TW201447986A - Semiconductor fabrication equipment having assistant monitor - Google Patents

Abstract

A semiconductor fabrication equipment having an assistant monitor includes a track, a driving shaft, a first sensor and a counter. The track includes a first end and a second end. The driving shaft has a projecting portion disposed in the track and is used for performing a reciprocating motion between the first end and the second end. The first sensor is disposed on a fixed position of the track and used for producing a first signal on a time of the projecting portion passing through the fixed position. The counter includes a first input terminal and a display panel. The first input terminal is coupled to the first sensor and used for producing a counting information. The display panel is coupled to the first terminal and used for producing a first count number with a progressive way after the counting information is received thereby.

Description

Semiconductor process equipment with auxiliary monitoring function

The present invention relates to a semiconductor process apparatus, and more particularly to a semiconductor process apparatus having an auxiliary monitoring function.

Current semiconductor processes are primarily performed by operating highly automated semiconductor process equipment, such as ion implanters to perform various doping processes on the functional components of the wafer. Please refer to the functional block diagram of an ion implanter shown in FIG.

Referring to FIG. 1, the ion implanter 10 includes at least an ion source unit 11, a charge mass analyzing unit 12, a target unit 13, and a main control unit 14. The ion source unit 11 typically includes a source of gas that can be used to generate an ion beam, a power source to provide the gas to generate an ion beam, and a power control/sensing module. The charge mass analysis unit 12 is disposed on the flight path 111 of the ion beam, and includes a magnetic energy generating component and a magnetic field control/sensing module, which generate different flight paths due to different charge/mass ratios when the ions travel through the magnetic field. The ions in the ion beam that meet the predetermined mass are advanced along the set target path 121, and the ions of the unpredetermined mass are deviated from the set target path 121 of the ion beam. The target unit 13 includes a Faraday cup, a scanning component, and a scanning control/sensing module, wherein one or more workpieces such as semiconductor wafers are disposed on the scanning component; and the scanning control/sensing module controls the scanning component pair A quasi-Faraday cup for reciprocating scanning of one or more workpieces aligned with an ion beam that has been screened by charge/mass analysis into the Faraday cup for ion implantation. The main control unit 14 is coupled to the ion source unit 11 and the electric charge The quality analysis unit 12 and the target unit 13 include a processing module, a storage module and a display module, wherein the storage module stores the implant process parameters; the processing module transmits the control signal for implanting the process parameters to the ions. The source unit 11, the charge mass analyzing unit 12, and the target unit 13 receive the sensing signals from the ion source unit 11, the charge mass analyzing unit 12, and the target unit 13, and transmit the execution state information of the implanting process to the display module. For the operator to monitor the execution status of the implant process through the display module.

However, if the semiconductor process equipment with highly automated control causes erroneous actions or information due to external power interference, internal control programs, hardware components of the device, or other unknown factors, take the ion implanter shown in Figure 1 as an example. The hardware of the source unit 11, the charge quality analyzing unit 12, the target unit 13 or the main control unit 14 or the software of the main control unit 14 is erroneous, so that the main control unit 14 cannot correctly display the execution state of the implantation process, and the operator must pause. In the implantation process, the subsequent process steps can be performed by artificially calculating or taking out the workpiece and other detecting devices, such as a heat wave measuring instrument, to detect the workpiece to confirm the implant dose. The foregoing method not only delays the production plan but may still fail to detect the defects of the product, resulting in waste of production costs. Therefore, how to solve the above problems is to develop the object of the present invention.

SUMMARY OF THE INVENTION A primary object of the present invention is to provide a semiconductor process apparatus having an auxiliary monitoring function including a track, a drive shaft, a first sensing element, and a counter. The track includes a first endpoint and a second endpoint. The drive shaft has one end disposed in the track for performing a reciprocating motion between the first end point and the second end point. The first sensing element is disposed at a certain point on the track for generating a first signal when the end passes the fixed point. The counter includes a first input and a display. The first input end is coupled to the first sensing component, and is configured to generate a counting information after receiving the first signal. The display end is coupled to the first input end for receiving the first count information and displaying a first count number in a progressive manner.

The present invention utilizes a first sensing element disposed on a track in a semiconductor process device And extracting the first signal generated when the sensing drive shaft reciprocates to construct an auxiliary monitoring mechanism of the semiconductor process equipment. In the case of a software or hardware error in the semiconductor process equipment, the auxiliary monitoring mechanism of the present invention can reliably record and display the progress of the process that has been performed according to the process actions performed by the semiconductor process equipment.

The above and other objects, features and advantages of the present invention will become more <RTIgt;

10‧‧‧Ion implanter

11‧‧‧Ion source unit

12‧‧‧Charge mass analysis unit

13‧‧‧Target unit

14‧‧‧Main control unit

20‧‧‧Semiconductor Process Equipment (Ion Implanter)

21‧‧‧Control unit

22‧‧‧ Track

23‧‧‧First Drive Department

24‧‧‧Loading station

25‧‧‧Supports

30‧‧‧ counter

31‧‧‧ Recorder

111‧‧‧Flight path of the ion beam

121‧‧‧Set target path for ion beam

220‧‧‧First sensing element

221‧‧‧ the center point of the track

222‧‧‧ the first endpoint of the orbit

223‧‧‧second endpoint of the orbit

231‧‧‧First drive motor

232‧‧‧Drive shaft

233‧‧‧End of the drive shaft

241‧‧‧ Center point of the carrying platform

301‧‧‧ first input

302‧‧‧ Display

303‧‧‧ second input

304‧‧‧Power supply

305‧‧‧ Grounding

V1‧‧‧ independent power supply

W1‧‧‧Semiconductor Wafer

FIG. 1 is a schematic block diagram of an ion implanter.

2 is a functional block diagram of a semiconductor process device with an auxiliary monitoring function of the present invention.

2A-2B are schematic diagrams showing an embodiment of a semiconductor process device having an auxiliary monitoring function according to the present invention.

The main idea of the present invention is to construct a set of auxiliary monitoring mechanisms by using the sensing elements disposed on the reciprocating driving members of the semiconductor processing apparatus and taking out sensing signals generated when the sensing driving members perform the reciprocating motion. 2 is a functional block diagram of a semiconductor process device with an auxiliary monitoring function of the present invention.

First, referring to FIG. 2, the semiconductor process device 20 includes a track (not shown), a first driving portion 23, a first sensing element 220, a control unit 21, and a counter 30. The track includes a first endpoint and a second endpoint (not shown). The first driving unit 23 includes a driving shaft (not shown). The driving shaft has an end portion (not shown) disposed in the rail for reciprocating between the first end point and the second end point. The first sensing element 220 is disposed on the track for generating a first signal when the end of the drive shaft passes through the first sensing element 220 (shown by a dashed arrow in the figure). Control unit 21 coupling The first driving portion 23 is connected to transmit a control signal to the first driving portion 23 to reciprocate the driving shaft. In some programmable control semiconductor processing devices, the control unit 21 may also store a preset number of times of reciprocating motion, which decrements the reciprocating motion by an inverted signal between the first driving portion and the reverse/reverse motion. The preset number of times is performed, and the number of remaining reciprocating motions is displayed. For example, the reciprocating motion is preset to be performed N times in the control unit 21, and after the reciprocating motion is performed by the first driving portion 23, the control unit 21 displays the number of remaining reciprocating motions as N. -1 time. When the number of counts displayed by the control unit 21 is zero, the control unit 21 issues a stop signal to cause the first drive unit 23 to stop operating.

The counter 30 includes a first input 301 and a display 302. The first input terminal 301 is coupled to the first sensing component 220 for generating a count information after receiving the first signal. The display end 302 is coupled to the first input end 301 for receiving the count information and displaying the first count number in a progressive manner. The counter 30 selected for use in the present invention may further include a second input terminal 303, a power supply terminal 304, and a ground terminal 305. The second input terminal 303 can generate a return-to-zero information after receiving an input signal, and the display terminal 302 receives the zero-return information and displays that the first count number is zero. The power supply terminal 304 can be externally connected to the independent power source V1.

For a more detailed description, FIG. 2A and FIG. 2B are schematic side views showing an embodiment of a semiconductor process device having an auxiliary monitoring function of the present invention.

In FIGS. 2A through 2B, the semiconductor process device 20 of the present invention having an auxiliary monitoring function is an ion implanter. 2A is a schematic diagram of the ion implanter 20 when performing an ion implantation process. Referring to FIG. 2A, the ion implanter 20 includes a track 22, a first driving portion 23, and a first sensing element 220, and further includes a carrying platform 24 and a second driving portion (not shown). The track 22 includes a center point 221, a first end point 222, and a second end point 223. The first driving unit 23 includes a first driving motor 231 and a driving shaft 232. The driving shaft 232 has an end portion 233 disposed in the rail 22 for linear reciprocating movement between the first end point 222 and the second end point 223 ( The linear reciprocating motion shown by the two arrows in the figure). The carrying platform 24 is pivotally connected to the driving shaft 232 and can be driven by the driving shaft 232 to perform the linear reciprocating motion (the linear reciprocating line shown by the two arrow lines in the figure) Movement) for carrying at least one semiconductor wafer w1. The second drive portion is disposed in the carrier 24 for driving the carrier 24 to perform a circular motion (circular motion as shown by the two arrow curves in the figure) at the center point 241 of the carrier 24. The ion implanter 20 combines the linear reciprocating motion of the first driving portion 23 and the circular motion performed by the second driving portion to form a scanning operation, so that one or more semiconductor wafers w1 on the loading table 24 are scanned. The dopants in the ion beam are uniformly implanted into each of the semiconductor wafers w1 by ion beams (not shown) in the implanted regions.

In the present embodiment, the track 22 has a center point 221 between the first end point 222 and the second end point 223. The first sensing element 220 is disposed on the center point 221 for use as a positioning sensing element of the driving shaft 232. It should be noted that, in the ion implanter 20, the first sensing element may be disposed on the first end point 222 or the second end point 223, and the auxiliary monitoring mechanism in the present invention does not limit the access configuration to the center. The first sensing signal generated by the first sensing component 220 on the point 221, wherein the first sensing component 221 is selected from a proximity switch, a photoelectric switch or a piezoelectric switch, preferably has high reliability and durability. Longer proximity switch. When the first sensing component 220 detects that the end 233 of the driving shaft 232 passes through the center point 221 of the track 22, the first sensing component 221 generates a first signal, for example, a +24V voltage signal. In the present invention, the first input terminal 301 of the counter 30 is coupled to the first sensing component 220, and the first input terminal 301 generates a counting information after receiving the first signal. The display end 302 of the counter 30 is coupled to the first input end 301. The display end 302 displays a first count number (001 as shown in the figure) in a progressive manner after receiving the count information.

It should be noted that, as shown in FIG. 2A, the auxiliary monitoring mechanism of the present invention takes the sensing signal generated by the first sensing element 220 disposed on the track 22, and only the end 233 of the driving shaft 232 is indeed The counter 30 will generate the first count number when performing a linear reciprocating motion. Therefore, if the control unit (not shown) of the ion implanter 20, the first drive motor 231, or other components have a software or hardware error and fail to display or perform the correct process operation, the first display on the counter 30 A count number is the number of linear reciprocations that the drive shaft 232 has performed. In addition, the auxiliary monitoring mechanism of the present invention may include a recorder 31 in addition to the counter 30. The process of generating a first count number with counter 30. In the present embodiment, the recorder 31 is a photographic recorder which, in addition to the process of generating the first count number by the image recording counter 30, simultaneously records the linear reciprocating motion of the drive shaft for double confirmation of the first count. The correctness of the number.

Referring again to FIG. 2B, a schematic side view of the ion implanter 20 when the ion implantation process is completed. As shown in FIG. 2B, the ion implanter 20 further includes a third driving portion (not shown) and a holder 25. After the ion implantation process 20 completes the ion implantation process of the batch of semiconductor wafers w1, the end portion 233 of the drive shaft 232 is positioned at the center point 221 of the track 22, that is, the position where the first sensing element 220 is disposed. The third driving portion (not shown) drives the carrying platform 24 to perform a rotational motion with the driving shaft 232 as a central axis (ie, corresponding to the rotational motion about the x-axis in the figure), and the carrier 24 is disengaged from the ion implanter 20. Implant area. The support member 25 is disposed below the carrying platform 24, and after receiving a second signal from a control unit (not shown), can be raised from the lower direction of the carrying platform 24 to protrude from the surface of the carrying platform 24 for The semiconductor wafer is lifted from the carrier 24 to load/remove the semiconductor wafer w1 from the ion implanter 20 by a robotic arm (not shown) for transporting the semiconductor wafer w1.

In this embodiment, the second input end 303 of the counter 30 is coupled to the support member 25 and the display end 302 respectively. The second input end 303 generates a second signal after the control support member 25 performs the raising operation. Return to zero information. After receiving the zero return information, the display terminal 302 displays that the number of counts is zero ((000 as shown in the figure) to prepare to monitor the next batch of ion implantation processes. Similarly, the recorder 31 can record the batch. The process of the sub-ion implantation process prepares the field operator to retrospectively investigate the production process of the batch implantation process.

It can be seen from the above description that the present invention utilizes a sensing element disposed on a reciprocating driving member of a semiconductor processing apparatus, and takes out a sensing signal generated when the sensing driving member performs a reciprocating motion to construct an auxiliary monitoring of a group of semiconductor processing equipment. mechanism. When a semiconductor or device hardware or hardware error occurs, the monitoring mechanism of the present invention can reliably record and display the progress of the process that has been performed according to the process actions performed by the semiconductor process device, so that the operator can Quickly analyze the state of semiconductor process equipment and/or its manufacturing semiconductor wafers, so it can effectively reduce defective products, avoid delays in production planning, and waste of production processes.

While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application attached to this case.

20‧‧‧Semiconductor Process Equipment (Ion Implanter)

22‧‧‧ Track

23‧‧‧First Drive Department

24‧‧‧Loading station

30‧‧‧ counter

31‧‧‧ Recorder

220‧‧‧First sensing element

221‧‧‧ the center point of the track

222‧‧‧ the first endpoint of the orbit

223‧‧‧second endpoint of the orbit

231‧‧‧First drive motor

232‧‧‧Drive shaft

233‧‧‧End of the drive shaft

241‧‧‧ Center point of the carrying platform

301‧‧‧ first input

302‧‧‧ Display

303‧‧‧ second input

304‧‧‧Power supply

305‧‧‧ Grounding

V1‧‧‧ independent power supply

W1‧‧‧Semiconductor Wafer

Claims (10)

A semiconductor process device with an auxiliary monitoring function, comprising: a track comprising a first end point and a second end point; a drive shaft having an end portion disposed in the track for the first end point And a reciprocating motion between the second end point; and a first sensing element disposed at a certain point on the track for sensing a first signal generated when the end portion passes the fixed point; a counter The first input end is coupled to the first sensing component for receiving the first signal to generate a counting information, and a display end coupled to the first input terminal for receiving the counting information Then, a first count number is displayed in a progressive manner. The semiconductor process device with auxiliary monitoring function according to claim 1, wherein the track includes a center point between the first end point and the second end point, and the fixed point is the center point. A semiconductor process device having an auxiliary monitoring function as described in claim 1, wherein the first sensing element is selected from the group consisting of a proximity switch, a photoelectric switch, or a piezoelectric switch. The semiconductor process device with auxiliary monitoring function according to claim 1, wherein the first signal is a voltage signal. The semiconductor processing device with auxiliary monitoring function according to claim 1, further comprising: a carrying platform pivotally connected to the driving shaft and driven by the driving shaft to perform the reciprocating motion, The device is configured to carry at least one semiconductor wafer; a support member is disposed under the carrier, and after receiving a second signal, is raised from the lower portion of the carrier and protrudes from the surface of the carrier for providing The semiconductor wafer is loaded or removed from the carrying platform, wherein the counter further includes a second input end coupled to the supporting member and the display end for receiving the second signal to generate a return-to-zero information. After receiving the zero return information, the display terminal displays that the number of counts is zero. The semiconductor processing device with the auxiliary monitoring function according to claim 1, further comprising a control unit that stores one of the reciprocating motions by a predetermined number of times and generates a second by decrementing the preset number of times The number of counts. The semiconductor process device with auxiliary monitoring function according to claim 1, wherein the counter further comprises a power supply end. The semiconductor process device with auxiliary monitoring function according to claim 7 , wherein the power supply end is coupled to an independent power source. The semiconductor process device with auxiliary monitoring function according to claim 1, further comprising a recorder for recording the first count number. A semiconductor process device having an auxiliary monitoring function as described in claim 9 wherein the recorder is a photographic recorder.