Summary of the invention
The object of the present invention is to provide a kind of source electrode driver of Thin Film Transistor-LCD of built-in detecting circuit, and the number of the wiring volume of total input pin of solution test machine and test module increases, and makes test machine integral body build and puts the problem that volume increases.
Another object of the present invention is to provide a kind of source electrode driver of Thin Film Transistor-LCD of built-in detecting circuit, and can reach the measurement of high precision, solve the expensive problem of test machine simultaneously.
For reaching above-mentioned purpose, the invention provides a kind of source electrode driver of Thin Film Transistor-LCD of built-in detecting circuit, it comprises N driver element and P test cell.Each driver element is to receive a numerical data respectively, and produces the analog output signal of a correspondence according to this numerical data.And each test cell is the output that receives M driver element, and selects signal to select the output signal of one of them driver element as test signal according to one.When the voltage of this test signal was higher than a high reference voltage or be lower than a low reference voltage, the unusual status signal of test cell output representative was given test machine.
Wherein, test cell more comprises a multiplexer, one first comparer, one second comparer and a judging unit.Multiplexer is the output signal that receives M driver element, and exports the output signal of one of them driver element as test signal according to aforementioned selection signal.First comparer is acceptance test signal and high reference voltage, and compare test signal and high reference voltage height, and the result is passed to judging unit by one first comparison signal.Second comparer is acceptance test signal and low reference voltage, and compare test signal and low reference voltage height, and the result is passed to judging unit by one second comparison signal.Judging unit, be to receive aforementioned first comparison signal and aforementioned second comparison signal, when test event signal is higher or lower than low reference voltage than high reference voltage, first comparer or second comparer will inform that the judging unit test signal has unusually, and judging unit will be exported the unusual state output signal of representative to test machine.When test event signal is lower and higher than low reference voltage than high reference voltage, judging unit will be exported the normal state output signal of representative and give test machine.Test machine can learn whether test signal satisfies the requirement of specification (Spec) after the output that receives judging unit.
The present invention provides a kind of method of testing of source electrode driver of Thin Film Transistor-LCD in addition, and this source electrode driver is to receive N numerical data and produce N analog output signal, and this method of testing is to comprise the following step: the initial value G that sets the GTG value; The numerical data on input GTG value G rank; Producing reference voltage, is high reference voltage and the low reference voltage that produces corresponding to aforementioned GTG value G rank; Produce one and select signal, this selection signal selects an analog output signal as test signal; Comparison step is whether the voltage of comparison of aforementioned test signal is lower than aforementioned high reference voltage and is higher than aforementioned low reference voltage; When the voltage of aforementioned test signal is higher than aforementioned high reference voltage or be lower than aforementioned low reference voltage,, and finish test with a bad alarm signal activation; When the voltage of aforementioned test signal is not higher than aforementioned high reference voltage and be not lower than aforementioned low reference voltage, then change aforementioned selection signal and select another analog output signal as test signal, and the aforementioned comparison step of rebound; All tested when all analog output signals and to have finished, then changed GTG value G, and the aforementioned generation reference voltage of rebound step; All tested when all GTG values and to have finished, then finished.
The present invention also provides a kind of method of testing of source electrode driver of Thin Film Transistor-LCD, and this source electrode driver is to receive N numerical data and produce N analog output signal, is to comprise the following step: the initial value G that sets the GTG value; The numerical data on input GTG value G rank; Producing high reference voltage, is the high reference voltage that produces corresponding to aforementioned GTG value G rank; Produce one and select signal, this selection signal selects an analog output signal as test signal; First comparison step is whether the voltage of comparison of aforementioned test signal is higher than aforementioned high reference voltage; When the voltage of aforementioned test signal is higher than aforementioned high reference voltage,, and finish test with a bad alarm signal activation; Producing low reference voltage, is the low reference voltage that produces corresponding to aforementioned GTG value G rank; Second comparison step is whether the voltage of comparison of aforementioned test signal is lower than aforementioned low reference voltage; When the voltage of aforementioned test signal is lower than aforementioned low reference voltage,, and finish test with a bad alarm signal activation; When the voltage of aforementioned test signal was not higher than aforementioned high reference voltage and be not lower than aforementioned low reference voltage, then the aforementioned generation of rebound was high with reference to voltage steps, and changed aforementioned selection signal and select another analog output signal as test signal; All tested when all analog output signals and to have finished, then change GTG value G, and the aforementioned high reference voltage of rebound has produced step; All tested when all GTG values and to have finished, then finished.
The source electrode driver of the Thin Film Transistor-LCD of built-in detecting circuit of the present invention by being built in the test cell in the source electrode driver, makes M input pin of test cell, can utilize the mode of P.e.c. to be provided with.Thereby reduced known test module and increased a large amount of wiring volumes accounted for because of the number M of input pin.And, can roll up the number M of input pin, and only need occupy a little volume, and can reduce the number P of test cell, to satisfy the condition of P*M 〉=N because the input pin utilizes the mode of P.e.c. to be provided with.
Therefore, solve building of test machine and put the problem that volume increases.
Use because of the collocation that utilizes first comparer, second comparer and judging unit again, and analyze the requirement whether this test signal satisfies specification (spec), thereby replaced expensive test machine, reach the effect that reduces cost.
Embodiment
Describe the source electrode driver of the Thin Film Transistor-LCD of built-in detecting circuit of the present invention in detail below with reference to Figure of description, and components identical will be with identical symbology.
Fig. 3 A shows the test structure of the source electrode driver integral body of the Thin Film Transistor-LCD that uses built-in detecting circuit of the present invention.This test structure comprises N driver element 11, a P test cell 31 and a test machine 33.N driver element 11 receives a numerical data respectively, and produces an analog output signal S (1)~S (N) respectively according to this numerical data.Each test cell 31 receives the output signal of M driver element, and selects one of them output signal as test signal according to a selection signal, and exports a status signal.When this test signal was higher than a high reference voltage Vmax (G) or be lower than a low reference voltage Vmin (G), the status signal of test cell 31 was an error condition.Last test machine 33 only needs to export a test signal according to the state of each status signal, represents corresponding to the driver element of this test signal up to specification.The control signal of test machine 33 comprise select signal, the low reference voltage Vmin (G) of high reference voltage Vmax (G), with the stage control signal.The action of driver element 11 and framework, identical with the driver element 11 of Fig. 1, no longer repeat specification.
Fig. 3 B shows first embodiment of test cell of the Thin Film Transistor-LCD of a kind of built-in detecting circuit of the present invention.Test cell 31 comprises a multiplexer 311, one first comparer 312, one second comparer 313 and a judging unit 314.This multiplexer 311 receives output signal S (the 1)~S (m) of M driver element, and according to selecting signal to export output signal S (the 1)~S (m) of one of them driver element, as a test signal.First comparer 312 is the acceptance test signal and the first reference voltage signal Vref_1, and the output first comparison signal Comp_1 behind the magnitude of voltage of the compare test signal and the first reference voltage signal Vref_1.The magnitude of voltage of the first reference voltage signal Vref_1 is defined as high reference voltage Vmax (G).Second comparer 313 is the acceptance test signal and the second reference voltage signal Vref_2, and the output second comparison signal Comp_2 behind the magnitude of voltage of the compare test signal and the second reference voltage signal Vref_2.The magnitude of voltage of the second reference voltage signal Vref_2 is defined as low reference voltage Vmin (G).Judging unit 314 is to receive the first comparison signal Comp_1 and the second comparison signal Comp_2, and produces status signal according to its state.When the high reference voltage Vmax of the voltage ratio of test event signal (G) was high, then the first comparison signal Comp_1 was H, otherwise the first comparison signal Comp_1 is L.When the low reference voltage Vmin (G) of the voltage ratio of test event signal was low, the second comparison signal Comp-_2 was L, otherwise the second comparison signal Comp_2 is H.Therefore, be that the H or the second comparison signal Comp_2 are L as long as judging unit 314 detects the first comparison signal Comp_1, then will represent the status signal of abnormality to give test machine 33.Therefore, test machine 33 can receive the status signal of being exported by judging unit 314, so as to judging the scope whether this test signal exceeds high reference voltage Vmax (G) and low reference voltage Vmin (G), and learn whether this test signal satisfies the requirement of specification (spec).That is, when the signal of being exported when judging unit 314 is the status signal of representative abnormality, represent that the pairing driver element of this test signal 11 is bad.
Fig. 4 shows a kind of embodiment of judging unit.This judging unit 314 is to receive the first comparison signal Comp_1 and the second comparison signal Comp_2, and produces status signal.This judging unit 314 comprises a NOT door 41 and a NAND door 42.The input end of NOT door 41 receives the first comparison signal Comp_1, and its output terminal is connected to an input end of NAND door 42.Another input end of NAND door 42 receives the second comparison signal Comp_2.Therefore, if the first comparison signal Comp_1 is the L and the second comparison signal Comp_2 when being H, NAND door 42 is output as H.And when the first comparison signal Comp_1 be the H or the second comparison signal Comp_2 when being L, the status signal that NAND door 42 is exported is L, represents abnormality.
Fig. 5 shows another embodiment of judging unit.Judging unit 314 comprises one the one NOT door 51, a NOR door 52 and one the 2nd NOT door 53.The input end of the one NOT door 51 receives the second comparison signal Comp_2, and its output terminal is connected to an input end of NOR door 52.Another input end of NOR door 52 receives the first comparison signal Com_1, and its output terminal is connected to the input end of the 2nd NOT door 53.Therefore, in this embodiment so long as the first comparison signal Com_1 is that the H or the second comparison signal Comp_2 are L, then the status signal exported of judging unit 314 is L, represents abnormality.
Must attention person, the number M of the analog output signal that the number P of test cell 31, multiplexer 311 receive, with the number N of driver element 11, must satisfy the condition of P*M 〉=N.
In the present embodiment, because only need utilize the collocation utilization of one first comparer 312, one second comparer 313 and a judging unit 314, can analyze the requirement of whether satisfying specification (spec) corresponding to the driver element of this test signal, and the test machine of the costliness of replacement known techniques, so this case has reached the effect that reduces cost.
Fig. 6 shows the method for testing of the source electrode driver of a kind of Thin Film Transistor-LCD of the present invention.Source electrode driver 30 receives N numerical data, and behind over-drive unit and test cell, the unusual or normal status signal of output representative is given test machine.This method of testing comprises the following step:
Step S602: beginning.
Step S604: the initial value G=0 that sets the GTG value.The resolution of GTG value can be decided by the bit number of numerical data, the numerical data of 10 bits for example, and its GTG value is 0~1023.
Step S606: the numerical data on input GTG value G rank.That is the numerical data on input GTG value G rank is to all driver elements 11.
Step S608: the high reference voltage Vmax (G) and low reference voltage Vmin (G) that produce GTG value G rank.Described high reference voltage and low reference voltage can be produced by test machine 33.
Step S610: produce one and select signal.This selection signal selects an analog output signal as test signal.Because each test cell is to receive M analog output signal, and each time point only can detect an analog output signal, so selects one of them analog output signal as test signal by this selection signal.This selects signal to be produced by test machine 33.
Step S612: whether the compare test signal is lower than high reference voltage Vmax (G) and is higher than low reference voltage Vmin (G).
Step S614: when test signal is higher than high reference voltage Vma x (G) or is lower than reference voltage Vmin (G), represent that test signal is bad and skip to step S622.And when test signal was lower than high reference voltage Vmax (G) and be higher than low reference voltage Vmin (G), the expression test signal was up to specification and skip to step S616.
Step S616: judge whether all analog output signals were all tested, if not, rebound S610 then.And all test when finishing when all analog output signals, then skip to step S618.
Step S618: judge that whether all GTG values all tested, if not, then skipped to S620.And all test when finishing when all GTG values, then skip to step S624.
Step S620: change GTG value G, and rebound step S606.For example, GTG value G is added 1 at every turn.
Step S622:, and skip to step S624 with a bad alarm signal activation.
Step S624: finish test.
Fig. 7 shows second embodiment of test cell of the Thin Film Transistor-LCD of a kind of built-in detecting circuit of the present invention.The framework of the test cell 31 of this test cell 71 and first embodiment is roughly the same, all comprise multiplexer, comparer and judging unit, its difference is that test cell 71 only comprises a comparer 712, and the mode of its comparison signal is divided into one first comparison phase and one second comparison phase.
When first comparison phase, a test signal and a reference voltage signal Vref that comparer 712 receives by multiplexer 711 outputs, this moment, the voltage of reference voltage signal Vref was high reference voltage Vmax (G), and the voltage of compare test voltage of signals and high reference voltage Vmax (G), the result is passed to judging unit 714 by a comparison signal Comp.When this test signal is not higher than high reference voltage Vmax (G), enter second comparison phase.When second comparison phase, reference voltage signal Vref is low reference voltage Vmin (G), and the voltage of compare test voltage of signals and low reference voltage Vmin (G) passes to judging unit 714 with the result by comparison signal Comp at this moment.Judging unit 714 is to learn that according to a stage control signal current stage is first comparison phase or second comparison phase, and the stage control signal can be provided by test machine 33.Therefore present embodiment can reduce the volume of source electrode driver, and reach the effect of dwindling source electrode driver by the number that reduces comparer, but its shortcoming is for being divided into two stage tests.
Moreover Fig. 8 A and Fig. 8 B show the method for testing of the source electrode driver of the test cell 71 that uses Fig. 7.Source electrode driver receives N numerical data, and behind over-drive unit and test cell, the unusual or normal status signal of output representative is given test machine.This method of testing comprises the following step:
Step S802: beginning.
Step S804: the initial value G=0 that sets the GTG value.The resolution of GTG value can be decided by the bit number of numerical data, the numerical data of 10 bits for example, and its GTG value is 0~1023.
Step S806: the numerical data on input GTG value G rank.That is the numerical data on input GTG value G rank is to all driver elements 11.
Step S808: producing high reference voltage, is the high reference voltage that produces GTG value G rank.This high reference voltage can be produced by test machine 33.
Step S810: produce one and select signal, it selects an analog output signal as test signal.This selects signal to be produced by test machine 33.
Step S812: for height with reference to voltage ratio than the stage, be whether the compare test signal is lower than high reference voltage.
Step S814: when test signal is higher than high reference voltage Vmax (G), represent badly, skip to step S826 corresponding to the driver element of this test signal.And when test signal is lower than high reference voltage Vma x (G), skip to step S816.
Step S816: producing low reference voltage, is the low reference voltage Vmin (G) that produces GTG value G rank.Should can produce by test machine 33 by low reference voltage.
Step S818: low reference voltage comparison phase is whether the compare test signal is higher than low reference voltage Vmin (G).
Step S820: when aforementioned test signal is lower than reference voltage Vmin (G), represent badly, skip to step S826 corresponding to the driver element of this test signal.And when aforementioned test signal is higher than low reference voltage Vmin (G), skip to step S822.
Step S822: judge whether all analog output signals were all tested, if not, rebound S808 then.And all test when finishing when all analog output signals, then skip to step S824.
Step S824: judge that whether all GTG values all tested, if not, then skipped to S828.And all test when finishing when all GTG values, then skip to step S830.
Step S826:, and skip to S830 end test with a bad alarm signal activation.
Step S828: change GTG value G, and rebound step S806.For example, GTG value G is added 1 at every turn.
Step S830: finish test.
Though more than with embodiment the present invention is described, but therefore do not limit scope of the present invention, only otherwise break away from main idea of the present invention, the sector person can carry out various distortion or change, for example the outlet line of a plurality of judging units can be connected,, and this group outlet line directly is pushed into pin (PAD) as 8 one group, or shift pin again onto through after some logical operations again, to reduce the number of pin.