TW201514581A - Optical member affixed body production method - Google Patents

Abstract

A method of producing an optical member bonded body includes an optical member bonded body formation step (S13) of unwinding a strip-shaped optical member sheet from a web roll and bonding a plurality of optical members obtained by cutting the optical member sheet into a plurality of optical display components to form a plurality of optical member bonded bodies, a first autoclave treatment step (S14) of heating and pressurizing the plurality of optical member bonded bodies, an inspection step (S21) of inspecting defects for each of the plurality of optical member bonded bodies which have been subjected to the first autoclave treatment step (S14), and a second autoclave treatment step (S22) of heating and pressurizing defective products detected in the inspection step (S21), wherein the optical member bonded body formation step (S13) and the first autoclave treatment step (S14) are performed in a continuous production line, and the second autoclave treatment step (S22) is performed separately from the production line.

Description

Optical component bonding body manufacturing method

The present invention relates to a method of manufacturing an optical component bonding body. The present invention claims priority based on Japanese Patent Application No. 2013-180591, filed on Jan.

As a method of bonding a polarizing plate (optical module) to a liquid crystal panel (optical display member), a bonding method called a roll-to-panel (RTP) method is known (for example, refer to the patent document) 1). This bonding method is a method of cutting a long polarizing plate from a take-up reel to a specific size and directly bonding it to a liquid crystal panel conveyed on a production line.

When the polarizing plate is bonded to the liquid crystal panel, dust from the operating device or dust generated by the operator may cause a defect as a bonded foreign matter enters between the liquid crystal panel and the polarizing plate. Such a defective product can be inspected by inspecting a manufactured product that is carried out to the production line. In this method, the inspection position of the defective product is separated from the manufacturing line, and the defective product is generated until the defective product is detected. time delay. Therefore, after the occurrence of the defective product, the delay in the countermeasures such as the stop of the production line or the removal of the cause, until the defective product is detected, the defective product continues to be generated, and a considerable number of defective products are generated, so that the production yield of the production line is low. .

Therefore, in the production system of Patent Document 1, an optical automatic inspection device (Automatic Optical Inspection) is provided on the production line, and the defects of the bonded body conveyed on the production line are automatically inspected in order. As such a defect inspection device, various defect inspection devices such as a transmissive type and a reflective type are known, and these defect inspection devices are appropriately selected and used depending on the type of the defect. In the production system of Patent Document 1, since the defect inspection device is provided on the manufacturing line, the above-described time delay does not occur, and the manufacturing yield is improved. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent No. 4669070

[Problems to be solved by the invention]

In the automatic inspection using the commercially available defect inspection device, it is easy to cause a "leakage" of the defective product as a good product compared to the visual inspection. Usually, in the defect inspection device, the threshold of the good and bad determination is strictly set to suppress the occurrence of the leakage. However, even in the automatic inspection using the defect inspection device, there is still a situation in which a leak occurs. Therefore, it is eager to improve the accuracy of the defect inspection and significantly improve the countermeasures.

The present invention provides a method for producing an optical component bonding body, which can be inspected with defects with good precision in actual use, and can be stably manufactured without impairing the manufacturing yield. [Means for solving problems]

An aspect of the present invention provides a method for manufacturing an optical component bonding body, which is a method for manufacturing an optical component bonding body formed by bonding an optical component to an optical display component, comprising: an optical component bonding body forming process, and a self-material The roll cylinder winds out the strip-shaped optical component layer, and the plurality of optical components obtained by cutting the optical component layer are bonded to the plurality of optical display components to form a plurality of optical component bonding bodies; the first hot pressing process, heating and pressing Processing a plurality of optical component bonding bodies; a first hot pressing process, heating and pressurizing the plurality of optical component bonding bodies; inspecting a process, respectively checking the defects of the optical component bonding bodies through the first hot pressing process; and the second heat a pressure treatment process for heating and pressing the defective product detected by the inspection process; wherein the optical component bonding body forming process and the first hot pressing process are performed on a continuous manufacturing line; separately from the manufacturing line The second hot pressing process is performed.

Moreover, an aspect of the present invention provides a method of manufacturing an optical component bonding body, which is a manufacturing method of an optical component bonding body formed by bonding an optical component to an optical display component, comprising: a bonding body forming process, and a self-material The roll roller winds out the strip-shaped optical component layer, and the plurality of layer sheets obtained by cutting the optical component layer are bonded to the plurality of optical display components to form a plurality of bonded bodies; and the detection process is performed, and the layer is detected in the bonded body The outer peripheral edge of the bonding surface of the sheet and the optical display member; the optical component bonding body forming process in which the layer self-bonding to the optical display member is disposed corresponding to the outer side of the bonding surface portion a portion, cut along the outer periphery to form an optical component bonding body having an optical component corresponding to the size of the bonding surface; a first hot pressing process, heating and pressing the composite optical component bonding body; and inspecting the process The optical component bonding body of the first hot pressing process optically inspects the defects thereof; and the second hot pressing process, the heating and pressing process is detected by the inspection process Yield; wherein the optical component bonded body forming process and the first heat treatment process within a continuous production line for manufacturing; for the second hot-pressing process and the manufacturing production line separately.

In one aspect of the present invention, in the detecting process, it is preferable to detect the outer peripheral edge of the bonding surface of the layer and the optical display member for each optical display member.

In one aspect of the present invention, preferably, in the first hot press processing process, the plurality of optical component bonding bodies sequentially transported through the optical component bonding body forming process are distributed to the plurality of processing lines, The treatment line is subjected to heat and pressure treatment.

In one aspect of the present invention, preferably, the first visual inspection process is further performed, and the plurality of optical component bonding bodies subjected to the second hot pressing treatment are visually inspected for defects; and the rework processing process is performed on the first visual inspection. Inspecting the first visual inspection defective product detected by the process, the first visual inspection of the defective product has a defect state, and peeling off the optical component from the first visual inspection defective product to expose the optical display component to expose the optical display The surface of the component is bonded to a new optical component prepared in advance to form a new optical component bonding body; wherein the first visual inspection process and the rework processing process are performed separately from the manufacturing line.

In one aspect of the present invention, preferably, the second visual inspection process further has a visual inspection of the defects of the plurality of optical component bonding bodies subjected to the rework processing process; wherein the second is performed separately from the manufacturing line Visually inspect the process.

In one aspect of the invention, it is preferable that the second visual inspection process is performed again on the second visual inspection defective product detected by the second visual inspection process.

In one aspect of the invention, it is preferred to perform an optical inspection of the defect automatically using an automatic inspection device disposed on the manufacturing line during the inspection process.

In one aspect of the invention, it is preferred to inspect the process and visually inspect the defect.

Moreover, an aspect of the present invention provides a production system for an optical component bonding body, comprising: a bonding body forming device having a layer obtained by cutting a strip-shaped optical component layer passing through a roll drum to be attached to an optical a bonding device for displaying components to form a plurality of bonding bodies; the first hot pressing device is a first hot pressing device for hot pressing the plurality of bonding bodies through the bonding body forming device, the bonding device and the first heat The pressing device is disposed on a continuous manufacturing line; the inspection device optically inspects the defects of the plurality of bonding bodies through the first hot pressing device; and the second hot pressing device is disposed from the manufacturing line and is configured by hot pressing Defective product determined by the inspection device. [Effects of the Invention]

According to the present invention, there is provided a method for producing an optical component bonding body which can be inspected with defects with good precision in actual use, and can be stably manufactured without impairing the manufacturing yield.

Hereinafter, a method of manufacturing an optical component bonded body according to an embodiment of the present invention will be described. 1 and 2 are explanatory views showing a production system of an optical component bonding body used in the method of manufacturing the optical module bonding body of the embodiment. Fig. 1 is a schematic configuration diagram of a film bonding system 1 which is a part of a production system constituting an optical component bonding body. In Fig. 1, the film bonding system 1 is divided into upper and lower sections for convenience of illustration. FIG. 2 is an explanatory view of the film bonding system 1 having the first inverting device 15.

In the film bonding system 1 , for example, a film-shaped optical component such as a polarizing film, an antireflection film, or a light diffusing film is bonded to a panel-shaped optical display member such as a liquid crystal panel or an organic electroluminescence (OEL) panel. The film bonding system 1 is configured to produce an optical display device including an optical display member and an optical component as part of a production system. In the film bonding system 1, a liquid crystal panel P as an optical display member is used.

In the following description, first, the film bonding system 1 will be described in detail based on the description of the liquid crystal panel P used in the film bonding system 1.

(Liquid Crystal Panel) FIG. 3 is a plan view of the liquid crystal panel P. The liquid crystal panel P includes: a first substrate P1 having a rectangular shape in plan view; a second substrate P2 having a smaller rectangular shape facing the first substrate P1; and a liquid crystal layer P3 sealed between the first substrate P1 and the second substrate P2 . The liquid crystal panel P has a rectangular shape along the outer peripheral shape of the first substrate P1 in plan view, and a region inside the outer periphery of the liquid crystal layer P3 in plan view is the display region P4.

Fig. 4 is a sectional view taken along line IV-IV of Fig. 3; The first optical component cut out from the strip-shaped first optical component layer F1 and the long strip-shaped second optical component layer F2 (refer to FIG. 1) is appropriately bonded to the front surface and the reverse surface of the liquid crystal panel P. F11 and second optical component F12. In the following description, the first optical component layer F1 and the second optical component layer F2 are collectively referred to as "optical component layer FX". Further, the first optical component F11 and the second optical component F12 are collectively referred to as "optical component F1X".

In the present embodiment, the first optical component F11 and the second optical component F12 which are polarizing films are bonded to both surfaces of the liquid crystal panel P (the surface on the backlight side and the surface on the display surface side). The surface on the backlight side, preferably overlapping the first optical component F11, is further bonded to the third optical component as a luminance increasing film.

Fig. 5 is a partial cross-sectional view showing the optical component layer FX. The optical component layer FX has a film-shaped optical component body F1a, an adhesive layer F2a provided on the first surface (upper side of FIG. 5) of the optical component body F1a, and a layer of the optical component body detachably laminated via the adhesive layer F2a. a separation layer F3a on the first side of F1a; and a surface protection film F4a laminated on the second side (the lower side of FIG. 5) of the optical unit body F1a. Hereinafter, a portion from which the separation layer sheet F3a is removed from the optical module layer FX is referred to as a bonding layer F5. In addition, the hatching of each layer in FIG. 5 is omitted for convenience of illustration.

The optical module body F1a has a sheet-shaped polarizing element F6, a first film F7 joined by an adhesive or the like on the first surface of the polarizing element F6, and a second film bonded to the second surface of the polarizing element F6 by an adhesive or the like. Film F8. The first film F7 and the second film F8 protect the protective film such as the polarizing element F6.

The optical module body F1a may have a single layer structure composed of one layer of optical layers, or may be a laminated structure in which a plurality of optical layers are laminated to each other. In addition to the polarizing element F6, the optical layer may be a retardation film or a luminance increasing film or the like. At least one of the first film F7 and the second film F8 may be subjected to a surface treatment to obtain an anti-glare effect including a hard coat treatment or an anti-glare treatment for protecting the outermost layer of the liquid crystal display unit. The optical module body F1a may not include at least one of the first film F7 and the second film F8. For example, when the first film F7 is omitted, the separation layer sheet F3a may be bonded to the first surface of the polarizing element F6 via the adhesive layer F2a.

After the optical module main body F1a is cut to a specific length, the entire area of the display area P4 of the liquid crystal panel P and the peripheral area of the display area P4 are bonded together. At this time, the layer cut out from the optical module main body F1a is left with the same thickness as the adhesive layer F2a, and the layer of the optical component body F1a is bonded to the liquid crystal via the layer of the adhesive layer F2a. Panel P.

The separation layer F3a protects the adhesive layer F2a and the optical module body F1a before the separation layer F3a is separated from the adhesive layer F2a.

The surface protective film F4a is bonded to the cut liquid crystal panel P together with the optical module body F1a. The surface protective film F4a is provided on the opposite side of the liquid crystal panel P with respect to the optical module body F1a to protect the optical module body F1a. The surface protective film F4a is separated from the optical module body F1a at a specific time point. Further, the optical component layer FX may be a structure that does not include the surface protective film F4a. The surface protective film F4a may also be a structure that cannot be separated from the optical module body F1a.

In the manufacturing line to be described later, the bonding layer F5 is cut from such an optical component layer FX to form an optical component F1X.

(Film Bonding System) Hereinafter, the film bonding system 1 will be described with reference to Figs. In addition, the right side of the figure shows the upstream side of the conveyance direction of the liquid crystal panel P (it is hereafter called a panel conveyance upstream side). The left side of the figure shows the downstream side of the transport direction of the liquid crystal panel P (hereinafter referred to as the panel transport downstream side).

The film bonding system 1 transports the liquid crystal panel P from the start position to the end position of the bonding process, for example, by using the driving type roller conveyor 5, and sequentially applies specific processing to the liquid crystal panel P. The liquid crystal panel P is conveyed on the roller conveyor 5 in a horizontal state in which the front surface and the reverse surface thereof are horizontal.

In the following description, the entire processing of the flow operation of the liquid crystal panel P from the start position to the end position of the bonding process is referred to as "manufacturing line". The manufacturing line mainly refers to the flow operation performed on the drum conveyor 5, and the work performed on the production line is referred to as "work in the production line". In the present embodiment, the processing (not shown) of the liquid crystal panel provided on the upstream side of the bonding process is included in the manufacturing line.

Then, the liquid crystal panel P conveyed on the roller conveyor 5 is taken out from the start position to the end position of the bonding process, and the liquid crystal panel P is processed at a position different from the roller conveyor 5, and then processed. When the liquid crystal panel P is placed back on the roller conveyor 5, it can be used as a part of the manufacturing line if there is no stagnation in the process.

Further, in the flow operation on the drum conveyor 5, the work performed by the separation is referred to as the "manufacturing of the production line". Except for the production line, regardless of the conveying speed of the roller conveyor 5, an operation that takes a necessary time is performed.

The roller conveyor 5 is divided into an upstream conveyor 6 and a downstream conveyor 7 in a first reversing device 15 to be described later. The liquid crystal panel P is conveyed, for example, in the direction in which the upstream conveyor 6 travels in the short side of the display region P4, and is conveyed in the direction in which the downstream conveyor 7 travels in the longitudinal direction of the display region P4. An optical component obtained by cutting the optical component layer FX of the self-contained optical layer is bonded to the front surface and the reverse surface of the liquid crystal panel P. Each part of the film bonding system 1 is integrally controlled by a control unit 20 as an electronic control unit.

The film bonding system 1 includes a first adsorption device 11 that adsorbs the liquid crystal panel P that has been transported to the end position of the upstream process, and transports it to the initial position of the upstream conveyor 6 while aligning the liquid crystal panel P; a dust collecting device 12 is disposed on the downstream side of the panel transporting at the initial position; the first bonding device 13 is disposed on the downstream side of the panel transporting of the first dust collecting device 12; and the first deviation detecting device 14 is disposed on the first sticker The front panel reversing device 15 is disposed on the downstream side of the panel conveyance of the first deviation inspection device 14, and conveys the liquid crystal panel P that has reached the end position of the upstream conveyor 6 to the downstream side. The starting position of the machine 7.

Further, the film bonding system 1 includes a second dust collecting device 16 disposed on the panel transport downstream side at the initial position of the downstream conveyor 7, and a second bonding device 17 disposed on the panel of the second dust collecting device 16. The downstream side is transported; the second deviation inspection device 18 is disposed on the panel transport downstream side of the second bonding apparatus 17; the hot press device 100 is disposed on the panel transport downstream side of the second deviation inspection device 18; and the second inverting device 19, disposed on the downstream side of the panel transport of the hot press device 100.

(First adsorption device) The first adsorption device 11 includes a panel holding portion 11a that holds the liquid crystal panel P freely transported in the vertical direction and the horizontal direction, and performs calibration of the liquid crystal panel P, and a calibration camera 11b that detects, for example, a panel. The calibration standard of the liquid crystal panel P of the holding portion 11a.

The panel holding portion 11a is held by vacuum suction on the upper surface of the liquid crystal panel P transported at the end position of the upstream process, and simultaneously transports the liquid crystal panel P to the starting position of the bonding process (upstream side conveyor 6) in a horizontal state. This position is desorbed, and the liquid crystal panel P is moved to the upstream side conveyor 6.

When the liquid crystal panel P held by the panel holding portion 11a is placed on the upstream conveyor 6, for example, the calibration camera 11b captures a calibration mark or a front end shape of the liquid crystal panel P. The photographing data of the calibration camera 11b is transmitted to the control unit 20, and based on the photographed data, the control unit 20 operates the panel holding portion 11a. Thereby, the calibration of the liquid crystal panel P with respect to the upstream side conveyor 6 is performed. At this time, the position of the liquid crystal panel P of the upstream conveyor 6 in the horizontal direction (the conveyor width direction) in the vertical conveyance direction is determined, and the liquid crystal panel P of the upstream conveyor 6 is determined to rotate in the direction around the vertical axis. position.

(First Dust Collecting Device) The first dust collecting device 12 is close to the bonding position of the first bonding device 13 and is provided on the panel transport upstream side of the first bonding device 13. The first dust collecting device 12 removes and collects static electricity from the lower surface of the liquid crystal panel P that has just been introduced to the bonding position.

(First Bonding Device) The first bonding device 13 has a conveying device 22 that winds the first optical component layer F1 from the winding roller R1a around which the first optical component layer F1 is wound, and along the first optical component The first optical component layer F1 is transported in the longitudinal direction of the layer F1, and the nip roller 23 is attached to the optical component separated from the first optical component layer F1 by the transport device 22 to the liquid crystal panel P transported by the upstream conveyor 6. The underside.

In the present embodiment, the first optical component layer F1 has a structure corresponding to the width of the width of the liquid crystal panel P. The "width having a width corresponding to the width of the liquid crystal panel P" means a layer of the laminated layer obtained by half-cutting the first optical component layer F1 in the width direction of the layer, which is larger than the display region P4 of the liquid crystal panel P, and the layer thereof The sheet is smaller than the substrate of the liquid crystal panel P to which it is bonded (the size of the functional portion such as the electronic component mounting portion is removed from the substrate).

Specifically, the width (length in the short-side direction) of the first optical component layer F1 is the same as or wider than the long side of the display region P4 of the liquid crystal panel P, and the layer is in the substrate of the liquid crystal panel P to which it is attached. The sides corresponding to the long sides of the display area P4 are the same or narrower. The first bonding device 13 has the bonding layer F5 of the first optical component layer F1 being the same as or shorter than the short side of the display region P4 of the liquid crystal panel P, and the layer is in the substrate of the liquid crystal panel P to which it is attached. The side corresponding to the short side of the display region P4 is cut at the same or shorter length to form a layer of the bonding layer F5, and is cut into a specific size to be bonded to the lower side surface of the liquid crystal panel P which is introduced to the bonding position. The lamination of the layer of layer F5.

The "layer sheet of the bonding layer F5" produced in the first bonding apparatus 13 is an optical component that is bonded to the liquid crystal panel P. The peripheral portion of the optical module produced as described above is a size that accommodates the frame portion G when the liquid crystal panel P is placed.

The conveying device 22 is a device that conveys the bonding layer F5 that carries the separation layer sheet F3a. The conveying device 22 has a roller holding portion 22a, and holds a roll drum R1a wound with a strip-shaped first optical component layer F1, and winds out the first optical component layer F1 along the longitudinal direction of the first optical component layer F1; The plurality of guide rollers 22b wind the first optical component layer F1 to guide the first optical component layer F1 wound from the take-up reel R1a along a specific transport path; the cutting device 22c, on the transport path An optical component layer F1 is half-cut; the blade 22d winds the first optical component layer F1 after the half-cut, at an acute angle, and the optical component is peeled off from the separation layer F3a, and the optical component is supplied to the sticker. And the winding portion 22e holds the separation roller R2 of the separation layer F3a which is wound by the blade 22d.

In the present embodiment, the "semi-cut" means that the tension in the first optical component layer F1 is not broken or broken, and the specific thickness separation layer F3a remains. An optical component layer F1 is cut into the vicinity of the interface between the adhesive layer F2a and the separation layer F3a. For the formation of the cut-in, a cutting blade or a laser device can be used.

The winding holding portion 22a located at the starting point of the conveying device 22 and the winding portion 22e located at the end position of the conveying device 22 are, for example, driven in synchronization with each other. Thereby, the roller holding portion 22a winds up the first optical component layer F1 toward the conveyance direction of the first optical component layer F1, and the winding portion 22e winds up the separation layer F3a that has passed through the blade 22d. In the conveyance device 22, the upstream side in the conveyance direction of the first optical module layer F1 (separation layer sheet F3a) is referred to as the layer conveyance upstream side, and the downstream side in the conveyance direction is referred to as the sheet conveyance downstream side.

Each of the guide rollers 22b changes the direction in which the first optical component layer F1 is conveyed along the transport path. At least a portion of the plurality of guide rollers 22b is movable to adjust the tension of the first optical component layer F1 during transport.

When the first optical component layer F1 is wound up by a specific length, the cutting device 22c traverses the entire width along a width direction perpendicular to the longitudinal direction of the first optical component layer F1, and cuts the thickness direction of the first optical component layer F1. Part of it (half cut).

The cutting device 22c transmits the tension in the first optical component layer F1, and does not cause the first optical component layer F1 (the separation layer F3a) to be broken or broken (the separation layer F3a having a specific thickness remains). The position of the advance and retraction of the blade is cut, and half cut is performed until the vicinity of the interface between the adhesive layer F2a and the separation layer F3a.

In the half-cut first optical component layer F1, the bonding layer F5 is cut in the thickness direction of the first optical component layer F1 to form a transverse line across the entire width of the first optical component layer F1 in the width direction. The transverse line is formed in parallel in the longitudinal direction of the strip-shaped first optical component layer F1. For example, in the case of a bonding process of transporting the liquid crystal panel P of the same size, a plurality of transverse lines are formed at equal intervals in the longitudinal direction of the first optical component layer F1. The first optical component layer F1 is divided into a plurality of sections in the longitudinal direction by a plurality of transverse lines. In the longitudinal direction of the first optical component layer F1, the partitions sandwiched by the adjacent pair of transverse lines are each one of the plies F5.

The blade edge 22d is disposed below the upstream side conveyor 6, and extends at least to the entire width thereof in the width direction of the first optical component layer F1. At the blade edge 22d, the first optical component layer F1 is wound to fold the separation layer F3a of the first optical component layer F1 after the half cut.

The blade 22d has a first surface, and is disposed from a width direction of the first optical unit F1 (a width direction of the upstream side conveyor 6), and a lying posture (that is, a specific angle with respect to a conveying direction of the liquid crystal panel P); The second surface is disposed at an acute angle from the first surface of the first optical component layer F1 as viewed from the width direction of the first optical component layer F1; and the front end portion is located at the intersection of the first surface and the second surface.

The blade 22d winds the first optical component layer F1 at an acute angle to the front end portion of the blade 22d. When the first optical component layer F1 is folded back at an acute angle to the front end portion of the blade 22d, the layer (optical component) of the bonding layer F5 is separated from the separation layer F3. The front end portion of the blade 22d is provided close to the panel conveyance upstream side of the nip roller 23. The optical component separated from the separation layer F3 by the blade 22d is superposed on the lower surface of the liquid crystal panel P conveyed by the upstream conveyor 6, and is introduced between the pair of bonding rollers 23a of the nip roller 23.

The nip roller 23 has a pair of bonding rollers 23a which are disposed in parallel with each other in the axial direction. A specific gap is formed between the pair of bonding rolls 23a, and the gap is the bonding position of the first bonding apparatus 13. The liquid crystal panel P and the optical component are superposed into the gap. The liquid crystal panel P and the optical unit are pinched between the pair of bonding rolls 23a, and sent to the downstream side of the panel conveyance. Thereby, the optical component is integrally bonded to the lower side of the liquid crystal panel P. Hereinafter, the bonded panel is referred to as a single-sided bonding panel P11 (optical component bonding body).

(First Deviation Inspection Device) The first deviation inspection device 14 checks whether or not the position of the liquid crystal panel P of the optical component to be bonded to the first bonding device 13 in the single-sided bonding panel P11 is correct (whether the positional deviation is in the tolerance Within the scope). The first deviation inspection device 14 has a pair of cameras 14a, for example, the edge of the optical assembly on the upstream side of the panel transporting single-sided bonding panel P11, and the edge of the optical assembly in the downstream side of the panel transporting single-sided bonding panel P11. . The photographing data of each camera 14a is transmitted to the control unit 20, and based on the photographing data, it is judged whether or not the relative positions of the optical unit and the liquid crystal panel P are correct. The single-sided bonding panel P11, which is judged to be inaccurate in the relative position, is discharged to the outside of the system (outside the manufacturing line) by a discharge unit not shown.

(First Inverting Device) The first inverting device 15 shown in FIG. 2 has, for example, a rotating shaft 15a which is inclined by 45° with respect to a plane view of the conveying direction of the liquid crystal panel P, and an inverting arm 15b by a rotating shaft 15 It is supported between the end position of the upstream conveyor 6 and the starting position of the downstream conveyor 7. The reverse arm 15b holds the single-sided bonding panel P11 that has reached the end position of the upstream conveyor 6 through the first deviation inspection device 14 by suction, clamping, or the like, and is rotated by 180° around the rotation shaft 15a. Thereby, the inversion arm 15b reverses the front and back of the single-sided bonding panel P11, and converts the direction of the single-sided bonding panel P11 conveyed in parallel with the short side of the display area P4 to the length of the display area P4, for example. We transport in parallel.

This inversion is performed when the direction of the polarization axis of the optical module F1X bonded to the surface of the liquid crystal panel P and the direction of the polarization axis of the optical module F1X bonded to the reverse side of the liquid crystal panel P are perpendicular to each other. The upstream side conveyor 6 and the downstream side conveyor 7 serve as the conveying direction of the liquid crystal panel P from the right side to the left side of the drawing, and after passing through the first reversing device 15, the upstream side conveyor 6 and the downstream side conveyor 7 A specific amount of displacement horizontally.

In the case of the forward/reverse inversion of the liquid crystal panel P, it is preferable to use a rotating shaft having, for example, a direction parallel to the conveying direction and an inverting device having an inverting arm. In this case, when the layer conveyance direction of the first bonding apparatus 13 and the layer direction of the second bonding apparatus 17 are horizontally disposed perpendicular to each other, the optical component F1X perpendicular to the polarization axis direction can be bonded to the liquid crystal panel. The front and back of P.

The reverse arm 15b has the same calibration function as the panel holding portion 11a of the first adsorption device 11. In the first inverting device 15, a calibration camera 15c similar to the calibration camera 11b of the first adsorption device 11 is provided.

(Second Dust Collecting Device) Referring back to FIG. 1 , the second dust collecting device 16 is adjacent to the bonding position of the second bonding device 17 and is disposed on the panel transport upstream side of the second bonding device 17 . The second dust collecting device 16 removes and collects dust from the lower surface of the single-sided bonding panel P11 that has just been introduced to the bonding position.

(Second Bonding Device) The second bonding device 17 has the same conveying device 22 and nip roller 23 as the first bonding device 13 . In the second bonding apparatus 17, the optical component formed by the second optical component layer F2 which is half cut at a specific size is bonded to the lower surface of the single-sided bonding panel P11 which is introduced to the bonding position.

In the present embodiment, similarly to the first optical component layer F1, the second optical component layer F2 has a structure corresponding to the width of the liquid crystal panel P. Specifically, the width (length in the short-side direction) of the second optical component layer F2 is the same as or wider than the short side of the display region P4 of the liquid crystal panel P, and the layer is in the substrate of the liquid crystal panel P to which it is attached. The sides of the short side of the display area P4 are the same or narrower. The second bonding device 17 has the bonding layer F5 of the second optical component layer F2 being the same as or longer than the long side of the display region P4 of the liquid crystal panel P, and the layer is in the substrate of the liquid crystal panel P to which it is attached. The side corresponding to the long side of the display region P4 is cut at the same or shorter length to form a layer of the bonding layer F5, and is cut into a specific size to be bonded to the lower side surface of the liquid crystal panel P which is introduced to the bonding position. The lamination of the layer of layer F5.

The "layer sheet of the bonding layer F5" produced in the second bonding apparatus 17 is an optical component that is bonded to the liquid crystal panel P. The peripheral portion of the optical module produced as described above is a size that accommodates the frame portion G when the liquid crystal panel P is placed.

The gap between the pair of bonding rollers 23a of the nip roller 23 (the bonding position of the second bonding device 17) is introduced in a state in which the single-sided bonding panel P11 and the optical component are overlapped, and the optical component is integrally attached to the single sheet. The lower side of the panel P11 is fitted to the surface. Hereinafter, the bonded panel is referred to as a double-sided bonding panel P12 (optical component bonding body).

The second deviation inspection device 18 checks whether the position of the liquid crystal panel P of the optical component to which the second bonding device 17 is bonded in the double-sided bonding panel P12 is correct (whether the positional deviation is within the tolerance range). The second deviation inspection device 18 has a pair of cameras 18a, for example, the edge of the optical assembly on the upstream side of the panel transporting the double-sided bonding panel P12 and the edge of the optical assembly in the downstream side of the panel transporting side of the double-sided bonding panel P12 . The photographing data of each camera 18a is transmitted to the control unit 20, and based on the photographed data, it is judged whether or not the relative positions of the optical unit and the liquid crystal panel P are correct. The double-sided bonding panel P12, which is judged to be inaccurate in the relative position, is discharged to the outside of the system by a discharge unit not shown.

(Hot Pressing Apparatus) The hot press apparatus 100 performs a heat and pressure treatment (hot pressing treatment, first hot pressing treatment) on the double-sided bonding panel P12 of the second deviation inspection device 18. The hot pressing device 100 has a chamber 101. In the chamber 101, a plurality of stacked double-sided bonding panels P12 are collected and carried in. The double-sided bonding panel P12 of the plurality of sheets is subjected to heat and pressure treatment in the chamber 101.

In the present specification, the "hot pressing treatment" means that the defective product as the processed product is exposed to a temperature higher than room temperature in a pressurized environment having a high atmospheric pressure for a certain period of time. For example, as an example, the processing conditions are in a pressure condition of 0.294 MPa or more and 0.785 MPa or less (3 kgf/cm ² or more and 8 kgf/cm ² or less), and a temperature of 40 ° C or more and 80 ° C or less, for 30 seconds or more. Hold time below 25 minutes.

The pressure condition can be 0.392 MPa or more (4 kgf/cm ² or more) of 0.588 MPa or less (6 kgf/cm ² or less). The temperature condition can be 50 ° C or more and 70 ° C or less. The holding time can be from 1 minute to 5 minutes. The upper limit and the lower limit of the processing conditions can be combined easily. In addition, the above numerical value is an example, and is not limited to this.

In addition, the "holding time" means a time until the set value of the pressure and temperature in the chamber 101 becomes the above until the pressure and the temperature are below the set value. Therefore, even if either or both of the pressure and the temperature fluctuate, as long as the pressure and temperature are above the set value, the processing time of this condition includes the holding time.

In the hot press apparatus 100, first, the double-sided bonding panel P12 which is sequentially conveyed is stacked in a specific number of sheets which are not shown in the position 102 which is measured upstream of the chamber 101. When the double-sided bonding panel P12 that has been carried into the chamber 101 is subjected to hot pressing treatment in the chamber 101 in the stacking portion, the specific number of sheets is deposited. Therefore, the accumulation portion functions as a damper so that the conveyance of the double-sided bonding panel P12 in the hot press processing does not stagnate.

Next, the double-sided bonding panel P12 in which a plurality of sheets are stacked is collected, and then carried into the chamber 101 to be subjected to hot pressing.

The maximum time required for the hot press treatment is set according to the transport speed of the double-sided bonding panel P12 in the manufacturing line and the number of stacked sheets in the stacking portion. For example, when the double-sided bonding panel P12 is carried into the stacking portion every 10 seconds, and 20 sheets of the double-sided bonding panel P12 are stacked in the stacking portion, 20 sheets of double-sided sheets are moved from the stacking portion to the chamber 101 every 200 seconds. Fit the panel P12. In such a case, in the chamber 101, the hot press treatment can be performed for a maximum of 200 seconds (including the time period of temperature rise and pressure reduction and temperature drop reduction). In addition, the above numerical value is an example, and is not limited to this.

Next, in the unloading portion (not shown) provided at the position 103 measured downstream of the chamber 101, the plurality of double-sided bonding panels P12 carried out from the chamber 101 are unloaded one by one and transported to the downstream side. In the unloading portion, the double-sided bonding panel P12 is unloaded at a speed equal to or higher than the stacking of the double-sided bonding panel P12 in the stacking portion, so that the conveyance of the double-sided bonding panel P12 is not stopped.

On the downstream side of the second deviation inspection device 18, it is preferable to divide the downstream conveyor 7 into a plurality of numbers as a plurality of processing lines, and each of the downstream conveyors 7 (each processing line) is set to be hot-pressed. The apparatus 100 processes the hot pressing process in parallel. In the case where the hot press treatment is performed in parallel, the processing time can be prolonged in each of the hot press devices.

By the hot press processing of the hot press apparatus 100, the double-sided bonding panel P12 which has a defect in the double-sided bonding panel P12 carried in the hot press apparatus 100 can remove the defect as mentioned later. Defects that cannot be removed by hot pressing are detected during the inspection process.

Here, in the manufacturing method of the optical component bonding body of the present embodiment, the "defect" to be inspected in the inspection process means that the optical inspection is performed in the display region of the double-sided bonding panel P12, and the double is used. In the display device manufactured by the surface bonding panel P12, display failure is caused.

As such defects, for example, (1) defects of the liquid crystal panel P itself, (2) defects of the optical component itself, and (3) defects caused by the bonding faces of the liquid crystal panel P and the optical component

As the "(1) defect of the liquid crystal panel P itself", for example, the liquid crystal of the liquid crystal panel P is unaligned due to the disorder of the liquid crystal alignment film of the liquid crystal panel P. In the case where the liquid crystal panel P has such a defect, for example, even if a pair of polarizing plates are correctly orthogonally polarized, the liquid crystal panel P is designed as a black liquid crystal screen (NB), as long as the double-sided bonding panel P12 is used. One side of the light is irradiated, because light leakage occurs, and the defect as a bright spot can be confirmed. In the visual inspection, light is irradiated from the first surface side of the double-sided bonding panel P12, and the inspector judges the presence or absence of a bright spot from the second surface side of the double-sided bonding panel P12. Further, for example, even when the liquid crystal panel P is damaged during transportation, it is a defect of (1) the liquid crystal panel P itself.

The "(2) defects of the optical component itself" are, for example, deformed by scratches or depressions formed on the surface of the optical component F1X. If there is such a defect, the light beam set by the liquid crystal panel P may be bent or scattered in the deformed portion, and the other portion having no distortion may be different from the luminance, so that the difference in luminance can be used for inspection.

As a result of "(3) a defect occurring in the bonding surface of the liquid crystal panel P and the optical component", for example, dust or dust is caught on the bonding surface of the liquid crystal panel P and the optical component (hereinafter, collectively referred to as "foreign matter" Defects, or defects in which air is trapped on the mating surface to form bubbles. The bonding surface is a bonding surface of the liquid crystal panel P and the first optical component F11 shown in FIG. 4, and a bonding surface of the liquid crystal panel P and the second optical component F12. If there is such a defect, the light beam which is set by the liquid crystal panel P is bent or scattered in the defective portion, and the other portion having no distortion is different from the luminance, so that the difference in luminance can be used for inspection.

When the double-sided bonding panel P12 is subjected to hot pressing treatment, the double-sided bonding panel P12 has a defect that "(2) defects in the optical component itself are small deformation of the optical component itself, or "(3) In the case where a defect occurs in the bonding surface of the liquid crystal panel P and the optical component, when air is trapped on the bonding surface of the liquid crystal panel P and the optical component, and bubbles are generated as a fine object, the defect is expected to be eliminated.

That is, in the case where the defect is a small deformation of the optical component itself, the hot pressing process is performed, and the optical component is easily deformed by heating the optical component. In this way, it is expected to eliminate the small deformation caused by the defect.

Further, in the case where air bubbles are generated by sandwiching the air on the bonding surface, heat and pressure are applied to the layer of the optical component having the adhesive layer F2a (refer to FIG. 5), and the saturated solubility of the air is increased to form bubbles. The air disappears from the layer of the adhesive layer F2a. By this, I hope to eliminate the bubbles.

Further, since the air which has disappeared from the layer of the adhesive layer F2a is diffused in the layer of the adhesive layer F2a, even if the defective product is returned to the normal temperature under atmospheric pressure after the hot pressing treatment, the position of the bubble which is expected to disappear is not repeated again. Condensing air regenerates bubbles.

Defects that are expected to be eliminated by hot pressing are more difficult to detect in the inspection process. Therefore, the double-sided bonding panel P12 having such a fine defect is introduced into the inspection process, and it is easy to cause "false positives" for determining a good product as a defective product, or "missing" for determining a defective product as a good product. Therefore, such defects are eliminated by the hot press treatment, and the inspection results in the inspection process described later are likely to be stabilized.

In contrast, when the defect of the double-sided bonding panel P12 is at least one of the following: "(1) defects of the liquid crystal panel P itself", and "(2) optical components themselves have defects In the defect, the large deformation of the optical component itself is caused by the air trapping on the bonding surface of the liquid crystal panel P and the optical component in "(3) defects caused by the bonding surface of the liquid crystal panel P and the optical component". If the bubble is a large object or a foreign matter is caught on the bonding surface to cause a defect, it is considered that the hot pressing process cannot eliminate the defect.

However, defects that cannot be eliminated by hot pressing are easily detected in the inspection process, so that it is not easy to cause false alarms or missed readings during the inspection process. Therefore, the inspection result in the inspection process described later is likely to be stabilized.

(Second Inverting Device) The second inverting device 19 reverses and reverses the double-sided bonding panel P12 that is carried out from the hot pressing device 100. The double-sided bonding panel P12 conveyed by the second inverting device 19 has the backlight side facing upward by the first inverting device 15, and the second inverting device 19 is the same as the loading of the film bonding system 1. The display surface side of the liquid crystal panel P is made to face upward.

The double-sided bonding panel P12 of the second reversing device 19 is transported to the downstream side by the downstream conveyor 7, and is carried out from the manufacturing line of the film bonding system 1.

(Defect Inspection and Inspection Process) In the present embodiment, the presence or absence of defects is checked by visual inspection of the double-sided bonding panel P12 carried out from the manufacturing line. Visual inspection can be carried out by multiple inspectors.

The double-sided bonding panel P12 visually inspected is subjected to hot pressing treatment by the hot pressing device 100 in the manufacturing line. Thereby, only a large defect which cannot be erased by a hot press process can be inspected. Thereby, the detection of the defect becomes easy, and the result of the defect inspection is stabilized.

In the inspection by the visual inspection (inspection device 120), the double-sided bonding panel P12, which is a defective product, is carried out to the next process.

Further, in the visual inspection, the double-sided bonding panel P12 (defective product) in which the defect is found is subjected to hot pressing treatment (second hot pressing) using the hot pressing device 110 (second hot pressing device) outside the manufacturing line. deal with). Since the number of defective products is reduced by the first hot press treatment, the second hot press treatment can be carried out for a sufficient period of time.

The double-sided bonding panel P12 carried out from the manufacturing line has been subjected to the first hot pressing process by the hot pressing device 100 in the manufacturing line. Therefore, the processing conditions of the second hot press treatment are considered to be difficult to eliminate in the case where the processing conditions of the first hot press treatment are more moderate.

Therefore, the second hot press treatment can be performed under more severe conditions than the processing conditions of the first hot press treatment. In the second hot pressing process, the set value of the temperature or pressure can be set to be higher than the set value in the first hot pressing process. However, if the temperature or pressure setting value is high, the liquid crystal panel P may be damaged. Therefore, for example, in the second hot press processing, the holding time in the hot press processing is set to be longer than the first hot press. Thereby, the second hot press treatment can be performed under more severe conditions than the processing conditions of the first hot press treatment.

As an example, for example, the processing conditions of the second hot press treatment are in a pressure condition of 0.294 MPa or more and 0.785 MPa or less (3 kgf/cm ² or more and 8 kgf/cm ² or less), and 40 ° C or more and 80 ° C or less. The temperature condition has a holding time of 30 seconds or more and 25 minutes or less.

As another range of the processing conditions, the pressure condition can be 0.392 MPa or more (4 kgf/cm ² or more) of 0.588 MPa or less (6 kgf/cm ² or less). The temperature condition can be 50 ° C or more and 70 ° C or less. The holding time can be from 1 minute to 5 minutes. The upper limit and the lower limit of the processing conditions can be combined easily. As an example, the pressure of the first hot press treatment and the pressure of the second hot press treatment are set to 0.5 MPa, and the temperature of the first hot press treatment and the temperature of the second hot press treatment are set to 60 ° C. The holding time of one hot pressing treatment was set to 30 seconds, and the holding time of the second hot pressing treatment was set to 1 minute. In this case, the set value of the pressure is the same in the first hot press treatment and the second hot press treatment, and the set value of the temperature is the same in the first hot press treatment and the second hot press treatment, and the second hot press treatment is performed. The holding time is longer than the holding time of the first hot pressing process. Therefore, the damage of the liquid crystal panel can be avoided, and the defect can be effectively eliminated. In addition, the above numerical value is an example, and is not limited to this.

Fig. 6 is a distribution chart showing the results of an experiment confirming the effect of performing two hot pressing treatments. In Fig. 6, the double-sided bonding panel P12 having a defect as a cause of air bubbles shows a change in the bubble size when the hot pressing process is performed. In the figure, the horizontal axis shows the sample number, and the vertical axis shows the bubble size (unit: μm) of each sample.

In the experiment shown in Fig. 6, the conditions of the first hot pressing treatment (described as 1st AC treatment in the drawing) were as follows: temperature 50 ° C, pressure 5 kgf / cm ² (490.35 kPa), and heating and pressurization for 2 minutes. The processing time of 2 minutes is set as the time of the hot press processing time in the corresponding production line.

The conditions of the second hot pressing treatment (described as 2nd AC treatment in the drawing) were a temperature of 50 ° C, a pressure of 5 kgf / cm ² (490.35 kPa), and heating and pressurization for 20 minutes. The processing time of 20 minutes is set as the time of the hot pressing processing time outside the corresponding production line.

As shown in Fig. 6, up to the double-sided bonding panel P12 of the sample No. 14, the bubble size after the first hot pressing treatment was 0 μm, that is, the bubble was removed by the first hot pressing treatment.

Further, in the sample of sample No. 15-19, after the first hot pressing treatment, the bubble became small and remained. Then, with respect to the samples of sample numbers 15, 16, 19, the bubbles were removed by the second hot pressing process.

In other words, the defects which cannot be removed by the hot press treatment (1stAC treatment) in the production line can be eliminated by the hot press treatment (2ndAC treatment) outside the production line.

According to the inventor's discussion, in the same apparatus as the film bonding system 1, the double-sided bonding panel P12 introduced before the hot pressing apparatus 100 is known from the statistical table, and the defect up to 2500 μm accounts for 89% of the total. Defects up to 3000μm account for 93% of the total,

In the confirmation experiment shown in Fig. 6, since the defect before the sample No. 14 was eliminated by the 1st AC treatment, nearly 90% of the defects were able to be removed by the first hot pressing treatment in accordance with the above data. The remaining 10% of the defects, spent a lot of time for the second hot pressing process, hope to eliminate. Therefore, most of the defects can be eliminated by performing the hot pressing process twice.

Fig. 7 is a graph showing experimental results of confirming the effect of changing the hot pressing treatment between the first hot press treatment and the second hot press treatment. Fig. 7 (a) is an experimental result of 18 hours between the first hot press treatment and the second hot press treatment. Fig. 7(b) is an experimental result of 36 hours between the first hot press treatment and the second hot press treatment.

In Fig. 7, for the samples in which the defects are removed after the hot press processing, the number of samples is indicated in the field indicated by "OK", and the sample in which the defects are not removed after each hot pressing treatment is described in the field indicated by "NG". The number of samples. Further, the defect removal rate (%) indicates the ratio of the number of "OK" samples after each hot pressing treatment to the total number of samples.

As shown in FIG. 7, when the time from the first hot press processing to the second hot press processing becomes long, the defect removal rate is lowered. Therefore, the second hot press treatment is preferably carried out as far as possible from the time after the first hot press treatment.

For example, there are a large number of defective products as objects to be subjected to the second hot pressing process. Thereby, if the upper limit of the number of processes that can be processed is accumulated in the hot press apparatus, waiting for the second hot press process, the effect of the second hot press process may be lowered.

Therefore, the second hot pressing process is set to the following two criteria, and can be carried out: (1) when the hot pressing device accumulates the upper limit amount that can be processed, or (2) after a certain time elapses from the first hot pressing process Time (for example, 24 hours after the first hot pressing treatment).

Defects expected to be eliminated by such hot pressing treatment are hard to find in the inspection process. Therefore, the double-sided bonding panel P12 having such a fine defect is introduced into the inspection process, and it is easy to cause false alarm or missed viewing. Such defects are eliminated by hot pressing, and the inspection results are easily stabilized.

In contrast, the double-sided bonding panel P12 has the following defects: "(1) defects in the liquid crystal panel P itself" in the damage of the liquid crystal panel P, and "(2) defects in the optical component itself" It is a large deformation of the optical component itself, and "(3) a defect occurring in the bonding surface of the liquid crystal panel P and the optical component" is a bubble formed by sandwiching air on the bonding surface of the liquid crystal panel P and the optical component. If a large object or a foreign object is caught on the bonding surface to cause a defect, it is considered that the hot pressing treatment cannot eliminate the defect.

However, the defects which cannot be eliminated by such hot pressing treatment are easily detected in the inspection process, so that it is not easy to cause false alarms or missed readings in the inspection process. Therefore, the inspection result in the inspection process described later is likely to be stabilized.

(Defect Inspection) In the present embodiment, the presence or absence of defects is visually inspected on the outside of the production line for the double-sided bonding panel P12 subjected to the second hot pressing treatment. The first hot pressing process and the second hot pressing process are performed on the double-sided bonding panel P12 that is visually inspected. Therefore, it is possible to examine only a large defect that cannot be removed by such two hot pressing processes. As a result, the burden on the inspector is reduced, and at the same time, the defect is easily detected, and the result of the defect inspection is stabilized.

In the inspection of the visual inspection, the double-sided bonding panel P12, which is a defective product, is carried out to the next process.

In addition, the double-sided bonding panel P12 (defective product) which is found to be defective by visual inspection is checked for the type or state of the defect, and the subsequent processing is performed to determine whether or not the defect can be eliminated.

(Rework processing) The defect of the defective product is a large deformation of the optical component itself in "(2) defects in the optical component itself, or "(3) on the bonding surface of the liquid crystal panel P and the optical component. In the case where the air is trapped on the bonding surface of the liquid crystal panel P and the optical component to cause a large bubble, or when a foreign matter is caught on the bonding surface, it is judged that the liquid crystal panel P itself is not present. defect.

However, such a defective product has been subjected to two hot pressing treatments, and it is difficult to eliminate the defects even if the hot pressing treatment is repeatedly performed, and it is considered that the defects cannot be eliminated. Therefore, the defective product in which the above-described defects are found is subjected to the rework process, and the optical module is peeled off from the defective product to expose the liquid crystal panel P, and the exposed liquid crystal panel P is bonded to the new layer to form a new double-sided bonding panel. P12.

At this time, compared with the case where the double-sided bonding panel P12 is not subjected to the hot press processing, since the number of defective products is reduced, the heavy-duty processing can be omitted.

In addition, the defective product has a defect such as "(1) a defect in the liquid crystal panel P itself", and it is determined that the hot pressing process or the rework process cannot be reproduced, and the defective product is discarded.

Such a heavy-duty processing process is performed separately from the above-mentioned manufacturing line (out-of-line processing). Therefore, it takes a lot of time for the heavy work to be processed, and it is expected to reduce the waste.

In the double-sided bonding panel P12 subjected to the rework processing process, the presence or absence of defects is checked in a visual inspection (second visual inspection process) separate from the above-described manufacturing line. If no defect is found, the double-sided bonding panel P12 as a finished product is carried out to the next process.

Further, in the second visual inspection process, the double-sided bonding panel P12 in which the defect is determined to be defective is returned to the second hot pressing process described above, and after the hot pressing process, the regeneration is attempted.

(Manufacturing Method of Optical Component Bonding Body) FIG. 8 is an explanatory view showing a manufacturing method of the optical component bonding body in the present embodiment, and shows a flow chart of the above manufacturing process. Hereinafter, the manufacturing flow will be described using the symbols shown in FIG. 1 as appropriate.

In the flowchart, the processing performed in the manufacturing line is displayed by the processing indicated by the symbol S1, and the processing performed outside the manufacturing line is displayed by the processing indicated by the symbol S2.

(Optical component bonding body forming process) First, in the manufacture of the double-sided bonding panel P12, the liquid crystal panel P is carried in the manufacturing line (step S11), and the dust or dust adhering to the surface of the liquid crystal panel P is cleaned and contaminated. (Step S12).

Next, in the film bonding system 1 described above, the first optical component layer F1 and the second optical component layer F2 are wound from the roll reels R1a, R1b, respectively, and the first optical component layer F1 and the second optical component layer F2 are rolled out. The lengths of the long sides or the short sides of the respective display regions P4 are cut to form the first optical component F11 and the second optical component F12. Here, "the length of the long side or the short side of the corresponding display area P4 is cut" means that the size of the layer obtained by cutting is larger than the display area P4 of the liquid crystal panel P, and the layer is smaller than the laminated layer. The substrate of the optical display member (the size of the functional portion such as the electronic component mounting portion is removed from the substrate) is cut to a length longer than the long side of the display region P4 or the short side of the display region P4, and is smaller than the corresponding layer The length of the side of the substrate of the liquid crystal panel P.

Then, the first optical component F11 is attached to the first surface of the liquid crystal panel P, and the second optical component F12 is attached to the second surface of the liquid crystal panel P to form the double-sided bonding panel P12 (step S13).

(First Hot Pressing Process) Then, the obtained double-sided bonding panel P12 is subjected to hot pressing treatment in the production line (in the production line) (step S14). Then, the obtained double-sided bonding panel P12 is carried out from the manufacturing line (step S15).

(Visual Inspection Process) The double-sided bonding panel P12 carried out from the manufacturing line is visually inspected for defects (outside the production line) (step S21). As a result of the visual inspection, for example, the double-sided bonding panel P12 which is determined to be a good product is, for example, collected after a plurality of sheets, and then carried out to the next process.

(Second Hot Pressing Process) On the other hand, as a result of the visual inspection, the double-sided bonding panel P12 which is a defective product having defects is subjected to hot pressing treatment outside the production line (outside the production line) ( Step S22).

(First Visual Inspection Process) The double-sided bonding panel P12 subjected to the second hot pressing treatment is subjected to visual inspection of defects outside the production line (outside the production line) (step S23). As a result of the visual inspection, after collecting a plurality of sheets on the double-sided bonding panel P12 which is determined to be a good product, the film is carried out toward the next process.

(Rework processing process) On the other hand, as a result of the visual inspection, the double-sided bonding panel P12 of the defective product determined to have a defect is confirmed by the type and state of the found defect, and is performed by performing the subsequent processing. The judgment that the defect can be eliminated (step S24).

The defect of the defective product is that the optical component itself is deformed or air is trapped on the bonding surface of the liquid crystal panel P and the optical component to generate a bubble, and the rework process is performed (step S25). As a defect of the defective product subjected to the heavy-duty processing, for example, the defect is a small deformation of the optical component itself, or air is trapped in the bonding surface of the liquid crystal panel P and the optical component to generate a bubble as a fine object (defect) • Small), or, the defect is a large deformation of the optical component itself, or the air is trapped on the bonding surface of the liquid crystal panel P and the optical component to generate a large bubble (defect • medium).

The defect of the defective product is a small deformation of the optical component itself, or air bubbles are formed on the bonding surface of the liquid crystal panel P and the optical component, and the double-sided bonding panel P12 has been subjected to hot pressing twice. After that, it is not necessary to repeat the hot pressing process, and the rework processing is performed together with the "defective medium" (marked as "defective small" in the flowchart).

In addition, the defect of the defective product is the damage of the liquid crystal panel P, etc., and it is judged that it is not reproduced by the rework process (marked as "defects and large" in the flowchart), and it discards.

Next, the double-sided bonding panel P12 subjected to the hot press processing or the rework processing is subjected to visual inspection of the defect (second visual inspection process, step S26).

If no defect is found, the double-sided bonding panel P12 as a finished product is carried out to the next process. The double-sided bonding panel P12, which has been found to be defective as a defective product, returns to step S22 again, and undergoes hot pressing again to try to regenerate. The method for producing the optical component bonded body of the present embodiment is carried out as described above.

According to the above manufacturing method of the optical component bonding body, the optical component bonding body conveyed on the production line has been subjected to the first hot pressing treatment. Therefore, it is possible to eliminate the defect and improve the yield by eliminating the defect of the optical component which is difficult to find a fine defect by a hot pressing process.

Further, it is determined that the optical component bonding body as a defective product is subjected to the second hot pressing treatment outside the production line by the inspection after the first hot pressing treatment. Therefore, defects which cannot be eliminated by the first hot press treatment can be eliminated by the second hot press treatment to increase the yield.

Moreover, by the hot pressing process, the deformation of the optical component itself can be solved, and the defect of the optical component bonding body can be eliminated. Even if the optical component itself has a deformed portion as a cause of defects, it can be a defect-free optical component bonded body. Therefore, the output of the optical component is increased, and as a result, the yield of the optical component bonding body can be improved.

Moreover, the inspector visually inspects the manufacturing line, and compared with the case where the commercially available optical automatic inspection device performs defect inspection, the possibility of overkill is small, and the accuracy of the defect inspection is appropriately maintained according to actual use. The standard. Further, since the fine defects are eliminated by the first hot pressing process and the second hot pressing process, the number of defective products is reduced, and the process burden of the visual inspection can be reduced.

Further, since the fine defects are eliminated by the hot press treatment, the inspection is mainly performed by the visual inspection, and it is easy to check the defects with good precision in actual use.

In the present embodiment, the bonding device (the first bonding device 13 and/or the second bonding device 17) and the hot pressing device 100 (the first thermal pressing device) are disposed on a continuous manufacturing line. Further, the hot press device 110 (second hot press device) disposed by separation from the manufacturing line is subjected to the hot press process using the defective product determined by the inspection device 120 (visual defect inspection, automatic inspection device). That is, the optical component bonding body forming process and the first hot pressing process are performed on a continuous manufacturing line, and the second hot pressing process is performed in a state of being separated from the manufacturing line. For example, in the bonding system 1 , at least a part of the transport system for manufacturing the production line transports the object to be processed to the bonding device (the first bonding device 13 / the second bonding device 17 ) and the thermal pressing device 100 . The transport system for manufacturing the production line basically transports the object to be processed to the hot press device 110 using another transfer system. According to the method for producing an optical component bonded body of the present embodiment, a method for producing an optical component bonded body can be provided, and the defect can be inspected with good precision in actual use, and can be stably manufactured without impairing the manufacturing yield.

Further, the present invention is not limited to the above embodiments. For example, in the above embodiment, when the polarizing film is bonded to the liquid crystal panel, the optical display member to which the optical module is attached is not limited to the liquid crystal panel, and may be an organic electroluminescence (OEL) panel. The attached optical component is not limited to the polarizing film, and may be an antireflection film, a light diffusion film, or the like.

Further, in the present embodiment, the second visual inspection defective product detected by the second visual inspection process is subjected to the off-line processing after the second hot press processing, and the hot pressing in the plurality of off-line processing is performed. After the treatment process, a plurality of thermal processes are experienced, and the quality of the optical component bonding body is easily lowered. Therefore, the defective product detected by the second visual inspection process can be discarded.

However, from the viewpoint of improvement in yield, it is preferable that the amount of waste is relatively small. For example, the upper limit value at which the second hot press treatment process can be performed is set in advance, and for the defective product of the second hot press process having the set number of times, As an application, it is best to discard it.

Further, in the present embodiment, the defect inspection after the first hot press treatment is a visual defect inspection outside the production line, but is not limited thereto. For example, the film bonding system 1 in FIG. 1 is preferably provided on the downstream side of the second inverting device 19, and an optical automatic inspection device is provided to automatically inspect the defects of the bonded body conveyed on the production line in sequence. That is, it is preferable to perform automatic defect inspection on a manufacturing line.

As such an optical automatic inspection device, for example, it is possible to use a camera from the upper side (display surface side) while illuminating from the lower side (backlight side) of the double-sided bonding panel P12, and according to this, The photographing data is used to determine the structure of the defect of the double-sided bonding panel P12. Further, as an optical automatic inspection device, any other material that can be optically automatically inspected for defects can be used.

[Second Embodiment] Fig. 9 is an explanatory view showing a production system of another optical component bonding body for carrying out the method for manufacturing an optical module bonding body according to the present embodiment. Fig. 9 is a schematic configuration diagram of a film bonding system 2 constituting a part of a production system of an optical component bonding body, which corresponds to Fig. 1 . In Fig. 9, the film bonding system 2 is divided into upper and lower sections for convenience of illustration. In the following description, the same components as those described above will be omitted.

In the film bonding system 2 shown in FIG. 9, the width (length in the width direction) of the strip-shaped first optical component layer F1 is wider than the long side of the display region P4 of the liquid crystal panel P. Further, the width (length in the width direction) of the strip-shaped second optical component layer F2 is wider than the short side of the display region P4 of the liquid crystal panel P.

In the film bonding system 2, the bonding layer F5 of the strip-shaped first optical component layer F1 is cut out at a shorter length than the short side of the display region P4 of the liquid crystal panel P to fabricate the first layer F1m. It is bonded to the liquid crystal panel P during the conveyance of the liquid crystal panel P by the roller conveyor 5. Similarly, the bonding layer F5 of the strip-shaped second optical component layer F2 is cut out at a length longer than the long side of the display region of the liquid crystal panel P to form the second layer F2m, which is used by the roller conveyor 5. The liquid crystal panel P is bonded to the liquid crystal panel P during conveyance. As described below, the first layer F1m and the second layer F2m are collectively referred to as "layer FXm".

Then, when bonded to the liquid crystal panel P, the first optical module F11 is formed by cutting the remaining portion of the first layer sheet F1m located outside the display region P4 of the liquid crystal panel P from the first layer sheet F1m. Further, when bonded to the liquid crystal panel P, the second optical module F12 is formed by cutting the remaining portion of the second layer sheet F2m located outside the display region P4 of the liquid crystal panel P from the second layer sheet F2m. Each part of the film bonding system 2 is integrally controlled by a control unit not shown.

The film bonding system 2 includes a first adsorption device 11 that adsorbs the liquid crystal panel P that has been transported to the delivery end of the front-end process, and transports it to the loading end of the upstream conveyor 6 to perform calibration of the liquid crystal panel P (position determination) The first dust collecting device 12 is disposed on the panel transport downstream side of the first suction device 11; the first bonding device 13 is disposed on the panel transport downstream side of the first dust collecting device 12; and the first inverting device 31A, The first cutting device 32A is disposed on the panel transport downstream side of the first reversing device 31A, and the recovery device (not shown) is disposed on the first cutting device. The panel of 32A conveys the first recovery position 33A on the downstream side; and the first rotating device 34 is disposed on the downstream side of the panel transport of the recovery device.

Further, the film bonding system 2 includes a second dust collecting device 16 that is disposed on the panel transport downstream side of the loading end of the downstream conveyor 7, and a second bonding device 17 that is disposed on the panel of the second dust collecting device 16 The downstream side; the second reversing device 31B is disposed on the panel transport downstream side of the second bonding device 17; the second cutting device 32B is disposed on the panel transport downstream side of the second reversing device 31B; The second pressure recovery device 100 is disposed on the downstream side of the panel transporting downstream of the second cutting device 32B; the hot press device 100 is disposed on the downstream side of the panel transport of the recovery device; and the second rotating device 35 is disposed on the hot press device The panel of 100 is transported to the downstream side.

As will be described in detail later, on the panel transport upstream side of the first cutting device 32A, a detecting device is set to set the cutting position in the first cutting device 32A. On the panel transport upstream side of the second cutting device 32B, the setting detecting means sets the cutting position in the second cutting device 32B.

(First Bonding Device) The first bonding device 13 is a layer (first layer sheet F1m) of the bonding layer F5 that is cut to a specific size with respect to the lower surface of the liquid crystal panel P that is introduced to the bonding position. fit.

The first bonding apparatus 13 has a conveying device 22 that winds the first optical component layer F1 from the roll drum R1a around which the first optical component layer F1 is wound, and conveys it along the longitudinal direction of the first optical component layer F1. The first optical component layer F1 and the nip roller 23 are bonded to the lower surface of the liquid crystal panel P transported by the upstream conveyor 6 by the first layer sheet F1m separated from the first optical unit layer F1 by the transport device 22.

The conveying device 22 is a device that conveys the bonding layer F5 that carries the separation layer sheet F3a. The conveying device 22 has a drum holding portion 22a, a plurality of guide rollers 22b, a cutting device 22c that applies a half cut to the first optical component layer F1 on the transport path, and a blade 22d that applies a half-cut first optical component. The layer F1 is wound at an acute angle to peel the first layer sheet F1m from the separation layer sheet F3a, and the first layer sheet F1m is supplied to the bonding position; and the winding portion 22e.

The first optical component layer F1 is in a horizontal direction (ply width direction) perpendicular to the conveyance direction of the first optical component layer F1, and has a width wider than the width of the liquid crystal panel P in plan view.

The cutting device 22c winds out the length of the display region P4 (the length of the long side of the display region P4 and the short side of the display region P4) in the longitudinal direction perpendicular to the layer width direction of the first optical module layer F1. In the present embodiment, when the length of the short side of the display region P4 is long, the entire width is traversed along the width direction of the layer, and the first optical component layer F1 is half-cut. Thereby, since the first optical component layer F1 has the bonding layer F5, the first layer sheet F1m larger than the display region P4 of the liquid crystal panel P is formed.

In the first optical component layer F1 after the half-cut, the optical module body F1a and the surface protective film F4a are cut at least in the thickness direction of the first optical component layer F1 to form an entire width direction across the first optical component layer F1. The transverse tangent of the width. The transverse line is formed at an interval having the same length as the short side length of the display region P4 in the longitudinal direction of the strip-shaped first optical component layer F1. The first optical component layer F1 is divided into a plurality of sections in the longitudinal direction by a plurality of transverse lines. In the longitudinal direction of the first optical component layer F1, the partitions sandwiched by the adjacent pair of transverse lines are each a first layer F1m.

The first layer F1m may be larger than, for example, the liquid crystal panel P. Further, in the first layer sheet F1m, the size of the protruding portion on the outer side of the liquid crystal panel P (the size of the remaining portion of the first layer sheet F1m) is appropriately set in accordance with the size of the liquid crystal panel P. For example, when the first layer F1m is applied to a small-sized and small-sized liquid crystal panel P of 5 吋 10 ,, at one side of the first layer F1 m, one side of the first layer F1 m and the liquid crystal are The interval between the sides of one of the panels P can be set to a length ranging from 2 mm to 5 mm. In addition, the above numerical values are merely an example and are not limited thereto.

The blade edge 22d is disposed below the upstream side conveyor 6, and extends at least to the entire width thereof in the width direction of the first optical component layer F1. At the blade edge 22d, the first optical component layer F1 is wound to be folded to the separation layer sheet F3a of the first optical component layer F1 after the half cut. When the first optical component layer F1 changes the advancing direction at the front end portion of the blade edge 22d to be folded back at an acute angle, the separation layer sheet F3a is peeled off from the first layer sheet F1m. The first layer sheet F1m separated from the separation layer sheet F3 by the blade edge 22d is superposed on the lower side surface of the liquid crystal panel P conveyed by the upstream side conveyor 6, and is introduced between the pair of bonding rollers 23a of the nip roller 23. .

The nip roller 23 has a pair of bonding rollers 23a which are disposed in parallel with each other in the axial direction. A specific gap is formed between the pair of bonding rolls 23a, and the gap is the bonding position of the first bonding apparatus 13. The liquid crystal panel P and the first layer sheet F1m are superposed and introduced into the gap. The liquid crystal panel P and the first layer sheet F1m are pinched between the pair of bonding rolls 23a, and sent to the downstream side of the panel conveyance. Thereby, the first layer sheet F1m is integrally bonded to the lower side surface of the liquid crystal panel P to form the first optical component bonding body PA1 (bonding body).

(First Inverting Device) The first inverting device 31A conveys the first optical component bonding body PA1 to the cutting position of the first cutting device 32A, and inverts the first optical component bonding body PA1 at the time of transportation. The front and back surfaces of the liquid crystal panel P are transferred to the first cutting device 32A in a state in which the surface to which the first layer sheet F1m is attached.

(First cutting device) The first cutting device 32A cuts off the remaining portion provided on the outer side of the bonding surface portion corresponding to the liquid crystal panel P and the first layer sheet F1m from the first layer sheet F1m bonded to the liquid crystal panel P. The first optical component F11 (see FIG. 4) corresponding to the size of the bonding surface of the liquid crystal panel P and the first layer F1m is formed. The remaining portion of the first layer sheet F1m is cut from the first optical component bonding body PA1 by the first cutting device 32A, and the first optical component is bonded to the surface of the liquid crystal panel P and the surface of either of the reverse sides of the liquid crystal panel P. F11 to form the second optical component bonding body PA2. The structure of the first cutting device 32A will be described in detail later.

(Recovery Device) The recovery device (not shown) provided in the first recovery position 33A, for example, holds the remaining portion cut by the first cutting device 32A, and is formed by the first cutting device 32A. An optical component F11 is peeled off to recover the remaining portion. After the remaining portion is recovered, the second optical component pasting body PA2 is moved in the direction of the first rotating device 34. Further, it is preferable not to use the recovery device, and the remaining portion that is cut off is freely dropped and removed when the first cutting device 32A is cut.

(First Rotating Device) The first rotating device 34 holds the second optical component bonding body PA2 that has passed through the first cutting device 32A to the carry-out end of the upstream side conveyor 6 by suction or clamping, and rotates the second optical component bonding body. PA2 is such that the second optical component bonding body PA2 is conveyed in the longitudinal direction of the display region P4. Thereby, the polarizing axis of the polarizing film bonded to the surface of the liquid crystal panel P is perpendicular to the polarizing axis of the polarizing film bonded to the reverse surface of the liquid crystal panel P.

Here, the first rotating device 34 has the same calibration camera 34c as the calibration camera 11b of the first adsorption device 11, and has the same calibration function as the panel holding portion 11a of the first adsorption device 11.

(Second bonding apparatus) The second bonding apparatus 17 is opposite to the lower side of the second optical component bonding body PA2 introduced to the bonding position, and the layer of the bonding layer F5 which is half cut by a specific size (second layer sheet) F2m) is fitted. The second bonding device 17 has the same conveying device 22 and nip roller 23 as the first bonding device 13 .

The cutting device 22c of the second bonding device 17 winds the second optical component layer F2 by the length of the display region P4 in the longitudinal direction perpendicular to the layer width direction using the second bonding device 17 (display region P4) When the length of either the long side and the short side of the display area P4 is longer than the length of the display area P4 in the present embodiment, the width is traversed along the entire width of the layer width direction relative to the second optical component layer. F2 is semi-cut. Thereby, since the second optical component layer F2 has the bonding layer F5, the second layer sheet F2m larger than the display region P4 of the liquid crystal panel P is formed.

In the second optical component layer F2 after the half cut, a transverse line is formed at intervals of the length of the strip-shaped second optical component layer F2 having the same length as the length of the long side of the display region P4. The second optical component layer F2 is divided into a plurality of sections in the longitudinal direction by a plurality of transverse lines. In the longitudinal direction of the second optical component layer F2, the partitions sandwiched by the adjacent pair of transverse lines are each a second layer F2m.

The second ply F2m may be larger than the liquid crystal panel P, for example. Further, in the second layer sheet F2m, the size of the protruding portion on the outer side of the liquid crystal panel P (the size of the remaining portion of the second layer sheet F2m) is appropriately set in accordance with the size of the liquid crystal panel P. For example, when the second layer F2m is applied to a small-sized and small-sized liquid crystal panel P of 5 吋 10 ,, at the sides of the second layer F 2 m, one side of the second layer F 2 m and the liquid crystal are The interval between the sides of one of the panels P can be set to a length ranging from 2 mm to 5 mm. In addition, the above numerical values are merely an example and are not limited thereto.

The nip roller 23 has a pair of bonding rollers 23a which are disposed in parallel with each other in the axial direction. A specific gap is formed between the pair of bonding rolls 23a, and the gap is the bonding position of the second bonding apparatus 17. The second optical component bonding body PA2 and the second layer sheet F2m are superposed into the gap, and the second optical component bonding body PA2 and the second layer sheet F2m are pinched between the pair of bonding rollers 23a, and are sent. Carry the downstream side to the panel. Thereby, the second layer sheet F2m is integrally bonded to the lower side surface of the second optical component bonding body PA2 (the opposite side of the surface to which the first optical component F11 of the second optical component bonding body PA2 is bonded) to form the second Three optical component bonding body PA3 (bonding body).

(Second reversing device) The second reversing device 31B conveys the third optical component bonding body PA3 to the cutting position of the second cutting device 32B, and inverts the third optical component bonding body PA3 at the time of transportation. The front and back surfaces of the liquid crystal panel P are transferred to the second cutting device 32B in a state in which the surface to which the second layer sheet F2m is attached.

(Second cutting device) The second cutting device 32B cuts the outer side of the bonding surface portion corresponding to the liquid crystal panel P and the second layer sheet F2m from the second layer sheet F2m bonded to the third optical component bonding body PA3. The remaining portion is provided to form a second optical component F12 (refer to FIG. 4) corresponding to the size of the bonding surface of the liquid crystal panel P and the second layer F2m. The second cutting unit 32B cuts the remaining portion of the second layer F2m from the third optical component bonding body PA3, and the second optical component F12 is bonded to the second surface (front or back) of the liquid crystal panel P, and The first surface (front or back) of the liquid crystal panel P is bonded to the first optical component F11 to form a fourth optical component bonding body PA4 (optical component bonding body).

Here, the first cutting device 32A and the second cutting device 32B are, for example, carbon dioxide (CO ₂ ) laser cutting machines. The remaining portion provided on the outer side of the bonding surface portion corresponding to the liquid crystal panel P and the first layer sheet F1m is cut from the first layer sheet F1m by the first cutting device 32A to form a liquid crystal panel P and the first layer. The first optical component F11 of the bonding surface size of the sheet F1m. The remaining portion provided on the outer side of the bonding surface portion corresponding to the liquid crystal panel P and the second layer sheet F2m is cut from the second layer sheet F2m by the second cutting device 32B to form a liquid crystal panel P and a second layer. A second optical component F12 of the bonding surface size of the sheet F2m.

The cutting device 32 (the first cutting device 32A and the second cutting device 32B are collectively referred to as "cutting device 32") and the liquid crystal panel P and the layer bonded to the liquid crystal panel P detected by the detecting device described later. The outer periphery of the bonding surface of the FXm is cut off the layer FXm bonded to the liquid crystal panel P without interruption. A frame portion G (see FIG. 4) having a specific width for providing a sealant or the like for bonding the first substrate P1 of the liquid crystal panel P and the second substrate P2 of the liquid crystal panel P to the outside of the display region P4 is provided on the outer side of the display region P4. The slit FXm is cut by the cutting device 32 in the width of the portion G.

The detection of the outer periphery of such a bonding surface and the cutting of the cutting device are carried out in the following manner.

Fig. 10 is a schematic view showing the first detecting means 61 for detecting the outer periphery of the bonding surface. The first detecting device 61 included in the film bonding system 2 of the present embodiment includes an imaging device 63 that captures a bonding surface of the liquid crystal panel P and the first layer F1m in the first optical component bonding body PA1 (hereinafter referred to as The first bonding surface SA1 (bonding surface) is a screen of the outer peripheral edge ED; the illumination light source 64 is for illuminating the outer peripheral edge ED; and the control unit 65 is for storing the memory of the image captured by the imaging device 63, or according to the screen. Perform a calculation for detecting the peripheral ED.

The first detecting device 61 is provided between the first inverting device 31A and the first cutting device 32A on the upstream side of the panel transporting of the first cutting device 32A in FIG.

The photographing device 63 is fixed and disposed inside the first bonding surface SA1 of the outer peripheral edge ED. The photographing device 63 is inclined, and the normal line of the first bonding surface SA1 is at an angle θ (hereinafter referred to as the tilt angle θ of the photographing device 63) to the normal line of the photographing surface 63a of the photographing device 63. The photographing device 63 faces the outer peripheral edge ED with the imaging surface 63a, and photographs the outer peripheral edge ED from the side of the first optical sheet bonding body PA1 to which the first layer sheet F1m is bonded.

The inclination angle θ of the photographing device 63 is preferably set so as to reliably capture the outer periphery of the first substrate P1 constituting the first bonding surface SA1. For example, when the main panel is divided into a plurality of liquid crystal panels and formed by a so-called multi-layer panel, a deviation may occur at the outer periphery of the first substrate P1 and the second substrate P2 constituting the liquid crystal panel P, and the second substrate P2 may be The end face is offset to the outside of the end face of the first substrate P1. In the above case, the inclination angle θ of the photographing device 63 is preferably set such that the outer periphery of the second substrate P2 does not enter the photographing field of view of the photographing device 63.

In the above case, the inclination angle θ of the imaging device 63 can be set in accordance with the distance between the first bonding surface SA1 and the center of the imaging surface 63a of the imaging device 63 (hereinafter referred to as the height H of the imaging device 63). For example, when the height H of the imaging device 63 is 50 mm or more and 100 mm or less, the inclination angle θ of the imaging device 63 can be set to an angle in the range of 5° or more and 20° or less. However, in the case where the amount of deviation is known empirically, the height H of the photographing device 63 and the tilt angle θ of the photographing device 63 can be obtained from the amount of deviation. In the present embodiment, the height H of the imaging device 63 is set to 78 mm, and the inclination angle θ of the imaging device 63 is set to 10°. In addition, the above numerical values are merely an example and are not limited thereto.

The tilt angle θ of the photographing device 63 may also be 0°. Fig. 11 is a schematic view showing a modification of the first detecting device 61, which is an example in which the inclination angle θ of the photographing device 63 is 0°. In this case, the imaging device 63 and the illumination light source 64 may be separately provided at positions overlapping the outer peripheral edge ED along the normal direction of the first bonding surface SA1.

The distance between the first bonding surface SA1 and the center of the imaging surface 63a of the imaging device 63 (hereinafter referred to as the height H1 of the imaging device 63) is preferably set so as to easily detect the periphery ED outside the first bonding surface SA1. s position. For example, the height H1 of the photographing device 63 can be set in a range of 50 mm or more and 320 mm or less. In addition, the above numerical values are merely an example and are not limited thereto.

The illumination light source 64 is fixed and disposed on the opposite side of the side of the first optical component bonding body PA1 to which the first layer sheet F1m is bonded. The illumination light source 64 is disposed outside the first bonding surface SA1 of the outer peripheral edge ED. In the present embodiment, the optical axis of the illumination source 64 is parallel to the normal line of the imaging surface 63a of the imaging device 63.

Further, the illumination light source 64 may be provided on the side of the first optical component bonding body PA1 to which the first layer sheet F1m is bonded (that is, on the same side as the photographing device 63).

Further, as long as the illumination light emitted from the illumination light source 64 can illuminate the outer periphery ED of the imaging device 63, the optical axis of the illumination light source 64 and the normal line of the imaging surface 63a of the imaging device 63 can also intersect each other.

Fig. 12 is a plan view showing the position of the outer periphery of the bonding surface. An inspection area CA is set on the transport path of the first optical component bonding body PA1 shown in FIG. The inspection area CA is set on the liquid crystal panel P to be conveyed, and corresponds to the position of the outer periphery ED of the first bonding surface SA1. In the figure, the inspection area CA is set at four positions corresponding to the four corner portions of the first bonding surface SA1 having a rectangular shape in plan view, and the corner portion of the first bonding surface SA1 as the outer peripheral edge ED is detected. structure. In the figure, in the outer periphery of the first bonding surface SA1, the hook portion of the corresponding corner portion is represented as the outer peripheral edge ED.

The first detecting device 61 of Fig. 10 detects the outer peripheral edge ED in the inspection area CA at four positions. Specifically, each of the inspection areas CA is provided with an imaging device 63 and an illumination light source 64, and the first detection device 61 captures a corner portion of the first bonding surface SA1 of each of the liquid crystal panels P to be transported, and detects based on the photographic data. Out of the periphery ED. The data of the detected peripheral ED is stored in the control unit 65 shown in FIG.

The setting position of the inspection area CA is not limited to this as long as the outer periphery of the first bonding surface SA1 can be detected. For example, each inspection area CA may be provided at a position corresponding to a part of each side of the first bonding surface SA1 (for example, a central portion of each side). In this case, the structure of each side (four sides) of the first bonding surface SA1 as the outer periphery is detected.

Further, the imaging device 63 and the illumination light source 64 are not limited to the configuration provided in each of the inspection regions CA, and may be configured to be movable along a movement path set by the outer periphery ED of the first bonding surface SA1. In this case, since the photographing device 63 and the illumination light source 64 are configured to detect the outer peripheral edge ED when they are located in the respective inspection areas CA, it is possible to detect the outer circumference by providing each of the photographing device 63 and the illumination light source 64. Edge ED.

The cutting position of the first layer piece F1m by the first cutting device 32A is set based on the detection result of the outer periphery ED of the first bonding surface SA1.

For example, the control unit 65 shown in FIG. 10 sets the cutting position of the first layer F1m based on the stored data of the outer periphery ED of the first bonding surface SA1, so that the first optical component F11 is formed without protruding. The size of the outer side of the liquid crystal panel P (outside of the first bonding surface SA1). Further, the setting of the cutting position is not necessarily performed by the control unit 65 of the first detecting device 61, and may be performed using another calculation means using the data of the outer periphery ED detected by the first detecting device 61.

The first cutting device 32A cuts the first layer sheet F1m by the cutting position set by the control unit 65.

Referring back to FIG. 9, the first cutting device 32A cuts off the corresponding first bonding surface SA1 of the first layer sheet F1m bonded to the liquid crystal panel P along the cutting position set according to the detected outer circumference ED. The portion, and the remaining portion on the outer side of the first bonding surface SA1, cuts out the first optical component F11 corresponding to the size of the first bonding surface SA1 (refer to FIG. 4). Thereby, the second optical component bonding body PA2 (secondary bonding body) in which the first optical component F11 is bonded to the upper surface of the liquid crystal panel P is laminated.

Here, the "portion corresponding to the first bonding surface SA1" means that the display area of the liquid crystal panel P is larger than that of the liquid crystal panel P in the first layer sheet F1m (the outline shape in plan view) The small area is an area in which the functional portion such as the electronic component mounting portion is avoided in the liquid crystal panel P.

In the present embodiment, in the liquid crystal panel P having a rectangular outer shape in plan view, the remaining portions are cut off by laser along the outer periphery of the liquid crystal panel P at three sides except the functional portion, which is equivalent to the function. On one side of the portion, the remaining portion is cut by laser from a position outside the outer periphery of the liquid crystal panel P toward the display region P4 side. For example, in the case where the first substrate P1 is a thin film transistor (TFT) substrate, in a side opposite to the functional portion, in addition to the functional portion, from the periphery of the liquid crystal panel P toward the display region The P4 side is offset by a certain amount of position.

Figure 13 is a schematic view showing the second detecting means 62 for detecting the outer periphery of the bonding surface. The second detecting device 62 included in the film bonding system 2 of the present embodiment includes an imaging device 63 that captures a bonding surface of the liquid crystal panel P and the second layer F2m in the third optical component bonding body PA3 (hereinafter referred to as a screen of the outer peripheral edge ED of the second bonding surface SA2 (bonding surface); the illumination light source 64 illuminates the outer peripheral edge ED; and the control unit 65 stores the image captured by the imaging device 63, and detects the outer periphery based on the screen. The calculus used for the edge ED. The second detecting device 62 has the same structure as the first detecting device 61 described above.

The second detecting device 62 is disposed on the upstream side of the panel transporting of the second cutting device 32B in FIG. 9, and is disposed between the second inverting device 31B and the second cutting device 32B. The second detecting device 62 detects the outer peripheral edge ED of the second bonding surface SA2 in the same manner as the first detecting device 61 in the inspection region set on the transport path of the third optical component bonding body PA3.

The cutting position of the second ply F2m of the second cutting device 32B is set based on the detection result of the outer periphery ED of the second bonding surface SA2.

For example, the control unit 65 shown in FIG. 13 sets the cutting position of the second layer F2m based on the stored information of the outer periphery ED of the second bonding surface SA2, so that the second optical component F12 is not formed. The size of the outer side of the liquid crystal panel P (outside of the second bonding surface SA2) is protruded. Further, the setting of the cutting position is not necessarily performed by the control unit 65 of the second detecting device 62, and may be performed using another calculation means using the data of the outer periphery ED detected by the second detecting device 62.

The second cutting device 32B cuts the second layer sheet F2m by the cutting position set by the control unit 65.

The second cutting device 32B cuts off the portion of the second ply F2m that is bonded to the liquid crystal panel P corresponding to the second bonding surface SA2 along the outer peripheral edge ED, and the outer side of the second bonding surface SA2 The remaining portion is used to cut out the second optical component F12 corresponding to the size of the second bonding surface SA2 (refer to FIG. 4). Thereby, the fourth optical component bonding body PA4 to which the second optical component F12 is bonded is formed on the upper surface of the second optical component bonding body PA2.

Here, the "portion corresponding to the second bonding surface SA2" means that the display area of the liquid crystal panel P is larger than that of the liquid crystal panel P in the second layer sheet F2m (the outline shape in plan view) The small area is an area in which the functional portion such as the electronic component mounting portion is avoided in the liquid crystal panel P.

As described above, in the cutting device 32, the outer peripheral edge of the bonding surface of each of the plurality of liquid crystal panels P is detected by the detecting device, and the outer peripheral edge of the plurality of liquid crystal panels P can be set to be attached to each of the liquid crystal panels P. The cutting position of the layer FXm. Thereby, regardless of the individual difference in the size of the liquid crystal panel P or the layer FXm, the optical component of the desired size can be cut. Since there is no difference in quality due to individual differences in the size of the liquid crystal panel P or the layer FXm, the frame portion around the display area can be reduced to achieve the expansion of the display area and the miniaturization of the machine.

In the above embodiment, a carbon dioxide (CO ₂ ) laser cutting machine is used as an example of the cutting device 32, but the cutting device 32 is not limited thereto. Other cutting means such as a cutting blade may be used as the cutting device 32.

(Recovery device) The recovery device (not shown) provided in the second recovery position 33B, for example, holds the remaining portion cut by the second cutting device 32B, and is formed by the second cutting device 32B. The two optical components F12 are peeled off to recover the remaining portion. After the remaining portion is recovered, the fourth optical component pasting body PA4 is moved in the direction of the second rotating device 35. Further, it is preferable not to use the recovery device, and the remaining portion that is cut off is freely dropped and removed when the second cutting device 32B is cut.

(Second Rotating Device) The second rotating device 35 rotates the fourth optical component bonding body PA4 so that the fourth optical component bonding body PA4 carried out from the thermal pressing device 100 is conveyed in the short-side direction of the display region P4.

Then, in the same manner as in the first embodiment, the fourth optical component bonding body PA4 carried out from the manufacturing line is visually inspected outside the manufacturing line, and the second optical component bonding body PA4 which is a defective product is subjected to the second heat. Pressure treatment. The operation (out-of-production processing) of the fourth optical component bonding body PA4 in the production line is the same as that of the first embodiment.

(Manufacturing Method of Optical Component Bonding Body) A method of manufacturing the optical component bonding body according to the second embodiment will be described with reference to Fig. 8 .

First, in the manufacture of the double-sided bonding panel P12, the liquid crystal panel P is carried into the manufacturing line (step S11), and dust, dust, and the like adhering to the surface of the liquid crystal panel P are cleaned (step S12).

Next, in the above-described film bonding system 2, the first optical component layer F1 is taken up and cut from the roll drum R1a to form a first layer F1m larger than the display area P4 (for example, larger than the liquid crystal panel P). . Then, the first layer sheet F1m is bonded to the liquid crystal panel P to form the first optical component bonding body PA1 (primary bonding body).

Next, in the first optical component bonding body PA1, the outer peripheral edge of the bonding surface of the first layer F1m and the liquid crystal panel P is detected, and the remaining portion of the first layer F1m is cut along the detected outer periphery to form the first Two optical components are bonded to the body PA2.

Similarly, the second optical component layer F2 is taken up and cut from the take-up reel R1b to form a second ply F2m larger than the display area P4 (for example, larger than the liquid crystal panel P), and is bonded to the second optical component. The body PA2 is bonded to form a third optical component bonding body PA3.

Then, in the third optical component bonding body PA3, the outer peripheral edge of the bonding surface of the second layer sheet F2m and the liquid crystal panel P is detected, and the remaining portion of the second layer sheet F2m is cut along the detected outer peripheral edge to form the first The four optical component is bonded to the body PA4 (step S13).

Then, in the obtained fourth optical component bonding body PA4, steps S14, S15, S21-S26 are carried out in the same manner as in the first embodiment. The method for producing an optical component bonded body of the present embodiment is carried out as described above.

According to the manufacturing method of the optical component bonding body described above, a method of manufacturing an optical component bonding body is provided in the same manner as in the first embodiment, and it is possible to perform defect inspection with just accuracy in actual use without impairing the manufacturing yield. Stability manufacturing.

Further, in the present embodiment, the first bonding apparatus 13 or the second bonding apparatus 17 is not limited to being directly peeled off from the separated layer sheet F3a while the first layer sheet F1m or the second layer sheet F2m is formed. The structure is bonded to the liquid crystal panel P or the second optical component bonding body PA2. In the bonding apparatus, a bonding head may be provided, and the produced first layer sheet F1m or second layer sheet F2m may be attached and attached to the liquid crystal panel P or the second optical component bonding body PA2.

Although the preferred embodiment of the embodiment has been described above with reference to the attached drawings, the present invention is not limited to the examples. The various shapes or combinations of the constituent elements shown in the above examples are merely examples, and various changes in design requirements and the like are possible without departing from the gist of the invention.

1‧‧‧Film bonding system
2‧‧‧Film bonding system
5‧‧‧Roller conveyor
6‧‧‧Upstream conveyor
7‧‧‧ downstream conveyor
11‧‧‧First adsorption device
11a‧‧‧ Panel Holder
11b‧‧‧calibration camera
12‧‧‧The first dust collecting device
13‧‧‧First bonding device
14‧‧‧First deviation inspection device
14a‧‧‧ camera
15‧‧‧First reversal device
15a‧‧‧Rotary axis
15b‧‧‧Reverse arm
15c‧‧‧calibration camera
16‧‧‧Second dust collecting device
17‧‧‧Second fitting device
18‧‧‧Second deviation inspection device
18a‧‧‧ camera
19‧‧‧Second reversal device
20‧‧‧Control Department
22‧‧‧Transporting device
22a‧‧‧Roller Holder
22b‧‧‧Guide roller
22c‧‧‧cutting device
22d‧‧‧blade
22e‧‧‧Winding Department
23‧‧‧ pinch roller
23a‧‧‧Adhesive roller
31A‧‧‧First reversal device
31B‧‧‧second reversal device
32‧‧‧cutting device
32A‧‧‧First cutting device
32B‧‧‧Second cutting device
33A‧‧‧First recovery location
33B‧‧‧Second recovery location
34‧‧‧First rotating device
34c‧‧‧calibration camera
35‧‧‧Second rotating device
61‧‧‧First detection device
62‧‧‧Second detection device
63‧‧‧Photographing device
63a‧‧‧Photographing surface
64‧‧‧Light source
65‧‧‧Control Department
100‧‧‧Hot pressure device
101‧‧‧ chamber
102‧‧‧ position
103‧‧‧ position
110‧‧‧Hot pressure device
120‧‧‧Checking device
CA‧‧‧ inspection area
ED‧‧‧ outer periphery
F11‧‧‧First optical component
F12‧‧‧Second optical component
F1m‧‧‧ first layer
F2m‧‧‧Second layer
F1‧‧‧First optical component layer
F2‧‧‧Second optical component layer
F5‧‧‧Fitting layer
F6‧‧‧ polarizing element
F7‧‧‧ first film
F8‧‧‧second film
F1a‧‧‧Optical component body
F2a‧‧‧Adhesive layer
F3a‧‧‧Separation layer
F4a‧‧‧Surface protection film
FX‧‧‧ optical component layer
G‧‧‧Border Department
H‧‧‧ Height
H1‧‧‧ Height
P‧‧‧ LCD panel
P11‧‧‧Single-sided fitting panel
P12‧‧‧ double-sided fitting panel
P1‧‧‧ first substrate
P2‧‧‧second substrate
P3‧‧‧ liquid crystal layer
P4‧‧‧ display area
PA1‧‧‧First optical component fit
PA2‧‧‧Second optical component fit
PA3‧‧‧The third optical component fit
PA4‧‧‧Four optical component bonding body
R1a, R1b‧‧‧ Roller
R2‧‧‧Separation roller
S1‧‧‧ Processing
S11-S15‧‧‧Steps
S2‧‧‧ Processing
S21-S26‧‧‧Steps
SA1‧‧‧ first fit surface
SA2‧‧‧Second fit surface θ‧‧‧ tilt angle

Fig. 1 is a schematic configuration diagram of a film bonding system according to the first embodiment. Fig. 2 is an explanatory view of a film bonding system having a first inverting device. FIG. 3 is a plan view of a liquid crystal panel. FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. 3. FIG. Fig. 5 is a partial cross-sectional view showing the optical component layer. Fig. 6 is a graph showing experimental results confirming the effect of performing two AC treatments. Fig. 7 is a graph showing experimental results showing the effect of confirming the time between two AC treatments. Fig. 8 is an explanatory view showing a method of manufacturing an optical component bonding body in the first embodiment. Fig. 9 is a schematic configuration diagram of a film bonding system according to a second embodiment. Fig. 10 is a schematic view showing a first detecting device for detecting the outer periphery of the bonding surface. Fig. 11 is a schematic view showing a modification of the first detecting device. Fig. 12 is a plan view showing the position of the outer periphery of the bonding surface. Fig. 13 is a schematic view showing a second detecting device for detecting the outer periphery of the bonding surface.

S1‧‧‧ Processing

S11-S15‧‧‧Steps

S2‧‧‧ Processing

S21-S26‧‧‧Steps

Claims (10)

A manufacturing method of an optical component bonding body, which is a manufacturing method of an optical component bonding body formed by bonding an optical component to an optical display component, comprising: an optical component bonding body forming process, and a tape-shaped optical body is rolled out from the winding roller a component layer, the plurality of optical components obtained by cutting the optical component layer are bonded to the plurality of optical display components to form a plurality of optical component bonding bodies; the first hot pressing process, heating and pressing the plurality of optical component bonding bodies; a process of inspecting a defect of the optical component bonded body by the first hot pressing process; and a second hot pressing process, heating and pressing the defective product detected by the inspection process; wherein the optical component is bonded The forming process and the first hot press processing process are performed on a continuous manufacturing line; and the second hot press process is performed separately from the manufacturing line. A manufacturing method of an optical component bonding body, which is a manufacturing method of an optical component bonding body formed by bonding an optical component to an optical display component, comprising: a bonding body forming process, and winding a ribbon-shaped optical component layer from a roll roller And bonding the plurality of layers obtained by cutting the optical component layer to the plurality of optical display components to form a plurality of bonding bodies; and detecting a process for detecting a bonding surface of the layer and the optical display component in the bonding body An outer peripheral edge; an optical component bonding body forming process in which a layer self-bonding to the optical display member is disposed along a peripheral portion of the outer surface of the facing surface portion, and is cut along the outer peripheral edge Forming an optical component bonding body containing an optical component corresponding to the size of the bonding surface; a first hot pressing process, heating and pressing the plurality of optical component bonding bodies; and an inspection process for attaching the optical component processed by the first hot pressing process The optical body is separately inspected for defects; and the second hot pressing process, the heat and pressure treatment, the defective product detected by the inspection process; wherein, the optical group The part bonding forming process and the first hot pressing process are performed on a continuous manufacturing line; and the second hot pressing process is performed separately from the manufacturing line. The method of manufacturing an optical component bonding body according to claim 2, wherein in the detecting process, an outer peripheral edge of a bonding surface of the layer and the optical display member is detected for each optical display member. The method of manufacturing an optical component bonding body according to any one of claims 1 to 3, wherein the plurality of optical component bonding bodies are sequentially transported through the optical component bonding body forming process in the first thermal compression processing process The processing line is distributed to a plurality of processing lines, and each of the processing lines is subjected to heat and pressure treatment. The method for manufacturing an optical component bonding body according to any one of claims 1 to 4, further comprising: a first visual inspection process, wherein the defects of the plurality of optical component bonded bodies subjected to the second hot pressing treatment are visually inspected; And the rework processing process, the first visual inspection defective product detected by the first visual inspection process, the first visual inspection of the defective product has a defect state, and the optical component is peeled off from the first visual inspection defective product to expose The optical display member is bonded to a surface on which the optical display member is exposed to a new optical component prepared in advance to form a new optical component bonding body; wherein the first visual inspection process is performed separately from the manufacturing line Rework processing process. The manufacturing method of the optical component bonding body according to claim 5, further comprising a second visual inspection process for visually checking the defects of the plurality of optical component bonding bodies subjected to the rework processing process; wherein, separately from the manufacturing line The second visual inspection process is performed. The method of manufacturing an optical component bonding body according to claim 6, wherein the second visual inspection process is performed again on the second visual inspection defective product detected by the second visual inspection process. The method of manufacturing an optical component bonding body according to any one of claims 1 to 7, wherein the defect is optically automatically detected in an inspection process using an automatic inspection device provided in the manufacturing line. The method of manufacturing an optical component bonding body according to any one of claims 1 to 7, wherein the defect is visually inspected in the inspection process. A production system for an optical component bonding body, comprising: a bonding body forming device having a bonding device for bonding a layer obtained by cutting a strip-shaped optical component layer of a roll roller to an optical display member to form a plurality of bonding devices The first hot pressing device is a first hot pressing device for hot pressing the plurality of bonded bodies of the bonded body forming device, and the bonding device and the first hot pressing device are disposed on a continuous manufacturing line; The inspection device optically inspects the defects of the plurality of bonded bodies passing through the first heat press device; and the second heat press device is disposed apart from the manufacturing line, and the heat press treatment uses the defective product determined by the inspection device.