TW201423341A - Server - Google Patents

Abstract

A server includes a housing, a plurality of circuit boards, and a plurality of heat sinks. The circuit boards are disposed in the housing. Each of the circuit boards includes a plurality of central processing units. The heat sinks are disposed in the housing and correspond to the circuit boards respectively. Each of the heat sinks includes at least one heat pipe and a heat-dissipating fin set. The heat-dissipating fin set receives heat generated by the corresponding central processing units via the heat pipe and then dissipate the heat in the air.

Description

server

The present invention relates to a server, and more particularly to a server for reducing the number of heat sinks.

Currently, some servers on the market use many Central Processing Units (CPUs). Although the power of each central processing unit is not very high, additional cooling equipment must be added to meet the cooling requirements.

For example, in the case of a server having twelve central processing boards, each central processing board is provided with four central processing units and one switch. Since the central processing unit and the exchanger both generate heat, additional cooling equipment is required. It is customary to have a separate heat sink for each central processing unit and switch, but only the central processing board in the entire system requires up to sixty heat sinks, for volume limited servers. It is not a small burden.

On the other hand, the heat sinks on each central processing circuit board are arranged in a row, so the wind resistance formed is large, and thus most of the airflow generated by the fan flows through other places with less wind resistance, and there is not enough The airflow cools all the radiators. Therefore, the conventional method must also design a baffle to guide the airflow to the heat sink, which not only increases the cost of the component, but also reduces the internal space utilization rate of the server.

The invention provides a server comprising a casing, a plurality of central processing boards and a plurality of heat sinks. The central processing circuit board is disposed in the casing. Each central processing board contains a plurality of central processing units. The heat sink is disposed in the casing and corresponds to the central processing circuit board. Each heat sink includes at least one heat pipe and a heat sink fin set. The heat sink fin group receives heat generated by the central processing unit on the corresponding central processing circuit board through the heat pipe and is dissipated into the air.

In an embodiment of the invention, the central processing circuit board is disposed in the casing in parallel in the first direction. The central processing board is vertically oriented in the first direction.

In an embodiment of the invention, the server further includes a plurality of fans. Each fan has an air outlet. Each heat sink fin group is located at a corresponding air outlet.

In an embodiment of the invention, the central processing circuit board is disposed in the casing in parallel in the first direction. The fans are arranged in a row along the first direction. The heat sink fin sets are also arranged in a row along the first direction.

In an embodiment of the invention, each of the heat dissipation fin sets separates a corresponding fan from a central processing unit on a corresponding central processing circuit board.

In an embodiment of the invention, the central processing unit on each of the central processing circuit boards is thermally coupled to a corresponding heat dissipation fin set by a single heat pipe.

In an embodiment of the invention, the central processing unit on each of the central processing circuit boards is disposed along the second direction, and the corresponding heat pipes are thermally coupled to the central processing unit in the second direction.

In an embodiment of the invention, each of the heat dissipation fin sets is thermally insulated and fixed to a corresponding central processing circuit board.

In an embodiment of the invention, the heat dissipation fin set is thermally connected to the casing.

In an embodiment of the invention, each of the central processing boards described above further includes a switch. The central processing unit and the switch on each central processing board are electrically connected. The central processing unit and the switch on each central processing circuit board share a heat pipe to be thermally connected to the corresponding heat sink fin group.

In summary, the main feature of the server of the present invention is that it is a heat sink designed for each central processing circuit board, and can simultaneously cool a plurality of central processing units and switches disposed on the same central processing circuit board. . Therefore, the server of the present invention can reduce the number of heat sinks required, which not only reduces the cost of parts but also reduces the internal space utilization rate of the server. Moreover, since one heat sink is used on each central processing circuit board, it is only necessary to provide the heat sink in the air outlet of the fan, and no additional baffle is required. Furthermore, reducing the number of heat sinks used by the server can reduce the internal wind resistance of the server to improve the smoothness of airflow, thus indirectly reducing the temperature of all central processing units and switches.

The embodiments of the present invention are disclosed in the following drawings, and for the purpose of clarity However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some conventional knots are used to simplify the schema. The components and elements will be illustrated in a simplified schematic manner.

Please refer to Figure 1 and Figure 2. FIG. 1 is a perspective view showing a servo 1 according to an embodiment of the present invention. 2 is a perspective view showing the servo 1 of FIG. 1 in which only one central processing circuit board 14 is inserted into the motherboard 12.

As shown in FIGS. 1 and 2, in the present embodiment, the server 1 includes at least a casing 10, a motherboard 12, a plurality of central processing boards 14, a plurality of heat sinks 16, a plurality of fans 18, and a power source. Provider 20.

The motherboard 12 of the server 1 is disposed at the bottom of the casing 10. The central processing circuit board 14 of the server 1 is arranged in parallel in the first direction A1 in the casing 10 and is inserted into the motherboard 12 to supply computing resources to the motherboard 12. In an embodiment, each central processing circuit board 14 of the server 1 is perpendicular to the first direction A1, but the invention is not limited thereto.

The power supply 20 of the server 1 is disposed in the casing 10 and electrically connected to the motherboard 12 to provide power required by the motherboard 12. The central processing circuit board 14 inserted in the motherboard 12 receives power through the motherboard 12.

It should be noted that the present embodiment is exemplified by the server 1 having twelve central processing boards 14, but the invention is not limited thereto. In practical applications, regardless of the size of the server or the number of central processing boards 14 included therein, the concept of the server 1 of the present invention can be effectively reduced as long as there is a need for the use of the heat sink 16. The number of heat sinks 16 increases the overall heat dissipation efficiency.

As shown in FIG. 2, in the present embodiment, each central processing circuit board 14 of the server 1 includes a plurality of central processing units 140 and switches 142, and a central processing unit on each central processing circuit board 14. 140 The switch 142 is electrically connected to each other. During the operation of the central processing unit 140 on the central processing board 14, the central processing unit 140 and the switch 142 tend to generate a large amount of heat and must therefore dissipate heat through the heat sink 16.

The heat sinks 16 of the server 1 are respectively corresponding to the central processing circuit board 14 (i.e., each central processing circuit board 14 is cooled by a corresponding heat sink 16). Each heat sink 16 includes a heat pipe 160 and a heat sink fin set 162. The heat pipe 160 of the heat sink 16 is simultaneously thermally coupled to the central processing unit 140 and the exchanger 142 on the corresponding central processing circuit board 14 to thereby rapidly dissipate the heat generated by the central processing unit 140 and the exchanger 142. The heat sink fin set 162 of the heat sink 16 is coupled to the heat pipe 160, thereby receiving heat generated by the central processing unit 140 and the exchanger 142 on the corresponding central processing circuit board 14 through the heat pipe 160 and dissipating into the air.

In order to prevent the high temperature of the heat dissipation fin group 162 after absorbing heat from adversely affecting the performance of the corresponding central processing circuit board 14, the present invention thermally fixes the heat dissipation fin group 162 of each heat sink 16 to the corresponding one. The central processing board 14 is on.

It should be noted that the present embodiment is exemplified by a central processing circuit board 14 having four central processing units 140, but the invention is not limited thereto.

The fans 18 of the server 1 are arranged in a row in the first direction A1 in the casing 10 and on the same side of the central processing circuit board 14 for generating airflow toward the central processing circuit board 14. The heat dissipation fin groups 162 of each of the heat sinks 16 are also arranged in a row along the first direction A1. The casing 10 of the server 1 further includes a partition 100 for separating the central processing circuit board 14 from the fan 18. The partition 100 has a plurality of openings 100a, and the openings 100a correspond to the middle The central processing circuit board 14 (that is, one central processing circuit board 14 corresponding to each opening 100a) is not limited thereto.

Each fan 18 of the server 1 has an air outlet 180. The heat dissipation fin set 162 of each heat sink 16 is located at the corresponding opening 100a and the corresponding air outlet 180. In the present embodiment, the partition 100 of the casing 10 further separates the central processing board 14 from the fan 18. The airflow blown by the air outlet 180 of each fan 18 passes through two corresponding openings 100a on the partition 100 and is blown to the heat sink fin sets 162 of the two corresponding heat sinks 16 (i.e., each fan 18). There are two corresponding heat dissipation fin sets 162), but the invention is not limited thereto. Thereby, the airflow generated by the fan 18 can effectively dissipate the heat absorbed by the heat dissipation fin group 162 into the air.

In addition, the central processing unit 140 and the exchanger 142 on each central processing circuit board 14 are disposed along the second direction A2, and the corresponding heat pipes 160 are thermally coupled to the central processing unit 140 and the exchanger 142 in the second direction A2. The heat sink fin set 162 of each heat sink 16 separates the corresponding fan 18 from the central processing unit 140 on the corresponding central processing circuit board 14. Therefore, the airflow blown by the air outlet 180 of the fan 18 is first blown to the heat dissipation fin sets 162 of the two corresponding heat sinks 16 after passing through the two corresponding openings 100a of the partition plate 100. The airflow will pass through the central processing unit 140 and the exchanger 142 after passing through the heat sink fin set 162.

Since the number of heat sinks 16 used by the server 1 of the present invention is small, the wind resistance within the cabinet 10 can be reduced, so that the airflow can quickly flow through the central processing unit 140 and the exchanger 142 after passing through the heat dissipation fin set 162. In turn, the temperature of all central processing unit 140 and exchanger 142 can be reduced indirectly.

In order to increase the heat dissipation efficiency of the heat sink 16, in the present embodiment, the heat dissipation fin group 162 of each heat sink 16 is thermally connected to the casing 10 (or thermally connected to the separator 100 at the same time), thereby rapidly conducting heat. The way to transfer heat to the casing 10 to dissipate heat.

It should be noted that the present embodiment is exemplified by the heat sink 16 having only one heat pipe 160 (that is, the central processing unit 140 and the exchanger 142 of each central processing circuit board 14 share one heat pipe 160 heat. It is connected to the corresponding heat dissipation fin group 162), thereby achieving the effect of simplifying the heat dissipation design and reducing the cost, but the invention is not limited thereto.

In another embodiment, the heat sink 16 can include five heat pipes 160 that are respectively coupled to the central processing unit 140 and the exchanger 142 on the corresponding central processing circuit board 14, as well as to the central processing unit 140 and the switch 142. The generated heat is conducted to the heat sink fin set 162 for heat dissipation purposes; in yet another embodiment, the heat sink 16 can include three heat pipes 160 for the central processing unit 140 on the corresponding central processing circuit board 14 and exchange The corresponding 142 of heat sink fins 162 are thermally coupled to each other, i.e., a suitable number of heat pipes 160 are provided for the present invention as desired.

From the above detailed description of the specific embodiments of the present invention, it can be clearly seen that the main feature of the server of the present invention is that it designs an integrated heat sink for each central processing circuit board, which can be cooled at the same time. Multiple central processing units and switches on the same central processing board. Therefore, the server of the present invention can reduce the number of heat sinks required, which not only reduces the cost of parts but also reduces the internal space utilization rate of the server. Moreover, since one heat sink is used on each central processing circuit board, it is only necessary to set the heat sink to the air outlet of the fan, and no additional flow is required. board. Furthermore, reducing the number of heat sinks used by the server can reduce the internal wind resistance of the server to improve the smoothness of airflow, thus indirectly reducing the temperature of all central processing units and switches.

While the present invention has been described above by way of example, it is not intended to limit the invention, and the invention may be modified and modified in various ways without departing from the spirit and scope of the invention. The scope is subject to the definition of the scope of the patent application.

1‧‧‧Server

10‧‧‧Chassis

100‧‧ ‧ partition

100a‧‧‧ openings

12‧‧‧ Motherboard

14‧‧‧Central Processing Board

140‧‧‧Central Processing Unit

142‧‧‧Switch

16‧‧‧ radiator

160‧‧‧heat pipe

162‧‧‧Fixing fin set

18‧‧‧fan

180‧‧‧air outlet

20‧‧‧Power supply

A1‧‧‧ first direction

A2‧‧‧ second direction

FIG. 1 is a perspective view showing a servo according to an embodiment of the present invention.

Fig. 2 is another perspective view showing the servo in Fig. 1, in which only one central processing circuit board is inserted in the motherboard.

1‧‧‧Server

10‧‧‧Chassis

100‧‧ ‧ partition

100a‧‧‧ openings

12‧‧‧ Motherboard

14‧‧‧Central Processing Board

140‧‧‧Central Processing Unit

142‧‧‧Switch

16‧‧‧ radiator

160‧‧‧heat pipe

162‧‧‧Fixing fin set

18‧‧‧fan

180‧‧‧air outlet

20‧‧‧Power supply

A1‧‧‧ first direction

A2‧‧‧ second direction

Claims (10)

A server includes: a casing; a plurality of central processing circuit boards disposed in the casing, each of the central processing circuit boards including a plurality of central processing units; and a plurality of heat sinks disposed on the casing And corresponding to the central processing circuit boards, each of the heat sinks includes: at least one heat pipe; and a heat dissipation fin set, thereby receiving the corresponding central processing on the central processing circuit board through the heat pipe The heat generated by the unit is dissipated into the air. The server of claim 1, wherein the central processing boards are disposed in the chassis in a first direction, the central processing boards being perpendicular to the first direction. The server of claim 1, further comprising a plurality of fans, each of the fans having an air outlet, each of the heat dissipation fin sets being located at a corresponding air outlet. The server of claim 3, wherein the central processing circuit boards are disposed in the first parallel direction in the casing, the fans are arranged in a row along the first direction, and the heat dissipation fin sets are They are also arranged in a row along the first direction. The server of claim 3, wherein each of the heat dissipation fin sets separates the corresponding fan from the central processing units on the corresponding central processing circuit board. The server of claim 1, wherein the central processing units on each of the central processing circuit boards share a heat pipe to be thermally connected to the corresponding heat dissipation fin set. The server of claim 6, wherein the central processing units on each of the central processing circuit boards are disposed along a second direction, and the corresponding heat pipes are thermally coupled to the central portions in the second direction. Processing unit. The server of claim 1, wherein each of the heat dissipation fin sets is thermally insulated from the corresponding central processing circuit board. The server of claim 1, wherein the heat dissipation fin sets are thermally connected to the casing. The server of claim 1, wherein each of the central processing circuit boards further comprises a switch, and the central processing units on each of the central processing circuit boards are electrically connected to the switch, and each The central processing units on the central processing circuit board and the switch share a heat pipe to be thermally connected to the corresponding heat dissipation fin set.