CN103840069A - LED light emitting device manufacturing method - Google Patents

LED light emitting device manufacturing method Download PDF

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Publication number
CN103840069A
CN103840069A CN201210481254.0A CN201210481254A CN103840069A CN 103840069 A CN103840069 A CN 103840069A CN 201210481254 A CN201210481254 A CN 201210481254A CN 103840069 A CN103840069 A CN 103840069A
Authority
CN
China
Prior art keywords
led
transparent adhesive
adhesive tape
optical element
tape material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201210481254.0A
Other languages
Chinese (zh)
Inventor
蔡明达
徐智鹏
张忠民
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rongchuang Energy Technology Co ltd
Zhanjing Technology Shenzhen Co Ltd
Original Assignee
Rongchuang Energy Technology Co ltd
Zhanjing Technology Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rongchuang Energy Technology Co ltd, Zhanjing Technology Shenzhen Co Ltd filed Critical Rongchuang Energy Technology Co ltd
Priority to CN201210481254.0A priority Critical patent/CN103840069A/en
Priority to TW101147568A priority patent/TW201421748A/en
Publication of CN103840069A publication Critical patent/CN103840069A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)

Abstract

An LED light emitting device manufacturing method comprises the following steps: firstly, providing an LED light source with a light exit surface; secondly, using uncured transparent adhesive material to bond the light exit surface of the LED light source with a light entry surface of an optical element; and thirdly, curing the transparent adhesive material. The method can reduce total reflection of light during incidence from the LED light source into the optical element, so that the loss of light energy is minimized and the light utilization efficiency of an LED light emitting device is improved.

Description

LED illuminating device manufacture method
Technical field
The present invention relates to a kind of manufacture method of light-emitting device, relate in particular to a kind of light-emitting device manufacture method with LED source.
Background technology
Than traditional light emitting source, light-emitting diode (Light Emitting Diode, LED) there is the advantages such as lightweight, volume is little, it is low to pollute, the life-span is long, it is as a kind of novel light emitting source, be applied to more and more in the middle of each field, as street lamp, traffic lights, signal lamp, shot-light and decorative lamp etc.
Existing light-emitting device adopts light-emitting diode and light guide plate to build LED illuminating device in making conventionally.Described light guide plate comprises light entrance face, and the relative and interval of the light entrance face of described light-emitting diode and light guide plate arranges.This light-emitting diode generally includes package substrates, is arranged on the light-emitting diode chip for backlight unit in package substrates, and be arranged in package substrates and cover the packaging body of this light-emitting diode chip for backlight unit, the surface of the side away from described package substrates of this packaging body is exiting surface.In the process of the light sending at light-emitting diode chip for backlight unit transmitted through packaging body directive light guide plate light entrance face, when light from the outgoing of packaging body exiting surface to the air of packaging body outside time, only be transmitted to optically thinner medium from optically denser medium, therefore the light that partly arrives the interface of packaging body exiting surface and air can produce total reflection phenomenon, make the outgoing and enter light guide plate inside completely of light that light-emitting diode chip for backlight unit sends, thereby cause the loss of light energy.
Summary of the invention
In view of this, be necessary to provide a kind of total reflection phenomenon that reduces to reduce the LED illuminating device manufacture method of light energy losses as far as possible.
A manufacture method for LED illuminating device, comprises the following steps: the first step, provides a LED source with exiting surface; Second step, utilizes uncured transparent adhesive tape material that the incidence surface of the exiting surface of LED source and an optical element is bonded together; And the 3rd step, solidify described transparent adhesive tape material.
Compared with prior art, the LED illuminating device that above-mentioned manufacture method is produced, the exiting surface of its LED source is bonded together via curing transparent adhesive tape material and the incidence surface of optical element, because curing transparent adhesive tape material refractive index is higher than air, make the refractive index difference between LED source inside and transparent adhesive tape material less, thereby from light more difficult generation total reflection in the time arriving the interface of exiting surface and transparent adhesive tape material of LED source, and then effectively reduce total reflection phenomenon to reduce light energy losses as far as possible.
With reference to the accompanying drawings, in conjunction with embodiment, the invention will be further described.
Accompanying drawing explanation
The LED illuminating device manufacture method schematic diagram that Fig. 1 to Fig. 3 provides for first embodiment of the invention.
The LED illuminating device manufacture method schematic diagram that Fig. 4 to Fig. 6 provides for second embodiment of the invention.
Main element symbol description
LED source 10
Circuit board 11
LED package chip 12
Exiting surface 120
Transparent adhesive tape material 20
Optical element 30
Incidence surface 300
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
The LED illuminating device manufacture method that first embodiment of the invention provides comprises the following steps.
The first step, provides a LED source 10 with exiting surface 120.
Referring to Fig. 1, in the present embodiment, this LED source 10 is light-emitting diode light bar, and it comprises circuit board 11 and is arranged on the multiple LED package chips 12 on circuit board 11.Each LED package chip 12 has a packaging body exiting surface in order to emergent ray.This packaging body exiting surface is as the exiting surface 120 of described LED source 10.
Second step, utilizes uncured transparent adhesive tape material 20 that the incidence surface 300 of the exiting surface of LED source 10 120 and an optical element 30 is bonded together.
Described optical element 30 can be diffuser plate, lens or light guide plate etc., specifically can select according to the design requirement of light-emitting device.
In the present embodiment, first on the exiting surface 120 of LED source 10, apply transparent adhesive tape material 20; Then one optical element 30 is provided, and the incidence surface of this optical element 30 300 is fitted in and is coated on transparent adhesive tape material 20 LED source exiting surface 120, uncured, referring to Fig. 2 and Fig. 3.
For the uncured transparent adhesive tape material 20 that guarantees to be coated on exiting surface 120 is difficult for flowing, in the present embodiment, the coefficient of viscosity of uncured transparent adhesive tape material 20 is greater than every square metre of (Ns/m of 7000 Newton-second 2).In addition, not yielding in order to guarantee to be coated in uncured transparent adhesive tape material 20 on exiting surface 120, the cohesive strength of uncured transparent adhesive tape material 20 is greater than 2 kPas (KPa).In the present embodiment, adopt dispensing needle head 40 to apply transparent adhesive tape material 20 on the exiting surface 120 of LED source 10.
The 3rd step, solidifies described transparent adhesive tape material 20.
After transparent adhesive tape material 20 is cured, the exiting surface 120 of LED source 10 is just fixed on the incidence surface 300 of optical element 30 via transparent adhesive tape material 20, and all there is no air gap between the incidence surface 300 of transparent adhesive tape material 20 after solidifying and the exiting surface 120 of LED source 10, optical element 30.
Compared with there is the situation of air gap between LED source in prior art and light guide plate incidence surface, curing transparent adhesive tape material 20 has replaced the position of air gap, and because curing transparent adhesive tape material 20 refractive indexes are higher than air, make the refractive index difference between LED source 10 inside and transparent adhesive tape material 20 less, thereby from light more difficult generation total reflection in the time arriving the interface of exiting surface 120 and transparent adhesive tape material 20 of LED source 10, and then effectively reduce total reflection phenomenon to reduce light energy losses as far as possible.
In addition, in the time that optical element 30 is light guide plate, increase to some extent because the minimizing of total reflection phenomenon makes the rising angle of LED source 10, reduce thereby have the beneficial effect that light guide plate is bright, blanking bar produces.In addition, due to the existence of transparent adhesive tape material 20, make LED source 10 more approach light guide plate incidence surface under the prerequisite that can not touch light guide plate incidence surface, thereby reduce the seal ring thickness of light-emitting device, meet miniaturization, the slimming design requirement of light-emitting device.
In the above-described embodiments, arrange and be attached on the exiting surface 120 of LED source 10 for uncured transparent adhesive tape material 20 is easy to, the exiting surface 120 of the LED source 10 that the above-mentioned first step provides is plane.
Referring to Fig. 4, Fig. 5 and Fig. 6, second embodiment of the invention also provides a kind of LED illuminating device manufacture method.
Identical with the first embodiment, the manufacture method that this second embodiment provides comprises equally: the first step, provides a LED source 10 with exiting surface 120; Second step, utilizes uncured transparent adhesive tape material 20 that the incidence surface 300 of the exiting surface of LED source 10 120 and an optical element 30 is bonded together; The 3rd step, solidifies described transparent adhesive tape material 20.
Different from the first embodiment, the second step of the manufacture method that this second embodiment provides adopts following scheme to carry out: first an optical element 30 is provided and on the incidence surface 300 of optical element 30, applies uncured transparent adhesive tape material 20; Then, the exiting surface of LED source 10 120 is fitted in and is coated on transparent adhesive tape material 20 optical element incidence surface 300, uncured.
In a second embodiment, arrange and be attached on the incidence surface 300 of optical element 30 for uncured transparent adhesive tape material 20 is easy to, the incidence surface 300 of the optical element 30 that described second step provides is plane.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection range that all should belong to the claims in the present invention with distortion.

Claims (10)

1. a LED illuminating device manufacture method, comprises the following steps:
The first step, provides a LED source with exiting surface;
Second step, utilizes uncured transparent adhesive tape material that the incidence surface of the exiting surface of LED source and an optical element is bonded together; And
The 3rd step, solidifies described transparent adhesive tape material.
2. LED illuminating device manufacture method as claimed in claim 1, is characterized in that, described second step further comprises step: first, apply transparent adhesive tape material on the exiting surface of LED source; Then, provide an optical element, and the incidence surface of this optical element is fitted in and is coated on transparent adhesive tape material LED source exiting surface, uncured.
3. LED illuminating device manufacture method as claimed in claim 1, is characterized in that, described second step further comprises step: first, an optical element is provided and on the incidence surface of optical element, applies uncured transparent adhesive tape material; Then, the exiting surface of LED source is fitted in and is coated on transparent adhesive tape material optical element incidence surface, uncured.
4. LED illuminating device manufacture method as claimed in claim 1, is characterized in that, the coefficient of viscosity of described uncured transparent adhesive tape material is greater than every square metre of 7000 Newton-second.
5. LED illuminating device manufacture method as claimed in claim 4, is characterized in that, the cohesive strength of described uncured transparent adhesive tape material is greater than 2 kPas.
6. LED illuminating device manufacture method as claimed in claim 1, is characterized in that, the optical element that described second step provides is diffuser plate, lens or light guide plate.
7. LED illuminating device manufacture method as claimed in claim 1, is characterized in that, the incidence surface of the optical element that described second step provides is plane.
8. LED illuminating device manufacture method as claimed in claim 7, is characterized in that, the optical element that described second step provides is diffuser plate, lens or light guide plate.
9. LED illuminating device manufacture method as claimed in claim 1, it is characterized in that, the LED source that the described first step provides comprises circuit board and is arranged at least one the LED package chip on circuit board, and the exiting surface of described LED source is the packaging body exiting surface of LED package chip.
10. LED illuminating device manufacture method as claimed in claim 9, is characterized in that, the packaging body exiting surface of described LED package chip is plane.
CN201210481254.0A 2012-11-23 2012-11-23 LED light emitting device manufacturing method Pending CN103840069A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201210481254.0A CN103840069A (en) 2012-11-23 2012-11-23 LED light emitting device manufacturing method
TW101147568A TW201421748A (en) 2012-11-23 2012-12-14 Method for manufacturing light emitting diode device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210481254.0A CN103840069A (en) 2012-11-23 2012-11-23 LED light emitting device manufacturing method

Publications (1)

Publication Number Publication Date
CN103840069A true CN103840069A (en) 2014-06-04

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Family Applications (1)

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Country Status (2)

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CN (1) CN103840069A (en)
TW (1) TW201421748A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107664874A (en) * 2016-07-29 2018-02-06 乐金显示有限公司 Light source module and the back light unit including the light source module

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009218274A (en) * 2008-03-07 2009-09-24 Stanley Electric Co Ltd Semiconductor light-emitting device
CN201858541U (en) * 2010-07-22 2011-06-08 歌尔声学股份有限公司 LED (light-emitting module) backlight module and display equipment with same
CN102290500A (en) * 2010-06-16 2011-12-21 斯坦雷电气株式会社 Semiconductor light-emitting device and manufacturing method
TW201202764A (en) * 2010-03-26 2012-01-16 Iti Scotland Ltd Edge lit light guide device, LED assembly and display device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009218274A (en) * 2008-03-07 2009-09-24 Stanley Electric Co Ltd Semiconductor light-emitting device
TW201202764A (en) * 2010-03-26 2012-01-16 Iti Scotland Ltd Edge lit light guide device, LED assembly and display device
CN102290500A (en) * 2010-06-16 2011-12-21 斯坦雷电气株式会社 Semiconductor light-emitting device and manufacturing method
CN201858541U (en) * 2010-07-22 2011-06-08 歌尔声学股份有限公司 LED (light-emitting module) backlight module and display equipment with same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107664874A (en) * 2016-07-29 2018-02-06 乐金显示有限公司 Light source module and the back light unit including the light source module

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Application publication date: 20140604