TW201436692A - 電子裝置 - Google Patents

電子裝置 Download PDF

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Publication number
TW201436692A
TW201436692A TW102108391A TW102108391A TW201436692A TW 201436692 A TW201436692 A TW 201436692A TW 102108391 A TW102108391 A TW 102108391A TW 102108391 A TW102108391 A TW 102108391A TW 201436692 A TW201436692 A TW 201436692A
Authority
TW
Taiwan
Prior art keywords
circuit board
electronic device
inductor
board
mounting portion
Prior art date
Application number
TW102108391A
Other languages
English (en)
Inventor
Wei-Shih Chen
Li-Che Lu
Shu-Yuan Kuo
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW102108391A priority Critical patent/TW201436692A/zh
Priority to US14/190,085 priority patent/US20140254110A1/en
Priority to JP2014040179A priority patent/JP2014174163A/ja
Publication of TW201436692A publication Critical patent/TW201436692A/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/147Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09145Edge details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10151Sensor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10189Non-printed connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

一種電子裝置,包括有底座、裝設於所述底座內之電路板、一感應器及一柔性轉接板,所述感應器裝於所述柔性轉接板上並藉由所述柔性轉接板電性連接所述電路板。

Description

電子裝置
本發明涉及一種電子裝置,尤指一種具有感應器之電子裝置。
紅外線感應器廣泛運用於各種電子設備,如手機、筆記型電腦中,通常紅外線感應器是直接打於印製電路板(Printed Circuit Board, PCB)之表面,其相對印製電路板之位置無法改變,紅外線感應器之感應方向與所述電路板大致垂直,而位於所述電子設備側面之物體,所述紅外線感應器無法感應到。另外,所述紅外線感應器之結構較大佔據印製電路板之大量空間,從而影響印製電路板之佈線,再者,紅外線感應器之位置會增加電路板之總體厚度,從而影響電子設備之厚度。
鑒於以上內容,有必要提供一種感應器位置能夠改變之電子裝置。
一種電子裝置,包括有底座、裝設於所述底座內之電路板、一感應器及一柔性轉接板,所述感應器裝於所述柔性轉接板上並藉由所述柔性轉接板電性連接所述電路板。
與習知技術相比,上述電子裝置中,所述感應器裝於轉接板上,因此可藉由所述轉接板之柔性而改變其相對所述電路板之相對位置,由此,可將所述感應器安裝於電子產品之空餘位置,而為電子產品節約空間。
30...電子產品
10...底座
11...頂板
13...側板
131...介面
15...安裝部
151...安裝槽
20...電路板
21...連接器
23...缺口
40...轉接板
50...感應器
60...感應器組合
圖1是本發明電子裝置之較佳實施方式中之一立體分解圖。
圖2是圖1中II部分之一放大圖。
圖3是圖1中III部分之一放大圖。
圖4是圖1之一立體組裝圖。
圖5是圖4中VI部分之一放大圖。
請參閱圖1-3,於本發明之一較佳實施方式中,一電子裝置包括有一電子產品30及一裝設於所述電子產品30內之感應器組合60。於一本實施例中,所述電子產品30為一筆記型電腦。
所述電子產品30包括有一底座10及一裝設於所述底座10內之電路板20。於一實施方式中,所述電路板20為一主機板。所述電路板20對應所述感應器組合60設有一連接器21,並對應所述感應器組合60開設有一缺口23。所述底座10包括有一頂板11及一設於所述頂板11一側之側板13。所述頂板11與所述側板13大致垂直,並靠近所述側板13凸設有一安裝部15。所述安裝部15開設有一用以固定所述感應器組合60之安裝槽151(見圖3)。所述安裝部15具有彈性。於一較佳實施方式中,所述安裝部15由塑膠材料製成。所述側板13開設有一用於供外接設備使用之介面131。
所述感應器組合60包括有一轉接板40及一設於所述轉接板40上之感應器50。所述轉接板40具有柔性,並能夠彎折而使所述感應器50處於水平或者垂直位置。於一較佳實施方式中,所述轉接板40是一柔性印製電路板(Flexible Printed Circuit Board,FPC)。所述感應器50可用以感應所述電子產品30是否有外接設備,如滑鼠、移動硬碟機、閃盤等,接入。於一實施方式中,所述感應器50為一紅外線感應器。
請參照圖4及圖5,組裝時,所述電路板20安裝於所述底座10之頂板11上,且所述安裝部15正好位於所述電路板20之缺口23內,所述轉接板40安裝有所述感應器50之一端彎折成90度,而所述感應器50所朝方向與所述電路板20所於平面大致平行。所述轉接板40之另一端插入所述連接器21中,而使所述感應器50與所述電路板20電性連接。所述感應器50彈性卡入所述底座10之安裝槽151中,並具有一朝向A之感應方向,所述感應方向大致與所述電路板20平行。
藉由上述轉接板40,一方面,使所述感應器50安裝於所述電路板20之一側,用於感應所述電路板20側面的物體,並為所述電路板20節約空間,另一方面,所述感應器50未凸設於所述電路板20之表面,降低了電路板20之整體厚度。
綜上所述,本發明確已符合發明專利要求,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,舉凡熟悉本發明技藝之人士,爰依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下之申請專利範圍內。
11...頂板
13...側板
15...安裝部
20...電路板
21...連接器
23...缺口
40...轉接板
50...感應器

Claims (9)

  1. 一種電子裝置,包括有底座、裝設於所述底座內之電路板、一感應器及一柔性轉接板,所述感應器裝於所述柔性轉接板上並藉由所述柔性轉接板電性連接所述電路板。
  2. 如請求項1所述之電子裝置,其中所述轉接板為一柔性印製電路板。
  3. 如請求項1項所述之電子裝置,其中所述電路板設有一連接器,所述轉接板藉由所述連接器與所述電路板連接,從而使所述感應器與所述電路板電性連接。
  4. 如請求項1項所述之電子裝置,其中所述底座包括有頂板,所述頂板上設有安裝部,所述安裝部開設有安裝槽,所述感應器卡於所述安裝槽內。
  5. 如請求項4項所述之電子裝置,其中所述安裝部具有彈性。
  6. 如請求項5項所述之電子裝置,其中所述安裝部由塑膠材料製成。
  7. 如請求項5項所述之電子裝置,其中所述電路板開設有一缺口,所述安裝部位於所述缺口內。
  8. 如請求項1項所述之電子裝置,其中所述感應器具有一感應方向,所述感應方向與所述電路板大致平行。
  9. 如請求項1項所述之電子裝置,其中所述感應器為一紅外線感應器。
TW102108391A 2013-03-11 2013-03-11 電子裝置 TW201436692A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW102108391A TW201436692A (zh) 2013-03-11 2013-03-11 電子裝置
US14/190,085 US20140254110A1 (en) 2013-03-11 2014-02-25 Electronic device with sensor assembly
JP2014040179A JP2014174163A (ja) 2013-03-11 2014-03-03 電子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102108391A TW201436692A (zh) 2013-03-11 2013-03-11 電子裝置

Publications (1)

Publication Number Publication Date
TW201436692A true TW201436692A (zh) 2014-09-16

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ID=51487551

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102108391A TW201436692A (zh) 2013-03-11 2013-03-11 電子裝置

Country Status (3)

Country Link
US (1) US20140254110A1 (zh)
JP (1) JP2014174163A (zh)
TW (1) TW201436692A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106226566A (zh) * 2016-08-30 2016-12-14 四川汉舟电气股份有限公司 一种高性能组合仪表的互感器盒

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1022291B1 (nl) * 2014-12-17 2016-03-14 Tense Gemakkelijk installeerbaar sensorsysteem en onderdelen

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6497035B1 (en) * 1999-12-06 2002-12-24 Hr Textron, Inc. Hall position sensor
JP4773170B2 (ja) * 2005-09-14 2011-09-14 任天堂株式会社 ゲームプログラムおよびゲームシステム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106226566A (zh) * 2016-08-30 2016-12-14 四川汉舟电气股份有限公司 一种高性能组合仪表的互感器盒

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Publication number Publication date
US20140254110A1 (en) 2014-09-11
JP2014174163A (ja) 2014-09-22

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