TW201419426A - Fabricating method for package cover - Google Patents

Abstract

A fabricating method for a package cover is provided. The fabricating method for package cover includes providing a mold with a receiving tank, a plurality of insulating particles scatteredly disposed in the receiving tank, performing microwave heating process to the insulating particles in the receiving tank for forming a melting colloid layer, and performing a cooling process to the melting colloid layer for solidifying the melting colloid layer.

Description

Package cover body manufacturing method

The present invention relates to a method of fabricating a cover, and more particularly to a method of making a package cover.

With the lightness, thinness, and versatility of electronic devices, semiconductor packages used therein have also become smaller, thinner, and narrower in pitch. In this case, the epoxy resin composition for semiconductor encapsulation is strongly required to have high solder heat resistance and high water repellency because heat resistance and water repellency affect the implementation of the epoxy resin composition. The reliability of semiconductor packages produced by packaging. Therefore, the amount of the inorganic filler contained in the epoxy resin composition tends to increase, so that the semiconductor package thus produced has a low internal stress and a low hygroscopicity. However, as the amount of the inorganic filler increases, the fluidity during packaging may decrease and defects during molding (for example, lead frame deformation, gold wire deformation, or surface void, etc.) may increase.

In order to solve the above problems, it has been conventionally attempted to maintain the flow of the epoxy resin composition by optimizing the particle shape and particle size distribution of the inorganic filler or by minimizing the viscosity at the package temperature of the epoxy resin or the phenol resin. Sex and improve its filling characteristics. However, the goal of reducing the surface void is difficult to achieve, and it is easy to cause a problem of poor bonding. Therefore, reducing the surface voids of the epoxy resin composition has become a topic in packaging technology.

The invention provides a method for manufacturing a package cover body, which can be made into a package cover body with a flat surface and a small cavity.

The present invention provides a method for fabricating a package cover, which comprises providing a mold having a receiving groove, a plurality of insulating particles disposed in the receiving groove, and the insulating particles being dispersedly disposed in the receiving groove. Then, the insulating particles located in the accommodating groove are subjected to a microwave heating step to form a molten colloid layer, and then the molten colloid layer is subjected to a cooling cooling step to solidify the molten colloid layer.

In an embodiment of the invention, the temperature of the microwave heating step is between 80 ° C and 120 ° C.

In an embodiment of the invention, the method for fabricating the package cover further comprises: providing a microwave heating fixture before the microwave heating step of the insulating particles located in the accommodating groove, placing it on the upper part of the mold and bearing the capacity An upper edge of the groove.

In an embodiment of the invention, the temperature of the cooling and cooling step is between 10 ° C and 15 ° C.

In an embodiment of the invention, the method for fabricating the package cover further comprises: providing a cooling and cooling fixture before the step of cooling the colloidal layer in the molten state, placing it on the upper part of the mold and bearing the receiving groove; An upper edge.

In an embodiment of the invention, the material of the insulating particles comprises an epoxy resin or a silicone rubber.

Based on the above, the present invention performs a microwave heating step on the insulating particles to form a molten colloid layer, and then lowers the molten colloid layer. The temperature cooling step is to cure the molten colloid layer to form a flat sheet-like package cover. Since the step of microwave heating and cooling and cooling can remove the gap between the insulating particles, so that there is no residual air in the produced package cover, the risk of surface voiding of the conventional epoxy resin composition can be avoided. In this way, the package cover made by the manufacturing method of the present invention can have better process yield and can have better surface flatness because there is no residual air in the package cover body (ie, no surface void). .

The above described features and advantages of the present invention will be more apparent from the following description.

1 is a flow chart of a method of fabricating a package cover according to an embodiment of the present invention. 2 to 5 are schematic cross-sectional views showing a method of fabricating a package cover according to an embodiment of the present invention. Referring to FIG. 1 and FIG. 2 simultaneously, in the manufacturing process of the package cover of the embodiment, first, in step S110, a mold 100 is provided, and the mold 100 has a receiving groove 110, and then step S120 is performed. A plurality of insulating particles 120 are disposed in the groove 110, and the insulating particles 120 are dispersedly disposed in the receiving groove 110. The material of the insulating particles 120 is an insulating material, such as epoxy resin or silicone rubber.

Next, step S130 is performed to perform a microwave heating step on the insulating particles 120 located in the accommodating groove 110 to form a molten colloid layer to drive out the air between the insulating particles 120. Finally, step S140 is performed to perform a cooling and cooling step on the colloidal layer in the molten state to solidify the colloidal layer in the molten state, and the step of cooling and cooling is used to eliminate the remaining colloidal layer in the molten state. Bubble between the two.

Referring to FIG. 3 , in the method for fabricating the package cover of the embodiment, when the insulating particles are subjected to microwave heating, a microwave heating fixture 200 may be disposed, placed above the mold 100 and supported by the receiving groove 110 . An upper edge 112 is formed together with the receiving groove 100 to form a first sealed space S1. The insulating particles 120 are disposed in the first sealed space S1, and the microwave heating jig 200 starts microwave heating of the first sealed space S1. The insulating particles 120 start to melt after being heated, and the air between the insulating particles 120 is dissipated by heating. Then, the insulating particles 120 form a molten colloid layer 130.

Specifically, the microwave heating conditions used in the microwave heating step of the present embodiment are as follows: the temperature of the microwave heating is between 80 ° C and 120 ° C to ensure that the insulating particles 120 are uniformly heated and melted. It is noted that the present invention utilizes microwave heating to perform the melting step of the insulating particles 120, which has many advantages that are not easily realized by conventional heating methods, such as: shorter time, higher efficiency, and due to the required heating temperature Lower, the molten structure after heating the material is uniform and stable.

Referring to FIG. 4 and FIG. 5 simultaneously, in the method for manufacturing the package cover of the embodiment, when the molten colloid layer 130 is subjected to a cooling and cooling step, the microwave heating fixture 200 placed on the mold 100 is first removed. Then, the cooling and cooling fixture 300 is placed above the mold 100 and bears against the upper edge 112 of the accommodating groove 110 to form a second sealed space S2 together with the accommodating groove 110. The cooling and cooling jig 300 starts to cool down the molten colloid layer 130 in the accommodating groove 110 by the cooling pipe in the second sealed space S2. The molten colloid layer 130 begins to solidify due to a decrease in temperature, and remains in the molten state. The bubbles between the colloidal layers 130 are also gradually eliminated during the cooling process. Finally, as shown in FIG. 5, the molten colloid layer 130 is cured into a sheet-like package cover 140.

The package cover 140 made by the method for manufacturing the package cover of the present embodiment is subjected to microwave heating and cooling and cooling to remove voids between the insulating particles 120 and bubbles in the molten colloid layer 130. The formed package cover 140 may have a flat surface free of surface voids. The package cover 140 can be applied to package a semiconductor structure to cover and protect the wafer, the bonding wires and the contacts, and isolate the bonding wires and contacts from the outside to prevent external moisture from entering the package structure through the contacts. This causes the internal wiring of the substrate to fail. When the package cover 140 is used to package a semiconductor structure, the bonding strength between the package and the semiconductor structure is also improved because the surface thereof is relatively flat.

In summary, the present invention utilizes a microwave heating fixture to microwave the insulating particles to dissipate the air between the insulating particles to form a molten colloid layer, and then cool the molten colloid layer by using a cooling cooling fixture. In order to remove the bubbles in the molten colloid layer and solidify the molten colloid layer into a sheet-like encapsulation cover. Since the temperature required for microwave heating is low, the texture after melting of the material is uniform and structurally stable, and the surface of the encapsulating cover after the bubbles are removed by the steps of microwave heating and cooling and cooling is relatively flat, so that the manufacturing method of the present invention is made. The package cover can have a better process yield.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art does not deviate. In the spirit and scope of the present invention, the scope of protection of the present invention is defined by the scope of the appended claims.

100‧‧‧Mold

110‧‧‧ accommodating slots

112‧‧‧Upper edge

120‧‧‧Insulating particles

130‧‧‧Moltened colloidal layer

140‧‧‧Package cover

200‧‧‧Microwave heating fixture

300‧‧‧ Cooling and cooling fixture

S1‧‧‧ first confined space

S2‧‧‧Second confined space

S110~S140‧‧‧Steps

1 is a flow chart of a method of fabricating a package cover according to an embodiment of the present invention.

2 to 5 are schematic cross-sectional views showing a method of fabricating a package cover according to an embodiment of the present invention.

S110~S140‧‧‧Steps

Claims (6)

A method for manufacturing a package cover, comprising: providing a mold, the mold having a receiving groove; and arranging a plurality of insulating particles in the accommodating groove, wherein the insulating particles are dispersedly disposed in the accommodating groove; The insulating particles in the accommodating groove are subjected to a microwave heating step to form a molten colloid layer; and the molten layer is subjected to a cooling cooling step to cure the molten colloid layer. The method for fabricating a package cover according to claim 1, wherein the temperature of the microwave heating step is between 80 ° C and 120 ° C. The method for manufacturing the package cover according to the first aspect of the invention, further comprising: providing a microwave heating fixture before the microwave heating step of the insulating particles located in the receiving groove, Above the mold and bearing against an upper edge of the receiving groove. The method for fabricating a package cover according to claim 1, wherein the temperature of the cooling and cooling step is between 10 ° C and 15 ° C. The method for manufacturing the package cover according to the first aspect of the invention, further comprising: providing a cooling and cooling fixture before the step of cooling the molten layer of the molten layer, placing the mold on the upper side of the mold Relying on an upper edge of the receiving groove. The method for manufacturing a package cover according to claim 1, wherein the materials of the insulating particles comprise epoxy resin or silicone rubber.