CN104246920B - Thermal Cutoffs resistor and its manufacture method - Google Patents
Thermal Cutoffs resistor and its manufacture method Download PDFInfo
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- CN104246920B CN104246920B CN201380011995.5A CN201380011995A CN104246920B CN 104246920 B CN104246920 B CN 104246920B CN 201380011995 A CN201380011995 A CN 201380011995A CN 104246920 B CN104246920 B CN 104246920B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C13/00—Resistors not provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
- H01C1/014—Mounting; Supporting the resistor being suspended between and being supported by two supporting sections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/12—Overvoltage protection resistors
- H01C7/126—Means for protecting against excessive pressure or for disconnecting in case of failure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/13—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material current responsive
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
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Abstract
The present invention relates to a kind of Thermal Cutoffs resistor and its manufacture method, more specifically, it is related to following Thermal Cutoffs resistor and its manufacture method：Resistive elements are being provided with close to the lead drawn from the one side of housing or the region of circuit board, Thermal Cutoffs is being provided with away from the lead drawn from the one side of housing or the region of circuit board, therefore is delivered to said temperature fuse with heat conduction caused by can preventing from welding or radiant heat and is fused.
Description
Technical field
The present invention relates to a kind of Thermal Cutoffs resistor and its manufacture method, more particularly to following Thermal Cutoffs
Resistor and its manufacture method：The region of lead to the close circuit board drawn from the one side of housing is provided with resistive elements；
Region away from circuit board is provided with Thermal Cutoffs, so as to prevent during welding because heat conduction or radiant heat are delivered to Thermal Cutoffs
Thermal Cutoffs is caused to fuse.
Background technology
In general, in such as LCD-TV, the circuit of this electronic product (example) of PDP TVs, in order to prevent because connecing
The inrush current that is produced during energization source, internal temperature rise and lasting overcurrent etc. and occur equipment fault, in circuit
Power input sets protection device (such as Thermal Cutoffs resistor) to protect power circuit.
This Thermal Cutoffs resistor has resistive elements and Thermal Cutoffs first.Resistive elements and Temperature protection
Silk is connected in series by lead.
In addition, in order to avoid the fragment produced when other electronic devices are fused by fusible member is influenceed, Temperature protection
The resistive elements and Thermal Cutoffs of silk resistor are packaged in housing, in enclosure interior filling noggin piece (filler).
Here, in view of heat resistance, electric conductivity and curing performance etc., using the pureed for including silica (SiO2)
Noggin piece is as noggin piece, and housing then uses the housing of the ceramic material for the housing for being typically used as general resistance.
In addition, the end extension of lead is drawn out in the outside of housing, traditional Thermal Cutoffs resistor, by lead
End is welded on printed circuit board (PCB), and resistive elements and Thermal Cutoffs are set on a printed circuit with the state erect.
Therefore, the shape temperature resistance so set, when flow into inrush current to when, using resistive elements limit current to
Rated current, when flowing into overcurrent, by above-mentioned noggin piece by the heat transfer produced by the heating of resistive element to temperature
Fuse, is broken in the way of disconnecting the fusible member formed by solid-state scolding tin or polymeric particles being located inside Thermal Cutoffs
Open circuit, so as to protect the circuit of household electrical appliance.
Fig. 9 is the figure for showing traditional resistor.Reference shown in Fig. 9 is similar with the reference of the present invention or phase
Together.Referring to Fig. 9, Korean Patent No. 10-1060013 discloses following Thermal Cutoffs resistor, it includes：Resistance structure
Part；Pass through the Thermal Cutoffs of the heating functioin disconnecting circuit of above-mentioned resistive elements；It is connected in series resistive elements and Temperature protection
The lead of silk；Housing, open one side internally houses above-mentioned resistive elements with the state that the end of above-mentioned lead is drawn out to outside
And Thermal Cutoffs, possess the lead-out groove for drawing above-mentioned lead on the wall of side；And Thermal Cutoffs resistor,
It is internally embedded resistive elements and Thermal Cutoffs, and including being filled in above-mentioned enclosure interior and noggin piece comprising silica.On
It is to carry out injection moulding to be formed by the heat resistance heat-curing plastic material small relative to above-mentioned noggin piece to state housing.
Foregoing patent, because circuit and Thermal Cutoffs are adjacent, therefore, Thermal Cutoffs is produced when may be because of welding
Raw heat and fuse.
The content of the invention
The problem of present invention is to solve above-mentioned, a purpose of the invention is to provide a kind of following Thermal Cutoffs resistance
Device and its manufacture method：Resistive elements are being provided with close to the lead drawn from the one side of housing or the region of circuit board, remote
The lead drawn from the one side of housing or the region of circuit board are provided with Thermal Cutoffs, therefore having can prevent welding caused
Heat conduction or radiant heat are delivered to said temperature fuse and fusing-off temperature fuse.
It is a further object of the present invention to provide a kind of following Thermal Cutoffs resistor and its manufacture method：By resistance structure
Part and Thermal Cutoffs are along transversely arranged, therefore with overall compact structure.
It is a further object of the present invention to provide a kind of following Thermal Cutoffs resistor and its manufacture method：Due in shell
Resistive elements guide wall and Thermal Cutoffs guide wall are formd on body, therefore having can prevent short-circuit and cut-out from outside transmission
The effect of heat.
It is a further object of the present invention to provide a kind of following Thermal Cutoffs resistor and its manufacture method：By in shell
The noggin piece being made up of silicon or epoxy resin is filled in vivo, drying time is shortened, with can easily implement automatic chemical industry
The effect of skill.
Scheme for solving technical problem
Therefore, according to the Thermal Cutoffs resistor of the present invention, it is characterised in that including：
Resistive elements；
Thermal Cutoffs, is connected to above-mentioned resistive elements, makes short circuit by the heating functioin of above-mentioned resistive elements；
Housing, one side open is to be internally embedded in above-mentioned resistive elements and said temperature fuse；
Lead, one end is connected respectively to above-mentioned resistive elements and said temperature fuse, and the other end is drawn out to above-mentioned shell
Outside body, including resistive elements lead and Thermal Cutoffs lead；And
Noggin piece, is filled into above-mentioned enclosure interior,
Above-mentioned resistive elements are being provided with close to the region for the lead drawn from the one side of above-mentioned housing, remote from above-mentioned shell
The region for the lead that the one side of body is drawn is provided with said temperature fuse.
In addition, according to the Thermal Cutoffs resistor of the present invention, it is characterised in that above-mentioned resistive elements lead and temperature are protected
The other end of dangerous silk lead is drawn out to outside by the one side of the opening of above-mentioned housing.
In addition, according to the Thermal Cutoffs resistor of the present invention, it is characterised in that above-mentioned resistive elements and said temperature
The opening one side formation level being configured to respectively with above-mentioned housing of fuse.
In addition, according to the Thermal Cutoffs resistor of the present invention, it is characterised in that above-mentioned noggin piece is silicon materials.
In addition, according to the Thermal Cutoffs resistor of the present invention, it is characterised in that be formed with lead-out groove on above-mentioned housing,
The lead-out groove is used to above-mentioned resistive elements lead and said temperature fuse lead being drawn out to outside.
In addition, according to the Thermal Cutoffs resistor of the present invention, it is characterised in that be formed with least one on above-mentioned housing
Lead wall.
In addition, according to the Thermal Cutoffs resistor of the present invention, it is characterised in that above-mentioned wall of leading includes：Resistance leads wall, position
Between above-mentioned resistive elements and above-mentioned resistive elements lead；And Thermal Cutoffs leads wall, positioned at said temperature fuse and
Between said temperature fuse lead.
In addition, according to the Thermal Cutoffs resistor of the present invention, it is characterised in that be provided with above-mentioned temperature on above-mentioned housing
The region of degree fuse is formed with stage portion.
In addition, according to the present invention Thermal Cutoffs resistor, it is characterised in that above-mentioned housing be injected-formative plastic or
Ceramic material makes.
In addition, according to the Thermal Cutoffs resistor manufacture method of the present invention, it is characterised in that including：
Device Connection Step, connection resistive elements and Thermal Cutoffs, will be connected to the electricity of one end of above-mentioned resistive elements
Resistance component lead and the Thermal Cutoffs lead of the one end for being connected to said temperature fuse are attached；
Device Embedded step, by the one side of the opening of pre-prepd housing be sequentially embedded said temperature fuse and on
Resistive elements are stated, and above-mentioned resistive elements is located at close to the region for the lead drawn by the one side of above-mentioned housing, make above-mentioned temperature
Degree fuse is located remotely from the region of the above-mentioned lead of the extraction of the one side by above-mentioned housing；
Noggin piece filling step, silicon or ring are filled to the enclosure interior that embedded in above-mentioned resistive elements and Thermal Cutoffs
Oxygen tree fat；And
Noggin piece drying steps, above-mentioned noggin piece is dried.
In addition, according to the Thermal Cutoffs resistor manufacture method of the present invention, it is characterised in that in device Embedded step,
Above-mentioned resistive elements lead and said temperature fuse lead are drawn out to outside by the open one side of above-mentioned housing.
In addition, according to the Thermal Cutoffs resistor manufacture method of the present invention, it is characterised in that above-mentioned resistive elements and upper
State Thermal Cutoffs and be configured to the open one side with the housing of the above-mentioned lead of extraction in a horizontal plane.
Invention effect
According to the Thermal Cutoffs resistor of the invention and its manufacture method of constituted above, close to the one side from housing
The lead of extraction or the region of circuit board are provided with resistive elements, away from the lead drawn from the one side of housing or the area of circuit board
Domain is provided with Thermal Cutoffs, thus be delivered to said temperature fuse with heat conduction caused by can preventing from welding or radiant heat and
The effect of fusing.
In addition, according to the Thermal Cutoffs and its manufacture method of the present invention, by resistive elements and Thermal Cutoffs along horizontal stroke
To arrangement, therefore with overall compact structure.
In addition, according to the Thermal Cutoffs and its manufacture method of the present invention, being led due to foring resistive elements on housing
Wall and Thermal Cutoffs guide wall, therefore with the hot effect that can prevent that short circuit and cut-out from transmitting from outside.
In addition, according to the Thermal Cutoffs and its manufacture method of the present invention, by being filled in housing by silicon or asphalt mixtures modified by epoxy resin
The noggin piece that fat is constituted, shortens drying time, with can easily implement the effect of automation process.
Brief description of the drawings
Fig. 1 is the stereogram for the first embodiment for showing the Thermal Cutoffs resistor according to the present invention.
Fig. 2 is the sectional view for the first embodiment for showing the Thermal Cutoffs resistor according to the present invention.
Fig. 3 a-3c are to show the section view that the state on circuit board is arranged at according to the Thermal Cutoffs resistor of the present invention
Figure.
Fig. 4 is the stereogram for the second embodiment for showing the Thermal Cutoffs resistor according to the present invention；
Fig. 5 is the stereogram for the 3rd embodiment for showing the Thermal Cutoffs resistor according to the present invention；
Fig. 6 is the profile for the 3rd embodiment for showing the Thermal Cutoffs resistor according to the present invention；
Fig. 7 is the flow chart for the embodiment for showing the Thermal Cutoffs resistor manufacture method according to the present invention；
Fig. 8 a-8d are to show regarding according to each step of Thermal Cutoffs resistor manufacturing process of the present invention
Figure.
Fig. 9 is a view to displays temperature fuse-resistor.
Embodiment
Below, embodiments of the invention will be described in detail with reference to accompanying drawing.
In narration for the present invention, related known function and illustrating for structure are possible to if determining
So that spirit of the invention unnecessarily becomes unclear, then description is omitted.In addition, term described later is to consider this hair
Function in bright is possible to different according to user, the intention of network operator or legal precedent etc. the term that defines, these terms.Cause
This, it, which is defined, to be determined according to the entire disclosure of the present invention.
Fig. 1 is the stereogram for the first embodiment for showing the Thermal Cutoffs resistor according to the present invention.Fig. 2 is display root
According to the sectional view of the first embodiment of the Thermal Cutoffs resistor of the present invention.Fig. 3 a-3c are to show the temperature according to the present invention
Fuse-resistor is arranged at the sectional view of the state on circuit board.
Fig. 1~Fig. 3 is referred to, the Thermal Cutoffs resistor 1 based on the present invention is used for the circuit set to electronic product
In, substantially it may include：Resistive elements 10；Thermal Cutoffs 20；House the housing of above-mentioned resistive elements 10 and Thermal Cutoffs 20
40；It is connected to the lead 31,32,33 on above-mentioned resistive elements 10 and Thermal Cutoffs 20；And be filled into inside housing 40
Noggin piece 50.
Above-mentioned resistive elements 10 are usually used cement resistor or power supply negative temperature coefficient (negative
Temperature coefficient, NTC) etc. be used to control the device of inrush current.It is preferred that the material of resistive elements is only
If the material that will not be fused by high current just has no particular limits, it can preferably enumerate and corronil is wound on bar
Structure.In the two ends connecting lead wire of said temperature fuse, specifically, device connecting lead wire is connected to respectively and temperature is protected
Dangerous silk lead.
Said temperature fuse 20 on the insulating ceramics rod of specific length (insulating ceramic rod) by twining
Around fusible member it is (not shown) constitute.Above-mentioned lead is the conductive shield for being respectively electrically connected to be arranged at the two ends of above-mentioned rod
Lead on (conductive cap), specifically, difference interface unit connecting lead wire 33 and resistive elements lead 31.Due to
Because of a variety of kenels of Thermal Cutoffs that above-mentioned resistive elements are generated heat and fuse it is well known that i.e. detailed description will be omitted herein.
Above-mentioned resistive elements 10 and Thermal Cutoffs 20 are connected in series or in parallel by above-mentioned device connecting lead wire 33.
Above-mentioned resistive elements 10 and Thermal Cutoffs 20 can by clamping (clamping), welding (soldering) and
A variety of methods such as spot welding (spot welding) are connected.
Above-mentioned device connecting lead wire 33 can be connected with lead above-mentioned resistive elements one end and Thermal Cutoffs one
End, can also be configured to be connected to the form of two leads.
Above-mentioned resistive elements lead 31 and Thermal Cutoffs lead 32 are drawn out to outside housing 40, are connected to circuit board 2
On.
Based on the Thermal Cutoffs resistor 1 of the present invention, in order to avoid Thermal Cutoffs resistor 1 and being arranged at circuit board
On other electronic units by it is above-mentioned blow body fusing when produced fragment influenceed, with the He of housing packaged resistance component 10
Fuse 20, noggin piece 50 is filled in enclosure interior.
Above-mentioned housing 40 can enumerate the cuboid box-shaped of at least one side opening, to be embedded in resistive elements 10 and temperature
Fuse 20.
Above-mentioned housing 40 can be made by injection moulding plastic cement or ceramic material.Particularly in the case of plastic casing,
Because the proportion of plastic cement is far below ceramics, therefore, it is possible to reduce weight, processability is outstanding, can reduce manufacture unit price.
By open one side, to being internally embedded and be arranged side by side above-mentioned resistive elements 10 and temperature for above-mentioned housing 40
Fuse 20.It is preferred that above-mentioned resistive elements 10 are located at close to the region of lead 31,32, the lead 31,32 is the one side from housing
The lead of extraction, said temperature fuse 20 is set in the area arrangement from lead 31,32 farther out.
In addition, the one side formation of the opening of above-mentioned housing 40, by above-mentioned open surface, is sequentially embedded Temperature protection in bottom
Silk 20 and resistive elements 10, the other end of above-mentioned resistive elements lead 31 and Thermal Cutoffs lead 32 are drawn out to outside open surface
Portion.
As shown in Figure 3 a, the open surface that may be mounted to above-mentioned housing 40 is opposite with circuit board.As shown in Figure 3 b, can also
The state that above-mentioned housing 40 is arranged to keep flat.On the other hand, can also as shown in Figure 3 c, above-mentioned housing 40 can also be configured to
The shape opened up and down.
Fig. 3 a are please referred to again, implement weld job, Thermal Cutoffs lead 32 is connected to circuit board 2.Above-mentioned scolding tin
Usually carried out at a temperature of 250 DEG C~310 DEG C, weld the mode of particular device by using flatiron and will automatically insert
The circuit board of most of device is placed in the mode welded on dip-soldering machine to be welded.Particularly, welded using dip-soldering machine 4
When connecing, the heat conduction via lead 31,32 is not only, the effect of the influence of radiant heat to said temperature fuse is also very big.
Further, since radiant heat is conducted to Thermal Cutoffs 20 by circuit board 2 and noggin piece 50, so with remote
The distance of thermal source, temperature drop.
Therefore, if said temperature fuse 20 is located at close to the position of circuit board 2, there is Thermal Cutoffs 20 because of welding
When heat conduction and radiant heat and the problem of fuse.
[experimental example 1]
If the temperature of dip-soldering machine (a) is 310 DEG C, the maximum temperature at each position of measurement temperature fuse.Testing result, temperature
The temperature (b) of fuse lead is 213.0 DEG C, the temperature (c) of Thermal Cutoffs is 133.5 DEG C, the temperature of device connecting lead wire
(d) it is 117.6 DEG C.Confirm when foregoing temperature is maintained for more than 30 seconds, Thermal Cutoffs can produce a large amount of because of main element
Heat and fuse.
It can confirm that the temperature (b) of Thermal Cutoffs lead is significantly higher than Thermal Cutoffs or device connecting lead wire by experiment 1
Temperature (c, d), if said temperature fuse 20 be located at close to be drawn out to circuit board or outside lead near, can be because of lead
Heat conduction or by circuit board be delivered to dip-soldering machine radiant heat occur Thermal Cutoffs fuse the problem of.
In addition, in the present invention, said temperature fuse is configured to so that being drawn out to foregoing circuit plate or outside
Lead transmission heat conduction influence minimize and miniaturization structure.
On the other hand, by above-mentioned lead as being embedded into the hot of internal region transmission in Thermal Cutoffs lead 32
A part, periphery is rejected heat to by the silicon for being filled into enclosure interior.
In addition, noggin piece 50 can be made up of silicon or epoxy resin, with good cohesive (adhesiveness), firmly
Degree, wearability (wear resistance), anticorrosive (anti-corrosion) and tension stress (tensile strength)
Deng.
Above-mentioned silicon noggin piece or epoxy noggin piece by surge test when applying surge voltage, and resistive elements occur
Breakage is exploded, and now silicon noggin piece eliminates explosive sound and protection peripheral devices.In addition, above-mentioned silicon noggin piece plays equivalent
Or better than the performance of known cement noggin piece.
Because compared to traditional cement noggin piece, when using silicon or epoxy as above-mentioned noggin piece 50
When, it can significantly shorten noggin piece drying time.For example, cement noggin piece is about 2 in the drying time at 100 DEG C
Hour, but silicon noggin piece is about 1~10 minute in the drying time at 100 DEG C.
In addition, in the case of traditional cement noggin piece, because drying time is long and is difficult to continuous automatic
Chemical industry skill.But, by using the silicon noggin piece of the present invention, automation process is more prone to.
Fig. 4 is the stereogram for the second embodiment for showing the Thermal Cutoffs resistor according to the present invention.
Referring to Fig. 4, according to the Thermal Cutoffs resistor of the present embodiment, housing 40b open surface is formed in front,
Adjacent bottom surface is formed with lead-out groove 41 downwards with above-mentioned opening.
Because the formation of above-mentioned open surface is in the area front bigger than bottom surface, therefore, and by resistive elements and Thermal Cutoffs
The process for being embedded into bottom surface (referring to Fig. 1~3) in the process being embedded in above-mentioned housing 40b is compared, and becomes relatively easy.
Above-mentioned lead-out groove 41 is functioned as follows：Above-mentioned resistive elements lead 31 and Thermal Cutoffs lead 32 are drawn out to
Outside, correctly guides the gap between each lead.
Fig. 5 is the stereogram for the 3rd embodiment for showing the Thermal Cutoffs resistor according to the present invention, and Fig. 6 is display root
According to the sectional view of the 3rd embodiment of Thermal Cutoffs resistor of the present invention.
Fig. 5,6 are referred to, housing 40c of the invention can at least form one and lead wall 43,45.
Above-mentioned wall 43,45 of leading may include：Resistive elements lead wall 43, positioned at above-mentioned resistive elements 10 and above-mentioned resistance lead 31
Between；And Thermal Cutoffs leads wall 45, between said temperature fuse 20 and said temperature fuse lead 32.
Wall 43,45 is led to function as follows：Guide for embedded and fixed temperature fuse 20 and insure with said temperature
Untill the resistive elements 10 of the connection of silk 20, the heat transfer on periphery is cut off to Thermal Cutoffs 20 or resistive elements 10.
It is located in addition, above-mentioned resistive elements lead wall 43 between resistive elements 10 and resistance lead 31, to avoid above-mentioned resistance
The contact resistance component 10 of component lead 31 causes short circuit.Equally, Thermal Cutoffs leads wall 45 positioned at Thermal Cutoffs 20 and temperature
To avoid short circuit phenomenon between fuse lead 32.
On the other hand, said temperature fuse 20 is provided with above-mentioned housing 40, specifically, can be opposed with open surface
Face on formed stage portion 47.
Stage portion 47 is functioned as follows：Resistive elements 10 of aliging and the level of Thermal Cutoffs 20 and so that filling structure
Part 50 surrounds the outer surface of Thermal Cutoffs 20 well.
In general, the diameter of above-mentioned resistive elements 10 is more than Thermal Cutoffs 20, therefore is housed in housing to align
The level of resistive elements 10 and Thermal Cutoffs 20 in 40, forms the stage portion 47 protruded with specified altitude, so as to ensure electricity
Hinder component 10 and the difference in height of Thermal Cutoffs 20.
Below, referring to the drawings, the manufacture method of the Thermal Cutoffs resistor of the present invention is described in detail.
Fig. 7 is the flow chart for the embodiment for showing the Thermal Cutoffs resistor manufacture method according to the present invention.Fig. 8 a-
8d is the view for showing each step according to Thermal Cutoffs resistor manufacturing process of the present invention.
Fig. 7-Fig. 8 d are referred to, the manufacture method of Thermal Cutoffs resistor of the present invention includes device Connection Step
S1, device Embedded step S2, silicon filling step S3 and noggin piece drying steps S4.
Fig. 8 a are referred to, in above-mentioned device Connection Step S1, by resistive elements 10 and the serial or parallel connection of Thermal Cutoffs 20
Connection, will be connected to the resistive elements lead 31 of one end of above-mentioned resistive elements 10 and is connected to the one of said temperature fuse 20
The Thermal Cutoffs lead 32 at end is attached.
Fig. 8 b are referred to, in above-mentioned device Embedded step S2, pass through the open simultaneously embedding successively of pre-prepd housing 40
Enter said temperature fuse 20 and resistive elements 10, set close to the region for the lead drawn from the open one side of above-mentioned housing 40
There are above-mentioned resistive elements, insure in the region away from the lead drawn from the open one side of above-mentioned housing 40 provided with said temperature
Silk.
In above-mentioned device Embedded step S2, above-mentioned resistive elements lead 31 and Thermal Cutoffs lead 32 pass through above-mentioned housing
40 open one side is drawn out to outside.
In addition, above-mentioned resistive elements 10 and Thermal Cutoffs 20 can be with the housing 40 for drawing above-mentioned lead the face water of opening one
Flat configuration.
Refer to Fig. 8 c, noggin piece filling step S3 is to having had been inserted into above-mentioned resistive elements 10 and Thermal Cutoffs 20
The inside of the housing 40 filling noggin piece such as silicon or epoxy resin the step of, noggin piece drying steps S4 is to silicon or asphalt mixtures modified by epoxy resin
The step of noggin pieces such as fat 50 are dried.
Refer to Fig. 8 d, Thermal Cutoffs resistor manufactured as above, with compact structure, and with being welded to electricity
The hot influence for enabling to flatiron or welding version to produce during the plate of road is minimized.
In addition, specific embodiment is described in detail in the embodiment part of the present invention and accompanying drawing, but this
Invention is not limited to the disclosed embodiments, for general technical staff of the technical field of the invention, can not take off
Various displacements, deformation are carried out in model essay from the technological thought of the present invention and is changed.Therefore, the scope of the present invention should not limit to
In embodiment described, the technical side being equal including right described later and with right should be interpreted that
Case.
【Symbol description】
1：Thermal Cutoffs resistor 10：Resistive elements
20：Thermal Cutoffs 30：Lead
31：Resistive elements lead 32：Thermal Cutoffs lead
33：Device connecting lead wire 40：Housing
41：Lead-out groove 43：Resistive elements guiding wall
45：Thermal Cutoffs guiding wall 47：Step part
50：Noggin piece
3：Scolding tin (scolding tin) 4：Dip-soldering machine
Claims (8)
1. a kind of Thermal Cutoffs resistor, it is characterised in that including：
Resistive elements；
Thermal Cutoffs, is connected to above-mentioned resistive elements, makes short circuit by the heating functioin of above-mentioned resistive elements；
Housing, one side open is to be internally embedded in above-mentioned resistive elements and said temperature fuse；
Lead, one end is connected respectively to above-mentioned resistive elements and said temperature fuse, and the other end is drawn out to outside above-mentioned housing
Portion, including resistive elements lead and Thermal Cutoffs lead；
Noggin piece, is filled into above-mentioned enclosure interior；And
Resistive elements lead wall and Thermal Cutoffs leads wall, and above-mentioned resistive elements lead wall positioned at above-mentioned resistive elements and above-mentioned resistance structure
Between part lead, parallel above-mentioned resistive elements are set, and said temperature fuse leads wall and is arranged at said temperature fuse and above-mentioned
Between Thermal Cutoffs lead, while wall formation orthogonal is led with above-mentioned resistive elements,
Above-mentioned resistive elements are only provided close to the region for the lead drawn from the one side of above-mentioned housing, said temperature fuse
It is arranged on the region away from the lead drawn from the one side of above-mentioned housing, and resistive elements and Thermal Cutoffs are along horizontal row
Row,
Above-mentioned resistive elements lead, bending and parallel above-mentioned resistive elements arranging after the other end of above-mentioned resistive elements is protruded,
Then bend again, state upwardly and drawn outside housing from above-mentioned one,
Said temperature fuse lead, bends after the other end of said temperature fuse is protruded, shell is stated upwardly from above-mentioned one
It is external to draw.
2. Thermal Cutoffs resistor as claimed in claim 1, it is characterised in that above-mentioned resistive elements and said temperature are protected
The opening one side formation level being configured to respectively with above-mentioned housing of dangerous silk.
3. Thermal Cutoffs resistor as claimed in claim 1, it is characterised in that above-mentioned noggin piece is silicon materials.
4. Thermal Cutoffs resistor as claimed in claim 1, it is characterised in that be formed with lead-out groove on above-mentioned housing, should
Lead-out groove is used to above-mentioned resistive elements lead and said temperature fuse lead being drawn out to outside.
5. Thermal Cutoffs resistor as claimed in claim 4, it is characterised in that be provided with said temperature on above-mentioned housing
The region of fuse is formed with stage portion.
6. Thermal Cutoffs resistor as claimed in claim 1, it is characterised in that above-mentioned housing is injected-formative plastic or pottery
Ceramic material makes.
7. a kind of Thermal Cutoffs resistor manufacture method, it is characterised in that including：
Device Connection Step, connection resistive elements and Thermal Cutoffs, will be connected to the resistance structure of one end of above-mentioned resistive elements
Part lead and the Thermal Cutoffs lead of the one end for being connected to said temperature fuse are attached, resistive elements and Temperature protection
Silk is along transversely arranged；
Device Embedded step, said temperature fuse and above-mentioned electricity are sequentially embedded by the one side of the opening of pre-prepd housing
Component is hindered, and above-mentioned resistive elements is only located at close to the region for the lead drawn by the one side of above-mentioned housing, makes said temperature
Fuse is located remotely from the region of the above-mentioned lead of the extraction of the one side by above-mentioned housing；
Noggin piece filling step, silicon or asphalt mixtures modified by epoxy resin are filled to the enclosure interior that embedded in above-mentioned resistive elements and Thermal Cutoffs
Fat；And
Noggin piece drying steps, above-mentioned noggin piece is dried,
It is formed with that resistive elements lead wall and Thermal Cutoffs leads wall on above-mentioned housing, above-mentioned resistive elements lead wall positioned at above-mentioned resistance
Between component and above-mentioned resistive elements lead, parallel above-mentioned resistive elements are set, said temperature fuse lead wall be arranged at it is above-mentioned
Between Thermal Cutoffs and said temperature fuse lead, while wall formation orthogonal is led with above-mentioned resistive elements,
In device Embedded step：
By above-mentioned resistive elements lead, bent after the other end of above-mentioned resistive elements is protruded and parallel above-mentioned resistive elements are matched somebody with somebody
If then bending again, state upwardly and drawn outside housing from above-mentioned one,
By said temperature fuse lead, bend, stated upwardly from above-mentioned one after the other end of said temperature fuse is protruded
Drawn outside housing.
8. method as claimed in claim 7, it is characterised in that above-mentioned resistive elements and said temperature fuse are configured to and drawn
Go out the open one side of housing of above-mentioned lead in a horizontal plane.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2012-0151297 | 2012-12-21 | ||
| KR1020120151297A KR101496526B1 (en) | 2012-12-21 | 2012-12-21 | Fuse resistor and manufacturing method thereof |
| PCT/KR2013/012027 WO2014098540A1 (en) | 2012-12-21 | 2013-12-23 | Fuse resistor, and method for manufacturing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104246920A CN104246920A (en) | 2014-12-24 |
| CN104246920B true CN104246920B (en) | 2017-08-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380011995.5A Active CN104246920B (en) | 2012-12-21 | 2013-12-23 | Thermal Cutoffs resistor and its manufacture method |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5932139B2 (en) |
| KR (1) | KR101496526B1 (en) |
| CN (1) | CN104246920B (en) |
| TW (1) | TWI457953B (en) |
| WO (1) | WO2014098540A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106024548A (en) * | 2015-03-25 | 2016-10-12 | 斯玛特电子公司 | Fuse resistor and manufacturing method thereof |
| CN204926939U (en) * | 2015-09-06 | 2015-12-30 | 东莞市贝特电子科技股份有限公司 | Two unification resistance |
| KR102627052B1 (en) * | 2019-09-12 | 2024-01-19 | 스마트전자 주식회사 | Circuit protecting device |
| KR102265512B1 (en) * | 2019-09-23 | 2021-06-16 | 스마트전자 주식회사 | Circuit protecting device |
| KR102265518B1 (en) * | 2019-10-07 | 2021-06-16 | 스마트전자 주식회사 | Circuit protecting device |
| WO2021167379A1 (en) * | 2020-02-21 | 2021-08-26 | 주식회사 케이포스 | Resistor with integrated fuse |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020078649A (en) * | 2001-04-07 | 2002-10-19 | 스마트전자 주식회사 | Fusible resistor and method of fabricating the same |
| JP2008097943A (en) * | 2006-10-11 | 2008-04-24 | Uchihashi Estec Co Ltd | Temperature fuse built-in resistor |
| JP2008204832A (en) * | 2007-02-21 | 2008-09-04 | Uchihashi Estec Co Ltd | Resistor with temperature fuse |
| JP2010157410A (en) * | 2008-12-26 | 2010-07-15 | Teikoku Tsushin Kogyo Co Ltd | Fuse resistor |
| KR101060013B1 (en) * | 2009-04-21 | 2011-08-26 | 스마트전자 주식회사 | Fuse Resistor, Manufacturing Method and Installation Method |
| KR101038237B1 (en) * | 2009-04-21 | 2011-05-31 | 스마트전자 주식회사 | Thermal Fuse Resistor |
| JP2011100679A (en) * | 2009-11-09 | 2011-05-19 | Uchihashi Estec Co Ltd | Thermal fuse built-in resistor and electric circuit using this thermal fuse built-in resistor |
| KR20120009303A (en) * | 2010-07-23 | 2012-02-01 | 스마트전자 주식회사 | Circuit protection element of ceramic radiant heat structure and manufacturing method thereof |
-
2012
- 2012-12-21 KR KR1020120151297A patent/KR101496526B1/en active IP Right Grant
-
2013
- 2013-10-08 TW TW102136280A patent/TWI457953B/en active
- 2013-12-23 CN CN201380011995.5A patent/CN104246920B/en active Active
- 2013-12-23 JP JP2015508884A patent/JP5932139B2/en active Active
- 2013-12-23 WO PCT/KR2013/012027 patent/WO2014098540A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| KR101496526B1 (en) | 2015-02-27 |
| TW201440083A (en) | 2014-10-16 |
| TWI457953B (en) | 2014-10-21 |
| WO2014098540A1 (en) | 2014-06-26 |
| CN104246920A (en) | 2014-12-24 |
| JP2015515108A (en) | 2015-05-21 |
| JP5932139B2 (en) | 2016-06-08 |
| KR20140082061A (en) | 2014-07-02 |
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