TW201506870A - Detection system and detection method - Google Patents

Abstract

A detection system and a detection method of driving chips, which are applied to a display device, are disclosed herein. The display device includes a plurality of driving chips. The detection system includes a plurality of switch components, a plurality of detection units, and a processing unit. The driving chips are configured to receive a control signal via the switch components. Each of the detection units is configured to receive a feedback signal generated by the driving chips according to the control signal, and generates a detection signal according to the feedback signal. The processing unit is configured to receive the detection signal from the detection units and determines whether the driving chips work normally according the detection signal.

Description

Detection system and detection method

The present invention relates to a detection system and a detection method, and in particular to a detection system and a detection method applied to a drive wafer.

In recent years, displays have become one of the indispensable components of today's consumer electronics. In addition to the display panel, the display typically includes a plurality of drive wafers to drive the display panel. Generally, the driving chips are connected to each other in series. When the first driving chip receives the signal, the signal is transmitted to the next driving chip, and so on, thereby causing the driving chips to be sequentially operated. Drive the display panel to produce an image for the display.

However, when a problem occurs in a certain driving chip, the adjacent driving chips may not be able to transmit signals normally, and thus the display panel may have partial or comprehensive image output failure. However, when detecting these driving chips, it is impossible to detect a single driving chip or some specific driving wafers. Therefore, when partial or full-surface image output of the display panel is inappropriate, it is difficult to judge a problem. Drive chip. Therefore, when detecting the driving wafer, it is not only time consuming, but also problems such as erroneous repair, wasted material, labor cost, and the like.

In view of the above, the object of the present invention is to provide a detection system and a detection method, which can selectively detect a single driving chip or a specific plurality of driving wafers, and determine a driving chip that cannot operate normally, so as to reduce the mis-repair. The cost of materials and labor costs.

To achieve the above object, the present invention provides a detection system for driving a wafer, which is applied to a display including a plurality of driving chips and electrically connected to the display. The detection system includes a plurality of switching elements, a plurality of detecting units, and a processing unit. The switching elements are electrically connected to the driving chips, and the driving chips receive a control signal through the switching elements. Each of the detecting units is electrically connected to the driving chips, and each detecting unit is configured to receive a feedback signal generated by the driving chips according to the control signal, and generate a detecting signal according to the feedback signal. The processing unit is electrically connected to the detecting units, and receives the detecting signals from the detecting units, and determines whether the driving chips are normally operated according to the detecting signals.

To achieve the above object, the present invention further provides a method for detecting a driving wafer, which is applied to a display including a plurality of driving wafers. The detecting method includes the following steps: providing a control signal to the driving chips to cause each driving chip to generate a feedback signal according to the control signal; generating a plurality of detection signals according to the feedback signal; and, according to the detection The test signal determines whether the drive chips are operating normally.

In order to make the above objects, technical features and advantages of the present invention more obvious The following is a detailed description of the preferred embodiments in conjunction with the drawings.

1, 2, 3‧ ‧ inspection system

11‧‧‧ display panel

13-1~13-N‧‧‧ drive chip

15-1~15-N‧‧‧Detection unit

17‧‧‧Processing unit

102‧‧‧Control signal

104‧‧‧Reward signal

106‧‧‧Detection signal

108‧‧‧Information signal

111‧‧‧First Control Unit

113‧‧‧Second control unit

S1-1~S1-N‧‧‧first switching element

S2-1~S2-(N-1)‧‧‧Second switching element

R1~RN‧‧‧resistance

VDD‧‧‧voltage source

S401~S403‧‧‧Steps

1A is a schematic diagram of a detection system for driving a wafer of the first embodiment; FIG. 1B is a schematic diagram of a detection system for driving a wafer of the first embodiment; and FIG. 2 is a schematic diagram of a detection system for driving a wafer of the second embodiment. 3A is a schematic diagram of a detection system for driving a wafer of the third embodiment; FIG. 3B is a schematic diagram of a detection system for driving a wafer of the third embodiment; and FIG. 4 is a method for detecting a driving wafer of the fourth embodiment; Flow chart.

The content of the present invention can be construed as the following examples, but the embodiments of the present invention are not intended to limit the invention to any specific environment, application or manner as described in the following embodiments. Therefore, the following examples are merely illustrative of the invention and are not intended to limit the invention. In the following embodiments and figures, elements that are not directly related to the present invention have been omitted and are not shown, and the dimensional ratios between the elements in the drawings are only for ease of understanding, and are not intended to be limited to The actual implementation ratio of the present invention.

About the "first", "second", ..., etc. used in this article, and The meaning of non-specific reference order or order is not intended to limit the present invention, but merely distinguishes between elements or operations described in the same technical terms.

"Electrical connection" or "coupling" as used herein may mean that two or more elements are in direct physical or electrical contact with each other, or indirectly for physical or electrical contact, and "electrical connection" It can also mean that two or more component elements operate or act in conjunction with one another.

A first embodiment of the present invention is a detection system for driving a wafer, the schematic of which is depicted in Figure 1A. The detection system 1 is applied to a display (not shown). The display includes a display panel 11 and a plurality of drive wafers 13-1 to 13-N (N is an integer greater than 1). Further, the driving chips 13-1 to 13-N are used to drive the display panel 11 and cause the display panel 11 to generate an image.

In this embodiment, the detection system 1 includes a plurality of first switching elements S1-1~S1-N, a plurality of detecting units 15-1~15-N, and a processing unit 17. The first switching elements S1-1~S1-N are electrically connected to the driving chips 13-1~13-N, respectively, and the driving chips 13-1~13-N are received through the first switching elements S1-1~S1-N. A control signal 102, the control signal 102 can be any signal for controlling the driving chips 13-1~13-N.

As shown in FIG. 1A, the detecting units 15-1~15-N are electrically connected to the driving chips 13-1~13-N, respectively, and the driving chips 13-1~13-N are respectively transmitted through the first switch S1-1. When ~S1-N receives the control signal 102, a feedback signal 104 is generated. Then, the detecting units 15-1~15-N respectively receive the feedback signals 104 generated by the driving chips 13-1~13-N according to the control signals 102, and generate a detecting signal 106 according to the feedback signals 104, respectively. For example, when When a switching element S1-1 is turned on, the driving chip 13-1 receives the control signal 102 and generates a feedback signal 104. Afterwards, the detecting unit 15-1 generates the detecting signal 106 in response to the received feedback signal 104.

In this embodiment, the processing unit 17 is electrically connected to the detecting units 15-1~15-N for receiving the detecting signal 106 from the detecting units 15-1~15-N, and determining according to the detecting signal 106. It is judged whether or not the driving chips 13-1 to 13-N operate normally. It is to be noted that the processing unit 17 can be any of a variety of processors well known to those of ordinary skill in the art, such as a central processing unit (CPU), a microprocessor or other computing device.

For convenience of explanation, the following embodiments are exemplified by the case where N is 4, but are not limited thereto. When the driving chips 13-1 and 13-3 are to be detected, the first switching elements S1-1 and S1-3 can be selectively turned on, and the other first switching elements S1-2 and S1-4 are turned off, so that The driving chips 13-1 and 13-3 to be tested receive the control signals 102 through the first switching elements S1-1 and S1-3, and respectively generate the feedback signals 104. In this case, the detecting units 15-1 and 15-3 receive the feedback signals 104 generated by the driving chips 13-1 and 13-3, and generate the detecting signals 106 according to the feedback signals 104. Then, the processing unit 17 receives the detection signals 106 generated by the detecting units 15-1 and 15-3, and determines whether the driving chips 13-1 and 13-3 are working normally.

On the other hand, if it is desired to detect whether all of the driving chips 13-1 to 13-4 are operating normally, the first switching elements S1-1 to S1-4 are all turned on, and the driving wafers 13-1 to 13-4 are transmitted through the phase. The corresponding first switching elements S1-1~S1-4 receive the control signal 102. When the driving chips 13-1~13-4 are all in normal operation, the driving chips 13-1~13-4 generate the feedback signal 104. And its relative The detecting units 15-1~15-4 generate corresponding detecting signals 106 according to the respective feedback signals 104. The processing unit 17 determines that the driving chips 13-1 to 13-4 are normal according to the received detection signal 106. It should be noted that the above description is only for explaining an embodiment of the present invention, and the present invention does not limit the number of configurations of the first switching element and the detecting unit.

In another embodiment, as shown in FIG. 1B, the detection system 1 further includes a first control unit 111, and the first control unit 111 can be connected to the first switching elements S1-1~S1-N by wire or/and wirelessly. For controlling the first switching elements S1-1~S1-N, the driving chips 13-1~13-N are selectively received by the control signals 102. It should be noted that the first switching elements S1-1~S1-N can also be turned on or off by manual control, or the first switching elements S1-1~S1 can be made by using a jumper. -N is turned on or off. In other words, any manner in which the first switching elements S1-1 to S1-N can be controlled to be turned on and off is within the scope of the present invention.

A second embodiment of the present invention is a detection system 2 for driving a wafer, the schematic of which is depicted in Figure 2. Compared with the first embodiment, in the embodiment, the detecting units 15-1~15-N of the detecting system 2 further comprise a resistor, and the resistors are denoted by R1~RN.

Specifically, the detecting units 15-1~15-N respectively comprise resistors R1~RN, the first ends of the resistors R1~RN are used to receive a voltage source VDD, and the second ends of the resistors R1~RN are respectively electrically connected. To drive the corresponding drive wafers 13-1~13-N in the wafer. Thereafter, the processing unit 17 compares the voltage across the resistors R1 to RN with a reference voltage value (not shown) to determine whether the driving chips 13-1~13-N are working normally.

For example, when the processing unit 17 compares the voltage across the resistors R1 RN RN with the reference voltage value, the resistance value across the R1 and the reference voltage value are greatly different, and the remaining resistors R2 RN RN After the cross voltage is still in a reasonable range after comparison with the reference voltage value, the processing unit 17 judges that the driving wafer 13-1 is not operating normally. However, in other embodiments, the processing unit 17 can also determine the driving chip 13 by comparing the current value of the inflow detecting units 15-1~15-N with a reference current value (not shown). -1~13-N is working normally. Alternatively, the driving chips 13-1 to 13-N are detected by the principle of thermal sensing, and it is judged whether or not the driving chips 13-1 to 13-N are normally operated. It is to be understood that the above-described determinations are merely illustrative of the invention and are not intended to limit the invention.

A third embodiment of the present invention is a detection system 3 for driving a wafer, the schematic of which is depicted in Figure 3A. The detecting system 3 further includes a plurality of second switching elements S2-1 to S2-(N-1) (that is, the number N minus 1) compared to the detecting system 1, and is respectively disposed on the driving wafers 13-1 to 13-N. The drive chips 13-1 to 13-N are electrically connected through the second switching elements S2-1 to S2-(N-1). Since the detecting system 3 of the third embodiment is similar to the detecting system 1 of the first embodiment, only the difference between the third embodiment and the first embodiment will be described below.

For example, if the number of N is 4, the display panel 11 includes the driving chips 13-1~13-4, and the detecting system 3 includes the first switching elements S1-1~S1-4 and the second switching element S2-1~ S2-3. The detecting units 15-1~15-4 and the processing unit 17. If the driving chips 13-1~13-4 are to be detected, in addition to selectively turning on the first switching elements S1-1~S1-4, The second switching elements S1-1 to S1-3 are selectively turned on. In this way, when the second switching elements S1-1 to S1-3 are all turned on, an electrical connection is generated between the driving chips 13-1 to 13-4. When only the first switching element S1-1 is turned on, when the driving chip 13-1 receives the control signal 102, a data signal 108 is generated, and the driving chips 13-2 to 13-4 pass through the second switching element. S2-1~S2-3 receive the data signal 108. Similarly, when only the first switching element S1-4 is turned on, the driving chip 13-4 receives the control signal 102, generates the data signal 108, and transmits the data signal through the second switching elements S2-3~S2-1. 108 is transferred to the drive chips 13-3 to 13-1.

In this embodiment, when the first switching element S1-1 and the second switching element S2-1 are simultaneously turned on, the driving chip 13-1 receives the control signal 102 and transmits the data signal 108 to the driving chip 13-2. The detecting unit 15-1 generates the detecting signal 106 according to the feedback signal 104 received from the driving chip 13-1. Then, the processing unit 17 determines whether the driving chips 13-1 and 13-2 are working normally according to the detecting signal 106 generated by the detecting unit 15-1. In other words, the processing unit 17 does not need to determine whether the driving chip 13-2 is working normally through the detection signal 106 generated by the receiving detecting unit 15-2. In other words, by selectively turning on or off the first switching elements S1-1 to S1-4 and/or the second switching elements S2-1 to S2-3, the driving chips 13-1 to 13-4 can be simultaneously performed. In the detection, since the signal is transmitted through the second switching elements S2-1 to S2-3, the signals can be controlled on the respective chips 13-1~13 by the second switching elements S2-1 to S2-3 being turned on or off. The transfer between 4 makes it easier to test the wafer. It should be noted that the above is only an embodiment of the present invention, and the present invention does not limit the first switching element. The number of configurations of the device, the second open component, and the detection unit.

In another embodiment, as shown in FIG. 3B, the detecting system 3 further includes a second control unit 113, and the second control unit 113 can be connected to the second switching elements S2-1~S2-N by wire or/and wirelessly. For controlling the second switching elements S2-1 S S2-N, selectively driving the driving chips 13-1~13-N to each other, so that the driving chips 13-1~13-N can pass through The two switching elements S2-1 to S2-N transmit the data signal 108 to each other. It should be noted that the second switching elements S2-1~S2-N can also be turned on or off by manual control, or the second switching elements S2-1~S2- can be made by using a jumper. N is turned on or off. In other words, any manner in which the second switching elements S2-1 to S2-N can be controlled to be turned on or off is within the scope of the present invention.

A fourth embodiment of the present invention is a method 4 of detecting a drive wafer, the flow chart of which is depicted in FIG. The detection method 4 of the present invention can be applied to a display comprising a plurality of drive wafers.

In addition, it should be understood that the steps of the detecting method mentioned in the embodiment may be adjusted according to actual needs, and may be performed simultaneously or partially simultaneously, unless the order is specifically stated. Moreover, this embodiment can be implemented by the above-described detection system embodiment of each driving chip.

First, in step S410, a control signal is provided to the plurality of driving chips to cause each driving chip to generate a feedback signal according to the control signal. In another embodiment, step S410 further includes the step of sequentially providing control signals to a single drive wafer or a plurality of drive wafers of the plurality of drive wafers in a plurality of different time periods. In addition, in the above steps, the following steps are further included, The transmission path of the control signal of the driving chip that does not receive the control signal among the plurality of driving chips is disconnected at a plurality of different periods. Moreover, in another embodiment, the method further includes the step of selectively turning on or off a transmission path between the plurality of driving wafers. Next, in step S420, a plurality of detection signals are generated according to the feedback signal. Finally, in step S430, it is determined whether the plurality of driving chips are normally operated according to the plurality of detecting signals.

In another embodiment, in step S410, the method further includes the following steps: providing a control signal to the plurality of driving chips, so that each driving chip operates according to the control signal, and when the feedback signal is operated by the plurality of driving chips, A voltage across a resistor coupled between the plurality of drive wafers and a voltage source. Then, in step S420, a plurality of detection signals are generated according to the feedback signal. Finally, step S430 is executed to determine whether the plurality of driving chips are normally operated according to the plurality of detecting signals.

In addition, the detection method 4 of the fourth embodiment can also perform all the operations and functions described in the first embodiment to the third embodiment, and those skilled in the art can directly understand how the fourth embodiment is based on the The embodiments to the third embodiment are used to perform the operations and functions, and thus are not described herein again.

As can be seen from the description of the above embodiments, the present invention utilizes a detecting unit to detect a single driving chip or a plurality of driving chips through a plurality of switching elements, and transmits the detection result to the processing unit. Then, the processing unit determines whether the driving chip is working normally according to the received detection signal. In this way, the drive wafer that cannot operate normally can be judged, and the material and labor cost caused by the mis-repair can be reduced.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present case. Anyone skilled in the art can make various changes and refinements without departing from the spirit and scope of the present case. The scope defined in the patent application is subject to change.

1‧‧‧Detection system

11‧‧‧ display panel

13-1~13-N‧‧‧ drive chip

15-1~15-N‧‧‧Detection unit

17‧‧‧Processing unit

102‧‧‧Control signal

104‧‧‧Reward signal

106‧‧‧Detection signal

S1-1~S1-N‧‧‧first switching element

Claims (10)

A driving system for driving a wafer is applied to a display, the display includes a plurality of driving chips, and the detecting system includes: a plurality of first switching elements electrically connected to the driving chips, and the driving chips are used to transmit the The first switching element receives a control signal; the plurality of detecting units are electrically connected to the driving chips, and each detecting unit is configured to receive a feedback signal generated by the driving chip according to the control signal, and Generating a detection signal according to the feedback signal; and a processing unit electrically connected to the detection units for receiving the detection signals from the detection units and determining the detection signals according to the detection signals Wait for the drive chip to operate normally. The detection system of claim 1, further comprising a first control unit for controlling each of the first switching elements to selectively cause the driving chips to receive the control signal. The detection system of claim 1 or 2 further includes a plurality of second switching elements respectively disposed between the driving chips, and the driving chips are electrically connected through the second switching elements. The detection system of claim 2, further comprising a second control unit for controlling the second switching elements to selectively electrically connect the driving chips. The detecting system of claim 1 or 2, wherein each detecting unit comprises a resistor, the first end of each resistor is for receiving a voltage source, and the second end of each resistor is electrically connected to the driving chip. The corresponding driving chip, the processing unit compares the voltage across the resistors with a reference voltage value to determine whether the driving chips are working normally. A method for detecting a driving chip is applied to a display comprising a plurality of driving chips, comprising the steps of: providing a control signal to the driving chips to cause each driving chip to generate a feedback signal according to the control signal; The feedback signal generates a plurality of detection signals; and determining whether the driving chips are normally operated according to the detection signals. The detecting method of claim 6, wherein the providing the control signal to the driving chips for each driving chip to generate the feedback signal according to the control signal comprises: sequentially providing the control signal to the plurality of different time periods A single drive wafer or a plurality of drive wafers in the drive wafers. The detecting method of claim 7, wherein sequentially providing the control signal to the single driving chip or the plurality of driving chips in the driving chips during a plurality of different time periods comprises: disconnecting at the different time periods And a transmission path of the control signal of the driving chip that does not receive the control signal in the driving chip. The detecting method according to any one of claims 6 to 8, further comprising the step of selectively turning on or off a transmission path between the driving chips. The method of claim 6, wherein the providing the control signal to the driver chips causes each of the driver chips to generate the feedback signal according to the control signal comprises: providing the control signal to the driver chips Each of the driving chips is operated according to the control signal, and the feedback signal is a voltage across a resistor between the driving chip and a voltage source when the driving chips are operated.