WO2019160058A1 - Mold formation method and mold - Google Patents

Mold formation method and mold Download PDF

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Publication number
WO2019160058A1
WO2019160058A1 PCT/JP2019/005420 JP2019005420W WO2019160058A1 WO 2019160058 A1 WO2019160058 A1 WO 2019160058A1 JP 2019005420 W JP2019005420 W JP 2019005420W WO 2019160058 A1 WO2019160058 A1 WO 2019160058A1
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mold
adhesive layer
unit
base material
resin
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PCT/JP2019/005420
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French (fr)
Japanese (ja)
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田邊大二
田中覚
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Ｓｃｉｖａｘ株式会社
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Publication of WO2019160058A1 publication Critical patent/WO2019160058A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/30—Mounting, exchanging or centering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Definitions

  • the present invention relates to a mold forming method and a mold.
  • An optical member having a fine concavo-convex structure on its surface is used for the purpose of controlling optical properties, such as a lens for condensing, a moth eye for preventing reflection, and a wire grid for adjusting polarization.
  • a method for forming this fine concavo-convex structure a mold (mold) having an inverted structure of the concavo-convex structure is formed on the surface, the mold is pressed against the object, and heat or light is used. Attention has been focused on nanoimprints that transfer the pattern onto the surface of the molding. (For example, refer to Patent Document 1).
  • a master mold is first created by laser processing, and then a mold is produced by imprinting directly from the master mold onto a resin. Moreover, the mold is produced by electroforming from the master mold, and imprinted on the resin from the electroformed mold to produce the mold.
  • an object of the present invention is to provide a mold forming method capable of accurately manufacturing a large-area mold at low cost and a mold manufactured using the method.
  • the mold forming method of the present invention includes an adhesive layer forming step of forming an adhesive layer on the surface of a base material or the back surface of a unit mold on which a predetermined pattern is formed, It has an arrangement process of arranging a plurality of unit molds via an adhesive layer, and a fixing process of fixing the unit mold to the adhesive layer by curing the adhesive layer.
  • the adhesive layer forming step forms an adhesive layer made of a photocurable resin on the substrate, and the fixing step is performed by irradiating the adhesive layer with light to cure the adhesive layer. What is necessary is just to fix the unit mold to the layer.
  • the unit mold and the base material are made of the same photocurable resin as the adhesive layer.
  • the base material, the adhesive layer, and the unit mold need to be transparent to ultraviolet rays having a predetermined wavelength used for the optical imprint.
  • Another mold forming method of the present invention is characterized in that a mold formed by the above-described mold forming method is used to transfer a pattern of the mold to a resin to form a new mold.
  • the mold of the present invention comprises a base material, a plurality of unit molds on which a predetermined pattern is formed, and an adhesive layer that is formed on the base material and fixes the unit mold.
  • the adhesive layer may be made of a photocurable resin.
  • the unit mold and the base material are made of the same photocurable resin as the adhesive layer.
  • the base material, the adhesive layer, and the unit mold need to be transparent to ultraviolet rays having a predetermined wavelength used for the optical imprint.
  • the mold forming method of the present invention and the mold produced by the method are produced by arranging a plurality of unit molds produced from a small-area master mold, and thus can be produced with high precision and large area and at low cost.
  • the mold forming method of the present invention mainly includes an adhesive layer forming step, an arranging step, and a fixing step.
  • the adhesive layer forming step is a step of forming the adhesive layer 3 on the front surface 11 of the substrate 1 or the back surface 22 of the unit mold 2.
  • the adhesive layer 3 is formed on the entire surface 11 of the substrate 1.
  • the adhesive layer 3 may be formed by rotating the substrate 1 using a coater or the like and coating the entire surface 11 of the substrate 1.
  • the adhesive layer 3 may be formed only on a portion of the surface 11 of the substrate 1 where the unit mold 2 is disposed as shown in FIG. 2, or the back surface 22 of the unit mold 2 as shown in FIG. You may form in.
  • the base material 1 functions as a base for supporting the unit mold 2. Therefore, the surface of the substrate 1 has an area enough to dispose a plurality of unit molds.
  • the material of the base material 1 is selected to be transparent to ultraviolet rays having a predetermined wavelength used for optical imprinting. Such materials include transparent resins such as COP and transparent inorganic materials such as glass.
  • the material of the substrate 1 is better to be the same type of resin as that of the adhesive layer 3 in that the optical properties of the substrate 1 and the adhesive layer 3 can be made the same or approximate, and more preferably the same resin. Better to do.
  • a material having heat resistance with respect to the temperature used for thermal imprinting is selected.
  • a material having heat resistance with respect to the temperature used for thermal imprinting include a resin such as COP having a glass transition point and a melting point higher than the temperature used, an inorganic material such as glass and silicon, and a metal such as nickel.
  • the unit mold 2 is formed with a predetermined pattern having a fine concavo-convex structure.
  • This fine concavo-convex structure is for imparting a desired function to the target product.
  • a lens shape, a structure that suppresses reflection like a moth eye, a structure that polarizes light like a wire grid, Or the structure for forming these corresponds.
  • the pattern having the fine concavo-convex structure may be formed in any way, but can be formed by, for example, an imprint method. Specifically, first, a master mold is manufactured by laser processing. Next, the unit mold 2 may be produced by directly imprinting the resin from the master mold. Alternatively, a mold may be manufactured by electroforming from a master mold and imprinted on the resin from the electroformed mold.
  • the unit mold 2 when using the produced mold for optical imprinting, can use the same photocurable resin as the adhesive layer 3, and the unit mold 2 and the adhesive layer 3 can have the same optical characteristics. This is preferable.
  • Another method for forming a pattern having a fine concavo-convex structure is to transfer a pattern to a resist formed on the surface of an inorganic material or metal using a master mold or an electroformed mold, and then etch the pattern. May be.
  • the size of the pattern of the unit mold 2 is arbitrary and may be determined in view of cost, throughput, pattern accuracy, and the like. For example, a thing of about several m square can be used. Since the said pattern may be smaller than the pattern area of the mold formed, the pattern of the master mold required for the manufacture can also be made small. Therefore, the master mold can be manufactured at a low cost and in a short time.
  • the shape of the unit mold 2 is preferably a shape in which there is no gap between the patterns of the unit mold 2 when the unit molds 2 are arranged side by side.
  • the pattern of the unit mold 2 may be a rectangle, and the unit mold 2 may be a rectangle as large as the pattern as much as possible.
  • a material transparent to ultraviolet rays having a predetermined wavelength used for optical imprinting is selected.
  • materials include transparent resins such as COP and transparent inorganic materials such as glass.
  • a material having heat resistance with respect to the temperature used for thermal imprinting is selected. Examples of such a material include a resin such as COP having a glass transition point and a melting point higher than the temperature used, an inorganic material such as glass and silicon, and a metal such as nickel.
  • the adhesive layer 3 is for bonding the substrate 1 and the unit mold 2 together.
  • the material of the adhesive layer 3 may be any material as long as the base material 1 and the unit mold 2 can be adhered to each other.
  • a photocurable resin that is cured by irradiation with light can be used.
  • a material that is transparent to ultraviolet rays having a predetermined wavelength used for optical imprinting is selected. Examples of such a material include a transparent resin such as an acrylic adhesive.
  • the optical characteristics of the unit mold 2 or the base material 1 and the adhesive layer 3 can be made the same or approximated.
  • the adhesive layer 3 is preferably made of the same type of resin as that of the unit mold 2 or the substrate 1, and more preferably the same resin.
  • a material having heat resistance with respect to the temperature used for thermal imprinting is selected.
  • a resin having a glass transition point and a melting point higher than the temperature to be used there is a resin having a glass transition point and a melting point higher than the temperature to be used.
  • the placement step is a step of placing a plurality of unit molds 2 on the base material 1 via the adhesive layer 3.
  • the arrangement interval may be any, but a narrower one is preferable in order to make the patterns dense.
  • a known chip mounter 4 may be used for the arrangement of the unit mold 2.
  • the fixing step is a step of curing the adhesive layer 3 and fixing the unit mold 2 to the adhesive layer 3.
  • the adhesive layer 3 is cured by irradiating light 5, and the unit mold 2 is fixed to the surface 11 of the substrate 1.
  • the adhesive layer 3 is cured by leaving it for a predetermined time until it is sufficiently cured, and the unit mold 2 is fixed to the surface of the substrate 1. Thereby, a plurality of unit molds 2 can be fixed on the substrate 1.
  • the mold of the present invention thus formed is composed of a base material 1, a plurality of unit molds 2 arranged on the base material 1, and an adhesive layer 3 formed between the base material 1 and the unit mold 2. Mainly composed.
  • the base material 1 functions as a base for supporting the unit mold 2 as described above.
  • the substrate 1 is transparent to ultraviolet rays having a predetermined wavelength used for optical imprinting.
  • the material of the base material 1 is preferably the same type of resin as that of the adhesive layer 3 and more preferably the same resin because the optical properties of the base material 1 and the adhesive layer 3 can be made the same or approximate. Is good.
  • the said base material 1 is heat resistant with respect to the temperature used by a thermal imprint.
  • the unit mold 2 is formed with a predetermined pattern having a fine concavo-convex structure as described above.
  • the size of the pattern of the unit mold 2 is arbitrary and may be determined in view of cost, throughput, pattern accuracy, and the like. For example, a thing about several mm square can be used. Since the said pattern may be smaller than the pattern area of the mold formed, the pattern of the master mold required for the manufacture can also be made small. Therefore, the master mold can be manufactured at a low cost and in a short time.
  • the shape and arrangement of the unit mold 2 is preferably a shape in which there is no gap between the patterns of the unit mold 2 when the unit molds 2 are arranged side by side.
  • the pattern of the unit mold 2 may be a rectangle, and the unit mold 2 may be a rectangle as large as the pattern as much as possible.
  • the material of the unit mold 2 when the formed mold is used for optical imprinting, a material transparent to ultraviolet rays having a predetermined wavelength used for optical imprinting is selected.
  • the material of the unit mold 2 is preferably made of the same resin as that of the adhesive layer 3 in that the optical characteristics of the substrate 1 and the unit mold 2 can be made the same.
  • a material having heat resistance with respect to the temperature used for thermal imprinting is selected.
  • the adhesive layer 3 is for bonding the substrate 1 and the unit mold 2 together.
  • the material of the adhesive layer 3 may be any material as long as the base material 1 and the unit mold 2 can be adhered to each other.
  • a photocurable resin that is cured by irradiation with light can be used.
  • the optical characteristics of the unit mold 2 or the base material 1 and the adhesive layer 3 can be made the same or approximated.
  • the adhesive layer 3 is preferably made of the same type of resin as that of the unit mold 2 or the substrate 1, and more preferably the same resin.
  • the formed mold When the formed mold is used for optical imprinting, a material that is transparent to ultraviolet rays having a predetermined wavelength used for optical imprinting is selected. In addition, when the formed mold is used for thermal imprinting, a material having heat resistance with respect to the temperature used for thermal imprinting is selected. As such a material, there is a resin having a glass transition point and a melting point higher than the temperature to be used.
  • another mold forming method of the present invention is to form a mold by transferring the pattern of the mold to a resin using the mold of the present invention described above.
  • optical imprinting or thermal imprinting may be used.
  • a large-area mold can be easily and accurately manufactured at a low price.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)

Abstract

The objective of the present invention is to provide a mold formation method and a mold prepared using the method, with which it is possible to prepare a large-surface-area mold at a low cost and with good precision. The mold is formed with: an adhesive layer formation step in which an adhesive layer 3 is formed on the surface 11 of a base material 1, or on the back surface of a unit mold 2 on which a prescribed pattern is formed; a disposition step in which a plurality of unit molds 2 are disposed on the base material 1 with the adhesive layer 3 interposed therebetween; and a fixing step in which the adhesive layer 3 is cured and the unit molds 2 are fixed to the adhesive layer 3.

Description

モールド形成方法およびモールドMold forming method and mold
　本発明は、モールド形成方法およびモールドに関する。 The present invention relates to a mold forming method and a mold.
　集光のためのレンズや反射防止のためのモスアイ、偏光を調節するためのワイヤーグリッド等、光学特性の制御を目的として、微細な凹凸構造を表面にもつ光学部材が利用されている。この微細な凹凸構造を形成する方法としては、その凹凸構造の反転構造が表面に形成されたモールド（金型）を用い、当該モールドを被成形物に対し加圧し、熱や光を利用して当該パターンを被成形物の表面に転写するナノインプリントが注目されている。（例えば、特許文献１参照）。 An optical member having a fine concavo-convex structure on its surface is used for the purpose of controlling optical properties, such as a lens for condensing, a moth eye for preventing reflection, and a wire grid for adjusting polarization. As a method for forming this fine concavo-convex structure, a mold (mold) having an inverted structure of the concavo-convex structure is formed on the surface, the mold is pressed against the object, and heat or light is used. Attention has been focused on nanoimprints that transfer the pattern onto the surface of the molding. (For example, refer to Patent Document 1).
　ここで、ナノインプリントに用いるモールドは、まずレーザ加工によってマスターモールドを作成し、次に、当該マスターモールドから樹脂に直接インプリントしてモールドを作製している。また、マスターモールドから電鋳によりモールドを作製し、当該電鋳モールドから樹脂にインプリントしてモールドを作製している。 Here, as a mold used for nanoimprinting, a master mold is first created by laser processing, and then a mold is produced by imprinting directly from the master mold onto a resin. Moreover, the mold is produced by electroforming from the master mold, and imprinted on the resin from the electroformed mold to produce the mold.
国際公開番号ＷＯ２００４／０６２８８６International Publication Number WO2004 / 062886
　ところで近年、当該光学部材やその他のインプリント製品に関して、大面積化の要望があり、それに用いるモールドも大型化が必要となっている。しかしながら、モールドを作製するためのマスターモールドを大型化すると、その作製に多くの時間とコストが掛かるという問題がある。また、加工する面積が大きくなるにつれて欠陥等の発生確率も高くなり、精度も低下するという問題がある。 By the way, in recent years, there is a demand for an increase in the area of the optical member and other imprint products, and the mold used for the area is also required to be increased in size. However, when the master mold for producing the mold is enlarged, there is a problem that the production takes a lot of time and cost. In addition, as the area to be processed increases, the probability of occurrence of defects and the like increases, and the accuracy also decreases.
　そこで本発明では、大面積のモールドを低価格で精度良く作製することができるモールド形成方法および当該方法を用いて作製したモールドを提供することを目的とする。 Therefore, an object of the present invention is to provide a mold forming method capable of accurately manufacturing a large-area mold at low cost and a mold manufactured using the method.
　上記目的を達成するために、本発明のモールド形成方法は、基材の表面又は所定のパターンが形成されたユニットモールドの裏面に接着層を形成する接着層形成工程と、前記基材上に前記接着層を介して複数の前記ユニットモールドを配置する配置工程と、前記接着層を硬化させて、前記接着層に前記ユニットモールドを固定する固定工程と、を有することを特徴とする。 In order to achieve the above object, the mold forming method of the present invention includes an adhesive layer forming step of forming an adhesive layer on the surface of a base material or the back surface of a unit mold on which a predetermined pattern is formed, It has an arrangement process of arranging a plurality of unit molds via an adhesive layer, and a fixing process of fixing the unit mold to the adhesive layer by curing the adhesive layer.
　この場合、前記接着層形成工程は、基材上に光硬化性樹脂からなる接着層を形成するものであり、前記固定工程は、前記接着層に光を照射することにより硬化させて、前記接着層に前記ユニットモールドを固定するものであれば良い。 In this case, the adhesive layer forming step forms an adhesive layer made of a photocurable resin on the substrate, and the fixing step is performed by irradiating the adhesive layer with light to cure the adhesive layer. What is necessary is just to fix the unit mold to the layer.
　また、形成されたモールドを光インプリントに用いる場合には、前記ユニットモールドや前記基材は前記接着層と同じ光硬化性樹脂から形成されたものである方が好ましい。また、前記基材、前記接着層および前記ユニットモールドは、当該光インプリントに用いる所定波長の紫外線に対して透明である必要がある。 In addition, when the formed mold is used for photoimprinting, it is preferable that the unit mold and the base material are made of the same photocurable resin as the adhesive layer. The base material, the adhesive layer, and the unit mold need to be transparent to ultraviolet rays having a predetermined wavelength used for the optical imprint.
　また、本発明の別のモールド形成方法は、上述したモールド形成方法によって形成されたモールドを用いて樹脂に当該モールドのパターンを転写し、新たなモールドを形成することを特徴とする。 Further, another mold forming method of the present invention is characterized in that a mold formed by the above-described mold forming method is used to transfer a pattern of the mold to a resin to form a new mold.
　また、本発明のモールドは、基材と、所定のパターンが形成された複数のユニットモールドと、前記基材上に形成されると共に、前記ユニットモールドを固定する接着層と、を具備することを特徴とする。 The mold of the present invention comprises a base material, a plurality of unit molds on which a predetermined pattern is formed, and an adhesive layer that is formed on the base material and fixes the unit mold. Features.
　この場合、前記接着層は、光硬化性樹脂からなるものを用いることができる。 In this case, the adhesive layer may be made of a photocurable resin.
　また、形成されたモールドを光インプリントに用いる場合には、前記ユニットモールドや前記基材は前記接着層と同じ光硬化性樹脂から形成されたものである方が好ましい。また、前記基材、前記接着層および前記ユニットモールドは、当該光インプリントに用いる所定波長の紫外線に対して透明である必要がある。 In addition, when the formed mold is used for photoimprinting, it is preferable that the unit mold and the base material are made of the same photocurable resin as the adhesive layer. The base material, the adhesive layer, and the unit mold need to be transparent to ultraviolet rays having a predetermined wavelength used for the optical imprint.
　本発明のモールド形成方法および当該方法で作製したモールドは、小面積のマスターモールドから作成したユニットモールドを複数配置して作成しているため精度がよく、大面積かつ安価に作製することができる。 The mold forming method of the present invention and the mold produced by the method are produced by arranging a plurality of unit molds produced from a small-area master mold, and thus can be produced with high precision and large area and at low cost.
本発明に係る接着層形成工程および配置工程を示す概略断面図である。It is a schematic sectional drawing which shows the contact bonding layer formation process and arrangement | positioning process which concern on this invention. 本発明に係る別の接着層形成工程および配置工程を示す概略断面図である。It is a schematic sectional drawing which shows another contact bonding layer formation process and arrangement | positioning process which concern on this invention. 本発明に係る別の接着層形成工程および配置工程を示す概略断面図である。It is a schematic sectional drawing which shows another contact bonding layer formation process and arrangement | positioning process which concern on this invention. 本発明に係る固定工程の一例を示す概略断面図である。It is a schematic sectional drawing which shows an example of the fixing process which concerns on this invention.
　本発明のモールド形成方法は、接着層形成工程と、配置工程と、固定工程で主に構成される。 The mold forming method of the present invention mainly includes an adhesive layer forming step, an arranging step, and a fixing step.
　接着層形成工程は、基材１の表面11又はユニットモールド２の裏面22に接着層３を形成する工程である。例えば、図１に示すように基材１の表面11の全面に接着層３を形成する。接着層３の形成は、コーター等を用いて基材１を回転させ、基材１の表面11全体に塗布すればよい。なお、接着層３の形成は、図２に示すように基材１の表面11のユニットモールド２を配置する部分のみに形成しても良いし、図３に示すようにユニットモールド２の裏面22に形成しても良い。 The adhesive layer forming step is a step of forming the adhesive layer 3 on the front surface 11 of the substrate 1 or the back surface 22 of the unit mold 2. For example, as shown in FIG. 1, the adhesive layer 3 is formed on the entire surface 11 of the substrate 1. The adhesive layer 3 may be formed by rotating the substrate 1 using a coater or the like and coating the entire surface 11 of the substrate 1. The adhesive layer 3 may be formed only on a portion of the surface 11 of the substrate 1 where the unit mold 2 is disposed as shown in FIG. 2, or the back surface 22 of the unit mold 2 as shown in FIG. You may form in.
　ここで、基材１は、ユニットモールド２を支持する土台として機能する。したがって、基材１の表面は複数のユニットモールドを配置できるだけの面積を有する。また、形成されたモールドを光インプリントに用いる場合には、当該基材１の材料は、光インプリントに用いる所定波長の紫外線に対して透明なものが選択される。このような材料としては、ＣＯＰ等の透明な樹脂や、ガラス等の透明な無機材料がある。また、基材１と接着層３の光学特性を同じにするか近似させることができる点で、基材１の材料は接着層３と同種の樹脂にする方が良く、更に好ましくは同じ樹脂にする方が良い。また、形成されたモールドを熱インプリントに用いる場合には、当該材料は、熱インプリントで使用する温度に対して耐熱性のあるものが選択される。このような材料としては、使用する温度よりガラス転移点や融点の高いＣＯＰ等の樹脂、ガラスやシリコン等の無機材料、ニッケル等の金属がある。 Here, the base material 1 functions as a base for supporting the unit mold 2. Therefore, the surface of the substrate 1 has an area enough to dispose a plurality of unit molds. When the formed mold is used for optical imprinting, the material of the base material 1 is selected to be transparent to ultraviolet rays having a predetermined wavelength used for optical imprinting. Such materials include transparent resins such as COP and transparent inorganic materials such as glass. Further, the material of the substrate 1 is better to be the same type of resin as that of the adhesive layer 3 in that the optical properties of the substrate 1 and the adhesive layer 3 can be made the same or approximate, and more preferably the same resin. Better to do. In addition, when the formed mold is used for thermal imprinting, a material having heat resistance with respect to the temperature used for thermal imprinting is selected. Examples of such a material include a resin such as COP having a glass transition point and a melting point higher than the temperature used, an inorganic material such as glass and silicon, and a metal such as nickel.
　また、ユニットモールド２は、微細凹凸構造からなる所定のパターンが形成されたものである。この微細凹凸構造は、目的となる製品に所望の機能を付与するためのもので、例えば、レンズ形状のものや、モスアイのように反射を抑える構造、ワイヤーグリッドのように光を偏光させる構造、あるいはこれらを形成するための構造等が該当する。当該微細凹凸構造からなるパターンはどのように形成しても良いが、例えば、インプリント方法で形成することができる。具体的には、まず、レーザ加工によってマスターモールドを作製する。次に、当該マスターモールドから樹脂に直接インプリントしてユニットモールド２を作製すれば良い。また、マスターモールドから電鋳によりモールドを作製し、当該電鋳モールドから樹脂にインプリントしてモールドを作製しても良い。 The unit mold 2 is formed with a predetermined pattern having a fine concavo-convex structure. This fine concavo-convex structure is for imparting a desired function to the target product.For example, a lens shape, a structure that suppresses reflection like a moth eye, a structure that polarizes light like a wire grid, Or the structure for forming these corresponds. The pattern having the fine concavo-convex structure may be formed in any way, but can be formed by, for example, an imprint method. Specifically, first, a master mold is manufactured by laser processing. Next, the unit mold 2 may be produced by directly imprinting the resin from the master mold. Alternatively, a mold may be manufactured by electroforming from a master mold and imprinted on the resin from the electroformed mold.
　なお、作製したモールドを光インプリントに用いる場合には、ユニットモールド２は接着層３と同じ光硬化性樹脂を用いる方が、ユニットモールド２と接着層３の光学特性を同じにすることができる点で好ましい。 In addition, when using the produced mold for optical imprinting, the unit mold 2 can use the same photocurable resin as the adhesive layer 3, and the unit mold 2 and the adhesive layer 3 can have the same optical characteristics. This is preferable.
　また、微細凹凸構造からなるパターンの別の形成方法としては、無機材料や金属の表面に形成されたレジストにマスターモールドや電鋳モールドを用いてパターンを転写し、これをエッチング等して形成しても良い。 Another method for forming a pattern having a fine concavo-convex structure is to transfer a pattern to a resist formed on the surface of an inorganic material or metal using a master mold or an electroformed mold, and then etch the pattern. May be.
　ユニットモールド２のパターンの大きさは任意であり、コスト、スループット、パターンの精度等を鑑みて決めれば良い。例えば、数ｍ角程度のものを用いることができる。当該パターンは、形成されるモールドのパターン面積よりも小さくて良いため、その製造に必要なマスターモールドのパターンも小さくすることができる。したがって、マスターモールドを安価かつ短時間で作製することができる。 The size of the pattern of the unit mold 2 is arbitrary and may be determined in view of cost, throughput, pattern accuracy, and the like. For example, a thing of about several m square can be used. Since the said pattern may be smaller than the pattern area of the mold formed, the pattern of the master mold required for the manufacture can also be made small. Therefore, the master mold can be manufactured at a low cost and in a short time.
　また、パターン同士を密にするために、ユニットモールド２の形状は、ユニットモールド２を並べて配置した際に、ユニットモールド２のパターン同士の間に隙間ができない形状が好ましい。例えば、ユニットモールド２のパターンを四角形とし、ユニットモールド２もできるだけ当該パターンと同程度の大きさの四角形とすれば良い。 Further, in order to make the patterns dense, the shape of the unit mold 2 is preferably a shape in which there is no gap between the patterns of the unit mold 2 when the unit molds 2 are arranged side by side. For example, the pattern of the unit mold 2 may be a rectangle, and the unit mold 2 may be a rectangle as large as the pattern as much as possible.
　ユニットモールド２の材料は、形成されたモールドを光インプリントに用いる場合には、光インプリントに用いる所定波長の紫外線に対して透明なものが選択される。このような材料としては、ＣＯＰ等の透明な樹脂や、ガラス等の透明な無機材料がある。また、形成されたモールドを熱インプリントに用いる場合には、当該材料は、熱インプリントで使用する温度に対して耐熱性のあるものが選択される。このような材料としては、使用する温度よりガラス転移点や融点の高いＣＯＰ等の樹脂、ガラスやシリコン等の無機材料、ニッケル等の金属がある。 As the material of the unit mold 2, when the formed mold is used for optical imprinting, a material transparent to ultraviolet rays having a predetermined wavelength used for optical imprinting is selected. Such materials include transparent resins such as COP and transparent inorganic materials such as glass. In addition, when the formed mold is used for thermal imprinting, a material having heat resistance with respect to the temperature used for thermal imprinting is selected. Examples of such a material include a resin such as COP having a glass transition point and a melting point higher than the temperature used, an inorganic material such as glass and silicon, and a metal such as nickel.
　また、接着層３は、基材１とユニットモールド２を接着するためのものである。接着層３の材料は、基材１とユニットモールド２を接着することができればどのようなものでも良いが、例えば、光を照射することで硬化する光硬化性樹脂を用いることができる。また、形成されたモールドを光インプリントに用いる場合には、光インプリントに用いる所定波長の紫外線に対して透明なものが選択される。このような材料としては、例えば、アクリル系接着剤等の透明な樹脂がある。また、ユニットモールド２又は基材１が光硬化性樹脂から形成されている場合には、ユニットモールド２や基材１と接着層３の光学特性を同じにするか近似させることができる点で、接着層３は当該ユニットモールド２又は基材１と同種の樹脂にする方が良く、更に好ましくは同じ樹脂にする方が良い。また、形成されたモールドを熱インプリントに用いる場合には、当該材料は、熱インプリントで使用する温度に対して耐熱性のあるものが選択される。このような材料としては、使用する温度よりガラス転移点や融点の高い樹脂がある。 The adhesive layer 3 is for bonding the substrate 1 and the unit mold 2 together. The material of the adhesive layer 3 may be any material as long as the base material 1 and the unit mold 2 can be adhered to each other. For example, a photocurable resin that is cured by irradiation with light can be used. When the formed mold is used for optical imprinting, a material that is transparent to ultraviolet rays having a predetermined wavelength used for optical imprinting is selected. Examples of such a material include a transparent resin such as an acrylic adhesive. Moreover, when the unit mold 2 or the base material 1 is formed from a photocurable resin, the optical characteristics of the unit mold 2 or the base material 1 and the adhesive layer 3 can be made the same or approximated. The adhesive layer 3 is preferably made of the same type of resin as that of the unit mold 2 or the substrate 1, and more preferably the same resin. In addition, when the formed mold is used for thermal imprinting, a material having heat resistance with respect to the temperature used for thermal imprinting is selected. As such a material, there is a resin having a glass transition point and a melting point higher than the temperature to be used.
　配置工程は、基材１上に接着層３を介して複数のユニットモールド２を配置する工程である。配置の間隔はどのようにしても良いが、パターン同士を密にするためには狭い方が好ましい。ユニットモールド２の配置には、例えば公知のチップマウンタ４を用いればよい。 The placement step is a step of placing a plurality of unit molds 2 on the base material 1 via the adhesive layer 3. The arrangement interval may be any, but a narrower one is preferable in order to make the patterns dense. For example, a known chip mounter 4 may be used for the arrangement of the unit mold 2.
　固定工程は、接着層３を硬化させて、接着層３にユニットモールド２を固定する工程である。例えば、接着層３に光硬化性樹脂を用いた場合、図４に示すように、光５を照射させて接着層３を硬化させ、基材１の表面11にユニットモールド２を固定する。また、化学反応で硬化する樹脂を用いた場合には、十分に硬化するまで所定時間放置して接着層３を硬化させ、基材１表面にユニットモールド２を固定する。これにより複数のユニットモールド２を基材１上に固定することができる。 The fixing step is a step of curing the adhesive layer 3 and fixing the unit mold 2 to the adhesive layer 3. For example, when a photocurable resin is used for the adhesive layer 3, as shown in FIG. 4, the adhesive layer 3 is cured by irradiating light 5, and the unit mold 2 is fixed to the surface 11 of the substrate 1. When a resin that is cured by a chemical reaction is used, the adhesive layer 3 is cured by leaving it for a predetermined time until it is sufficiently cured, and the unit mold 2 is fixed to the surface of the substrate 1. Thereby, a plurality of unit molds 2 can be fixed on the substrate 1.
　このように形成された本発明のモールドは、基材１と、当該基材１上に配置される複数のユニットモールド２と、基材１とユニットモールド２の間に形成された接着層３で主に構成される。 The mold of the present invention thus formed is composed of a base material 1, a plurality of unit molds 2 arranged on the base material 1, and an adhesive layer 3 formed between the base material 1 and the unit mold 2. Mainly composed.
　基材１は上述したように、ユニットモールド２を支持する土台として機能するものである。また、形成されたモールドを光インプリントに用いる場合には、当該基材１は、光インプリントに用いる所定波長の紫外線に対して透明なものである。基材１と接着層３の光学特性を同じにするか近似させることができる点で、基材１の材料は接着層３と同種の樹脂にする方が良く、更に好ましくは同じ樹脂にする方が良い。また、形成されたモールドを熱インプリントに用いる場合には、当該基材１は、熱インプリントで使用する温度に対して耐熱性のあるものである。 The base material 1 functions as a base for supporting the unit mold 2 as described above. When the formed mold is used for optical imprinting, the substrate 1 is transparent to ultraviolet rays having a predetermined wavelength used for optical imprinting. The material of the base material 1 is preferably the same type of resin as that of the adhesive layer 3 and more preferably the same resin because the optical properties of the base material 1 and the adhesive layer 3 can be made the same or approximate. Is good. Moreover, when using the formed mold for a thermal imprint, the said base material 1 is heat resistant with respect to the temperature used by a thermal imprint.
　また、ユニットモールド２は上述したように、微細凹凸構造からなる所定のパターンが形成されたものである。ユニットモールド２のパターンの大きさは任意であり、コスト、スループット、パターンの精度等を鑑みて決めれば良い。例えば、数ｍｍ角程度のものを用いることができる。当該パターンは、形成されるモールドのパターン面積よりも小さくて良いため、その製造に必要なマスターモールドのパターンも小さくすることができる。したがって、マスターモールドを安価かつ短時間で作製することができる。 The unit mold 2 is formed with a predetermined pattern having a fine concavo-convex structure as described above. The size of the pattern of the unit mold 2 is arbitrary and may be determined in view of cost, throughput, pattern accuracy, and the like. For example, a thing about several mm square can be used. Since the said pattern may be smaller than the pattern area of the mold formed, the pattern of the master mold required for the manufacture can also be made small. Therefore, the master mold can be manufactured at a low cost and in a short time.
　また、パターン同士を密にするためには、ユニットモールド２の形状や配置は、ユニットモールド２を並べて配置した際に、ユニットモールド２のパターン同士の間に隙間ができない形状が好ましい。例えば、ユニットモールド２のパターンを四角形とし、ユニットモールド２もできるだけ当該パターンと同程度の大きさの四角形とすれば良い。 Further, in order to make the patterns dense, the shape and arrangement of the unit mold 2 is preferably a shape in which there is no gap between the patterns of the unit mold 2 when the unit molds 2 are arranged side by side. For example, the pattern of the unit mold 2 may be a rectangle, and the unit mold 2 may be a rectangle as large as the pattern as much as possible.
　ユニットモールド２の材料は、形成されたモールドを光インプリントに用いる場合には、光インプリントに用いる所定波長の紫外線に対して透明なものが選択される。基材１とユニットモールド２の光学特性を同じにすることができる点で、ユニットモールド２の材料は接着層３と同じ樹脂にする方が好ましい。また、形成されたモールドを熱インプリントに用いる場合には、当該材料は、熱インプリントで使用する温度に対して耐熱性のあるものが選択される。 As the material of the unit mold 2, when the formed mold is used for optical imprinting, a material transparent to ultraviolet rays having a predetermined wavelength used for optical imprinting is selected. The material of the unit mold 2 is preferably made of the same resin as that of the adhesive layer 3 in that the optical characteristics of the substrate 1 and the unit mold 2 can be made the same. In addition, when the formed mold is used for thermal imprinting, a material having heat resistance with respect to the temperature used for thermal imprinting is selected.
　また、接着層３は、基材１とユニットモールド２を接着するためのものである。接着層３の材料は、基材１とユニットモールド２を接着することができればどのようなものでも良いが、例えば、光を照射することで硬化する光硬化性樹脂を用いることができる。また、ユニットモールド２又は基材１が光硬化性樹脂から形成されている場合には、ユニットモールド２や基材１と接着層３の光学特性を同じにするか近似させることができる点で、接着層３は当該ユニットモールド２又は基材１と同種の樹脂にする方が良く、更に好ましくは同じ樹脂にする方が良い。また、形成されたモールドを光インプリントに用いる場合には、光インプリントに用いる所定波長の紫外線に対して透明なものが選択される。また、形成されたモールドを熱インプリントに用いる場合には、当該材料は、熱インプリントで使用する温度に対して耐熱性のあるものが選択される。このような材料としては、使用する温度よりガラス転移点や融点の高い樹脂がある。 The adhesive layer 3 is for bonding the substrate 1 and the unit mold 2 together. The material of the adhesive layer 3 may be any material as long as the base material 1 and the unit mold 2 can be adhered to each other. For example, a photocurable resin that is cured by irradiation with light can be used. Moreover, when the unit mold 2 or the base material 1 is formed from a photocurable resin, the optical characteristics of the unit mold 2 or the base material 1 and the adhesive layer 3 can be made the same or approximated. The adhesive layer 3 is preferably made of the same type of resin as that of the unit mold 2 or the substrate 1, and more preferably the same resin. When the formed mold is used for optical imprinting, a material that is transparent to ultraviolet rays having a predetermined wavelength used for optical imprinting is selected. In addition, when the formed mold is used for thermal imprinting, a material having heat resistance with respect to the temperature used for thermal imprinting is selected. As such a material, there is a resin having a glass transition point and a melting point higher than the temperature to be used.
　また、本発明の別のモールド形成方法は、上述した本発明のモールドを用いて樹脂に当該モールドのパターンを転写し、モールドを形成するものである。転写には、光インプリント又は熱インプリントを用いれば良い。これにより、大面積のモールドを低価格で精度良く簡単に作製することができる。 Further, another mold forming method of the present invention is to form a mold by transferring the pattern of the mold to a resin using the mold of the present invention described above. For the transfer, optical imprinting or thermal imprinting may be used. As a result, a large-area mold can be easily and accurately manufactured at a low price.
１　基材
２　ユニットモールド
３　接着層
４　チップマウンタ
５　光
11　基材の表面
22　ユニットモールドの裏面 1 Base Material 2 Unit Mold 3 Adhesive Layer 4 Chip Mounter 5 Light
11 Substrate surface
22 Back side of unit mold

Claims (11)

  1. 　基材の表面又は所定のパターンが形成されたユニットモールドの裏面に接着層を形成する接着層形成工程と、
    　前記基材上に前記接着層を介して複数の前記ユニットモールドを配置する配置工程と、
    　前記接着層を硬化させて、前記接着層に前記ユニットモールドを固定する固定工程と、
    を有することを特徴とするモールド形成方法。     An adhesive layer forming step of forming an adhesive layer on the surface of the base material or the back surface of the unit mold on which a predetermined pattern is formed;
    An arrangement step of arranging a plurality of the unit molds on the base material via the adhesive layer,
    A fixing step of curing the adhesive layer and fixing the unit mold to the adhesive layer;
    The mold formation method characterized by having.
  2. 　前記接着層形成工程は、基材上に光硬化性樹脂からなる接着層を形成するものであり、
    　前記固定工程は、前記接着層に光を照射することにより硬化させて、前記接着層に前記ユニットモールドを固定するものであることを特徴とする請求項１記載のモールド形成方法。     The adhesive layer forming step is to form an adhesive layer made of a photocurable resin on a substrate,
    2. The mold forming method according to claim 1, wherein in the fixing step, the unit mold is fixed to the adhesive layer by curing the adhesive layer by irradiating light.
  3. 　前記ユニットモールドは前記接着層と同じ光硬化性樹脂から形成されたものであることを特徴とする請求項２記載のモールド形成方法。 3. The mold forming method according to claim 2, wherein the unit mold is formed of the same photocurable resin as the adhesive layer.
  4. 　前記基材は前記接着層と同じ光硬化性樹脂から形成されたものであることを特徴とする請求項２又は３記載のモールド形成方法。 4. The mold forming method according to claim 2, wherein the base material is formed of the same photocurable resin as the adhesive layer.
  5. 　前記基材、前記接着層および前記ユニットモールドは、所定波長の紫外線に対して透明であることを特徴とする請求項１ないし４のいずれかに記載のモールド形成方法。 The mold forming method according to any one of claims 1 to 4, wherein the base material, the adhesive layer, and the unit mold are transparent to ultraviolet rays having a predetermined wavelength.
  6. 　請求項１ないし５のいずれかに記載のモールド形成方法によって形成されたモールドを用いて樹脂に当該モールドのパターンを転写し、新たなモールドを形成することを特徴とするモールド形成方法。 A mold forming method, wherein a mold formed by the mold forming method according to any one of claims 1 to 5 is used to transfer a pattern of the mold to a resin to form a new mold.
  7. 　基材と、
    　所定のパターンが形成された複数のユニットモールドと、
    　前記基材上に形成されると共に、前記ユニットモールドを固定する接着層と、
    を具備することを特徴とするモールド。     A substrate;
    A plurality of unit molds on which a predetermined pattern is formed;
    An adhesive layer that is formed on the substrate and fixes the unit mold;
    The mold characterized by comprising.
  8. 　前記接着層は、光硬化性樹脂からなるものであることを特徴とする請求項７記載のモールド。 The mold according to claim 7, wherein the adhesive layer is made of a photocurable resin.
  9. 　前記ユニットモールドは前記接着層と同じ光硬化性樹脂から形成されたものであることを特徴とする請求項８記載のモールド。 The mold according to claim 8, wherein the unit mold is formed of the same photo-curable resin as the adhesive layer.
  10. 　前記基材は前記接着層と同じ光硬化性樹脂から形成されたものであることを特徴とする請求項８又は９記載のモールド。 The mold according to claim 8 or 9, wherein the base material is formed of the same photocurable resin as the adhesive layer.
  11. 　前記基材、前記接着層および前記ユニットモールドは、所定波長の紫外線に対して透明であることを特徴とする請求項７ないし１０のいずれかに記載のモールド。 The mold according to any one of claims 7 to 10, wherein the substrate, the adhesive layer, and the unit mold are transparent to ultraviolet rays having a predetermined wavelength.
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Citations (9)

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