TW201421748A - Method for manufacturing light emitting diode device - Google Patents
Method for manufacturing light emitting diode device Download PDFInfo
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- TW201421748A TW201421748A TW101147568A TW101147568A TW201421748A TW 201421748 A TW201421748 A TW 201421748A TW 101147568 A TW101147568 A TW 101147568A TW 101147568 A TW101147568 A TW 101147568A TW 201421748 A TW201421748 A TW 201421748A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
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Abstract
Description
本發明涉及一種發光裝置的製造方法，尤其涉及一種具有發光二極體光源的發光裝置製作方法。The present invention relates to a method of fabricating a light-emitting device, and more particularly to a method of fabricating a light-emitting device having a light-emitting diode source.
相比於傳統的發光源，發光二極體（Light Emitting Diode，LED）具有重量輕、體積小、污染低、壽命長等優點，其作為一種新的發光源，已經被越來越多地應用到各領域當中，如路燈、交通燈、信號燈、射燈及裝飾燈等。Compared with the traditional light source, the Light Emitting Diode (LED) has the advantages of light weight, small volume, low pollution and long life. It has been used more and more as a new light source. In various fields, such as street lamps, traffic lights, signal lights, spotlights and decorative lights.
現有的發光裝置製作中，通常採用發光二極體及導光板來構建發光二極體發光裝置。所述導光板包括光入射面，所述發光二極體與導光板的光入射面相對且間隔設置。該發光二極體通常包括封裝基底、設置在封裝基底上的發光二極體晶片，以及設置在封裝基底上並覆蓋該發光二極體晶片的封裝體，該封裝體的遠離所述封裝基底的一側的表面為出光面。在發光二極體晶片發出的光透射過封裝體並射嚮導光板光入射面的過程中，當光線從封裝體出光面出射至封裝體外部的空氣中時，光是從光密介質傳向光疏介質的，因此部分到達封裝體出光面與空氣的交界面的光會產生全反射現象，使得發光二極體晶片發出的光無法完全出射而進入導光板內部，從而造成光能量的損失。In the fabrication of a conventional light-emitting device, a light-emitting diode and a light guide plate are generally used to construct a light-emitting diode light-emitting device. The light guide plate includes a light incident surface, and the light emitting diodes are opposite to and spaced apart from the light incident surface of the light guide plate. The light emitting diode generally includes a package substrate, a light emitting diode chip disposed on the package substrate, and a package disposed on the package substrate and covering the light emitting diode chip, the package body being away from the package substrate The surface on one side is the illuminating surface. When light emitted from the LED chip is transmitted through the package and is incident on the light incident surface of the light guide plate, when light is emitted from the light exit surface of the package to the air outside the package, light is transmitted from the optically dense medium to the light. When the medium is dissipated, the light that partially reaches the interface between the light-emitting surface of the package and the air will cause a total reflection phenomenon, so that the light emitted from the LED chip cannot be completely emitted and enters the inside of the light guide plate, thereby causing loss of light energy.
有鑒於此，有必要提供一種可減少全反射現象以儘量減少光能量損失的發光二極體發光裝置製作方法。In view of the above, it is necessary to provide a method of fabricating a light-emitting diode light-emitting device that can reduce the total reflection phenomenon to minimize the loss of light energy.
一種發光二極體發光裝置的製作方法，包括以下步驟：第一步，提供一具有出光面的發光二極體光源；第二步，利用未固化的透明膠材將發光二極體光源的出光面與一光學元件的入光面黏結在一起；以及第三步，固化所述透明膠材。A method for fabricating a light-emitting diode light-emitting device includes the following steps: a first step, providing a light-emitting diode light source having a light-emitting surface; and a second step, using an uncured transparent glue material to emit light from the light-emitting diode light source The face is bonded to the light incident surface of an optical component; and in the third step, the transparent adhesive is cured.
與現有技術相比，上述製作方法製作出的發光二極體發光裝置，其發光二極體光源的出光面經由固化的透明膠材與光學元件的入光面黏結在一起，由於固化的透明膠材折射率高於空氣，使得發光二極體光源內部與透明膠材之間的折射率差異較小，從而來自發光二極體光源的光線在到達出光面與透明膠材的交界面時較難發生全反射，進而有效減少全反射現象以儘量減少光能量損失。Compared with the prior art, the light-emitting diode light-emitting device produced by the above manufacturing method has the light-emitting surface of the light-emitting diode light source bonded to the light-incident surface of the optical component via the cured transparent rubber material, due to the cured transparent adhesive. The refractive index of the material is higher than that of air, so that the difference in refractive index between the interior of the light-emitting diode light source and the transparent rubber material is small, so that the light from the light-emitting diode light source is difficult to reach the interface between the light-emitting surface and the transparent rubber material. Total reflection occurs, which effectively reduces total reflection to minimize light energy loss.
下面參照附圖，結合具體實施例對本發明作進一步的描述。The invention will now be further described with reference to the specific embodiments thereof with reference to the accompanying drawings.
本發明第一實施方式提供的發光二極體發光裝置製作方法包括以下步驟。The method for fabricating a light-emitting diode light-emitting device according to the first embodiment of the present invention includes the following steps.
第一步，提供一具有出光面120的發光二極體光源10。In a first step, a light emitting diode source 10 having a light exit surface 120 is provided.
參見圖1，本實施例中該發光二極體光源10為發光二極體燈條，其包括電路板11以及設置在電路板11上的多個發光二極體封裝晶片12。每個發光二極體封裝晶片12具有一個用以出射光線的封裝體出光面。該封裝體出光面作為所述發光二極體光源10的出光面120。Referring to FIG. 1 , the light emitting diode light source 10 in the present embodiment is a light emitting diode light bar, and includes a circuit board 11 and a plurality of light emitting diode package wafers 12 disposed on the circuit board 11 . Each of the LED package wafers 12 has a package exit surface for emitting light. The light emitting surface of the package is used as the light emitting surface 120 of the light emitting diode light source 10.
第二步，利用未固化的透明膠材20將發光二極體光源10的出光面120與一光學元件30的入光面300黏結在一起。In the second step, the light-emitting surface 120 of the light-emitting diode source 10 is bonded to the light-incident surface 300 of an optical element 30 by means of an uncured transparent adhesive material 20.
所述光學元件30可為擴散板、透鏡或導光板等，具體可依發光裝置的設計需求來選擇。The optical component 30 can be a diffusing plate, a lens or a light guide plate, etc., and can be selected according to the design requirements of the light emitting device.
本實施例中，首先在發光二極體光源10的出光面120上塗敷透明膠材20；然後提供一光學元件30，並將該光學元件30的入光面300貼合在塗敷於發光二極體光源出光面120的、未固化的透明膠材20上，參見圖2及圖3。In this embodiment, first, a transparent adhesive material 20 is applied on the light-emitting surface 120 of the light-emitting diode light source 10; then, an optical component 30 is provided, and the light-incident surface 300 of the optical component 30 is attached to the light-emitting surface. The uncured transparent adhesive material 20 of the polar body light-emitting surface 120 is shown in FIG. 2 and FIG.
為保證塗敷在出光面120上的未固化的透明膠材20不易流動，本實施例中，未固化的透明膠材20的黏滯係數大於7000牛頓秒每平方米(Ns/m2)。另外，為了保證塗敷在出光面120上的未固化的透明膠材20不易變形，未固化的透明膠材20的黏聚力大於2千帕(KPa)。本實施例中，採用點膠針頭40在發光二極體光源10的出光面120上塗敷透明膠材20。In order to ensure that the uncured transparent adhesive material 20 coated on the light-emitting surface 120 is not easy to flow, in this embodiment, the viscous coefficient of the uncured transparent adhesive material 20 is greater than 7000 Newton seconds per square meter (Ns/m2). In addition, in order to ensure that the uncured transparent adhesive material 20 coated on the light-emitting surface 120 is not easily deformed, the uncured transparent adhesive material 20 has a cohesive force of more than 2 kPa (KPa). In this embodiment, the transparent glue 20 is applied on the light-emitting surface 120 of the light-emitting diode light source 10 by using the dispensing needle 40.
第三步，固化所述透明膠材20。In the third step, the transparent adhesive 20 is cured.
待透明膠材20被固化後，發光二極體光源10的出光面120便經由透明膠材20固定在光學元件30的入光面300上，並且固化後的透明膠材20與發光二極體光源10的出光面120、光學元件30的入光面300之間均沒有空氣間隙。After the transparent adhesive material 20 is cured, the light-emitting surface 120 of the light-emitting diode light source 10 is fixed on the light-incident surface 300 of the optical component 30 via the transparent adhesive 20, and the cured transparent adhesive material 20 and the light-emitting diode are formed. There is no air gap between the light-emitting surface 120 of the light source 10 and the light-incident surface 300 of the optical element 30.
與現有技術中發光二極體光源和導光板入光面之間存在空氣間隙的情況相比，固化的透明膠材20取代了空氣間隙的位置，而由於固化的透明膠材20折射率高於空氣，使得發光二極體光源10內部與透明膠材20之間的折射率差異較小，從而來自發光二極體光源10的光線在到達出光面120與透明膠材20的交界面時較難發生全反射，進而有效減少全反射現象以儘量減少光能量損失。Compared with the case where there is an air gap between the light-emitting diode light source and the light-incident surface of the light guide plate in the prior art, the cured transparent rubber material 20 replaces the position of the air gap, and the refractive index of the cured transparent rubber material 20 is higher than that. The air makes the difference in refractive index between the inside of the light-emitting diode light source 10 and the transparent rubber material 20 small, so that the light from the light-emitting diode light source 10 is difficult to reach the interface between the light-emitting surface 120 and the transparent adhesive material 20. Total reflection occurs, which effectively reduces total reflection to minimize light energy loss.
此外，當光學元件30為導光板時，由於全反射現象的減少使得發光二極體光源10的出光角度有所增加，從而具有減少導光板亮、暗帶產生的有益效果。此外，由於透明膠材20的存在，使得發光二極體光源10在不會觸碰到導光板入光面的前提下更加接近導光板入光面，從而減小發光裝置的邊框厚度，滿足發光裝置的小型化、薄型化設計需求。In addition, when the optical element 30 is a light guide plate, the light extraction angle of the light-emitting diode light source 10 is increased due to the reduction of the total reflection phenomenon, thereby having the beneficial effect of reducing the light and dark bands of the light guide plate. In addition, due to the presence of the transparent adhesive material 20, the light-emitting diode light source 10 is closer to the light-incident surface of the light guide plate without touching the light-incident surface of the light guide plate, thereby reducing the thickness of the frame of the light-emitting device and satisfying the light emission. The need for miniaturization and thin design of the device.
在上述實施例中，為使未固化的透明膠材20易於設置、並附著在發光二極體光源10的出光面120上，上述第一步所提供的發光二極體光源10的出光面120為平面。In the above embodiment, in order to make the uncured transparent adhesive material 20 easy to be disposed and adhered to the light-emitting surface 120 of the light-emitting diode light source 10, the light-emitting surface 120 of the light-emitting diode light source 10 provided in the first step is 120. It is a plane.
參見圖4、圖5及圖6，本發明第二實施方式還提供一種發光二極體發光裝置製作方法。Referring to FIG. 4, FIG. 5 and FIG. 6, a second embodiment of the present invention further provides a method for fabricating a light-emitting diode light-emitting device.
與第一實施方式相同的是，該第二實施方式提供的製作方法同樣包括：第一步，提供一具有出光面120的發光二極體光源10；第二步，利用未固化的透明膠材20將發光二極體光源10的出光面120與一光學元件30的入光面300黏結在一起；第三步，固化所述透明膠材20。Similar to the first embodiment, the manufacturing method provided by the second embodiment also includes: a first step, providing a light emitting diode light source 10 having a light emitting surface 120; and a second step, using an uncured transparent plastic material. 20, the light-emitting surface 120 of the light-emitting diode source 10 is bonded to the light-incident surface 300 of an optical component 30; in the third step, the transparent adhesive 20 is cured.
與第一實施方式不同的是，該第二實施方式提供的製作方法的第二步採用以下方案實行：首先提供一光學元件30並在光學元件30的入光面300上塗敷未固化的透明膠材20；然後，將發光二極體光源10的出光面120貼合在塗敷於光學元件入光面300的、未固化的透明膠材20上。Different from the first embodiment, the second step of the manufacturing method provided by the second embodiment is implemented by first providing an optical component 30 and applying an uncured transparent adhesive on the light incident surface 300 of the optical component 30. Then, the light-emitting surface 120 of the light-emitting diode light source 10 is bonded to the uncured transparent adhesive material 20 applied to the light-incident surface 300 of the optical element.
在第二實施方式中，為使未固化的透明膠材20易於設置、並附著在光學元件30的入光面300上，所述第二步提供的光學元件30的入光面300為平面。In the second embodiment, in order to make the uncured transparent adhesive material 20 easy to set and adhere to the light incident surface 300 of the optical element 30, the light incident surface 300 of the optical element 30 provided in the second step is a flat surface.
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士爰依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.
10．．．發光二極體光源10. . . Light-emitting diode source
11．．．電路板11. . . Circuit board
12．．．發光二極體封裝晶片12. . . LED package wafer
120．．．出光面120. . . Glossy surface
20．．．透明膠材20. . . Transparent plastic
30．．．光學元件30. . . Optical element
300．．．入光面300. . . Glossy surface
圖1至圖3為本發明第一實施方式提供的發光二極體發光裝置製作方法示意圖。FIG. 1 to FIG. 3 are schematic diagrams showing a manufacturing method of a light-emitting diode light-emitting device according to a first embodiment of the present invention.
圖4至圖6為本發明第二實施方式提供的發光二極體發光裝置製作方法示意圖。4 to FIG. 6 are schematic diagrams showing a method of fabricating a light-emitting diode light-emitting device according to a second embodiment of the present invention.
11．．．電路板11. . . Circuit board
12．．．發光二極體封裝晶片12. . . LED package wafer
120．．．出光面120. . . Glossy surface
20．．．透明膠材20. . . Transparent plastic
30．．．光學元件30. . . Optical element
300．．．入光面300. . . Glossy surface
Claims (10)
第一步，提供一具有出光面的發光二極體光源；
第二步，利用未固化的透明膠材將發光二極體光源的出光面與一光學元件的入光面黏結在一起；以及
第三步，固化所述透明膠材。A method for manufacturing a light-emitting diode light-emitting device, comprising the following steps:
The first step is to provide a light emitting diode light source having a light emitting surface;
In the second step, the light-emitting surface of the light-emitting diode light source is bonded to the light-incident surface of an optical component by using an uncured transparent adhesive material; and in the third step, the transparent adhesive material is cured.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210481254.0A CN103840069A (en) | 2012-11-23 | 2012-11-23 | LED light emitting device manufacturing method |
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| TW201421748A true TW201421748A (en) | 2014-06-01 |
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| KR20180014401A (en) * | 2016-07-29 | 2018-02-08 | 엘지디스플레이 주식회사 | Light Source Module And Backlight Unit Having The Same |
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| JP5224173B2 (en) * | 2008-03-07 | 2013-07-03 | スタンレー電気株式会社 | Semiconductor light emitting device |
| GB2478986B (en) * | 2010-03-26 | 2015-07-01 | Iti Scotland Ltd | LED arrays |
| JP5572013B2 (en) * | 2010-06-16 | 2014-08-13 | スタンレー電気株式会社 | Light emitting device and manufacturing method thereof |
| CN201858541U (en) * | 2010-07-22 | 2011-06-08 | 歌尔声学股份有限公司 | LED (light-emitting module) backlight module and display equipment with same |
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