TW201412943A - Method for producing beta-sialon, beta-sialon, and light-emitting device - Google Patents

Method for producing beta-sialon, beta-sialon, and light-emitting device Download PDF

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TW201412943A
TW201412943A TW102129940A TW102129940A TW201412943A TW 201412943 A TW201412943 A TW 201412943A TW 102129940 A TW102129940 A TW 102129940A TW 102129940 A TW102129940 A TW 102129940A TW 201412943 A TW201412943 A TW 201412943A
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sialon
light
blending
wavelength
producing
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Ryoji Inaba
Takuya Okada
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Denki Kagaku Kogyo Kk
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77348Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00Nitrogen; Compounds thereof
    • C01B21/082Compounds containing nitrogen and non-metals and optionally metals
    • C01B21/0821Oxynitrides of metals, boron or silicon
    • C01B21/0826Silicon aluminium oxynitrides, i.e. sialons
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/0838Aluminates; Silicates
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/01Particle morphology depicted by an image
    • C01P2004/03Particle morphology depicted by an image obtained by SEM
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/61Micrometer sized, i.e. from 1-100 micrometer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

Provided are a method for producing beta-sialon, beta-sialon, and a light-emitting device with which it is possible to bring peak wavelength to within a range of greater than 545 nm but no more than 555 nm without reducing light-emission efficiency. The beta-sialon, in which Eu2+ is a solid solution in beta-sialon represented by the general formula Si6-zAlzOzN8-z, is produced by performing a mixing step S1 for adding, kneading, and homogenizing starting materials, and a firing step S2 for firing the post-mixing-step starting materials and obtaining beta-sialon. The mixing step S1 involves performing a primary mixing step S11 for mixing silicon nitride, aluminum nitride, and oxide such that 0.3 ≤ z ≤ 1.0, and a secondary mixing step S12 for mixing beta-sialon powder and one or both of europium oxide and europium salt with the starting materials after the primary mixing step S11. Moreover, one or both of aluminum oxide and silicon oxide are used as the oxide mixed in the primary mixing step S11.

Description

β賽隆之製造方法、β賽隆及發光裝置 Method for manufacturing β-Sialon, β-Sialon and illuminating device

本發明係關於β賽隆之製造方法、β賽隆及發光裝置。更詳言之,本發明係關於使Eu2+固溶於β賽隆(SiAlON)的β賽隆之製造方法、以此方法製造之β賽隆及使用此β賽隆之發光裝置。 The present invention relates to a method for producing β-Sialon, a β-Sialon, and a light-emitting device. More specifically, the present invention relates to a method for producing a β-Silon in which Eu 2+ is dissolved in β-Silon (SiAlON), a β-Sialon manufactured by the method, and a light-emitting device using the β-Sialon.

已知使發光中心的二價銪(Eu2+)固溶於β賽隆(SiAlON)而成之β賽隆,會被從紫外光至藍光之大範圍波長的光激發而發出綠光(參閱專利文獻1~3)。例如,專利文獻1之0015段落揭示一β賽隆,其中就以通式:Si6-ZAlZOZN8-Z表示之β賽隆之組成而言,其係藉由使Z成為0.24~0.42且使Eu含量成為0.05~0.25at%,而使波鋒波長成為535nm。 It is known that the β-sialon in which the divalent europium (Eu 2+ ) of the luminescent center is dissolved in β-Silon is excited by the light of a wide range of wavelengths from ultraviolet light to blue light (see Patent Documents 1 to 3). For example, paragraph 0015 of Patent Document 1 discloses a β-Sialon in which the composition of β-Sialon represented by the general formula: Si 6-Z Al Z O Z N 8-Z is obtained by making Z 0.24~ 0.42 and the Eu content was 0.05 to 0.25 at%, and the wave front wavelength was 535 nm.

專利文獻2揭示一β賽隆,其係藉由將β賽隆結晶的晶格常數a設為0.7605~0.7610nm,晶格常數c設為0.2906~0.2911nm,Eu含量設為0.4~2質量%,第一過渡金屬含量設為5ppm以下,而實現高發光效率與窄帶域發光。專利文獻3揭示一β賽隆,其波長700~800nm的平均擴散反射率為90%以上,螢光波鋒波長中之擴散反射率為85%以上。 Patent Document 2 discloses a β-Sialon by setting the lattice constant a of the β-Sialon crystal to 0.7605 to 0.7610 nm, the lattice constant c to 0.2906 to 0.2911 nm, and the Eu content to 0.4 to 2 mass%. The first transition metal content is set to 5 ppm or less to achieve high luminous efficiency and narrow band emission. Patent Document 3 discloses a β-Sialon having an average diffuse reflectance of 90% or more at a wavelength of 700 to 800 nm and a diffuse reflectance of 85% or more at a wavelength of a fluorescent wave front.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]國際公開第2006/121083號 [Patent Document 1] International Publication No. 2006/121083

[專利文獻2]日本特開2010-241995號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2010-241995

[專利文獻3]日本特開2011-174015號公報 [Patent Document 3] Japanese Laid-Open Patent Publication No. 2011-174015

前述之專利文獻1~3中記載之以往的β賽隆,當以波長455nm的光激發時之螢光光譜的波鋒波長皆為540~545nm。相對之下,近年要求在較545nm更長波長側具有波峰之螢光體,而有針對為了使β賽隆的波鋒波長位移至長波長側之探討。 In the conventional β-Sialon described in the above-mentioned Patent Documents 1 to 3, the wavelength of the fluorescence spectrum of the fluorescence spectrum when excited by light having a wavelength of 455 nm is 540 to 545 nm. In contrast, in recent years, a phosphor having a peak on the longer wavelength side than 545 nm has been required, and there has been a discussion on shifting the wavelength of the wave front of β-Sialon to the long wavelength side.

然而,一邊維持作為β賽隆而言必要的發光效率,一邊將波鋒波長設為較545nm更長波長側較為困難,且至今仍未實現當以波長455nm的光激發時,在大於545nm且555nm以下的波長上具有波鋒波長之β賽隆。而且,作為β賽隆而言必要的發光效率,其換算成外部量子效率係55%以上。此處,「外部量子效率」係指螢光發光光子數相對於照射於β賽隆之激發光光子數的比率。 However, while maintaining the luminous efficiency necessary as β-Sialon, it is difficult to set the wave front wavelength to a longer wavelength side than 545 nm, and it has not been realized so far when excited by light having a wavelength of 455 nm, at more than 545 nm and 555 nm. The following wavelengths have a wavelength of β-Sylon. Further, the luminous efficiency necessary for β-Sialon is converted to an external quantum efficiency of 55% or more. Here, "external quantum efficiency" means the ratio of the number of fluorescent light-emitting photons to the number of excitation photons irradiated to β-sialon.

在此,本發明之主要目的在於提供β賽隆之製造方法、β賽隆及發光裝置,該β賽隆之製造方法可不降低發光效率並將波峰波長設為在大於545nm且555nm以下之範圍。 Here, the main object of the present invention is to provide a method for producing β-Sialon, a β-Sialon, and a light-emitting device, which can reduce the luminous efficiency and set the peak wavelength to a range of more than 545 nm and 555 nm or less.

本發明人為了解決前述之課題,而針對能夠 製造波鋒波長位移至長波長側之β賽隆進行銳意實驗探討之結果發現:僅透過設計變更來製造β賽隆,會產生異相生成或粒子間燒結之新課題。此粒子間燒結係生成晶格缺陷的原因,其進而成為螢光特性低下之原因。 The inventors of the present invention have been able to solve the aforementioned problems. As a result of intensive experimentation of the production of the wave front wavelength shift to the long wavelength side of the β-Silon, it was found that the production of β-Sialon by design change alone would cause a new problem of heterogeneous generation or interparticle sintering. This inter-particle sintering system causes lattice defects, which in turn causes a decrease in fluorescence characteristics.

本發明人更進一步進行探討而發現:透過將通式:Si6-zAlzOzN8-z中之z值限定為0.3≦z≦1.0,同時以特定之方法加以製造,可不降低發光效率並使波峰波長位移至較545nm更長波長側,進而達成本發明。 The present inventors further explored and found that by limiting the z value in the general formula: Si 6-z Al z OzN 8-z to 0.3 ≦ z ≦ 1.0 while being manufactured by a specific method, the luminous efficiency can be not lowered. The present invention has been achieved by shifting the peak wavelength to a longer wavelength side than 545 nm.

本發明之該β賽隆之製造方法,其具有:摻合步驟,其摻合並混捏原料而使之均勻化;與燒成步驟,其將摻合步驟後的原料進行燒成而得到β賽隆,前述摻合步驟中進行:一次摻合步驟,其係以使其成為通式:Si6-zAlzOzN8-z(0.3≦z≦1.0)之方式摻合氮化矽、氮化鋁及氧化物;與二次摻合步驟,其將β賽隆粉末和氧化銪及銪鹽中任一者或兩者摻合於一次摻合步驟後的原料中,前述一次摻合步驟中摻合的氧化物係氧化鋁及氧化矽中任一者或兩者,據以使Eu2+固溶於以通式:Si6-zAlzOzN8-z(0.3≦z≦1.0)表示之β賽隆,來得到當以波長455nm的光激發時之螢光光譜的波鋒波長為大於545nm且555nm以下的β賽隆。 The method for producing β-Sialon according to the present invention comprises: a blending step of mixing and kneading a raw material to homogenize; and a calcining step of calcining the raw material after the blending step to obtain β-Sialon. In the foregoing blending step: a single blending step of blending tantalum nitride, aluminum nitride, and the like into a general formula: Si 6-z Al z OzN 8-z (0.3≦z≦1.0) An oxide; and a secondary blending step of blending either or both of the β-Sialon powder and the cerium oxide and the cerium salt in the raw material after the primary blending step, the blending in the previous blending step Either or both of oxide-based alumina and cerium oxide, according to which Eu 2+ is dissolved in a formula: Si 6-z Al z O z N 8-z (0.3≦z≦1.0) β-Sialon, to obtain a β-Silon having a peak wavelength of a fluorescence spectrum when excited by light having a wavelength of 455 nm of more than 545 nm and 555 nm or less.

較佳為相對於100質量%之前述一次摻合步驟後的原料,前述二次摻合步驟中摻合5~30質量%之前述β賽隆粉末。 It is preferable to blend 5 to 30% by mass of the aforementioned β-sialon powder with respect to 100% by mass of the raw material after the one-time mixing step.

較佳為相對於前述氧化物、前述氧化銪及銪鹽的總摻合量,係將前述二次摻合步驟中氧化銪及銪鹽中任一 者或兩者總計的摻合量設為0.33~0.50。 Preferably, the total blending amount of the oxide, the cerium oxide and the cerium salt is any one of the cerium oxide and the cerium salt in the secondary blending step. The blending amount of the total amount of both or both is set to 0.33 to 0.50.

較佳為前述燒成步驟係在氮氣氣體環境下以1820~2050℃之溫度進行燒成。 Preferably, the calcination step is carried out at a temperature of 1820 to 2050 ° C in a nitrogen gas atmosphere.

較佳為前述燒成步驟係將氣壓設為0.1~10MPa。 Preferably, the calcination step is performed by setting the gas pressure to 0.1 to 10 MPa.

本發明之β賽隆之製造方法,可於前述燒成步驟後進行粒度調整步驟,其藉由粉碎及分級中任一者或兩者,而將平均粒徑設為30μm以下。 In the method for producing β-Sialon according to the present invention, the particle size adjustment step may be performed after the calcination step, and the average particle diameter may be 30 μm or less by either or both of pulverization and classification.

本發明之β賽隆之製造方法,可對前述燒成步驟後或前述粒度調整步驟後的β賽隆進行熱處理步驟,其將之保持在1300℃以上且前述燒成步驟中之燒成溫度以下的溫度條件下。 In the method for producing β-Sialon according to the present invention, the heat treatment step of the β-Sialon after the calcination step or the particle size adjustment step may be maintained at 1300° C. or higher and the calcination temperature in the calcination step or lower. Under temperature conditions.

本發明之β賽隆之製造方法,可於前述燒成步驟、前述粒度調整步驟或前述熱處理步驟後進行酸處理步驟,其具有:浸漬步驟,其將β賽隆浸漬於酸溶液中;與清洗步驟,其清洗殘留於前述浸漬步驟後之β賽隆表面上的酸溶液。 The method for producing β-Sialon according to the present invention may be subjected to an acid treatment step after the calcination step, the particle size adjustment step or the heat treatment step, comprising: an impregnation step of immersing β-sialon in an acid solution; and a washing step It cleans the acid solution remaining on the surface of the β-sialon after the aforementioned impregnation step.

本發明之該β賽隆,係以前述之β賽隆之製造方法製造之β賽隆,其係使Eu2+固溶於以通式:Si6-zAlzOzN8-z(0.3≦z≦1.0)表示之β賽隆,而當以波長455nm的光激發時之螢光光譜的波鋒波長為大於545nm且555nm以下者。 The β-Sialon of the present invention is a β-Silone manufactured by the aforementioned method for producing β-Sialon, which is such that Eu 2+ is dissolved in a general formula: Si 6-z Al z O z N 8-z (0.3 ≦z≦1.0) indicates β-Sialon, and when the wavelength of 455 nm is excited, the wavelength of the fluorescence spectrum of the fluorescence spectrum is greater than 545 nm and 555 nm or less.

較佳為本發明之β賽隆之Al含量為2~8質量%,Eu含量為0.3~1質量%,氧含量為0.5~4質量%。 Preferably, the Al content of the β-Sialon of the present invention is 2 to 8% by mass, the Eu content is 0.3 to 1% by mass, and the oxygen content is 0.5 to 4% by mass.

較佳為本發明之β賽隆利用粉末X射線繞射法測定之β賽隆以外之結晶相的繞射射線強度,相對於β賽隆 (101)面的繞射射線強度係1%以下。 Preferably, the β-Sialon of the present invention uses a powder X-ray diffraction method to measure the diffraction ray intensity of a crystal phase other than β-sialon, relative to β-Sylon The diffraction radiation intensity of the (101) plane is 1% or less.

本發明之該發光裝置,係具有發光元件與搭載於前述發光元件之發光面的螢光體且在前述螢光體之一部分或全部中使用前述之β賽隆者。 The light-emitting device of the present invention includes a light-emitting element and a phosphor mounted on a light-emitting surface of the light-emitting element, and the β-Sialon is used in part or all of the phosphor.

較佳為本發明之發光裝置之前述發光元件係發光二極體(LED)。 Preferably, the light-emitting element of the light-emitting device of the present invention is a light-emitting diode (LED).

若依據本發明,則可一邊維持作為發光效率之外部量子效率為55%以上,一邊穩定地製造波鋒波長在大於545nm且555nm以下之範圍的β賽隆。 According to the present invention, it is possible to stably produce β-sialon having a wave front wavelength of more than 545 nm and 555 nm or less while maintaining the external quantum efficiency as the luminous efficiency of 55% or more.

1‧‧‧發光裝置 1‧‧‧Lighting device

2‧‧‧發光元件 2‧‧‧Lighting elements

3‧‧‧螢光體 3‧‧‧Fertior

4、7‧‧‧引線框架 4, 7‧‧‧ lead frame

5‧‧‧封裝樹脂 5‧‧‧Encapsulated resin

6‧‧‧接合引線 6‧‧‧bonding leads

8‧‧‧框體 8‧‧‧ frame

圖1係顯示本發明第1實施形態之β賽隆之製造步驟的流程圖。 Fig. 1 is a flow chart showing a manufacturing procedure of β-Sialon according to the first embodiment of the present invention.

圖2係顯示本發明第2實施形態之發光裝置之構成的模式圖。 Fig. 2 is a schematic view showing the configuration of a light-emitting device according to a second embodiment of the present invention.

圖3係顯示實施例1之β賽隆之掃描型電子顯微鏡(SEM)像的圖式代用照片。 Fig. 3 is a pictorial substitute photograph showing a scanning electron microscope (SEM) image of β-Sialon of Example 1.

圖4係顯示比較例2之β賽隆之掃描型電子顯微鏡(SEM)像的圖式代用照片。 4 is a pictorial substitute photograph showing a scanning electron microscope (SEM) image of β-Silon of Comparative Example 2.

[實施發明之形態] [Formation of the Invention]

以下針對用以實施本發明之形態,將參照附圖進行詳細說明。 The embodiments for carrying out the invention will be described in detail below with reference to the accompanying drawings.

(第1實施形態) (First embodiment)

[β賽隆] [β赛隆]

本發明第1實施形態之該β賽隆係使Eu2+固溶於以通式:Si6-zAlzOzN8-z(0.3≦z≦1.0)表示之β賽隆者,且當以波長455nm的光激發時之螢光光譜的波鋒波長為大於545nm且555nm以下。 The β-Sialon system according to the first embodiment of the present invention dissolves Eu 2+ in a β-Sialon represented by the general formula: Si 6-z Al z O z N 8-z (0.3≦z≦1.0), and The wavelength of the fluorescence spectrum of the fluorescence spectrum when excited by light having a wavelength of 455 nm is greater than 545 nm and 555 nm or less.

通式:Si6-zAlzOzN8-z之z值若小於0.3,則螢光波鋒波長會變得較545nm更低。另一方面,z值若大於1.0,則會變得難以抑制異相生成與粒子間燒結,且發光強度指標的外部量子效率恐變為小於55%。因此,本實施形態之β賽隆係將z值限定為0.3≦z≦1.0。藉此可使螢光波峰波長位移至較545nm更長波長側。 If the z value of Si 6-z Al z O z N 8-z is less than 0.3, the wavelength of the fluorescent wave front will become lower than 545 nm. On the other hand, when the z value is more than 1.0, it becomes difficult to suppress the generation of the hetero phase and the sintering between the particles, and the external quantum efficiency of the luminescence intensity index is less than 55%. Therefore, the β-Sialon system of the present embodiment limits the z value to 0.3≦z≦1.0. Thereby, the fluorescence peak wavelength can be shifted to the longer wavelength side than 545 nm.

本實施形態之β賽隆相對於全質量較佳為Al含量為2~8質量%,Eu含量為0.3~1質量%,氧含量為0.5~4質量%。藉由將Al含量、Eu含量及氧含量設為前述之範圍,可特定β賽隆於通式中正確的z值。 The β-Sialon of the present embodiment preferably has an Al content of 2 to 8% by mass, an Eu content of 0.3 to 1% by mass, and an oxygen content of 0.5 to 4% by mass based on the total mass. By setting the Al content, the Eu content, and the oxygen content to the above ranges, it is possible to specify the correct z value in the formula.

本實施形態之β賽隆,較佳為利用粉末X射線繞射法測定之β賽隆以外之結晶相的繞射射線強度,相對於β賽隆(101)面的繞射射線強度係1%以下。β賽隆以外之結晶相的繞射射線強度若係1%以下,則β賽隆以外之結晶相的含量會變得非常少,而變成含有高純度的β賽隆結晶相。另外,即使β賽隆以外之結晶相的繞射射線強度大於1%而含有不可避免之雜質的非晶質或β賽隆以外之結晶相,只要在不降低特性之範圍即無問題。 The β-Silon of the present embodiment is preferably a diffraction ray intensity of a crystal phase other than β-Sialon measured by a powder X-ray diffraction method, and a diffraction ray intensity of 1% with respect to the β-Sialon (101) plane. the following. When the diffraction ray intensity of the crystal phase other than β-Sialon is 1% or less, the content of the crystal phase other than β-Sialon is extremely small, and the β-Sialon crystal phase containing high purity is contained. In addition, even if the diffraction ray intensity of the crystal phase other than β-Sialon is more than 1% and the amorphous phase containing the unavoidable impurities or the crystal phase other than β-Sialon, there is no problem as long as the range of the characteristics is not lowered.

[製造方法] [Production method]

其次,針對本發明実施形態之β賽隆之製造方法進行 說明。圖1係顯示本實施形態之β賽隆之製造方法的流程圖。如圖1所示,本實施形態之β賽隆之製造方法中係進行:摻合步驟S1,其摻合並混捏原料而使之均勻化;燒成步驟S2,其將摻合步驟後的原料進行燒成而得到β賽隆。 Next, the manufacturing method of the β-Sialon of the present invention is carried out. Description. Fig. 1 is a flow chart showing a method of manufacturing the β-Sialon of the present embodiment. As shown in Fig. 1, in the method for producing β-Sialon of the present embodiment, a blending step S1 is performed in which a kneading raw material is blended and homogenized, and a baking step S2 is performed in which the raw material after the blending step is fired. Into the resulting beta.

<摻合步驟S1> < blending step S1>

摻合步驟S1中係以2階段進行摻合。首先,一次摻合步驟S11中係以使其成為通式:Si6-zAlzOzN8-z(0.3≦z≦1.0)之方式摻合氮化矽及氧化矽中任一者或兩者與氮化鋁與氧化鋁。 In the blending step S1, the blending is carried out in two stages. First, in one mixing step S11, any one of tantalum nitride and cerium oxide is blended in such a manner as to have the formula: Si 6-z Al z O z N 8-z (0.3≦z≦1.0) or Both with aluminum nitride and aluminum oxide.

其次,於二次摻合步驟S12中,對一次摻合步驟S11中摻合之原料摻合β賽隆粉末與氧化銪及銪鹽中任一者或兩者。此時摻合之β賽隆粉末係使用為通式:Si6-zAlzOzN8-z(0.3≦z≦1.0)者。 Next, in the secondary blending step S12, the raw material blended in the primary blending step S11 is blended with either or both of the β-sialon powder and the cerium oxide and the phosphonium salt. The β-sialon powder blended at this time was used as a compound of the formula: Si 6-z Al z O z N 8-z (0.3≦z≦1.0).

於二次摻合步驟S12中β賽隆粉末的摻合比,較佳為相對於一次摻合步驟後之原料100質量%係將其設為5~30質量%。β賽隆粉末的摻合量若過少,則無法充分獲得β賽隆粉末之添加功效。另一方面,β賽隆粉末的摻合量若過多,則會有β賽隆粉末的晶粒成長變得過多,且所製造之β賽隆粒子的成長變小之傾向。 The blending ratio of the β-sialon powder in the secondary blending step S12 is preferably 5 to 30% by mass based on 100% by mass of the raw material after the primary blending step. If the blending amount of the β-sialon powder is too small, the addition effect of the β-sialon powder cannot be sufficiently obtained. On the other hand, if the amount of the β-sialon powder is too large, the crystal grain growth of the β-sialon powder tends to be excessive, and the growth of the produced β-sialon particles tends to be small.

於二次摻合步驟S12中氧化銪及銪鹽中任一者或兩者的摻合比(以下稱為銪比率),較佳為相對於氧化物、氧化銪及銪鹽的總摻合量係設為使其成為0.33~0.50。 The blending ratio of any one or both of cerium oxide and cerium salt in the secondary blending step S12 (hereinafter referred to as cerium ratio) is preferably a total blending amount with respect to oxide, cerium oxide and cerium salt. It is set to be 0.33 to 0.50.

後述之燒成步驟S2的初期階段中,原料中的 氧化物會形成液相,且Si3N4或AlN會溶解於該液相中,而使β賽隆析出。藉由提升此生成液相中的銪比率,可降低液相生成溫度並降低燒成溫度。藉由此燒成溫度的降低,能抑制二次摻合步驟S12中摻合之β賽隆粉末的分解,並抑制所得之β賽隆中之晶格缺陷的生成,而防止螢光特性的降低。 In the initial stage of the calcination step S2 described later, the oxide in the raw material forms a liquid phase, and Si 3 N 4 or AlN is dissolved in the liquid phase to precipitate β-Sialon. By raising the enthalpy ratio in the resulting liquid phase, the liquid phase formation temperature can be lowered and the firing temperature can be lowered. By the reduction in the firing temperature, the decomposition of the β-sialon powder blended in the secondary blending step S12 can be suppressed, and the formation of the lattice defects in the obtained β-Sialon can be suppressed, and the decrease in the fluorescence characteristics can be prevented. .

再者,透過提升銪比率,亦可促進銪對β賽隆中的固溶,並提高所得之賽隆中的螢光特性。銪比率若過低,則降低液相生成溫度之功效會變得不充分,且難以進行低溫燒成。另一方面,銪比率若過高,則即使降低液相生成溫度亦恐因過度生成液相而殘留複合氧化物為異相進而招致螢光特性的降低。 Furthermore, by increasing the enthalpy ratio, it is also possible to promote the solid solution in the β-Sialon and improve the fluorescence characteristics in the obtained Sialon. If the ruthenium ratio is too low, the effect of lowering the liquid phase formation temperature becomes insufficient, and it is difficult to perform low-temperature baking. On the other hand, if the ruthenium ratio is too high, even if the liquid phase formation temperature is lowered, the liquid phase may be excessively formed, and the composite oxide may remain as a hetero phase and cause a decrease in fluorescence characteristics.

就前述之摻合步驟S1(一次摻合步驟S11、二次摻合步驟S12)中之混合方法而言,其有:乾式混合方法、在實質上不與原料各成分反應之不活性溶劑中進行濕式混合後去除溶劑之方法。用於混合之裝置,並無特別限定,可使用V型混合機、滾動型混合機(rocking mixer)、球磨機、振動磨等習知裝置。 In the mixing method of the aforementioned blending step S1 (primary blending step S11, secondary blending step S12), there is a dry mixing method in which an inert solvent which does not substantially react with each component of the raw material is used. A method of removing the solvent after wet mixing. The apparatus for mixing is not particularly limited, and a conventional apparatus such as a V-type mixer, a rolling mixer, a ball mill, or a vibration mill can be used.

本實施形態之β賽隆之製造方法中,由於係以2階段進行摻合步驟,故可抑制異相生成並抑制粒子間燒結的發生。具體而言,由於二次摻合步驟S12中會添加β賽隆粉末,故可抑制於後述之燒成步驟S2中粒子間的燒結。藉此可抑制晶格缺陷的生成,並抑制所得之β賽隆之螢光特性的降低。 In the method for producing β-Sialon according to the present embodiment, since the blending step is performed in two stages, generation of heterogeneous phase can be suppressed and occurrence of sintering between particles can be suppressed. Specifically, since the β-sialon powder is added in the secondary blending step S12, sintering between the particles in the firing step S2 described later can be suppressed. Thereby, the formation of lattice defects can be suppressed, and the decrease in the fluorescence characteristics of the obtained β-Sialon can be suppressed.

<燒成步驟S2> <Burning step S2>

燒成步驟S2中,係將摻合步驟S1後之原料進行燒成而得到β賽隆。用以於燒成步驟S2中收納原料之容器,通常係使用氮化硼等燒成時不與原料反應之材質。燒成步驟S2的條件雖可視原料之組成等等來作適當選擇,但為了防止燒成步驟時雜質的混入,較佳為在氮氣氣體環境下,且為了燒成反應的校正化,較佳為在1820~2050℃的範圍內進行。 In the baking step S2, the raw material after the blending step S1 is fired to obtain β-sialon. The container for storing the raw material in the firing step S2 is usually a material that does not react with the raw material when it is fired by using boron nitride or the like. Although the conditions of the baking step S2 can be appropriately selected depending on the composition of the raw material, etc., in order to prevent the incorporation of impurities during the firing step, it is preferred to adjust the calcination reaction in a nitrogen gas atmosphere. It is carried out in the range of 1820 to 2050 °C.

燒成溫度更佳為1900~1980℃。其原因為,燒成溫度若過低,則會有難以進行β賽隆之晶粒成長的傾向,若過高則會增大晶粒成長過程中生成之晶格缺陷量,且晶格缺陷會吸收可見光而有使螢光特性降低的傾向。 The firing temperature is preferably from 1900 to 1980 °C. The reason is that if the firing temperature is too low, it tends to be difficult to grow the crystal grains of β-Sialon. If it is too high, the amount of lattice defects generated during grain growth is increased, and lattice defects are absorbed. Visible light has a tendency to lower the fluorescence characteristics.

燒成步驟S2較佳為在氣壓為0.1~10MPa的條件下進行。其原因為,燒成時的氣壓若過低,則有時會引起原料氮化物或事先含有於原料中之β賽隆粉末的分解,若過高則會增大對裝置的負擔。為了防止燒成步驟時雜質的混入,燒成步驟S2較佳為在真空中,或氮氣或者氬氣等不活性氣體環境中進行。 The baking step S2 is preferably carried out under the conditions of a gas pressure of 0.1 to 10 MPa. The reason for this is that if the gas pressure at the time of firing is too low, decomposition of the raw material nitride or the β-sialon powder previously contained in the raw material may occur, and if it is too high, the burden on the device may increase. In order to prevent the incorporation of impurities during the firing step, the firing step S2 is preferably carried out in a vacuum or in an inert gas atmosphere such as nitrogen or argon.

<粒度調整步驟> <granularity adjustment step>

於本實施形態之β賽隆之製造方法中,為謀求β賽隆彼此的均等性,較佳為在燒成步驟S2之後進行粒度調整步驟,其藉由粉碎及分級中任一者或兩者,而將平均粒徑設為30μm以下。 In the method for producing β-Sialon according to the present embodiment, in order to achieve the uniformity of β-Sialon, it is preferable to perform a particle size adjustment step after the baking step S2, which is performed by either or both of pulverization and classification. The average particle diameter is set to 30 μm or less.

粉碎的方法並無特別限定,但例如有:將經燒成之β賽隆利用球磨機、振動磨及噴射磨機等粉碎機粉 碎至既定粒度之方法。又,分級的方法亦並無特別限定,但例如有:僅將經燒成之β賽隆中通過20~45μm以下網眼之篩者進行分離.回收之方法。 The method of pulverization is not particularly limited, and for example, the pulverized powder such as a ball mill, a vibration mill, and a jet mill is used for the fired β-Sialon. A method of breaking to a given particle size. Further, the method of classification is not particularly limited, but for example, only the sieved β-Sialon is passed through a sieve of 20 to 45 μm or less. The method of recycling.

<熱處理步驟> <heat treatment step>

於本實施形態之β賽隆之製造方法中,較佳為對燒成步驟S2後或粒度調整步驟後的β賽隆進行熱處理步驟,其將之保持在1300℃以上且燒成步驟S2時之燒成溫度以下的溫度條件下。藉由進行此熱處理步驟,可使存在於β賽隆中且阻礙可見光發光之晶格缺陷或第二相成為可溶於酸之狀態。 In the method for producing β-Sialon according to the present embodiment, it is preferred to subject the β-Sialon after the baking step S2 or the particle size adjusting step to a heat treatment step of maintaining the temperature at 1300° C. or higher and the firing step S2. Under the temperature conditions below the temperature. By performing this heat treatment step, a lattice defect existing in the β-Sialon and hindering the visible light emission or the second phase can be made to be in an acid-soluble state.

此時,熱處理步驟時的溫度若過低,則缺陷去除的功效有變低之傾向,過高亦有功效達到上限而無法再提升之傾向。又,熱處理步驟可在選自氮氣、氨氣、氫氣及鈍氣中之1種氣體或者2種以上的混和氣體環境中,或在真空中進行。 At this time, if the temperature at the heat treatment step is too low, the effect of the defect removal tends to be low, and if the temperature is too high, the effect is too high to be promoted. Further, the heat treatment step may be carried out in a gas selected from the group consisting of nitrogen gas, ammonia gas, hydrogen gas, and inert gas, or two or more mixed gas atmospheres, or in a vacuum.

熱處理步驟時的溫度及處理時間,較佳為使其為β賽隆在波長為650~800nm時的平均擴散反射率較熱處理步驟前更降低10~50%之條件。其原因為,熱處理步驟所致之平均擴散反射率的降低若較10%還少,則可見光發光阻礙因子的狀態變化會變小,而使此處理所致之特性提升功效變小。又,其原因為,平均擴散反射率的降低若大於50%,由於會伴隨正常的β賽隆結晶的分解故不佳。 The temperature and the treatment time in the heat treatment step are preferably such that the average diffusion reflectance of β-Silon at a wavelength of 650 to 800 nm is 10 to 50% lower than that before the heat treatment step. The reason for this is that if the decrease in the average diffuse reflectance due to the heat treatment step is less than 10%, the state change of the visible light ray-blocking factor becomes small, and the effect of improving the characteristics due to the treatment becomes small. Further, the reason is that if the decrease in the average diffuse reflectance is more than 50%, it is unsatisfactory due to the decomposition of the normal β-sialon crystal.

<酸處理步驟> <acid treatment step>

於本實施形態之β賽隆之製造方法中,較佳為在燒成 步驟S2後、粒度調整步驟後或熱處理步驟後進行酸處理步驟。具體而言,酸處理步驟,較佳為進行:浸漬步驟,其將β賽隆浸漬於酸溶液中;與清洗步驟,其清洗殘留於浸漬步驟後之β賽隆表面上的酸溶液。酸處理步驟係將在熱處理步驟中發生變化之發光阻礙因子溶解去除之步驟,藉由進行此步驟,可提升β賽隆的螢光特性。 In the method for producing β-Sialon according to the embodiment, it is preferably baked. The acid treatment step is performed after the step S2, after the particle size adjustment step or after the heat treatment step. Specifically, the acid treatment step is preferably carried out by: a dipping step of immersing β-sialon in an acid solution; and a washing step of washing the acid solution remaining on the surface of the β-sialon after the impregnation step. The acid treatment step is a step of dissolving and removing the luminescence hindrance factor which changes during the heat treatment step, and by performing this step, the fluorescence characteristics of the β-Sialon can be improved.

就酸處理步驟中所用之酸而言,可列舉氫氟酸、硫酸、磷酸、鹽酸及硝酸中任1種或2種以上的混和物,此等酸可以水溶液的形態使用。就浸漬步驟的實施方法而言,例如有將熱處理步驟後的β賽隆分散至上述含有酸之水溶液中並攪拌數分鐘至數小時左右而使其反應之方法。浸漬步驟中酸的溫度並無特別限定,可適當選擇室溫、加熱至室溫以上之溫度、50~80℃等。為了去除酸,會將浸漬步驟後的β賽隆以過濾器分離酸之後進行水洗(清洗步驟)。 The acid used in the acid treatment step may be any one or a mixture of two or more of hydrofluoric acid, sulfuric acid, phosphoric acid, hydrochloric acid, and nitric acid, and these acids may be used in the form of an aqueous solution. In the method of carrying out the impregnation step, for example, a method in which the β-sialon after the heat treatment step is dispersed in the above-mentioned aqueous solution containing an acid and stirred for several minutes to several hours is used. The temperature of the acid in the impregnation step is not particularly limited, and may be appropriately selected from room temperature, heated to room temperature or higher, and 50 to 80 ° C. In order to remove the acid, the β-Sialon after the impregnation step is subjected to water washing after the acid is separated by a filter (washing step).

如上詳述,本實施形態之β賽隆,由於將以通式:Si6-zAlzOzN8-z表示之賽隆的z值設為0.3~1.0之範圍,同時以2階段進行摻合步驟,並於二次摻合步驟中添加β賽隆粉末,故可不降低發光效率而使波鋒波長位移至較以往更長波長側。其結果,可一邊維持作為發光效率之外部量子效率為55%以上,一邊實現波鋒波長在大於545nm且555nm以下之範圍的β賽隆。 As described in detail above, in the β-Sialon of the present embodiment, the z value of the sialon represented by the general formula: Si 6-z Al z O z N 8-z is in the range of 0.3 to 1.0, and is carried out in two stages. The blending step and the addition of the β-sialon powder in the secondary blending step can shift the wavefront wavelength to a longer wavelength side than before without lowering the luminous efficiency. As a result, it is possible to realize β-sialon having a wave front wavelength of more than 545 nm and 555 nm or less while maintaining the external quantum efficiency as the luminous efficiency of 55% or more.

(第2實施形態) (Second embodiment)

其次,針對本發明第2實施形態之該發光裝置進行說明。圖2係顯示本實施形態之發光裝置之構成的模式圖。 如圖2所示,本實施形態之發光裝置1,其具備:發光元件2與搭載於發光元件之發光面的螢光體3,且於螢光體3之一部分或全部中係使用前述之第1實施形態之β賽隆。 Next, the light-emitting device according to the second embodiment of the present invention will be described. Fig. 2 is a schematic view showing the configuration of a light-emitting device of the embodiment. As shown in FIG. 2, the light-emitting device 1 of the present embodiment includes a light-emitting element 2 and a phosphor 3 mounted on a light-emitting surface of the light-emitting element, and the above-described first part is used in part or all of the phosphor 3 1 embodiment of the beta cello.

就發光元件2而言,可使用紫外線發光二極體(UV-LED)及藍色發光二極體(藍色LED)等各種LED、螢光體燈及雷射二極體(LD)等,較佳為LED。又,就螢光體3而言,雖可僅使用前述之第1實施形態之β賽隆,但亦可組合使用紅色發光螢光體、橙色發光螢光體、黃色發光螢光體、綠色發光螢光體及藍色發光螢光體等。藉此可調整作為發光裝置之發光色。 As the light-emitting element 2, various LEDs such as an ultraviolet light-emitting diode (UV-LED) and a blue light-emitting diode (blue LED), a phosphor lamp, and a laser diode (LD) can be used. It is preferably an LED. Further, in the case of the phosphor 3, only the above-described β-sialon according to the first embodiment may be used, but a red-emitting phosphor, an orange-emitting phosphor, a yellow-emitting phosphor, and a green light may be used in combination. Fluorescent body and blue luminescent phosphor. Thereby, the illuminating color as the illuminating means can be adjusted.

本實施形態之發光裝置1,係在引線框架4上搭載發光元件2,並利用使螢光體分散而成之封裝樹脂5將發光元件2封裝在引線框架4上的框體8中。發光元件2係利用接合引線6連接至其他引線框架7。 In the light-emitting device 1 of the present embodiment, the light-emitting element 2 is mounted on the lead frame 4, and the light-emitting element 2 is sealed in the frame 8 of the lead frame 4 by the sealing resin 5 obtained by dispersing the phosphor. The light-emitting element 2 is connected to the other lead frame 7 by the bonding wires 6.

本實施形態之發光裝置1,係由發光元件2射出波長為350~500nm之從紫外線至紫、藍、綠的可見光為激發光,來照射由β賽隆等構成之螢光體3。藉由激發光的照射,β賽隆會發出在大於545nm且555nm以下之波長域具有波峰之光。本實施形態之發光裝置1所用之β賽隆的發光,由於其外部量子效率為55%以上,因此可使本實施形態之發光裝置1具有高發光強度。 In the light-emitting device 1 of the present embodiment, the light-emitting element 2 emits visible light from ultraviolet rays to violet, blue, and green light having a wavelength of 350 to 500 nm as excitation light, and irradiates the phosphor 3 composed of β-Sialon or the like. By the irradiation of the excitation light, the β-Sialon emits light having a peak in a wavelength region of more than 545 nm and 555 nm or less. Since the external quantum efficiency of the β-sialon used in the light-emitting device 1 of the present embodiment is 55% or more, the light-emitting device 1 of the present embodiment can have high luminous intensity.

[實施例] [Examples]

以下,將列舉本發明之實施例及比較例來針對本發明之功效進行說明。 Hereinafter, the effects of the present invention will be described by way of examples and comparative examples of the present invention.

(第1實施例) (First embodiment)

第1實施例中,係以下述所示之方法製造β賽隆,並評估其特性。實施例及比較例之β賽隆之構成及評估結果示於下述表1。 In the first embodiment, β-Sialon was produced by the method shown below, and its characteristics were evaluated. The composition and evaluation results of the β-Sialon of the examples and the comparative examples are shown in Table 1 below.

表1所示之β賽隆的通式中之z值係原料摻合時之值,其為目標值。另外,表1中,z值之值相同之實施例1與比較例2,雖然其組成分析值的Al含量或氧含量不同,但此係由於燒成步驟中原料之一部分發生揮發,或由於無法完全固溶於β賽隆的結晶所殘留之相在其後之熱處理步驟或酸處理步驟中透過酸處理被去除了之緣故。 The z value in the formula of β-Sialon shown in Table 1 is the value at the time of blending the raw materials, which is a target value. Further, in Table 1, in Example 1 and Comparative Example 2, in which the values of z are the same, although the Al content or the oxygen content of the composition analysis values are different, this is because a part of the raw material is volatilized in the firing step, or The phase remaining in the crystal which is completely dissolved in the β-Sialon is removed by the acid treatment in the subsequent heat treatment step or acid treatment step.

<螢光光譜> <fluorescence spectrum>

表1所示之螢光光譜的波鋒波長係利用分光光度計(大塚電子公司製MCPD-7000)而以下述方法測定。首先,將實施例及比較例之各β賽隆(以下稱為試料)填充於凹型的測定槽以使其表面變平滑,並裝上積分球。其次, 對此積分球利用光纖維導入從發光光源的Xe燈分光成波長為455nm的藍色光。將此藍色光作為激發源來照射試料,並利用分光光度計(大塚電子公司製MCPD-7000)進行試料之螢光及反射光光譜的測定。由所得到之得螢光光譜求出波鋒波長。 The wave front wavelength of the fluorescence spectrum shown in Table 1 was measured by the following method using a spectrophotometer (MCPD-7000 manufactured by Otsuka Electronics Co., Ltd.). First, each of the β-Sialon (hereinafter referred to as a sample) of the examples and the comparative examples was filled in a concave measuring tank to smooth the surface thereof, and an integrating sphere was attached. Secondly, The integrating sphere was introduced into the blue light having a wavelength of 455 nm by the Xe lamp of the light-emitting source by the optical fiber. The sample was irradiated with the blue light as an excitation source, and the fluorescence of the sample and the spectrum of the reflected light were measured by a spectrophotometer (MCPD-7000 manufactured by Otsuka Electronics Co., Ltd.). The wave front wavelength was obtained from the obtained fluorescence spectrum.

<繞射射線強度> <Diffraction Ray Intensity>

表1所示之繞射射線強度,係透過粉末X射線繞射法測定(101)面的繞射射線強度,並將β賽隆之(101)面的繞射射線強度作為100%而算出之值。另外,表1所示之「無異相」,係指相對於β賽隆(101)面的繞射射線強度顯示為0.0%。 The diffraction ray intensity shown in Table 1 is obtained by measuring the intensity of the diffraction ray of the (101) plane by the powder X-ray diffraction method, and calculating the diffraction ray intensity of the (101) plane of the β-Silon as 100%. . In addition, "no out of phase" shown in Table 1 means that the intensity of the diffraction ray with respect to the surface of the β-Sialon (101) is 0.0%.

<平均粒徑> <Average particle size>

表1所示之平均粒徑,係利用粒度分布測定裝置而透過由雷射繞射.散射法進行粒徑分布測定所得到之體積基準之積算分率中的50%粒徑(D50)。 The average particle diameter shown in Table 1 is transmitted by laser diffraction using a particle size distribution measuring device. The scattering method performed 50% of the particle diameter (D50) in the integrated fraction of the volume basis obtained by the particle size distribution measurement.

<組成分析值中之Al、Eu及氧含量> <Al, Eu and oxygen content in the composition analysis value>

表1所示之組成分析值中之Al及Eu之值,係將實施例及比較例之各β賽隆的粉末透過鹼溶解法使其溶解後,利用ICP發光分光分析裝置(Rigaku股份有限公司製CIROS-120)測定之Al含量及Eu含量。表1所示之組成分析值中的氧之值,係利用氧氮分析裝置(堀場製作所製EMGA-920)測定之氧含量。 The values of Al and Eu in the compositional analysis values shown in Table 1 were obtained by dissolving the powder of each β-Sialon of the examples and the comparative examples by an alkali dissolution method, and then using an ICP emission spectroscopic analyzer (Rigaku Co., Ltd.) Determination of Al content and Eu content by CIROS-120). The value of oxygen in the compositional analysis values shown in Table 1 is the oxygen content measured by an oxygen-nitrogen analyzer (EMGA-920, manufactured by Horiba, Ltd.).

<外部量子效率> <External quantum efficiency>

在試料部設置反射率為99%的標準反射板(Labsphere公司製Spectralon),並測定分光成波長為 455nm之激發光的光譜,以從450~465nm之波長範圍的光譜算出激發光光子數(Qex)。在試料部設置測定標的之β賽隆,並以分光成波長為455nm之藍色光照射β賽隆,以從所得到之光譜數據算出激發反射光光子數(Qref)及螢光光子數(Qem)。 A standard reflection plate (Spectralon manufactured by Labsphere) with a reflectance of 99% was set in the sample portion, and the wavelength was measured to be wavelength. The spectrum of the excitation light of 455 nm calculates the number of excitation photons (Qex) from the spectrum in the wavelength range of 450 to 465 nm. The measurement target is provided with β-Sialon, and the β-Silon is irradiated with blue light having a wavelength of 455 nm to calculate the number of photons (Qref) and the number of fluorescent photons (Qem) of the excited reflected light from the obtained spectral data. .

激發反射光光子數係以與激發光光子數相同之波長範圍,而螢光光子數係以465~800nm之範圍算出。從所得到之3種類的光子數求出外部量子效率(=Qem/Qex×100)。 The number of excitation-reflected photons is in the same wavelength range as the number of excitation photons, and the number of fluorescent photons is calculated in the range of 465 to 800 nm. The external quantum efficiency (=Qem/Qex×100) was obtained from the number of photons of the three types obtained.

[實施例1] [Example 1]

依照前述第1實施形態之β賽隆之製造方法,來以使其成為通式:Si6-zAlzOzN8-z(z=0.5)之方式摻合氮化矽與氮化鋁與氧化物,而製造實施例1之β賽隆。 According to the method for producing β-Sialon according to the first embodiment, the tantalum nitride and the aluminum nitride are blended in such a manner as to have a general formula: Si 6-z Al z O z N 8-z (z=0.5). The oxide was used to produce the β-Sialon of Example 1.

<二次摻合步驟中所用之β賽隆粉末的製造> <Manufacture of β-sialon powder used in the secondary blending step>

首先,以下述所示之方法及條件製造二次摻合步驟中所用之β賽隆粉末。原料係使用:95.43質量%之宇部興產股份有限公司製α型氮化矽粉末(SN-E10 grade:氧含量1.0質量%)、3.04質量%之Tokuyama股份有限公司製氮化鋁粉末(E grade:氧含量0.9質量%)、0.74質量%之大明化學股份有限公司製氧化鋁粉末(TM-DAR grade)、及0.79質量%之信越化學工業股份有限公司製氧化銪粉末(RU grade)。 First, the β-sialon powder used in the secondary blending step was produced by the methods and conditions shown below. Raw material used: 95.43% by mass of α-type tantalum nitride powder (SN-E10 grade: oxygen content 1.0% by mass) and 3.04% by mass of aluminum nitride powder manufactured by Tokuyama Co., Ltd. (E grade) : an oxygen content of 0.9% by mass), 0.74% by mass of alumina powder (TM-DAR grade) manufactured by Daming Chemical Co., Ltd., and 0.79 mass% of ruthenium oxide powder (RU grade) manufactured by Shin-Etsu Chemical Co., Ltd.

將此等原料利用V型混合機(筒井理化學器械股份有限公司製S-3)混合後,為了去除凝集物,將通過網眼500μm之篩者進行分離.回收。將經回收之β賽隆粉 末的原料填充於附有蓋子的圓筒型氮化硼製容器(電氣化學工業股份有限公司製N-1 grade),並以碳製加熱器之電爐而在0.8MPa之加壓氮氣氣體環境中,以2000℃進行15小時的燒成處理而得到β賽隆。 These raw materials were mixed by a V-type mixer (S-3 manufactured by Tsutsui Chemical Instruments Co., Ltd.), and in order to remove agglomerates, they were separated by a sieve of 500 μm. Recycling. Recycled beta sialon powder The raw material of the last is filled in a cylindrical boron nitride container (N-1 grade made by Electric Chemical Industry Co., Ltd.) with a lid, and is heated in a pressurized nitrogen gas atmosphere of 0.8 MPa in an electric furnace of a carbon heater. The sample was subjected to a calcination treatment at 2000 ° C for 15 hours to obtain β-Sialon.

將所得到之β賽隆透過戴上乾淨橡皮手套之人手碎解。將經碎解之β賽隆透過超音速噴射粉碎器(日本Pneumatic工業公司製PJM-80SP)粉碎。粉碎條件,係將試料供給速度設為50g/分鐘,粉碎空氣壓力設為0.3MPa。將所得到之粉碎粉末作為於二次摻合步驟中作為原料使用的β賽隆粉末。 The resulting β-Saron was broken by the hands of a clean rubber glove. The disintegrated β-Sialon was pulverized by a supersonic jet pulverizer (PJM-80SP manufactured by Pneumatic Industries, Japan). The pulverization conditions were such that the sample supply rate was 50 g/min, and the pulverization air pressure was set to 0.3 MPa. The obtained pulverized powder was used as a β-sialon powder used as a raw material in the secondary blending step.

<β賽隆之製造方法> <Method of manufacturing β-Sialon>

其次,就原料而言,係使用:78.45質量%之宇部興產股份有限公司製α型氮化矽粉末(SN-E10 grade:氧含量1.0質量%)、3.51質量%之Tokuyama股份有限公司製氮化鋁粉末(E grade:氧含量0.9質量%)、3.39質量%之大明化學股份有限公司製氧化鋁粉末(TM-DAR grade)、1.74質量%之信越化學工業股份有限公司製氧化銪粉末(RU grade)、及12.91質量%之以前述之方法及條件所製造之原料β賽隆粉末。 Next, in the case of the raw material, the α-type tantalum nitride powder (SN-E10 grade: oxygen content 1.0 mass%) manufactured by Ube Hiroshi Co., Ltd., which is 78.45 mass%, and the nitrogen produced by Tokuyama Co., Ltd. of 3.51 mass% are used. Aluminum oxide powder (E grade: oxygen content: 0.9% by mass), 3.39 mass% of alumina powder (manufactured by Daming Chemical Co., Ltd.), and 1.74% by mass of yttrium oxide powder manufactured by Shin-Etsu Chemical Co., Ltd. (RU) Grade) and 12.91% by mass of the raw material β-sialon powder produced by the above methods and conditions.

將此等原料利用V型混合機(筒井理化學器械股份有限公司製S-3)混合後,使其全部通過網眼500μm之篩而去除凝集物。此時之摻合比在β賽隆之通式:Si6-zAlzOzN8-z中,除了氧化銪與原料賽隆之外係設計成z=0.5。又,銪比率(表1之Eu2O3/氧化物)相對於氧化物的比例係0.34質量%。 These raw materials were mixed by a V-type mixer (S-3 manufactured by Tsutsui Chemical Instruments Co., Ltd.), and all of them were passed through a sieve of 500 μm mesh to remove aggregates. At this time, the blending ratio is in the formula of β-Sialon: Si 6-z Al z O z N 8-z , except that the cerium oxide and the raw material Sialon are designed to have z=0.5. Further, the ratio of the cerium ratio (Eu 2 O 3 /oxide of Table 1) to the oxide was 0.34% by mass.

接下來,對全部通過篩並予以回收之β賽隆的原料進行燒成步驟。燒成步驟中,係將原料填充於附有蓋子的圓筒型氮化硼製容器,並以碳製加熱器之電爐而在0.8MPa之加壓氮氣氣體環境中,以1900℃進行15小時的加熱處理。將透過燒成步驟所得到之β賽隆以戴上乾淨橡皮手套之人手碎解。 Next, the raw material of the β-Sialon which was all sieved and recovered was subjected to a baking step. In the calcination step, the raw material was filled in a cylindrical boron nitride container with a lid, and was subjected to an electric furnace of a carbon heater at 1900 ° C for 15 hours in a pressurized nitrogen gas atmosphere of 0.8 MPa. Heat treatment. The β-Sialon obtained through the firing step is broken by a person wearing a clean rubber glove.

將碎解後的β賽隆透過超音速噴射粉碎器,以試料供給速度為50g/分鐘,粉碎空氣壓力為0.5MPa的條件進行粉碎處理,再以粒度分布調整步驟而進行利用氣流分級機之分級處理,來去除微粉。此時,分級條件,係將試料供給速度設為50g/分鐘,分級風量設為2.0m/m3,轉數設為2000rpm。 The disintegrated β-Sialon was passed through a supersonic jet pulverizer, and the pulverization treatment was carried out under the conditions of a sample supply speed of 50 g/min and a pulverization air pressure of 0.5 MPa, and the classification by the air flow classifier was carried out by the particle size distribution adjustment step. Process to remove micronized powder. At this time, the classification conditions were such that the sample supply rate was 50 g/min, the classification air volume was 2.0 m/m 3 , and the number of revolutions was 2000 rpm.

對經碎解並分級後的β賽隆進行熱處理步驟。熱處理步驟中,係將所得到之粉碎粉末填充於附有蓋子的圓筒型氮化硼製容器,並以碳製加熱器之電爐而在大氣壓氬氣氣體環境中,以1500℃進行8小時的熱處理。熱處理步驟前之β賽隆的顏色係淡黃色,但熱處理步驟後之β賽隆粉末的顏色會變化為深綠色。 The heat-treated step of the fragmented and classified β-Sialon is performed. In the heat treatment step, the obtained pulverized powder is filled in a cylindrical boron nitride container with a lid, and is subjected to an electric furnace of a carbon heater at 1500 ° C for 8 hours in an atmospheric pressure argon gas atmosphere. Heat treatment. The color of the β-Sialon before the heat treatment step is pale yellow, but the color of the β-sialon powder after the heat treatment step changes to dark green.

再者,對熱處理步驟後的β賽隆進行酸處理步驟。酸處理步驟中,係將β賽隆浸漬於將50質量%之氫氟酸與70質量%之硝酸以質量比1:1混合之混酸(液溫80℃)中1小時。其後,將浸漬於混酸之β賽隆進行過濾、水洗及乾燥。 Further, an acid treatment step is performed on the β-Sialon after the heat treatment step. In the acid treatment step, β-sialon was immersed in a mixed acid (liquid temperature: 80 ° C) in which 50% by mass of hydrofluoric acid and 70% by mass of nitric acid were mixed at a mass ratio of 1:1 for 1 hour. Thereafter, the β-sialon immersed in the mixed acid was filtered, washed with water, and dried.

藉此,而得到使Eu2+固溶於以通式:Si6-zAlzOzN8-z(z=0.50),即Si5.5Al0.5O0.5N7.5所示之β賽隆 而成之實施例1之β賽隆。實施例1之β賽隆,其Al含量為2.8質量%,Eu含量為0.8質量%,氧含量為1.589質量%,且平均粒徑為21.86μm。 Thereby, Eu 2+ is dissolved in the formula: Si 6-z Al z O z N 8-z (z = 0.50), that is, Si 5.5 Al 0.5 O 0.5 N 7.5 is shown as β sialon. The β-Sialon of Example 1 was formed. The β-Sialon of Example 1 had an Al content of 2.8% by mass, an Eu content of 0.8% by mass, an oxygen content of 1.589% by mass, and an average particle diameter of 21.86 μm.

實施例1之賽隆,當以波長455nm的光激發時之螢光光譜的波鋒波長為552nm,外部量子效率為66%,可不降低發光效率並使波鋒波長在大於545nm且555nm以下之範圍。再者,實施例1之β賽隆,經確認為:利用粉末X射線繞射法測定之β賽隆以外之結晶相的繞射射線強度,相對於β賽隆(101)面的繞射射線強度係0%,且未含有異相。 In the Sialon of Example 1, when the wavelength of 455 nm is excited, the fluorescence spectrum has a wave front wavelength of 552 nm and an external quantum efficiency of 66%, which does not lower the luminous efficiency and allows the wave front wavelength to be greater than 545 nm and 555 nm or less. . Further, the β-Sialon of Example 1 was confirmed to be a diffraction ray intensity of a crystal phase other than β-Sialon measured by a powder X-ray diffraction method, and a diffraction ray with respect to the β-Sialon (101) plane. The strength is 0% and does not contain a heterogeneous phase.

(實施例2) (Example 2)

如表1所示,除了以使z值成為0.7之方式摻合原料以外,係以與前述之實施例1之β賽隆相同之方法及條件製造實施例2之β賽隆。實施例2之β賽隆,其波鋒波長及外部量子效率係與實施例1之β賽隆相同。 As shown in Table 1, except that the raw material was blended so that the z value became 0.7, the β-Sialon of Example 2 was produced by the same method and conditions as those of the above-described Example 1 of β-Sialon. The β-Sialon of Example 2 has the same wave front wavelength and external quantum efficiency as the β-Sialon of Example 1.

(實施例3) (Example 3)

如表1所示,除了以使z值成為0.3之方式摻合原料以外,係以與前述之實施例1之β賽隆相同之方法及條件製造實施例3之β賽隆。實施例3之β賽隆,相較於實施例1之β賽隆,雖其波鋒波長及外部量子效率有降低,但均為沒有問題之範圍。 As shown in Table 1, except that the raw material was blended so that the z value became 0.3, the β-Sialon of Example 3 was produced by the same method and conditions as those of the above-described Example 1 of β-Sialon. The β-Sialon of Example 3 has a lower wavelength and external quantum efficiency than the β-Sialon of Example 1, but has no problem.

(實施例4) (Example 4)

如表1所示,除了以使z值成為1.0之方式摻合原料以外,係以與前述之實施例1之β賽隆相同之方法及條件製造實施例4之β賽隆。實施例4之β賽隆,相較於實施例1 之β賽隆,雖其波鋒波長變高且外部量子效率有降低,但均為沒有問題之範圍。 As shown in Table 1, except that the raw material was blended so that the z value became 1.0, the β-Sialon of Example 4 was produced by the same method and conditions as those of the above-described Example 1 of β-Sialon. The β-Sialon of Example 4 is compared to Example 1 The β-Sialon has a wavefront wavelength that is high and the external quantum efficiency is reduced, but there is no problem.

(實施例5) (Example 5)

如表1所示,除了以使z值成為0.7,銪比率成為0.27質量%之方式摻合原料以外,係以與前述之實施例1之β賽隆相同之方法及條件製造實施例5之β賽隆。實施例5之β賽隆,其波鋒波長大於545nm且外部量子效率達到55%。 As shown in Table 1, except that the raw material was blended so that the z value was 0.7 and the ruthenium ratio was 0.27% by mass, the β of Example 5 was produced by the same method and conditions as those of the above-described Example 1 of β-Sialon. Saone. The β-Sialon of Example 5 has a wave front wavelength of more than 545 nm and an external quantum efficiency of 55%.

(比較例1) (Comparative Example 1)

如表1所示,除了以使z值成為0.2之方式摻合原料以外,係以與前述之實施例1之β賽隆相同之方法及條件製造比較例1之β賽隆。比較例1之β賽隆,其波鋒波長係541nm而等同於以往,且外部量子效率亦未達到55%。 As shown in Table 1, except that the raw material was blended so that the z value became 0.2, the β-Sialon of Comparative Example 1 was produced by the same method and conditions as those of the above-described Example 1 of β-Sialon. The β-Sialon of Comparative Example 1 has a wave front wavelength of 541 nm and is equivalent to the conventional one, and the external quantum efficiency is also less than 55%.

(比較例2) (Comparative Example 2)

如表1所示,除了原料未使用賽隆粉末以外,係以與前述之實施例1之β賽隆相同之方法及條件製造比較例2之β賽隆。比較例2之β賽隆,其波鋒波長雖與實施例1之β賽隆相同,但外部量子效率係44%,其相較於實施例1之β賽隆而言係為大幅低落者。 As shown in Table 1, β-Silon of Comparative Example 2 was produced in the same manner and under the same conditions as in the above-described Example 1 of β-Silon except that the raw material was not used. In the β-Sialon of Comparative Example 2, the wave front wavelength was the same as that of the β-Sialon of Example 1, but the external quantum efficiency was 44%, which was significantly lower than that of the β-Sialon of Example 1.

(比較例3) (Comparative Example 3)

如表1所示,除了以使z值成為1.2,銪比率成為0.41質量%之方式摻合原料以外,係以與前述之實施例1之β賽隆相同之方法及條件製造比較例3之β賽隆。比較例3之β賽隆,其使波鋒波長位移至較實施例1之β賽隆再更長波長側而大於555nm,且外部量子效率未達到55%。 As shown in Table 1, except that the raw material was blended so that the z value was 1.2 and the ruthenium ratio was 0.41% by mass, the β of Comparative Example 3 was produced by the same method and conditions as those of the above-described Example 1 of β-Sialon. Saone. The β-Sialon of Comparative Example 3 shifted the wave front wavelength to the longer wavelength side than the β-sialon of Example 1 and was larger than 555 nm, and the external quantum efficiency did not reach 55%.

由上述結果:z值從0.3~1.0之範圍偏離之比較例1、3,其波鋒波長係545nm以下或大於555nm,而且外部量子效率亦小於55%。 From the above results, Comparative Examples 1 and 3 in which the z value deviated from the range of 0.3 to 1.0 had a wave front wavelength of 545 nm or less or more than 555 nm, and the external quantum efficiency was also less than 55%.

圖3係實施例1之β賽隆的掃描型電子顯微鏡(SEM)像,圖4係比較例2之β賽隆的掃描型電子顯微鏡(SEM)像。如圖3及圖4所示,原料未使用賽隆粉末之比較例2之β賽隆,相較於實施例1之β賽隆,其粒子尺寸較小。相對之下,原料中添加β賽隆粉末之實施例1之β賽隆,其短徑較大,且可得到由粒子尺寸一致之柱狀粒子構成之結構,其結果可得到良好的螢光特性。 3 is a scanning electron microscope (SEM) image of β-Sialon of Example 1, and FIG. 4 is a scanning electron microscope (SEM) image of β-Sialon of Comparative Example 2. As shown in FIG. 3 and FIG. 4, the β-Sialon of Comparative Example 2 in which the raw material was not used in the Sialon powder had a smaller particle size than the β-Sialon of Example 1. In contrast, the β-Sialon of Example 1 in which the β-sialon powder was added to the raw material had a large short diameter and a structure composed of columnar particles having the same particle size, and as a result, good fluorescence characteristics were obtained. .

(第2實施例) (Second embodiment)

第2實施例中,係將前述之實施例及比較例之各β賽隆混入聚矽氧製之封裝樹脂,而搭載於藍色發光LED之發光元件表面。並使用此LED製作照明裝置。 In the second embodiment, each of the above-described examples and comparative examples of β-sialon was mixed with a sealing resin made of polyfluorene oxide, and was mounted on the surface of a light-emitting element of a blue light-emitting LED. And use this LED to make a lighting device.

其結果,使用實施例1~5之β賽隆之照明裝置,其可得到螢光體的發光波長位移至較以往的β賽隆更長波長側的發光色。相對之下,使用比較例1~3之β賽隆之照明裝置,由於其螢光體的發光波長與以往的β賽隆相同,或其發光強度小於55%,故其較使用實施例1~5之β賽隆之照明裝置係呈更暗的發光。 As a result, the illuminating device of the β-Sialon of Examples 1 to 5 was used, and the luminescent color of the phosphor was shifted to a longer wavelength side than the conventional β-Silon. In contrast, the illumination device of the β-Sialon of Comparative Examples 1 to 3 was used because the emission wavelength of the phosphor was the same as that of the conventional β-Silon, or the luminescence intensity thereof was less than 55%, so that it was used in Examples 1 to 5. The lighting device of the β-Sialon is darker.

Claims (13)

一種β賽隆之製造方法,其具有:摻合步驟,其摻合並混捏原料而使之均勻化;燒成步驟,其將摻合步驟後的原料進行燒成而得到β賽隆,該摻合步驟中係進行:一次摻合步驟,其係以使其成為通式:Si6-zAlzOzN8-z(0.3≦z≦1.0)之方式摻合氮化矽、氮化鋁及氧化物;二次摻合步驟,其將β賽隆粉末和氧化銪及銪鹽中任一者或兩者摻合於一次摻合步驟後的原料中,該一次摻合步驟中摻合的氧化物係氧化鋁及氧化矽中任一者或兩者,以使Eu2+固溶於以通式:Si6-zAlzOzN8-z(0.3≦z≦1.0)表示之β賽隆,來得到當以波長455nm的光激發時之螢光光譜的波鋒波長為大於545nm且555nm以下的β賽隆。 A method for producing β-Sialon, comprising: a blending step of mixing and kneading a raw material to homogenize; and a calcining step of calcining the raw material after the blending step to obtain β-Sialon, the blending step The middle system is carried out: a mixing step of blending tantalum nitride, aluminum nitride and an oxide in such a manner that it becomes a general formula: Si 6-z Al z OzN 8-z (0.3≦z≦1.0); a secondary blending step of blending either or both of the β-Sialon powder and the cerium oxide and the cerium salt in the raw material after the primary blending step, the oxide oxidized in the primary blending step Any one or both of aluminum and cerium oxide to dissolve Eu 2+ in β sialon represented by the general formula: Si 6-z Al z O z N 8-z (0.3≦z≦1.0) The peak wavelength of the fluorescence spectrum when excited by light having a wavelength of 455 nm is obtained as β-sialon having a wavelength of more than 545 nm and 555 nm or less. 如申請專利範圍第1項之β賽隆之製造方法,其中相對於100質量%之前述一次摻合步驟後的原料,前述二次摻合步驟中摻合5~30質量%之前述β賽隆粉末。 The method for producing β-Sialon according to the first aspect of the patent application, wherein the above-mentioned secondary blending step is blended with 5 to 30% by mass of the aforementioned β-sialon powder with respect to 100% by mass of the raw material after the one-time mixing step. . 如申請專利範圍第1或2項之β賽隆之製造方法,其中相對於前述氧化物、前述氧化銪及銪鹽的總摻合量,係將前述二次摻合步驟中氧化銪及銪鹽中任一者或兩者總計的摻合量設為0.33~0.50。 The method for producing β-Sialon according to claim 1 or 2, wherein the total blending amount of the oxide, the cerium oxide and the cerium salt is the cerium oxide and the cerium salt in the secondary admixing step. The blending amount of either or both is set to 0.33 to 0.50. 如申請專利範圍第1至3項中任一項之β賽隆之製造方 法,其中前述燒成步驟係在氮氣氣體環境下以1820~2050℃之溫度進行燒成。 For example, the manufacturer of β赛隆, which is one of the patent scopes 1 to 3 In the method, the calcination step is carried out at a temperature of 1820 to 2050 ° C in a nitrogen gas atmosphere. 如申請專利範圍第1至4項中任一項之β賽隆之製造方法,其中前述燒成步驟係將氣壓設為0.1~10MPa。 The method for producing β-Sialon according to any one of claims 1 to 4, wherein the calcination step is performed by setting the gas pressure to 0.1 to 10 MPa. 如申請專利範圍第1至5項中任一項之β賽隆之製造方法,其中於前述燒成步驟後進行粒度調整步驟,其藉由粉碎及分級中任一者或兩者,而將平均粒徑設為30μm以下。 The method for producing β-Sialon according to any one of claims 1 to 5, wherein after the calcination step, a particle size adjustment step is performed, wherein the average particle is obtained by either or both of pulverization and classification. The diameter is set to 30 μm or less. 如申請專利範圍第1至6項中任一項之β賽隆之製造方法,其中對前述燒成步驟後或前述粒度調整步驟後的β賽隆進行熱處理步驟,其將之保持在1300℃以上且前述燒成步驟時之燒成溫度以下的溫度條件下。 The method for producing β-Sialon according to any one of claims 1 to 6, wherein the step of heat-treating the β-Sialon after the calcination step or after the particle size adjustment step is maintained at 1300° C. or higher and The temperature is lower than the firing temperature in the baking step. 如申請專利範圍第7項之β賽隆之製造方法,其中於前述燒成步驟、前述粒度調整步驟或前述熱處理步驟後進行:酸處理步驟,其具有:浸漬步驟,其將β賽隆浸漬於酸溶液中;與清洗步驟,其清洗殘留於前述浸漬步驟後之β賽隆表面上的酸溶液。 The method for producing β-Sialon according to Item 7 of the patent application, wherein the calcination step, the particle size adjustment step or the heat treatment step is followed by an acid treatment step having an impregnation step of immersing β-sialon in an acid In the solution; and a washing step, which washes the acid solution remaining on the surface of the β-sialon after the aforementioned impregnation step. 一種β賽隆,其係以如申請專利範圍第1至8項中任一項之β賽隆之製造方法製造之β賽隆,其係使Eu2+固溶於以通式:Si6-zAlzOzN8-z(0.3≦z≦1.0)表示之β賽隆,而當以波長455nm的光激發時之螢光光譜的波鋒波長為大於545nm且555nm以下者。 A β-Sialon manufactured by the method for producing β-Sialon according to any one of claims 1 to 8 which is capable of solid-solving Eu 2+ in the formula: Si 6-z Al z O z N 8-z (0.3≦z≦1.0) indicates β-Sialon, and when the wavelength of 455 nm is excited, the wavelength of the fluorescence spectrum of the fluorescence spectrum is greater than 545 nm and 555 nm or less. 如申請專利範圍第9項之β賽隆,其中Al含量為2~8質量%,Eu含量為0.3~1質量%,氧含量為0.5~4質量%。 For example, the β-Sialon of claim 9 has an Al content of 2 to 8% by mass, an Eu content of 0.3 to 1% by mass, and an oxygen content of 0.5 to 4% by mass. 如申請專利範圍第9或10項之β賽隆,其中利用粉末X射線繞射法測定之β賽隆以外之結晶相的繞射射線強度,相對於β賽隆(101)面的繞射射線強度係1%以下。 For example, the β-Sialon of claim 9 or 10, wherein the diffraction ray intensity of the crystal phase other than β-sialon measured by the powder X-ray diffraction method, the diffraction ray relative to the β-Silon (101) plane The strength is 1% or less. 一種發光裝置,其具有發光元件與搭載於前述發光元件之發光面的螢光體,且前述螢光體之一部分或全部係如申請專利範圍第9至11項中任一項之β賽隆。 A light-emitting device comprising a light-emitting element and a phosphor mounted on a light-emitting surface of the light-emitting element, and a part or all of the phosphor is a β-Seilon according to any one of claims 9 to 11. 如申請專利範圍第12項之發光裝置,其中前述發光元件係發光二極體。 The illuminating device of claim 12, wherein the illuminating element is a light emitting diode.
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