TW201440083A - Fuse resistor and manufacturing method thereof - Google Patents

Abstract

Disclosed are a fuse resistor provided with a resistor member positioned in a region close to a lead wire drawn out through one surface of a case or to a circuit board and a thermal fuse positioned in another region distant from the wire or the circuit board, thereby preventing the thermal fuse from being melted and blown by heat transferred to the thermal fuse through conduction or radiation during soldering, and a manufacturing method thereof.

Description

Fuse resistor and method of manufacturing same

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a fuse resistor and a method of fabricating the same, and more particularly to a resistive member having a region located near a wire drawn from a surface of a casing or drawn to a circuit board. And a fuse that is located away from the wire or another region of the board to prevent heat transfer through the conduction or radiation, causing the fuse to melt or blow, and the method of manufacturing the same.

In order to prevent large electronic products (such as LCD TVs and PDP TVs) from failing due to inrush current, increase in internal temperature, and continuous overcurrent when power is supplied to the circuit, a protective device (such as a thermal fuse resistor) is configured. The power supply circuit is protected at the power input of the circuit.

The fuse resistor has a resistive member and a thermal fuse. The resistive member is in series with the thermal fuse and passes through the wire.

In order to prevent the other electronic components from being melted and blown, the resistance member and the thermal fuse of the fuse resistor are encapsulated in a casing and filled with a filler.

Here, considering a thermal resistance, a conductivity, and a degree of curing as a filler, a slurry filler including cerium oxide (SiO ₂ ) is used as a filler, and a ceramic case is generally used as a general resistor. The shell.

In addition, one end of the wire extends through the exterior of the housing. A conventional fuse resistor is disposed on a printed circuit board by soldering one end of the wire to the printed circuit board such that the resistive member and the thermal fuse are upright.

When an inrush current is supplied to the fuse resistor configured in the foregoing manner, the current is limited to a predetermined level by the resistive member. When an overcurrent is supplied to the fuse resistor, heat is generated in the resistive member and transferred to the thermal fuse by conduction through the filler, so that the thermal fuse is melted by solid solder or polymer pellet. The blown body is melted and blown, and the circuit of the household appliance is protected by destroying the circuit.

Figure 9 shows a conventional resistor. The elements of the elements shown in Fig. 9 are similar or identical to the present invention. Referring to FIG. 9, Korean Patent No. 10-1060013 discloses a thermal fuse resistor including a resistance member, a thermal fuse that destroys a circuit due to heat generated by a resistance member, and a series connection with a resistance member and a thermal fuse. a wire, a housing having an open surface, and a drawing-out groove for drawing a wire on the sidewall surface to provide a resistance member and a wire of the thermal fuse extending outside the casing, and having a yttrium oxide The filler fills the inside of the housing to allow the resistive member and the thermal fuse to be embedded in the housing. The housing is made of a thermosetting plastic which has a lower thermal resistance than the filling by injection molding.

According to the aforementioned patent document, the circuit and the thermal fuse are adjacent to each other. Therefore, the thermal fuse may be melted and blown due to heat generated during soldering.

Accordingly, the present invention is to solve the above problems, and an object of the present invention is to provide a fuse resistor having an area located near a wire drawn or pulled out from a surface of a casing to a circuit board. A resistive member, and a thermal fuse located away from the wire or another region of the circuit board to prevent heat transfer through conduction or radiation during soldering to cause the thermal fuse to melt or blow and its method of manufacture.

Another object of the present invention is to provide a fuse resistor having a laterally configured resistance member and a thermal fuse and a method of manufacturing the same.

Another object of the present invention is to provide a fuse resistor located on a housing having a resistive architecture guide wall and a thermal fuse guide wall and a method of fabricating the same to avoid short circuit and block external heat transfer.

Another object of the present invention is to provide a fuse resistor and a method of manufacturing the same by filling a filler into a casing to reduce drying time and simple automated processing, wherein the filler is made of a silicone resin or Made of epoxy resin.

According to an embodiment of the present invention, the foregoing object is achieved by a fuse resistor, wherein the fuse resistor includes a resistance member, a thermal fuse connected to the resistance member and one of the heat transfer destruction circuits according to the resistance member a housing having an open surface to allow the resistive member and the thermal fuse to be embedded, one end connected to the resistive member and the thermal fuse, and the other end having the resistive member lead and the thermal fuse lead, wherein the resistive member lead and the thermal fuse The wire is extended beyond the casing and fills the interior of the casing, wherein the resistive member is located adjacent the wire extending through one of the surfaces of the casing, and the thermal fuse is located in another region remote from the wire.

One end of each of the resistive member wires and the thermal fuse wire will extend beyond the housing through the open surface of the housing.

The arrangement of the resistive member and the thermal fuse are respectively parallel to the open surface of the housing to extend the lead outside the housing.

The filler is composed of a tantalum material.

The housing has an extended slot to allow the resistive member wires and the thermal fuse wires to extend out of the housing.

The housing has at least one guide wall.

The guide wall includes a resistance guide wall between the resistance member and the resistance member wire, and a thermal fuse guide wall between the thermal fuse and the thermal fuse wire.

The housing may have a stepped portion for placing the thermal fuse.

The housing is made of plastic or ceramic filled with mold.

Another part of an embodiment of the present invention provides a method of manufacturing a fuse resistor, comprising a device connecting step for interconnecting a resistive member and a thermal fuse, connecting one end of the resistive member to the resistive member, and thermally fusing One end of the wire is connected to the thermal fuse wire; the device is embedded in the step of continuously inserting the thermal fuse and the resistive member into the housing through the open surface of the housing such that the resistive member is located adjacent to the wire extending through the surface of the housing a region, and the thermal fuse is located in another region away from the wire, wherein the open surface is pre-fabricated; the filler filling step is used to fill the filler made of tantalum or epoxy compound with electrical resistance and heat a housing of the fuse; and a filler drying step for drying the filler.

In the device embedding step, the resistance member wire and the thermal fuse wire guide The wire is pulled out of the housing by the open surface of the housing.

The resistive member and the thermal fuse are parallel to the open surface of the housing and the lead is pulled out of the housing by the open surface.

(a) ‧‧‧welding station

(b) ‧‧‧Hot fuse wire

(c), 20‧‧‧thermal fuse

(d) ‧‧‧ device connection wires

10‧‧‧Resistance components

2‧‧‧~Board

31, 32, 33‧‧‧ wires

4‧‧‧welding station

40, 40a, 40b, 40c‧‧‧ housing

41‧‧‧Extension groove

43, 45‧‧‧ Guide wall

47‧‧‧step part

50‧‧‧Filling

S1, S2, S3, S4‧‧‧ step process

The foregoing and other objects, features and other advantages of the present invention will be described in the following description in conjunction with the accompanying drawings in which: FIG. 1 shows a fuse resistor according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view showing a fuse resistor according to a first embodiment of the present invention; and FIG. 3A-3C is a view showing a fuse resistor according to an embodiment of the present invention. FIG. 4 is a perspective view showing a fuse resistor according to a second embodiment of the present invention; and FIG. 5 is a perspective view showing a fuse resistor according to a second embodiment of the present invention; 6A, 6B are cross-sectional views showing a fuse resistor according to a third embodiment of the present invention; and Fig. 7 is a view showing a fuse according to an embodiment of the present invention. A flowchart of a method of fabricating a resistor; FIGS. 8A-8D are views showing each step of a fuse resistor manufacturing process in accordance with the present invention.

A more detailed description of the exemplary embodiments will be presented below in conjunction with the drawings.

In the description of the present invention, the description of the related functions and the configuration will be omitted for the sake of simplicity. Furthermore, the methods described below define the functionality of the invention and may vary depending on the purpose of the user or operator or jurisprudence. Accordingly, the methods described are fully defined in accordance with the description of the invention.

Referring to FIGS. 1-3, the fuse resistor 1 is used in a circuit of an electronic product, and includes a resistance member 10, a thermal fuse 20, a housing 40 in which the resistance member 10 and the thermal fuse 20 are placed, and wires 31 and 32. And a wire 33 connecting the resistance member 10 and the thermal fuse 20, and a filler 50 filling the casing 40.

The resistive member 10 is typically a cement resistor or a device that can control the inrush current, such as a negative temperature coefficient (NTC) device of the power source. Preferably, the resistive member is composed of a rod wound with a copper-nickel alloy. The wire is connected to both ends of the thermal fuse, and more specifically, the wire refers to a device connecting wire and a thermal fuse wire.

The thermal fuse 20 is a wound ceramic body (not shown) wound with an insulating ceramic rod of a predetermined length. The wire is electrically connected to a conductive cap provided at both ends of the rod, and more specifically, the wire refers to a device connecting wire 33 and a resistance member wire 31. The thermal fuses generated by the resistive members and the hot fuses that are blown are of a conventional type, and the related description is omitted here.

The resistive member 10 is connected in series with the thermal fuse 20 or in parallel through the device to connect the wires 33.

The resistance member 10 and the thermal fuse 20 can be connected in various ways, including Clamping, soldering, and spot welding.

The device connection wire 33 is used to connect one end of the resistance member to one end of the thermal fuse. Alternatively, the wires 33 can be connected by means of two means.

The resistive member lead 31 and the thermal fuse lead 32 are pulled out of the housing 40 and connected to the circuit board 2.

In order to prevent the fuse resistor 1 and other electronic components disposed on the circuit board from being affected by the debris generated when the melt-blown body is melted and blown, the resistance member 10 of the fuse resistor 1 and the fuse 20 are The package is housed in a housing, and the interior of the housing is filled with a filler 50.

The housing 40 is a parallelepiped rectangle shaped to have at least one open surface such that the resistive member 10 and the thermal fuse 20 can be embedded in the housing 40.

The housing 40 is made of plastic or ceramic filled and molded. In particular, since the specific gravity of the plastic is much lower than that of the ceramic, when the casing 40 is made of plastic, the weight of the casing 40 will be reduced.

The resistance member 10 and the thermal fuse 20 are embedded in the casing 40 through the open surface of the casing 40, and are disposed in parallel with each other. Preferably, the resistive member 10 is located adjacent the area of the wires 31 and 32 that are pulled out of the housing by the surface of the housing, and the thermal fuse 20 is located away from the wires 31 and 32.

The open surface of the housing 40 is located at a lower position. The thermal fuse 20 and the resistive member 10 are continuously embedded into the housing 40 through the open surface, and the other end of each of the resistive member wires 31 and the thermal fuse wire 32 is pulled out of the open surface.

As shown in FIG. 3A, the housing 40 is disposed to face the circuit board. The open surface. In addition, as shown in FIG. 3B, the housing 40 may be disposed laterally of the circuit board. Meanwhile, as shown in FIG. 3C, the top and bottom of the housing 40 may be open.

Referring to FIG. 3A, the thermal fuse wire 32 is soldered to the circuit board 2. The temperature of the soldering is between 250 ° C and 310 ° C. Each device is soldered separately using a soldering iron, or a plurality of devices are automatically placed on the circuit board by placing the circuit board on a soldering station. In particular, when soldering is performed on the soldering station 4, heat transfer and heat radiation can seriously affect the thermal fuse through the wires 31 and 32.

In addition to this, when heat radiation is conducted to the thermal fuse 20 through the circuit board 2 and the filler 50, the temperature is lowered due to being away from the heat source.

Therefore, if the thermal fuse 20 is located close to the circuit board 2, the thermal fuse 20 may be melted and blown due to heat transfer and heat radiation generated by soldering.

Experiment 1: The temperature of the soldering station (a) was set to 310 ° C, and the maximum temperature of each part of the thermal fuse was measured. In the measurement, the temperature of the thermal fuse wire (b) was 213.0 ° C, the temperature of the thermal fuse (c) was 133.5 ° C, and the temperature of the device connecting wire (d) was 117.6 ° C. We have found that when the aforementioned temperature is maintained for more than 30 seconds, the thermal fuse melts and blows due to the large amount of heat generated by the main components.

It can be known from Experiment 1 that the temperature of the thermal fuse wire (b) is much higher than the temperature of the heat fuse (c) or the device connecting wire (d), and when the thermal fuse is located close to the circuit board or the wire drawing pull-out area. Externally, the thermal fuse 20 will melt and blow due to heat transfer from the wires or heat radiation through the soldering station of the board.

In addition, in the present invention, the thermal fuse is received through the circuit board Or the thermal effects of the wires that are pulled out will be minimized and the miniaturized architecture will be implemented.

At the same time, heat is transferred through the portion of the wire to conduct heat, for example, the thermal fuse wire 32 embedded in the housing is filled to fill the case to dissipate heat to the environment.

The filler 50 is made of tantalum resin or epoxy resin, and has good adhesion properties, hardness, wear resistance, anti-corrosion, and tensile strength. Physical characteristics.

When the impact test provides a surge voltage to the crucible filler or epoxy fill, the resistive member will be broken or burst. At this point, the helium filler reduces the bursting sound and protects other devices located around the resistive member. In addition, the function of the ruthenium filler is equal to or higher than the conventional cement filler.

This is because a lot of filler drying time can be reduced when using tantalum or epoxy as the filler 50 compared to conventional cement fillers. For example, the cement filling has a drying time of about 2 hours at 100 ° C, but the drying time of the crucible filling at 100 ° C is about 1 to 10 minutes.

In addition, if a conventional cement filler is used, it is difficult to achieve a continuous automated process because the drying time is too long. However, the crucible filler used in the present invention will achieve the purpose of automated process.

Figure 4 is a perspective view showing a fuse resistor according to a second embodiment of the present invention.

Referring to FIG. 4, the fuse resistor according to the embodiment, the housing The 40b has an open surface on the front side, and the extension groove 41 is formed on a lower surface near the lower side of the open surface.

Since the open surface is formed on the front side, the front surface is preferably on the lower surface, so that the process of embedding the resistance member and the thermal fuse to the housing 40b is performed by embedding the resistance member and the thermal fuse through the lower surface into the housing 40b. The process (see Figures 1-3) is easier.

The function of the extension groove 41 is to pull the resistance member wire 31 and the thermal fuse wire 32 to the outside and accurately maintain the distance between the wires.

5 is a perspective view showing a fuse resistor according to a third embodiment of the present invention, and FIG. 6 is a cross-sectional view showing a fuse resistor according to a third embodiment of the present invention.

Referring to Figures 5 and 6, the housing 40c provided according to this embodiment has at least one guide wall 43, 45.

The guide walls 43, 45 include a resistance member guide wall 43 between the resistance member 10 and the resistance wire 31, and a thermal fuse guide wall 45 between the thermal fuse 20 and the thermal fuse wire 32.

The function of the guide walls 43, 45 is to guide the embedding and fixing of the thermal fuse 20 and the resistive member 10 connected to the thermal fuse 20 and to shield the heat transmitted to the periphery of the thermal fuse 20 or the resistive member 10.

Further, the resistance member guide wall 43 is located between the resistance member 10 and the resistance wire 31 to prevent the resistance member wire 31 from contacting the resistance member 10 to cause a short circuit. Similarly, thermal fuse guide wall 45 is positioned between thermal fuse 20 and thermal fuse lead 32 to avoid shorting.

At the same time, the housing 40 has a thermal fuse 20, more specifically, a hot melt The wire 20 is disposed on a stepped portion 47 formed on a surface facing the open surface.

The function of the stepped portion 47 is to set the resistive member 10 and the thermal fuse 20 to the same level and to cause the filler 50 to safely surround the outer surface of the thermal fuse 20.

As shown in FIG. 6A, in the case where the diameter of the resistance member 10 is larger than the thermal fuse, the position of the resistance member 10 and the thermal fuse 20 are set to the same level at the same level by forming the step portion 47 to a predetermined height. In the body 40c, the difference in height between the resistance member 10 and the thermal fuse 20 is excluded.

Hereinafter, a method of manufacturing the fuse resistor of the present invention will be discussed in detail with reference to Figures 7-8D.

Referring to FIGS. 7-8D, the method of manufacturing the fuse resistor of the present invention includes a device connection step S1, a device embedding step S2, a filler filling step S3, and a filler drying step S4.

Referring to FIG. 8A, in the device connection step S1, the resistance member 10 is connected in series or in parallel with the thermal fuse 20, and the resistance member wire 31 connected to one end of the resistance member 10 is connected to one end of the thermal fuse 20. Connected thermal fuse wire 32.

Referring to FIG. 8B, in the device embedding step S2, the thermal fuse 20 and the resistance member 10 are continuously embedded in the casing 40 through the open surface of the casing 40, and the resistance member is disposed in close proximity to the casing 40. The area housing of the wire from which the surface is pulled out, and the thermal fuse is placed away from the wire pulled out to the outside of the surface.

In the device embedding step S2, the resistive member wires 31 and the thermal fuse wires 32 are pulled out of the open surface of the housing 40.

Further, in the example of pulling out the wire, the resistance member 10 and The thermal fuse 20 is disposed parallel to the open surface of the housing.

Referring to FIG. 8C, in the filling filling step S3, the casing 40 having the resistance member 10 and the thermal fuse 20 is filled with a filler such as silicone resin or epoxy resin. In the filler drying step S4, for example, the filler 50 of the resin or epoxy resin is dried.

Referring to Fig. 8D, the fuse resistor manufactured in the foregoing manner has a miniaturized structure. In addition, when the fuse resistor is soldered to the board, the effect of soldering iron or soldering heat on the fuse resistor will be minimized.

Obviously, the fuse resistor of the present invention and the method of manufacturing the same have a resistor member housing located in a region near the surface of the housing pulled or pulled out to a wire of a circuit board, and located away from the wire Or a thermal fuse in another area of the board. Therefore, it is possible to prevent heat transfer from being transmitted or radiated during soldering to cause the heat fuse to melt or blow.

According to the fuse resistor of the present invention and the method of manufacturing the same, the resistance member and the thermal fuse are arranged in a lateral direction. Therefore, a more compact architecture can be realized.

According to the fuse resistor of the present invention and the method of manufacturing the same, the resistance member guide wall and the thermal fuse guide wall are formed in the casing. Therefore, short circuits and external heat generated by contact with the fuse resistor can be avoided.

Further, according to the fuse resistor of the present invention and the method of manufacturing the same, the casing is filled with a filler made of tantalum resin or epoxy resin. Therefore, drying time can be shortened and an automated process can be realized.

The preferred embodiments of the present invention are intended to be illustrative only, and those skilled in the art, without departing from the spirit and scope of the invention, Appropriate changes and substitutions can be made in a broad sense.

10‧‧‧Resistance components

20‧‧‧Hot fuse

31, 32, 33‧‧‧ wires

40‧‧‧shell

Claims (12)

A fuse resistor comprising: a resistor member; a thermal fuse connected to the resistor member to thermally destroy the circuit according to the resistor member; a housing having the resistor member and the thermal fuse embedded therein An open surface to the one of the above casings; a wire having a resistance member wire connected to the resistance member and one of the thermal fuses, the device connecting wire, extending from the resistance member and pulling out the surface of the housing a housing, and a thermal fuse wire housing extending from the thermal fuse and pulling out a surface of the housing, wherein the resistive member is located adjacent to a region of the lead drawn by the surface of the housing The body, and the thermal fuse described above, are located in another region away from the wire. The fuse resistor of claim 1, wherein one of the surfaces of the housing is open to allow the resistive member lead and the thermal fuse lead to be pulled out of the housing. The fuse resistor of claim 2, wherein the resistive member and the thermal fuse are disposed parallel to the open surface of the housing and are pulled out of the housing. The fuse resistor of claim 1, wherein the filler is composed of a tantalum material. The fuse resistor of claim 1, wherein the housing has an extension groove to allow the resistor member conductor and the thermal fuse guide The wire is pulled out of the above casing. The fuse resistor of claim 5, wherein the housing has at least one guide wall. The fuse resistor of claim 6, wherein the guide wall comprises a resistance conducting wall between the resistor member and the resistor member conductor, and the thermal fuse and the thermal fuse lead One of the hot fuse guide walls. The fuse resistor of claim 5, wherein the housing comprises one of the step portions of the thermal fuse arrangement. The fuse resistor of claim 1, wherein the casing is made of plastic or ceramic filled and molded. A fuse resistor manufacturing method comprising a device connecting step for interconnecting a resistor member and a thermal fuse, and connecting one end of the resistor member to a resistor member and connecting one end of the thermal fuse a thermal fuse wire connection; a device embedding step for continuously inserting the thermal fuse and the resistor member into the housing through an open surface of a housing such that the resistor member is located adjacent to the housing The surface of the wire is drawn from a region of the wire extending through the surface of the housing, and the thermal fuse is located in another region away from the wire, the open surface being prefabricated; a filling filling step of filling a filler having the above-described resistance member and the above-mentioned thermal fuse with a filler made of a ruthenium compound or an epoxy compound; A filler drying step for drying the above filler. The method of claim 10, wherein in the device embedding step, the resistive member lead and the thermal fuse lead are pulled out of the housing through the open surface of the housing. The method of claim 10, wherein the resistance member and the thermal fuse are parallel to the open surface of the housing, and the lead wire is pulled out of the housing by the open surface.