CN104254217A - Outer shell and electronic device with same - Google Patents
Outer shell and electronic device with same Download PDFInfo
- Publication number
- CN104254217A CN104254217A CN201310266095.7A CN201310266095A CN104254217A CN 104254217 A CN104254217 A CN 104254217A CN 201310266095 A CN201310266095 A CN 201310266095A CN 104254217 A CN104254217 A CN 104254217A
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- CN
- China
- Prior art keywords
- heat dissipating
- dissipating layer
- outer casing
- casing member
- cover glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides an outer shell which comprises a shell, a heat dissipation layer and a piece of protective glass. The shell comprises an outer surface. The heat dissipation layer is arranged on the outer surface of the shell, and the protective glass is arranged on the heat dissipation layer. A part of the heat dissipation layer is exposed out of the protective glass, so that heat can be outwardly dissipated. A heat conductivity coefficient of the heat dissipation layer is larger than a heat conductivity coefficient of the shell. The outer shell has the advantages that the heat dissipation layer is arranged between the shell and the protective glass, and the heat conductivity coefficient of the heat dissipation layer is larger than the heat conductivity coefficient of the shell, so that the heat which is conducted to the shell can flow into the heat dissipation layer and can be quickly outwardly dissipated via the part, which is exposed out of the protective glass, of the heat dissipation layer, and heat dissipation effects can be improved.
Description
Technical field
The present invention relates to a kind of outer casing member, particularly a kind of have the outer casing member of operator guards and use the electronic installation of this outer casing member.
Background technology
Existing a kind of electronic installation comprises the cover glass that a housing and covers the outer surface of described housing.The hardness of described cover glass, higher than described housing, can prevent described housing to be scratched.But, because the radiating effect of cover glass is bad, easily cause described electronic installation internal heat dissipating bad.
Summary of the invention
In view of this, be necessary that providing a kind of can improve the outer casing member of radiating efficiency and use the electronic installation of this outer casing member.
A kind of outer casing member, it comprises a housing, a heat dissipating layer and a cover glass.Described housing comprises an outer surface.Described heat dissipating layer is arranged on the outer surface of described housing, and described cover glass is arranged on described heat dissipating layer.The described heat dissipating layer of part exposes outwards to dispel the heat from described cover glass.The conductive coefficient of described heat dissipating layer is greater than described housing.
A kind of electronic installation, it comprises an outer casing member and as above and is housed in display screen in described outer casing member.
Outer casing member provided by the invention by arranging heat dissipating layer between housing and cover glass; conductive coefficient due to heat dissipating layer is greater than described housing; thus make the heat conducting to housing can enter this heat dissipating layer; and be rapidly to outer distributing by the part that heat dissipating layer exposes this cover glass, improve radiating effect.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view of the electronic installation that embodiment of the present invention provides.
Fig. 2 is the decomposing schematic representation of the outer casing member in the electronic installation in Fig. 1.
Main element symbol description
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
As shown in Figure 1-2, a kind of electronic installation 100 that embodiment of the present invention provides, it multiple electronic component comprising an outer casing member 10 and be housed in described outer casing member 10, such as, display screen and circuit board.In present embodiment, described electronic installation 100 is a mobile phone.
Described outer casing member 10 comprises housing 11, heat dissipating layer 12, cover glass 13 and two optical cement layer 14.
Described housing 11 is in rectangular shape, and it adopts metal or plastic material to make.Described housing 11 comprises an outer surface 111.
The conductive coefficient of described heat dissipating layer 12 is greater than described housing 11.Described heat dissipating layer 12 is graphene film or carbon nano-tube film.Described graphene film and described carbon nano-tube film are the allotrope of carbon, described graphene film is that honeycomb lattice structure forms film, described carbon nano-tube film is by the film of multiple carbon nanotube arrangement, and these two kinds of films all have larger area of dissipation.Described heat dissipating layer 12 is transparent membrane, only absorb the light of about 2.3%, and conductive coefficient is about 5300W/mK, and has reelability.In present embodiment, the thickness of described heat dissipating layer 12 is about 100um-1000um.
Described cover glass 13 is in tabular, and it is toughened glass.Described cover glass 13 comprises upper surface 131 and a lower surface 132 relative with described upper surface 131.The case hardness of described upper surface 131 reaches 8-9H.Described lower surface 132 has nano level etching.The conductive coefficient of described cover glass 13 is about 1.1W/mK.In present embodiment, the thickness of described cover glass 13 is about 10um-150um.
Described optical cement layer 14 adopts and is formed by rigid optical glue.Described rigid optical glue is epoxy resin, and it has good translucent effect.
In the process of assembling, first on the outer surface 111 of described housing 11, apply one deck epoxy resin to form described optical cement layer 14, then be attached in described optical cement layer 14 by described heat dissipating layer 12, make described heat dissipating layer 12 mutually bonding with described housing 11.Then, described heat dissipating layer 12 applies one deck epoxy resin again to form another layer of optical cement layer 14, then the lower surface 132 of described cover glass 13 is attached to described optical cement layer 14, make described cover glass 13 mutually bonding with described heat dissipating layer 12.The described heat dissipating layer of part 12 exposes described cover glass 13.In present embodiment, the edge of described heat dissipating layer 12 is not coated by described cover glass 13 institute, thus described heat dissipating layer 12 is directly contacted with outside.Secondly, because described heat dissipating layer 12 has reelability, described cover glass 13 can effectively be fitted with described housing 11.Moreover, the lower surface 132 due to described cover glass 13 has nano level etching, make described cover glass 13 can with described housing 11 stable adhesion.
In the process used, on the heat conduction that described electronic installation 100 produces to described housing 11, because described heat dissipating layer 12 has higher conductive coefficient, thus make the heat on described housing 11 can conduct to described heat dissipating layer 12 rapidly.Further, due to the design feature of described heat dissipating layer 12, the heat on described heat dissipating layer 12 can be distributed rapidly.When there being External Force Acting on the upper surface 131 of described cover glass 13, on the one hand because described upper surface 131 has higher hardness, described cover glass 13 is not easily scratched; On the other hand, because described optical cement layer 14 adopts rigid optical glue to be formed, act on described cover glass 13 external force will absorb by described housing 11, thus make described cover glass 13 not easily broken.
Outer casing member provided by the invention by arranging heat dissipating layer between housing and cover glass; conductive coefficient due to heat dissipating layer is greater than described housing; thus make the heat conducting to housing can enter this heat dissipating layer; and be rapidly to outer distributing by the part that heat dissipating layer exposes this cover glass, improve radiating effect.
Be understandable that, for the person of ordinary skill of the art, other various corresponding change and distortion can be made by technical conceive according to the present invention, and all these change the protection range that all should belong to the claims in the present invention with distortion.
Claims (9)
1. an outer casing member, it comprises a housing, a heat dissipating layer and a cover glass; Described housing comprises an outer surface; Described heat dissipating layer is arranged on the outer surface of described housing, and described cover glass is arranged on described heat dissipating layer; The described heat dissipating layer of part exposes outwards to dispel the heat from described cover glass; The conductive coefficient of described heat dissipating layer is greater than described housing.
2. outer casing member as claimed in claim 1, is characterized in that: described heat dissipating layer is transparent graphene film or carbon nano-tube film.
3. outer casing member as claimed in claim 1, is characterized in that: described outer casing member also comprises two optical cement layer, described heat dissipating layer and described housing and bonding by described optical cement layer between described cover glass with described heat dissipating layer.
4. outer casing member as claimed in claim 3, is characterized in that: described cover glass is provided with nano level etching on the side of described heat dissipating layer.
5. outer casing member as claimed in claim 3, it is characterized in that: described optical cement layer is formed by rigid optical glue, described rigid optical glue is epoxy resin.
6. outer casing member as claimed in claim 1, is characterized in that: described housing adopts metal or plastic material to make.
7. outer casing member as claimed in claim 1, is characterized in that: described heat dissipating layer absorbs the light of 2.3%, and conductive coefficient is 5300W/mK.
8. outer casing member as claimed in claim 1, is characterized in that: the edge of described heat dissipating layer is not coated by described cover glass institute, and described heat dissipating layer directly contacts with outside.
9. an electronic installation, it comprises the display screen be housed in just like the outer casing member in any one in claim 1-8 and in described outer casing member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310266095.7A CN104254217A (en) | 2013-06-28 | 2013-06-28 | Outer shell and electronic device with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310266095.7A CN104254217A (en) | 2013-06-28 | 2013-06-28 | Outer shell and electronic device with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104254217A true CN104254217A (en) | 2014-12-31 |
Family
ID=52188623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310266095.7A Pending CN104254217A (en) | 2013-06-28 | 2013-06-28 | Outer shell and electronic device with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104254217A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211711A (en) * | 2016-07-15 | 2016-12-07 | 中国空间技术研究院 | A kind of radiator with high performance based on aligned carbon nanotube film and preparation method |
| WO2020093207A1 (en) * | 2018-11-05 | 2020-05-14 | 深圳市柔宇科技有限公司 | Display screen, display device and electronic device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007101692A (en) * | 2005-09-30 | 2007-04-19 | Fujifilm Corp | Heat conduction plate, heat sink, and flat display panel |
| CN202548725U (en) * | 2012-05-07 | 2012-11-21 | 邓旭 | Shell applied to mobile phone or tablet computer |
| CN202711120U (en) * | 2012-05-23 | 2013-01-30 | 深圳市万景华科技有限公司 | Protective device for movable type electronic terminal |
-
2013
- 2013-06-28 CN CN201310266095.7A patent/CN104254217A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007101692A (en) * | 2005-09-30 | 2007-04-19 | Fujifilm Corp | Heat conduction plate, heat sink, and flat display panel |
| CN202548725U (en) * | 2012-05-07 | 2012-11-21 | 邓旭 | Shell applied to mobile phone or tablet computer |
| CN202711120U (en) * | 2012-05-23 | 2013-01-30 | 深圳市万景华科技有限公司 | Protective device for movable type electronic terminal |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211711A (en) * | 2016-07-15 | 2016-12-07 | 中国空间技术研究院 | A kind of radiator with high performance based on aligned carbon nanotube film and preparation method |
| CN106211711B (en) * | 2016-07-15 | 2019-05-24 | 中国空间技术研究院 | A kind of radiator with high performance and preparation method based on aligned carbon nanotube film |
| WO2020093207A1 (en) * | 2018-11-05 | 2020-05-14 | 深圳市柔宇科技有限公司 | Display screen, display device and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20170703 Address after: Shenzhen City, Guangdong Guanlan Foxconn science and Technology Park B District Building 5 building C09 floor, C07 building, floor 2, C08 building, floor 4, floor C04, building, 1 Applicant after: Shenzhen Yu Precision Technology Co., Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Applicant before: Hongfujin Precise Industry (Shenzhen) Co., Ltd. Applicant before: Hon Hai Precision Industry Co., Ltd. |
|
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141231 |