TW201502302A - 可微調整製程參數之濺鍍製程控制系統及其方法 - Google Patents
可微調整製程參數之濺鍍製程控制系統及其方法 Download PDFInfo
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- TW201502302A TW201502302A TW102125164A TW102125164A TW201502302A TW 201502302 A TW201502302 A TW 201502302A TW 102125164 A TW102125164 A TW 102125164A TW 102125164 A TW102125164 A TW 102125164A TW 201502302 A TW201502302 A TW 201502302A
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- Prior art keywords
- control system
- sputtering
- parameter
- neurons
- control
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- 238000000034 method Methods 0.000 title claims abstract description 148
- 230000008569 process Effects 0.000 title claims abstract description 128
- 238000004544 sputter deposition Methods 0.000 title claims abstract description 69
- 238000004886 process control Methods 0.000 title claims abstract description 64
- 230000001537 neural effect Effects 0.000 claims abstract description 10
- 210000002569 neuron Anatomy 0.000 claims description 41
- 238000001514 detection method Methods 0.000 claims description 30
- 238000013528 artificial neural network Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 230000008676 import Effects 0.000 claims description 3
- 238000001552 radio frequency sputter deposition Methods 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims 1
- 230000035484 reaction time Effects 0.000 abstract description 7
- 238000012545 processing Methods 0.000 description 6
- 238000004364 calculation method Methods 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 238000011217 control strategy Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 210000005036 nerve Anatomy 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102125164A TW201502302A (zh) | 2013-07-15 | 2013-07-15 | 可微調整製程參數之濺鍍製程控制系統及其方法 |
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| TW102125164A TW201502302A (zh) | 2013-07-15 | 2013-07-15 | 可微調整製程參數之濺鍍製程控制系統及其方法 |
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| Publication Number | Publication Date |
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| TW201502302A true TW201502302A (zh) | 2015-01-16 |
| TWI495751B TWI495751B (enExample) | 2015-08-11 |
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| TW102125164A TW201502302A (zh) | 2013-07-15 | 2013-07-15 | 可微調整製程參數之濺鍍製程控制系統及其方法 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111534804A (zh) * | 2020-06-16 | 2020-08-14 | 常州市乐萌压力容器有限公司 | 基于改进灰关联模型的磁控溅射工艺参数优化方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3523962B2 (ja) * | 1996-05-21 | 2004-04-26 | アネルバ株式会社 | スパッタリング装置及びホール内へのスパッタリングによる薄膜作成方法 |
| US6090246A (en) * | 1998-01-20 | 2000-07-18 | Micron Technology, Inc. | Methods and apparatus for detecting reflected neutrals in a sputtering process |
| JP4021601B2 (ja) * | 1999-10-29 | 2007-12-12 | 株式会社東芝 | スパッタ装置および成膜方法 |
| WO2002063064A1 (en) * | 2001-02-07 | 2002-08-15 | Asahi Glass Company, Limited | Spatter device and spatter film forming method |
| JP3866615B2 (ja) * | 2002-05-29 | 2007-01-10 | 株式会社神戸製鋼所 | 反応性スパッタリング方法及び装置 |
| US6995545B2 (en) * | 2003-08-18 | 2006-02-07 | Mks Instruments, Inc. | Control system for a sputtering system |
| US8133359B2 (en) * | 2007-11-16 | 2012-03-13 | Advanced Energy Industries, Inc. | Methods and apparatus for sputtering deposition using direct current |
| TWI425107B (zh) * | 2010-11-15 | 2014-02-01 | Ind Tech Res Inst | 連續式濺鍍設備以及太陽能選擇性吸收膜的製造方法 |
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- 2013-07-15 TW TW102125164A patent/TW201502302A/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111534804A (zh) * | 2020-06-16 | 2020-08-14 | 常州市乐萌压力容器有限公司 | 基于改进灰关联模型的磁控溅射工艺参数优化方法 |
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| Publication number | Publication date |
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| TWI495751B (enExample) | 2015-08-11 |
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