TW201423189A - Receptacle and optical transmission module - Google Patents

Abstract

The purpose of the present invention is to provide a receptacle and an optical transmission module enabling miniaturization of a lens or total reflective surface. A plug (40) provided on one end of an optical fiber (60) is connected to this receptacle (20). This receptacle (20) is provided with an optical element (50, 100), and a positioning member (200) which optically couples the core of the optical fiber (60) and the optical element. In the positioning member (200), on the optical path which connects the optical fiber (60) and the optical element (50, 100), a total reflection surface (R1, R2) is provided in order to totally reflect light coming towards the optical element (50) or light emitted from the optical element (100).

Description

Socket and optical transmission module

The present invention relates to a socket and an optical transmission module, and more particularly to a socket and an optical transmission module for converting an electrical signal into an optical signal and transmitting the same.

As a conventional socket, for example, an optical module described in Patent Document 1 is known. 17 is a cross-sectional view of the optical module described in Patent Document 1. Figure 18 is a graph showing the refraction of light at the interface between resin and air.

As shown in FIG. 17, the optical module 500 includes an optical plug 501, a holder 502 (not shown), a ceramic package 503, and a resin package 504. The optical plug 501 is made of a resin and supports one end of the optical fiber 506. Further, a collecting lens 511 is provided on one end side of the longitudinal direction of the optical fiber 501. The ceramic package 503 houses the optical element 539 inside. The resin package 504 is bonded to the ceramic package 503. Further, the optical plug 501 is connected to the resin package 504. Further, in the resin package 504, a reflection lens 548 is provided in order to optically connect the optical fiber 506 to the optical element 539.

In the case of the optical module 500, for example, when the optical element 539 is a light receiving element, the light P501 emitted from the optical fiber 506 is condensed or collimated by the collecting lens 511. Thereafter, the light P501 is reflected by the reflective lens 548 and transmitted to the optical element 539.

However, in the optical module 500, the light P501 is refracted when the resin having a relatively large refractive index is emitted toward the air having a relatively small refractive index. At this time, as shown in FIG. 18, the light P501 traveling in the air A500 is more diffused and assumed to be empty at the same time as the light P502 which is assumed to travel in the resin R500. Pass in the gas A500. That is, the longer the distance d of the light P501 traveling in the air A500, the more the diffusion W501 of the light P501 becomes larger than the diffusion W502 of the light P502. Therefore, in the optical module 500, since the distance that the light P501 is transmitted in the air is long, there is a problem that the condensing lens 511 or the reflection lens 548 for condensing or collimating the light P501 becomes large.

Patent Document 1: Japanese Laid-Open Patent Publication No. 2008-15348

Accordingly, it is an object of the present invention to provide a socket and an optical transmission module that can miniaturize a lens or a total reflection surface.

A socket according to an aspect of the present invention is a connector for connecting one end of an optical fiber, comprising: an optical element; and a positioning member for optically coupling the core of the optical fiber and the optical element; and connecting the positioning member The optical fiber and the optical path of the optical element are provided with a total reflection surface for totally reflecting light that is directed toward the optical element or that is emitted from the optical element.

An optical transmission module according to an aspect of the present invention includes: the socket; and a plug provided at one end of the optical fiber; and a third convex lens positioned on an optical axis of the optical fiber of the plug and facing the positioning member.

An optical module according to another aspect of the present invention includes: the socket; and a plug disposed at one end of the optical fiber; and an optical axis of the optical fiber is parallel to an insertion direction of the plug.

According to the socket and the optical transmission module of the present invention, the lens or the total reflection surface can be miniaturized.

E1‧‧‧Surface electrode

R1, R2‧‧‧ total reflection surface

10‧‧‧Optical transmission module

20‧‧‧ socket

22‧‧‧Construction substrate

24‧‧‧ sealing resin

26‧‧‧Drive circuit

30‧‧‧metal cover

32a~32d‧‧‧With the Ministry

40‧‧‧ plug

50‧‧‧Light-receiving element array

60‧‧‧ fiber

100‧‧‧Lighting element array

100A, 100B‧‧‧VCSEL (Vertical Resonator Surface Illuminated Laser)

128‧‧‧ bottom substrate

160‧‧‧Multi-layer of light-emitting area

200‧‧‧ Positioning members

230,232,234,250,252,254‧‧‧ lenticular lens

911‧‧‧electrode for cathode

921‧‧‧Anode ring electrode

Fig. 1 is a perspective view showing the appearance of an optical transmission module according to an embodiment of the present invention.

Fig. 2 is an exploded perspective view of the socket according to the embodiment of the present invention.

Fig. 3 is a perspective view showing the appearance of a package substrate according to an embodiment of the present invention.

Fig. 4 is a plan view of a light-emitting element array according to an embodiment of the present invention as seen from the positive side in the z-axis direction.

Fig. 5 is a cross-sectional view showing A-A or B-B of the light-emitting element array shown in Fig. 4.

Fig. 6 is a perspective view showing the appearance of a socket for removing a metal cover from a socket according to an embodiment of the present invention.

Fig. 7 is a perspective view showing the appearance of a positioning member according to an embodiment of the present invention.

Fig. 8 is a plan view of the positioning member according to the embodiment of the present invention as seen from the negative side in the z-axis direction.

Fig. 9 is a view showing a configuration of a structure substrate and a plug according to an embodiment of the present invention in a C-C or D-D cross section of the positioning member shown in Fig. 7.

Fig. 10 is a perspective view showing the appearance of a metal cover according to an embodiment of the present invention.

Figure 11 is a perspective view showing the appearance of a plug according to an embodiment of the present invention.

Fig. 12 is a plan view showing a plug according to an embodiment of the present invention from the negative side in the z-axis direction.

Figure 13 is a diagram showing the process of a socket according to an embodiment of the present invention.

Figure 14 is a cross-sectional view of a conventional socket and plug.

Figure 15 is a diagram of the process of a conventional socket.

Fig. 16 is a view showing a plug of an embodiment of the present invention added to a cross section of a socket according to a modification of the embodiment of the present invention.

17 is a cross-sectional view of the optical module described in Patent Document 1.

Figure 18 is a graph showing the refraction of light at the interface between resin and air.

Hereinafter, a socket, an optical transmission module, and a manufacturing method thereof according to an embodiment of the present invention will be described method.

(Composition of optical transmission module)

Hereinafter, the configuration of the socket and the optical transmission module according to the embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing the appearance of an optical transmission module 10 according to an embodiment of the present invention. Fig. 2 is an exploded perspective view of the socket 20 according to an embodiment of the present invention. 3 is an external perspective view of the metal cover 30 and the positioning member 200 removed from the socket 20 according to an embodiment of the present invention. Further, the upper and lower directions of the optical transmission module 10 are defined as the z-axis direction, and the direction along the long side of the optical transmission module 10 when viewed from the z-axis direction is defined as the x-axis direction. Furthermore, the direction along the short side of the light transmission module 10 is defined as the y-axis direction. The x-axis, the y-axis, and the z-axis are orthogonal to each other.

As shown in FIG. 1, the optical transmission module 10 includes a socket 20 and a plug 40. Further, the plug 40 is connected to the socket 20.

As shown in FIG. 2, the socket 20 includes a metal cover 30, a light receiving element array 50, a light emitting element array 100, a positioning member 200, a build substrate 22, and a sealing resin 24.

As shown in FIG. 3, the package substrate 22 has a rectangular shape when viewed in plan from the z-axis direction. Further, when the surface of the package substrate 22 on the negative side in the z-axis direction (hereinafter, the "surface on the negative side in the z-axis direction" is referred to as the back surface) is provided when the optical transmission module 10 is mounted on the circuit board. The surface mount electrode E1 (not shown in FIG. 3) that is in contact with the pad of the circuit board.

The surface on the positive side in the z-axis direction of the package substrate 22 (hereinafter, the surface on the positive side in the z-axis direction is referred to as a surface), as shown in FIG. 3, on the negative side in the x-axis direction The ground conductor exposed portion E2 in which one of the ground conductors provided in the package substrate 22 is partially exposed is provided in the vicinity of the corner formed by the side L1 and the side L2 on the negative side in the y-axis direction. The ground conductor exposed portion E2 has a rectangular shape having a long side in the x-axis direction when viewed from the positive side in the z-axis direction.

Further, the surface of the package substrate 22 is provided in the vicinity of the corner formed by the side L1 on the negative side in the x-axis direction and the side L3 on the positive side in the y-axis direction. The ground conductor exposed portion E3 is partially exposed to one of the ground conductors. The ground conductor exposed portion E3 has a rectangular shape with a long side in the x-axis direction when viewed from the positive side in the z-axis direction.

The light-receiving element array 50 and the light-emitting element array 100 are provided on a portion of the surface of the package substrate 22 on the positive side in the x-axis direction. The light-receiving element array 50 is an element including a plurality of photodiodes that convert optical signals into electrical signals. The light emitting element array 100 is an element including a plurality of diodes that convert electrical signals into optical signals.

Further, the drive circuit 26 is provided on the positive side in the x-axis direction of the light-receiving element array 50 and the light-emitting element array 100 on the positive side in the x-axis direction of the surface of the package substrate 22. The drive circuit 26 is a semiconductor circuit element for driving the light-receiving element array 50 and the light-emitting element array 100.

Moreover, as shown in FIG. 3, the drive circuit 26 has a rectangular shape having a long side parallel to the y-axis direction when viewed in plan from the z-axis direction. The drive circuit 26 and the light-receiving element array 50 are connected by wire bonding through the lead wires U. Further, the drive circuit 26 and the light-emitting element array 100 are connected by wire bonding via the lead wires U. Thereby, the electrical signal from the driving circuit 26 is transmitted to the light emitting element array 100 through the lead U, and the electrical signal from the light receiving element array 50 is transmitted to the driving circuit 26 through the lead U.

As shown in FIG. 3, the sealing resin 24 is provided with a sealing portion 24a and leg portions 24b to 24e, and is made of a transparent resin such as epoxy resin. The sealing portion 24a has a substantially rectangular parallelepiped shape and is provided on a portion of the surface of the package substrate 22 on the positive side in the x-axis direction. The sealing portion 24a covers the light receiving element array 50, the light emitting element array 100, and the drive circuit 26.

The leg portions 24b and 24c are arranged at intervals from the negative side to the positive side in the x-axis direction. The leg portions 24b and 24c are rectangular parallelepiped members that protrude from the surface on the negative side in the y-axis direction of the sealing portion 24a toward the side L2 of the package substrate 22. Further, a space H1 in which the convex portion C3 of the metal cover 30 to be described later is fitted is provided between the leg portion 24b and the leg portion 24c.

The leg portions 24d, 24e are arranged at intervals from the negative side to the positive side in the x-axis direction. The leg portions 24d and 24e are members having a rectangular parallelepiped shape that protrudes from the surface on the positive side in the y-axis direction of the sealing portion 24a toward the side L3 of the package substrate 22. Further, a space H2 in which the convex portion C6 of the metal cover 30 to be described later is fitted is provided between the leg portion 24d and the leg portion 24e.

(Composition of light-emitting element array)

Next, the light emitting element array 100 will be described with reference to the drawings. Fig. 4 is a plan view of the light-emitting element array 100 according to the embodiment of the present invention as seen from the positive side in the z-axis direction. Fig. 5 is a cross-sectional view showing A-A or B-B of the light-emitting element array 100 shown in Fig. 4. Further, in the present embodiment, only the two VCSELs 100A and 100B are described, but the number of VCSELs constituting the light-emitting element array 100 of the present invention is not limited thereto.

As shown in FIG. 4, the light-emitting element array 100 includes two VCSELs 100A and 100B. That is, the VCSELs 100A, 100B are integrated and arrayed, and the VCSELs 100A, 100B are independently driven. Further, the laser beam B1 is emitted from the respective VCSELs 100A, 100B toward the positive side in the z-axis direction. Two VCSELs 100A, 100B, as shown in FIG. 5, are provided on the surface of the common base substrate 128.

The base substrate 128 is made of a semi-insulating semiconductor, specifically, a substrate made of GaAs. The base substrate 128 preferably has a specific resistance of 1.0 × 10 ⁷ Ω ‧ cm or more. By using the base substrate 128 composed of the above-described semi-insulating semiconductor of resistivity, the isolation between the VCESL 100A and the VCSEL 100B can be more surely ensured.

On the surface of the base substrate 128, as shown in FIG. 5, an N-type semiconductor contact layer 130 is laminated. The N-type semiconductor contact layer 130 is provided in each of the VCESL 100A and the VCSEL 100B. Further, the N-type semiconductor contact layer 130 of the VCESL 100A and the N-type semiconductor contact layer 130 of the VCESL 100B are insulated from each other. Further, the N-type semiconductor contact layer 130 is composed of a compound semiconductor having N-type conductivity.

On the surface of the N-type semiconductor contact layer 130, as shown in FIG. 5, an N-type semiconductor multilayer film reflective layer (hereinafter referred to as an N-type DBR layer) 132 is laminated. Further, the N-type DBR layer 132 is provided with an arc-shaped groove W when viewed from the positive side in the z-axis direction. The groove W is substantially half-turned on the negative side in the x-axis direction near the center of each of the VCESLs 100A and 100B. The bottom of the trench W reaches the surface of the N-type semiconductor contact layer 130. The N-type DBR layer 132 is made of AlGaAs, and is formed by laminating a plurality of layers of Al having different composition ratios with respect to Ga. Thereby, the N-type DBR layer 132 functions as a first reflector for generating laser light of a predetermined frequency. Further, the N-type DBR layer 132 may also serve as an N-type semiconductor contact layer. That is, an N-type semiconductor contact layer is not necessary.

On the surface of the N-type DBR layer 132, as shown in FIG. 5, an N-type semiconductor cladding layer 134 is laminated. The N-type semiconductor cladding layer 134 has a circular shape at the center of the VCESL 100A and 100B when viewed in plan from the z-axis direction. Each of the N-type semiconductor cladding layers 134 is insulated from each other. The N-type semiconductor cladding layer 134 is composed of AlGaAs.

On the surface of the N-type semiconductor cladding layer 134, as shown in FIG. 5, an active layer 136 is provided. Further, the active layer 136 is composed of GaAs and AlGaAs. Further, the GaAs layer is provided by being sandwiched by the AlGaAs layer. In addition, the energy of AlGaAs is prohibited to have a larger bandwidth than GaAs. Moreover, the refractive index of GaAs is larger than that of AlGaAs.

On the surface of the active layer 136, as shown in FIG. 5, a P-type semiconductor cladding layer 138 is provided. The P-type semiconductor cladding layer 138 is composed of AlGaAs.

On the surface of the P-type semiconductor cladding layer 138, as shown in FIG. 5, an oxidized narrow layer 150 is provided. When the oxidized narrow layer 150 is viewed from the z-axis direction, a circular hole 152 is provided substantially at the center of the oxidized narrow layer 150. The oxidized narrow layer 150 is composed of AlGaAs.

On the surface of the oxidized narrow layer 150, as shown in FIG. 5, a P-type semiconductor multilayer film reflective layer (hereinafter referred to as a P-type DBR layer) 140 is provided. Further, a portion of the P-type DBR layer 140 is also provided in the hole 152 provided in the oxidized narrow layer, and is in contact with the P-type semiconductor cladding layer 138. The P-type DBR layer 140 is made of AlGaAs, and is formed by laminating a plurality of layers of Al with respect to a composition ratio of Ga. Thereby, the P-type DBR layer 140 functions as a second reflector for generating laser light of a predetermined frequency. In addition, the reflectivity of the P-type DBR layer 140 is lower than that of the N-type DBR layer 132. Here, although a semiconductor coating layer is provided to sandwich the active layer, the configuration is not limited thereto. It is also possible to provide a layer having a film thickness generated by resonance as an active layer.

On the surface of the P-type DBR layer 140, as shown in FIG. 5, a P-type semiconductor contact layer 142 is laminated. The P-type semiconductor contact layer 142 is composed of a compound semiconductor having P-type conductivity. Further, the P-type DBR layer may also serve as a P-type semiconductor contact layer. That is, a P-type semiconductor contact layer is not necessary.

The light is formed by the N-type semiconductor contact layer 130, the N-type DBR layer 132, the N-type semiconductor cladding layer 134, the active layer 136, the P-type semiconductor cladding layer 138, the P-type DBR layer 140, and the P-type semiconductor contact layer 142. The area multi-layer portion 160.

In addition, the thickness of each layer and the composition ratio of Al to Ga are set to have a peak wavelength of the emission spectrum and a plurality of quantum positions at the abdomen of the center of the photo standing wave distribution. well. Thereby, the light-emitting region multilayer portion 160 functions as a light-emitting portion of the VCSELs 100A and 100B. Further, as shown in FIG. 5, by providing the oxidized constriction layer 150, a current can be efficiently injected into the active layer 136, thereby realizing VCSELs 100A and 100B having low power consumption.

On the surface of the P-type semiconductor contact layer 142, as shown in FIG. 5, a ring electrode 921 for an anode is provided. As shown in FIG. 4, the anode ring electrode 921 has a ring shape when viewed in plan from the z-axis direction. Further, the anode electrode does not have to be annular, and may be, for example, a C-shape or a rectangular shape in which one of the annular portions is opened.

As shown in FIGS. 4 and 5, the electrode W of the N-type DBR layer 132 is provided with a cathode electrode 911. Further, the cathode electrode 911 is in contact with the N-type semiconductor contact layer 130 as shown in FIG. Thereby, the cathode electrode 911 is electrically connected to the N-type semiconductor contact layer 130. Further, as shown in FIG. 4, the cathode electrode 911 has an arc shape when viewed in plan from the z-axis direction. Further, this circular arc is substantially concentric with the ring of the annular anode electrode 921.

The insulating film 162 is provided so as to cover the surface of the light-emitting region multilayer portion 160 of the VCSELs 100A and 100B other than the portion where the cathode electrode 911 and the anode ring electrode 921 are provided. Moreover, the material of the insulating film 162 is, for example, tantalum nitride.

In the portion of the VCSEL 100A, 100B on the positive side in the x-axis direction, as shown in FIG. 4, an insulating layer 170 is provided. Further, as shown in FIG. 5, the insulating layer 170 is provided on the insulating film 162 covering the N-type DBR layer 132. As shown in FIG. 4, the insulating layer 170 has a rectangular shape having long sides in the y-axis direction when viewed in plan from the z-axis direction. Further, as a material of the insulating layer 170, for example, polyimide.

As shown in FIG. 4, a cathode pad electrode 912 is provided in a portion on the negative side in the y-axis direction of the surface of the insulating layer 170. The cathode pad electrode 912 is connected to the cathode wiring electrode 913 It is connected to the cathode electrode 911.

As shown in FIG. 4, a pad electrode 922 for an anode is provided on a portion of the surface of the insulating layer 170 on the positive side in the y-axis direction. Further, the anode pad electrode 922 and the cathode pad electrode 912 are separated by a predetermined distance. The anode pad electrode 922 is connected to the anode ring electrode 921 through the anode wiring electrode 923.

Further, as shown in FIGS. 4 and 5, the light-emitting element array 100 is provided with a groove 180 for dividing the VCSELs 100A and 100B. As shown in FIG. 4, the groove 180 is a lattice-like groove which is formed in parallel with the x-axis direction and the y-axis direction when viewed in plan from the z-axis direction. Moreover, as shown in FIG. 5, the groove 180 penetrates the insulating film 162, the N-type DBR layer 132, and the N-type semiconductor contact layer 130 in the lamination direction. Furthermore, the bottom of the trench 180 reaches a predetermined depth from the surface of the base substrate 128. Thereby, the VCSELs 100A, 100B can be prevented from being turned on through the N-type semiconductor contact layer 130.

In each of the VCSELs 100A and 100B of the light-emitting element array 100 configured as described above, the current (driving signal) is caused to flow from the cathode pad electrode 912 toward the anode pad electrode 922, and the active layer 136 is inductively discharged. The light emitted from the active layer is emitted by induction, and is reflected by the N-type DBR layer 132 and the P-type DBR layer 140 to and from the active layer. During and after the round trip, the light is amplified by the induction release, and the laser beam is emitted toward the positive side of the z-axis direction. In addition, since the N-type semiconductor contact layer 130 of the VCSEL 100A is separated from the N-type semiconductor contact layer 130 of the VCSEL 100B, crosstalk between the driving signal of the VCSEL 100A and the driving signal of the VCSEL 100B can be suppressed.

(composition of positioning member)

Next, the socket 20 will be described with reference to the drawings. Fig. 6 is a perspective view showing the appearance of the socket 20 according to the embodiment of the present invention (the metal cover 30 is not shown). 7 is a positioning member 200 according to an embodiment of the present invention; Appearance perspective. Fig. 8 is a plan view of the positioning member 200 according to the embodiment of the present invention as seen from the negative side in the z-axis direction. Fig. 9 is a view showing a structure of a package substrate 22 and a plug 40 according to an embodiment of the present invention in a C-C or D-D cross section of the positioning member 200 shown in Fig. 7.

As shown in FIG. 6, the positioning member 200 is provided across the structure substrate 22 and the sealing resin 24 so as to cover the entire surface of the package substrate 22 and the entire sealing resin 24. Further, the positioning member 200 includes a positioning member 220 for a light receiving element and a positioning member 240 for a light emitting element. The positioning members 220 and 240 are disposed to be sequentially arranged from the negative side to the positive side in the y-axis direction. Further, the positioning member 200 is made of, for example, an epoxy-based or an anti-loning resin.

As shown in FIGS. 7 and 8 , the positioning member 220 for a light-emitting element has a rectangular shape when viewed in plan from the z-axis direction. Further, the positioning member 220 includes a plug guiding portion 222 and a light coupling portion 224.

As shown in FIG. 7, the plug guide portion 222 constitutes a portion of the positioning member 220 on the negative side in the x-axis direction. Further, as shown in FIG. 8, the plug guide portion 222 is a plate-like member having a rectangular shape when viewed in plan from the z-axis direction. Further, the end surface S1 of the plug guiding portion 222 on the positive side in the x-axis direction faces the negative side of the sealing resin 24 in the x-axis direction as shown in FIG. Therefore, the plug guiding portion 222 is located on the mounting substrate 22 on the negative side of the sealing resin 24 in the x-axis direction.

Further, as shown in FIG. 7, the groove G1 for guiding the plug 40 to be described later is substantially parallel to the x-axis at the center of the surface of the plug guiding portion 222 in the y-axis direction. In the plug guide portion 222, a portion on the negative side in the y-axis direction of the groove G1 is referred to as a flat portion F1, and a portion on the positive side in the y-axis direction from the groove G1 is referred to as a flat portion F2. The height G1 of the groove G1 from the substrate 22 in the z-axis direction, as shown in FIG. 9, is higher than the height h2 of the sealing resin 24 in the z-axis direction. low.

As shown in FIGS. 7 to 9, the optical coupling portion 224 is placed on the sealing resin 24 so as to constitute a portion of the positioning member 220 on the positive side in the x-axis direction.

Further, as shown in FIG. 7, the optical coupling unit 224 has a main body 226 and a contact portion 228. The body 226 has a rectangular parallelepiped shape. The abutting portion 228 protrudes from the flat surface portion S2 of the plug guiding portion 222 from the end surface S2 on the negative side in the x-axis direction of the main body 226 to substantially the center in the x-axis direction of the flat portion F1. Thereby, the optical coupling unit 224 has an L shape when viewed in plan from the z-axis direction. Further, an end surface of the contact portion 228 on the negative side in the x-axis direction is referred to as an end surface S3. Further, the optical coupling portion 224 is provided with a concave portion D1 and a convex lens 230.

As shown in FIG. 7, the recessed portion D1 is provided in the vicinity of the side of the optical coupling portion 224 on the positive side in the y-axis direction. Moreover, the recessed portion D1 overlaps with the light receiving element array 50 when viewed in plan from the z-axis direction. Further, the recessed portion D1 overlaps with the optical axis of the optical fiber 60 connected to the plug 40 to be described later when viewed in plan from the x-axis direction. In addition, the optical axis of the optical fiber 60 is parallel to the x-axis. Moreover, as shown in FIG. 7, the recessed part D1 has a rectangular shape in plan view from the z-axis direction. Further, as shown in FIG. 9, the concave portion D1 has a V shape when viewed in plan from the y-axis direction.

The inner peripheral surface of the concave portion D1 on the negative side in the x-axis direction is the total reflection surface R1. The total reflection surface R1, as shown in Fig. 9, is parallel to the y-axis. Further, the total reflection surface R1 is inclined counterclockwise by 45° with respect to the z-axis when viewed from the negative side in the y-axis direction. Also, the refractive index of the positioning member 200 is sufficiently larger than air. Therefore, the laser beam B1 emitted from the optical fiber 60 toward the positive side in the x-axis direction enters the optical coupling portion 224, is totally reflected by the total reflection surface R1 toward the negative side in the z-axis direction, and passes through the sealing resin 24 to The light receiving element array 50 travels. That is, the total reflection surface R1 is provided on the optical path connecting the optical fiber 60 and the light receiving element array 50. At this time, if the light beam of the laser beam B1 is viewed from the y-axis direction, Then, the angle between the optical axis of the laser beam B1 emitted from the optical fiber 60 and the total reflection surface R1 is 45°, and the angle between the optical axis of the laser beam B1 directed toward the light receiving element array 50 and the total reflection surface R1 is 45°. That is, the angle formed by the total reflection surface R1 and the optical axis of the optical fiber 60 is equal to the angle formed by the total reflection surface R1 and the light receiving element array 50.

As shown in FIGS. 8 and 9 , the convex lens 230 (first convex lens) is provided on the surface of the optical coupling portion 224 on the negative side in the z-axis direction. Further, the convex lens 230 is overlapped with the light receiving element array 50 when viewed in plan from the z-axis direction. Thereby, the convex lens 230 faces the light-receiving element array 50 and is located on the optical path of the laser beam B1. Further, the convex lens 230 has a semicircular shape that protrudes toward the negative side of the z-axis when viewed from a direction orthogonal to the z-axis. Therefore, the laser beam B1 emitted from the optical fiber 60 is reflected by the total reflection surface R1, and then condensed or collimated by the convex lens 230 to be incident on the light receiving element array 50.

As shown in FIGS. 7 and 8 , the positioning member 240 for the light receiving element has a rectangular shape when viewed in plan from the z-axis direction. Further, the positioning member 240 includes a plug guiding portion 242 and a light coupling portion 244.

As shown in FIG. 7, the plug guide portion 242 constitutes a portion of the positioning member 240 on the negative side in the x-axis direction. Further, as shown in FIG. 8, the plug guide portion 242 is a plate-like member having a rectangular shape when viewed in plan from the z-axis direction. Further, the end surface S4 of the plug guiding portion 242 on the positive side in the x-axis direction faces the negative side of the sealing resin 24 in the x-axis direction as shown in FIG. Therefore, the plug guiding portion 242 is located on the mounting substrate 22 on the negative side of the sealing resin 24 in the x-axis direction.

Further, at a substantially central portion of the surface of the plug guiding portion 242 in the y-axis direction, as shown in FIG. 7, the groove G2 for guiding the plug 40 to be described later is provided substantially in parallel with the x-axis. Further, in the plug guiding portion 242, a portion which is closer to the negative side in the y-axis direction than the groove G2 is referred to as a flat portion F3, and A portion of the groove G2 on the positive side in the y-axis direction is referred to as a flat portion F4. The height H3 of the groove G2 from the substrate 22 in the z-axis direction is lower than the height h2 of the sealing resin 24 in the z-axis direction as shown in FIG.

As shown in FIGS. 7 to 9, the optical coupling portion 244 is placed on the sealing resin 24 so as to form a portion of the positioning member 240 on the positive side in the x-axis direction.

Further, as shown in FIG. 7, the optical coupling unit 244 has a main body 246 and a contact portion 248. The body 246 has a rectangular parallelepiped shape. The abutting portion 248 protrudes from the flat surface portion S5 of the plug guide portion 242 from the end surface S5 on the negative side in the x-axis direction of the main body 246 to substantially the center of the flat portion F4 in the x-axis direction. Thereby, the light coupling portion 244 has an L shape when viewed in plan from the z-axis direction. Further, an end surface of the contact portion 248 on the negative side in the x-axis direction is referred to as an end surface S6. Further, the light coupling portion 244 is provided with a concave portion D2 and a convex lens 250.

As shown in FIG. 7, the recessed portion D2 is provided in the vicinity of the side of the optical coupling portion 244 on the negative side in the y-axis direction. Moreover, the recessed portion D2 overlaps with the light-emitting element array 100 when viewed in plan from the z-axis direction. Further, the recessed portion D2 overlaps with the optical axis of the optical fiber 60 connected to the plug 40, which will be described later, when viewed in plan from the x-axis direction. In addition, the optical axis of the optical fiber 60 is parallel to the x-axis. Further, as shown in FIG. 7, the concave portion D2 has a rectangular shape when viewed in plan from the z-axis direction. Further, as shown in FIG. 9, the concave portion D2 has a V shape when viewed in plan from the y-axis direction.

The inner peripheral surface of the concave portion D2 on the negative side in the x-axis direction is the total reflection surface R2. The total reflection surface R2, as shown in Fig. 9, is parallel to the y-axis. Further, the total reflection surface R2 is inclined counterclockwise by 45° with respect to the z-axis when viewed from the negative side in the y-axis direction. Also, the refractive index of the positioning member 200 is sufficiently larger than air. Therefore, the laser beam B2 emitted from the light-emitting element array 100 toward the positive side in the z-axis direction enters the light coupling portion 244, and the total reflection surface R2 is on the negative side in the x-axis direction. The reflection travels through the plug 40 to the optical fiber 60. That is, the total reflection surface R2 is provided on the optical path connecting the optical fiber 60 and the light-emitting element array 100. At this time, when the light beam of the laser beam B2 is viewed from the y-axis direction, the angle between the optical axis of the laser beam B2 emitted from the light-emitting element array 100 and the total reflection surface R2 is 45°, and the laser beam toward the optical fiber 60 is obtained. The angle between the optical axis of B2 and the total reflection surface R2 is 45°. That is, the angle formed by the total reflection surface R2 and the optical axis of the optical fiber 60 is equal to the angle formed by the total reflection surface R2 and the light-emitting element array 100.

The convex lens 250 (first convex lens) is provided on the back surface of the optical coupling portion 244 as shown in FIGS. 8 and 9 . Further, the convex lens 250 overlaps with the light-emitting element array 100 when viewed in plan from the z-axis direction. Thereby, the convex lens 250 opposes the light-emitting element array 100 and is located on the optical path of the laser beam B2. Further, the convex lens 250 has a semicircular shape that protrudes toward the negative side of the z-axis when viewed from a direction orthogonal to the z-axis. Therefore, the laser beam B2 emitted from the light-emitting element array 100 is condensed or collimated by the convex lens 250, and is incident on the total reflection surface R2.

(Composition of metal cover)

Next, the metal cover 30 will be described with reference to the drawings. Fig. 10 is a perspective view showing the appearance of a metal cover 30 according to an embodiment of the present invention.

The metal cover 30 is a piece of metal plate (for example, SUS301) bent into Made with fonts. Further, as shown in FIG. 1, the metal cover 30 covers the positioning member 200 from the positive side in the z-axis direction and the positive side in the y-axis direction and the negative side in the y-axis direction.

The metal cover 30, as shown in FIG. 10, includes an upper surface 32 and side surfaces 34, 36. The upper surface 32 is a plane orthogonal to the z-axis and has a rectangular shape. The side surface 34 is formed by bending the long side of the metal cover 30 from the negative side in the y-axis direction of the upper surface 32 toward the negative side in the z-axis direction. The side surface 36, the metal cover 30 from the long side of the positive side of the y-axis direction of the upper surface 32 to the negative side of the z-axis direction Formed by bending.

In the portion on the negative side of the x-axis direction of the upper surface 32, as shown in Fig. 10, engaging portions 32a, 32b for fixing the plug 40 to the socket 20 are provided. The engaging portions 32a and 32b are arranged in order from the negative side in the y-axis direction toward the positive side.

The engaging portions 32a, 32b are cut by the upper 32 Formed by a glyph. More specifically, the engaging portions 32a, 32b are opened by being cut in the upper surface 32 toward the positive side in the x-axis direction. Font gap and make The portion surrounded by the notch is formed by being concavely curved toward the negative side in the z-axis direction. Thereby, the engaging portions 32a and 32b have a V-shaped shape that protrudes toward the negative side in the z-axis direction when viewed in plan from the y-axis direction.

Further, as shown in Fig. 10, the short sides on the negative side in the x-axis direction of the upper surface 32 are provided with engaging portions 32c, 32d for fixing the plug 40 to the socket 20. The engaging portions 32c and 32d are metal pieces that protrude from the upper surface 32 toward the negative side in the x-axis direction. The engaging portions 32c and 32d are concavely curved toward the negative side in the z-axis direction at positions substantially at the center in the x-axis direction of the engaging portions 32c and 32d. Thereby, the engaging portions 32c and 32d have a V-shaped shape that protrudes toward the negative side in the z-axis direction when viewed in plan from the y-axis direction.

As shown in FIG. 10, the long sides of the side surface 34 on the negative side in the z-axis direction are sequentially projected from the negative side toward the positive side in the x-axis direction toward the positive side in the negative direction side in the z-axis direction. Arrange the settings. The convex portions C1 to C3 are fixed to the structural substrate 22 by an adhesive, respectively. Further, the convex portion C1 is connected to the ground conductor exposed portion E2 of the package substrate 22. Further, the convex portion C3 is fitted into the space H1 provided between the leg portion 24b of the sealing resin 24 and the leg portion 24c. Thereby, the metal cover 30 is positioned relative to the package substrate 22.

The long side of the side of the negative side of the z-axis direction of the side surface 36, as shown in FIG. The convex portions C4 to C6 protruding toward the negative side in the z-axis direction are arranged in this order from the negative side in the x-axis direction toward the positive side. The convex portions C4 to C6 are fixed to the package substrate 22 by an adhesive, respectively. Further, the convex portion C4 is connected to the ground conductor exposed portion E3 of the package substrate 22. Further, the convex portion C6 is fitted into the space H2 provided between the leg portion 24d of the sealing resin 24 and the leg portion 24e. Thereby, the metal cover 30 is positioned relative to the package substrate 22.

Further, as shown in FIG. 1, the metal cover 30 covers the positioning member 200 from the positive side in the z-axis direction and the positive side in the y-axis direction and the negative side in the y-axis direction. Further, an opening portion A3 into which the plug 40 to be described later is inserted is formed on the negative side in the x-axis direction of the socket 20.

(composition of the plug)

A plug 40 according to an embodiment of the present invention will be described with reference to the drawings. Figure 11 is a perspective view showing the appearance of a plug according to an embodiment of the present invention. Fig. 12 is a plan view showing a plug according to an embodiment of the present invention from the negative side in the z-axis direction.

The plug 40, as shown in Fig. 11, is provided at one end of the optical fiber 60. The plug 40 is provided with a receiving side plug 42 and a transmitting side plug 46. Further, the plug 40 is made of, for example, an epoxy-based or an anti-loning resin.

The receiving side plug 42 transmits the laser beam B1 from the optical fiber 60. As shown in FIG. 11, the receiving side plug 42 includes an optical fiber insertion portion 42a and an ear portion 42b. The optical fiber insertion portion 42a constitutes a portion on the positive side in the y-axis direction of the reception side plug 42, and has a rectangular parallelepiped shape extending in the x-axis direction. An opening A1 for inserting the optical fiber 60 is provided in a portion on the negative side in the x-axis direction of the optical fiber insertion portion 42a.

As shown in FIG. 11, the opening A1 is formed by cutting the upper surface S7 of the optical fiber insertion portion 42a on the positive side in the z-axis direction and the end surface S8 on the negative side in the x-axis direction. also, A hole H7 for guiding the core wire of the inserted optical fiber 60 to the front end of the receiving side plug 42 is provided on the inner circumferential surface of the opening A1 on the positive side in the x-axis direction. Further, the number of holes H7 corresponds to the number of the optical fibers 60, and is two in the present embodiment.

Further, as shown in FIG. 11, a portion D3 for injecting an adhesive for fixing the optical fiber 60 is provided in a portion on the positive side in the x-axis direction of the optical fiber insertion portion 42a. The concave portion D3 is recessed from the surface of the optical fiber insertion portion 42a toward the back surface. A hole H7 is provided in the inner circumferential surface of the concave portion D3 on the negative side in the x-axis direction. The hole H7 is connected to the inner peripheral surface of the opening A1 on the positive side in the x-axis direction. Therefore, the core wire of the optical fiber 60 reaches the concave portion D3 from the opening A1 through the hole H7. The core wire of the optical fiber 60 that has reached the concave portion D3 abuts against the inner circumferential surface (contact surface) S9 on the positive side in the x-axis direction of the concave portion D3. Further, the optical fiber 60 is fixed to the reception side plug 42 by injecting an adhesive made of a transparent resin, for example, an epoxy resin into the opening A1 and the recess D3.

As shown in FIGS. 9 and 12, a convex lens 44 (fourth convex lens) is provided on the end surface S10 of the optical fiber insertion portion 42a on the positive side in the x-axis direction. The convex lens 44 has a semicircular shape that protrudes toward the positive side in the x-axis direction when viewed from a direction orthogonal to the x-axis direction. Thereby, the laser beam B1 emitted from the optical fiber 60 is condensed or collimated by the convex lens 44.

Further, the convex lens 44 overlaps the optical axis of the optical fiber 60 when viewed in plan from the x-axis direction. Therefore, the laser beam B1 is condensed or collimated by the convex lens 44, and travels on the total reflection surface R1. Further, the laser beam B1 is reflected by the total reflection surface R1 and transmitted to the light receiving element array 50.

As shown in FIG. 11, the upper surface S7 of the optical fiber insertion portion 42a is provided with a projection N1 that engages with the engagement portion 32a of the metal cover 30. The projection N1 is provided between the opening A1 and the recess D3 in the x-axis direction and extends in the y-axis direction. Further, the projection N1 has a triangular shape that protrudes toward the positive side in the z-axis direction when viewed in plan from the y-axis direction.

On the back surface of the optical fiber insertion portion 42a, as shown in Figs. 11 and 12, a convex portion C7 is provided. The convex portion C7 corresponds to the groove G1 of the plug guiding portion 222 of the positioning member 220. The convex portion C7 is disposed in parallel with the x-axis from the end surface S8 toward the end surface S10.

As shown in FIG. 11 and FIG. 12, the ear portion 42b protrudes from the vicinity of the end portion on the negative side in the x-axis direction of the optical fiber insertion portion 42a toward the negative side in the y-axis direction. Thereby, the receiving side plug 42 has an L shape. Further, the ear portion 42b functions as a grip portion when the receiving side plug 42 is inserted and removed. Further, an extraction hole having a substantially rectangular shape when viewed from the z-axis direction is provided substantially at the center of the ear portion 42b.

Further, the connection operation between the receiving side plug 42 and the socket 20 is performed by pressing the convex portion C7 along the groove G1 toward the positive side in the x-axis direction. At this time, the end surface S11 of the ear portion 42b on the positive side in the x-axis direction abuts against the end surface S3 of the abutting portion 228 of the positioning member 220 shown in FIG.

Further, by the connection operation of the receiving side plug 42 and the socket 20, as shown in FIG. 9, the receiving side plug 42 is placed on the positioning member 220. Further, as described above, the optical axis of the optical fiber 60 is parallel to the x-axis direction, and the direction in which the receiving side plug 42 is pressed into the socket 20 is the positive side in the x-axis direction. Therefore, the optical axis of the optical fiber 60 is parallel to the insertion direction of the receiving side plug 42.

Further, when the receiving side plug 42 is connected to the socket 20, the engaging portion 32a of the metal cover 30 is engaged with the projection N1, and the engaging portion 32c is engaged with the corner formed by the upper surface S7 of the receiving side plug 42 and the end surface S8. Thereby, the receiving side plug 42 is fixed to the socket 20.

The transmitting side plug 46 transmits the laser beam B2 from the light emitting element array 100. As shown in FIG. 11, the transmission side plug 46 includes an optical fiber insertion portion 46a and an ear portion 46b. The optical fiber insertion portion 46a constitutes a portion on the negative side in the y-axis direction of the communication side plug 46, and has a rectangular parallelepiped shape. In the light An opening portion A2 through which the optical fiber 60 is inserted is provided in a portion of the fiber insertion portion 46a on the negative side in the x-axis direction.

As shown in FIG. 11, the opening A2 is formed by cutting the upper surface S12 of the optical fiber insertion portion 46a on the positive side in the z-axis direction and the end surface S13 on the negative side in the x-axis direction. Further, an inner peripheral surface on the positive side in the x-axis direction of the opening A2 is provided with a hole H8 for guiding the core of the inserted optical fiber 60 to the front end of the transmitting-side plug 46. Further, the number of holes H8 corresponds to the number of the optical fibers 60, and is two in the present embodiment.

Further, as shown in FIG. 11, a portion of the optical fiber insertion portion 46a on the positive side in the x-axis direction is provided with a concave portion D4 for injecting an adhesive for fixing the optical fiber 60. The recess D4 is recessed from the surface of the optical fiber insertion portion 46a toward the back surface. A hole H8 is provided in the inner peripheral surface of the concave portion D4 on the negative side in the x-axis direction. The hole H8 is connected to the inner peripheral surface of the opening A2 on the positive side in the x-axis direction. Therefore, the core wire of the optical fiber 60 reaches the concave portion D4 from the opening portion A2 through the hole H8. The core wire of the optical fiber 60 that has reached the concave portion D4 abuts against the inner circumferential surface (contact surface) S14 on the positive side in the x-axis direction of the concave portion D4. Further, the optical fiber 60 is fixed to the communication side plug 46 by injecting an adhesive made of a transparent resin, for example, an epoxy resin into the opening A2 and the recess D4.

As shown in FIGS. 9 and 12, a convex lens 48 (fourth convex lens) is provided on the end surface S15 of the optical fiber insertion portion 46a on the positive side in the x-axis direction. The convex lens 48 has a semicircular shape that protrudes toward the positive side in the x-axis direction when viewed from a direction orthogonal to the x-axis direction. Thereby, the laser beam B2 emitted from the light-emitting element array 100 and reflected by the total reflection surface R2 is condensed or collimated by the convex lens 48.

Further, the convex lens 48 overlaps the optical axis of the optical fiber 60 when viewed in plan from the x-axis direction. Therefore, the laser beam B2 condensed or collimated by the convex lens 48 passes through the resin of the optical fiber insertion portion 46a. Further, the laser beam B2 is transmitted to the core of the core of the optical fiber 60 abutting against the abutting surface S14.

As shown in FIG. 11, the upper surface S12 of the optical fiber insertion portion 46a is provided with a projection N2 that engages with the engagement portion 32b of the metal cover 30. The projection N2 is provided between the opening A2 and the recess D4 in the x-axis direction and extends in the y-axis direction. Moreover, the projection N2 has a triangular shape that protrudes toward the positive side in the z-axis direction when viewed in plan from the y-axis direction.

On the back surface of the optical fiber insertion portion 46a, as shown in Figs. 11 and 12, a convex portion C8 is provided. The convex portion C8 corresponds to the groove G2 of the plug guiding portion 242 of the positioning member 240. The convex portion C8 is disposed in parallel with the x-axis from the end surface S13 toward the end surface S15.

As shown in FIGS. 11 and 12, the ear portion 46b protrudes from the end portion on the negative side in the x-axis direction of the optical fiber insertion portion 46a toward the positive side in the y-axis direction. Thereby, the transmitting side plug 46 has an L shape. Further, the ear portion 46b functions as a grip portion when the communication side plug 46 is inserted and removed. Further, an extraction hole having a substantially rectangular shape when viewed from the z-axis direction is provided at substantially the center of the ear portion 46b.

Further, the connection operation between the transmitting side plug 46 and the socket 20 is performed by pressing the convex portion C8 along the groove G2 toward the positive side in the x-axis direction. At this time, the end surface S16 of the ear portion 46b on the positive side in the x-axis direction abuts against the end surface S6 of the abutting portion 248 of the positioning member 200 shown in FIG.

Further, by the connection operation of the transmitting side plug 46 and the socket 20, as shown in FIG. 9, the transmitting side plug 46 is placed on the positioning member 240. Further, as described above, the optical axis of the optical fiber 60 is parallel to the x-axis direction, and the direction in which the transmitting-side plug 46 is pressed into the socket 20 is the positive side in the x-axis direction. Therefore, the optical axis of the optical fiber 60 is parallel to the insertion direction of the transmitting side plug 46.

Further, when the transmitting side plug 46 is connected to the socket 20, the engaging portion 32b of the metal cover 30 is engaged with the projection N2, and the engaging portion 32d and the upper surface S12 and the end surface S13 of the transmitting side plug 46 are engaged. The corners of the configuration are engaged, whereby the communication side plug 46 is fixed to the socket 20.

In the optical transmission module 10 configured as described above, as shown in FIG. 9, the laser beam B1 emitted from the optical fiber 60 toward the positive side in the x-axis direction passes through the plug 40 and the positioning member 220. Further, the laser beam B1 is reflected by the total reflection surface R1 toward the negative side in the z-axis direction, and is transmitted through the sealing resin 24 to the light-receiving element array 50. Therefore, the positioning member 220 has a function of optically coupling the core of the optical fiber 60 to the light receiving element array 50.

Further, the laser beam B2 emitted from the light-emitting element array 100 toward the positive side in the x-axis direction passes through the sealing resin 24 and the positioning member 240. Further, the laser beam B2 is reflected by the total reflection surface R2 toward the negative side in the x-axis direction, and is transmitted through the plug 40 to the core of the optical fiber 60. Therefore, the positioning member 240 has a function of optically coupling the core of the optical fiber 60 to the light-emitting element array 100.

(Production method)

Hereinafter, a method of manufacturing the optical transmission module 10 according to an embodiment of the present invention will be described in the order of the light-emitting element array 100, the socket 20, the plug 40, and the optical transmission module 10.

(Method of Manufacturing Light-Emitting Element Array)

First, an N-type semiconductor contact layer 130, an N-type DBR layer 132, an N-type semiconductor cladding layer 134, an active layer 136, a P-type semiconductor cladding layer 138, and a P-type DBR layer 140 are sequentially laminated on the surface of the base substrate 128. P-type semiconductor contact layer 142.

Next, the P-type semiconductor contact layer 142, the P-type DBR layer 140, the P-type semiconductor cladding layer 138, the active layer 136, and the N-type semiconductor cladding layer are formed in addition to the portions constituting the light-emitting region multilayer portion 160 of each of the VCSELs 100A and 100B. 134 is sequentially etched in a predetermined pattern. At this step, etching is performed to the surface of the N-type DBR layer 132. Thereby, in addition to the N-type semiconductor contact layer 130 and the N-type DBR layer 132, the light-emitting region multilayer portion 160 of the VCSEL 100A, 100B is separated into Leave the established distance.

The N-type semiconductor contact layer 130 is exposed by etching a position close to the light-emitting region multilayer portion 160 in a region exposed on the surface of the N-type DBR layer 132. A cathode electrode 911 is formed in a region where the N-type semiconductor contact layer 130 is exposed.

Further, an anode ring electrode 921 is formed on the surface of the P-type semiconductor contact layer 142 of the unetched light-emitting region multilayer portion 160.

On the surface side of the base substrate 128, an insulating film 162 is formed in addition to the surfaces of the cathode electrode 911 and the anode ring electrode 921.

An insulating layer 170 is formed in a region of the surface of the insulating film 162 which is close to the light-emitting region multilayer portion 160.

A cathode pad electrode 912 and an anode pad electrode 922 are formed on the surface of the insulating layer 170.

A cathode wiring electrode 913 that connects the cathode electrode 911 and the cathode pad electrode 912 is formed. An anode wiring electrode 923 that connects the anode ring electrode 921 and the anode pad electrode 922 is formed.

The insulating film 162, the N-type DBR layer 132, and the N-type semiconductor contact layer 130 are formed so as to divide the regions of the adjacent VCSELs 100A and 100B so as to form recesses having a concave shape from the surface of the base substrate 128 to the inside to a predetermined depth. 180. Through the above steps, the light emitting element array 100 is formed.

(Method of manufacturing the socket)

Next, a method of manufacturing the socket 20 will be described with reference to the drawings. Figure 13 is a diagram showing the process of a socket according to an embodiment of the present invention.

First, solder is applied on the upper surface of the mother substrate 122 (not shown in the drawing) which is an assembly of the constituent substrates 22. More specifically, the cream solder is pressed using a squeegee on the mother substrate 122 on which the metal mask is placed. Next, the metal mask is removed from the mother substrate 122, thereby printing the solder to the mother substrate 122.

Next, the capacitor is placed on the solder of the mother substrate 122. Thereafter, the mother substrate 122 is heated to solder the capacitor.

After the capacitor is soldered, an Ag paste is applied to a predetermined position on the mother substrate 122. The driver circuit 26, the light-receiving element array 50, and the light-emitting element array 100 are placed on the applied Ag to perform die bonding. Further, the drive circuit 26 and the light-receiving element array 50 are connected by wire bonding using Au leads, and the drive circuit 26 is connected to the light-emitting element array 100 by wire bonding.

Thereafter, the capacitor, the drive circuit 26, the light-receiving element array 50, and the light-emitting element array 100 are subjected to resin molding. Further, the mother substrate 122 is cut using a cutter, thereby obtaining a plurality of package substrates 22.

Next, the positioning member 220 is placed on the package substrate 22 and the sealing resin 24. More specifically, a UV-curable adhesive is applied to a region on the negative side in the x-axis direction of the surface of the sealing resin 24a. After the application of the adhesive, as shown in FIG. 13, the position of the center T50 of the light-emitting portion of the light-receiving element array 50 is confirmed by the position recognition camera V1.

Next, the loading machine V2 for placing the positioning member 220 on the sealing resin 24 sucks up the positioning member 220. Then, as shown in FIG. 13, the position of the lens center T230 of the convex lens 230 of the positioning member 220 is confirmed by the position recognition camera V3 in a state where the positioning device 220 is adsorbed by the mounting machine V2.

The position data of the center T50 of the light receiving unit of the light receiving element array 50 confirmed by the position recognition camera V1 and the position data of the lens center T230 of the convex lens 230 of the positioning member 220 confirmed by the position recognition camera V3 are used to calculate the light receiving element array 50. The relative position of the light receiving portion and the convex lens 230. Based on the calculated result, the amount of movement of the loading machine V2 is determined.

Next, the positioning member 220 is moved by the loading machine V2 to determine the amount of movement. Thereby, the lens center T230 of the convex lens 230 coincides with the optical axis of the light receiving element array 50.

The operation of placing the positioning member 240 on the package substrate 22 and the sealing resin 24 is performed in parallel with the mounting operation of the positioning member 220. More specifically, after applying a UV-curable adhesive to a region on the negative side in the x-axis direction of the surface of the sealing resin 24a, as shown in FIG. 13, the light-emitting portion of the light-emitting element array 100 is confirmed by the position recognition camera V4. The location of the center T100.

Next, the loading machine V5 for placing the positioning member 240 on the sealing resin 24 sucks up the positioning member 240. Next, as shown in FIG. 13, in the state where the positioning device 240 is adsorbed by the mounting machine V5, the position of the lens center T250 of the convex lens 250 of the positioning member 240 is confirmed by the position recognition camera V6.

The positional data of the center T100 of the light-emitting portion of the light-emitting element array 100 confirmed by the position recognition camera V4 and the positional data of the lens center T250 of the convex lens 250 of the positioning member 240 confirmed by the position recognition camera V6 are used to calculate the light-emitting element array 100. The relative position of the light emitting portion and the convex lens 250. Based on the calculated result, the amount of movement of the mounted machine V5 is determined.

Next, the positioning member 240 is moved by the loading machine V5 to determine the amount of movement. Thereby, the lens center T250 of the convex lens 250 coincides with the optical axis of the light-emitting element array 100.

The disposed positioning members 220, 240 are irradiated with ultraviolet rays. In addition, ultraviolet light In the shot, the positioning members 220 and 240 are in a state in which the mounting machines V2 and V5 are pressed against the package substrate 22 and the sealing resin 24. Thereby, when the UV-type hardener located between the positioning members 220, 240 and the sealing resin 24 is hardened, the positioning members 220, 240 are fixed to the structure substrate 22 and the sealing resin 24 without causing a positional displacement.

Next, the metal cover 30 is attached to the package substrate 22 on which the positioning member 200 is placed. More specifically, the space H1 between the leg portions 24b and 24c on the surface of the structure substrate 22, the space H2 between the leg portions 24d and 24e, and the portion where the convex portions C2 and C5 of the metal cover 30 are in contact with each other are coated with an epoxy system. A thermosetting adhesive such as a thermosetting adhesive. Moreover, a conductive paste such as Ag is applied to the ground conductor exposed portions E2 and E3 of the package substrate 22.

After the application of the adhesive and the conductive paste, the convex portion C3 of the metal cover 30 is fitted to the portion of the sealing portion 24b of the sealing resin 24 and the portion of the leg portion 24c, that is, the space H1. Further, the convex portion C6 is fitted to the portion of the leg portion 24d of the sealing resin 24 and the leg portion 24e, that is, the space H2. Thereby, the position of the metal cover 30 with respect to the structure substrate 22 is determined. Further, at the same time as the positioning of the metal cover 30, the convex portions C1 to C6 are in contact with the adhesive or the conductive paste on the package substrate 22.

After the metal cover 30 is fitted, the package substrate 22 is heated to cure the adhesive and the conductive paste. Thereby, the metal cover 30 is fixed to the package substrate 22. Further, by attaching the metal cover 30 to the package substrate 22, the convex portions C1, C4 of the metal cover 30 are in contact with the ground conductor exposed portions E2, E3 of the package substrate 22. Thereby, the metal cover 30 is connected to the ground conductor in the package substrate 22, and the ground potential is maintained. The socket 20 is completed by the above steps.

(Method of manufacturing plug)

First, the optical fiber 60 inserted into the plug 40 is cut to a predetermined length.

Next, the coating near the front end of the optical fiber 60 is removed using a fiber stripper. After the coating near the front end is removed, the opening of the core wire of the optical fiber 60 is exposed.

Next, as shown in FIG. 11, a transparent adhesive such as an epoxy resin for fixing the optical fiber 60 is injected into the openings A1 and A2 of the plug 40 and the recesses D3 and D4. Furthermore, the core of the optical fiber 60 is pressed into contact with the faces S9, S14 of the plug 40. Next, the optical fiber 60 is fixed to the plug 40 by hardening the transparent adhesive.

(Manufacturing method of optical transmission module)

The plug 40 is attached to the socket 20. The connection of the plug 40 is as described above by the projections C7, C8 of the plug 40 along the slots G1, G2 of the positioning members 220, 240 from the opening A3 provided between the metal cover 30 and the socket 20 toward the x-axis direction. Pressing in the positive direction side is performed. The optical transmission module 10 is completed through the above process.

(effect)

In the optical transmission module 10 and the socket 20 configured as described above, the lenses 230 and 240 and the total reflection surfaces R1 and R2 can be miniaturized. More specifically, in the optical module 500, as shown in FIG. 17, the light P501 is emitted from the plug 501 made of resin to the air. Next, the light P501 travels in the air, is reflected by the reflection lens 548, and reaches the optical element 539. On the other hand, in the optical transmission module 10 and the socket 20, as shown in FIG. 9, the laser beam B1 emitted from the optical fiber 60 is reflected by the total reflection surface R1 through the positioning member 220 made of resin. The laser beam B1 reflected by the total reflection surface R1 passes through the sealing resin 24 to reach the light receiving element array 50.

That is, in the optical transmission module 10 and the socket 20, the total reflection surface R1 is provided in the positioning member 220, and the vicinity of the total reflection surface R1 is filled with the resin. Thereby, most of the optical path connecting the optical fiber 60 and the light receiving element array 50 is occupied by the resin. Therefore, in the optical transmission module 10 and the socket 20, the ratio of the resin occupied by the optical path connecting the optical fiber 60 and the light-receiving element array 50 is higher than the ratio of the resin in the optical module 500 in the optical path connecting the optical fiber 506 and the optical element 539. Thereby, in the optical transmission module 10 and the socket 20, the diffusion of the light caused by the laser beam B1 traveling in the air can be suppressed. As a result, in the optical transmission module 10 and the socket 20, the convex lens 230 and the total reflection surface R1 that condense or collimate the laser beam B1 can be miniaturized. In the laser beam B2, the convex lens 250 and the total reflection surface R2 can be miniaturized for the same reason.

Further, in the optical transmission module 10 and the socket 20, the optical loss of the laser beam B1 can be reduced. More specifically, in the optical transmission module 10 and the socket 20, the laser beam B1 emitted from the optical fiber 60 passes through the positioning member 220 and the sealing resin 24 which are made of resin. Thereby, the ratio of the resin occupies greatly changes in the optical path of the laser beam B1. As a result, the diffusion of the laser beam B1 can be further suppressed. Therefore, the intensity of the laser beam B1 incident on the light receiving element array 50 becomes large, and the optical loss of the laser beam B1 can be reduced. Further, for the same reason, the optical loss of the laser beam B2 can also be reduced.

Further, as shown in FIG. 9, the insertion direction of the plug 40 to the socket 20 is the same as the optical axis of the optical fiber 60 in the x-axis direction. Thereby, even if the plug 40 is insufficiently mounted to the socket 20, the optical axis of the optical fiber 60 does not deviate as long as the distance from the front end of the optical fiber 60 to the light-receiving element array 50 or the light-emitting element array 100 becomes long. Therefore, according to the optical transmission module 10, optical loss of the optical fiber 60 and the light receiving element array 50 or the light emitting element array 100 accompanying the mounting failure of the plug 40 can be suppressed.

In the optical transmission module 10 and the socket 20, a surface mounting electrode E1 is provided on the back surface of the package substrate 22. Thereby, the optical transmission module 10 can be surface-mounted without providing a connector for connection on the circuit board on which the optical transmission module 10 is mounted. Therefore, the substantial area occupied by the optical transmission module 10 of the circuit substrate on which the optical transmission module 10 is mounted can be suppressed.

In the optical transmission module 10 and the socket 20, as shown in FIG. 9, a convex lens 230 is provided on the back surface of the optical coupling portion 224 of the positioning member 220. Therefore, the laser beam B1 from the optical fiber 60 passes through the convex lens 230. At this time, even if the optical axis of the laser beam B1 reflected by the total reflection surface R1 is shifted, the laser beam B1 is condensed or collimated by the convex lens 230 to travel on the light receiving element array 50. Therefore, according to the socket 20 and the optical transmission module 10, the optical loss caused by the shift of the optical axis of the laser beam B1 can be suppressed.

In the optical transmission module 10 and the socket 20, as shown in FIG. 9, a convex lens 250 is provided on the back surface of the optical coupling portion 244 of the positioning member 200. Therefore, the laser beam B2 from the light-emitting element array 100 passes through the convex lens 250. At this time, even if the position of the light-emitting element array 100 is displaced relative to the positioning member 240, the laser beam B2 is concentrated or collimated by the convex lens 250 to travel on the total reflection surface R2. Therefore, according to the socket 20 and the optical transmission module 10, optical loss due to positional displacement of the light-emitting element array 100 can be suppressed.

In the optical transmission module 10, as shown in FIG. 9, a convex lens 44 is provided on the end surface S10 of the receiving side plug 42. Therefore, the laser beam B1 from the optical fiber 60 passes through the convex lens 44. At this time, even if the position of the optical fiber 60 is displaced from the plug 40, the laser beam B1 is concentrated or collimated by the convex lens 44 to travel toward the total reflection surface R1. Therefore, according to the optical transmission module 10, the optical loss caused by the positional deviation of the optical fiber 60 can be suppressed.

In the optical transmission module 10, as shown in FIG. 9, a convex lens 48 is provided on the end surface S15 of the communication side plug 46. Therefore, the laser beam B2 reflected by total reflection passes through the convex lens 48. At this time, the laser beam B2 is concentrated or collimated by the convex lens 48 to travel toward the optical fiber 60. Therefore, according to the optical transmission module 10, the optical loss caused by the shift of the optical axis of the laser beam B1 can be suppressed.

In the optical transmission module 10, the strength of the plug 40 can be improved. Figure 14 is a study Know the cross section of the socket and plug. More specifically, when the positioning member 200 is entirely provided in the sealing resin 25 as in the optical transmission module 400 shown in FIG. 14, the thickness of the plug 41 in the z-axis direction is reduced. Therefore, the strength of the plug 41 is lowered. Therefore, in the optical transmission module 10, as shown in FIG. 9, the positioning member 200 is provided across the package substrate 22 and the sealing resin 24. Further, the plug 40 is located on the plug guiding portions 222, 242 of the positioning member 200. Further, the heights h1, h3 of the grooves G1, G2 of the plug guiding portions 222, 242 are lower than the height h2 of the sealing resin 24. Further, the optical axis of the optical fiber 60 is located on the positive side of the sealing resin 24 in the z-axis direction. Thereby, in the optical transmission module 10, the plug 40 can be made larger in the z-axis direction than the optical transmission module 400 shown in FIG. Therefore, in the optical transmission module 10, the strength can be improved.

Further, in the optical transmission module 10, since the plug 40 can be made larger in the z-axis direction, it is easier to grasp the plug 41 of the optical transmission module 400. Therefore, in the optical transmission module 10, the connection work of the plug 40 to the socket 20 is easy.

Further, between the metal cover 30 of the optical transmission module 10 and the socket 20, as shown in FIG. 1, an opening A3 is provided. The connection of the plug 40 is performed by inserting the plug 40 from the opening A3. Therefore, in the optical transmission module 10, when the plug 40 is detached, the metal cover 30 does not need to be removed, and the attachment and detachment work of the plug 40 is easy.

Further, the metal cover 30 is provided with engaging portions 32a to 32d for fixing the plug 40. Thereby, the positional displacement of the plug 40 with respect to the positioning member 200 can be prevented. As a result, the optical axis shift of the optical fiber 60 can be prevented. Therefore, according to the optical transmission module 10, the optical axis shift of the optical fiber 60 can be prevented, and optical loss can be suppressed.

In the method of manufacturing the optical transmission module 10 and the socket 20, as described below, positional displacement of the light-receiving element array 50 and the convex lens 230 can be suppressed. In more detail, the positioning member When the package substrate 22 is mounted on the package substrate 22, the pin P1 provided on the package substrate 22 shown in Fig. 15 is conventionally used. The positioning member 200 is fixed to the package substrate 22 by inserting the pin P1 provided on the package substrate 22 into the hole H9 provided in the positioning member 200. In this case, a positional shift occurs between the light receiving element array 50 and the convex lens 230 of the positioning member 200 due to the positional shift at the time of manufacture of the pin P1 on the mounting substrate 22 or the positional displacement of the light receiving element array 50.

Therefore, in the manufacturing method of the optical transmission module 10 and the socket 20, when the positioning member 200 is mounted on the package substrate 22, the position confirmation camera confirms the center T50 of the light-emitting portion of the light-receiving element array 50 and the lens center T230 of the convex lens 230. The positional relationship is at the same time, and the positioning member 200 is placed on the package substrate 22. Thereby, the light receiving element array 50 and the convex lens 230 are directly positioned without being transmitted through the pin P1. As a result, even if the positional shift at the time of manufacture of the pin P1 on the package substrate 22 or the positional shift at the time of mounting of the light-receiving element array 50 is generated, positional displacement between the light-receiving element array 50 and the convex lens 230 can be suppressed. Further, for the same reason, it is also possible to suppress occurrence of a positional shift between the light-emitting element array 100 and the convex lens 250.

(Modification)

Hereinafter, the configuration of the optical transmission module 10' according to the modification will be described. Figure 16 is a cross-sectional view showing a light transmitting module 10' and a socket 20' according to a modification. For the appearance, use Figure 1.

The difference between the optical transmission module 10 and the optical transmission module 10' is that the positioning member 200 is further provided with a convex lens. The other points are not different between the optical transmission module 10 and the optical transmission module 10', and therefore the description thereof will be omitted. In addition, in FIG. 16, the same structure as the optical transmission module 10 is given the same symbol as the optical transmission module 10.

A convex lens 232 (third convex lens) is provided on the total reflection surface R1 of the positioning member 220. Thereby, the total reflection surface R1 has a convex surface when viewed from the y-axis direction. Thereby, from the optical fiber 60 The emitted laser beam B1 is collected or collimated by the convex lens 232 and transmitted to the light receiving element array 50. Therefore, according to the optical transmission module 10', the optical loss can be further suppressed as compared with the optical transmission module 10.

Further, as shown in FIG. 16, a convex lens 234 (second convex lens) is provided on the surface of the positioning member 220 facing the receiving side plug 42. Thereby, the laser beam B1 emitted from the optical fiber 60 is condensed or collimated by the convex lens 234, and is transmitted to the total reflection surface R1. Therefore, according to the optical transmission module 10', the optical loss can be further suppressed as compared with the optical transmission module 10.

As shown in FIG. 16, a convex lens 252 (third convex lens) is provided on the total reflection surface R2 of the positioning member 240. Thereby, the total reflection surface R1 has a convex surface when viewed from the y-axis direction. Thereby, the laser beam B2 emitted from the light-emitting element array 100 is collected or collimated by the convex lens 252, and is transmitted to the optical fiber 60. Therefore, according to the optical transmission module 10', the optical loss can be further suppressed as compared with the optical transmission module 10.

Further, as shown in FIG. 16, a convex lens 254 (second convex lens) is provided on the surface of the positioning member 240 opposed to the transmitting-side plug 46. Thereby, the laser beam B2 reflected by the total reflection surface R2 is condensed or collimated by the convex lens 254, and is transmitted to the optical fiber 60. Therefore, according to the optical transmission module 10', the optical loss can be further suppressed as compared with the optical transmission module 10.

(Other embodiments)

The optical transmission module, the socket and the method of manufacturing the same according to the present invention are not limited to the optical transmission modules 10 and 10' of the above embodiment, and can be modified within the scope of the gist.

As described above, the present invention is useful for an optical transmission module and a socket, and is excellent in that the lens or the total reflection surface can be miniaturized.

H1, h2, h3‧‧‧ height

B1, B2‧‧‧ laser beam

D1‧‧‧ recess

R1, R2‧‧‧ total reflection surface

S1, S4‧‧‧ end face

22‧‧‧Construction substrate

24‧‧‧ sealing resin

26‧‧‧Drive circuit

42‧‧‧Receiving side plug

44,48‧‧‧ convex lens

46‧‧‧Send side plug

50‧‧‧Light-receiving element array

100‧‧‧Lighting element array

200,220,240‧‧‧ Positioning members

222,242‧‧‧plug guide

224,244‧‧‧Photocoupler

230,250‧‧‧ convex lens

Claims (7)

A socket for connecting a plug provided at one end of an optical fiber, characterized by comprising: an optical component; and a positioning member for optically coupling the core of the optical fiber and the optical component respectively; connecting the optical fiber to the positioning component The optical path of the optical element is provided with a total reflection surface for totally reflecting light that is directed toward the optical element or that is emitted from the optical element. The socket of claim 1, further comprising a sealing resin covering the optical element; and the sealing resin is provided on an optical path connecting the optical fiber and the optical element. The socket of claim 1 or 2, wherein a first convex lens facing the optical element is provided on an optical path connecting the optical fiber and the optical element to the positioning member. The socket of claim 1 or 2, wherein the second convex lens is disposed on the optical axis of the optical fiber of the positioning member and facing the plug. A socket according to claim 1 or 2, wherein the fourth convex lens is provided on the total reflection surface. An optical transmission module comprising: a socket of any one of claims 1 to 5; and a plug disposed at one end of the optical fiber; provided with an optical axis of the optical fiber of the plug and positioned with the optical fiber The third convex lens opposite to the member. An optical transmission module comprising: a socket of any one of claims 1 to 5; and a plug disposed at one end of the optical fiber; The optical axis of the optical fiber is parallel to the insertion direction of the plug.