TW201422366A - Method of manufacturing substrate - Google Patents

Abstract

The present invention provides a substrate manufacturing method which is not easy to produce flaws and cracks on the substrate. The substrate manufacturing method includes: a step of preparing a block body having a first surface and a second surface configured on its backside and fixed to the holding member; and a cutting step, which moves a metal wire along a first direction of the length of the metal wire and a second direction, while cutting the block body from the first surface toward the second surface by using the metal wire. Here, the cutting step further includes: an initial step for making the metal wire contacting the block body from the first surface, and cutting a first region on the first side of the block body through the use of the metal wire; an interim step, which uses the metal wire to cut the middle region of the block body between the first region and the second region on the second side; and a final step, which uses the metal wire to cut the second region of the block body. Moreover, the movement of the metal wire is controlled in such a way that it moves continuously in single direction by a greater distance during at least one of the initial step and the final step than during the interim step.

Description

Substrate manufacturing method

The present invention relates to a method of manufacturing a substrate.

A substrate of a semiconductor used in a crystal solar cell element or the like is produced, for example, by cutting a block formed by cutting an ingot of a semiconductor material into a sheet. As a cutting method for cutting a block into a sheet, for example, there is a method of cutting a block into a sheet by pressing a block against a reciprocating metal wire (see, for example, Patent Document 1 below).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2000-42896

In the cutting method using a block having a reciprocating metal wire, the movement of the metal wire tends to become unstable at the time of starting and ending the cutting of the block and when the moving direction of the metal wire is reversed. Therefore, it is easy to cause cracks and cracks in the block, and the yield may be lowered when the substrate is manufactured by thinning of the block.

Such a problem is not limited to the case where a substrate is manufactured by cutting a block of a semiconductor material into a sheet, and the technique of manufacturing a substrate by cutting the object to be cut is generally common.

Therefore, a method of manufacturing a substrate in which cracks and cracks are not easily generated on a substrate is desired.

In order to solve the above problems, a method of manufacturing a substrate according to an aspect includes a preparation step and a cutting step. In the method of manufacturing the substrate, in the preparation step, a block including the first surface and the second surface disposed on the back side of the first surface and fixed to the second surface of the holding member is prepared. Further, in the dicing step, the movement of the metal wire in the first direction along the longitudinal direction of the metal wire and the movement of the metal wire in the second direction opposite to the first direction are alternately performed. The block is cut from the first surface side toward the second surface side by the metal wire. Further, the cutting step includes an initial step, an intermediate step, and a final step. Here, in the initial step, the metal wire is brought into contact with the block from the first surface side, and the first region on the first surface side in the block is cut by the metal wire. In the intermediate step, the intermediate portion between the first region and the second region on the second surface side is cut by the metal wire. In the final step, the second region in the block is cut by the wire. Moreover, the movement of the metal wire is controlled in such a manner that the moving distance of the metal wire continuously moving in a unidirectional direction in at least one of the initial step and the final step is greater than the above-mentioned metal line in the intermediate step The moving distance in which the above one-way continuously moves.

Another method of manufacturing a substrate includes a preparation step and a cutting step. In the method of manufacturing the substrate, in the preparation step, a block including the first surface and the second surface disposed on the back side of the first surface and fixed to the second surface of the holding member is prepared. Further, in the dicing step, the movement of the metal wire in the first direction along the longitudinal direction of the metal wire and the movement of the metal wire in the second direction opposite to the first direction are alternately performed. The block is cut from the first surface side toward the second surface side by the metal wire. Further, the cutting step includes an initial step, an intermediate step, and a final step. Here, in the initial step, the metal wire is brought into contact with the block from the first surface side, and the first region on the first surface side in the block is cut by the metal wire. Above In the intermediate step, the intermediate portion between the first region and the second region on the second surface side is cut by the metal wire. In the final step, the second region in the block is cut by the wire. Further, in at least one of the initial step and the final step, and the intermediate step, switching operations for switching the direction in which the metal wire is moved between the first direction and the second direction are respectively performed. Further, the movement of the metal wire is controlled in such a manner that the absolute value of the acceleration of the metal wire in the switching operation performed in at least one of the initial step and the final step is less than that in the intermediate step The absolute value of the acceleration of the metal wire in the switching operation.

According to the manufacturing method of the substrate, the frequency of the switching operation in at least one of the initial step and the final step is lower than the frequency of the switching operation in the intermediate step, so the movement of the metal line in the initial step and the final step Not easy to become unstable. As a result, it is difficult to cause cracks and cracks in the substrate produced by the cutting of the block.

Moreover, according to another method of manufacturing a substrate, in at least one of the initial step and the final step, the movement of the metal wire is less likely to become unstable, so that the substrate produced by the cutting of the block is not easily produced. Cracks and cracks.

1‧‧‧Substrate cutting device

10‧‧‧Control Department

11~13‧‧‧1~3 drive department

20‧‧‧Operation Department

Absolute values of acceleration for Ac1, Ac2, Ac3‧‧

AP1a, AP2a, AP3a‧‧‧1st moving period

AP1b, AP2b, AP3b‧‧‧2nd mobile period

AR1‧‧‧1st area

AR2‧‧‧2nd area

AR3‧‧‧ intermediate area

BL1‧‧‧ block

BX1‧‧‧ Debris Receiving Box

E1a, E1b‧‧‧ Both ends of the first side in the X direction

E2a, E2b‧‧‧ Both ends of the second side in the X direction

GR1~GR4‧‧‧1~4 guide rolls

HM1‧‧‧ Lifting Department

HP1‧‧‧ Keeping Department

Lt1, Lt2, Lt3‧‧‧ one-way moving distance

L1, L2, L3‧‧‧ thickness

M1, M2‧‧‧ Central Department

MR1~MR3‧‧‧1~3 main roller

OB1‧‧‧ Keep objects

P1, P2, P3‧‧‧ rotating shaft

S1‧‧‧ first side

S2‧‧‧2nd

SB1‧‧‧ basic components

T1~T7‧‧‧ moments

+ V1, - V1‧‧‧ value

W1 (W1f, W1s) ‧ ‧ metal wire

WR1‧‧‧Volume 1

WR2‧‧‧ Volume 2

X, Y, Z‧‧ Direction

Fig. 1 is a perspective view schematically showing a schematic configuration of a substrate cutting device according to an embodiment.

Fig. 2 is a view schematically showing the configuration of a part of a substrate cutting device according to an embodiment.

Fig. 3 is a block diagram showing a functional configuration of a substrate cutting device according to an embodiment.

Fig. 4 is a view schematically showing the state of the substrate cutting device in the initial step of the cutting step.

Figure 5 is a view schematically showing the shape of the substrate cutting device in the intermediate step of the cutting step State diagram.

Fig. 6 is a view schematically showing the state of the substrate cutting device in the final step of the cutting step.

Fig. 7 is a view for explaining setting of ranges of the first region, the intermediate region, and the second region.

Fig. 8 is a view exemplifying a movement operation of a wire in an initial step of the cutting step.

Fig. 9 is a view exemplifying a movement action of a metal wire in a middle step of the cutting step.

Fig. 10 is a view exemplifying a movement action of a metal wire in a final step of the cutting step.

Fig. 11 is a view showing a change in the unidirectional moving distance of the metal wire.

Fig. 12 is a view showing a stepwise change of the one-way moving distance in the first modification.

Fig. 13 is a view showing the movement operation of the metal wire in the initial step of the second modification.

Fig. 14 is a view showing the movement operation of the metal wire in the intermediate step of the second modification.

Fig. 15 is a view showing the movement operation of the metal wire in the final step of the second modification.

Fig. 16 is a view showing a change in the absolute value of the acceleration of the metal wire in the second modification.

Fig. 17 is a view showing a change in the absolute value of the acceleration of the metal wire of the third modification.

Fig. 18 is a view showing the movement operation of the metal wire in the initial step of another modification.

Fig. 19 is a view showing the movement operation of the metal wire in the intermediate step of another modification.

Fig. 20 is a view showing the movement operation of the metal wire in the final step of another modification.

Hereinafter, an embodiment and various modifications of the present invention will be described based on the drawings. Furthermore, in FIGS. 1, 2, and 4 to 7, the right-handed XYZ coordinate in the X direction is attached with one of the moving directions of the metal wire W1 (the right direction from the view of FIG. 2). system.

<(1) One embodiment> <(1-1) Schematic Configuration of Substrate Cutting Device>

As shown in Fig. 1, a substrate cutting device 1 according to an embodiment is a wire-saw for cutting a block BL1 as a cutting object by a wire W1. The substrate cutting apparatus 1 mainly includes a metal wire W1, first and second reels WR1, WR2, first to fourth guide rollers GR1 to GR4, first to third main rollers MR1 to MR3, a lifting portion HM1, and a debris receiving box. BX1.

The metal wire W1 may be, for example, a metal wire (abrasive grain fixing metal wire) to which the abrasive grains are fixed. The thickness of the metal wire W1 may be, for example, 60 μm or more and 150 μm or less. Moreover, the diameter of the abrasive grains fixed to the metal wire W1 may be, for example, 5 μm or more and 30 μm or less.

The first reel WR1 and the second reel WR2 are respectively wound up portions of the metal wire W1. Specifically, the first reel WR1 winds one metal wire W1 from one end side, and the second reel WR2 winds the one metal wire W1 from the other end side. The first reel WR1 includes a cylindrical portion (winding portion) that is rotated by the first driving portion 11 (see FIG. 3). The second reel WR2 includes a cylindrical portion (winding portion) that is rotated by the second driving portion 12 (see FIG. 3). The first drive unit 11 and the second drive unit 12 may be, for example, a motor or the like. Further, in the first reel WR1 and the second reel WR2, the metal wire W1 can be wound up by, for example, winding the metal wire W1 around the outer peripheral portion of the winding portion that is rotated. Specifically, the metal wire W1 that is successively sent out from the second reel WR2 is taken up by the first reel WR1. Further, the metal wire W1 which is successively fed from the first reel WR1 is taken up by the second reel WR2. Further, by appropriately adjusting the force of stretching the wire W1 by the first reel WR1 and the force of stretching the wire W1 by the second reel WR2, the wire W1 can be appropriately tensioned in the longitudinal direction. .

The first and second guide rollers GR1 and GR2 guide the metal wire W1 that has been successively fed from the first reel WR1 to the third main roller MR3, and guide the metal wire W1 that has been sequentially sent out from the third main roller MR3 to The first reel is WR1. Further, the third and fourth guide rollers GR3 and GR4 guide the metal wire W1 that has been successively sent out from the second reel WR2 to the third main roller MR3, and will The wire W1 which is successively sent out from the third main roll MR3 is guided to the second reel WR2.

The first to third main rolls MR1 to MR3 move the metal wire W1 in the longitudinal direction of the metal wire W1 in a state where the metal wires W1 are arranged at a predetermined interval. Here, the rotation axis P1 of the first main roll MR1 and the rotation axis P2 of the second main roll MR2 are substantially parallel to each other and are spaced apart from each other by a predetermined distance. Further, the rotation axis P3 of the third main roll MR3 is located on the -Z side of the plane including the rotation axis P1 and the rotation axis P2, and is substantially parallel to the rotation axis P1 and the rotation axis P2. That is, when viewed from the Y-side, when the rotation axis P1, the rotation axis P2, and the rotation axis P3 are coupled, a downwardly convex triangle can be formed. Further, a plurality of grooves are provided at predetermined intervals on the outer peripheral portions of the first to third main rolls MR1 to MR3. Then, the metal wire W1 is sequentially wound around the plurality of grooves of the first to third main rolls MR1 to MR3 to form a line of the wire W1 which is parallel to each other at a predetermined interval.

For example, the metal wire W1 which is successively fed from the first reel WR1 sequentially passes through the first guide roller GR1 and the second guide roller GR2 to reach the third main roller MR3, and is sequentially stuck to the first to third main rollers MR1. ~Slots outside the MR3. After the metal wire W1 is caught in the groove of the outer peripheral portion of the third main roll MR3, the wire W1 is sequentially stuck to the first main roll MR1, the second main roll MR2, and the third main roll MR3, thereby making the wire W1 Winding around the first to third main rolls MR1 to MR3 for one week. Then, after being wound around the first to third main rolls MR1 to MR3 a plurality of times, the wire W1 is taken up from the third main roll MR3 to the second roll via the third guide roll GR3 and the fourth guide roll GR4. Disk WR2.

Between the first main roll MR1 and the second main roll MR2, the wire W1 is stretched over a plurality of paths that are parallel and have a predetermined interval. The wire W1 moves in the first direction (+X direction) along the longitudinal direction thereof. In other words, the wire W1 moves from the first main roll MR1 toward the second main roll MR2. In other words, by winding the wire W1 successively fed from the first reel WR1 by the second reel WR2, the wire W1 in the first direction is performed between the first main roll MR1 and the second main roll MR2. Move (first move).

On the other hand, for example, the metal wire W1 which is successively fed from the second reel WR2 sequentially reaches the third main roll MR3 via the fourth guide roller GR4 and the third guide roller GR3, and is sequentially stuck to the first one. ~3 The groove of the outer circumference of the main rolls MR1 to MR3. After the metal wire W1 is caught in the groove of the outer peripheral portion of the third main roll MR3, the wire W1 is sequentially stuck to the second main roll MR2, the first main roll MR1, and the third main roll MR3, thereby making the wire W1 Winding around the first to third main rolls MR1 to MR3 for one week. Then, after being wound around the first to third main rolls MR1 to MR3 a plurality of times, the wire W1 is taken up from the third main roll MR3 to the first roll via the second guide roll GR2 and the first guide roll GR1. Disk WR1.

At this time, between the first main roll MR1 and the second main roll MR2, the wire W1 moves in the second direction (-X direction) opposite to the first direction in the longitudinal direction thereof. In other words, the wire W1 moves from the second main roll MR2 toward the first main roll MR1. In other words, by winding the wire W1 successively fed from the second reel WR2 by the first reel WR1, the wire in the second direction is formed between the first main roll MR1 and the second main roll MR2. W1 movement (2nd move).

The lifting portion HM1 is a portion that elevates and lowers the block BL1 as the object to be cut. The elevation unit HM1 is movable up and down (±Z direction) by the third drive unit 13 (see FIG. 3). For example, the third driving unit 13 may be configured to elevate and lower the lifting portion HM1 by a motor or the like.

Further, the lifting portion HM1 includes a holding portion HP1 that holds the object OB1 at a lower portion. The holding object OB1 includes a block BL1 as a cutting object and a base member SB1 as a holding member for holding the block BL1. The block BL1 may be, for example, a block BL1 of a semiconductor material having a substantially rectangular parallelepiped shape. The semiconductor material may be, for example, ruthenium or the like.

As shown in FIG. 2, the block BL1 includes a first surface S1 facing downward (-Z direction) and a second surface S2 facing upward (+Z direction). The second surface S2 is disposed on the back side of the first surface S1 and is fixed to the base member SB1 by the following or the like. The shape of the base member SB1 may be, for example, a plate shape. Further, as the material of the base member SB1, for example, carbon, glass, resin, or the like can be used. Further, the holding portion HP1 can hold the holding object OB1 by, for example, clamping the base member SB1 or following the base member SB1. Thereby, the base member SB1 can be attached to the elevation part HM1.

Here, the movement of the metal wire W1 (reciprocating movement) in which the first movement in the first direction and the second movement in the second direction are alternately repeated is performed, and the block BL1 is lowered, whereby the metal wire is used. W1 cuts the block BL1 into thin slices. As a result, a plurality of substrates are manufactured from the bulk BL1.

In the cutting method of cutting the block BL1 into a sheet by the metal wire W1 moving in one direction, the metal wire used is cut compared to the cutting method in which the block BL1 is sliced by the reciprocating metal wire W1. The length of W1 becomes longer. Therefore, in the first and second reels WR1 and WR2 for supplying the wire W1, the number of windings of the wire W1 increases. Thereby, it is relatively easy to apply excessive pressure to the metal wire W1 wound inside. In this case, when the metal wire W1 is an abrasive grain fixing metal wire, the abrasive grain is pressed against the wire in the first and second reels WR1 and WR2 where the metal wire W1 overlaps. The body of the metal wire W1. Therefore, it is easy to cause the metal wire W1 to be cracked, and it is easy to cause the wire W1 to be broken. Therefore, the state in which the metal wire W1 reciprocates can increase the number of times the metal wire W1 can be re-used as compared with the state in which the metal wire W1 is moved in one direction.

The chip receiving box BX1 is a box-shaped member having an opening at the top. In the chip receiving box BX1, for example, cutting chips and the like which are generated when the block BL1 is cut by the wire W1 are recovered.

Further, the machining liquid that functions as the coolant for cooling the metal wire W1 and the block BL1 is supplied to the cut portion of the block BL1 and its vicinity from a plurality of openings of the supply nozzle. The working fluid contains, for example, a water-soluble solvent such as ethylene glycol or an oily solvent, and the solvent may be diluted with water. The supply flow rate of the machining liquid is appropriately set in accordance with the size of the block BL1. Further, the working fluid can be recycled, and the abrasive grains and cutting chips which are detached from the metal wire W1 contained in the working fluid are removed.

<(1-2) Functional Configuration of Substrate Cutting Device>

As shown in FIG. 3, the substrate cutting apparatus 1 includes a control unit 10, a first driving unit 11, a second driving unit 12, a third driving unit 13, and an operation unit 20.

The control unit 10 controls a part of the operation of the substrate cutting device 1. The function of the control unit 10 may be realized by, for example, executing a program stored in a RAM (Random Access Memory) or the like as a memory medium by a processor as a hardware. Furthermore, part or all of the functions of the control unit 10 can be realized, for example, by a dedicated electronic circuit or the like.

The control unit 10 controls the operation in the substrate cutting device 1 based on the input from the operation unit 20 by the operator. The operation unit 20 may be, for example, a variety of buttons or the like. Further, the control unit 10 controls the operations of the first drive unit 11, the second drive unit 12, and the third drive unit 13. In other words, by the control unit 10 controlling the operations of the first drive unit 11 and the second drive unit 12, the reciprocating movement of the wire W1 by the first reel WR1 and the second reel WR2 is controlled. Moreover, the control unit 10 controls the operation of the third drive unit 13 to control the lowering of the block BL1 by the lift unit HM1.

<(1-3) Manufacturing Step of Substrate>

In the step of manufacturing the substrate, the step of preparing the block BL1 (preparation step) and the step of cutting the block BL1 by the substrate cutting device 1 (cutting step) are sequentially performed.

<(1-3-1) Preparation Step>

First, for example, the block BL1 of a predetermined size is cut out from the ingot. The block BL1 may have a rectangular parallelepiped shape, for example.

Next, the base member SB1 is fixed to one of the main faces of the block BL1 by the following method. Thereby, the block body BL1 including the first surface S1 and the second surface S2 disposed on the back side of the first surface S1 and fixed to the base member SB1 as the holding member is prepared.

<(1-3-2) Cutting step>

First, the block BL1 to which the base member SB1 is fixed is attached to the lifting portion HM1 of the substrate cutting device 1. The base member SB1 is held by the holding portion HP1 of the lifting portion HM1. Thereby, the block BL1 to which the base member SB1 is fixed is held by the elevation portion HM1.

Next, the reciprocating movement of the wire W1 is started. Reciprocating movement alternately along the gold The movement of the metal wire W1 in the first direction (+X direction) in the longitudinal direction of the line W1 and the movement of the metal wire W1 in the second direction (-X direction) opposite to the first direction.

Then, while the reciprocating movement of the wire W1 is performed, the block BL1 is lowered in the downward direction (-Z direction) by the elevating portion HM1. Thereby, the block body BL1 is cut by the metal wire W1 from the first surface S1 side toward the second surface S2 side, and then one of the base members SB1 is cut. At this time, first, as shown in FIG. 4, the following step (initial step) is performed: the metal wire W1 is brought into contact with the block BL1 from the first surface S1 side, and the inside of the block BL1 is cut by the metal wire W1. The area (first area) AR1 on the side of the surface S1.

Then, as shown in FIG. 5, the following step (intermediate step) is performed: the metal line W1 cuts between the first region AR1 and the region (the second region) AR2 located on the second surface S2 side in the block BL1. Area (middle area) AR3.

Further, as shown in FIG. 6, the step (final step) of cutting the second region AR2 in the block BL1 by the metal wire W1 is performed. In other words, in the block BL1, the first area AR1, the intermediate area AR3, and the second area AR2 are sequentially arranged from the first surface S1 to the second surface S2. Moreover, the initial step, the intermediate step, and the final step are included in the cutting step.

Moreover, the movement of the metal wire W1 is controlled by the control unit 10 in such a manner that the distance (moving distance) of the metal wire W1 continuously moving in one direction in the initial step and the final step is greater than that in the intermediate step, the metal wire W1 is oriented in one direction. The moving distance that moves continuously. Here, the moving distance (unidirectional moving distance) in which the metal wire W1 continuously moves in one direction includes the distance in which the metal wire W1 continuously moves in the +X direction between the first main roller MR1 and the second main roller MR2, and the metal wire The distance W1 continues to move in the -X direction.

The thicknesses L1 to L3 in the +Z direction of the first region AR1, the intermediate region AR3, and the second region AR2 may be set, for example, in consideration of the range of the bending of the metal wire W1 in the dicing step. FIG. 7 shows the arrangement relationship between the block BL1 and the metal wire W1 immediately after the cutting of the block BL1 by the metal wire W1 and immediately before the cutting of the block BL1 by the metal wire W1. Moreover, the metal wire W1 immediately after the start of the cutting is marked with a symbol W1s, the wire W1 before the end of the cutting is marked with the symbol W1f.

As shown in Fig. 7, immediately after the start of the dicing, the metal wires W1 (W1s) caused by the contact with the block BL1 start from the both end portions E1a and E1b in the X direction of the first surface S1. The block BL1 is cut. Therefore, in the vicinity of the first surface S1 in the block BL1, the state in which the thin portions are cut between the both end portions E1a and E1b in the X direction and the central portion M1 is different. Further, before the end of the cutting, the two ends E2a and E2b in the X direction of the second surface S2 are first cut by the bending of the metal wire W1 (W1f) due to the contact with the block BL1. . Then, the base member SB1 is cut in the vicinity of the both end portions E2a and E2b, and the portion in the vicinity of the central portion M2 in the X direction of the second surface S2 in the block BL1 is cut. Therefore, in the vicinity of the second surface S2 in the block BL1, the state in which the thin portions are cut between the both end portions E2a and E2b in the X direction and the central portion M2 is different.

Therefore, the thicknesses L1 to L3 of the first region AR1, the intermediate region AR3, and the second region AR2 may be set in accordance with the bending of the metal wire W1 generated when the metal wire W1 is pressed against the block BL1 in the dicing step. As an example, when the thickness of the first surface S1 to the second surface S2 of the block BL1 is 156 mm, the thickness L1 of the first region AR1 is set to 5 mm, and the thickness L2 of the intermediate region AR3 is set to 145 mm. The thickness L3 of the second region AR2 is set to 6 mm. Further, in consideration of variations that may occur in the dicing step, the thickness L1 of the first region AR1 and the thickness L3 of the second region AR2 may be set to be from the first surface S1 to the second surface S2 of the block BL1, respectively. A thickness of 10% or less of the thickness.

In FIGS. 8 to 10, the time is shown in the horizontal direction, and the speed of the metal wire W1 is shown in the vertical direction. The following example is shown: in each of the initial steps shown in FIG. 8, the intermediate step shown in FIG. 9, and the final step shown in FIG. 10, the moving speed of the metal wire W1 in the first movement in the +X direction The maximum value is +V1, and the maximum value of the moving speed of the metal wire W1 in the second movement in the +X direction is -V1.

Specifically, from time T1 to time T2, the moving speed of the metal wire W1 in the second movement in the -X direction is decreased. At time T2, the second movement is changed to the first movement. Self time From T2 to time T3, the moving speed of the metal wire W1 in the first movement in the +X direction increases. From time T3 to time T4, the moving speed of the metal wire W1 in the first movement in the +X direction is maintained at +V1 which is a fixed value. From time T4 to time T5, the moving speed of the metal wire W1 in the first movement in the +X direction is decreased. At time T5, the first movement is shifted to the second movement. From time T5 to time T6, the moving speed of the metal wire W1 in the second movement in the -X direction increases. From time T6 to time T7, the moving speed of the metal wire W1 in the second movement in the -X direction is maintained at -V1 which is a fixed value. The reciprocating movement is achieved by repeating the change in the moving speed of the metal wire W1 which is the same as the change in the moving speed of the metal wire W1 from the time T1 to the time T7.

Further, as shown in Figs. 8 to 10, the one-way moving distance Lt1 in the initial step and the one-way moving distance Lt3 in the final step are larger than the one-way moving distance Lt2 in the intermediate step. In addition, FIG. 11 exemplifies the relationship between the distance from the first surface S1 of the surface to be cut (cutting start surface) to the position where the metal wire W1 moves (the metal wire moving position), and the unidirectional moving distance. As shown in FIG. 11, for example, in the initial step of the distance from the first surface S1 to the metal wire moving position of 0 to L1, the one-way moving distance Lt1 is set to 3000 m. Further, for example, in the intermediate step of the distance from the first surface S1 to the metal wire moving position to L1 to (L1+L2), the one-way moving distance Lt2 is set to 500 m. Further, for example, in the final step of the distance from the first surface S1 to the metal wire moving position to (L1+L2) to (L1+L2+L3), the one-way moving distance Lt3 is set to 3000 m.

By the control of the one-way moving distance, in the initial step and the final step, the action of switching the direction in which the metal wire W1 moves between the first direction and the second direction can be reduced (switching) The frequency of the action). The frequency can be as long as the number of times per unit time. Further, the frequency of the switching operation in the initial step and the final step may be, for example, 0 times. Due to the reduction in the frequency of such switching operations, the metal wires W1 are less likely to sway in the direction orthogonal to the first direction and the second direction in the initial step and the final step, and the movement of the metal wires W1 is less likely to become unstable. As a result, it is not easy to be a block of the object to be cut. The crack and crack of the BL1 can improve the yield of the substrate which is thinned by the bulk BL1. That is, it is not easy to cause cracks and cracks in the substrate. Further, by the stable movement of the metal wire W1 in the initial step, the accuracy of the thickness of the substrate can be improved, and the occurrence of defects of the substrate can be reduced by the stable movement of the metal wire W1 in the final step.

Here, the one-way moving distance in which the metal wire W1 continuously moves in one direction is controlled by the control unit 10, for example, from the first reel WR1 to the first reel and the second reel WR2. The length of the metal wire W1 can be changed. Further, the one-way moving distance can be changed by, for example, the control unit 10 controlling the length of the metal wire W1 that is successively fed from the second reel WR2 and wound up to the first reel WR1 in the second movement. Further, for example, when the unused reel W1 is provided in the first reel WR1, the moving distance of the metal wire W1 continuously moving in the first direction is set to be larger than the metal wire W1 continuously in the second direction. The moving distance can be moved, and a new metal wire is supplied at any time during the cutting step.

In addition, here, as long as the one-way moving distance in the initial step and the final step is set, for example, in the range of 900 m or more and less than 5000 m, the one-way moving distance in the intermediate step is set within a range of 100 m or more and less than 900 m. Just fine. The maximum value of the absolute value of the moving speed of the metal wire W1 during the reciprocating movement may be set, for example, within a range of 500 m/min or more and 1500 m/min or less. In the switching operation, for example, as long as the first movement of the metal wire W1 in the first direction and the second movement of the metal wire W1 in the second direction are switched with little gap, the disconnection of the metal wire W1 is less likely to occur. In the case where the metal wire W1 is stopped (stop time) between the first movement and the second movement, the stop time may be, for example, 0.1 second or longer and 1 second or shorter. In addition, the absolute value of the acceleration of the metal wire W1 in the switching operation may be set, for example, within a range of ² m/sec ² or more and 16 m/sec ² or less. The speed (feeding speed) at which the block BL1 is lowered by the lifting portion HM1 in the cutting step may be set, for example, in a range of 100 μm/min or more and 1100 μm/min or less. Further, when the feed rate is increased or decreased according to the increase or decrease of the moving speed of the metal wire W1 in the switching operation, the load applied to the metal wire W1 can be reduced, and the disconnection of the metal wire W1 is less likely to occur.

<(1-4) Summary of an embodiment>

As described above, in the method of manufacturing a substrate according to the embodiment, the one-way moving distance in which the metal wire W1 is continuously moved in one direction in the initial step and the final step is larger than the one-way moving distance in the intermediate step, and is controlled. The movement of the wire W1. Thereby, the frequency of performing the switching operation in the initial step and the final step becomes lower than the frequency of performing the switching operation in the intermediate step. Therefore, in the initial step and the final step, the movement of the wire W1 is less likely to be shaken, and the movement of the wire W1 is less likely to become unstable. As a result, it is not easy to cause cracks and cracks in the substrate produced by thinning of the bulk BL1.

<(2) Change example> <(2-1) First Modification>

In the above-described embodiment, the movement of the wire W1 is controlled such that the one-way moving distance in the steps of the initial step and the final step becomes a fixed value, but the invention is not limited thereto. For example, the one-way moving distance Lt1 in the initial step can also be reduced stepwise. Further, for example, the one-way moving distance Lt3 in the final step may be increased stepwise. Further, the one-way moving distance Lt1 in the initial step may be gradually reduced and the one-way moving distance Lt3 in the final step may be increased stepwise. By the gradual change of the unidirectional moving distance, the amount of change in the load applied to the wire W1 can be reduced, so that the occurrence of the wire breakage of the wire W1 and the occurrence of the undulation of the surface of the substrate can be reduced.

As a specific example of the case where such a state is employed, an example as shown in Fig. 12 can be cited. Specifically, after the unidirectional moving distance Lt1 in the initial step is sequentially changed to 3000 m, 2000 m, 1500 m, and 1000 m, the unidirectional moving distance is changed to the unidirectional moving distance Lt2 in the intermediate step, that is, 500 m. Further, thereafter, the one-way moving distance Lt3 in the final step is changed stepwise to 1000 m, 1500 m, 2000 m, and 3000 m.

<(2-2) Second Modification>

In the above embodiment, the movement of the wire W1 is controlled such that the one-way moving distance in the initial step and the final step is greater than the one-way moving distance in the intermediate step, but is not limited thereto. For example, it is assumed that in at least one of the initial step and the final step, and the intermediate step, a switching operation of switching the direction in which the metal wire W1 moves between the first direction and the second direction is performed. In this case, it is considered to control the movement of the wire W1 in such a manner that the absolute value of the acceleration of the wire W1 in the switching operation performed in at least one of the initial step and the final step is smaller than the intermediate step. The absolute value of the acceleration of the wire W1 in the switching action. According to this aspect, the movement of the wire W1 does not easily become unstable during the switching operation in at least one of the initial step and the final step. As a result, it is not easy to cause cracks and cracks in the substrate produced by thinning of the bulk BL1.

Specific examples of such a form include the examples shown in Figs. 13 to 16 . In FIGS. 13 to 10, similarly to FIGS. 8 to 10, the change in the moving speed of the metal wire W1 with respect to the passage of time is illustrated, and the time and the speed of the wire W1 are respectively indicated in the lateral direction and the vertical direction. In addition, FIG. 16 exemplifies the relationship between the distance from the first surface S1 of the cutting start surface to the movement position of the metal wire W1 and the absolute value of the acceleration of the metal wire W1.

Specifically, as shown in FIG. 13 and FIG. 16, for example, in the initial step, the absolute value Ac1 of the acceleration of the wire W1 is set to 3 m/sec ² in the first movement period AP1a and the second movement period AP1b. Further, as shown in FIG. 14 and FIG. 16, for example, in the intermediate step, the absolute value Ac2 of the acceleration of the wire W1 is set to 15 m/sec ² in the first movement period AP2a and the second movement period AP2b. Further, as shown in FIG. 15 and FIG. 16, for example, in the final step, the absolute value Ac3 of the acceleration of the wire W1 is set to 3 m/sec ² in the first movement period AP3a and the second movement period AP3b.

Here, it is assumed that the switching operation is performed in the initial step and the switching operation is not performed in the final step. In this case, it is only necessary to control the movement of the wire W1 in the following manner. The absolute value Ac1 of the acceleration of the metal wire W1 in the switching operation of the initial step is smaller than the absolute value Ac2 of the acceleration of the metal wire W1 in the switching operation of the intermediate step. Further, it is assumed that the switching operation is performed in the final step and the switching operation is not performed in the initial step. In this case, the movement of the wire W1 can be controlled in such a manner that the absolute value Ac3 of the acceleration of the wire W1 in the switching operation of the final step is smaller than the absolute value of the acceleration of the wire W1 in the switching operation of the intermediate step. Ac2.

Further, it is assumed that the switching operation is performed in the steps of both the initial step and the final step. In this case, the movement of the metal wire W1 may be controlled in such a manner that the absolute value of the acceleration of the metal wire W1 in the switching operation of at least one of the initial step and the final step is smaller than the metal in the switching operation of the intermediate step. The absolute value of the acceleration of line W1 is Ac2. Further, it is only necessary to control the movement of the metal wire W1 in such a manner that the absolute values Ac1 and Ac3 of the acceleration of the metal wire W1 in the initial step and the final step are smaller than the absolute value Ac2 of the acceleration of the metal wire W1 in the intermediate step. In this case, cracks and cracks are less likely to occur on the substrate.

<(2-3) Third variation>

In the second modification described above, the movement of the metal wire W1 is controlled so that the absolute values Ac1 and Ac3 of the acceleration of the metal wire W1 in the steps of the initial step and the final step are fixed. However, the present invention is not limited thereto. For example, the absolute value Ac1 of the acceleration of the wire W1 in the initial step may be increased stepwise. Further, for example, the absolute value Ac3 of the acceleration of the wire W1 in the final step may be gradually reduced. Further, the absolute value Ac1 of the acceleration of the metal wire W1 in the initial step may be increased stepwise, and the absolute value Ac3 of the acceleration of the metal wire W1 in the final step may be gradually reduced.

As a specific example which employs such an aspect, the example shown in FIG. 17 is mentioned. Specifically, after the absolute value Ac1 of the acceleration of the metal wire W1 in the initial step is sequentially increased to 3 m/sec ² , 6 m/sec ² , 9 m/sec ^{2 ,} and 12 m/sec ² , the metal wire is placed. The absolute value of the acceleration of W1 is changed to the absolute value Ac2 of the acceleration of the wire W1 in the intermediate step, that is, 15 m/sec ² . Thereafter, the absolute value Ac3 of the acceleration of the metal wire W1 in the final step is stepwise reduced to 12 m/sec ² , 9 m/sec ² , 6 m/sec ² and 3 m/sec ² .

<(2-4) Other variations>

For example, in the above-described one embodiment and the first variation, the movement of the wire W1 is controlled in such a manner that the one-way moving distance in the steps of the initial step and the final step is greater than the one-way moving distance in the intermediate step, but Limited to this. For example, the movement of the metal wire W1 can also be controlled in such a manner that the one-way moving distance of the metal wire W1 continuously moving in one direction is greater than the one-way moving distance in the intermediate step in at least one of the initial step and the final step.

Further, in the above-described first embodiment and the first modification, the movement of the wire W1 is controlled such that the one-way moving distance in the steps of the initial step and the final step is substantially the same, but the invention is not limited thereto. For example, in the initial step, when the metal wire W1 starts to contact the first surface S1 and immediately after the contact, the movement of the metal wire W1 tends to be unstable. On the other hand, as long as the movement of the wire W1 is controlled such that the one-way moving distance Lt1 in the initial step is larger than the one-way moving distance Lt3 in the final step, the movement of the wire W1 in the initial step is less likely to become unstable. Thereby, it is not easy to generate cracks and cracks in the substrate manufactured by the thinning of the block BL1.

Further, in the second and third modifications described above, the metal is controlled in such a manner that the absolute value of the acceleration of the metal wire W1 in the steps of the initial step and the final step is smaller than the absolute value of the acceleration of the metal wire W1 in the intermediate step. The movement of the line W1 is not limited to this. As described above, for example, in the initial step, when the metal wire W1 starts to contact the first surface S1 and immediately after the contact, the movement of the metal wire W1 tends to be unstable. In this regard, as long as the absolute value Ac1 of the acceleration of the metal wire W1 in the initial step is smaller than the absolute value Ac3 of the acceleration of the metal wire W1 in the final step, the movement of the metal wire W1 is controlled, and the metal wire W1 in the initial step is used. Movement does not easily become unstable. Thereby, it is not easy to generate cracks and cracks in the substrate manufactured by the thinning of the block BL1.

Further, in the second and third modifications described above, the shift between the first movement and the second movement In the middle of the movement, the absolute value of the acceleration of the wire W1 in the initial step and the final step is smaller than the absolute value of the acceleration of the wire W1 in the intermediate step. However, it is not limited to this. For example, in at least one of the first movement and the second movement, the absolute value of the acceleration of the metal wire W1 in at least one of the initial step and the final step may be reduced.

Further, in the above-described one embodiment and various modifications, one of the absolute values of the one-way moving distance and the acceleration of the wire W1 is different between at least one of the initial step and the final step, and the intermediate step. But it is not limited to this. For example, the absolute value of the one-way moving distance and the acceleration of the wire W1 may be different between at least one of the initial step and the final step and the intermediate step. That is, the movement of the metal wire W1 can also be controlled so as to satisfy the conditions of both the conditions 1 and 2 below. Condition 1 is a condition in which the one-way moving distance of the metal wire W1 continuously moving in one direction is greater than the one-way moving distance in the intermediate step in at least one of the initial step and the final step. Further, the condition 2 is a condition that the absolute value of the acceleration of the metal wire W1 in the switching operation performed in at least one of the initial step and the final step is smaller than the absolute value of the acceleration of the metal wire W1 in the switching operation of the intermediate step. Thereby, cracks and cracks are less likely to occur in the substrate produced by thinning of the bulk BL1.

Specific examples of such an aspect include the examples shown in Figs. 18 to 20 . In FIGS. 18 to 20, similarly to FIGS. 8 to 10, the change in the moving speed of the metal wire W1 with respect to the passage of time is exemplified, and the time and the speed of the wire W1 are respectively indicated in the lateral direction and the vertical direction.

Specifically, as shown in FIG. 18, in the initial step, the metal wire W1 is accelerated by the absolute value Ac1 of the acceleration in the first movement period AP1a and the second movement period AP1b. Further, as shown in FIG. 19, in the intermediate step, in the first movement period AP2a and the second movement period AP2b, the metal wire W1 is made to have an absolute value Ac2 of acceleration which is larger than the absolute value Ac1 of the acceleration of the initial step. accelerate. Further, as shown in FIG. 20, in the final step, the metal line W1 is made in the first moving period AP3a and the second moving period AP3b. The absolute value Ac3 of the acceleration smaller than the absolute value Ac2 of the acceleration of the intermediate step is accelerated. Further, as shown in Figs. 18 to 20, the one-way moving distance Lt1 in the initial step and the one-way moving distance Lt3 in the final step are larger than the one-way moving distance Lt2 in the intermediate step.

Moreover, in the above-described one embodiment and various modifications, the metal wire W1 is an example of the abrasive grain fixing metal wire, but the invention is not limited thereto. For example, as the block BL1 in which the cutting of the metal wire W1 is used as the object to be cut, the cutting object may be cut by the metal wire W1 while flowing the cutting fluid. Here, the cutting fluid may include, for example, abrasive grains such as tantalum carbide, alumina, or diamond, mineral oil, a surfactant, a dispersant, and the like.

Further, in the above-described one embodiment and various modifications, when the hardness of the block BL1 and the hardness of the base member SB1 are set to be substantially the same, the movement of the wire W1 in the final step is less likely to become unstable. As a result, it is not easy to cause cracks and cracks in the substrate produced by thinning of the bulk BL1. Further, in the method of setting the hardness of the block BL1 to be substantially the same as the hardness of the base member SB1, for example, a method of producing the block BL1 and the base member SB1 using the same material may be included.

Further, in the above-described one embodiment and various modifications, the absolute value of the unidirectional moving distance and the acceleration of the wire W1 may be adjusted according to the tension applied to the wire W1 in the cutting step. Moreover, the one-way moving distance and acceleration of the metal wire W1 may be adjusted according to at least one length of the length of the metal wire W1 contacting the block BL1 and the length of the metal wire W1 contacting the base member SB1 in the final step. The absolute value.

Furthermore, it is a matter of course that all or a part of the above-described one embodiment and various modifications can be combined in an appropriate and non-contradictory range.

[Examples]

Hereinafter, specific embodiments of the above-described one embodiment and various modifications will be described.

<(A) Preparation steps for the block>

The block BL1 of the rectangular parallelepiped is cut from the ingot of the polycrystalline crucible. The lengths of the longitudinal, lateral and depth in the block BL1 are about 156 mm, about 156 mm and about 468 mm, respectively. Then, the base member SB1 is fixed to one side of the block BL1 by an adhesive. The material of the base member SB1 is carbon. Further, the lengths of the longitudinal direction, the lateral direction, and the depth of the base member SB1 are about 40 mm, about 156 mm, and about 468 mm, respectively.

<(B) Cutting step of the block>

The cutting step of the block BL1 is performed by a substrate cutting device having the same configuration as that of the substrate cutting device 1 of the above-described embodiment.

Specifically, the base member SB1 of the block BL1 is sandwiched and held by the holding portion HP1 of the lifting portion HM1 of the substrate cutting device 1. Thereby, the block BL1 is held by the lifting portion HM1.

Then, the metal wire W1 in the substrate cutting device 1 starts to reciprocate.

Then, while the metal wire W1 is reciprocating, the block BL1 is lowered by the elevating portion HM1, whereby the block BL1 is cut from the first surface S1 side toward the second surface S2 side by the metal wire W1. Here, the feed rate at which the block BL1 is lowered by the lift portion HM1 is set to an average of 400 μm/min. Further, as shown in Table 1, the cutting conditions such as the one-way moving distances Lt1, Lt2, Lt3 and the absolute values of the accelerations Ac1, Ac2, Ac3 in the initial step, the intermediate step, and the final step are different from each other. a cutting step. As a result, a plurality of tantalum substrates having samples 1 to 12 having a thickness of about 200 μm and having a substantially square main surface of 156 mm were produced.

The cutting conditions of the sample 1 are as follows: the one-way moving distances Lt1, Lt2, and Lt3 in the initial step, the intermediate step, and the final step are set to 450 m, and the acceleration of the wire W1 in the initial step, the intermediate step, and the final step is set. The absolute value is set to 5.0 m/sec ² . The cutting conditions of the samples 2 to 7 are as follows: based on the cutting conditions of the sample 1, the one-way moving distances Lt1 and Lt3 in the initial step and the final step are sequentially increased to 800 m, 900 m, 1500 m, 3000 m, 4500 m. And 5000m. The cutting condition of the sample 8 was based on the condition that the one-way moving distance Lt1 in the final step was increased to 3000 m based on the cutting condition of the sample 3. The cutting condition of the sample 9 was based on the condition that the one-way moving distance Lt3 in the initial step was increased to 3000 m based on the cutting condition of the sample 3.

Further, the cutting condition of the sample 10 is based on the condition that the absolute value Ac1 of the acceleration of the metal wire W1 in the initial step is reduced to 3.5 m/sec ² based on the cutting condition of the sample 9. The cutting condition of the sample 11 was based on the condition that the absolute value Ac3 of the acceleration of the metal wire W1 in the final step was reduced to 3.5 m/sec ² based on the cutting condition of the sample 9. The cutting conditions of the sample 12 were based on the conditions of the cutting conditions of the sample 9, and the absolute values Ac1 and Ac3 of the acceleration of the metal wire W1 in the initial step and the final step were reduced to 3.5 m/sec ² .

Further, in Table 1, for each sample, the value obtained by dividing the one-way moving distance Lt1 of the initial step by the one-way moving distance Lt2 of the intermediate step (Lt1/Lt2), and the one-way step of the final step are shown. The moving distance Lt3 is divided by the value obtained by the one-way moving distance Lt2 of the intermediate step (Lt3/Lt2). Here, the value (Lt1/Lt2) and the value (Lt3/Lt2) indicate values obtained by rounding off the value of the second digit after the decimal point.

<(C) Evaluation method of substrate>

For the plurality of substrates of each of the samples 1 to 12, it was confirmed by visual inspection and inspection equipment whether or not micro-cracks and defects were generated on the surface of the substrate. Then, for the plurality of substrates of each of the samples 1 to 12, the number of substrates on which at least one of the microcracks and the defects is confirmed is divided by the number of the entire substrates, and multiplied by 100. The rate of occurrence of defects (bad rate of occurrence) was calculated. Here, the defect occurrence rate calculated for each of the samples 1 to 12 is shown in the column at the right end of Table 1. Specifically, the defective yields of Samples 1 to 12 were 12.4%, 10.9%, 8.1%, 6.9%, 5.3%, 6.4%, 10.0%, 8.7%, 4.0%, 3.3%, 3.8%, and 3.1%, respectively. .

<(D) Evaluation result of substrate>

As shown in Table 1, the defect occurrence rates of the samples 2 to 7 were lower than those of the sample 1. Thereby, it is understood that the movement of the metal wire W1 is controlled such that the unidirectional moving distances Lt1 and Lt3 in the initial step and the final step are larger than the one-way moving distance Lt2 in the intermediate step, and the defective generation rate is lowered. It can be inferred that the frequency of the switching operation by switching the direction in which the metal wire W1 moves is lower in the intermediate step and the lower-end step in the initial step and the final step, so that the movement of the metal wire W1 becomes more stable, and cracking of the substrate is less likely to occur. Cracked. Further, a tendency has been found that the rate of occurrence of defects decreases as the one-way moving distances Lt1 and Lt3 in the initial step and the final step increase.

Moreover, the defect generation rate of the sample 9 was lower than the defect generation rate of the sample 8. Thereby, it is understood that the movement of the metal wire W1 is controlled such that the unidirectional movement distance Lt1 in the initial step is larger than the unidirectional movement distance Lt3 of the final step, and the defect occurrence rate is lowered. Inferred In the initial step when the metal wire W1 starts to contact the bulk BL1 and immediately after the contact, the movement of the metal wire W1 tends to be unstable, the movement of the metal wire W1 is stabilized, whereby the substrate is not easily formed. Cracks and cracks are generated.

Moreover, the defect generation rate of the sample 10-12 was lower than the defect generation rate of the sample 9. Therefore, it is understood that at least one of the absolute values Ac1 and Ac3 of the acceleration of the metal wire W1 in the initial step and the final step is controlled to be smaller than the absolute value Ac2 of the acceleration of the metal wire W1 in the intermediate step, and the defect is poor. The rate of production is reduced. It can be inferred that the movement state of the metal wire W1 is stabilized in the switching operation of the switching direction of the switching metal wire W1, and cracking and cracking of the substrate are not easily caused.

Further, the defect occurrence rate of the sample 10 was lower than that of the sample 11. Thereby, it is understood that the movement rate of the metal wire W1 is controlled such that the absolute value Ac1 of the acceleration of the metal wire W1 in the initial step is smaller than the absolute value Ac3 of the acceleration of the metal wire W1 in the final step, and the defect occurrence rate is lowered. It can be inferred that the movement of the metal wire W1 is stabilized in the initial step when the metal wire W1 starts to contact the bulk BL1 and immediately after the contact, and the movement of the metal wire W1 tends to be unstable. Cracks and cracks are generated on the substrate.

Moreover, the defect generation rate of the sample 12 was lower than the defect occurrence rate of the sample 10 and the sample 11. Therefore, it can be seen that the movement of the metal wire W1 is controlled such that the absolute values Ac1 and Ac3 of the acceleration of the metal wire W1 in the initial step and the final step are smaller than the absolute value Ac2 of the acceleration of the metal wire W1 in the intermediate step. The rate of adverse effects is reduced. Here, it can be inferred that the movement state of the metal wire W1 is stabilized in the switching operation of switching the moving direction of the metal wire W1, and cracking and cracking of the substrate are not easily caused.

1‧‧‧Substrate cutting device

BL1‧‧‧ block

BX1‧‧‧ Debris Receiving Box

GR1~GR4‧‧‧1~4 guide rolls

HM1‧‧‧ Lifting Department

HP1‧‧‧ Keeping Department

MR1~MR3‧‧‧1~3 main roller

OB1‧‧‧ Keep objects

P1, P2, P3‧‧‧ rotating shaft

SB1‧‧‧ basic components

W1‧‧‧ metal wire

WR1‧‧‧Volume 1

WR2‧‧‧ Volume 2

X, Y, Z‧‧ Direction

Claims (8)

A method of manufacturing a substrate, comprising: a preparation step of preparing a block including a first surface and a second surface disposed on a back side of the first surface and fixed to the holding member; and a cutting step of alternately performing one side The movement of the metal line in the first direction along the longitudinal direction of the metal line and the movement of the metal line in the second direction opposite to the first direction are directed from the first surface side by the metal line The second surface side cuts the block; and the cutting step includes an initial step of contacting the metal wire from the first surface side to the block body, and cutting the inside of the block by the metal wire a first region on the one side; an intermediate step of cutting an intermediate portion between the first region and the second region on the second surface side by the metal wire; and a final step of borrowing Cutting the second region in the block by the metal wire; and controlling the movement of the wire in such a manner that the metal is in at least one of the initial step and the final step The way toward the moving distance is greater than the continuously moving distance of the above intermediate steps in the metal wire is continuously toward the check. A method of manufacturing a substrate according to claim 1, wherein the movement of the metal wire is controlled such that the moving distance in the initial step is greater than the moving distance in the final step. A method of manufacturing a substrate according to claim 1, wherein the moving distance is reduced stepwise in the initial step. A method of manufacturing a substrate according to claim 1, wherein the moving distance is increased stepwise in the final step. A method of manufacturing a substrate according to any one of claims 1 to 4, which is in the initial step And at least one of the step of the final step and the intermediate step, respectively performing a switching operation of switching a direction in which the metal wire moves between the first direction and the second direction; and controlling the metal in the following manner The movement of the wire: the absolute value of the acceleration of the metal wire in the switching operation performed in at least one of the initial step and the final step is smaller than the metal wire in the switching operation performed in the intermediate step The absolute value of the acceleration. The method of manufacturing a substrate according to claim 5, wherein the movement of the metal wire is controlled in such a manner that an absolute value of the acceleration of the metal wire in the switching operation performed in the initial step is smaller than that in the final step The absolute value of the acceleration of the metal line in the switching operation. A method of manufacturing a substrate, comprising: a preparation step of preparing a block including a first surface and a second surface disposed on a back side of the first surface and fixed to the holding member; and a cutting step of alternately performing one side The movement of the metal line in the first direction along the longitudinal direction of the metal line and the movement of the metal line in the second direction opposite to the first direction are directed from the first surface side by the metal line The second surface side cuts the block; and the cutting step includes an initial step of contacting the metal wire from the first surface side to the block body, and cutting the inside of the block by the metal wire a first region on the one side; an intermediate step of cutting an intermediate portion between the first region and the second region on the second surface side by the metal wire; and a final step of borrowing Cutting the second region in the block by the metal wire; and performing the moving of the metal wire in at least one of the initial step and the final step and the intermediate step The switching operation of switching between the first direction and the second direction; Controlling the movement of the metal wire in such a manner that the absolute value of the acceleration of the metal line in the switching operation performed in at least one of the initial step and the final step is smaller than the switching operation performed in the intermediate step The absolute value of the acceleration of the above metal wire. The method of manufacturing a substrate according to claim 7, wherein the movement of the metal wire is controlled in such a manner that an absolute value of the acceleration of the metal wire in the switching operation performed in the initial step is smaller than that in the final step The absolute value of the acceleration of the metal line in the switching operation.