TW201442804A - Silver-coated nickel particles and method for producing same - Google Patents

Silver-coated nickel particles and method for producing same Download PDF

Info

Publication number
TW201442804A
TW201442804A TW102141748A TW102141748A TW201442804A TW 201442804 A TW201442804 A TW 201442804A TW 102141748 A TW102141748 A TW 102141748A TW 102141748 A TW102141748 A TW 102141748A TW 201442804 A TW201442804 A TW 201442804A
Authority
TW
Taiwan
Prior art keywords
silver
particles
nickel
coated nickel
coated
Prior art date
Application number
TW102141748A
Other languages
Chinese (zh)
Other versions
TWI626098B (en
Inventor
Shinji Aoki
Toshihiro Kohira
Takafumi Sasaki
Hikaru Minowa
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW201442804A publication Critical patent/TW201442804A/en
Application granted granted Critical
Publication of TWI626098B publication Critical patent/TWI626098B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05Metallic powder characterised by the size or surface area of the particles
    • B22F1/052Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06Metallic powder characterised by the shape of the particles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17Metallic particles coated with metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

Each of silver-coated nickel particles according to the present invention is obtained by coating the surface of a core particle, which contains nickel, with silver. The entire surface of each silver-coated nickel particle is provided with a plurality of projections, and thus the surface has a rough shape. The size of each projection is from 0.05 [mu]m to 1 [mu]m (inclusive) when viewed in plan. The silver coverage of the silver-coated nickel particles is 50% or more. It is preferable that the volume cumulative particle diameter (D50) at the cumulative volume of 50% by volume as determined by laser diffraction/scattering particle size distribution measurement is from 0.5 [mu]m to 100 [mu]m (inclusive).

Description

覆銀之鎳粒子及其製造方法 Silver-coated nickel particles and method of producing the same

本發明係關於一種覆銀之鎳粒子及其製造方法。 The present invention relates to a silver-coated nickel particle and a method of producing the same.

為了實現導體間之電性導通,使用含有金屬粉末之導電性膏或導電性接著劑等。作為金屬粉末,使用金或銀等貴金屬、及鎳或銅等賤金屬。貴金屬不易氧化、導電性亦較高,因此係作為導電性粉末較佳之材料,但於經濟方面存在不良情況。因此,提出有如下各種嘗試:藉由於作為廉價之金屬之鎳或銅之表面較薄地覆蓋金或銀,而減少貴金屬之使用並且提高導電性粉末之導電性。 In order to achieve electrical conduction between the conductors, a conductive paste containing a metal powder, a conductive adhesive, or the like is used. As the metal powder, a noble metal such as gold or silver or a base metal such as nickel or copper is used. Since the noble metal is not easily oxidized and has high conductivity, it is preferred as a conductive powder, but it is economically disadvantageous. Therefore, various attempts have been made to reduce the use of precious metals and improve the conductivity of the conductive powder by covering the surface of gold or silver thinly as a metal of inexpensive metal.

例如,提出有於鎳之表面被覆銀之導電性粉末(參照專利文獻1及2)。專利文獻1中,一面攪拌含有包含鎳粉及錯合劑之漿料與銀之錯合物溶液的混合漿料,一面於鎳粉之表面析出銀。銀之析出係利用置換反應。專利文獻2中,使含有鎳粉末及還原劑之溶液A與含有硝酸銀氨錯合物及反應抑制劑之溶液B反應,而於鎳粉末上被覆銀。銀之析出係利用還原反應。 For example, a conductive powder coated with silver on the surface of nickel has been proposed (see Patent Documents 1 and 2). In Patent Document 1, silver is precipitated on the surface of the nickel powder while stirring a mixed slurry containing a solution of a slurry containing nickel powder and a binder and silver. The silver precipitation system utilizes a displacement reaction. In Patent Document 2, a solution A containing nickel powder and a reducing agent is reacted with a solution B containing a silver nitrate ammonia complex and a reaction inhibitor, and silver is coated on the nickel powder. The precipitation of silver utilizes a reduction reaction.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開2009-84634號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-84634

[專利文獻2]日本專利特開2011-144441號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2011-144441

專利文獻1中記載之利用置換反應之銀之析出不易均勻地進行, 結果存在不易提高覆銀之鎳粉之導電性之問題。又,若利用置換反應還原銀,則會因代替還原之銀溶出之鎳而於覆銀層中形成大量細孔,通過該細孔使鎳露出至外部。其結果,隨著時間之經過進行氧化而使粉之導電性降低。 The precipitation of silver by the substitution reaction described in Patent Document 1 is not easily performed uniformly. As a result, there is a problem that it is difficult to improve the conductivity of the silver-coated nickel powder. Further, when the silver is reduced by the displacement reaction, a large number of fine pores are formed in the silver coating layer instead of the nickel eluted by the reduced silver, and the nickel is exposed to the outside through the pores. As a result, oxidation proceeds over time to lower the conductivity of the powder.

專利文獻2中,利用還原反應,以藉由還原析出之銀之表面變得平滑之方式被覆銀,但由於銀之表面變得平滑,故而不易增加覆銀之鎳粒子彼此之接點。其結果,存在不易提高導電性之問題。 In Patent Document 2, silver is coated so that the surface of the precipitated silver is smoothed by the reduction reaction. However, since the surface of the silver is smooth, it is not easy to increase the contact between the silver-coated nickel particles. As a result, there is a problem that it is difficult to improve conductivity.

本發明提供一種於包含鎳之核心粒子之表面被覆銀而成之覆銀之鎳粒子。 The present invention provides a silver-coated nickel particle obtained by coating silver on a surface of a core particle containing nickel.

上述覆銀之鎳粒子係遍佈其整個表面區域形成大量凸部,藉此上述表面呈凹凸形狀。 The silver-coated nickel particles form a large number of convex portions throughout the entire surface region thereof, whereby the surface has an uneven shape.

俯視下之上述凸部之大小為0.05μm以上且1μm以下。 The size of the convex portion in plan view is 0.05 μm or more and 1 μm or less.

上述覆銀之鎳粒子中之銀之被覆率為50%以上。 The coverage of silver in the silver-coated nickel particles is 50% or more.

又,本發明提供一種覆銀之鎳粒子之製造方法作為上述覆銀之鎳粒子之較佳之製造方法, 其係使銀離子與包含鎳之核心粒子於水中接觸而進行置換鍍敷,於該核心粒子之表面析出銀而獲得前驅物粒子,繼而 使上述前驅物粒子、銀離子及銀離子之還原劑於水中接觸,於該前驅物粒子之表面進一步析出銀。 Moreover, the present invention provides a method for producing silver-coated nickel particles as a preferred method for producing the silver-coated nickel particles. The silver ions are exchanged with the core particles containing nickel in water to perform displacement plating, and silver is precipitated on the surface of the core particles to obtain precursor particles, and then the precursor particles are obtained. The precursor particles, silver ions, and silver ion reducing agents are brought into contact with water to further precipitate silver on the surface of the precursor particles.

圖1係實施例1中獲得之覆銀之鎳粒子之掃描式電子顯微鏡圖像。 1 is a scanning electron microscope image of silver-coated nickel particles obtained in Example 1.

圖2係實施例2中獲得之覆銀之鎳粒子之掃描式電子顯微鏡圖像。 2 is a scanning electron microscope image of silver-coated nickel particles obtained in Example 2.

圖3係實施例3中獲得之覆銀之銅鎳粒子之掃描式電子顯微鏡。 3 is a scanning electron microscope of silver-coated copper nickel particles obtained in Example 3.

圖4係比較例1中獲得之覆銀之鎳粒子之掃描式電子顯微鏡圖 像。 Figure 4 is a scanning electron micrograph of silver-coated nickel particles obtained in Comparative Example 1. image.

圖5係比較例2中獲得之覆銀之鎳粒子之掃描式電子顯微鏡圖像。 Fig. 5 is a scanning electron microscope image of silver-coated nickel particles obtained in Comparative Example 2.

以下,對本發明基於其較佳之實施形態進行說明。本發明之覆銀之鎳粒子係以包含銀之層(以下亦稱為「覆銀層」)被覆包含鎳之核心粒子之表面而構成。本說明書中,所謂覆銀之鎳粒子,視上下文有表示各粒子之情況、及表示由粒子之集合體構成之粉體之情況。銀較佳為被覆鎳粒子之整個表面區域。換言之,銀係無遺漏地被覆鎳粒子之表面,鎳較佳為不露出於覆銀之鎳粒子之表面。 Hereinafter, the present invention will be described based on preferred embodiments thereof. The silver-coated nickel particles of the present invention are formed by coating a surface of a core particle containing nickel with a layer containing silver (hereinafter also referred to as "silver-coated layer"). In the present specification, the silver-coated nickel particles have a case where each particle is represented and a powder composed of an aggregate of particles is used depending on the context. Silver is preferably the entire surface area of the coated nickel particles. In other words, the silver layer is coated with the surface of the nickel particles without any omission, and the nickel is preferably not exposed on the surface of the silver-coated nickel particles.

包含鎳之核心粒子實質上僅由鎳構成,或包含包括鎳之金屬。於核心粒子包含包括鎳之金屬之情形時,於核心粒子中鎳所占之比率較佳為3質量%以上且未達100質量%,鎳以外之金屬元素之比率較佳為超過0質量%且為97質量%以下。若鎳之比率未達3質量%,則有不易於覆銀之鎳粒子表面形成凸部之情況。作為鎳以外之金屬元素,例如可列舉銅、錫、鋅、鐵、鉻、鈀、金、銀等元素。該等金屬元素可使用1種或2種以上。再者,對核心粒子容許於其製造過程或保存中不可避免地少量混入氧等非金屬元素。本說明書中,為了方便起見而將於包含鎳之核心粒子、及包含鎳之金屬之核心粒子之表面覆蓋銀而成之粒子兩者總稱為「覆銀之鎳粒子」。 The core particles comprising nickel consist essentially of only nickel or a metal comprising nickel. In the case where the core particle contains a metal including nickel, the ratio of nickel in the core particle is preferably 3% by mass or more and less than 100% by mass, and the ratio of the metal element other than nickel is preferably more than 0% by mass. It is 97% by mass or less. When the ratio of nickel is less than 3% by mass, there is a case where a convex portion is formed on the surface of the nickel particles which are not easily silver-coated. Examples of the metal element other than nickel include elements such as copper, tin, zinc, iron, chromium, palladium, gold, and silver. These metal elements can be used alone or in combination of two or more. Further, the core particles are inevitably mixed with a small amount of non-metallic elements such as oxygen in the manufacturing process or storage. In the present specification, for the sake of convenience, particles in which silver-containing core particles and core particles containing nickel are coated with silver are collectively referred to as "silver-coated nickel particles".

對包含鎳之核心粒子之形狀並無特別限制。例如,可使用呈球形、多面體、扁平體(薄片)、樹枝狀結晶等形狀者作為核心粒子。再者,被覆核心粒子之表面之銀由於其被覆厚度較小,故而覆銀之鎳粒子之形狀與核心粒子之形狀實質上相同。 There is no particular limitation on the shape of the core particles containing nickel. For example, a shape of a spherical shape, a polyhedron, a flat body (flake), a dendritic crystal, or the like can be used as the core particle. Further, since the silver of the surface of the coated core particle has a small coating thickness, the shape of the silver-coated nickel particle is substantially the same as the shape of the core particle.

本發明之覆銀之鎳粒子之特徵之一在於被覆包含鎳之核心粒子之表面之覆銀層。詳細而言,該覆銀層包含微小之銀粒子之凝集體。 藉由利用此種結構之覆銀層被覆包含鎳之核心粒子之表面,而極力抑制鎳之氧化。其結果,即便於長期保存後,本發明之覆銀之鎳粒子亦可極力抑制電阻之降低。與此相對,於認為覆銀層具有大量細孔之專利文獻1中所記載之覆銀之鎳粒子中,由於包含鎳之核心粒子之表面容易通過細孔與外界接觸,故而存在鎳因長期保存而氧化之傾向,由此導致電阻容易降低。對形成包含微小之銀粒子之凝集體之覆銀層的方法於下文敍述。 One of the features of the silver-coated nickel particles of the present invention resides in coating a silver-clad layer comprising the surface of the core particles of nickel. In detail, the silver coating layer contains agglomerates of tiny silver particles. Oxidation of nickel is suppressed as much as possible by coating the surface of the core particles containing nickel with the silver-clad layer of such a structure. As a result, even after long-term storage, the silver-coated nickel particles of the present invention can suppress the decrease in electric resistance as much as possible. On the other hand, in the silver-coated nickel particles described in Patent Document 1 in which the silver-coated layer has a large number of pores, since the surface of the core particle containing nickel is easily contacted with the outside through the pores, nickel is present for long-term storage. The tendency to oxidize, thereby causing the resistance to be easily lowered. A method of forming a silver-clad layer containing an aggregate of minute silver particles will be described below.

本發明之覆銀之鎳粒子之特徵之一亦在於粒子表面之形狀。詳細而言,本發明之覆銀之鎳粒子於其表面形成有大量凸部。其結果,本發明之覆銀之鎳粒子之表面具有由凸部及位於凸部間之凹部所致的凹凸形狀。由於具有此種凹凸形狀,故而本發明之覆銀之鎳粒子與表面平滑之覆銀之鎳粒子、例如專利文獻2中記載者相比,粒子彼此之接觸面積變大。由此本發明之覆銀之鎳粒子成為粒子間之導電性較高者。尤其是鎳為與用於導電性粒子之其他金屬、例如銅相比較硬之金屬,故而即便施加壓力亦不易變形,因此表面為凹凸形狀對粒子間之導電性之提高極為有利。 One of the characteristics of the silver-coated nickel particles of the present invention is also the shape of the surface of the particles. In detail, the silver-coated nickel particles of the present invention have a large number of convex portions formed on the surface thereof. As a result, the surface of the silver-coated nickel particles of the present invention has a concavo-convex shape caused by the convex portion and the concave portion located between the convex portions. Because of such a concavo-convex shape, the silver-coated nickel particles of the present invention have a larger contact area with the particles than the silver-coated nickel particles having a smooth surface, for example, as described in Patent Document 2. Thus, the silver-coated nickel particles of the present invention have higher conductivity between particles. In particular, since nickel is a hard metal compared with other metals used for conductive particles, for example, copper, it is not easily deformed even when pressure is applied. Therefore, the surface has an uneven shape and is excellent in conductivity between particles.

上述凸部之大小係對覆銀之鎳粒子間之導電性之提高造成影響的要素。就該觀點而言,俯視下之各凸部之大小平均較佳為0.05μm以上且1μm以下,進而較佳為0.1μm以上且0.8μm以下,進而更佳為0.2μm以上且0.5μm以下。藉由形成此種大小之凸部,可容易地增大粒子彼此之接觸面積。 The size of the convex portion is an element that affects the improvement of the electrical conductivity between the silver-coated nickel particles. From this point of view, the size of each convex portion in plan view is preferably 0.05 μm or more and 1 μm or less, more preferably 0.1 μm or more and 0.8 μm or less, and still more preferably 0.2 μm or more and 0.5 μm or less. By forming the convex portions of such a size, the contact area of the particles with each other can be easily increased.

俯視下之凸部之大小係藉由利用電子顯微鏡觀察覆銀之鎳粒子表面並對觀察圖像進行圖像解析而求出。圖像解析例如可使用掃描式電子顯微鏡。具體而言,使用其測量存在於包含鎳之核心粒子之表面之銀粒子於俯視下之面積,算出與其面積相同之面積之圓之直徑。將該直徑之值設為凸部之大小。 The size of the convex portion in plan view was obtained by observing the surface of the silver-coated nickel particles with an electron microscope and performing image analysis on the observed image. For image analysis, for example, a scanning electron microscope can be used. Specifically, it is used to measure the area of the silver particles present on the surface of the core particles containing nickel in a plan view, and to calculate the diameter of a circle having the same area as the area. The value of this diameter is set to the size of the convex portion.

俯視下之凸部之大小係如上所述,俯視下之凸部之形狀例如可為大致圓形或多邊形等各向異性較小之形狀。藉由形成具有該等形狀之凸部,可容易地增大粒子彼此之接觸面積。所謂各向異性較小,係指長徑/短徑之值為5以下之形狀。 The size of the convex portion in plan view is as described above, and the shape of the convex portion in plan view may be, for example, a shape having a small anisotropy such as a substantially circular shape or a polygonal shape. By forming the convex portions having the above shapes, the contact area of the particles with each other can be easily increased. The term "anisotropy is small" means a shape having a long diameter/minor diameter of 5 or less.

凸部之大小亦取決於覆銀之鎳粒子之大小。就該觀點而言,覆銀之鎳粒子之粒徑較佳為0.05μm以上且100μm以下,進而較佳為0.5μm以上且50μm以下,進而更佳為1μm以上且20μm以下。藉由將覆銀之鎳粒子之粒徑設定為該範圍,可容易地增大粒子彼此之接觸面積。再者,於覆銀之鎳粒子中,被覆包含鎳之核心粒子之表面之銀由於其被覆厚度較小,故而核心粒子之粒徑與覆銀之鎳粒子之形狀實質上相同。 The size of the protrusions also depends on the size of the silver-coated nickel particles. From this viewpoint, the particle diameter of the silver-coated nickel particles is preferably 0.05 μm or more and 100 μm or less, more preferably 0.5 μm or more and 50 μm or less, and still more preferably 1 μm or more and 20 μm or less. By setting the particle diameter of the silver-coated nickel particles to the range, the contact area of the particles with each other can be easily increased. Further, in the silver-coated nickel particles, since the silver covering the surface of the core particles containing nickel has a small coating thickness, the particle diameter of the core particles is substantially the same as the shape of the silver-coated nickel particles.

覆銀之鎳粒子之粒徑可藉由雷射繞射散射式粒度分佈測定法測定。將利用該方法測得之累積體積50體積%之體積累積粒徑D50設為上述粒徑。 The particle size of the silver-coated nickel particles can be determined by laser diffraction scattering particle size distribution measurement. The volume cumulative particle diameter D 50 of 50 % by volume of the cumulative volume measured by this method was set as the above particle diameter.

於著眼於一個粒子之情形時,存在於該粒子中之凸部之數量較佳為於每1μm2中為2個以上且500個以下,進而較佳為5個以上且500個以下,進而更佳為10個以上且500個以下。藉由如此設定凸部之數量,可容易地增大粒子彼此之接觸面積。 When focusing on one particle, the number of convex portions present in the particle is preferably 2 or more and 500 or less per 1 μm 2 , more preferably 5 or more and 500 or less, and furthermore It is preferably 10 or more and 500 or less. By setting the number of the convex portions in this way, the contact area of the particles with each other can be easily increased.

被覆核心粒子之表面之覆銀層之被覆率為50%以上,較佳為60%以上,進而較佳為70%以上。最佳為覆銀層無遺漏地被覆核心粒子之整個表面區域(即,被覆率為100%)。被覆率例如係使用掃描式電子顯微鏡對覆銀之鎳粒子進行以銀及構成核心粒子之元素為對象的元素映射(mapping),求出銀所占之面積及構成核心粒子之元素所占之面積。基於該等面積,根據{銀所占之面積/(銀所占之面積+構成核心粒子之元素所占之面積)}×100算出被覆率。或者,使用掃描式電子顯微鏡對覆銀之鎳粒子基於反射電子圖像之對比度之差異求出銀所占之 面積及構成核心粒子之元素所占之面積。基於該等面積,由{銀所占之面積/(銀所占之面積+構成核心粒子之元素所占之面積)}×100算出被覆率。反射電子圖像之對比度中,原子量較大之元素係明亮地呈現,較小之元素係較暗地呈現。例如,於核心粒子使用鎳之情形時,銀係明亮地呈現,鎳係較暗地呈現。 The coverage of the silver-coated layer on the surface of the coated core particle is 50% or more, preferably 60% or more, and more preferably 70% or more. Preferably, the silver-coated layer completely covers the entire surface area of the core particles (i.e., the coverage is 100%). For example, a silver-coated nickel particle is subjected to elemental mapping of silver and an element constituting the core particle using a scanning electron microscope, and the area occupied by the silver and the area constituting the element constituting the core particle are determined. . Based on the area, the coverage ratio is calculated based on the area occupied by {silver/(the area occupied by silver + the area occupied by the elements constituting the core particles)}×100. Or, using a scanning electron microscope, the silver-coated nickel particles are determined based on the difference in contrast of the reflected electron image. The area and area of the elements that make up the core particles. Based on the areas, the coverage ratio is calculated from the area occupied by {silver/(area occupied by silver + area occupied by elements constituting the core particles)}×100. Among the contrasts of the reflected electron image, elements with a large atomic weight are brightly displayed, and smaller elements are darker. For example, in the case where nickel is used for the core particles, the silver is brightly present and the nickel is darker.

關於凸部,至少其表面包含銀。凸部較佳為其整體實質上由銀構成。藉由凸部之整體實質上由銀構成,可提高粒子間之導電性。例如可藉由對覆銀之鎳粒子之剖面進行元素分析而確認凸部之整體實質上由銀構成。於藉由該元素分析,凸部中之銀之比率為80質量%以上之情形時,可謂凸部實質上由銀形成。 Regarding the convex portion, at least the surface thereof contains silver. Preferably, the convex portion is substantially entirely composed of silver. Since the entirety of the convex portion is substantially made of silver, the conductivity between the particles can be improved. For example, elemental analysis of the cross section of the silver-coated nickel particles can be performed to confirm that the entire convex portion is substantially composed of silver. When the ratio of the silver in the convex portion is 80% by mass or more by the elemental analysis, the convex portion is substantially formed of silver.

於本發明之覆銀之鎳粒子中,銀所占之比率較佳為0.5質量%以上且50質量%以下,進而較佳為5質量%以上且20質量%以下。藉由以該範圍之比率含有銀,本發明之覆銀之鎳粒子可實現經濟性與導電性之平衡。覆銀之鎳粒子中銀所占之比率例如可使用酸等溶解覆銀之鎳粒子,使用該溶液,藉由ICP(Inductively Coupled Plasma,感應耦合電漿)發射光譜分析法進行測定。 In the silver-coated nickel particles of the present invention, the ratio of silver is preferably 0.5% by mass or more and 50% by mass or less, and more preferably 5% by mass or more and 20% by mass or less. By containing silver in a ratio of this range, the silver-coated nickel particles of the present invention can achieve a balance between economy and conductivity. The ratio of silver in the silver-coated nickel particles can be measured by, for example, ICP (Inductively Coupled Plasma) emission spectrometry using an acid or the like to dissolve silver-coated nickel particles.

本發明之覆銀之鎳粒子藉由具有如上所述之凸部,而成為粒子間之導電性較高者。導電性根據覆銀之鎳粒子之粒徑、或銀之含量及被覆率等而不同。例如,於覆銀之鎳粒子之粒徑為6~8μm、銀之含量為10~11質量%、被覆率為50%以上之情形時,表現出102kgf/cm2壓力下之壓粉電阻較佳為5.0×10-5Ω.cm以上且5.0×10-3Ω.cm以下、進而較佳為5.0×10-5Ω.cm以上且1.0×10-3Ω.cm以下之高導電性。與此相對,僅混合核心粒子與銀粒子者由於銀粒子與核心粒子間之密接性較覆銀之鎳粒子差,故而接觸電阻增大。由此,若僅混合核心粒子與銀粒子,則電阻提高。 The silver-coated nickel particles of the present invention have a high electrical conductivity between particles by having the convex portions as described above. The conductivity differs depending on the particle size of the silver-coated nickel particles, the content of silver, the coverage, and the like. For example, when the particle size of the silver-coated nickel particles is 6 to 8 μm, the content of silver is 10 to 11% by mass, and the coverage is 50% or more, it is preferable that the powder resistance at a pressure of 102 kgf/cm 2 is good. It is 5.0×10 -5 Ω. Above cm and 5.0 × 10 -3 Ω. Below cm, and further preferably 5.0 × 10 -5 Ω. Above cm and 1.0 × 10 -3 Ω. High conductivity below cm. On the other hand, in the case where only the core particles and the silver particles are mixed, since the adhesion between the silver particles and the core particles is inferior to that of the silver particles, the contact resistance is increased. Therefore, if only the core particles and the silver particles are mixed, the electric resistance is improved.

上述壓粉電阻例如可使用Mitsubishi Chemical Analytech製造之粉 體電阻測定系統MCP-PD51依據四端子四探針法進行測定。 The above-mentioned powder resistor can be, for example, a powder manufactured by Mitsubishi Chemical Analytech. The bulk resistance measuring system MCP-PD51 was measured in accordance with the four-terminal four-probe method.

具有上述各種特徵之本發明之覆銀之鎳粒子較佳為藉由依序組合置換鍍敷法與還原鍍敷法的銀被覆方法而製造。於首先進行之置換鍍敷法中,使銀離子與包含鎳之核心粒子於水中接觸而進行置換鍍敷,於該核心粒子之表面析出銀而獲得前驅物粒子(步驟1)。於其次進行之還原鍍敷法中,使上述前驅物粒子、銀離子及銀離子之還原劑於水中接觸,於該前驅物粒子之表面進一步析出銀(步驟2)。以下,對各步驟進行說明。 The silver-coated nickel particles of the present invention having various characteristics described above are preferably produced by a silver coating method in which a displacement plating method and a reduction plating method are sequentially combined. In the first displacement plating method, silver ions are exchanged with gold-containing core particles in water to perform displacement plating, and silver is precipitated on the surface of the core particles to obtain precursor particles (step 1). In the second reduction plating method, the precursor particles, silver ions, and silver ion reducing agents are brought into contact with water to further precipitate silver on the surface of the precursor particles (step 2). Hereinafter, each step will be described.

步驟1中使用之包含鎳之核心粒子可利用各種方法進行製造。例如,於核心粒子包含鎳之情形時,該核心粒子可藉由使用各種還原劑,以濕式還原鎳化合物而獲得核心粒子。或者,可使用鎳之熔態金屬,藉由霧化法獲得核心粒子。如此獲得之核心粒子之較佳之粒徑或形狀係如先前所述。使藉由該等方法獲得之核心粒子於水中與銀離子接觸。 The core particles containing nickel used in the step 1 can be produced by various methods. For example, in the case where the core particles contain nickel, the core particles can obtain the core particles by wet reduction of the nickel compound by using various reducing agents. Alternatively, the core particles may be obtained by atomization using a molten metal of nickel. The preferred particle size or shape of the core particles thus obtained is as previously described. The core particles obtained by the methods are brought into contact with silver ions in water.

銀離子係由成為銀源之銀化合物產生。作為銀化合物,例如可使用硝酸銀等水溶性銀化合物。就可於核心粒子之表面析出理想量之銀之觀點及量產性之觀點而言,水中之銀離子之濃度較佳為設定為0.01mol/L以上且5mol/L以下,尤佳為設定為0.05mol/L以上且0.5mol/L以下。 Silver ions are produced from a silver compound that becomes a silver source. As the silver compound, for example, a water-soluble silver compound such as silver nitrate can be used. The concentration of silver ions in water is preferably set to be 0.01 mol/L or more and 5 mol/L or less, from the viewpoint of depositing a desired amount of silver on the surface of the core particles, and is preferably set to be 0.05 mol/L or more and 0.5 mol/L or less.

另一方面,同樣就可於核心粒子之表面析出理想量之銀之觀點及量產性之觀點而言,水中之核心粒子之量較佳為設為10g/L以上且1000g/L以下,尤佳為設為50g/L以上且500g/L以下。 On the other hand, from the viewpoint of the fact that a desired amount of silver can be precipitated on the surface of the core particle, the amount of the core particle in water is preferably 10 g/L or more and 1000 g/L or less. It is preferably set to 50 g/L or more and 500 g/L or less.

核心粒子與銀離子之添加順序並無特別限制。例如,可將核心粒子與銀離子同時添加至水中。就控制利用置換鍍敷析出銀之容易度之觀點而言,較佳為使核心粒子預先分散於水中而製備漿料,於該漿料中添加成為銀源之銀化合物。於該情形時,漿料可為20℃~25℃之 常溫,或者亦可為其以外之0℃~80℃之溫度範圍。又,亦可於添加銀化合物之前,預先於漿料中添加乙二胺四乙酸、三乙二胺、亞胺基二乙酸、檸檬酸或酒石酸、或該等之鹽等錯合劑而控制銀之還原。 The order in which the core particles and the silver ions are added is not particularly limited. For example, core particles can be added to water simultaneously with silver ions. From the viewpoint of controlling the easiness of depositing silver by displacement plating, it is preferred to prepare a slurry by dispersing the core particles in water in advance, and adding a silver compound which is a silver source to the slurry. In this case, the slurry can be 20 ° C ~ 25 ° C Normal temperature, or it can be outside the temperature range of 0 °C ~ 80 °C. Further, before the addition of the silver compound, silver or a mixture of ethylenediaminetetraacetic acid, triethylenediamine, iminodiacetic acid, citric acid or tartaric acid, or a salt thereof may be added to the slurry to control the silver. reduction.

銀化合物之添加較佳為以水溶液之狀態進行。該水溶液可一次添加至漿料中,或者亦可持續特定時間連續或不連續地添加。就容易控制置換鍍敷之反應之方面而言,銀化合物之水溶液較佳為持續特定時間添加至漿料中。 The addition of the silver compound is preferably carried out in the form of an aqueous solution. The aqueous solution may be added to the slurry at one time or may be added continuously or discontinuously for a specific period of time. In terms of the ease of controlling the reaction of the displacement plating, the aqueous solution of the silver compound is preferably added to the slurry for a specific period of time.

藉由置換鍍敷於核心粒子之表面析出銀而獲得前驅物粒子。就可形成具有目標凸部且緻密之覆銀層之方面而言,前驅物粒子中之銀之析出量較佳為設為最終獲得之覆銀之鎳粒子中之銀量之0.1~50質量%、尤佳為設為1~20質量%。 The precursor particles are obtained by depositing silver on the surface of the core particles by displacement plating. In terms of forming a dense silver-clad layer having a target convex portion, the amount of silver precipitated in the precursor particles is preferably set to 0.1 to 50% by mass of the amount of silver in the finally obtained silver-coated nickel particles. It is preferably set to 1 to 20% by mass.

步驟2中,於包含步驟1中獲得之前驅物粒子之漿料中添加銀離子及銀離子之還原劑。於該情形時,可於暫且將步驟1中獲得之前驅物粒子固液分離後分散於水而形成漿料,或者亦可將步驟1中獲得之前驅物粒子之漿料直接供至步驟2。於後者之情形時,步驟1中添加之銀離子可殘存於漿料中,或者亦可不殘存。 In the step 2, a reducing agent of silver ions and silver ions is added to the slurry containing the precursor particles obtained in the step 1. In this case, the precursor particles may be obtained by solid-liquid separation in step 1 and then dispersed in water to form a slurry, or the slurry obtained in step 1 may be directly supplied to step 2. In the latter case, the silver ions added in the step 1 may remain in the slurry or may not remain.

於步驟2中添加之銀離子係與步驟1同樣地由水溶性銀化合物產生。銀化合物較佳為以水溶液之狀態添加至漿料中。銀水溶液中之銀離子之濃度較佳為0.01mol/L以上且10mol/L以下,進而較佳為0.1mol/L以上且1.0mol/L以下。就可形成具有目標凸部且緻密之覆銀層之方面而言,相對於包含10g/L以上且1000g/L以下、尤其是50g/L以上且500g/L以下之前驅物粒子之上述漿料中之該前驅物粒子100質量份,較佳為添加1質量份以上且50質量份以下、尤其是5質量份以上且30質量份以下具有該範圍之濃度之銀水溶液。 The silver ion added in the step 2 is produced from the water-soluble silver compound in the same manner as in the step 1. The silver compound is preferably added to the slurry in the form of an aqueous solution. The concentration of the silver ions in the aqueous silver solution is preferably 0.01 mol/L or more and 10 mol/L or less, and more preferably 0.1 mol/L or more and 1.0 mol/L or less. In terms of forming a dense silver-clad layer having a target convex portion, the above-mentioned slurry containing the precursor particles of 10 g/L or more and 1000 g/L or less, particularly 50 g/L or more and 500 g/L or less 100 parts by mass of the precursor particles are preferably added in an amount of 1 part by mass or more and 50 parts by mass or less, particularly 5 parts by mass or more and 30 parts by mass or less of a silver aqueous solution having a concentration in the range.

作為於步驟2中添加之還原劑,使用具有可同時進行銀之置換鍍敷及還原鍍敷之程度的還原力者較為有利。藉由使用此種還原劑,可 順利形成具有目標凸部且緻密之覆銀層。若使用還原性較強之還原劑,則存在銀單獨析出而變得不易被覆核心粒子之不良情況。另一方面,若使用還原性較弱之還原劑,則存在變得不易產生利用還原劑之銀之還原反應,取而代之優先產生置換反應而變得不易均勻地被覆核心粒子的不良情況。就以上觀點而言,作為還原劑,較佳為還原劑之水溶液之標準電極電位顯示-1.5~0.8V(NHE,Normal Hydrogen Electrode,標準氫電極)者。具體而言,有甲酸、草酸、L-抗壞血酸、異抗壞血酸、甲醛、硫代硫酸鈉、肼、硼氫化鈉等。該等有機還原劑可單獨使用1種,或者亦可組合2種以上而使用。其中,較佳為使用L-抗壞血酸。 As the reducing agent added in the step 2, it is advantageous to use a reducing power having a degree of simultaneous silver plating and reduction plating. By using such a reducing agent, A silver-clad layer having a target convex portion and a dense silver layer is formed smoothly. When a reducing agent having a relatively high reductive property is used, there is a problem that silver is precipitated alone and it is difficult to coat the core particles. On the other hand, when a reducing agent having a weak reducing property is used, there is a problem that it is less likely to cause a reduction reaction of silver by a reducing agent, and a substitution reaction is preferentially generated, and it is difficult to uniformly coat the core particles. From the above viewpoints, as the reducing agent, it is preferred that the standard electrode potential of the aqueous solution of the reducing agent is -1.5 to 0.8 V (NHE, Normal Hydrogen Electrode, standard hydrogen electrode). Specifically, there are formic acid, oxalic acid, L-ascorbic acid, isoascorbic acid, formaldehyde, sodium thiosulfate, hydrazine, sodium borohydride and the like. These organic reducing agents may be used alone or in combination of two or more. Among them, L-ascorbic acid is preferably used.

就可形成具有目標凸部且緻密之覆銀層之方面而言,還原劑之添加量相對於添加之銀溶液中之銀離子,較佳為設為0.5~5.0當量,尤佳為設為1.0~2.0當量。 In terms of forming a dense silver-clad layer having a target convex portion, the amount of the reducing agent added is preferably 0.5 to 5.0 equivalents, more preferably 1.0, with respect to the silver ions in the added silver solution. ~2.0 equivalents.

於包含前驅物粒子之漿料中添加還原劑及銀離子時之順序並無特別限制。就控制銀離子之還原而形成具有凸部且緻密之覆銀層之觀點而言,較佳為於漿料中添加還原劑後添加銀離子。成為銀源之銀化合物可一次添加至漿料中,或者亦可持續特定時間連續或不連續地添加。就容易控制銀離子之還原之方面而言,銀化合物較佳為以其水溶液之狀態持續特定時間添加至漿料中。 The order in which the reducing agent and the silver ions are added to the slurry containing the precursor particles is not particularly limited. From the viewpoint of controlling the reduction of silver ions to form a dense silver-clad layer having convex portions, it is preferred to add silver ions after adding a reducing agent to the slurry. The silver compound which becomes a silver source may be added to the slurry at a time, or may be continuously or discontinuously added for a specific period of time. In terms of easy control of the reduction of silver ions, the silver compound is preferably added to the slurry in a state of its aqueous solution for a specific period of time.

於步驟2中,可使漿料成為20℃~25℃之常溫之狀態,或者亦可於其以外之0~80℃之溫度範圍內進行加熱。就充分地進行銀離子之還原反應之觀點而言,較佳為於添加還原劑後,持續特定時間繼續攪拌漿料。 In the step 2, the slurry may be brought to a normal temperature of 20 ° C to 25 ° C, or may be heated in a temperature range of 0 to 80 ° C other than the slurry. From the viewpoint of sufficiently performing the reduction reaction of silver ions, it is preferred to continue stirring the slurry for a certain period of time after the addition of the reducing agent.

於步驟2中,可藉由適當調整反應時間或銀離子之濃度而獲得具有目標凸部之覆銀之鎳粒子。 In step 2, silver-coated nickel particles having a target convex portion can be obtained by appropriately adjusting the reaction time or the concentration of silver ions.

如此獲得之覆銀之鎳粒子可以包含其之導電性組合物之狀態較 佳地使用。例如,可將覆銀之鎳粒子與媒劑及玻璃料等混合而形成導電膏。或者,可將覆銀之銅粉與有機溶劑等混合而形成墨水。藉由將如此獲得之導電膏或墨水施加於適用對象物之表面,可獲得具有所需圖案之導電性膜。 The silver-coated nickel particles thus obtained may contain the state of the conductive composition thereof. Good to use. For example, silver-coated nickel particles may be mixed with a vehicle, a glass frit, or the like to form a conductive paste. Alternatively, the silver-coated copper powder may be mixed with an organic solvent or the like to form an ink. By applying the conductive paste or ink thus obtained to the surface of the applicable object, a conductive film having a desired pattern can be obtained.

[實施例] [Examples]

以下,藉由實施例進一步詳細地說明本發明。但本發明之範圍並不限制於該實施例。 Hereinafter, the present invention will be described in further detail by way of examples. However, the scope of the invention is not limited to the embodiment.

[實施例1] [Example 1] (1)第1步驟 (1) Step 1

於加熱至40℃之1.5L之純水中投入300g之鎳粉,製成漿料。該鎳粉係使用累積體積50體積%之體積累積粒徑D50=7μm者。於其中添加60g之硫酸,進而進行攪拌、酸洗。繼而,藉由利用純水之傾析法進行鎳粉之清洗,不進行乾燥而保持於水中。 300 g of nickel powder was placed in 1.5 L of pure water heated to 40 ° C to prepare a slurry. This nickel powder was a volume cumulative particle diameter D 50 = 7 μm using a cumulative volume of 50% by volume. 60 g of sulfuric acid was added thereto, followed by stirring and pickling. Then, the nickel powder is washed by a decantation method using pure water, and is kept in water without drying.

於該鎳粉中添加加熱至40℃之1.5L之純水,一面進行攪拌一面添加乙二胺四乙酸二鈉12.8g並使之溶解。繼而,添加20g之檸檬酸並使之溶解。進而,於該漿料中歷時1分鐘連續添加0.4mol/L之硝酸銀水溶液24mL,進行置換鍍敷,於鎳粒子之表面析出銀而獲得前驅物粒子。 To the nickel powder, 1.5 L of pure water heated to 40 ° C was added, and 12.8 g of disodium edetate was added and dissolved while stirring. Then, 20 g of citric acid was added and dissolved. Further, 24 mL of a 0.4 mol/L silver nitrate aqueous solution was continuously added to the slurry for 1 minute to carry out displacement plating, and silver was precipitated on the surface of the nickel particles to obtain precursor particles.

(2)第2步驟 (2) Step 2

將作為還原劑之L-抗壞血酸添加至漿料中並使之溶解。添加量係設為相對於銀離子之還原為1.15當量。進而,歷時29分鐘連續添加0.4mol/L之硝酸銀水溶液696mL。藉此,於前驅物粒子之表面進一步析出銀,獲得目標之覆銀之鎳粒子。將所獲得之覆銀之鎳粒子之掃描式電子顯微鏡圖像示於圖1。所獲得之粒子中銀所占之比率為10.7質量%。又,對所獲得之粒子之剖面進行元素分析,結果確認到凸部僅由銀形成。 L-ascorbic acid as a reducing agent is added to the slurry and dissolved. The amount added was set to be 1.15 equivalents with respect to the reduction of silver ions. Further, 696 mL of a 0.4 mol/L silver nitrate aqueous solution was continuously added over 29 minutes. Thereby, silver is further precipitated on the surface of the precursor particles to obtain the target silver-coated nickel particles. A scanning electron microscope image of the obtained silver-coated nickel particles is shown in Fig. 1. The ratio of silver in the obtained particles was 10.7% by mass. Further, elemental analysis of the cross section of the obtained particles revealed that the convex portion was formed only of silver.

[實施例2] [Embodiment 2]

將鎳粒子之粒徑變更為D50=21μm,除此以外,進行與實施例1相同之步驟,獲得覆銀之鎳粒子。將所獲得之覆銀之鎳粒子之掃描式電子顯微鏡圖像示於圖2。 Silver-coated nickel particles were obtained by the same procedure as in Example 1 except that the particle diameter of the nickel particles was changed to D 50 = 21 μm. A scanning electron microscope image of the obtained silver-coated nickel particles is shown in Fig. 2 .

[實施例3] [Example 3]

使用D50為27μm且鎳含量為10.8質量%之包含銅鎳合金之粒子作為核心粒子。除此以外,進行與實施例1相同之步驟,獲得覆銀之銅鎳粒子。將所獲得之覆銀之銅鎳粒子之掃描式電子顯微鏡圖像示於圖3。 As the core particle, a particle containing a copper-nickel alloy having a D 50 of 27 μm and a nickel content of 10.8 mass% was used. Except for this, the same procedure as in Example 1 was carried out to obtain silver-coated copper-nickel particles. A scanning electron microscope image of the obtained silver-coated copper-nickel particles is shown in Fig. 3 .

[比較例1] [Comparative Example 1]

本比較例係未進行實施例1之第1步驟即置換反應而未製造前驅物粒子的例子。即,實施例1中,於添加硝酸銀之前添加還原劑。除此以外,進行與實施例1相同之步驟,獲得覆銀之鎳粒子。將所獲得之覆銀之鎳粒子之掃描式電子顯微鏡圖像示於圖4。 This comparative example is an example in which the substitution reaction was not carried out in the first step of the first embodiment, and the precursor particles were not produced. That is, in Example 1, a reducing agent was added before the addition of silver nitrate. Except for this, the same procedure as in Example 1 was carried out to obtain silver-coated nickel particles. A scanning electron microscope image of the obtained silver-coated nickel particles is shown in Fig. 4 .

[比較例2] [Comparative Example 2]

本比較例相當於專利文獻2(日本專利特開2011-144441號公報)之實施例1。 This comparative example corresponds to Example 1 of Patent Document 2 (Japanese Laid-Open Patent Publication No. 2011-144441).

於0.5L之燒杯中添加0.28L之純水,投入D50=21μm之鎳粉,並進行攪拌。於其中添加3.6mL之濃硝酸,進而進行攪拌、酸洗。繼而,藉由利用純水之傾析法進行鎳粉之清洗,不進行乾燥而保持於水中。 0.28 L of pure water was added to a 0.5 L beaker, and nickel powder of D 50 = 21 μm was charged and stirred. 3.6 mL of concentrated nitric acid was added thereto, followed by stirring and pickling. Then, the nickel powder is washed by a decantation method using pure water, and is kept in water without drying.

於該鎳粉末中添加0.2L之純水、36mL之氨水、及2.1g之肼一水合物,進行攪拌而製備溶液(A)。 0.2 L of pure water, 36 mL of aqueous ammonia, and 2.1 g of hydrazine monohydrate were added to the nickel powder, and the mixture was stirred to prepare a solution (A).

與溶液(A)另外地於26mL之純水中添加9.45g之硝酸銀、及0.1g之反應抑制劑(BYK Chemie Japan股份有限公司製造之Disperbyk-111)、72mL之氨水,進行攪拌而製備溶液(B)。 In addition to solution (A), 9.45 g of silver nitrate, 0.1 g of a reaction inhibitor (Disperbyk-111 manufactured by BYK Chemie Japan Co., Ltd.), and 72 mL of ammonia water were added to 26 mL of pure water, followed by stirring to prepare a solution ( B).

一面攪拌溶液(A)一面向溶液(A)中花10分鐘滴加溶液(B)。其後,利用Jet Ajiter持續攪拌15分鐘後,去除上清液,其後藉由傾析法清洗覆銀之鎳粒子,進行過濾脫水。繼而,於60℃下進行15小時之乾燥,獲得目標之覆銀之鎳粒子。將所獲得之覆銀之鎳粒子之掃描式電子顯微鏡圖像示於圖5。於所獲得之粒子中銀所占之比率為10.1質量%。 The solution (B) was added dropwise while stirring the solution (A) to the solution (A) for 10 minutes. Thereafter, the mixture was continuously stirred by Jet Ajiter for 15 minutes, and then the supernatant was removed, and then the silver-coated nickel particles were washed by decantation to carry out filtration and dehydration. Then, drying was carried out at 60 ° C for 15 hours to obtain target silver-coated nickel particles. A scanning electron microscope image of the obtained silver-coated nickel particles is shown in Fig. 5 . The ratio of silver in the obtained particles was 10.1% by mass.

[評價] [Evaluation]

針對實施例及比較例中獲得之覆銀之鎳粒子,利用上述之方法測定俯視下之凸部之大小及形狀。又,測定覆銀之鎳粒子之粒徑D50。進而,測定銀之被覆率及壓粉電阻。將該等結果示於以下表1。 With respect to the silver-coated nickel particles obtained in the examples and the comparative examples, the size and shape of the convex portions in plan view were measured by the above method. Further, the particle diameter D 50 of the silver-coated nickel particles was measured. Further, the coverage of silver and the powder resistance were measured. These results are shown in Table 1 below.

根據表1所示之結果可知,各實施例之覆銀之鎳粒子(本發明品)與比較例1之覆銀之鎳粒子相比壓粉電阻較低。尤其是由實施例1與比較例1之對比可知,即便粒徑為相同程度且凸部之大小為相同程度,於被覆率較低之比較例1中,壓粉電阻亦變高。又,由實施例2與比較例2之對比可知,即便覆銀層之被覆率較高,未於覆銀層形成凹凸形狀之比較例2中,壓粉電阻亦變高。 From the results shown in Table 1, it was found that the silver-coated nickel particles (the present invention) of each of the examples had lower powder resistance than the silver-coated nickel particles of Comparative Example 1. In particular, in comparison with the first embodiment and the comparative example 1, it is understood that even in the comparative example 1 in which the coating ratio is low, the powder resistance is high even when the particle diameter is the same and the size of the convex portion is the same. Moreover, as compared with the comparison between the second embodiment and the comparative example 2, in the comparative example 2 in which the silver-clad layer was not formed in the uneven shape, the powder-pressing resistance was high.

[產業上之可利用性] [Industrial availability]

本發明之覆銀之鎳粒子係粒子間之電性導通較高者。 The silver-coated nickel particles of the present invention have higher electrical conductivity between particles.

Claims (6)

一種覆銀之鎳粒子,其係於包含鎳之核心粒子之表面被覆銀而成者,並且上述覆銀之鎳粒子係遍佈其整個表面區域形成大量凸部,藉此上述表面呈凹凸形狀,俯視下之上述凸部之大小為0.05μm以上且1μm以下,且上述覆銀之鎳粒子中之銀之被覆率為50%以上。 A silver-coated nickel particle obtained by coating silver on a surface of a core particle containing nickel, and the silver-coated nickel particle has a large number of convex portions formed over the entire surface region thereof, whereby the surface has a concave-convex shape and is planarly The size of the convex portion below is 0.05 μm or more and 1 μm or less, and the silver coverage in the silver-coated nickel particles is 50% or more. 如請求項1之覆銀之鎳粒子,其中利用雷射繞射散射式粒度分佈測定法測得之累積體積50體積%之體積累積粒徑D50為0.5μm以上且100μm以下。 The silver-coated nickel particles of claim 1, wherein the volume cumulative particle diameter D 50 of the cumulative volume of 50% by volume measured by a laser diffraction scattering particle size distribution measurement is 0.5 μm or more and 100 μm or less. 如請求項1之覆銀之鎳粒子,其中凸部實質上僅由銀構成。 The silver-coated nickel particle of claim 1, wherein the convex portion is substantially composed only of silver. 如請求項1之覆銀之鎳粒子,其中上述核心粒子包含鎳或包含包括鎳之金屬。 The silver-coated nickel particle of claim 1, wherein the core particle comprises nickel or comprises a metal comprising nickel. 一種導電性組合物,其含有如請求項1之覆銀之鎳粒子。 A conductive composition comprising the silver-coated nickel particles of claim 1. 一種覆銀之鎳粒子之製造方法,其係如請求項1之覆銀之鎳粒子之製造方法,並且其使銀離子與包含鎳之核心粒子於水中接觸而進行置換鍍敷,於該核心粒子之表面析出銀而獲得前驅物粒子,繼而使上述前驅物粒子、銀離子及銀離子之還原劑於水中接觸,於該前驅物粒子之表面進一步析出銀。 A method for producing silver-coated nickel particles, which is the method for producing silver-coated nickel particles according to claim 1, wherein the silver ions are exchanged with the core particles containing nickel in water to perform displacement plating on the core particles. On the surface, silver is precipitated to obtain precursor particles, and then the precursor particles, silver ions, and silver ion reducing agents are contacted in water, and silver is further precipitated on the surface of the precursor particles.
TW102141748A 2013-05-08 2013-11-15 Silver-coated nickel particles and method of producing the same TWI626098B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013098903A JP6210723B2 (en) 2013-05-08 2013-05-08 Silver-coated nickel particles and method for producing the same

Publications (2)

Publication Number Publication Date
TW201442804A true TW201442804A (en) 2014-11-16
TWI626098B TWI626098B (en) 2018-06-11

Family

ID=51866981

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102141748A TWI626098B (en) 2013-05-08 2013-11-15 Silver-coated nickel particles and method of producing the same

Country Status (5)

Country Link
JP (1) JP6210723B2 (en)
KR (1) KR20160004991A (en)
CN (1) CN104837582A (en)
TW (1) TWI626098B (en)
WO (1) WO2014181486A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6186019B2 (en) * 2016-01-13 2017-08-23 株式会社山王 Conductive fine particles and method for producing conductive fine particles
JP6846969B2 (en) * 2016-03-31 2021-03-24 Dowaエレクトロニクス株式会社 Silver-coated nickel powder and its manufacturing method
JP6663079B2 (en) * 2017-03-31 2020-03-11 富士フイルム株式会社 Gold-coated silver tabular particles, gold-coated silver tabular particle dispersion, method for producing the same, coating film, and antireflection optical member
CN108296478A (en) * 2018-01-11 2018-07-20 宁波广新纳米材料有限公司 Silver-nickel powder and preparation method thereof and electrocondution slurry containing the silver-nickel powder
CN110842190B (en) * 2019-10-11 2021-10-15 云南大学 Preparation method of silver-coated copper powder
CN114530280A (en) * 2022-04-21 2022-05-24 西安宏星电子浆料科技股份有限公司 Low-cost thick-film conductor paste
CN114783770B (en) * 2022-06-20 2022-12-13 西安宏星电子浆料科技股份有限公司 External electrode slurry of multilayer ceramic capacitor and preparation method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006035840A1 (en) * 2004-09-29 2006-04-06 Tdk Corporation Conductive particle manufacturing method, conductive paste, and electronic component manufacturing method
JP5080731B2 (en) * 2005-10-03 2012-11-21 三井金属鉱業株式会社 Fine silver particle-attached silver-copper composite powder and method for producing the fine silver particle-attached silver-copper composite powder
JP5284728B2 (en) * 2008-08-29 2013-09-11 三菱マテリアル株式会社 Silver-coated aluminum powder and method for producing the same
JP5764294B2 (en) * 2010-01-18 2015-08-19 ナミックス株式会社 Silver-coated nickel powder and method for producing the same
CN103069504B (en) * 2011-02-23 2015-08-12 积水化学工业株式会社 The manufacture method of electroconductive particle, electroconductive particle, anisotropic conductive material and connection structural bodies

Also Published As

Publication number Publication date
WO2014181486A1 (en) 2014-11-13
TWI626098B (en) 2018-06-11
JP2014218701A (en) 2014-11-20
KR20160004991A (en) 2016-01-13
JP6210723B2 (en) 2017-10-11
CN104837582A (en) 2015-08-12

Similar Documents

Publication Publication Date Title
TWI626098B (en) Silver-coated nickel particles and method of producing the same
JP5785532B2 (en) Silver-coated copper powder and method for producing the same
JP5284728B2 (en) Silver-coated aluminum powder and method for producing the same
JP5934829B2 (en) Silver-coated copper alloy powder and method for producing the same
KR101078253B1 (en) Preparation of Ag coated Cu powder by electroless plating method
JP6224933B2 (en) Silver-coated copper alloy powder and method for producing the same
JPWO2008059789A1 (en) Silver-plated copper fine powder, conductive paste produced using silver-plated copper fine powder, and method for producing silver-plated copper fine powder
JP6182531B2 (en) Composite copper particles and method for producing the same
JP5764294B2 (en) Silver-coated nickel powder and method for producing the same
JP5576318B2 (en) Copper particles
Zhuo et al. Effect of electrolyte composition on the morphological structures of dendritic copper powders prepared by a spontaneous galvanic displacement reaction
JP6194166B2 (en) Method for producing silver-coated copper alloy powder
JP5576319B2 (en) Copper particles
JP2016094665A (en) Silver coated copper powder and conductive paste using the same, conductive coating and conductive sheet
JP6549924B2 (en) Silver-coated copper powder and method for producing the same
JP2015108174A (en) Metal coated inorganic material particle and manufacturing method of the same
JP6309758B2 (en) Silver-coated copper powder and method for producing the same
JP6714440B2 (en) Composite copper particles
Kim et al. Roles of nickel layer deposition on surface and electric properties of carbon fibers
CN101024734A (en) Composite particle, composite material including the same, and method of producing the same
JP2017201062A (en) Method for producing silver-coated copper alloy powder
KR20140020286A (en) Coated fibrous copper microparticles, and electrically conductive coating agent and electrically conductive film each containing said coated fibrous copper microparticles
JP2014186986A (en) Conductive composition, method of producing metal-coated substrate and metal-coated substrate