TW201423194A - Method of manufacturing receptacle - Google Patents

Abstract

The purpose of the present invention is to provide a method of manufacturing a receptacle, which enables a highly accurate optical coupling of an optical fiber and an optical element. In the method of manufacturing a receptacle 20, the receptacle 20 includes optical elements 50, 100; a mounting substrate 22; and a positioning member 220, which has lenses 230, 250. The method of manufacturing a receptacle 20 includes a first step for acquiring positional information of the lenses 230, 250 by using an imaging means; a second step for acquiring positional information of the optical elements 50, 100 by using an imaging means; a third step for calculating the relative position of the positioning member 200 relative to the mounting substrate 22 based on the positional information of the lenses and the positional information of the optical elements; and a fourth step for moving the positioning member 200 or the mounting substrate 22 based on the positional information of the relative position such that the lenses 230, 250 and the optical elements 50, 100 are opposite for each other.

Description

Socket manufacturing method

The present invention relates to a method of manufacturing a socket, and more particularly to a method of manufacturing a socket for converting an electrical signal into an optical signal and transmitting the same.

As a method of manufacturing a conventional socket, for example, a method of manufacturing an optical module described in Patent Document 1 is known. Fig. 17 is a perspective view showing the appearance of the optical module described in Patent Document 1.

A vertical resonator surface illuminating laser (hereinafter referred to as VCSEL) is disposed in the optical module 500. Further, on the upper surface of the optical module 500, as shown in FIG. 17, a light entrance portion 551 and a guide pin 552 are provided. In the light entrance/export portion 551, light emitted from the VCSEL passes. Guide pins 552 are provided on both sides of the light entrance and exit portion 551.

However, the optical module 500 is connected to the optical connector 513 mounted at one end of the optical fiber 516 as shown in FIG. The connection between the optical module 500 and the optical connector 513 is performed by the guide pin 552 located on the optical module 500 being inserted into the guiding hole 553 of the optical connector 513. Thereby, the optical fiber 516 is optically coupled to the VCSEL.

However, in such a connection method, it is difficult to make the slave VCSEL due to the positional displacement when the guide pin 552 on the optical module 500 is manufactured or the positional displacement of the VCSEL when it is mounted to the optical module 500. The optical axis of the emitted light and the optical axis of the core of the optical fiber 516 are accurately aligned.

Patent Document 1: Japanese Patent Laid-Open Publication No. 2008-41772

Accordingly, it is an object of the present invention to provide a method of manufacturing a socket that optically couples an optical fiber to an optical element with high precision.

According to a method of manufacturing a socket according to an embodiment of the present invention, the socket includes an optical element, a mounting substrate on which the optical element is mounted on the main surface, and a positioning member placed on a main surface of the mounting substrate, and The optical element is optically coupled to the optical fiber by fitting with a plug provided at one end of the optical fiber, and has a main surface on the structural substrate for concentrating or collimating light incident on or emitted from the optical element. a lens having a normal direction opposite to the optical element, characterized in that: in the first step, the position information of the lens when viewed from the normal direction of the main surface of the package substrate is obtained by the photographing means; a step of obtaining, by means of a photographing means, position information of the optical component when viewed from a normal direction of a main surface of the component substrate; and a third step of calculating a relative position of the lens based on position information of the lens and position information of the optical component And the fourth step of moving the positioning member or the structural substrate according to the position information of the relative position, so that the lens and the optical element are on the main surface of the structural substrate The normal direction is opposite.

According to the method of manufacturing the socket of the present invention, the optical fiber and the optical element can be optically coupled with high precision.

E1‧‧‧Surface electrode

R1, R2‧‧‧ total reflection surface

V1, V2‧‧‧ camera

10‧‧‧Optical transmission module

20‧‧‧ socket

22‧‧‧Construction substrate

24‧‧‧ sealing resin

30‧‧‧metal cover

32a~32d‧‧‧With the Ministry

40‧‧‧ plug

50‧‧‧Light-receiving element array

60‧‧‧ fiber

100‧‧‧Lighting element array

100A, 100B‧‧‧VCSEL (Vertical Resonator Surface Illuminated Laser)

128‧‧‧ bottom substrate

160‧‧‧Multi-layer of light-emitting area

200‧‧‧ Positioning members

230,250‧‧‧ convex lens

911‧‧‧electrode for cathode

921‧‧‧Anode ring electrode

Fig. 1 is a perspective view showing the appearance of an optical transmission module according to an embodiment of the present invention.

Fig. 2 is an exploded perspective view of the socket according to the embodiment of the present invention.

Fig. 3 is a perspective view showing the appearance of a metal cover and a positioning member removed from a socket according to an embodiment of the present invention.

Fig. 4 is a plan view of a light-emitting element array according to an embodiment of the present invention as seen from the positive side in the z-axis direction.

Fig. 5 is a cross-sectional view showing A-A or B-B of the light-emitting element array shown in Fig. 4.

Fig. 6 is an external perspective view showing a state in which a metal cover is removed from a socket according to an embodiment of the present invention.

Fig. 7 is a perspective view showing the appearance of a positioning member according to an embodiment of the present invention.

Fig. 8 is a plan view of the positioning member according to the embodiment of the present invention as seen from the negative side in the z-axis direction.

Fig. 9 is a view showing a configuration of a structure substrate and a plug according to an embodiment of the present invention in a C-C or D-D cross section of the positioning member shown in Fig. 7.

Fig. 10 is a perspective view showing the appearance of a metal cover according to an embodiment of the present invention.

Figure 11 is a perspective view showing the appearance of a plug according to an embodiment of the present invention.

Fig. 12 is a plan view showing a plug according to an embodiment of the present invention from the negative side in the z-axis direction.

Figure 13 is a diagram showing the process of a socket according to an embodiment of the present invention.

Figure 14 is a diagram showing the process of a socket according to an embodiment of the present invention.

Figure 15 is a diagram showing the process of a socket according to an embodiment of the present invention.

Figure 16 is a diagram showing the process of a socket according to an embodiment of the present invention.

Fig. 17 is a perspective view showing the appearance of the optical module described in Patent Document 1.

Hereinafter, a socket, an optical transmission module, and a method of manufacturing the same according to an embodiment of the present invention will be described.

(Composition of optical transmission module)

Hereinafter, the configuration of the socket and the optical transmission module according to the embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing the appearance of an optical transmission module 10 according to an embodiment of the present invention. 2 is an embodiment of the present invention An exploded perspective view of the socket 20 of the form. 3 is an external perspective view of the metal cover 30 and the positioning member 200 removed from the socket 20 according to an embodiment of the present invention. Further, the upper and lower directions of the optical transmission module 10 are defined as the z-axis direction, and the direction along the long side of the optical transmission module 10 when viewed from the z-axis direction is defined as the x-axis direction. Furthermore, the direction along the short side of the light transmission module 10 is defined as the y-axis direction. The x-axis, the y-axis, and the z-axis are orthogonal to each other.

As shown in FIG. 1, the optical transmission module 10 includes a socket 20 and a plug 40. Further, the plug 40 is connected to the socket 20.

As shown in FIG. 2, the socket 20 includes a metal cover 30, a light receiving element array 50, a light emitting element array 100, a positioning member 200, a build substrate 22, and a sealing resin 24.

As shown in FIG. 3, the package substrate 22 has a rectangular shape when viewed in plan from the z-axis direction. Further, when the surface of the package substrate 22 on the negative side in the z-axis direction (hereinafter, the "surface on the negative side in the z-axis direction" is referred to as the back surface) is provided when the optical transmission module 10 is mounted on the circuit board. The surface mount electrode E1 (not shown in FIG. 3) that is in contact with the pad of the circuit board.

The surface on the positive side in the z-axis direction of the package substrate 22 (hereinafter, the "surface on the positive side in the z-axis direction" is referred to as a surface), and the side L1 and the y located on the negative side in the x-axis direction A ground conductor exposed portion E2 in which one of the ground conductors provided in the package substrate 22 is partially exposed is provided in the vicinity of the corner formed by the side L2 on the negative side in the axial direction. The ground conductor exposed portion E2 has a rectangular shape having a long side in the x-axis direction when viewed from the positive side in the z-axis direction.

Further, the surface of the package substrate 22 is provided in the vicinity of the corner formed by the side L1 on the negative side in the x-axis direction and the side L3 on the positive side in the y-axis direction. The ground conductor exposed portion E3 is partially exposed to one of the ground conductors. The ground conductor exposed portion E3 has a rectangular shape with a long side in the x-axis direction when viewed from the positive side in the z-axis direction.

The light-receiving element array 50 and the light-emitting element array 100 are disposed on the structure substrate 22 The portion of the surface on the positive side of the x-axis direction. The light-receiving element array 50 is an element including a plurality of photodiodes that convert optical signals into electrical signals. The light emitting element array 100 is an element including a plurality of diodes that convert electrical signals into optical signals.

Further, the drive circuit 26 is in the positive direction of the x-axis direction of the surface of the package substrate 22. The side portion is provided on the positive side in the x-axis direction of the light-receiving element array 50 and the light-emitting element array 100. The drive circuit 26 is a semiconductor circuit element for driving the light-receiving element array 50 and the light-emitting element array 100.

Moreover, as shown in FIG. 3, the drive circuit 26 is formed in a plan view from the z-axis direction. It has a rectangular shape with long sides parallel to the y-axis direction. The drive circuit 26 and the light-receiving element array 50 are connected by wire bonding through the lead wires U. Further, the drive circuit 26 and the light-emitting element array 100 are connected by wire bonding via the lead wires U. Thereby, the electrical signal from the driving circuit 26 is transmitted to the light emitting element array 100 through the lead U, and the electrical signal from the light receiving element array 50 is transmitted to the driving circuit 26 through the lead U.

As shown in FIG. 3, the sealing resin 24 includes a sealing portion 24a and leg portions 24b to 24e. It is made of a transparent resin such as an epoxy resin. The sealing portion 24a has a substantially rectangular parallelepiped shape and is provided on a portion of the surface of the package substrate 22 on the positive side in the x-axis direction. Further, the sealing portion 24a covers the light receiving element array 50, the light emitting element array 100, and the drive circuit 26.

The leg portions 24b, 24c are arranged in order from the negative side to the positive side of the x-axis direction The way is set at intervals. The leg portions 24b and 24c are rectangular parallelepiped members that protrude from the surface on the negative side in the y-axis direction of the sealing portion 24a toward the side L2 of the package substrate 22. Further, a space H1 in which the convex portion C3 of the metal cover 30 to be described later is fitted is provided between the leg portion 24b and the leg portion 24c.

The leg portions 24d, 24e are arranged in order from the negative side to the positive side of the x-axis direction The way is set at intervals. The leg portions 24d and 24e are members having a rectangular parallelepiped shape that protrudes from the surface on the positive side in the y-axis direction of the sealing portion 24a toward the side L3 of the package substrate 22. Further, a space H2 in which the convex portion C6 of the metal cover 30 to be described later is fitted is provided between the leg portion 24d and the leg portion 24e.

(Composition of light-emitting element array)

Next, the light emitting element array 100 will be described with reference to the drawings. Fig. 4 is a plan view of the light-emitting element array 100 according to the embodiment of the present invention as seen from the positive side in the z-axis direction. Fig. 5 is a cross-sectional view showing A-A or B-B of the light-emitting element array 100 shown in Fig. 4. Further, in the present embodiment, only the two VCSELs 100A and 100B are described, but the number of VCSELs constituting the light-emitting element array 100 of the present invention is not limited thereto.

The light emitting element array 100, as shown in FIG. 4, is provided with two VCSELs 100A, 100B. That is, the VCSELs 100A, 100B are integrated and arrayed, and the VCSELs 100A, 100B are independently driven. Further, the laser beam B1 is emitted from the respective VCSELs 100A, 100B toward the positive side in the z-axis direction. Two VCSELs 100A, 100B, as shown in FIG. 5, are provided on the surface of the common base substrate 128.

The base substrate 128 is made of a semi-insulating semiconductor, specifically, a substrate made of GaAs. The base substrate 128 preferably has a resistivity of 1.0×10 ⁷ Ω. More than cm. By using the base substrate 128 composed of the above-described semi-insulating semiconductor of resistivity, the isolation between the VCESL 100A and the VCSEL 100B can be more surely ensured.

On the surface of the base substrate 128, as shown in FIG. 5, an N-type semiconductor contact layer 130 is laminated. The N-type semiconductor contact layer 130 is provided in each of the VCESL 100A and the VCSEL 100B. In addition, the N-type semiconductor contact layer 130 of VCESL100A and VCESL100B The N-type semiconductor contact layers 130 are insulated from each other. Further, the N-type semiconductor contact layer 130 is composed of a compound semiconductor having N-type conductivity.

On the surface of the N-type semiconductor contact layer 130, as shown in FIG. 5, a layer of N is laminated. A semiconductor multilayer film reflective layer (hereinafter referred to as an N-type DBR layer) 132. Further, the N-type DBR layer 132 is provided with an arc-shaped groove W when viewed from the positive side in the z-axis direction. The groove W is wound half a turn in the negative side of the x-axis direction near the center of each of the VCESLs 100A and 100B. The bottom of the trench W reaches the surface of the N-type semiconductor contact layer 130. The N-type DBR layer 132 is made of AlGaAs, and is formed by laminating a plurality of layers of Al having different composition ratios with respect to Ga. Thereby, the N-type DBR layer 132 functions as a first reflector for generating laser light of a predetermined frequency. Further, the N-type DBR layer 132 may also serve as an N-type semiconductor contact layer. That is, an N-type semiconductor contact layer is not necessary.

On the surface of the N-type DBR layer 132, as shown in FIG. 5, the layer has an N-type semiconductor Body cover layer 134. The N-type semiconductor cladding layer 134 has a circular shape at the center of the VCESL 100A and 100B when viewed in plan from the z-axis direction. Each of the N-type semiconductor cladding layers 134 is insulated from each other. The N-type semiconductor cladding layer 134 is composed of AlGaAs.

On the surface of the N-type semiconductor cladding layer 134, as shown in FIG. 5, an active layer is provided. Layer 136. Further, the active layer 136 is composed of GaAs and AlGaAs. Further, the GaAs layer is provided by being sandwiched by the AlGaAs layer. In addition, the energy of AlGaAs is prohibited to have a larger bandwidth than GaAs. Moreover, the refractive index of GaAs is larger than that of AlGaAs.

On the surface of the active layer 136, as shown in FIG. 5, a P-type semiconductor cladding layer is provided. 138. The P-type semiconductor cladding layer 138 is composed of AlGaAs.

On the surface of the P-type semiconductor cladding layer 138, as shown in FIG. 5, an oxide narrow is provided. Narrow layer 150. When the oxidized narrow layer 150 is viewed from the z-axis direction, it is substantially in the stenosis layer 150 The center has a circular hole 152. The oxidized narrow layer 150 is composed of AlGaAs.

On the surface of the oxidized narrow layer 150, as shown in FIG. 5, a P-type semiconductor is provided. A layer reflective layer (hereinafter referred to as a P-type DBR layer) 140. Further, a portion of the P-type DBR layer 140 is also provided in the hole 152 provided in the oxidized narrow layer, and is in contact with the P-type semiconductor cladding layer 138. The P-type DBR layer 140 is made of AlGaAs, and is formed by laminating a plurality of layers of Al with respect to a composition ratio of Ga. Thereby, the P-type DBR layer 140 functions as a second reflector for generating laser light of a predetermined frequency. In addition, the reflectivity of the P-type DBR layer 140 is lower than that of the N-type DBR layer 132. Here, although a semiconductor coating layer is provided to sandwich the active layer, the configuration is not limited thereto. It is also possible to provide a layer having a film thickness generated by resonance as an active layer.

On the surface of the P-type DBR layer 140, as shown in FIG. 5, a P-type semi-conductive layer is laminated. Body contact layer 142. The P-type semiconductor contact layer 142 is composed of a compound semiconductor having P-type conductivity. Further, the P-type DBR layer may also serve as a P-type semiconductor contact layer. That is, a P-type semiconductor contact layer is not necessary.

By the above-mentioned N-type semiconductor contact layer 130, N-type DBR layer 132, N-type half The conductor cladding layer 134, the active layer 136, the P-type semiconductor cladding layer 138, the P-type DBR layer 140, and the P-type semiconductor contact layer 142 constitute a light-emitting region multilayer portion 160.

In addition, the thickness of each layer and the composition ratio of Al to Ga are set to be in light. The position of the abdomen of the center of the standing wave distribution has a peak wavelength of the luminescence spectrum and is configured with a plurality of quantum wells. Thereby, the light-emitting region multilayer portion 160 functions as a light-emitting portion of the VCSELs 100A and 100B. Further, as shown in FIG. 5, by providing the oxidized constriction layer 150, a current can be efficiently injected into the active layer 136, thereby realizing VCSELs 100A and 100B having low power consumption.

On the surface of the P-type semiconductor contact layer 142, as shown in FIG. 5, an anode is provided. Ring electrode 921. As shown in FIG. 4, the anode ring electrode 921 has a ring shape when viewed in plan from the z-axis direction. Further, the anode electrode does not have to be annular, and may be, for example, a C-shape or a rectangular shape in which one of the annular portions is opened.

As shown in FIGS. 4 and 5, the electrode W of the N-type DBR layer 132 is provided with a cathode electrode 911. Further, the cathode electrode 911 is in contact with the N-type semiconductor contact layer 130 as shown in FIG. Thereby, the cathode electrode 911 is electrically connected to the N-type semiconductor contact layer 130. Further, as shown in FIG. 4, the cathode electrode 911 has an arc shape when viewed in plan from the z-axis direction. Further, this circular arc is substantially concentric with the ring of the annular anode electrode 921.

The insulating film 162 is provided so as to cover the surface of the light-emitting region multilayer portion 160 of the VCSELs 100A and 100B other than the portion where the cathode electrode 911 and the anode ring electrode 921 are provided. Moreover, the material of the insulating film 162 is, for example, tantalum nitride.

In the portion of the VCSEL 100A, 100B on the positive side in the x-axis direction, as shown in FIG. 4, an insulating layer 170 is provided. Further, as shown in FIG. 5, the insulating layer 170 is provided on the insulating film 162 covering the N-type DBR layer 132. As shown in FIG. 4, the insulating layer 170 has a rectangular shape having long sides in the y-axis direction when viewed in plan from the z-axis direction. Further, as a material of the insulating layer 170, for example, polyimide.

As shown in FIG. 4, a cathode pad electrode 912 is provided in a portion on the negative side in the y-axis direction of the surface of the insulating layer 170. The cathode pad electrode 912 is connected to the cathode electrode 911 through the cathode wiring electrode 913.

As shown in FIG. 4, a pad electrode 922 for an anode is provided on a portion of the surface of the insulating layer 170 on the positive side in the y-axis direction. Further, the anode pad electrode 922 and the cathode pad electrode 912 are separated by a predetermined distance. The anode pad electrode 922 is connected to the anode through the anode wiring electrode 923 The ring electrode 921 is used extremely.

Moreover, the light-emitting element array 100 is provided to be divided as shown in FIGS. 4 and 5 The slot 180 of the VCSEL 100A, 100B. As shown in FIG. 4, the groove 180 is a lattice-like groove which is formed in parallel with the x-axis direction and the y-axis direction when viewed in plan from the z-axis direction. Moreover, as shown in FIG. 5, the groove 180 penetrates the insulating film 162, the N-type DBR layer 132, and the N-type semiconductor contact layer 130 in the lamination direction. Furthermore, the bottom of the trench 180 reaches a predetermined depth from the surface of the base substrate 128. Thereby, the VCSELs 100A, 100B can be prevented from being turned on through the N-type semiconductor contact layer 130.

In each VCSEL 100A of the light-emitting element array 100 configured as described above, 100B, by causing a current (driving signal) to flow from the anode pad electrode 922 toward the cathode pad electrode 912, induction discharge is caused in the active layer 136. The light emitted from the active layer is emitted by induction, and is reflected by the N-type DBR layer 132 and the P-type DBR layer 140 to and from the active layer. During and after the round trip, the light is amplified by the induction release, and the laser beam is emitted toward the positive side of the z-axis direction. In addition, since the N-type semiconductor contact layer 130 of the VCSEL 100A is separated from the N-type semiconductor contact layer 130 of the VCSEL 100B, crosstalk between the driving signal of the VCSEL 100A and the driving signal of the VCSEL 100B can be suppressed.

(composition of positioning member)

Next, the socket 20 will be described with reference to the drawings. Fig. 6 is a perspective view showing the appearance of the socket 20 according to the embodiment of the present invention (the metal cover 30 is not shown). Fig. 7 is a perspective view showing the appearance of a positioning member 200 according to an embodiment of the present invention. Fig. 8 is a plan view of the positioning member 200 according to the embodiment of the present invention as seen from the negative side in the z-axis direction. Fig. 9 is a view showing a structure of a package substrate 22 and a plug 40 according to an embodiment of the present invention in a C-C or D-D cross section of the positioning member 200 shown in Fig. 7.

The positioning member 200, as shown in FIG. 6, covers the surface and the dense structure of the substrate 22 The sealing resin 24 is provided over the entire surface of the package substrate 22 and the sealing resin 24. Further, the positioning member 200 includes a positioning member 220 for a light-emitting element and a positioning member 240 for a light-receiving element. The positioning members 220 and 240 are disposed to be sequentially arranged from the negative side to the positive side in the y-axis direction. Further, the positioning member 200 is made of, for example, an epoxy-based or an anti-loning resin.

As shown in FIGS. 7 and 8 , the positioning member 220 for a light-emitting element has a rectangular shape when viewed in plan from the z-axis direction. Further, the positioning member 220 includes a plug guiding portion 222 and a light coupling portion 224.

As shown in FIG. 7, the plug guide portion 222 constitutes a portion of the positioning member 220 on the negative side in the x-axis direction. Further, as shown in FIG. 8, the plug guide portion 222 is a plate-like member having a rectangular shape when viewed in plan from the z-axis direction. Further, the end surface S1 of the plug guiding portion 222 on the positive side in the x-axis direction faces the negative side of the sealing resin 24 in the x-axis direction as shown in FIG. Therefore, the plug guiding portion 222 is located on the mounting substrate 22 on the negative side of the sealing resin 24 in the x-axis direction.

Further, as shown in FIG. 7, the groove G1 for guiding the plug 40 to be described later is substantially parallel to the x-axis at the center of the surface of the plug guiding portion 222 in the y-axis direction. In the plug guide portion 222, a portion on the negative side in the y-axis direction of the groove G1 is referred to as a flat portion F1, and a portion on the positive side in the y-axis direction from the groove G1 is referred to as a flat portion F2. The height H1 of the groove G1 from the substrate 22 in the z-axis direction is lower than the height h2 of the sealing resin 24 in the z-axis direction as shown in FIG.

As shown in FIGS. 7 to 9, the optical coupling portion 224 is placed on the sealing resin 24 so as to constitute a portion of the positioning member 220 on the positive side in the x-axis direction.

Furthermore, the optical coupling unit 224 has a body 226 and an abutting portion as shown in FIG. 7 . 228. The body 226 has a rectangular parallelepiped shape. The abutting portion 228 protrudes from the flat surface portion S2 of the plug guiding portion 222 from the end surface S2 on the negative side in the x-axis direction of the main body 226 to substantially the center in the x-axis direction of the flat portion F1. Thereby, the optical coupling unit 224 has an L shape when viewed in plan from the z-axis direction. Further, an end surface of the contact portion 228 on the negative side in the x-axis direction is referred to as an end surface S3. Further, the optical coupling portion 224 is provided with a concave portion D1 and a convex lens 230.

The recess D1 is provided in the y-axis direction of the optical coupling portion 224 as shown in FIG. Near the side of the positive side. Moreover, the recessed portion D1 overlaps with the light-emitting element array 100 when viewed in plan from the z-axis direction. Further, the recessed portion D1 overlaps with the optical axis of the optical fiber 60 connected to the plug 40 to be described later when viewed in plan from the x-axis direction. In addition, the optical axis of the optical fiber 60 is parallel to the x-axis. Moreover, as shown in FIG. 7, the recessed part D1 has a rectangular shape in planar view from the z-axis direction. Further, as shown in FIG. 9, the concave portion D1 has a V shape when viewed in plan from the y-axis direction.

The inner peripheral surface of the concave portion D1 on the negative side in the x-axis direction is the total reflection surface R1. all The reflecting surface R1, as shown in Fig. 9, is parallel to the y-axis. Further, the total reflection surface R1 is inclined counterclockwise by 45° with respect to the z-axis when viewed from the negative side in the y-axis direction. Also, the refractive index of the positioning member 200 is sufficiently larger than air. The laser beam B1 emitted from the light-emitting element array 100 toward the positive side in the z-axis direction enters the optical coupling portion 224, and is totally reflected by the total reflection surface R1 toward the negative side in the x-axis direction, and is transmitted through the plug 40. Traveling toward fiber 60. At this time, when the light beam of the laser beam B1 is viewed from the y-axis direction, the angle between the optical axis of the laser beam B1 emitted from the light-emitting element array 100 and the total reflection surface R1 is 45°, and the laser beam toward the optical fiber 60 is obtained. The angle between the optical axis of B1 and the total reflection surface R1 is 45°. That is, the angle formed by the total reflection surface R1 and the optical axis of the optical fiber 60 is equal to the angle formed by the total reflection surface R1 and the light-emitting element array 100.

The convex lens 230 (first convex lens) is provided in the optical coupling as shown in FIGS. 8 and 9 The surface of the portion 224 on the negative side in the z-axis direction. Further, the convex lens 230 overlaps with each VCSEL of the light-emitting element array 100 when viewed in plan from the z-axis direction. Thereby, the convex lens 230 opposes the light-emitting element array 100 and is located on the optical path of the laser beam B1. Further, the convex lens 230 has a semicircular shape that protrudes toward the negative side of the z-axis when viewed from a direction orthogonal to the z-axis. Therefore, the laser beam B1 emitted from the light-emitting element array 100 is condensed or collimated by the convex lens 230, and is incident on the total reflection surface R1.

The positioning member 240 for the light receiving element is as shown in FIGS. 7 and 8 from the z-axis side. It is rectangular in plan view. Further, the positioning member 240 includes a plug guiding portion 242 and a light coupling portion 244.

The plug guiding portion 242, as shown in FIG. 7, constitutes the x-axis side of the positioning member 240 The part on the negative side. Further, as shown in FIG. 8, the plug guide portion 242 is a plate-like member having a rectangular shape when viewed in plan from the z-axis direction. Further, the end surface S4 of the plug guiding portion 242 on the positive side in the x-axis direction faces the negative side of the sealing resin 24 in the x-axis direction as shown in FIG. Therefore, the plug guiding portion 242 is located on the mounting substrate 22 on the negative side of the sealing resin 24 in the x-axis direction.

Further, in the center of the y-axis direction of the surface of the plug guiding portion 242, as shown in the figure As shown in Fig. 7, the groove G2 for guiding the plug 40 to be described later is provided substantially in parallel with the x-axis. In the plug guide portion 242, a portion on the negative side in the y-axis direction of the groove G2 is referred to as a flat portion F3, and a portion on the positive side in the y-axis direction from the groove G2 is referred to as a flat portion F4. The height H3 of the groove G2 from the substrate 22 in the z-axis direction is lower than the height h2 of the sealing resin 24 in the z-axis direction as shown in FIG.

The light coupling portion 244, as shown in FIGS. 7 to 9, constitutes the positioning member 240 x A portion on the positive side in the axial direction is placed on the sealing resin 24.

Furthermore, the optical coupling unit 244 has a body 246 and an abutting portion as shown in FIG. 7 . 248. The body 246 has a rectangular parallelepiped shape. The abutting portion 248 protrudes from the flat surface portion S5 of the plug guide portion 242 from the end surface S5 on the negative side in the x-axis direction of the main body 246 to substantially the center of the flat portion F4 in the x-axis direction. Thereby, the light coupling portion 244 has an L shape when viewed in plan from the z-axis direction. Further, an end surface of the contact portion 248 on the negative side in the x-axis direction is referred to as an end surface S6. Further, the light coupling portion 244 is provided with a concave portion D2 and a convex lens 250.

The recess D2 is provided in the y-axis direction of the optical coupling portion 244 as shown in FIG. Near the side of the negative direction side. Moreover, the concave portion D2 overlaps with the light receiving element array 50 when viewed in plan from the z-axis direction. Further, the recessed portion D2 overlaps with the optical axis of the optical fiber 60 connected to the plug 40, which will be described later, when viewed in plan from the x-axis direction. In addition, the optical axis of the optical fiber 60 is parallel to the x-axis. Moreover, as shown in FIG. 7, the recessed part D2 has a rectangular shape in planar view from the z-axis direction. Further, as shown in FIG. 9, the concave portion D2 has a V shape when viewed in plan from the y-axis direction.

The inner peripheral surface of the concave portion D2 on the negative side in the x-axis direction is the total reflection surface R2. all The reflecting surface R2, as shown in Fig. 9, is parallel to the y-axis. Further, the total reflection surface R2 is inclined counterclockwise by 45° with respect to the z-axis when viewed from the negative side in the y-axis direction. Also, the refractive index of the positioning member 200 is sufficiently larger than air. Therefore, the laser beam B2 emitted from the optical fiber 60 toward the positive side in the x-axis direction enters the optical coupling portion 244, is totally reflected by the total reflection surface R2 toward the negative side in the z-axis direction, and passes through the sealing resin 24 to The light receiving element array 50 travels. At this time, when the light beam of the laser beam B2 is viewed from the y-axis direction, the angle between the optical axis of the laser beam B2 emitted from the optical fiber 60 and the total reflection surface R2 is 45°, and the laser beam toward the light-receiving element array 50 is obtained. The angle between the optical axis of B2 and the total reflection surface R2 is 45°. That is, the angle formed by the total reflection surface R2 and the optical axis of the optical fiber 60 is equal to the angle formed by the total reflection surface R2 and the light receiving element array 50.

The convex lens 250 is provided on the back surface of the optical coupling portion 244 as shown in FIGS. 8 and 9 . Further, the convex lens 250 overlaps with each VCSEL of the light receiving element array 50 when viewed in plan from the z-axis direction. Thereby, the convex lens 250 faces the light-receiving element array 50 and is located on the optical path of the laser beam B2. Further, the convex lens 250 has a semicircular shape that protrudes toward the negative side of the z-axis when viewed from a direction orthogonal to the z-axis. Therefore, the laser beam B2 emitted from the optical fiber 60 is reflected by the total reflection surface R2, and then condensed or collimated by the convex lens 250 to be incident on the light receiving element array 50.

(Composition of metal cover)

Next, the metal cover 30 will be described with reference to the drawings. Fig. 10 is a perspective view showing the appearance of a metal cover 30 according to an embodiment of the present invention.

The metal cover 30 is a piece of metal plate (for example, SUS301) bent into Made with fonts. Further, as shown in FIG. 1, the metal cover 30 covers the positioning member 200 from the positive side in the z-axis direction and the positive side in the y-axis direction and the negative side in the y-axis direction.

The metal cover 30, as shown in FIG. 10, includes an upper surface 32 and side surfaces 34, 36. The upper surface 32 is a plane orthogonal to the z-axis and has a rectangular shape. The side surface 34 is formed by bending the long side of the metal cover 30 from the negative side in the y-axis direction of the upper surface 32 toward the negative side in the z-axis direction. The side surface 36 is formed by bending the long side of the metal cover 30 from the positive side in the y-axis direction of the upper surface 32 toward the negative side in the z-axis direction.

In the portion on the negative side of the x-axis direction of the upper surface 32, as shown in Fig. 10, engaging portions 32a, 32b for fixing the plug 40 to the socket 20 are provided. The engaging portions 32a and 32b are arranged in order from the negative side in the y-axis direction toward the positive side.

The engaging portions 32a, 32b are cut by the upper 32 Formed by a glyph. Specifically, the engaging portions 32a, 32b are opened by being cut in the front side 32 toward the positive side in the x-axis direction. Font gap and make The portion surrounded by the notch is formed by being concavely curved toward the negative side in the z-axis direction. Thereby, the engaging portions 32a and 32b have a V-shaped shape that protrudes toward the negative side in the z-axis direction when viewed in plan from the y-axis direction.

Further, the short side of the negative direction side of the x-axis direction of the upper surface 32 is as shown in FIG. Engagement portions 32c, 32d for fixing the plug 40 to the socket 20 are provided. The engaging portions 32c and 32d are metal pieces that protrude from the upper surface 32 toward the negative side in the x-axis direction. The engaging portions 32c and 32d are concavely curved toward the negative side in the z-axis direction at positions substantially at the center in the x-axis direction of the engaging portions 32c and 32d. Thereby, the engaging portions 32c and 32d have a V-shaped shape that protrudes toward the negative side in the z-axis direction when viewed in plan from the y-axis direction.

The long side of the side of the negative side of the z-axis direction of the side surface 34, as shown in FIG. The convex portions C1 to C3 protruding toward the negative side in the z-axis direction are arranged in order from the negative side in the x-axis direction toward the positive side. The convex portions C1 to C3 are fixed to the structural substrate 22 by an adhesive, respectively. Further, the convex portion C1 is connected to the ground conductor exposed portion E2 of the package substrate 22. Further, the convex portion C3 is fitted into the space H1 provided between the leg portion 24b of the sealing resin 24 and the leg portion 24c. Thereby, the metal cover 30 is positioned relative to the package substrate 22.

The long side of the side of the negative side of the z-axis direction of the side surface 36, as shown in FIG. The convex portions C4 to C6 protruding toward the negative side in the z-axis direction are arranged in this order from the negative side in the x-axis direction toward the positive side. The convex portions C4 to C6 are fixed to the package substrate 22 by an adhesive, respectively. Further, the convex portion C4 is connected to the ground conductor exposed portion E3 of the package substrate 22. Further, the convex portion C6 is fitted into the space H2 provided between the leg portion 24d of the sealing resin 24 and the leg portion 24e. Thereby, the metal cover 30 is positioned relative to the package substrate 22.

Further, as shown in FIG. 1, the metal cover 30 is from the positive side in the z-axis direction and y The positioning member 200 is covered on the positive side in the axial direction and the negative side in the y-axis direction. Further, in the negative side of the socket 20 in the x-axis direction, as shown in FIG. 1, an opening A3 into which the plug 40 to be described later is inserted is formed.

(composition of the plug)

A plug 40 according to an embodiment of the present invention will be described with reference to the drawings. Figure 11 is a perspective view showing the appearance of a plug according to an embodiment of the present invention. Fig. 12 is a plan view showing a plug according to an embodiment of the present invention from the negative side in the z-axis direction.

The plug 40, as shown in Fig. 11, is provided at one end of the optical fiber 60. Plug 40 is provided The transmitting side plug 42 and the receiving side plug 46. Further, the plug 40 is made of, for example, an epoxy-based or an anti-loning resin.

The transmitting side plug 42 transmits the laser beam B1 from the light emitting element array 100. give away As shown in FIG. 11, the side plug 42 includes an optical fiber insertion portion 42a and an ear portion 42b. The optical fiber insertion portion 42a constitutes a portion on the positive side in the y-axis direction of the transmitting-side plug 42, and has a rectangular parallelepiped shape extending in the x-axis direction. An opening A1 for inserting the optical fiber 60 is provided in a portion on the negative side in the x-axis direction of the optical fiber insertion portion 42a.

The opening A1, as shown in FIG. 11, is cut by the fiber insertion portion 42a. The upper surface S7 on the positive side in the axial direction and the end surface S8 on the negative side in the x-axis direction are formed. Further, an inner peripheral surface on the positive side in the x-axis direction of the opening A1 is provided with a hole H7 for guiding the core of the inserted optical fiber 60 to the front end of the transmitting-side plug 42. Further, the number of holes H7 corresponds to the number of the optical fibers 60, and is two in the present embodiment.

Further, in the portion on the positive side in the x-axis direction of the optical fiber insertion portion 42a, As shown in Fig. 11, a recess D3 for injecting an adhesive for fixing the optical fiber 60 is provided. Concave D3 from The surface of the optical fiber insertion portion 42a is recessed toward the back surface. A hole H7 is provided in the inner circumferential surface of the concave portion D3 on the negative side in the x-axis direction. The hole H7 is connected to the inner peripheral surface of the opening A1 on the positive side in the x-axis direction. Therefore, the core wire of the optical fiber 60 reaches the concave portion D3 from the opening A1 through the hole H7. The core wire of the optical fiber 60 that has reached the concave portion D3 abuts against the inner circumferential surface (contact surface) S9 on the positive side in the x-axis direction of the concave portion D3. Further, the optical fiber 60 is fixed to the communication side plug 42 by injecting an adhesive made of a transparent resin, for example, an epoxy resin into the opening A1 and the recess D3.

The end surface S10 on the positive side in the x-axis direction of the optical fiber insertion portion 42a is as shown in the figure 9 and 12, a convex lens 44 (third convex lens) is provided. The convex lens 44 has a semicircular shape that protrudes toward the positive side in the x-axis direction when viewed from a direction orthogonal to the x-axis direction. Thereby, the laser beam B1 emitted from the light-emitting element array 100 and reflected by the total reflection surface R1 is condensed or collimated by the convex lens 44.

Further, the convex lens 44 overlaps the optical axis of the optical fiber when viewed in plan from the x-axis direction. Therefore, the laser beam B1 that is condensed or collimated by the convex lens 44 passes through the resin of the optical fiber insertion portion 42a. Further, the laser beam B1 is transmitted to the core of the core wire abutting against the optical fiber 60 of the abutting surface S9.

On the upper surface S7 of the optical fiber insertion portion 42a, as shown in FIG. 11, a metal cover is provided. The protrusion N1 of the engaging portion 32a of the 30 is engaged. The projection N1 is provided between the opening A1 and the recess D3 in the x-axis direction and extends in the y-axis direction. Further, the projection N1 has a triangular shape that protrudes toward the positive side in the z-axis direction when viewed in plan from the y-axis direction.

On the back surface of the optical fiber insertion portion 42a, as shown in FIGS. 11 and 12, a convex portion is provided. C7. The convex portion C7 corresponds to the groove G1 of the plug guiding portion 222 of the positioning member 220. The convex portion C7 is disposed in parallel with the x-axis from the end surface S8 toward the end surface S10.

The ear portion 42b, as shown in Figs. 11 and 12, is from the x-axis of the optical fiber insertion portion 42a. The vicinity of the end portion on the negative side of the direction protrudes toward the negative side in the y-axis direction. Thereby, the transmitting side plug 42 has an L shape. Further, the ear portion 42b functions as a grip portion when the communication side plug 42 is inserted and removed. Further, an extraction hole having a substantially rectangular shape when viewed from the z-axis direction is provided at substantially the center of the ear portion 42b.

In addition, the connection operation between the transmitting side plug 42 and the socket 20 is performed by making the convex portion C7 is press-fitted along the groove G1 toward the positive side in the x-axis direction. At this time, the end surface S11 of the ear portion 42b on the positive side in the x-axis direction abuts against the end surface S3 of the abutting portion 228 of the positioning member 220 shown in FIG.

Moreover, by the connection operation of the transmitting side plug 42 and the socket 20, as shown in FIG. The signal transmitting side plug 42 is placed on the positioning member 220. Further, as described above, the optical axis of the optical fiber 60 is parallel to the x-axis direction, and the direction in which the transmitting-side plug 42 is pressed into the socket 20 is the positive side in the x-axis direction. Therefore, the optical axis of the optical fiber 60 is parallel to the insertion direction of the transmitting side plug 42.

Moreover, when the transmitting side plug 42 is connected to the socket 20, the engaging portion of the metal cover 30 32a is engaged with the projection N1, and the engaging portion 32c is engaged with the corner formed by the upper surface S7 of the transmitting side plug 42 and the end surface S8, whereby the transmitting side plug 42 is fixed to the socket 20.

The receiving side plug 46 is sent to the laser beam B2 of the light receiving element array 50. Receiving As shown in FIG. 11, the side plug 46 includes an optical fiber insertion portion 46a and an ear portion 46b. The optical fiber insertion portion 46a constitutes a portion on the negative side in the y-axis direction of the reception side plug 46, and has a rectangular parallelepiped shape. An opening portion A2 through which the optical fiber 60 is inserted is provided in a portion of the optical fiber insertion portion 46a on the negative side in the x-axis direction.

As shown in FIG. 11, the opening A2 is formed by cutting the upper surface S12 of the optical fiber insertion portion 46a on the positive side in the z-axis direction and the end surface S13 on the negative side in the x-axis direction. Further, an inner peripheral surface of the opening A2 on the positive side in the x-axis direction is provided with a hole H8 for guiding the core of the inserted optical fiber 60 to the front end of the receiving side plug 46. In addition, the number of holes H8 and the number of optical fibers 60 In the present embodiment, there are two.

Further, as shown in FIG. 11, a portion of the optical fiber insertion portion 46a on the positive side in the x-axis direction is provided with a concave portion D4 for injecting an adhesive for fixing the optical fiber 60. The recess D4 is recessed from the surface of the optical fiber insertion portion 46a toward the back surface. A hole H8 is provided in the inner peripheral surface of the concave portion D4 on the negative side in the x-axis direction. The hole H8 is connected to the inner peripheral surface of the opening A2 on the positive side in the x-axis direction. Therefore, the core wire of the optical fiber 60 reaches the concave portion D4 from the opening portion A2 through the hole H8. The core wire of the optical fiber 60 that has reached the concave portion D4 abuts against the inner circumferential surface (contact surface) S14 on the positive side in the x-axis direction of the concave portion D4. Further, the optical fiber 60 is fixed to the reception side plug 46 by injecting an adhesive made of a transparent resin, for example, an epoxy resin into the opening A2 and the recess D4.

A convex lens 48 is provided on the end surface S15 of the optical fiber insertion portion 46a on the positive side in the x-axis direction as shown in Figs. 9 and 12 . The convex lens 48 has a semicircular shape that protrudes toward the positive side in the x-axis direction when viewed from a direction orthogonal to the x-axis direction.

Further, the convex lens 48 overlaps the optical axis of the optical fiber 60 when viewed in plan from the x-axis direction. Therefore, the laser beam B2 emitted from the optical fiber 60 is condensed or collimated by the convex lens 48, and travels toward the total reflection surface R2. Further, the laser beam B2 is reflected by the total reflection surface R2 and transmitted to the light receiving element array 50.

As shown in FIG. 11, the upper surface S12 of the optical fiber insertion portion 46a is provided with a projection N2 that engages with the engagement portion 32b of the metal cover 30. The projection N2 is provided between the opening A2 and the recess D4 in the x-axis direction and extends in the y-axis direction. Moreover, the projection N2 has a triangular shape that protrudes toward the positive side in the z-axis direction when viewed in plan from the y-axis direction.

On the back surface of the optical fiber insertion portion 46a, as shown in Figs. 11 and 12, a convex portion C8 is provided. The convex portion C8 corresponds to the groove G2 of the plug guiding portion 242 of the positioning member 240. The convex portion C8 is disposed in parallel with the x-axis from the end surface S13 toward the end surface S15.

As shown in FIGS. 11 and 12, the ear portion 46b protrudes from the end portion on the negative side in the x-axis direction of the optical fiber insertion portion 46a toward the positive side in the y-axis direction. Thereby, the receiving side plug 46 has an L shape. Further, the ear portion 46b functions as a grip portion when the receiving side plug 46 is inserted and removed. Further, an extraction hole having a substantially rectangular shape when viewed from the z-axis direction is provided substantially at the center of the ear portion 46b.

Further, the connection operation between the receiving side plug 46 and the socket 20 is performed by pressing the convex portion C8 along the groove G2 toward the positive side in the x-axis direction. At this time, the end surface S16 of the ear portion 46b on the positive side in the x-axis direction abuts against the end surface S6 of the abutting portion 248 of the positioning member 200 shown in FIG.

Further, by the connection operation of the receiving side plug 46 and the socket 20, as shown in FIG. 9, the receiving side plug 46 is placed on the positioning member 240. Further, as described above, the optical axis of the optical fiber 60 is parallel to the x-axis direction, and the direction in which the receiving side plug 46 is pressed into the socket 20 is the positive side in the x-axis direction. Therefore, the optical axis of the optical fiber 60 is parallel to the insertion direction of the receiving side plug 46.

Further, when the receiving side plug 46 is connected to the socket 20, the engaging portion 32b of the metal cover 30 is engaged with the projection N2, and the engaging portion 32d is engaged with the corner formed by the upper surface S12 and the end surface S13 of the receiving side plug 46. Thereby, the receiving side plug 46 is fixed to the socket 20.

In the optical transmission module 10 configured as described above, as shown in FIG. 9, the laser beam B1 emitted from the light-emitting element array 100 toward the positive side in the z-axis direction passes through the sealing resin 24 and the positioning member 220. Further, the laser beam B1 is reflected by the total reflection surface R1 toward the negative side in the x-axis direction, and is transmitted through the plug 40 to the core of the optical fiber 60. Therefore, the positioning member 220 has a function of optically coupling the core of the optical fiber 60 to the light emitting element array 100.

Further, in the optical transmission module 10, as shown in FIG. 9, the laser beam B2 emitted from the optical fiber 60 toward the positive side in the x-axis direction passes through the positioning member 240. Furthermore, the laser beam B2 is totally reflected The surface R2 is reflected toward the negative side in the z-axis direction, and is transferred to the light-receiving element array 50 through the sealing resin 24. Therefore, the positioning member 240 has a function of optically coupling the core of the optical fiber 60 to the light receiving element array 50.

(Production method)

Hereinafter, a method of manufacturing the optical transmission module 10 according to an embodiment of the present invention will be described in the order of the light-emitting element array 100, the socket 20, the plug 40, and the optical transmission module 10.

(Method of Manufacturing Light-Emitting Element Array)

First, an N-type semiconductor contact layer 130, an N-type DBR layer 132, an N-type semiconductor cladding layer 134, an active layer 136, a P-type semiconductor cladding layer 138, and a P-type DBR layer 140 are sequentially laminated on the surface of the base substrate 128. P-type semiconductor contact layer 142.

Next, in addition to the light-emitting area multilayer portion 160 constituting each VCSEL 100A, 100B In addition, the P-type semiconductor contact layer 142, the P-type DBR layer 140, the P-type semiconductor cladding layer 138, the active layer 136, and the N-type semiconductor cladding layer 134 are sequentially etched in a predetermined pattern. At this step, etching is performed to the surface of the N-type DBR layer 132. Thereby, in addition to the N-type semiconductor contact layer 130 and the N-type DBR layer 132, the light-emitting region multilayer portion 160 of the VCSELs 100A, 100B is separated by a predetermined distance.

By approaching the light-emitting region of the region exposed on the surface of the N-type DBR layer 132 The position of the domain multilayer portion 160 is etched to expose the N-type semiconductor contact layer 130. A cathode electrode 911 is formed in a region where the N-type semiconductor contact layer 130 is exposed.

Moreover, the P-type semiconductor contact layer of the multilayer portion 160 in the unetched light-emitting region The surface of 142 forms a ring electrode 921 for the anode.

On the surface side of the base substrate 128, except for the cathode electrode 911 and the anode ring An insulating film 162 is formed outside the surface of the electrode 921.

An insulating layer 170 is formed in a region of the surface of the insulating film 162 which is close to the light-emitting region multilayer portion 160.

A cathode pad electrode 912 and an anode pad electrode 922 are formed on the surface of the insulating layer 170.

A cathode wiring electrode 913 that connects the cathode electrode 911 and the cathode pad electrode 912 is formed. An anode wiring electrode 923 that connects the anode ring electrode 921 and the anode pad electrode 922 is formed.

The insulating film 162, the N-type DBR layer 132, and the N-type semiconductor contact layer 130 are formed so as to divide the regions of the adjacent VCSELs 100A and 100B so as to form recesses having a concave shape from the surface of the base substrate 128 to the inside to a predetermined depth. 180. Through the above steps, the light emitting element array 100 is formed.

(Method of manufacturing the socket)

Next, a method of manufacturing the socket 20 will be described with reference to the drawings. 13 to 16 are views showing the process of the socket according to an embodiment of the present invention.

First, solder is applied on the upper surface of the mother substrate 122 (not shown in the drawing) which is an assembly of the constituent substrates 22. More specifically, the cream solder is pressed using a squeegee on the mother substrate 122 on which the metal mask is placed. Next, the metal mask is removed from the mother substrate 122, thereby printing the solder to the mother substrate 122.

Next, as shown in FIG. 3, the capacitor is placed on the solder of the mother substrate 122. Thereafter, the mother substrate 122 is heated to solder the capacitor.

After the capacitor is soldered, an Ag paste is applied to a predetermined position on the mother substrate 122. As shown in FIG. 3, the driver circuit 26, the light-receiving element array 50, and the light-emitting element array 100 are placed on the applied Ag to perform die bonding. Further, the drive circuit 26 and the light-receiving element array 50 are connected by wire bonding using Au leads, and the drive circuit 26 is connected to the light-emitting element array 100 by wire bonding.

Thereafter, as shown in FIG. 3, the capacitor, the driving circuit 26, and the light receiving element array The column 50 and the light-emitting element array 100 are resin-molded. Further, the mother substrate 122 is cut using a cutter, thereby obtaining a plurality of package substrates 22.

Next, the positioning member 220 is placed on the package substrate 22 and the sealing resin 24 on. When the positioning member 220 is placed, two cameras V1, V2 (photographing means) are used. The camera V1 is fixed toward the positive side in the z-axis direction. As shown in FIG. 13, the camera V2 is attached to the movable mounter V3 in a state facing the negative side of the z-axis direction. Further, the mounting machine V3 includes an arm portion V4 that adsorbs the camera V2 and the positioning members 220 and 240.

The positioning member 220 is placed on the package substrate 22 and the sealing resin 24 In the homework, first, the origin of the camera V1 and the origin of the camera V2 are precisely aligned. Specifically, as shown in FIG. 13, the mounting machine V3 is moved so that the camera V1 and the camera V2 face each other. Here, between the camera V1 and the camera V2, the correction plate 1000 provided with the small hole H20 is moved. Next, by causing the cameras V1, V2 to photograph the small holes H10, respectively, the positional deviation of the origin of the camera V1 and the origin of the camera V2 is corrected. Further, in this step, the origin after the positional shift correction is the origin of the plane parallel to the x-axis and the y-axis (hereinafter referred to as the xy plane).

Next, the correct position information of the convex lens 230 provided in the positioning member 220 is obtained. Specifically, as shown in FIG. 14, the positioning member 220 is sucked by the arm portion V4 of the mounting machine V3. Then, the convex lens 230 disposed on the absorbing positioning member 220 comes to the top of the camera V1. The way the mobile V3 is moved. The lens center T230 of the lens 230 is taken by the camera V1, and the correct position information I1 of the lens 230 is obtained. Further, the position information I1 is position information of the lens 230 on the xy plane when viewed in plan from the z-axis direction (the normal direction of the main surface of the package substrate 22). From the position information I1 and the amount of movement of the loading machine V3, the position information I2 with respect to the relative position of the camera V2 of the lens center T230 at the xy plane can be obtained.

In the position of the relative position of the camera V2 relative to the lens center T230 After the information I2 is placed, a UV-curable adhesive is applied to the region on the negative side in the x-axis direction of the surface of the sealing portion 24a of the sealing resin 24.

Next, the position information of the light emitting element array 100 is obtained. Specifically, such as As shown in Fig. 15, the mounter V3 is moved such that the camera V2 comes close to the upper side of the light-emitting element array 100. At this time, the mounting machine V3 is in a state of adsorbing the positioning member 220. Next, the light-emitting center T100 of the light-emitting element array 100 is imaged by the camera V2, and the correct position information I3 of the light-emitting element array 100 is obtained. Further, the position information I3 is position information of the light-emitting element array 100 on the xy plane when viewed in plan from the z-axis direction (the normal direction of the main surface of the package substrate 22). Based on the position information I3 obtained in this manner, the amount of movement of the mounter V3, and the position information I2, positional information I4 of the relative position of the lens 230 with respect to the light-emitting element array 100 can be obtained.

Based on the position information I4, the amount of movement of the mounted machine V3 is determined. In addition, as shown As shown in Fig. 16, the loading machine V3 is moved, and the positioning member 220 provided with the lens 230 is placed on the package substrate 22 on which the light-emitting element array 100 is mounted. Thereby, the lens 230 and the light-emitting element array 100 face each other in the z-axis direction (the normal direction of the package substrate 22), and the positioning member 220 and the package substrate 22 are aligned with high precision.

The disposed positioning member 220 is irradiated with ultraviolet rays. In addition, in the ultraviolet irradiation, The positioning member 220 is in a state of being pressed by the mounting machine V3 toward the package substrate 22 and the sealing resin 24. Thereby, when the UV-curable adhesive between the positioning member 220 and the sealing resin 24 is cured, the positioning member 220 is fixed to the carrier substrate 22 and the sealing resin 24 without causing a positional displacement.

After the positioning member 220 is placed on the package substrate 22 and the sealing resin 24, the positioning member 240 is placed on the package substrate 22 and the sealing resin in the same procedure.

Next, the metal cover 30 is attached to the package substrate 22 on which the positioning member 200 is placed. More specifically, the space H1 between the leg portions 24b and 24c of the sealing resin 24 on the surface of the package substrate 22, the space H2 between the leg portions 24d and 24e, and the convex portions C2, C5 of the metal cover 30 are in contact with each other. A thermosetting adhesive such as an epoxy resin is partially coated. Moreover, a conductive paste such as Ag is applied to the ground conductor exposed portions E2 and E3 of the package substrate 22.

After the application of the adhesive and the conductive paste, the convex portion C3 of the metal cover 30 is fitted to the portion of the sealing portion 24b of the sealing resin 24 and the portion of the leg portion 24c, that is, the space H1. Further, the convex portion C6 is fitted to the portion of the leg portion 24d of the sealing resin 24 and the leg portion 24e, that is, the space H2. Thereby, the position of the metal cover 30 with respect to the structure substrate 22 is determined. Further, at the same time as the positioning of the metal cover 30, the convex portions C1 to C6 are in contact with the adhesive and the conductive paste on the package substrate 22.

After the metal cover 30 is fitted, the package substrate 22 is heated to cure the adhesive and the conductive paste. Thereby, the metal cover 30 is fixed to the package substrate 22. Further, by attaching the metal cover 30 to the package substrate 22, the convex portions C1, C4 of the metal cover 30 are in contact with the ground conductor exposed portions E2, E3 of the package substrate 22. Thereby, the metal cover 30 is connected to the ground conductor in the package substrate 22, and the ground potential is maintained. The socket 20 is completed by the above steps.

(Method of manufacturing plug)

First, the optical fiber 60 inserted into the plug 40 is cut to a predetermined length.

Next, the coating near the front end of the optical fiber 60 is removed using a fiber stripper. After the coating near the front end is removed, the opening of the core wire of the optical fiber 60 is exposed.

Next, a transparent adhesive such as an epoxy resin for fixing the optical fiber 60 is injected into the openings A1 and A2 and the recesses D3 and D4 of the plug 40 shown in FIG. Furthermore, the core of the optical fiber 60 is pressed into contact with the faces S9, S14 of the plug 40. Next, the optical fiber 60 is fixed to the plug 40 by hardening the transparent adhesive.

(Manufacturing method of optical transmission module)

The plug 40 is attached to the socket 20. The connection of the plug 40 is as described above by the projections C7, C8 of the plug 40 along the slots G1, G2 of the positioning members 220, 240 from the opening A3 provided between the metal cover 30 and the socket 20 toward the x-axis direction. Pressing in the positive direction side is performed. The optical transmission module 10 is completed through the above process.

(effect)

In the manufacturing method of the socket 20 configured as described above, the optical fiber 60 and the light-emitting element array 100, and the optical fiber 60 and the light-receiving element array 50 can be optically coupled with high precision.

In the manufacturing method of the conventional optical module 500, the connection between the optical module 500 and the optical connector 513 is performed by the guide pin 552 located on the optical module 500 being inserted into the guiding hole 553 of the optical connector 513. Thereby, the optical fiber 516 is optically coupled to the VCSEL built in the optical module 500. However, in this connection method, due to the positional displacement when the guide pin 552 on the optical module 500 is manufactured or the positional displacement of the VCSEL when it is mounted on the optical module 500, it is difficult to make the VCSEL and The optical fiber 516 is optically coupled with high precision.

On the other hand, in the manufacturing method of the socket 20, the camera V1, V2 are directly It is confirmed that the position of the lens 230 and the position of the light-emitting element array 100 are simultaneously opposed. Therefore, in the manufacturing method of the socket 20, the alignment with the light-emitting element array 100 at the position of the lens 230 is not affected by the positional deviation when the guide pin is manufactured or when the light-emitting element array 100 is assembled to the package substrate 22. The influence of positional offset, etc. Thereby, in the manufacturing method of the socket 20, the lens 230 and the light-emitting element array 100 can be aligned with high precision.

Further, the optical fiber 60 is fixed to the plug 40 and the positioning member 220. In fiber 60 with The fixing of the plug 40 and the connection work of the plug 40 and the positioning member 220 are not performed by a so-called gap-connecting method by which the guide pin is connected. Further, the plug 40 and the positioning member 220 are formed into a shape with high precision by resin molding. Thereby, the light incident from the lens 230 is correctly transmitted to the optical fiber 60 through the positioning member 220 and the plug 40. Therefore, when the light emitted from the light-emitting element array 100 is correctly incident on the lens 230 in the optical module 10 including the socket 20, the light-emitting element array 100 and the optical fiber 60 can be optically coupled with high precision.

Further, as described above, in the manufacturing method of the socket 20, in order to make the lens 230 and The light emitting element array 100 is aligned with high precision, and the light emitted from the light emitting element array 100 is correctly incident on the lens 230. For the above reasons, in the method of manufacturing the socket 20, the optical fiber 60 and the light-emitting element array 100 can be optically coupled with high precision. Further, in the method of manufacturing the socket 20, the optical fiber 60 and the light-receiving element array 50 can be optically coupled with high precision for the same reason.

Furthermore, in the manufacturing method of the socket 20, the positioning member 220 disposed is irradiated In the case of ultraviolet rays, the positioning member 220 is maintained in a state of being pressed by the mounting machine V3 toward the package substrate 22 and the sealing resin 24. Thereby, when the UV-curable adhesive between the positioning member 220 and the sealing resin 24 is cured, the positioning member 220 is fixed to the carrier substrate 22 and the sealing resin 24 without causing a positional displacement. That is, in the manufacturing method of the socket 20, the position of the lens 230 and the array of light-emitting elements The positional relationship of the position of 100 is not offset by the hardening of the adhesive. Therefore, in the method of manufacturing the socket 20, the optical fiber 60 and the light-emitting element array 100 can be optically coupled with higher precision. Further, the optical fiber 60 and the light-receiving element array 50 can be optically coupled with high precision for the same reason.

Moreover, in the manufacturing method of the socket 20, a plurality of VCSELs are integrated. Light emitting element array 100. Thereby, in the method of manufacturing the socket 20, it is not necessary to align the position of the lens 230 with each of the plurality of VCSELs. Therefore, in the method of manufacturing the socket 20, the light-emitting element array 100 and the lens 230 can be efficiently aligned in a single operation.

(Other embodiments)

The method of manufacturing the socket of the present invention is not limited to the method of manufacturing the socket 20 of the above embodiment, and various modifications can be made without departing from the spirit and scope of the invention. For example, in the method of manufacturing the socket 20, the positioning member 200 is fixed, and the package substrate 22 may be placed there. Moreover, in the state in which the positioning member 200 and the UV-type hardening adhesive of the component substrate 22 are attached, the positioning member 200 may be fixed and the structure substrate 22 may be pressed.

As described above, the present invention is useful in a method of manufacturing a socket, enabling fiber and light The element is excellent in optical coupling with high precision.

T100‧‧‧Lighting Center

T230‧‧ lens center

V1, V2‧‧‧ camera

V3‧‧‧Loading machine

V4‧‧‧ Arm

22‧‧‧Construction substrate

24‧‧‧ sealing resin

220‧‧‧ Positioning members

Claims (3)

A socket manufacturing method, the socket includes an optical element, a mounting substrate on which the optical element is mounted on a main surface, and a positioning member, the positioning member is placed on a main surface of the mounting substrate, and is disposed by The plug of one end of the optical fiber is optically coupled to the optical fiber, and has a normal direction on the main surface of the structural substrate in order to condense or collimate the light incident on or emitted from the optical element. The optical element facing lens is characterized in that: in the first step, the position information of the lens when viewed from the normal direction of the main surface of the structural substrate is obtained by the imaging means; and the second step is obtained by the imaging means. The position information of the optical element when viewed from the normal direction of the main surface of the structural substrate; and the third step, calculating the relative position of the lens relative to the optical element based on the position information of the lens and the position information of the optical element; In the fourth step, the positioning member or the structural substrate is moved according to the position information of the relative position such that the lens and the optical element face each other in a normal direction of the main surface of the structural substrate. The method of manufacturing the socket according to the first aspect of the invention, further comprising the fifth step of holding the positioning member and the mounting substrate, and holding the positioning member pressed to the mounting substrate, or holding the positioning member The structure substrate is pressed to the state of the positioning member. The method of manufacturing a socket according to claim 1 or 2, wherein the optical component is a vertical resonator surface-emitting laser array in which a plurality of vertical resonator surface-emitting lasers are integrated.