TW201505812A - Second mold to which irregular first mold pattern has been transferred, second mold manufacturing method, method for manufacturing article using second mold, optical panel manufacturing method and optical element manufacturing method - Google Patents

Second mold to which irregular first mold pattern has been transferred, second mold manufacturing method, method for manufacturing article using second mold, optical panel manufacturing method and optical element manufacturing method Download PDF

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TW201505812A
TW201505812A TW103125142A TW103125142A TW201505812A TW 201505812 A TW201505812 A TW 201505812A TW 103125142 A TW103125142 A TW 103125142A TW 103125142 A TW103125142 A TW 103125142A TW 201505812 A TW201505812 A TW 201505812A
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Taiwan
Prior art keywords
mold
substrate
manufacturing
base material
transferred
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TW103125142A
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Chinese (zh)
Inventor
Kenta Sekikawa
Hiroshi Sakamoto
Kenichi Ebata
Yuriko Kaida
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Asahi Glass Co Ltd
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Publication of TW201505812A publication Critical patent/TW201505812A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11Anti-reflection coatings
    • G02B1/118Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023Microembossing

Abstract

A second mold to which an irregular first mold pattern has been transferred, wherein: the second mold has a substrate and an irregular layer, which is formed on the substrate and on which the irregular first mold pattern has been transferred; and the substrate comprises sheet glass.

Description

轉印有第1模之凹凸圖案之第2模、第2模之製造方法、使用第2模之物品之製造方法、光學面板之製造方法、及光學元件之製造方法 Second mold for transferring the concave-convex pattern of the first mold, method for producing the second mold, method for producing the article using the second mold, method for producing an optical panel, and method for producing an optical element 發明領域 Field of invention

本發明是有關於轉印有第1模之凹凸圖案之第2模、第2模之製造方法、使用第2模之物品之製造方法、光學面板之製造方法、及光學元件之製造方法。 The present invention relates to a second mold for transferring a concave-convex pattern of a first mold, a method for producing the second mold, a method for producing an article using the second mold, a method for producing an optical panel, and a method for producing an optical element.

發明背景 Background of the invention

壓印法是一種在模具與基材之間夾著成形材料,在基材上形成轉印有模具之凹凸圖案的凹凸層的方法(例如參照專利文獻1)。模具可以是將第1模之凹凸圖案以壓印法所轉印的第2模。可以減少第1模的使用頻率。由於第2模是以壓印法來製造,所以具有基材及形成於該基材上的凹凸層。此凹凸層之凹凸圖案,是把第1模之凹凸圖案反轉過來的圖案。 The imprint method is a method in which a molding material is interposed between a mold and a substrate, and a concavo-convex layer in which a concavo-convex pattern of a mold is transferred is formed on the substrate (see, for example, Patent Document 1). The mold may be a second mold that transfers the concave-convex pattern of the first mold by an imprint method. It is possible to reduce the frequency of use of the first mode. Since the second mold is produced by an imprint method, it has a base material and an uneven layer formed on the base material. The uneven pattern of the uneven layer is a pattern in which the concave-convex pattern of the first mold is reversed.

先前技術文獻 Prior technical literature 專利文獻 Patent literature

專利文獻1:日本特開2007-313880號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2007-313880

發明概要 Summary of invention

至今,第2模的基材,是使用可撓性優異的樹脂片。因此,當溫度變化時,樹脂片的尺寸變化很大,形成在樹脂片上的凹凸層之凹凸圖案的尺寸變化也會很大。 Heretofore, the base material of the second mold is a resin sheet excellent in flexibility. Therefore, when the temperature changes, the size of the resin sheet varies greatly, and the dimensional change of the concave-convex pattern of the uneven layer formed on the resin sheet is also large.

本發明是有鑑於上述課題而做成的,主要的目的在於:提供一種可減少隨著溫度變化而產生的凹凸圖案之尺寸變化的第2模。 The present invention has been made in view of the above problems, and a main object thereof is to provide a second mold which can reduce dimensional changes of a concavo-convex pattern which changes with temperature.

為了解決上述課題,根據本發明之一態樣,可提供一種第2模,是轉印有第1模之凹凸圖案的第2模,其具有:基材、及形成於該基材上且轉印有前述第1模之凹凸圖案的凹凸層,又,前述基材包含有薄板玻璃。 In order to solve the above problems, according to an aspect of the present invention, a second mold which is a second mold to which a concave-convex pattern of a first mold is transferred, which has a base material and is formed on the base material, can be provided. The uneven layer of the concave-convex pattern of the first mold is printed, and the base material includes a thin plate glass.

根據本發明之一態樣,可提供一種可將隨著溫度變化而產生的凹凸圖案之尺寸變化減少的第2模。 According to an aspect of the present invention, it is possible to provide a second mold which can reduce a dimensional change of a concavo-convex pattern which changes with temperature.

10‧‧‧第1模 10‧‧‧1st model

12‧‧‧旋轉輥 12‧‧‧Rotating roller

14‧‧‧旋轉輥 14‧‧‧Rotating roller

20‧‧‧第2模 20‧‧‧2nd mode

21‧‧‧基材 21‧‧‧Substrate

22‧‧‧成形材料 22‧‧‧Forming materials

23‧‧‧凹凸層 23‧‧‧Uneven layer

30‧‧‧物品(光學構件) 30‧‧‧ Items (optical components)

31‧‧‧基材 31‧‧‧Substrate

32‧‧‧成形材料 32‧‧‧Forming materials

33‧‧‧凹凸層 33‧‧‧Concave layer

40‧‧‧積層面板 40‧‧‧Laminated panels

41‧‧‧濾光片基板 41‧‧‧Filter substrate

42‧‧‧液晶層 42‧‧‧Liquid layer

43‧‧‧陣列基板 43‧‧‧Array substrate

50‧‧‧光學面板 50‧‧‧Optical panel

52‧‧‧接著層 52‧‧‧Next layer

圖1(a)~(d)是顯示本發明一實施形態之第2模之製造方法的截面圖。 1(a) to 1(d) are cross-sectional views showing a method of manufacturing a second mold according to an embodiment of the present invention.

圖2(a)~(d)是顯示本發明一實施形態之使用第2模之物品之製造方法的截面圖。 2(a) to 2(d) are cross-sectional views showing a method of manufacturing an article using the second mold according to an embodiment of the present invention.

圖3(a)~(c)是顯示本發明一實施形態之光學面板之製造方法的截面圖。 3(a) to 3(c) are cross-sectional views showing a method of manufacturing an optical panel according to an embodiment of the present invention.

用以實施發明之形態 Form for implementing the invention

以下,參照圖式來說明用以實施本發明之形態。在各圖式中,對於同樣的或相對應的構成,附加同樣的或相對應的符號,並省略說明。 Hereinafter, embodiments for carrying out the invention will be described with reference to the drawings. In the drawings, the same or corresponding symbols are attached to the same or corresponding components, and the description is omitted.

圖1是顯示本發明一實施形態之第2模之製造方法的截面圖。第2模20是轉印有第1模10之凹凸圖案的模。第1模10可被稱為母模,而第2模20也可被稱為子模。第2模20之製造方法具備有:準備第1模10的步驟(圖1(a))、塗布步驟(圖1(b))、轉印步驟(圖1(c))、及分離步驟(圖1(d))。另外,準備第1模10的步驟、與塗布步驟,哪個步驟先進行皆可,也可同時進行。 Fig. 1 is a cross-sectional view showing a method of manufacturing a second mold according to an embodiment of the present invention. The second mold 20 is a mold to which the uneven pattern of the first mold 10 is transferred. The first mold 10 can be referred to as a master mold, and the second mold 20 can also be referred to as a child mold. The manufacturing method of the second mold 20 includes a step of preparing the first mold 10 (Fig. 1 (a)), a coating step (Fig. 1 (b)), a transfer step (Fig. 1 (c)), and a separation step ( Figure 1 (d)). Further, the steps of preparing the first mold 10 and the coating step may be performed at the same time or at the same time.

第1模10於表面具有凹凸圖案。第1模10例如由矽、二氧化矽膜、石英玻璃、樹脂、金屬等所形成。第1模10例如以光刻法、電子束蝕刻法等來製作。 The first mold 10 has a concave-convex pattern on the surface. The first mold 10 is formed of, for example, tantalum, a hafnium oxide film, quartz glass, a resin, a metal, or the like. The first mold 10 is produced by, for example, photolithography, electron beam etching, or the like.

另外,本實施形態之第1模10是以光刻法、電子束蝕刻法等來製作,但也可根據以光刻法、電子束蝕刻法等所製作的原型而以壓印法或電鑄法來進行製作。 Further, although the first mold 10 of the present embodiment is produced by photolithography, electron beam etching, or the like, it may be embossed or electroformed according to a prototype produced by photolithography, electron beam etching, or the like. Law to make.

第1模10可如圖1所示般為板狀,也可為環帶狀。環帶狀的模具是將板狀的模具的兩端部熔接而成。環帶狀的模具適合連續生產。 The first mold 10 may have a plate shape as shown in FIG. 1 or may have a ring shape. The endless belt mold is obtained by welding both end portions of a plate-shaped mold. The belt-shaped mold is suitable for continuous production.

為了提高第1模10在分離步驟(圖1(d))中的脫模 性,可以在表面施以脫模處理。脫模處理可列舉例如:氟塗料處理、矽塗料處理等。 In order to improve the demolding of the first mold 10 in the separation step (Fig. 1 (d)) Sex, can be applied to the surface of the mold release treatment. The mold release treatment may, for example, be a fluorine coating treatment or a enamel coating treatment.

在塗布步驟中,於基材21上塗布液狀的成形材料22。另外,也可在塗布步驟中,於第1模10上塗布成形材料22。成形材料22不管是塗布在第1模10及基材21中的哪一者,都會在轉印步驟中被夾在第1模10與基材21之間。 In the coating step, a liquid molding material 22 is applied onto the substrate 21. Further, the molding material 22 may be applied to the first mold 10 in the coating step. The molding material 22 is sandwiched between the first mold 10 and the substrate 21 in the transfer step, regardless of which of the first mold 10 and the substrate 21 is applied.

基材21可以是施有可提高基材21與成形材料22間之緊密接著度的表面處理的基材。表面處理可列舉如:底漆處理、臭氧處理、電漿蝕刻處理等。底漆可使用:矽烷耦合劑、矽氮烷等。 The substrate 21 may be a substrate to which a surface treatment for improving the adhesion between the substrate 21 and the molding material 22 is applied. The surface treatment may, for example, be a primer treatment, an ozone treatment, a plasma etching treatment, or the like. The primer can be used: decane coupling agent, decazane, and the like.

成形材料22之塗布方法可為一般的塗布方法,可列舉例如:壓鑄模塗料法、輥塗法、凹版塗布法、噴墨印刷法、噴塗法、旋轉塗布法、淋塗法、刮刀塗布法、浸漬塗布法等。 The coating method of the molding material 22 may be a general coating method, and examples thereof include a die-casting coating method, a roll coating method, a gravure coating method, an inkjet printing method, a spray coating method, a spin coating method, a shower coating method, and a knife coating method. Dip coating method and the like.

在轉印步驟中,在第1模10與基材21之間夾著成形材料22,於基材21上形成轉印有第1模10之凹凸圖案的凹凸層23。凹凸層23是在以第1模10與基材21夾著成形材料22的狀態下使成形材料22固化者。在此,固化包含硬化。 In the transfer step, the molding material 22 is interposed between the first mold 10 and the substrate 21, and the uneven layer 23 on which the uneven pattern of the first mold 10 is transferred is formed on the substrate 21. In the uneven layer 23, the molding material 22 is cured in a state in which the molding material 22 is interposed between the first mold 10 and the substrate 21 . Here, the curing comprises hardening.

因應壓印法之種類來選定成形材料22。壓印法之種類,有光壓印法、熱壓印法等。 The forming material 22 is selected in accordance with the type of the imprint method. The types of imprinting methods include photo imprinting and hot imprinting.

光壓印法是利用光硬化反應的方法。在光壓印法的情況下,成形材料22包含光聚合性化合物,因應需要而更包含有光聚合起始劑。光聚合性化合物可列舉如:於分子中具有自由基聚合鍵(例如碳-碳不飽和雙鍵)及/或陽 離子聚合鍵的單體、寡聚物、反應性聚合物等。成形材料22也可更包含有未反應性之聚合物、溶劑等。 Photoimprinting is a method of utilizing a photohardening reaction. In the case of the photoimprint method, the molding material 22 contains a photopolymerizable compound, and further contains a photopolymerization initiator as needed. The photopolymerizable compound may, for example, have a radical polymerization bond (for example, a carbon-carbon unsaturated double bond) and/or a cation in the molecule. A monomer, an oligomer, a reactive polymer or the like of an ionomer bond. The molding material 22 may further contain an unreacted polymer, a solvent, or the like.

在光壓印法的情況下,成形材料22是準備為液狀的狀態,例如圖1(b)所示般塗布在基材21上。 In the case of the photoimprint method, the molding material 22 is prepared in a liquid state, and is applied onto the substrate 21 as shown in, for example, FIG. 1(b).

在光壓印法的情況下,藉由把光照射於成形材料22,來使成形材料22硬化。使用於使成形材料22硬化的光,可列舉例如:紫外線光、可見光、紅外線光等。 In the case of the photoimprint method, the molding material 22 is cured by irradiating light onto the molding material 22. Examples of the light used to cure the molding material 22 include ultraviolet light, visible light, infrared light, and the like.

在光壓印法的情況下,夾著成形材料22的第1模10及基材21中之至少一方是由透光性材料所構成。從光源射出的光,例如可透過透明的第1模10而照射至成形材料22,也可以是透過透明的基材21而照射至成形材料22。只要基材21與第1模10中至少一方為透明的,即可適用光壓印。 In the case of the photoimprint method, at least one of the first mold 10 and the base material 21 sandwiching the molding material 22 is made of a light transmissive material. The light emitted from the light source may be irradiated to the molding material 22 through the transparent first mold 10, for example, or may be irradiated to the molding material 22 through the transparent substrate 21. As long as at least one of the substrate 21 and the first mold 10 is transparent, photoimprinting can be applied.

光壓印法能以室溫來將成形材料22硬化。因此,不容易產生因第1模10與基材21間的線膨脹係數差所導致的應變,轉印精度良好。另外,為了促進硬化反應,也可將成形材料22加熱。 The photoimprint method can harden the molding material 22 at room temperature. Therefore, the strain due to the difference in linear expansion coefficient between the first mold 10 and the base material 21 is less likely to occur, and the transfer accuracy is good. Further, in order to promote the hardening reaction, the molding material 22 may be heated.

熱壓印法可大致區分為:利用熱硬化反應的熱壓印法、以及利用材料之熱可塑性的熱壓印法。 The hot stamping method can be roughly classified into a hot stamping method using a heat hardening reaction and a hot stamping method using a thermoplasticity of a material.

在利用熱硬化反應的情況下,成形材料22包含熱聚合性化合物,因應需要而更包含有熱聚合起始劑。熱聚合性化合物可列舉如:在分子中具有自由基聚合鍵(例如碳-碳不飽和雙鍵)及/或陽離子聚合鍵的單體、寡聚物、反應性聚合物等。成形材料22也可更包含有未反應性之聚合 物、溶劑等。 In the case of utilizing a thermosetting reaction, the molding material 22 contains a thermally polymerizable compound, and further contains a thermal polymerization initiator as needed. Examples of the thermally polymerizable compound include a monomer having a radical polymerization bond (for example, a carbon-carbon unsaturated double bond) and/or a cationic polymerization bond in a molecule, an oligomer, a reactive polymer, and the like. The forming material 22 may also further contain unreactive polymerization. Things, solvents, etc.

在利用熱硬化反應的情況下,成形材料22是準備為液狀的狀態,例如圖1(b)所示般塗布在基材21上。 In the case of utilizing the thermosetting reaction, the molding material 22 is in a liquid state, and is applied to the substrate 21 as shown in, for example, FIG. 1(b).

在利用熱硬化反應的情況下,藉由將成形材料22加熱,來使成形材料22硬化。將成形材料22加熱的加熱源,可使用:照射加熱光的光源(例如鹵素燈、雷射)、電熱器等。電熱器只要可將成形材料22加熱即可,也可隔著第1模10及基材21中的任一者來將成形材料22加熱。 In the case of utilizing the thermosetting reaction, the molding material 22 is cured by heating the molding material 22. As the heating source for heating the molding material 22, a light source (for example, a halogen lamp or a laser) that irradiates the heating light, an electric heater, or the like can be used. The electric heating device may heat the molding material 22, or may heat the molding material 22 via any of the first mold 10 and the base material 21.

另一方面,在利用材料之熱可塑性的情況下,成形材料22包含有熱可塑性樹脂。熱可塑性樹脂是準備為溶液的形態,塗布於基材21上而進行乾燥。另外,熱可塑性樹脂也可在加熱軟化後,塗布於基材21上而進行冷卻。又,熱可塑性樹脂也可準備成片狀的形態而貼附於基材21上。 On the other hand, in the case of utilizing the thermoplasticity of the material, the molding material 22 contains a thermoplastic resin. The thermoplastic resin is prepared in the form of a solution, and is applied onto the substrate 21 to be dried. Further, the thermoplastic resin may be applied to the substrate 21 to be cooled after being softened by heating. Further, the thermoplastic resin may be prepared in a sheet form and attached to the substrate 21.

在利用材料之熱可塑性的情況下,將第1模10之凹凸圖案轉印在藉由加熱而軟化的成形材料22。成形材料22隨著溫度變低而固化。加熱成形材料22的加熱源,可使用:照射加熱光的光源(例如鹵素燈、雷射)、電熱器等。成形材料22的加熱溫度,為熱可塑性樹脂之玻璃轉移溫度以上。 When the thermal plasticity of the material is utilized, the uneven pattern of the first mold 10 is transferred to the molding material 22 which is softened by heating. The forming material 22 solidifies as the temperature becomes lower. As the heating source for heating the molding material 22, a light source (for example, a halogen lamp or a laser) that irradiates heating light, an electric heater, or the like can be used. The heating temperature of the molding material 22 is equal to or higher than the glass transition temperature of the thermoplastic resin.

在轉印步驟中,例如可以一面使基材21之一部分彎曲、一面隔著成形材料22來使基材21與第1模10慢慢地接觸。空氣容易從第1模10與基材21之間跑出去,可抑制空氣的含入,而可提升轉印精度。為了防止含入空氣,可以在減壓氣體環境下進行轉印步驟。 In the transfer step, for example, one of the base materials 21 can be partially bent, and the base material 21 can be brought into contact with the first mold 10 with the molding material 22 interposed therebetween. Air easily escapes from between the first mold 10 and the substrate 21, and the inclusion of air can be suppressed, and the transfer accuracy can be improved. In order to prevent the inclusion of air, the transfer step can be carried out under a reduced pressure atmosphere.

在轉印步驟中,當基材21的一部分被彎曲時,宜平坦地支持住第1模10。適合用於第1模10比起基材21為較不易彎曲的情況。又,在想要抑制第1模10損傷時也很有效。 In the transfer step, when a part of the substrate 21 is bent, the first mold 10 is preferably supported flat. It is suitable for the case where the first mold 10 is less likely to be bent than the base material 21. Moreover, it is also effective when it is intended to suppress damage of the first mold 10.

在轉印步驟中,基材21的一部分,會沿著作為將基材21壓接於成形材料22之壓接構件的旋轉輥12而彎曲。在此狀態下,旋轉輥12與第1模10相對地移動,藉此,第1模10與基材21會隔著成形材料22慢慢地接觸。 In the transfer step, a part of the substrate 21 is bent along the rotating roll 12 which is a pressure-bonding member that presses the base material 21 against the molding material 22. In this state, the rotating roller 12 moves relative to the first die 10, whereby the first die 10 and the base material 21 are slowly brought into contact with each other via the molding material 22.

在轉印步驟中,藉著對基材21施加張力,使基材21的一部分攀附著旋轉輥12,沿著旋轉輥12而彎曲。基材21的彎曲部分之曲率半徑容易為一定,而加在基材21的應力也容易為一定。 In the transfer step, a part of the substrate 21 is caused to adhere to the rotating roller 12 by applying tension to the substrate 21, and is bent along the rotating roller 12. The radius of curvature of the curved portion of the base material 21 is easily constant, and the stress applied to the base material 21 is also likely to be constant.

分離步驟是將第1模10與凹凸層23分離。在分離步驟中,例如可以一面使形成有凹凸層23的基材21之一部分彎曲、一面使凹凸層23與第1模10慢慢地分離。分離所需要的力較弱,可以抑制第1模10的破損或凹凸層23的破損。 The separation step separates the first mold 10 from the uneven layer 23. In the separation step, for example, the concave-convex layer 23 and the first mold 10 can be gradually separated while partially bending one of the base materials 21 on which the uneven layer 23 is formed. The force required for the separation is weak, and the damage of the first mold 10 or the breakage of the uneven layer 23 can be suppressed.

在分離步驟中,當基材21的一部分彎曲時,宜平坦地支持住第1模10。適合用於第1模10比起基材21為較不易彎曲的情況。又,在想要抑制第1模10損傷時也很有效。 In the separating step, when a part of the substrate 21 is bent, the first mold 10 is preferably supported flat. It is suitable for the case where the first mold 10 is less likely to be bent than the base material 21. Moreover, it is also effective when it is intended to suppress damage of the first mold 10.

在分離步驟中,基材21的一部分,會沿著作為將基材21壓接於凹凸層23之壓接構件的旋轉輥12而彎曲。在此狀態下,旋轉輥12與第1模10相對地移動,藉此,凹凸層23與第1模10會慢慢地分離。 In the separation step, a part of the substrate 21 is bent along the rotating roll 12 which is a pressure-bonding member that presses the base material 21 against the uneven layer 23. In this state, the rotating roller 12 moves relative to the first die 10, whereby the uneven layer 23 and the first die 10 are gradually separated.

在分離步驟中,藉著對基材21施加張力,使基材21的一部分攀附著旋轉輥12,沿著旋轉輥12而彎曲。基材21 的彎曲部分之曲率半徑容易為一定,而加在基材21的應力也容易為一定。 In the separation step, a part of the substrate 21 is caused to adhere to the rotating roller 12 by applying tension to the substrate 21, and is bent along the rotating roller 12. Substrate 21 The radius of curvature of the curved portion is easily fixed, and the stress applied to the substrate 21 is also easily fixed.

如此一來,可得到具有基材21、及形成於基材21 上之凹凸層23的第2模20。凹凸層23的凹凸圖案,是第1模10的凹凸圖案反轉過來的圖案。 In this way, the substrate 21 can be obtained and formed on the substrate 21 The second mold 20 of the upper uneven layer 23 is formed. The uneven pattern of the uneven layer 23 is a pattern in which the uneven pattern of the first mold 10 is reversed.

此外,在製造第2模20時,有時基材21的溫度會 變化。例如,在把熱壓印法使用於製造第2模20時,因為進行熱處理,基材21的溫度會上升或下降。又,在把光壓印法使用於製造第2模20時,因為用來促進光硬化反應的熱處理,基材21的溫度會上升或下降。又,在光壓印法中,有時因為進行光照射,基材21的溫度會上升。像這樣,若基材21的溫度變化,則基材21的尺寸也會變化。在基材21的溫度變化為相同時,基材21的大小越大,基材21的尺寸變化會越大。基材21的尺寸變化,與形成在基材21上的凹凸層23之尺寸變化有關。 Further, when the second mold 20 is manufactured, the temperature of the substrate 21 may be Variety. For example, when the hot stamping method is used to manufacture the second mold 20, the temperature of the substrate 21 rises or falls because heat treatment is performed. Further, when the photoimprint method is used for the production of the second mold 20, the temperature of the substrate 21 rises or falls because of the heat treatment for promoting the photohardening reaction. Further, in the photoimprint method, the temperature of the substrate 21 may increase due to light irradiation. As described above, when the temperature of the substrate 21 changes, the size of the substrate 21 also changes. When the temperature change of the substrate 21 is the same, the larger the size of the substrate 21, the larger the dimensional change of the substrate 21. The dimensional change of the substrate 21 is related to the dimensional change of the uneven layer 23 formed on the substrate 21.

因此,在本實施形態中,不使用樹脂片,而是使 用薄板玻璃,來作為基材21。藉此,可減少隨著溫度變化而產生的基材21之尺寸變化。玻璃的線膨脹係數,比樹脂的線膨脹係數小。又,玻璃的熱收縮,也比經延伸成形的樹脂片的熱收縮還小。由於可減少隨著溫度變化而產生的基材21之尺寸變化,所以製造第2模20時的凹凸圖案之轉印精度良好。 Therefore, in the present embodiment, instead of using a resin sheet, A thin plate glass is used as the substrate 21. Thereby, the dimensional change of the substrate 21 caused by the temperature change can be reduced. The coefficient of linear expansion of the glass is smaller than the coefficient of linear expansion of the resin. Further, the heat shrinkage of the glass is also smaller than the heat shrinkage of the stretched resin sheet. Since the dimensional change of the substrate 21 due to temperature change can be reduced, the transfer accuracy of the uneven pattern when the second mold 20 is manufactured is good.

作為基材21的薄板玻璃之成形方法,可為以下任 一種:浮製法、熔融下拉法、噴口下拉法、再曳引法。又, 薄板玻璃的玻璃,可列舉例如:無鹼玻璃、硼矽酸玻璃、鈉鈣玻璃、高矽玻璃、其他的以氧化矽為主成分的氧化物系玻璃等。 The method for forming the sheet glass as the substrate 21 can be as follows One type: floating method, melting down method, nozzle down method, and re-drawing method. also, Examples of the glass of the thin glass include an alkali-free glass, a borosilicate glass, a soda lime glass, a sorghum glass, and other oxide-based glass containing cerium oxide as a main component.

作為基材21的薄板玻璃之線膨脹係數,例如為 0.5×10-6/℃~12×10-6/℃,以2×10-6/℃~10×10-6/℃為佳。在此,「線膨脹係數」指的是:在20℃~300℃時的平均的線膨脹係數。 The linear expansion coefficient of the sheet glass as the substrate 21 is, for example, 0.5 × 10 -6 / ° C to 12 × 10 -6 / ° C, preferably 2 × 10 -6 / ° C to 10 × 10 -6 / ° C. Here, the "linear expansion coefficient" means an average linear expansion coefficient at 20 ° C to 300 ° C.

作為基材21的薄板玻璃與第1模10間的線膨脹係 數差,以50×10-6/℃以下為佳,以20×10-6/℃以下為更佳。 The linear expansion coefficient between the thin glass of the substrate 21 and the first mold 10 is preferably 50 × 10 -6 / ° C or less, more preferably 20 × 10 -6 / ° C or less.

作為基材21的薄板玻璃之板厚,例如為0.3mm以 下,宜為0.2mm以下,更宜為0.1mm以下,以50μm以下為更佳。又,作為基材21的薄板玻璃之板厚,宜為0.1μm以上,更宜為1μm以上,以5μm以上為更佳。板厚為0.3mm以下的薄板玻璃,具有良好的可撓性,可在轉印步驟或分離步驟中彎曲。板厚為0.3mm以下的薄板玻璃,在例如彎曲成曲率半徑200mm時,可以不破裂地進行彎曲,但在板厚比0.3mm還厚的時候,彎曲成曲率半徑200mm時,會有破裂之虞。 The thickness of the thin plate glass as the substrate 21 is, for example, 0.3 mm. Next, it is preferably 0.2 mm or less, more preferably 0.1 mm or less, and more preferably 50 μm or less. Moreover, the thickness of the thin glass as the substrate 21 is preferably 0.1 μm or more, more preferably 1 μm or more, and still more preferably 5 μm or more. A thin plate glass having a plate thickness of 0.3 mm or less has good flexibility and can be bent in a transfer step or a separation step. When the sheet glass having a thickness of 0.3 mm or less is bent to have a radius of curvature of 200 mm, for example, it can be bent without being broken. However, when the thickness is more than 0.3 mm, when it is bent to a radius of curvature of 200 mm, there is a crack. .

另外,本實施形態的第2模20之基材21,是僅由 薄板玻璃所構成,但只要含有薄板玻璃即可,也可更包含有樹脂層。只要比起僅由樹脂片來形成基材21時,隨著溫度變化而產生的凹凸圖案之尺寸變化較小即可。 Further, the base material 21 of the second mold 20 of the present embodiment is composed only of The thin plate glass is used, but it may contain a thin plate glass, and may further include a resin layer. When the base material 21 is formed only from the resin sheet, the dimensional change of the concave-convex pattern due to the temperature change may be small.

圖2是顯示使用本發明一實施形態之第2模之物 品之製造方法的截面圖。物品之製造方法具備有:準備第2模20的步驟(圖2(a))、塗布步驟(圖2(b))、轉印步驟(圖2(c))、及分離步驟(圖2(d))。另外,準備第2模20的步驟、與塗布步驟,哪個步驟先進行皆可,也可同時進行。 Figure 2 is a view showing a second mold using an embodiment of the present invention; A cross-sectional view of the manufacturing method of the product. The method for producing an article includes a step of preparing the second mold 20 (Fig. 2 (a)), a coating step (Fig. 2 (b)), a transfer step (Fig. 2 (c)), and a separation step (Fig. 2 (Fig. 2 d)). Further, in the step of preparing the second mold 20 and the coating step, which step may be performed first or simultaneously.

第2模20於表面具有凹凸圖案。第2模20可如圖2 所示般為板狀,也可為環帶狀。為了提高第2模20在分離步驟(圖2(d))中的脫模性,可以是施加有脫模處理者。脫模處理可列舉如:氟塗料處理、矽塗料處理等。 The second mold 20 has a concave-convex pattern on the surface. The second mold 20 can be as shown in FIG. 2 It is generally plate-shaped as shown, and may also be in the form of a ring. In order to improve the mold release property of the second mold 20 in the separation step (Fig. 2 (d)), it may be that a mold release process is applied. The mold release treatment may, for example, be a fluorine coating treatment or a enamel coating treatment.

在塗布步驟中,於基材31上塗布液狀的成形材料 32。另外,也可在塗布步驟中,於第2模20上塗布成形材料32。成形材料32塗布在第2模20及基材31中的任一者,都可以在轉印步驟中被夾在第2模20與基材31之間。成形材料32可以是使用於光壓印法或熱壓印法的一般材料,可與製造第2模20所使用的成形材料22為相同種類的材料,也可為不同種類的材料。 Coating a liquid forming material on the substrate 31 in the coating step 32. Further, the molding material 32 may be applied to the second mold 20 in the coating step. The molding material 32 is applied to any of the second mold 20 and the base material 31, and may be sandwiched between the second mold 20 and the base material 31 in the transfer step. The molding material 32 may be a general material used for a photoimprint method or a thermal imprint method, and may be the same type of material as the molding material 22 used in the production of the second mold 20, or may be a different type of material.

基材31是由從玻璃、樹脂、及金屬所選出的至少 1種材料所形成,但從轉印精度的觀點來看,宜以與第2模20之基材21間的線膨脹係數差較小的玻璃來形成。 The substrate 31 is selected from at least glass, resin, and metal. One type of material is formed, but from the viewpoint of transfer accuracy, it is preferable to form the glass having a small difference in linear expansion coefficient from the base material 21 of the second mold 20.

基材31除了玻璃之外,也可以由樹脂、金屬等來 形成,但宜僅由玻璃來形成。基材31從與第2模20之基材21間的線膨脹係數差的觀點來看,可用與基材21相同種類的玻璃來形成。 The base material 31 may be made of resin, metal, or the like in addition to glass. Formed, but preferably formed only of glass. The base material 31 can be formed from the same kind of glass as the base material 21 from the viewpoint of the difference in linear expansion coefficient between the base material 21 of the second mold 20 .

基材31可以是施有可提高基材31與成形材料32 間之緊密接著度的表面處理者。表面處理可列舉如:底漆 處理、臭氧處理、電漿蝕刻處理等。底漆可使用:矽烷耦合劑、矽氮烷等。 The substrate 31 may be provided with the substrate 31 and the forming material 32 A surface processor that closely follows the degree. Surface treatment can be exemplified by: primer Treatment, ozone treatment, plasma etching treatment, etc. The primer can be used: decane coupling agent, decazane, and the like.

在轉印步驟中,例如可以一面使第2模20之一部分彎曲、一面隔著成形材料32來使基材31與第2模20慢慢地接觸。空氣容易從第2模20與基材31之間跑出去,可抑制空氣的含入,而可提升轉印精度。為了防止含入空氣,可以在減壓氣體環境下進行轉印步驟。 In the transfer step, for example, the base material 31 and the second mold 20 can be brought into contact with each other while the one of the second molds 20 is partially bent while being separated by the molding material 32. Air easily escapes from between the second mold 20 and the substrate 31, and the inclusion of air can be suppressed, and the transfer accuracy can be improved. In order to prevent the inclusion of air, the transfer step can be carried out under a reduced pressure atmosphere.

在轉印步驟中,當第2模20的一部分被彎曲時,宜平坦地支持住基材31。可抑制成為製品一部分的基材31的損傷。 In the transfer step, when a part of the second mold 20 is bent, the substrate 31 is preferably supported flat. Damage to the substrate 31 which is a part of the product can be suppressed.

在轉印步驟中,第2模20的一部分,會沿著作為將第2模20壓接於成形材料32之壓接構件的旋轉輥14而彎曲。在此狀態下,旋轉輥14與基材31相對地移動,藉此,第2模20與基材31會隔著成形材料32慢慢地接觸。 In the transfer step, a part of the second mold 20 is bent along the rotating roll 14 which is a pressure-bonding member that presses the second mold 20 against the molding material 32. In this state, the rotating roller 14 moves relative to the base material 31, whereby the second mold 20 and the base material 31 are slowly brought into contact with each other via the molding material 32.

在轉印步驟中,藉著對第2模20施加張力,使第2模20的一部分攀附著旋轉輥14,沿著旋轉輥14而彎曲。第2模20的彎曲部分之曲率半徑容易為一定,而加在第2模20的應力也容易為一定。 In the transfer step, a part of the second mold 20 is caused to adhere to the rotating roller 14 by applying tension to the second mold 20, and is bent along the rotating roller 14. The radius of curvature of the curved portion of the second die 20 is easily constant, and the stress applied to the second die 20 is also likely to be constant.

分離步驟是將第2模20與凹凸層33分離。在分離步驟中,例如可以一面使第2模20的一部分彎曲、一面使第2模20與凹凸層33慢慢地分離。分離所需要的力較弱,可以抑制第2模20的破損或凹凸層33的破損。 The separation step separates the second mold 20 from the uneven layer 33. In the separation step, for example, the second mold 20 and the uneven layer 33 can be gradually separated while the part of the second mold 20 is bent. The force required for the separation is weak, and the damage of the second mold 20 or the breakage of the uneven layer 33 can be suppressed.

在分離步驟中,當第2模20的一部分彎曲時,宜平坦地支持住物品30。可以抑制物品30的損傷。 In the separating step, when a part of the second mold 20 is bent, the article 30 is preferably supported flat. Damage to the article 30 can be suppressed.

在分離步驟中,第2模20的一部分,會沿著作為 將第2模20壓接於成形材料32之壓接構件的旋轉輥14而彎曲。在此狀態下,旋轉輥14與基材31相對地移動,藉此,凹凸層33與第2模20會慢慢地分離。 In the separation step, a part of the second mold 20 will be written along the The second mold 20 is pressed against the rotating roller 14 of the pressure-bonding member of the molding material 32 to be bent. In this state, the rotating roller 14 moves relative to the base material 31, whereby the uneven layer 33 and the second mold 20 are gradually separated.

在分離步驟中,藉著對第2模20施加張力,使第2 模20的一部分攀附著旋轉輥14,沿著旋轉輥14而彎曲。第2模20的彎曲部分之曲率半徑容易為一定,而加在第2模20的應力也容易為一定。 In the separation step, by applying tension to the second mold 20, the second is made A portion of the die 20 is attached to the rotating roller 14 and is bent along the rotating roller 14. The radius of curvature of the curved portion of the second die 20 is easily constant, and the stress applied to the second die 20 is also likely to be constant.

如此一來,可得到具有基材31、及形成於基材31 上之凹凸層33的物品(例如光學構件)30。凹凸層33的凹凸圖案,是第2模20的凹凸圖案反轉過來的圖案,是與第1模10的凹凸圖案相同的圖案。 In this way, the substrate 31 can be obtained and formed on the substrate 31. An article (for example, an optical member) 30 of the upper uneven layer 33. The uneven pattern of the uneven layer 33 is a pattern in which the concave-convex pattern of the second mold 20 is reversed, and is the same pattern as the concave-convex pattern of the first mold 10.

此外,在製造物品30時,有時第2模20的溫度會 變化,且第2模20之基材21的尺寸會變化。基材21的尺寸變化,與形成在基材21上的凹凸層23之尺寸變化有關。 In addition, when the article 30 is manufactured, sometimes the temperature of the second mold 20 will The size of the substrate 21 of the second mold 20 changes. The dimensional change of the substrate 21 is related to the dimensional change of the uneven layer 23 formed on the substrate 21.

因此,在本實施形態中,不使用樹脂片,而是使 用薄板玻璃,來作為基材21。藉此,可減少隨著溫度變化而產生的基材21之尺寸變化。玻璃的線膨脹係數,比樹脂的線膨脹係數小。又,玻璃的熱收縮,也比經延伸成形的樹脂片的熱收縮還小。由於可減少隨著溫度變化而產生的基材21之尺寸變化,所以製造物品30時的凹凸圖案之轉印精度良好。 Therefore, in the present embodiment, instead of using a resin sheet, A thin plate glass is used as the substrate 21. Thereby, the dimensional change of the substrate 21 caused by the temperature change can be reduced. The coefficient of linear expansion of the glass is smaller than the coefficient of linear expansion of the resin. Further, the heat shrinkage of the glass is also smaller than the heat shrinkage of the stretched resin sheet. Since the dimensional change of the substrate 21 due to temperature change can be reduced, the transfer precision of the uneven pattern at the time of manufacturing the article 30 is good.

作為第2模20之基材21的薄板玻璃、與物品30之基材31間的線膨脹係數差,以50×10-6/℃以下為佳,以20 ×10-6/℃以下為更佳。物品30之基材31,如上所述,從與第2模20之基材21間的線膨脹係數差的觀點來看,宜用與基材21相同種類的玻璃來形成。 The difference in linear expansion coefficient between the thin glass of the base material 21 of the second mold 20 and the base material 31 of the article 30 is preferably 50 × 10 -6 / ° C or less, and more preferably 20 × 10 -6 / ° C or less. good. As described above, the base material 31 of the article 30 is preferably formed of the same type of glass as the base material 21 from the viewpoint of the difference in linear expansion coefficient from the base material 21 of the second mold 20.

使用第2模20來製造的物品30,可列舉例如:扁 豆狀透鏡構件、蛾眼型的反射防止構件、線柵型的偏光構件等光學構件。 The article 30 manufactured using the second die 20 may, for example, be flat. An optical member such as a bean lens member, a moth-eye reflection preventing member, or a wire grid type polarizing member.

扁豆狀透鏡構件的凹凸層,具有在平面上配列多 數凸柱透鏡的構造。各凸柱透鏡會將左眼用之圖像的光,聚光於使用者的左眼,並將右眼用之圖像的光,聚光於使用者的右眼。凸柱透鏡的間距為數十μm~數百μm。 The uneven layer of the lentil lens member has a plurality of planes arranged on the plane The construction of a number of convex cylindrical lenses. Each of the stud lenses condenses the light of the image for the left eye to the left eye of the user, and condenses the light of the image for the right eye to the right eye of the user. The pitch of the stud lenses is several tens of μm to several hundreds of μm.

另外,各凸柱透鏡也可發揮使來自於光源的光成 為平行光的作用。此時,也可二維地配列顯微透鏡,來代替一維地配列凸條的柱面透鏡。 In addition, each of the stud lenses can also function to make light from the light source For the role of parallel light. At this time, a microlens may be arranged two-dimensionally instead of a cylindrical lens in which the ribs are arranged one-dimensionally.

蛾眼型的反射防止構件之凹凸層,具有在平面上突出設置多數錐狀凸部的構造。凸部是例如週期性地配列成六方格子狀、準六方格子狀、四方格子狀、或準四方格子狀。相鄰的凸部,可相接也可分離,也可以配置成凸部的下襬部重疊。凸部的間距是設定為可見光的波長以下。太大的波長範圍會減少光反射率。 The uneven layer of the moth-eye type reflection preventing member has a structure in which a plurality of tapered convex portions are protruded from the plane. The convex portions are, for example, periodically arranged in a hexagonal lattice shape, a quasi-hexagonal lattice shape, a square lattice shape, or a quasi-tetragonal lattice shape. The adjacent convex portions may be connected to each other or may be separated, or may be arranged such that the lower hem portions of the convex portions overlap. The pitch of the convex portions is set to be equal to or less than the wavelength of visible light. A too large wavelength range will reduce the light reflectivity.

線柵型的偏光構件之凹凸層,具有在平面上隔著間隔而配列多數凸條部的條狀構造。凸條部的間距,是設定為可見光的波長以下。在各凸條部的前端部,形成金屬線。金屬線是藉由例如從凸條部的斜上方蒸鍍金屬材料而形成。複數條金屬線,把具有朝平行於金屬線之方向振動 之電場向量的偏光反射,使具有朝正交於金屬線之方向振動之電場向量的偏光透過。藉此,可得到直線偏光。 The uneven layer of the wire-grid polarizing member has a strip-like structure in which a plurality of ridge portions are arranged on the plane with a space therebetween. The pitch of the ridge portions is set to be equal to or less than the wavelength of visible light. A metal wire is formed at the front end portion of each of the ridge portions. The metal wire is formed by, for example, vapor-depositing a metal material from an oblique upper side of the ridge portion. a plurality of metal wires that are vibrated in a direction parallel to the metal wire The polarized reflection of the electric field vector transmits polarized light having an electric field vector vibrating in a direction orthogonal to the metal line. Thereby, linear polarization can be obtained.

圖3是顯示本發明一實施形態之光學面板之製造 方法的截面圖。光學面板之製造方法例如具備有:準備光學構件30的步驟(圖3(a))、準備積層面板40的步驟(圖3(b))、及貼合光學構件3與積層面板40的步驟(圖3(c))。 3 is a view showing the manufacture of an optical panel according to an embodiment of the present invention; A cross-sectional view of the method. The manufacturing method of the optical panel includes, for example, a step of preparing the optical member 30 (FIG. 3 (a)), a step of preparing the laminated panel 40 (FIG. 3 (b)), and a step of bonding the optical member 3 and the laminated panel 40 ( Figure 3 (c)).

光學構件30如圖2所示,是使用第2模20而以壓印 法製造的構件。光學構件30如圖2(d)及圖3(a)所示,具有基材31、及形成於基材31上的凹凸層33。 As shown in FIG. 2, the optical member 30 is embossed using the second mold 20. A component made by law. As shown in FIGS. 2(d) and 3(a), the optical member 30 has a base material 31 and an uneven layer 33 formed on the base material 31.

積層面板40如圖3(b)所示,具備有:濾光片基板41、液晶層42、及陣列基板43。濾光片基板41於內部具有濾光片、透明電極等。陣列基板43於內部具有TFT等主動元件、成為子像素的電極等。在陣列基板43中與液晶層42為相反側的面、濾光片基板41中與液晶層42為相反側的面,可貼合偏光板或視角補正用的光學膜。 As shown in FIG. 3(b), the laminated panel 40 includes a filter substrate 41, a liquid crystal layer 42, and an array substrate 43. The filter substrate 41 has a filter, a transparent electrode, and the like inside. The array substrate 43 has an active element such as a TFT, an electrode serving as a sub-pixel, and the like. The surface of the array substrate 43 opposite to the liquid crystal layer 42 and the surface of the filter substrate 41 opposite to the liquid crystal layer 42 can be bonded to a polarizing plate or an optical film for viewing angle correction.

光學構件30如圖3(c)所示,隔著接著層52,貼附於例如積層面板40的前面(與背光為相反側之面),例如貼附於濾光片基板41。 As shown in FIG. 3(c), the optical member 30 is attached to, for example, the front surface (surface opposite to the backlight) of the laminated panel 40 via the adhesive layer 52, and is attached to the filter substrate 41, for example.

如此一來,可得到包含有光學構件30及積層面板40的光學面板50。另外,本實施形態之光學構件30,是與積層面板40分別設置,但也可設置為積層面板40的一部分。例如,濾光片基板或陣列基板可包含有光學構件。 In this way, the optical panel 50 including the optical member 30 and the laminated panel 40 can be obtained. Further, the optical member 30 of the present embodiment is provided separately from the laminated panel 40, but may be provided as a part of the laminated panel 40. For example, the filter substrate or the array substrate may include an optical member.

以上,已說明了轉印有第1模之凹凸圖案之第2模等之實施形態,但本發明並不限制於上述實施形態等。 可在專利申請範圍所記載之本發明要旨的範圍內,進行各種變形、改良。 Although the embodiment in which the second mode or the like of the concave-convex pattern of the first mold is transferred has been described above, the present invention is not limited to the above-described embodiment and the like. Various modifications and improvements can be made within the scope of the gist of the invention as described in the appended claims.

例如,上述實施形態之光學面板50是液晶面板, 但也可為有機EL面板、或電子紙。又,上述實施形態之光學面板50是顯示圖像的圖像顯示面板,但也可為不顯示圖像的照明面板。 For example, the optical panel 50 of the above embodiment is a liquid crystal panel. However, it can also be an organic EL panel or an electronic paper. Further, the optical panel 50 of the above embodiment is an image display panel that displays an image, but may be an illumination panel that does not display an image.

又,在上述實施形態中,是在轉印步驟將成形材 料22、32固化之後,才進行分離步驟,但也可在分離步驟後將成形材料固化。 Further, in the above embodiment, the forming material is formed in the transfer step. After the materials 22, 32 are cured, the separation step is carried out, but the shaped material may also be cured after the separation step.

又,在上述實施形態中,是使用第2模20來製造 光學構件30,但也可使用第2模來製造第3模。第3模可使用於製造光學構件30、或製造別的模具等。 Moreover, in the above embodiment, the second mold 20 is used for manufacture. The optical member 30 may be used, but the second mold may be used to manufacture the third mold. The third mold can be used to manufacture the optical member 30, or to manufacture another mold or the like.

又,在上述實施形態中,是使用第2模20來製造 光學構件30,但使用第2模製造的物品種類可以為多種多樣。可列舉例如:免疫分析晶片、DNA分析晶片、DNA分離晶片、微反應器、第3模等。第3模可使用於製造別的物品。第3模可以和第2模一樣,基材包含有薄板玻璃。 Moreover, in the above embodiment, the second mold 20 is used for manufacture. Although the optical member 30 is used, the kind of articles manufactured using the second mold can be various. For example, an immunoassay wafer, a DNA analysis wafer, a DNA separation wafer, a microreactor, a third mold, etc. are mentioned. The third mold can be used to make other items. The third mold can be the same as the second mold, and the substrate contains thin plate glass.

又,在上述實施形態中,是使用光學構件30來製造光學面板,但也可使用光學構件30來製造光學元件。光學元件可列舉如成像元件等。 Further, in the above embodiment, the optical member is manufactured using the optical member 30, but the optical member 30 may be used to manufacture the optical element. The optical element can be exemplified by an imaging element or the like.

本申請案根據在2013年7月23日向日本特許廳申請的特願2013-152298號而主張優先權,並於本申請案援用特願2013-152298號的全部內容。 The present application claims priority based on Japanese Patent Application No. 2013-152298, filed on Jan. 23, 2013.

10‧‧‧第1模 10‧‧‧1st model

12‧‧‧旋轉輥 12‧‧‧Rotating roller

20‧‧‧第2模 20‧‧‧2nd mode

21‧‧‧基材 21‧‧‧Substrate

22‧‧‧成形材料 22‧‧‧Forming materials

23‧‧‧凹凸層 23‧‧‧Uneven layer

Claims (10)

一種第2模,是轉印有第1模之凹凸圖案的第2模,其具有:基材、及形成於該基材上且轉印有前述第1模之凹凸圖案的凹凸層,又,前述基材包含有薄板玻璃。 A second mold which is a second mold to which a concave-convex pattern of a first mold is transferred, and includes: a base material; and a concave-convex layer formed on the base material and having a concave-convex pattern of the first mold transferred thereto, The aforementioned substrate comprises a thin plate glass. 如請求項1之第2模,其中前述薄板玻璃的板厚為0.3mm以下。 The second mold of claim 1, wherein the sheet glass has a thickness of 0.3 mm or less. 一種第2模之製造方法,是轉印有第1模之凹凸圖案的第2模之製造方法,包含有轉印步驟,該轉印步驟是在前述第1模與基材之間夾著成形材料,在前述基材上形成轉印有前述第1模之凹凸圖案的凹凸層,又,前述基材包含有薄板玻璃。 A method for producing a second mold, which is a method for producing a second mold to which a concave-convex pattern of a first mold is transferred, and includes a transfer step of forming a sandwich between the first mold and the substrate The material forms an uneven layer on which the uneven pattern of the first mold is transferred, and the base material includes a thin plate glass. 如請求項3之第2模之製造方法,其中前述薄板玻璃的板厚為0.3mm以下。 A method of producing a second mold according to claim 3, wherein the sheet glass has a thickness of 0.3 mm or less. 一種物品之製造方法,是使用轉印有第1模之凹凸圖案的第2模的物品之製造方法,包含有將前述第2模之凹凸圖案進行轉印的轉印步驟,且前述第2模具有基材及形成於該基材上的凹凸層,該凹凸層是轉印了前述第1模之凹凸圖案者,又, 前述基材包含有薄板玻璃。 A method for producing an article using a second mold in which a concave-convex pattern of a first mold is transferred, comprising a transfer step of transferring a concave-convex pattern of the second mold, and the second mold a base material and an uneven layer formed on the base material, wherein the uneven layer is a concave-convex pattern on which the first mold is transferred, and The aforementioned substrate comprises a thin plate glass. 如請求項5之物品之製造方法,其中前述薄板玻璃的板厚為0.3mm以下。 The method of producing the article of claim 5, wherein the sheet glass has a thickness of 0.3 mm or less. 一種光學面板之製造方法,使用藉由如請求項5或6之物品之製造方法而得到的光學構件來製造光學面板。 An optical panel manufacturing method for manufacturing an optical panel using an optical member obtained by the method of producing the article of claim 5 or 6. 如請求項7之光學面板之製造方法,其中前述光學面板是液晶面板、有機EL面板或電子紙。 The method of manufacturing an optical panel according to claim 7, wherein the optical panel is a liquid crystal panel, an organic EL panel, or an electronic paper. 一種光學元件之製造方法,使用藉由如請求項5或6之物品之製造方法而得到的光學構件來製造光學元件。 A method of producing an optical element, which comprises producing an optical element using an optical member obtained by the method of producing the article of claim 5 or 6. 如請求項9之光學元件之製造方法,其中前述光學元件是成像元件。 A method of manufacturing an optical element according to claim 9, wherein the optical element is an imaging element.
TW103125142A 2013-07-23 2014-07-22 Second mold to which irregular first mold pattern has been transferred, second mold manufacturing method, method for manufacturing article using second mold, optical panel manufacturing method and optical element manufacturing method TW201505812A (en)

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