TW201426459A - Touch panel and manufacturing method thereof - Google Patents

Abstract

A touch panel is divided into a sensing region and a line region, and the line region is at the side of the sensing region. The touch panel includes an electrode layer, a first conducting wire layer, a second conducting wire layer and an insulation layer. The electrode layer is in the sensing region. The first conducting wire layer is in the line region and connected to the electrode layer. The second conducting wire layer is connected to the first conducting wire layer in the line region. The insulation layer is deposited between the first conducting wire layer and the second conducting wire layer in the line region, and the insulation layer has a plurality of first holes. The first conducting wire layer is connected to the second conducting wire layer through the first holes. The manufacturing method of the touch panel is also disclosed. The electrode structure of said touch panel is able to be applied in the large-size touch panel. In other words, said touch panel is able to improve the phenomenon of the signal attenuation of the large-size touch panel without adding the width of the mask region of the touch panel.

Description

Touch panel and method of manufacturing same

The present invention relates to a touch technology, and more particularly to a touch panel and a method of fabricating the same.

As shown in FIG. 1 , it is a schematic diagram of a conventional touch panel structure. The touch panel 10 includes a first electrode 1 and a second electrode 2 that are vertically staggered. Both ends of the first electrode 1 and the second electrode 2 are taken out by the wires 3 and concentrated to the controller 4. The touch of the external conductive object on the electrode may cause some electrical parameters on the first electrode 1 and the second electrode 2 to change, and the electrical signal whose electrical parameter changes is transmitted to the controller 4, and the touched position is calculated, thereby further Implement touch function. It can be understood that as the size of the touch panel increases, the path through which the wires 3 converge from one end to the controller 4 also becomes longer, according to the resistance law R=ρL/S (ρ is the resistivity of the material of the wire 3, L is The length of the wire 3, S is the cross-sectional area of the wire 3), and in the case where ρ and S are constant, an increase in the length of the wire 3 causes the wire resistance to become large, causing attenuation of the touch signal. In the conventional solution, the width of the wire 3 can be increased to increase the cross-sectional area of the wire 3, thereby balancing the wire resistance of the wire 3, thereby improving the attenuation of the touch signal. However, since the width of the wire 3 is increased, when the touch panel is subsequently applied to the touch display device, in order to avoid the visible view of the wire 3, the frame of the touch display device is shielded (such as a common touch hand). The invisible area of the machine will also be widened, which will not meet the product requirements of the narrow-frame touch display device.

Based on this, it is necessary to provide a touch panel and a method for manufacturing the same that can reduce the attenuation of the touch signal, and can still improve the signal attenuation problem of the large panel while satisfying the demand of the narrow frame.

The embodiment of the invention provides a touch panel, which defines a sensing area and a line area located at an edge of the sensing area, wherein the touch panel comprises an electrode layer, a first wire layer, a second wire layer and an insulating layer. The electrode layer is located within the sensing region. The first wire layer is located in the wiring region and is electrically connected to the electrode layer. The second wire layer and the first wire layer are electrically connected in the circuit region. The insulating layer is disposed between the first wire layer and the second wire layer in the circuit region and is provided with a plurality of first through holes, and the first wire layer and the second wire layer are electrically connected through the first through hole.

The embodiment of the present invention provides a method for manufacturing a touch panel. The touch panel defines a sensing area and a line area located at an edge of the sensing area. The manufacturing method of the touch panel includes: forming an electrode layer in the sensing area; Forming a first wire layer in the circuit region, and the first wire layer is electrically connected to the electrode layer; forming a second wire layer, and the second wire layer and the first wire layer are electrically connected in the circuit region; forming an insulating layer The insulating layer is disposed between the first wire layer and the second wire layer in the circuit region and is provided with a plurality of first through holes, and the first wire layer and the second wire layer are electrically connected through the first through hole.

In summary, the touch panel proposed by the embodiment of the present invention passes The double-layered wire layer design increases the resistance area in a phase-shifted manner without increasing the width of the wire layer, thereby balancing the resistance value, thereby improving the width of the shielded area of the touch panel frame while improving the size of the large-sized panel. The problem of signal attenuation makes the touch panel suitable for use in larger touch products.

The detailed description of the present invention and the accompanying drawings are to be understood by the claims The scope is subject to any restrictions.

1‧‧‧first electrode

2‧‧‧second electrode

3‧‧‧ Both ends through the wire

4‧‧‧ Controller

10, 100, 200‧‧‧ touch panels

102, 202‧‧‧ Sensing area

104, 204‧‧‧ line area

110, 210‧‧‧ substrate

120, 220‧‧‧ electrode layer

122‧‧‧First direction electrode unit

124‧‧‧second direction electrode unit

126‧‧‧Connecting line

130, 230‧‧‧ first wire layer

132, 232‧‧‧ first wire

140, 240‧‧‧ insulation

142, 242‧‧‧ first through hole

143‧‧‧second through hole

150, 250‧‧‧ second wire layer

152, 252‧‧‧ second conductor

154‧‧‧Bridge wiring

S101~S106, S201~S206‧‧‧ steps

FIG. 1 is a schematic structural view of a conventional touch panel.

2 is an exploded view of a touch panel in accordance with an embodiment of the present invention.

FIG. 3 is an exploded view of a touch panel according to another embodiment of the present invention.

4 is an exploded view of a touch panel according to still another embodiment of the present invention.

FIG. 5 is a flow chart of a method of manufacturing a touch panel according to an embodiment of the invention.

6a-6c are top views of the touch panel in different steps in the flow chart shown in FIG. 5.

Figure 6d is a cross-sectional view taken along line A-A' of Figure 6c.

FIG. 7 is a flow chart of a method of manufacturing a touch panel according to another embodiment of the present invention.

8a-8c are top views of the touch panel in different steps in the flow chart shown in FIG. 7.

Figure 8d is a cross-sectional view taken along line B-B' of Figure 8c.

Please refer to FIG. 2 , which illustrates a touch panel according to an embodiment of the invention. Explosion map. The touch panel 100 defines a sensing area 102 and a line area 104 at an edge of the sensing area 102. The touch panel 100 includes an electrode layer 120, a first wire layer 130, an insulating layer 140, and a second wire layer 150. The position and number of the line regions 104 may be adjusted according to the specific structure of the electrode layer 120 and the number of the first wires 132 included in the first wire layer 130. For example, the line region 104 may be located on one side or more sides of the electrode layer 120. The electrode layer 120 is located in the sensing region 102 , and the first wire layer 130 is located in the circuit region 104 and electrically connected to the electrode layer 120 . The second wire layer 150 is electrically connected to the first wire layer 130 in the line region 104. The insulating layer 140 may be disposed between the first wire layer 130 and the second wire layer 150 in the line region 104, and the plurality of first through holes 142 are disposed on the insulating layer 140 in the circuit region 104, and the foregoing The one wire layer 130 and the second wire layer 150 are electrically connected to each other through the first through holes 142 provided on the insulating layer 140.

In this embodiment, the touch panel 100 further includes a substrate 110. The first wire layer 130 and the electrode layer 120 are disposed on the substrate 100. The insulating layer 140 may be disposed on the electrode layer 120 in the sensing region 102. The insulating layer 140 The wiring layer 104 may be disposed on the first wiring layer 130, and the insulating layer 140 disposed on the electrode layer 120 may be used to protect the electrode layer 120.

The substrate 110 may be a glass substrate or a transparent substrate such as a polyethylene terephthalate (PET). The substrate 110 can be a planar shape, a curved shape, or a combination of the two, thereby adapting to different touch product needs. The substrate 110 can also be a rigid substrate or a disturbable substrate.

The electrode layer 120 may be a Silver Nano-Wire (SNW) layer, a Carbon nanotube (CNT) layer, or Graphene (Graphene). Layer, conductive conductive layer, and oxidized metal (ITO, AZO...Gel) layer. More specifically, when the electrode layer 120 is made of a material that is easily oxidized such as nanosilver, the insulating layer 140 disposed on the electrode layer 120 also isolates part of the air, thereby improving the oxidation resistance of the electrode layer.

The first wire layer 130 includes a plurality of first wires 132, and the second wire layer 150 includes a plurality of second wires 152 respectively corresponding to the first wires 132. The position of the first through hole 142 on the insulating layer 140 corresponds to the positions of the first wire 132 and the second wire 152.

The first wire layer 130 and the electrode layer 120 may be made of the same transparent conductive material. For example, the first wire layer 130 and the electrode layer 120 may be a Silver Nano-Wire (SNW) or a carbon nanotube (Carbon nanotube). CNT), graphene (Graphene), polymer conductive (Conductive Polymer), and oxidized metal (ITO, AZO...Gel), etc., because both use the same transparent conductive material, so both can simultaneously The first wire layer 130 and the electrode layer 120 may also be made of different conductive materials. For example, the electrode layer 120 is still the above transparent conductive material, but the first wire layer 130 may be made of aluminum. A metal material such as silver or copper, an alloy material such as molybdenum aluminum molybdenum, or a transparent material such as indium tin oxide, or a combination thereof, wherein, preferentially, the first wire layer 130 is made of a metal material, and the metal material has a preferable electrical conductivity.

The insulating layer 140 may be disposed between the first conductive layer 130 and the second conductive layer 150 in the line region 104. The first through hole 142 on the first conductive layer 140 corresponds to the position of the first conductive line 132. The number of the first through holes 142 may be Determined according to the length of the first wire 132, That is, there may be more first through holes 142 at positions corresponding to the longer first wires 132, and fewer first through holes 142 at positions corresponding to the shorter first wires 132, but The number of formations is not limited to this, and there may be different corresponding numbers or positions depending on different designs. The insulating layer 140 may be a transparent insulating layer and may be made of a transparent insulating material such as Acrylate Polymer and Epoxide Resin. In one embodiment, the insulating layer 140 may be disposed on the electrode layer 120 in the sensing region 102. Moreover, since the electrode layer 120 is internally provided with spaced electrode units, there is a gap between the electrode units, and the insulating layer In this case, 140 may be filled in the gaps to be disposed on the substrate 110. In addition, by adjusting the refractive index of the insulating layer 140, the visible problem that the electrode layer 120 may exist may be reduced. More specifically, depending on the material of the electrode layer 120, the insulating layer 140 may select a material having a refractive index greater than 0.1 of the refractive index of the electrode layer 120. Or a material having a refractive index smaller than a refractive index of 0.1 of the electrode layer 120 is selected. In another embodiment, the insulating layer 140 is a laminated structure composed of different refractive index materials, that is, the optical appearance of the overall touch electrode structure can be adjusted by adjusting the refractive index of different laminated materials.

The second wire layer 150 may be made of a metal material such as aluminum, silver or copper, an alloy material such as molybdenum aluminum molybdenum, or a transparent material such as indium tin oxide, or a combination thereof, wherein, preferentially, the second wire layer 150 is made of a metal material or a metal. The material has a good electrical conductivity. Please refer to FIG. 3. FIG. 3 is an exploded view of a touch panel according to another embodiment of the present invention. In this embodiment, the electrode layer 120 includes a first direction electrode unit 122 and a second direction electrode unit 124 that are spaced apart, and a connection line 126 that connects the adjacent second direction electrode units 124, and the first direction electrode unit 122 is located. Both sides of the connecting line 126. the first The direction electrode units 122 are arranged in the first direction, and the second direction electrode units 124 are arranged in the second direction. Preferably, the first direction and the second direction are perpendicular to each other. The second direction electrode unit 124 is electrically connected by the connection line 126 to form a second direction electrode.

Correspondingly, in the embodiment, the insulating layer 140 located in the sensing region 104 is provided with a plurality of second through holes 143, and the second through holes 143 expose a portion of the first direction electrode units 122. The second through hole 143 and the first through hole 142 may be formed in the same step. It should be noted that the number of the second through holes 143 corresponding to the first direction electrode units 122 may not be limited (such as a single number in FIG. 3, and the shape may be various shapes such as a square shape). At the same time, the second wire layer 150 further includes a plurality of bridge wires 154. The bridge wires 154 are disposed on the insulating layer 140 located in the sensing region 102, and the bridge wires 154 are electrically connected to the adjacent first direction through the second through holes 143. Electrode unit 122. By the connection of the bridge wires 154, the spaced first direction electrode units 122 arranged in the first direction are joined to form the first direction electrodes. Preferably, the second wire 152 and the bridge wire 154 are formed of the same conductive material and simultaneously formed, but the two may also be made of different materials.

Except for the above description, the connection relationship between the present embodiment and the previous embodiment in the other components is substantially similar to the material use and manufacturing procedure, and will not be further described herein.

In other embodiments, the longitudinal space of the touch panel line region can be further utilized. For example, a third wire layer (not shown) can be stacked on the second wire layer 150 in the line region 104 to further enhance the wire. The effect of the layer transmission signal.

In addition, in the embodiment of FIG. 2 and FIG. 3, the touch panel is sequentially the substrate 110, the first wire layer 130, the insulating layer 140, and the second wire layer 150, but the components are The stack structure is not limited to the above order. Please refer to FIG. 4. FIG. 4 is an exploded view of a touch panel according to still another embodiment of the present invention. As shown in FIG. 4, the second wire layer 250 of the touch panel 200 is disposed on the substrate 210 in the circuit region 204. The insulating layer 240 is disposed on the substrate 210 in the sensing region 202, and the insulating layer 240 is disposed in the circuit region. The first through hole 242 is disposed on the insulating layer 240 in the circuit region 204. The position of the first through hole 242 corresponds to the position of the second wire layer 250. The electrode layer 220 and the first wire layer 230 are disposed on the insulating layer 240, and the first wire layer 230 and the second wire layer 250 are electrically connected through the first through hole. The electrode layer 220 can also adopt the biaxial electrode structure as shown in FIG. 3 or other types of electrode structures. It should be understood by those skilled in the art that when the electrode layer 220 adopts the electrode structure of FIG. 3, it is disposed on the substrate. The second wire layer 250 on the 210 may also include a plurality of bridge wires in the sensing region 202, and a plurality of second through holes may be correspondingly disposed on the insulating layer 240 in the sensing region 202.

Except for the above description, the connection relationship between the present embodiment and the foregoing embodiments in other components is substantially similar to the material usage and manufacturing procedure, and will not be further described herein. In addition, the present invention also provides a method for fabricating the above touch panel, comprising the steps of: forming an electrode layer in the sensing region; forming a first wire layer in the circuit region, and electrically connecting the first wire layer and the electrode layer Forming a second wire layer, and the second wire layer is electrically connected to the first wire layer in the circuit region; and forming an insulating layer, the insulating layer is disposed between the first wire layer and the second wire layer in the circuit region And a plurality of first through holes, wherein the first wire layer and the second wire layer are electrically connected through the first through hole.

The above steps may be formed in different orders, and more specifically, the touch panel of the above embodiment may be formed in the following manner.

Please refer to FIG. 5. FIG. 5 is a flow chart of a method for manufacturing a touch panel according to an embodiment of the invention. As shown in FIG. 5, the method includes the following steps.

Step S101: providing a substrate. The substrate 110 may be a glass substrate or a transparent substrate such as a polyethylene terephthalate (PET). The substrate 110 can be a planar shape, a curved shape, or a combination of the two, thereby adapting to different touch product needs. The substrate 110 can also be a rigid substrate or a disturbable substrate.

Step S102: forming a transparent conductive layer on the substrate. The transparent conductive layer may be a silver nano-wire (SNW) layer, a carbon nanotube (CNT) layer, a graphene layer, a conductive polymer layer, and a metal oxide layer ( ITO, AZO...Gel) layers, etc. The manner of forming the transparent conductive layer may be a process such as printing, deposition, sputtering, or the like.

Step S103: etching the transparent conductive layer to form an electrode layer and a first wiring layer. Referring to FIG. 6 a , the first wire layer 130 and the electrode layer 120 are formed on the substrate 110 , and the first wire layer 130 is located in the line region 104 , and the electrode layer is located in the sensing region 102 . The first wire layer 130 includes a plurality of first wires 132 electrically connected to different electrodes in the electrode layer 120, respectively. In this embodiment, the first conductive layer 130 and the electrode layer 120 are formed of the same transparent conductive material, and both are formed at the same time, but may be formed at different times, and the first conductive layer 130 and the electrode layer 120 may also be used. Different conductive materials, such as electrode layer 120, are still the above transparent conductive materials, but A wire layer 130 may be made of a metal material such as aluminum, silver or copper, an alloy material such as molybdenum aluminum molybdenum or a transparent material such as indium tin oxide, or a combination thereof, wherein, preferentially, the first wire layer 130 is made of a metal material or a metal material. Has a better conductivity.

Step S104: forming an insulating layer on the first wire layer. Referring to FIG. 6b, an insulating layer 140 is formed on the first wiring layer 130. In the present embodiment, the insulating layer 140 is simultaneously formed on the electrode layer 120, that is, the insulating layer 140 is formed on the electrode layer 120 in the sensing region 102, and the insulating layer is formed in the first wiring layer in the wiring region 104. 130. The insulating layer 140 may be made of a transparent insulating material such as Acrylate Polymer or Epoxide Resin.

Step S105: forming a first through hole on the insulating layer. A first through hole 142 is formed in the insulating layer 140, and a position of the first through hole 142 corresponds to a position of the first wire 132. In another embodiment, the insulating layer having the first through holes 142 may be directly formed using a printing process. Referring to FIG. 3 again, when the electrode layer 120 adopts the electrode structure of FIG. 3, that is, the electrode layer 120 includes the first direction electrode unit 122 and the second direction electrode unit 124 which are arranged at intervals, and connects the adjacent second direction electrode unit 122. The connecting line 126 is disposed, and the first direction electrode unit 122 is located at two sides of the connecting line 124. At this time, the insulating layer 140 located in the sensing area 102 is further formed with a plurality of second through holes 143, and the second through holes 143 are formed. The exposed portion of the first direction electrode unit 122 is exposed. The first through hole 142 and the second through hole 143 may be formed in the same step.

Step S106: forming a second wire layer on the insulating layer, and electrically connecting the second wire layer to the first wire layer through the first through hole. Referring to FIG. 6c, a second wiring layer 150 is formed on the insulating layer 140 at a position corresponding to the first wiring layer 130. First The two wire layers 150 may be made of a metal material such as aluminum, silver or copper, an alloy material such as molybdenum aluminum molybdenum, or a transparent material such as indium tin oxide, or a combination thereof. Preferably, the second wire layer 150 is made of a material having a good electrical conductivity such as a metal material. When the electrode layer 120 adopts the electrode structure of FIG. 3, the second wire layer 150 further includes a plurality of bridge wires 154 formed on the insulating layer 140 located in the sensing region 102, and the bridge wires 154 pass through the second through The hole 143 is electrically connected to the adjacent first direction electrode unit 122.

Referring to Figure 6d, Figure 6d is a cross-sectional view taken along line A-A' of Figure 6c (i.e., the stacked structure at line region 104). The first conductive layer 140 is electrically connected to the first conductive layer 140 and the first conductive layer 140 . The second conductive layer 140 is electrically connected to the first conductive layer 140 . In other embodiments, the second wire layer may be formed on the substrate, and then the insulating layer and the first wire layer and the electrode layer are sequentially formed.

Please refer to FIG. 7. FIG. 7 is a flow chart of a method for manufacturing a touch panel according to another embodiment of the present invention. As shown in Figure 7, the method includes the following steps.

Step S201: providing a substrate. The substrate 210 may be a glass substrate or a polyethylene terephthalate (PET) substrate.

Step S202: forming a second wire layer on the substrate. Referring to FIG. 8a, a second wiring layer 250 is formed on the substrate 210 in the wiring region 104. The second wire layer 250 includes a plurality of second wires 252. The second wire layer 250 may be made of a metal material such as aluminum, silver or copper, an alloy material such as molybdenum aluminum molybdenum or a transparent material such as indium tin oxide, or a combination thereof. Preferably, the second wire layer 250 is made of a material having a good electrical conductivity such as a metal material.

Step S203: forming an insulating layer on the second wire layer. Please refer to the picture 8b, covering the second wire layer 250 to form the insulating layer 240. In this step, the insulating layer 240 may also extend to the sensing region 202 to be formed on the substrate 210. That is, the insulating layer 240 is formed on the substrate 210 in the sensing region 202, and the insulating layer 240 is in the wiring region 204. Formed on the second wire layer 250. The insulating layer 240 may be made of a transparent insulating material such as Acrylate Polymer and Epoxide Resin.

Step S204: forming a first through hole on the insulating layer of the line region. A first through hole 242 is formed in the insulating layer 240 of the wiring region 104, and the position of the first through hole 242 corresponds to the position of the second wire 252. In another embodiment, the insulating layer having the first through holes 242 may be directly formed using a printing process.

Step S205: forming a transparent conductive layer on the insulating layer of the sensing region and the wiring region. The transparent conductive layer may be a silver nano-wire (SNW) layer, a carbon nanotube (CNT) layer, a graphene layer, a conductive polymer layer, and a metal oxide layer ( ITO, AZO...Gel) layers, etc. The manner of forming the transparent conductive layer may be a process such as printing, deposition, sputtering, or the like.

Step S206: etching the transparent conductive layer to form the electrode layer and the first wire layer, and electrically connecting the second wire layer to the first wire layer through the first through hole. Referring to FIG. 8c, an electrode layer 220 is formed on the insulating layer 240 located in the sensing region 202, and a first wiring layer 230 is formed on the insulating layer 240 located in the wiring region 204. The first wire layer 230 includes a plurality of first wires 232 electrically connected to different electrodes in the electrode layer 220. In this embodiment, the first wire layer 230 and the electrode layer 220 are the same through The conductive materials are formed at the same time, but may be formed at different times, and the first conductive layer 230 and the electrode layer 220 may also be made of different conductive materials. For example, the electrode layer 220 is still the above transparent conductive material, but the first conductive layer 230 may be a metal material such as aluminum, silver or copper, an alloy material such as molybdenum aluminum molybdenum, or a transparent material such as indium tin oxide, or a combination thereof. Preferably, the first wire layer 230 is made of a metal material, and the metal material is preferably used. Conductivity.

Referring to Figure 8d, Figure 8d is a cross-sectional view taken along line B-B' of Figure 8c (i.e., the stacked structure at line region 204). The first conductive layer 240 is electrically connected to the second conductive layer 240 and the second conductive layer 240 . The first conductive layer 240 is electrically connected to the second conductive layer 240 .

In addition, in the present embodiment, those skilled in the art should understand that when the electrode layer 220 adopts the electrode structure as shown in FIG. 3 or FIG. 4, the second wire layer 250 also needs to form a bridge wire in step S202. The insulating layer 240 extending to the sensing region 202 may also form a second through hole correspondingly in step S204. According to the above embodiments, the double-layered wire layer design increases the wire area in a phase-changing manner without increasing the width of the wire layer, thereby balancing the resistance value, thereby not increasing the width of the shielding area of the touch panel frame. The problem of signal attenuation caused by large-sized panels is improved, so that the touch panel can be applied to a larger touch product.

The above-mentioned embodiments are merely illustrative of several embodiments of the present invention, and the description thereof is more specific and detailed, but is not to be construed as limiting the scope of the invention. It should be noted that a number of variations and modifications may be made by those skilled in the art without departing from the inventive concept. All belong to the scope of patent protection of the present invention. Therefore, the scope of protection of the present invention should be subject to the appended claims.

100‧‧‧ touch panel

102‧‧‧Sensing area

104‧‧‧Line area

110‧‧‧Substrate

120‧‧‧electrode layer

130‧‧‧First wire layer

132‧‧‧First wire

140‧‧‧Insulation

142‧‧‧First through hole

150‧‧‧Second wire layer

152‧‧‧second wire

Claims (13)

A touch panel includes a sensing area and a line area at an edge of the sensing area, wherein the touch panel includes: an electrode layer located in the sensing area; a first wire layer located in the line area, and Electrically connecting with the electrode layer; the second wire layer is electrically connected to the first wire layer in the circuit region; and the insulating layer is disposed in the first wire layer and the second wire in the circuit region A plurality of first through holes are formed between the layers, and the first wire layer and the second wire layer are electrically connected through the first through holes. The touch panel of claim 1, wherein the first wire layer comprises a plurality of first wires, and the second wire layer comprises a plurality of second wires respectively corresponding to the plurality of first wires. The touch panel of claim 1, wherein the first wire layer and the electrode layer are disposed on a substrate, the insulating layer is disposed on the electrode layer in the sensing region, and the insulating layer is on the circuit The zone is disposed on the first wire layer. The touch panel of claim 1, wherein the first wire layer and the electrode layer are made of the same transparent conductive material. The touch panel of claim 3, wherein the electrode layer comprises a first direction electrode unit and a second direction electrode unit arranged in a spaced relationship, and a connection line connecting the second direction electrode unit, and the first direction The electrode unit is located at two sides of the connecting line, wherein the insulating layer located in the sensing region is provided with a plurality of second through holes, and the second through hole exposes a portion of the first direction electrode unit, and the second wire The layer further includes a plurality of bridge wires disposed on the insulating layer located in the sensing region, and the bridge wires are electrically connected to the adjacent first direction electrode units through the second through holes. The touch panel of claim 1, wherein the second wire layer is disposed on a substrate in the circuit region, and the insulating layer is disposed on the substrate in the sensing region, the insulating layer is The line area is disposed on the second wire layer. The touch panel of claim 1, wherein the second wire layer is made of any one or a combination of a metal material, an alloy material, and a transparent conductive material. The touch panel of claim 1, wherein the insulating layer is a laminated structure composed of different refractive index materials. A touch panel manufacturing method, the touch panel defines a sensing area and a line area located at an edge of the sensing area, and the manufacturing method of the touch panel comprises: forming an electrode layer in the sensing area; forming a first The wire layer is electrically connected to the electrode layer; and the first wire layer is electrically connected to the electrode layer; and the second wire layer is electrically connected to the first wire layer in the circuit region; Forming an insulating layer, the insulating layer is disposed between the first wire layer and the second wire layer in the circuit region and is provided with a plurality of first through holes, and the first wire layer and the second wire layer pass The first through hole is electrically connected. The method of manufacturing the touch panel of claim 9, wherein the first wire layer and the electrode layer are formed on a substrate, and the insulating layer is formed on the electrode layer in the sensing region, the insulating layer The wiring area is formed on the first wiring layer. The method of manufacturing the touch panel of claim 10, wherein the step of forming the electrode layer and the first wire layer on the substrate comprises: forming a transparent conductive layer on the substrate; and etching the transparent conductive layer to form The electrode layer and the first wire layer. The method of manufacturing the touch panel of claim 10, wherein the electrode layer comprises a first direction electrode unit and a second direction electrode unit arranged in a spaced apart manner, and a connection line connecting the adjacent second direction electrode units, and the a directional electrode unit is located at two sides of the connecting line, wherein a plurality of second through holes are formed on the insulating layer in the sensing region, and the second through hole exposes a portion of the first directional electrode unit, and the The second wire layer further includes a plurality of bridge wires formed on the insulating layer located in the sensing region, and the bridge wire passes the second through The through hole is electrically connected to the adjacent first direction electrode unit. The method of manufacturing the touch panel of claim 9, wherein the second wire layer is formed on the substrate in the circuit region, and the insulating layer is formed on the substrate in the sensing region, An insulating layer is formed on the second wiring layer in the wiring region.