CN104246920A - Fuse resistor and manufacturing method thereof - Google Patents
Fuse resistor and manufacturing method thereof Download PDFInfo
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- CN104246920A CN104246920A CN201380011995.5A CN201380011995A CN104246920A CN 104246920 A CN104246920 A CN 104246920A CN 201380011995 A CN201380011995 A CN 201380011995A CN 104246920 A CN104246920 A CN 104246920A
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- thermal cutoffs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C13/00—Resistors not provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/13—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material current responsive
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
- H01C1/014—Mounting; Supporting the resistor being suspended between and being supported by two supporting sections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/12—Overvoltage protection resistors
- H01C7/126—Means for protecting against excessive pressure or for disconnecting in case of failure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Fuses (AREA)
Abstract
The present invention relates to a fuse resistor and to a manufacturing method thereof. More particularly, the present invention relates to a fuse resistor in which a resistor element is located in a region near a lead wire extracted from one side of a case or near a circuit board, and a temperature fuse is located in a region away from the lead wire or the circuit board, thus preventing the temperature fuse from being blown as conductive heat or radiant heat generated by soldering is transferred to the temperature fuse, and to a manufacturing method thereof.
Description
Technical field
The present invention relates to a kind of Thermal Cutoffs resistor and its manufacture method, particularly following Thermal Cutoffs resistor and its manufacture method: the lead-in wire of drawing from the one side of housing is provided with resistive elements to the region near circuit board; Thermal Cutoffs is provided with in the region away from circuit board, thus because heat conduction or radiant heat are delivered to Thermal Cutoffs and cause Thermal Cutoffs to fuse when preventing welding.
Background technology
In general; in the circuit of such as LCD TV, this electronic product (example) of PDP TV; the inrush current produced during in order to prevent because switching on power, internal temperature rise and the overcurrent etc. that continues and equipment fault occurs, and arrange protection device (such as Thermal Cutoffs resistor) carry out protection power source circuit at the power input of circuit.
First this Thermal Cutoffs resistor has resistive elements and Thermal Cutoffs.Resistive elements and Thermal Cutoffs are connected in series by lead-in wire.
In addition, the impact of the fragment produced when other electronic device is subject to fusible member fusing, the resistive elements of Thermal Cutoffs resistor and Thermal Cutoffs are packaged in housing, fill noggin piece (filler) in enclosure interior.
At this, consider heat resistance, electric conductivity and curing performance etc., use and comprise the pureed noggin piece of silica (SiO2) as noggin piece, housing then adopts the housing of the ceramic material of the housing being typically used as general resistance.
In addition, the end of lead-in wire extends the outside being drawn out to housing, and in traditional Thermal Cutoffs resistor, by the welding edges of lead-in wire on printed circuit board (PCB), and resistive elements and Thermal Cutoffs are established on a printed circuit with the state erect.
Therefore; the shape temp. resistance of such setting; when flow into inrush current to time; utilize resistive elements by current limit to rated current; when flowing into overcurrent; heat trnasfer heating because of resistive element produced by above-mentioned noggin piece, to Thermal Cutoffs, to disconnect the mode open circuit of the fusible member formed by solid-state scolding tin or polymeric particles being located at Thermal Cutoffs inside, thus protects the circuit of household electrical appliance.
Fig. 9 is the figure that traditional resistor is shown.Reference numeral shown in Fig. 9 is similar or identical with Reference numeral of the present invention.Refer to Fig. 9, No. 10-1060013rd, Korean Patent discloses following Thermal Cutoffs resistor, and it comprises: resistive elements; By the Thermal Cutoffs of the heating functioin open circuit of above-mentioned resistive elements; Be connected in series the lead-in wire of resistive elements and Thermal Cutoffs; Housing, open one side, is drawn out to outside state with the end of above-mentioned lead-in wire and accommodates above-mentioned resistive elements and Thermal Cutoffs in inside, a side wall surface possesses the lead-out groove for drawing above-mentioned lead-in wire; And Thermal Cutoffs resistor, at inner embedded resistor component and Thermal Cutoffs, and comprise and be filled in above-mentioned enclosure interior and the noggin piece comprising silica.Above-mentioned housing is that heat-curing plastic material little relative to above-mentioned noggin piece for heat resistance is carried out injection moulding to be formed.
Aforesaid patent, because circuit is adjacent with Thermal Cutoffs, therefore, Thermal Cutoffs may fuse because of the heat produced during welding.
Summary of the invention
The present invention is in order to solve the above problems, an object of the present invention is to provide a kind of following Thermal Cutoffs resistor and manufacture method thereof: be provided with resistive elements in the region near the lead-in wire of drawing from the one side of housing or circuit board, be provided with Thermal Cutoffs in the region of the lead-in wire of drawing away from the one side from housing or circuit board, therefore there is the heat conduction that can prevent from welding and cause or radiant heat is delivered to said temperature fuse and fusing-off temperature fuse.
Another object of the present invention is to provide a kind of following Thermal Cutoffs resistor and manufacture method thereof: by resistive elements and Thermal Cutoffs along transversely arranged, therefore have compact structure more.
Another object of the present invention is to provide a kind of following Thermal Cutoffs resistor and manufacture method thereof: lead wall and Thermal Cutoffs leads wall owing to defining resistive elements on housing, therefore has and can prevent short circuit and the effect cutting off the heat transmitted from outside.
Another object of the present invention is to provide a kind of following Thermal Cutoffs resistor and manufacture method thereof: by filling the noggin piece be made up of silicon or epoxy resin in housing, shorten drying time, has the effect easily can implementing automation process.
For the scheme of technical solution problem
For this reason, according to Thermal Cutoffs resistor of the present invention, it is characterized in that, comprising:
Resistive elements;
Thermal Cutoffs, is connected to above-mentioned resistive elements, makes short circuit by the heating functioin of above-mentioned resistive elements;
Housing, one side open is internally to embed above-mentioned resistive elements and said temperature fuse;
Lead-in wire, one end is connected respectively to above-mentioned resistive elements and said temperature fuse, and the other end is drawn out to above-mentioned outside, comprises resistive elements lead-in wire and Thermal Cutoffs lead-in wire; And
Noggin piece, is filled into above-mentioned enclosure interior,
Be provided with above-mentioned resistive elements in the region near the lead-in wire of drawing from the one side of above-mentioned housing, be provided with said temperature fuse in the region of the lead-in wire of drawing away from the one side from above-mentioned housing.
In addition, according to Thermal Cutoffs resistor of the present invention, it is characterized in that, the other end of above-mentioned resistive elements lead-in wire and Thermal Cutoffs lead-in wire is drawn out to outside by the one side of the opening of above-mentioned housing.
In addition, according to Thermal Cutoffs resistor of the present invention, it is characterized in that, above-mentioned resistive elements and said temperature fuse be configured to respectively with the open one side formation level of above-mentioned housing.
In addition, according to Thermal Cutoffs resistor of the present invention, it is characterized in that, above-mentioned noggin piece is silicon materials.
In addition, according to Thermal Cutoffs resistor of the present invention, it is characterized in that, above-mentioned housing is formed with lead-out groove, this lead-out groove is used for above-mentioned resistive elements lead-in wire and said temperature fuse to be drawn out to outside.
In addition, according to Thermal Cutoffs resistor of the present invention, it is characterized in that, above-mentioned housing is formed with at least one and leads wall.
In addition, according to Thermal Cutoffs resistor of the present invention, it is characterized in that, above-mentioned wall of leading comprises: resistance leads wall, between above-mentioned resistive elements and above-mentioned resistive elements lead-in wire; And Thermal Cutoffs leads wall, between said temperature fuse and said temperature fuse lead-in wire.
In addition, according to Thermal Cutoffs resistor of the present invention, it is characterized in that, the region being provided with said temperature fuse on above-mentioned housing is formed with stage portion.
In addition, according to Thermal Cutoffs resistor of the present invention, it is characterized in that, above-mentioned housing is that injected-formative plastic or ceramic material make.
In addition, according to Thermal Cutoffs resistor manufacture method of the present invention, it is characterized in that, comprising:
Device Connection Step, contact resistance component and Thermal Cutoffs, be connected the resistive elements lead-in wire being connected to one end of above-mentioned resistive elements with the Thermal Cutoffs lead-in wire of the one end being connected to said temperature fuse;
Device embeds step, said temperature fuse and above-mentioned resistive elements is embedded successively by the one side of the opening of pre-prepd housing, and make above-mentioned resistive elements be positioned at the region of close lead-in wire of being drawn by the one side of above-mentioned housing, make said temperature fuse be positioned at the region of the above-mentioned lead-in wire of the extraction away from the one side by above-mentioned housing;
Noggin piece filling step, fills silicon or epoxy resin to the enclosure interior that embedded in above-mentioned resistive elements and Thermal Cutoffs; And
Noggin piece drying steps, carries out drying to above-mentioned noggin piece.
In addition, according to Thermal Cutoffs resistor manufacture method of the present invention, it is characterized in that, embed step at device, above-mentioned resistive elements lead-in wire and said temperature fuse lead-in wire are drawn out to outside by the open one side of above-mentioned housing.
In addition, according to Thermal Cutoffs resistor manufacture method of the present invention, it is characterized in that, above-mentioned resistive elements and said temperature fuse are configured to be in a horizontal plane with the open one side of the housing of drawing above-mentioned lead-in wire.
Invention effect
According to Thermal Cutoffs resistor of the present invention and the manufacture method thereof of as above structure, resistive elements is provided with in the region near the lead-in wire of drawing from the one side of housing or circuit board, be provided with Thermal Cutoffs in the region of the lead-in wire of drawing away from the one side from housing or circuit board, therefore there is the effect that the heat conduction that can prevent from welding and cause or radiant heat are delivered to said temperature fuse and fuse.
In addition, according to Thermal Cutoffs of the present invention and manufacture method thereof, by resistive elements and Thermal Cutoffs along transversely arranged, therefore there is compact structure more.
In addition, according to Thermal Cutoffs of the present invention and manufacture method thereof, lead wall and Thermal Cutoffs leads wall owing to defining resistive elements on housing, therefore have and can prevent short circuit and the effect cutting off the heat transmitted from outside.
In addition, according to Thermal Cutoffs of the present invention and manufacture method thereof, by filling the noggin piece be made up of silicon or epoxy resin in housing, shorten drying time, there is the effect easily can implementing automation process.
Accompanying drawing explanation
Fig. 1 is the stereogram of display according to the first embodiment of Thermal Cutoffs resistor of the present invention.
Fig. 2 is the cutaway view of display according to the first embodiment of Thermal Cutoffs resistor of the present invention.
Fig. 3 a-3c is the cutaway view that display Thermal Cutoffs resistor according to the present invention is arranged at the state on circuit board.
Fig. 4 is the stereogram of display according to the second embodiment of Thermal Cutoffs resistor of the present invention;
Fig. 5 is the stereogram of display according to the 3rd embodiment of Thermal Cutoffs resistor of the present invention;
Fig. 6 is the profile of display according to the 3rd embodiment of Thermal Cutoffs resistor of the present invention;
Fig. 7 is the flow chart of display according to an embodiment of Thermal Cutoffs resistor manufacture method of the present invention;
Fig. 8 a-8d is the view of display according to each step of Thermal Cutoffs resistor manufacture process of the present invention.
Embodiment
Below, will by reference to the accompanying drawings, embodiments of the invention are described in detail.
In for the present invention describing, likely make aim of the present invention unnecessarily become unclear if determine to relevant known function and illustrating of structure, then description is omitted.In addition, term described later is the term that the function considered in the present invention defines, and these terms are likely different according to the intention of user, network operator or legal precedent etc.Therefore, its definition should be determined by whole specification according to the present invention.
Fig. 1 is the stereogram of display according to the first embodiment of Thermal Cutoffs resistor of the present invention.Fig. 2 is the cutaway view of display according to the first embodiment of Thermal Cutoffs resistor of the present invention.Fig. 3 a-3c is the cutaway view that display Thermal Cutoffs resistor according to the present invention is arranged at the state on circuit board.
Referring to Fig. 1 ~ Fig. 3, based on Thermal Cutoffs resistor 1 of the present invention for being set in the circuit of electronic product, substantially can comprise: resistive elements 10; Thermal Cutoffs 20; Accommodate the housing 40 of above-mentioned resistive elements 10 and Thermal Cutoffs 20; Be connected to the lead-in wire 31,32,33 on above-mentioned resistive elements 10 and Thermal Cutoffs 20; And be filled into the noggin piece 50 of housing 40 inside.
Above-mentioned resistive elements 10 is the device for controlling inrush current such as normally used cement resistor or power supply negative temperature coefficient (negative temperature coefficient, NTC).Preferably, as long as the material of resistive elements can not the material that fuses by big current just have no particular limits, preferably can exemplify the structure being wound around corronil on bar.At the two ends connecting lead wire of said temperature fuse, specifically, device connecting lead wire and Thermal Cutoffs lead-in wire is connected to respectively.
Said temperature fuse 20 is formed by the upper fusible member (not shown) be wound around of the insulating ceramics rod (insulating ceramic rod) of specific length.Above-mentioned lead-in wire is electrically connected to the lead-in wire on the conductive shield (conductive cap) at the two ends being arranged at above-mentioned rod respectively, specifically, and interface unit connecting lead wire 33 and resistive elements lead-in wire 31 respectively.Because the multiple kenel of the Thermal Cutoffs fused because of above-mentioned resistive elements heating is known, be detailed at this.
Above-mentioned resistive elements 10 and Thermal Cutoffs 20 connected in series or in parallel by above-mentioned device connecting lead wire 33.
Above-mentioned resistive elements 10 is connected by multiple methods such as clamping (clamping), welding (soldering) and spot welding (spot welding) with Thermal Cutoffs 20.
Above-mentioned device connecting lead wire 33 can connect one end of above-mentioned resistive elements and one end of Thermal Cutoffs with a lead-in wire, also can be configured to the form being connected to two lead-in wires.
It is outside that above-mentioned resistive elements lead-in wire 31 and Thermal Cutoffs lead-in wire 32 are drawn out to housing 40, is connected on circuit board 2.
Based on Thermal Cutoffs resistor 1 of the present invention, in order to avoid Thermal Cutoffs resistor 1 and other electronic units be arranged on circuit board are subject to above-mentioned impact of blowing the fragment produced when body fuses, with packaging shell resistive elements 10 and fuse 20, fill noggin piece 50 in enclosure interior.
Above-mentioned housing 40 can exemplify the cuboid box-shaped of at least one side open, so that can embedded resistor component 10 and Thermal Cutoffs 20.
Above-mentioned housing 40 is made by injection moulding plastic cement or ceramic material.Particularly when plastic casing, because the proportion of plastic cement is far below pottery, therefore, it is possible to reduce weight, processability is outstanding, can reduce manufacture unit price.
By open one side, the inside to above-mentioned housing 40 embeds and be arranged side by side above-mentioned resistive elements 10 and Thermal Cutoffs 20.Preferred above-mentioned resistive elements 10 is positioned at the region near lead-in wire 31,32, and this lead-in wire 31,32 is the lead-in wires of drawing from the one side of housing, is arranging said temperature fuse 20 from the area arrangement away from lead-in wire 31,32.
In addition, the one side of the opening of above-mentioned housing 40 is formed in bottom, by above-mentioned open surface, embeds Thermal Cutoffs 20 and resistive elements 10 successively, and the other end of above-mentioned resistive elements lead-in wire 31 and Thermal Cutoffs lead-in wire 32 is drawn out to open surface outside.
As shown in Figure 3 a, the open surface that can be mounted to above-mentioned housing 40 is opposite with circuit board.As shown in Figure 3 b, also above-mentioned housing 40 can be arranged to the state kept flat.On the other hand, also can as shown in Figure 3 c, above-mentioned housing 40 also can be configured to the shape opened up and down.
Please again consult Fig. 3 a, implement weld job, Thermal Cutoffs lead-in wire 32 is connected to circuit board 2.Above-mentioned scolding tin is generally carry out at the temperature of 250 DEG C ~ 310 DEG C, by by the mode of flatiron welding particular device with the circuit board that automatically embedded in most of device is placed in the mode that dip-soldering machine carries out welding and welds.Particularly, when utilizing dip-soldering machine 4 to weld, be not only the heat conduction via lead-in wire 31,32, photothermal impact is also very large to the effect of said temperature fuse.
In addition, because radiant heat conducts to Thermal Cutoffs 20 by circuit board 2 and noggin piece 50, so along with the distance of stow away from heat, temperature declines.
Therefore, if said temperature fuse 20 is positioned at the position near circuit board 2, then there is the problem that Thermal Cutoffs 20 fuses because of heat conduction during welding and radiant heat.
[experimental example 1]
If the temperature of dip-soldering machine (a) is 310 DEG C, the maximum temperature at each position of measuring tempeature fuse.Testing result, the temperature (b) of Thermal Cutoffs lead-in wire is 213.0 DEG C, the temperature (c) of Thermal Cutoffs is 133.5 DEG C, and the temperature (d) of device connecting lead wire is 117.6 DEG C.Confirm when aforesaid temperature maintained more than 30 seconds, Thermal Cutoffs can fuse because main element produces large calorimetric.
Can confirm that temperature (b) that Thermal Cutoffs goes between is significantly higher than the temperature (c of Thermal Cutoffs or device connecting lead wire by experiment 1, d), if said temperature fuse 20 is positioned near the lead-in wire being drawn out to circuit board or outside, then can because of the heat conduction of lead-in wire or the problem of radiant heat occurrence temperature blown fuse being delivered to dip-soldering machine by circuit board.
In addition, in the present invention, said temperature fuse be configured to the lead-in wire transmission that can make to be drawn out to foregoing circuit plate or outside heat conduction impact minimize and the structure of miniaturization.
On the other hand, by the part as being embedded into the heat that inner region is transmitted in Thermal Cutoffs lead-in wire 32 of above-mentioned lead-in wire, periphery is rejected heat to by the silicon being filled into enclosure interior.
In addition, noggin piece 50 can be made up of silicon or epoxy resin, has good adhesiveness (adhesiveness), hardness, resistance to wear (wear resistance), anticorrosive (anti-corrosion) and tension stress (tensile strength) etc.
Above-mentioned silicon noggin piece or epoxy noggin piece are when applying surge voltage by surge test, and damaged or blast occurs resistive elements, and now silicon noggin piece eliminates explosive sound and protection peripheral devices.In addition, above-mentioned silicon noggin piece plays the performance being equal to or being better than known cement noggin piece.
This is because compared to traditional cement noggin piece, when using silicon or epoxy as above-mentioned noggin piece 50, significantly can shorten noggin piece drying time.Such as, cement noggin piece is approximately 2 hours the drying time at 100 DEG C, but silicon noggin piece is approximately 1 ~ 10 minute the drying time at 100 DEG C.
In addition, when traditional cement noggin piece, be difficult to because drying time is long realize continuous print automation process.But by adopting silicon noggin piece of the present invention, automation process is more prone to.
Fig. 4 is the stereogram of display according to the second embodiment of Thermal Cutoffs resistor of the present invention.
Refer to Fig. 4, according to the Thermal Cutoffs resistor of the present embodiment, the open surface of housing 40b is formed in front, is formed with lead-out groove 41 in the bottom surface adjacent with above-mentioned open surface downwards.
Because above-mentioned open surface is formed in large front, area ratio bottom surface, therefore, compared with the operation being embedded into bottom surface (consulting Fig. 1 ~ 3) in operation resistive elements and Thermal Cutoffs are embedded in above-mentioned housing 40b, become relatively easy.
Above-mentioned lead-out groove 41 functions as follows: above-mentioned resistive elements lead-in wire 31 and Thermal Cutoffs lead-in wire 32 are drawn out to outside, the correct gap guided between each lead-in wire.
Fig. 5 is the stereogram of display according to the 3rd embodiment of Thermal Cutoffs resistor of the present invention, and Fig. 6 is the cutaway view of display according to the 3rd embodiment of Thermal Cutoffs resistor of the present invention.
Refer to Fig. 5,6, housing 40c of the present invention at least can form one and lead wall 43,45.
Above-mentioned wall 43,45 of leading can comprise: resistive elements leads wall 43, between above-mentioned resistive elements 10 and above-mentioned resistance lead 31; And Thermal Cutoffs leads wall 45, between said temperature fuse 20 and said temperature fuse lead-in wire 32.
Lead wall 43,45 to function as follows: guide for embed with fixed temperature fuse 20 and the resistive elements 10 that is connected with said temperature fuse 20 till, cut off the heat trnasfer of periphery to Thermal Cutoffs 20 or resistive elements 10.
In addition, above-mentioned resistive elements leads wall 43 between resistive elements 10 and resistance lead 31, causes short circuit to avoid the above-mentioned resistive elements 31 contact resistance components 10 that go between.Equally, Thermal Cutoffs leads wall 45 between Thermal Cutoffs 20 and Thermal Cutoffs lead-in wire 32 to avoid short circuit phenomenon.
On the other hand, above-mentioned housing 40 is provided with said temperature fuse 20, specifically, stage portion 47 can be formed on the face opposed with open surface.
Stage portion 47 functions as follows: alignment resistive elements 10 and Thermal Cutoffs 20 level and make noggin piece 50 surround the outer surface of Thermal Cutoffs 20 well.
In general, the diameter of above-mentioned resistive elements 10 is greater than Thermal Cutoffs 20, therefore be housed in the level of resistive elements 10 in housing 40 and Thermal Cutoffs 20 in order to align, be formed with the outstanding stage portion 47 of specified altitude, thus ensureing resistive elements 10 and Thermal Cutoffs 20 difference in height.
Below, with reference to accompanying drawing, the manufacture method of Thermal Cutoffs resistor of the present invention is described in detail.
Fig. 7 is the flow chart of display according to an embodiment of Thermal Cutoffs resistor manufacture method of the present invention.Fig. 8 a-8d is the view of display according to each step of Thermal Cutoffs resistor manufacture process of the present invention.
Refer to Fig. 7-Fig. 8 d, the manufacture method of Thermal Cutoffs resistor of the present invention comprises device Connection Step S1, device embeds step S2, silicon filling step S3 and noggin piece drying steps S4.
Refer to Fig. 8 a, at above-mentioned device Connection Step S1, by resistive elements 10 and Thermal Cutoffs 20 connected in series or in parallel, the resistive elements lead-in wire 31 being connected to one end of above-mentioned resistive elements 10 and the Thermal Cutoffs of one end that is connected to said temperature fuse 20 are gone between and 32 to be connected.
Refer to Fig. 8 b, step S2 is embedded at above-mentioned device, said temperature fuse 20 and resistive elements 10 is embedded successively by the open one side of pre-prepd housing 40, be provided with above-mentioned resistive elements in the region of the lead-in wire of drawing near the open one side from above-mentioned housing 40, be provided with said temperature fuse in the region of the lead-in wire of drawing away from the open one side from above-mentioned housing 40.
Embed step S2 at above-mentioned device, above-mentioned resistive elements lead-in wire 31 and Thermal Cutoffs lead-in wire 32 are drawn out to outside by the open one side of above-mentioned housing 40.
In addition, above-mentioned resistive elements 10 and Thermal Cutoffs 20 can with the open one side horizontal arrangement of housing 40 of drawing above-mentioned lead-in wire.
Refer to Fig. 8 c, noggin piece filling step S3 is the step of filling the noggin piece such as silicon or epoxy resin to housing 40 inside that embedded in above-mentioned resistive elements 10 and Thermal Cutoffs 20, and noggin piece drying steps S4 carries out dry step to the noggin piece such as silicon or epoxy resin 50.
Refer to Fig. 8 d, the Thermal Cutoffs resistor as above manufactured, is of compact construction, and the impact with the heat that flatiron or welding version can be made to produce when being welded to circuit board minimizes.
In addition, specific embodiment is described in detail in the specific embodiment of the present invention part and accompanying drawing, but the present invention is not limited to the disclosed embodiments, for general technical staff of the technical field of the invention, various displacement, distortion and change can be carried out in the model essay not departing from technological thought of the present invention.Therefore, scope of the present invention should not be limited to illustrated embodiment, should be interpreted as the technical scheme comprising right described later and be equal to right.
[symbol description]
1: Thermal Cutoffs resistor 10: resistive elements
20: Thermal Cutoffs 30: lead-in wire
31: resistive elements lead-in wire 32: Thermal Cutoffs goes between
33: device connecting lead wire 40: housing
41: lead-out groove 43: resistive elements guiding wall
45: Thermal Cutoffs guiding wall 47: step part
50: noggin piece
3: scolding tin (scolding tin) 4: dip-soldering machine
Claims (12)
1. a Thermal Cutoffs resistor, is characterized in that, comprising:
Resistive elements;
Thermal Cutoffs, is connected to above-mentioned resistive elements, makes short circuit by the heating functioin of above-mentioned resistive elements;
Housing, one side open is internally to embed above-mentioned resistive elements and said temperature fuse;
Lead-in wire, one end is connected respectively to above-mentioned resistive elements and said temperature fuse, and the other end is drawn out to above-mentioned outside, comprises resistive elements lead-in wire and Thermal Cutoffs lead-in wire; And
Noggin piece, is filled into above-mentioned enclosure interior,
Be provided with above-mentioned resistive elements in the region near the lead-in wire of drawing from the one side of above-mentioned housing, be provided with said temperature fuse in the region of the lead-in wire of drawing away from the one side from above-mentioned housing.
2. Thermal Cutoffs resistor as claimed in claim 1, is characterized in that, the other end of above-mentioned resistive elements lead-in wire and Thermal Cutoffs lead-in wire is drawn out to outside by the one side of the opening of above-mentioned housing.
3. Thermal Cutoffs resistor as claimed in claim 1, is characterized in that, above-mentioned resistive elements and said temperature fuse be configured to respectively with the open one side formation level of above-mentioned housing.
4. Thermal Cutoffs resistor as claimed in claim 1, it is characterized in that, above-mentioned noggin piece is silicon materials.
5. Thermal Cutoffs resistor as claimed in claim 1, is characterized in that, above-mentioned housing is formed with lead-out groove, and this lead-out groove is used for above-mentioned resistive elements lead-in wire and said temperature fuse to be drawn out to outside.
6. Thermal Cutoffs resistor as claimed in claim 1, is characterized in that, above-mentioned housing is formed with at least one and leads wall.
7. Thermal Cutoffs resistor as claimed in claim 6, it is characterized in that, above-mentioned wall of leading comprises: resistance leads wall, between above-mentioned resistive elements and above-mentioned resistive elements lead-in wire; And Thermal Cutoffs leads wall, between said temperature fuse and said temperature fuse lead-in wire.
8. Thermal Cutoffs resistor as claimed in claim 5, it is characterized in that, the region being provided with said temperature fuse on above-mentioned housing is formed with stage portion.
9. Thermal Cutoffs resistor as claimed in claim 1, it is characterized in that, above-mentioned housing is that injected-formative plastic or ceramic material make.
10. a Thermal Cutoffs resistor manufacture method, is characterized in that, comprising:
Device Connection Step, contact resistance component and Thermal Cutoffs, be connected the resistive elements lead-in wire being connected to one end of above-mentioned resistive elements with the Thermal Cutoffs lead-in wire of the one end being connected to said temperature fuse;
Device embeds step, said temperature fuse and above-mentioned resistive elements is embedded successively by the one side of the opening of pre-prepd housing, and make above-mentioned resistive elements be positioned at the region of close lead-in wire of being drawn by the one side of above-mentioned housing, make said temperature fuse be positioned at the region of the above-mentioned lead-in wire of the extraction away from the one side by above-mentioned housing;
Noggin piece filling step, fills silicon or epoxy resin to the enclosure interior that embedded in above-mentioned resistive elements and Thermal Cutoffs; And
Noggin piece drying steps, carries out drying to above-mentioned noggin piece.
11. methods as claimed in claim 10, is characterized in that, embed step at device, and above-mentioned resistive elements lead-in wire and said temperature fuse lead-in wire are drawn out to outside by the open one side of above-mentioned housing.
12. methods as claimed in claim 10, is characterized in that, above-mentioned resistive elements and said temperature fuse are configured to be in a horizontal plane with the open one side of the housing of drawing above-mentioned lead-in wire.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2012-0151297 | 2012-12-21 | ||
| KR1020120151297A KR101496526B1 (en) | 2012-12-21 | 2012-12-21 | Fuse resistor and manufacturing method thereof |
| PCT/KR2013/012027 WO2014098540A1 (en) | 2012-12-21 | 2013-12-23 | Fuse resistor, and method for manufacturing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104246920A true CN104246920A (en) | 2014-12-24 |
| CN104246920B CN104246920B (en) | 2017-08-01 |
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ID=50978761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380011995.5A Active CN104246920B (en) | 2012-12-21 | 2013-12-23 | Thermal Cutoffs resistor and its manufacture method |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5932139B2 (en) |
| KR (1) | KR101496526B1 (en) |
| CN (1) | CN104246920B (en) |
| TW (1) | TWI457953B (en) |
| WO (1) | WO2014098540A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106024548A (en) * | 2015-03-25 | 2016-10-12 | 斯玛特电子公司 | Fuse resistor and manufacturing method thereof |
| CN112490095A (en) * | 2019-09-12 | 2021-03-12 | 斯玛特电子公司 | Circuit protection device |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204926939U (en) * | 2015-09-06 | 2015-12-30 | 东莞市贝特电子科技股份有限公司 | Two unification resistance |
| KR102265512B1 (en) * | 2019-09-23 | 2021-06-16 | 스마트전자 주식회사 | Circuit protecting device |
| KR102265518B1 (en) * | 2019-10-07 | 2021-06-16 | 스마트전자 주식회사 | Circuit protecting device |
| WO2021167379A1 (en) * | 2020-02-21 | 2021-08-26 | 주식회사 케이포스 | Resistor with integrated fuse |
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| JP2008097943A (en) * | 2006-10-11 | 2008-04-24 | Uchihashi Estec Co Ltd | Temperature fuse built-in resistor |
| JP2008204832A (en) * | 2007-02-21 | 2008-09-04 | Uchihashi Estec Co Ltd | Resistor with temperature fuse |
| JP2010157410A (en) * | 2008-12-26 | 2010-07-15 | Teikoku Tsushin Kogyo Co Ltd | Fuse resistor |
| JP2011100679A (en) * | 2009-11-09 | 2011-05-19 | Uchihashi Estec Co Ltd | Thermal fuse built-in resistor and electric circuit using this thermal fuse built-in resistor |
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| KR20020078649A (en) * | 2001-04-07 | 2002-10-19 | 스마트전자 주식회사 | Fusible resistor and method of fabricating the same |
| KR101060013B1 (en) * | 2009-04-21 | 2011-08-26 | 스마트전자 주식회사 | Fuse Resistor, Manufacturing Method and Installation Method |
| KR101038237B1 (en) * | 2009-04-21 | 2011-05-31 | 스마트전자 주식회사 | Thermal Fuse Resistor |
| KR20120009303A (en) * | 2010-07-23 | 2012-02-01 | 스마트전자 주식회사 | Circuit protection element of ceramic radiant heat structure and manufacturing method thereof |
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2012
- 2012-12-21 KR KR1020120151297A patent/KR101496526B1/en active IP Right Grant
-
2013
- 2013-10-08 TW TW102136280A patent/TWI457953B/en active
- 2013-12-23 CN CN201380011995.5A patent/CN104246920B/en active Active
- 2013-12-23 JP JP2015508884A patent/JP5932139B2/en active Active
- 2013-12-23 WO PCT/KR2013/012027 patent/WO2014098540A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008097943A (en) * | 2006-10-11 | 2008-04-24 | Uchihashi Estec Co Ltd | Temperature fuse built-in resistor |
| JP2008204832A (en) * | 2007-02-21 | 2008-09-04 | Uchihashi Estec Co Ltd | Resistor with temperature fuse |
| JP2010157410A (en) * | 2008-12-26 | 2010-07-15 | Teikoku Tsushin Kogyo Co Ltd | Fuse resistor |
| JP2011100679A (en) * | 2009-11-09 | 2011-05-19 | Uchihashi Estec Co Ltd | Thermal fuse built-in resistor and electric circuit using this thermal fuse built-in resistor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106024548A (en) * | 2015-03-25 | 2016-10-12 | 斯玛特电子公司 | Fuse resistor and manufacturing method thereof |
| CN112490095A (en) * | 2019-09-12 | 2021-03-12 | 斯玛特电子公司 | Circuit protection device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104246920B (en) | 2017-08-01 |
| KR101496526B1 (en) | 2015-02-27 |
| TW201440083A (en) | 2014-10-16 |
| TWI457953B (en) | 2014-10-21 |
| WO2014098540A1 (en) | 2014-06-26 |
| JP2015515108A (en) | 2015-05-21 |
| JP5932139B2 (en) | 2016-06-08 |
| KR20140082061A (en) | 2014-07-02 |
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