TW201500187A - Article and electronic device using same - Google Patents

Abstract

An article includes a case, a dissipating layer, and a protecting glass. The case includes an outer surface. The dissipating layer is positioned on the outer surface of the case. The protecting glass is positioned on the dissipating layer. Part of the dissipating layer exposes from the protecting glass and dissipates heat transmitting from the case. A thermal conductivity of the dissipating layer is greater than the thermal conductivity of the case.

Description

Housing member and electronic device using the same

The present invention relates to a housing member, and more particularly to a housing member having a protective structure and an electronic device using the same.

The prior electronic device includes a housing and a cover glass covering the outer surface of the housing. The protective glass has a higher hardness than the casing, and the casing can be prevented from being scratched. However, since the heat dissipation effect of the protective glass is not good, it is easy to cause poor heat dissipation inside the electronic device.

In view of the above, it is necessary to provide a housing member capable of improving heat dissipation efficiency and an electronic device using the same.

A housing member includes a housing, a heat dissipation layer and a cover glass. The housing includes an outer surface. The heat dissipation layer is disposed on an outer surface of the housing, and the protection glass is disposed on the heat dissipation layer. A portion of the heat dissipation layer is exposed from the protective glass to dissipate heat outward. The heat dissipation layer has a thermal conductivity greater than that of the housing.

An electronic device includes a housing member as described above and a display screen received in the housing member.

Compared with the prior art, the present invention provides a housing member by providing a heat dissipation layer between the housing and the cover glass. Since the thermal conductivity of the heat dissipation layer is larger than the housing, heat conducted to the housing can enter the heat dissipation layer. And the portion of the protective glass exposed through the heat dissipation layer is quickly radiated outward to improve the heat dissipation effect.

100‧‧‧Electronic devices

10‧‧‧Sheet parts

11‧‧‧Shell

111‧‧‧ outer surface

12‧‧‧Heat layer

13‧‧‧protective glass

131‧‧‧ upper surface

132‧‧‧ lower surface

14‧‧‧Optical adhesive layer

FIG. 1 is a schematic perspective view of an electronic device according to an embodiment of the present invention.

2 is an exploded perspective view of the outer casing member of the electronic device of FIG. 1.

As shown in FIG. 1-2, an electronic device 100 according to an embodiment of the present invention includes a housing member 10 and various electronic components housed in the housing member 10, such as a display screen and a circuit board. In this embodiment, the electronic device 100 is a mobile phone.

The outer casing member 10 includes a casing 11 , a heat dissipation layer 12 , a cover glass 13 and two optical adhesive layers 14 .

The housing 11 has a rectangular parallelepiped shape and is made of a metal or plastic material. The housing 11 includes an outer surface 111.

The heat dissipation layer 12 has a thermal conductivity greater than that of the housing 11. The heat dissipation layer 12 is a graphene film or a carbon nanotube film. The graphene film and the carbon nanotube film are allomorphs of carbon, and the graphene film is a honeycomb lattice structure forming film, and the carbon nanotube film is formed by arranging a plurality of carbon nanotubes. The film, both films have a large heat dissipation area. The heat dissipation layer 12 is a transparent film that absorbs only about 2.3% of light, has a thermal conductivity of about 5300 W/mK, and has recyclability. In this embodiment, the heat dissipation layer 12 has a thickness of about 100 um to 1000 um.

The cover glass 13 has a flat shape and is a tempered glass. The cover glass 13 includes an upper surface 131 and a lower surface 132 opposite the upper surface 131. The surface hardness of the upper surface 131 reaches 8-9H. The lower surface 132 has a nanoscale etch. The thermal conductivity of the cover glass 13 is about 1.1 W/mK. In this embodiment, the protective glass 13 has a thickness of about 10 um to 150 um.

The optical adhesive layer 14 is formed of a hard optical adhesive. The hard optical adhesive is an epoxy resin, which has a good light transmission effect.

In the process of assembly, an epoxy layer is first coated on the outer surface 111 of the casing 11 to form the optical adhesive layer 14, and the heat dissipation layer 12 is attached to the optical adhesive layer 14. The heat dissipation layer 12 is bonded to the housing 11. Then, a layer of epoxy resin is further coated on the heat dissipation layer 12 to form another layer of optical adhesive layer 14, and the lower surface 132 of the cover glass 13 is attached to the optical adhesive layer 14 to protect the layer. The glass 13 is bonded to the heat dissipation layer 12. A portion of the heat dissipation layer 12 exposes the cover glass 13. In this embodiment, the edge of the heat dissipation layer 12 is not covered by the cover glass 13 such that the heat dissipation layer 12 is in direct contact with the outside. Secondly, since the heat dissipation layer 12 has a recyclability, the cover glass 13 and the casing 11 can be effectively bonded. Furthermore, since the lower surface 132 of the cover glass 13 has a nano-scale etching, the protective glass 13 can be stably bonded to the casing 11.

During use, the heat generated by the electronic device 100 is conducted to the housing 11, and the heat dissipation layer 12 has a high thermal conductivity, so that the heat on the housing 11 can be quickly Conducted to the heat dissipation layer 12. Moreover, due to the structural characteristics of the heat dissipation layer 12, the heat on the heat dissipation layer 12 can be quickly dissipated. When an external force acts on the upper surface 131 of the cover glass 13, on the one hand, the cover glass 13 is not easily scratched due to the higher hardness of the upper surface 131; on the other hand, due to the optics The glue layer 14 is formed of a hard optical glue, and an external force acting on the cover glass 13 is absorbed by the casing 11, so that the cover glass 13 is not easily broken.

The outer casing member provided by the invention provides a heat dissipation layer between the casing and the cover glass, and the heat conduction coefficient of the heat dissipation layer is larger than the casing, so that heat conducted to the casing can enter the heat dissipation layer and is exposed through the heat dissipation layer. The portion of the protective glass is quickly radiated outward to improve heat dissipation.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

no

100‧‧‧Electronic devices

11‧‧‧Shell

111‧‧‧ outer surface

12‧‧‧Heat layer

13‧‧‧protective glass

131‧‧‧ upper surface

132‧‧‧ lower surface

14‧‧‧Optical adhesive layer

Claims (9)

An outer casing member includes a casing, a heat dissipation layer and a cover glass; the casing includes an outer surface; the heat dissipation layer is disposed on an outer surface of the casing, and the cover glass is disposed at the heat dissipation a portion of the heat dissipation layer is exposed from the protective glass to dissipate heat outward; the heat dissipation layer has a thermal conductivity greater than that of the housing. The outer casing member according to claim 1, wherein the heat dissipation layer is a transparent graphene film or a carbon nanotube film. The outer casing member of claim 1, wherein: the outer casing member further comprises two optical adhesive layers, and the heat dissipation layer and the outer casing and the cover glass and the heat dissipation layer pass the optical adhesive Layer bonding. The outer casing member of claim 3, wherein: the protective glass is provided with a nano-scale etching on a side of the heat dissipation layer. The outer casing member according to claim 3, wherein the optical adhesive layer is formed of a hard optical adhesive, and the hard optical adhesive is an epoxy resin. The outer casing member of claim 1, wherein: the casing is made of a metal or plastic material. The outer casing member of claim 1, wherein: the heat dissipation layer absorbs 2.3% of light and has a thermal conductivity of 5300 W/mK. The outer casing member of claim 1, wherein: an edge of the heat dissipation layer is not covered by the cover glass, and the heat dissipation layer is in direct contact with the outside. An electronic device comprising the outer casing member of any one of claims 1-8 and a display screen received in the outer casing member.