TW201412540A - Laminate, electroconductive pattern, and electric circuit - Google Patents

Abstract

The present invention relates to a laminate characterized in having: a layer (I) comprising a support body containing a specific polyimide resin; a resin layer (II) for receiving a fluid containing an electroconductive substance (x); and an electroconductive layer (III) formed by the electroconductive substance (x). The present invention further relates to an electroconductive pattern and an electric circuit. This laminate has excellent adhesion between the layer comprising a support body and the resin layer for receiving an electroconductive substance and can maintain an excellent adhesion even when exposed to a high-temperature environment, and can therefore be used as a laminate for an electroconductive pattern or the like.

Description

Laminated body, conductive pattern and circuit

The present invention relates to a laminate which can be used for producing a conductive pattern such as an electromagnetic wave mask, an integrated circuit, or an organic transistor.

In recent years, as electronic devices have become higher in performance, smaller in size, and thinner, it has been strongly demanded to increase the density or thickness of electronic circuits or integrated circuits used therein.

As a conductive pattern which can be used for the above-mentioned electronic circuit or the like, for example, a conductive ink containing a conductive substance such as silver or a plating nucleating agent is applied to the surface of the support and baked. The conductive material layer is formed, and then the surface of the conductive material layer is plated to form a plating layer on the surface of the conductive material layer (see, for example, Patent Document 1).

However, in the conductive pattern, since the adhesion between the support and the conductive material layer is insufficient, the conductive material may be detached from the surface of the support over a period of time to cause formation of the conductive material. The disconnection of the conductive pattern or the decrease in conductivity (increased resistance).

As a method of improving the adhesion between the support and the conductive material, for example, a method is known in which a conductive ink is used on an ink receiving substrate provided with a latex layer on a surface of a support, and a pattern is drawn by a specific method. This produces a conductive pattern (see Patent Document 2).

However, the conductive pattern obtained by the above method may be insufficient in terms of the adhesion between the support and the ink receiving layer, and thus there are cases as follows: The ink receiving layer and the conductive material are detached from the surface of the support over a period of time, causing a decrease in the disconnection or conductivity of the conductive pattern formed of the conductive material.

In the case of heating to a temperature of about 100 ° C to 200 ° C in the plating treatment step or the like, for example, peeling of the ink receiving layer from the surface of the support, etc., is insufficient in terms of heat resistance, and thus the conductive pattern is obtained. There is a case where plating treatment cannot be performed in order to increase the strength or the like.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2005-286158

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2009-49124

The problem to be solved by the present invention is to provide a laminate having a conductive pattern or the like which is excellent in adhesion between a layer containing a support and a resin layer that receives a conductive material, and even when exposed to a high temperature environment, It also has heat resistance that maintains the level of excellent adhesion.

The inventors of the present invention conducted research to investigate the above problems, and as a result, found that the above problems can be solved by using a specific support.

That is, the present invention relates to a laminate, a conductive pattern, and a circuit, the laminate comprising: a layer (I) comprising a polyimide resin having a structure represented by the following formula (1) (i-1) and a support (I1) of the polyimine resin (i-2) having a structure represented by the following formula (2) or a structure represented by the following formula (1) And a support (I2) of the polyimine resin (i-3) having a structure represented by the following formula (2); and a resin layer (II) receiving a fluid containing the conductive substance (x); Conductive layer (III), which is made of the above conductivity Formed by substance (x).

[R ¹ to R ⁸ in the formula (1) each independently represent a hydrogen atom, a halogen atom or an organic group, and n represents an integer of 1 to 1,000]

[R ⁹ to R ²² in the formula (2) each independently represent a hydrogen atom, a halogen atom or an organic group, and m represents an integer of 1 to 1,000]

When the laminate of the present invention is exposed to a high-temperature environment, excellent adhesion can be maintained, and as a result, excellent electrical conductivity can be maintained without causing disconnection or the like, and thus, for example, it can be used in the following fields and the like. Commonly known as the new field of printed electronics: the formation of conductive patterns or electronic circuits; the formation of organic solar cells, e-book ends, organic EL, organic transistors, flexible printed substrates, non-contact IC cards, etc. RFID (Radio Frequency identification, radio frequency identification, etc. Formation of various layers or peripheral wiring; wiring of electromagnetic wave masks for plasma displays, integrated circuits, and manufacture of organic transistors.

The laminate system of the present invention is a laminate comprising at least a layer (I) comprising a polyimide resin (i-1) having a structure represented by the following formula (1) and having the following formula (2) The support (I1) of the polyimine resin (i-2) having the structure shown or the structure represented by the following formula (1) and represented by the following formula (2) a support (I2) of a polyimine resin (i-3) having a structure; a resin layer (II) receiving a fluid containing a conductive substance (x); and a conductive layer (III) comprising the above conductive substance (x) is formed; and can be preferably used, for example, in a conductive pattern or circuit or the like.

[R ¹ to R ⁸ in the formula (1) each independently represent a hydrogen atom, a halogen atom or an organic group, and n represents an integer of 1 to 1,000]

[Chemical 4]

[R ⁹ to R ²² in the formula (2) each independently represent a hydrogen atom, a halogen atom or an organic group, and m represents an integer of 1 to 1,000]

First, the layer (I) constituting the laminate of the present invention will be described.

The layer (I) constituting the laminate of the present invention comprises a layer supporting the support (I1) or the support (I2) of the laminate.

As the support, a polyimine resin (i-1) having a structure represented by the following formula (1) and a polyimine resin having a structure represented by the following formula (2) are used. The support (I1) of (i-2) or the polyimine resin (i-3) having a structure represented by the following formula (1) and a structure represented by the following formula (2) Support (I2).

[R ¹ to R ⁸ in the formula (1) each independently represent a hydrogen atom, a halogen atom or an organic group, and n represents an integer of 1 to 1,000]

[Chemical 6]

[R ⁹ to R ²² in the formula (2) each independently represent a hydrogen atom, a halogen atom or an organic group, and m represents an integer of 1 to 1,000]

The support (I1) contains the above polyimine resin (i-1) and polyimine resin (i-2).

The polyimine resin (i-1) has a structure represented by the above formula (1).

R ¹ to R ⁸ in the above formula (1) are each independently a hydrogen atom, a hydroxyl group, a halogen atom or an organic group. Specific examples of the organic group include an alkyl group and an aryl group. The above R ¹ to R ^{8 are} preferably a hydrogen atom from the viewpoint of imparting excellent adhesion or heat resistance and being relatively inexpensive to obtain.

m in the above formula (1) is preferably an integer of from 1 to 1,000, more preferably an integer of from 3 to 50.0, still more preferably an integer of from 50 to 500, and still more preferably an integer of from 100 to 500.

The polyimine resin (i-1) is preferably an amine group having a molecular terminal structure.

The polyimine resin (i-1) can be produced, for example, by a polyamine containing 4,4'-diaminodiphenyl ether or the like and a tetracarboxylic acid containing pyromellitic dianhydride. The polyhydrate is produced by a dihydrate reaction, and then, if necessary, mixed with a catalyst or the like, and heated.

The reaction of the above polyamine with the above tetracarboxylic acid dihydrate can be carried out by a previously known method.

When the polyimine resin (i-1) is produced, a polyamine other than 4,4'-diaminodiphenyl ether or a tetracarboxylic acid dihydrate other than pyromellitic dianhydride may be used in combination. It is preferably 95% by mass based on the total amount of the raw materials for producing the above polyimine resin (i-1). 4,4'-diaminodiphenyl ether and pyromellitic dianhydride were used in the range of 100% by mass.

Moreover, as a method of producing the polyimine resin (i-1) using the polyamic acid obtained above, the method of heating is mentioned.

The above heating can be carried out at preferably 150 ° C or higher, more preferably 200 ° C to 300 ° C.

Specific examples of the method for producing the above polyimine resin (i-1) include the methods described in JOURNAL OF POLYMER SCIENCE: PART A-2 VOL. 6, 953-960 (1968).

The polyimine resin (i-2) constituting the support (I1) has a structure represented by the above formula (2).

R ⁹ to R ²² in the above formula (2) are each independently a hydrogen atom, a hydroxyl group, a halogen atom or an organic group. Specific examples of the organic group include an alkyl group and an aryl group. In terms of imparting excellent adhesion, the above R ⁹ to R ^{22 are} preferably a hydrogen atom.

n in the above formula (2) is preferably an integer of from 1 to 1,000, more preferably an integer of from 3 to 500, further preferably an integer of from 50 to 500, and particularly preferably an integer of from 100 to 500.

The polyimine resin (i-2) is preferably an amine group having a molecular terminal structure.

The above polyimine resin (i-2) can be produced, for example, by making a polyamine containing 4,4'-diaminodiphenyl ether or the like and containing biphenyl 3, 4, 3', 4 The tetracarboxylic acid dihydrate of the tetracarboxylic acid dihydrate is reacted to produce poly-proline, and then, if necessary, mixed with a catalyst or the like, and heated.

The reaction of the above polyamine with the above tetracarboxylic acid dihydrate can be carried out by a previously known method.

When the above polyimine resin (i-2) is produced, a polyamine other than 4,4'-diaminodiphenyl ether or a biphenyl 3,4,3',4'-tetracarboxylic acid may be used in combination. The tetracarboxylic acid dihydrate other than the hydrate is preferably used in a total amount of 95% by mass to 100% by mass based on the total amount of the raw materials for producing the above polyimine resin (i-2). , 4'-diaminodiphenyl ether and biphenyl 3,4,3',4'-tetracarboxylic acid dihydrate.

Moreover, as a method of producing the polyimine resin (i-2) using the polyamic acid obtained above, the method of heating is mentioned.

The above heating can be carried out at preferably 150 ° C or higher, more preferably 200 ° C to 300 ° C.

Specific examples of the method for producing the above polyimine resin (i-2) include the methods described in JOURNAL OF POLYMER SCIENCE: PART A-2 VOL. 6, 953-960 (1968).

As the support (I1) constituting the layer (I), it is preferred to use [the above polyimine resin (i-1) / the above polyimine resin (i-2)] = 5 to 95 The ratio contains the above polyimine resin (i-1) and the above polyimine resin (i-2).

In addition, as the support (I2) constituting the layer (I) of the laminate of the present invention, a structure having a combination of the structure represented by the following formula (1) and the structure represented by the following formula (2) can be used. A support of polyimine resin (i-3).

The above polyimine resin (i-3) can be produced by using the above-mentioned polyimine resin (i-1) or the above polyimine resin (i-2). A polyamine containing 4,4'-diaminodiphenyl ether or the like and a tetracarboxylic acid containing pyromellitic dianhydride or biphenyl 3,4,3',4'-tetracarboxylic acid dihydrate The polyhydrate is produced by a dihydrate reaction, and then, if necessary, mixed with a catalyst or the like, and heated.

The reaction of the above polyamine with the above tetracarboxylic acid dihydrate can be carried out by a previously known method.

When the above polyimine resin (i-3) is produced, a polyamine other than 4,4'-diaminodiphenyl ether or pyromellitic dianhydride and biphenyl 3,4,3' may be used in combination. The tetracarboxylic acid dihydrate other than the 4'-tetracarboxylic acid dihydrate is preferably 95% by mass to 100% based on the total amount of the raw materials for producing the above polyimine resin (i-3). Pyromellitic dianhydride and biphenyl 3,4,3',4'-tetracarboxylic acid dihydrate were used in the range of % by mass.

Moreover, as a method of producing the polyimine resin (i-3) using the polyamic acid obtained above, the method of heating is mentioned.

The above heating can be carried out at preferably 150 ° C or higher, more preferably 200 ° C to 300 ° C.

As the support (I1) and the support (I2), in addition to the above polyimine resin (i-1), the above polyimine resin (i-2) or the above polyimine resin (i) In addition to -2), it is also necessary to contain various additives.

As the above-mentioned additive, for example, the ease of transport of the support (I1) or the support (I2) containing the polyimide film is improved, and adhesion of the support (I1) to the support (I2) is prevented. In particular, an inorganic filler such as ceria or calcium phosphate is preferably used.

The inorganic filler is preferably 0.5% by mass to 30% by mass based on the mass of the support (I1) or the support (I2) in terms of improving the smoothness of the surface of the support. Used within the scope. Further, the inorganic filler preferably has an average particle diameter of from 0.01 μm to 5 μm, more preferably from 0.01 μm to 0.5 μm. Further, the above average particle diameter means a value measured by a laser diffraction scattering type particle size distribution meter device.

As a method of producing the above-mentioned support (I1), for example, a polyglycine which is a precursor of the above polyimine resin (i-1) is used as the above-mentioned polyimine resin ( I-2) obtaining a solution by mixing the pro-amino acid of the precursor and the solvent as needed, mixing the solution and the above-mentioned inorganic filler, if necessary, to obtain a mixture, and filtering the mixture as needed or After defoaming, it is formed into a film or sheet and heated.

As a method of producing the support (I2), a method of mixing a polylysine as a precursor of the polyimine resin (i-3) and optionally a solvent to obtain a solution is exemplified. And mixing the solution and an additive such as the above-mentioned inorganic filler as needed to obtain a mixture, and if necessary, filtering or defoaming the mixture, forming a film or Flaky and heated.

As the above-mentioned molding method, for example, a method in which the above mixture is extruded onto a drum by a T mold or the like and cast is used.

After the casting, the solvent is removed by heating at a temperature of, for example, 80 ° C to 150 ° C for about 30 seconds to 90 seconds, whereby the film-like or sheet-shaped molded article can be obtained.

The molded article containing the polyimide resin can be produced by heating the molded article at a temperature of, for example, 200 ° C to 450 ° C for about 30 seconds to 200 seconds.

The layer (I) including the support (I1) or the support (I2) obtained by the above method is preferably a thickness of about 1 μm to 5,000 μm, more preferably about 1 μm to 300 μm. In the case where it is required to be relatively soft as the above-mentioned laminated body, it is preferable to use a thickness of about 1 μm to 200 μm.

Next, the resin layer (II) constituting the laminate of the present invention will be described.

The resin layer (II) is a layer which can contain a fluid containing the conductive material (x) which forms the conductive layer (III) described below. When the resin layer (II) is in contact with the fluid, the solvent contained in the fluid is quickly absorbed, and the conductive material (x) is supported on the surface of the resin layer (II). Thereby, the adhesion of the layer (I) including the support (I1) or the support (I2), the resin layer (II), and the conductive layer (III) containing the conductive substance (x) can be remarkably improved, or Heat resistance.

The resin layer (II) may be provided on a part or the entire surface of the layer (I) including the support (I1) or the support (I2), or may be provided on one or both sides thereof. For example, as the above laminated body, it is also possible to use the resin layer (II) on the entire surface of the layer (I) including the support (I1) or the support (I2) and only in the resin layer (II). Some of them have the above conductive layer (III). Further, a laminate provided with the resin layer (II) may be used only for the portion of the surface (I) including the support (I1) or the support (I2) where the conductive layer (III) is provided.

The thickness of the above resin layer (II) is not according to the use of the laminate of the present invention or the like. The same, but it is usually preferably set to a thickness in the range of 10 nm to 1000 μm. Further, in terms of further improving the adhesion between the layer (I) including the support (I1) or the support (I2) and the conductive layer (III), the thickness of the resin layer (II) is more preferably The range of 10 nm to 300 nm, and more preferably the range of 10 nm to 100 nm.

As the resin layer (II), a composite resin (II-1) containing a urethane resin and an acrylic resin, a melamine resin (II-2), a urethane resin, or a vinyl resin can be used. A resin layer formed of an epoxy resin, a quinone imine resin, a guanamine resin, a phenol resin, polyvinyl alcohol, polyvinylpyrrolidone or the like. Among them, in terms of producing a laminate having excellent adhesion and heat resistance, it is preferred to use a composite resin (II-1) containing a urethane resin and an acrylic resin, or a melamine resin (II-2). And the layer formed.

Next, the conductive layer (III) constituting the laminate of the present invention will be described.

The conductive layer (III) is a layer containing a conductive material (x) contained in a fluid such as a conductive ink or a plating nucleating agent. For example, when a plating nucleating agent containing silver is used as the fluid, the conductive layer (III) corresponds to a layer containing the silver contained in the plating nucleating agent, and corresponds to the silver. Printing images or patterns.

The conductive layer (III) preferably contains the conductive material (x), and specifically preferably contains silver. The conductive layer (III) mainly contains the conductive material as described above, but a solvent, an additive, or the like contained in the fluid may remain in the conductive layer (III).

Further, the above conductive layer (III) may be provided on a part or the entire surface of the above resin layer (II). For example, as the laminated body, the conductive layer (III) may be provided only at a desired portion of the surface of the resin layer (II). Specifically, as the conductive layer (III) provided only on a desired portion of the surface of the resin layer (II), a linear layer formed by drawing a line is exemplified. It is preferable to have a linear layer as the laminate of the above-mentioned conductive layer (III) in the production of a conductive pattern or a circuit.

In order to increase the density of the conductive pattern, etc., it is preferably the above-mentioned line shape. The width (line width) of the layer is about 0.01 μm to 200 μm, preferably about 0.01 μm to 150 μm.

The conductive layer (III) constituting the laminate of the present invention can be used in a thickness ranging from 10 nm to 10 μm. The thickness of the above-mentioned conductive layer (III) can be adjusted by controlling the amount of coating of the fluid containing the conductive substance (x) which can be used to form the above-mentioned conductive layer (III). In the case where the conductive layer (III) is a thin line, the thickness (height) is preferably in the range of 10 nm to 1 μm.

Further, in order to improve the adhesion between the surface of the conductive layer (III) and the plating layer (IV) which may be provided, it is preferred to oxidize a part or the entire surface of the conductive layer (III).

Here, the above oxidation means that the conductive material (x) contained in the conductive layer (III) is bonded to oxygen to form an oxide, and the valence of the conductive material (x) is increased.

Therefore, as the oxidized surface of the conductive layer (III), for example, when silver is used as the conductive substance (x) contained in the conductive layer (III), it may be used as a surface containing or containing silver oxide. The above-mentioned silver is bonded to a hydroxyl group or the like and its valence is increased from 0 to +1.

The conductive layer (III) may be oxidized by the surface in contact with the plating layer (IV), or all of the conductive material contained in the conductive layer (III) may be oxidized together with the surface.

The oxidized surface of the conductive layer (III) preferably has a resistance value of 0.1 Ω/□ to 50 Ω/□, and is preferably provided with excellent adhesion to the plating layer (IV). The range of 0.2 Ω / □ ~ 30 Ω / □.

Further, in addition to the layer (I), the resin layer (II), and the conductive layer (III), the laminate of the present invention may optionally have a plating layer (IV).

For example, when the laminated body is used in a conductive pattern or the like, the plating layer (IV) is formed to maintain good electrical conductivity without causing disconnection or the like for a long period of time. The layer of the wiring pattern is set with higher reliability.

The plating layer (IV) is preferably a layer containing a metal such as copper, nickel, chromium, cobalt or tin, and more preferably a plating layer containing copper.

The plating layer (IV) may be used in a thickness ranging from 1 μm to 50 μm. The thickness of the plating layer (IV) can be adjusted by controlling the processing time, the current density, the amount of the plating additive, and the like in the plating treatment step in forming the plating layer (IV).

Next, a method of producing the laminate of the present invention will be described.

The laminate of the present invention can be produced, for example, by applying a resin composition (R) to a part or the entire surface of the support (I1) or the support (I2) constituting the layer (I). The resin layer (II) is formed by drying, and then a fluid containing the conductive material (x) is applied to a part or the entire surface of the resin layer (II) and fired to form the conductive layer (III). In the case where the plating layer (IV) is provided, a layered body further including a plating layer (IV) can be produced by plating a part or the entire surface of the conductive layer (III).

The method of forming the resin layer (II) on a part or the entire surface of the support (I1) or the support (I2) can be formed by applying the above resin composition (R) to the support. (I1) or a part or the entire surface of the support (I2), and a solvent such as an aqueous medium or an organic solvent contained in the above resin composition (R) is removed.

Examples of the method of applying the resin composition (R) to the surface of the support (I1) or the support (I2) include a gravure method, a coating method, a screen method, a roll method, a rotation method, and a spray. Ways and other methods.

The surface of the support (I1) or the support (I2) to which the resin composition (R) is applied may also be subjected to a dry treatment such as a plasma discharge treatment method such as a corona discharge treatment method or a UV treatment method, or The surface treatment is carried out by a wet treatment method using water, an acidic or alkaline chemical solution, an organic solvent or the like.

Applying the above resin composition (R) to the surface of the above support (I1) or support (I2) Thereafter, as a method of removing the solvent contained in the coating layer, for example, a method in which the solvent is volatilized by drying using a dryer is usually employed. The drying temperature may be a temperature in which the solvent is volatilized and does not adversely affect the support (I1) or the support (I2).

The coating amount of the resin composition (R) on the support (I1) or the support (I2) is excellent relative to the support (I1) or the viewpoint of imparting excellent adhesion and conductivity. area of the support member (I2) of, preferably from 0.01g / m ² ~ 60g / m ² range, the absorbency and manufacturing cost in consideration of the above-described solvent contained in the fluid, is particularly preferably 0.1g / m ² ~10g/m ² .

As the resin composition (R) which can be used for the production of the above-mentioned resin layer (II), those containing various resins and solvents can be used.

As the resin, for example, a composite resin (II-1) containing a urethane resin and an acrylic resin, a melamine resin (II-2), a urethane resin, an acrylic resin, an epoxy resin, or the like can be used. A quinone imine resin, a guanamine resin, a phenol resin, polyvinyl alcohol, polyvinylpyrrolidone or the like.

Further, as the resin, in terms of further improving the adhesion between the layer (I) comprising the support (I1) or the support (I2) and the conductive layer (III), it is preferred to use an aminocarboxylic acid. A composite resin (II-1) of an ester resin and an acrylic resin, or a melamine resin (II-2).

The resin composition (R) is preferably used in an amount of 10% by mass to 70% by mass based on the total amount of the resin composition (R) in terms of the ease of application, and the like. Good use includes 10% by mass to 50% by mass.

Further, as the solvent which can be used in the above resin composition (R), various organic solvents or aqueous media can be used.

As the organic solvent, for example, toluene, ethyl acetate or methyl ethyl ketone can be used. Further, examples of the aqueous medium include water and an organic solvent mixed with water, and a mixture of these.

Examples of the organic solvent to be mixed with water include alcohols such as methanol, ethanol, n-propanol and isopropanol, ethyl carbitol, ethyl celecoxib, and butyl sage; acetone and methyl b. Ketones such as ketones; polyalkylene glycols such as ethylene glycol, diethylene glycol, and propylene glycol; alkyl ethers of polyalkylene glycols; and internal amides such as N-methyl-2-pyrrolidone .

Further, as the resin used in the resin composition (R), from the viewpoint of further improving the adhesion to the various supports (I1) or the support (I2), it is preferred to use a hydrophilic group. Resin. Examples of the hydrophilic group include an anionic group such as a carboxylate group or a sulfonate group which is formed by neutralizing a part or all of a basic compound, or a cationic group or a nonionic group. Anionic group.

Further, the above resin may optionally have an alkoxyalkyl group, a stanol group, a hydroxyl group, an amine group, a methylol group, a hydroxymethylguanamine group, an alkoxymethylguanamine group or a hydroxymethylamino group. Linkage functional groups. Therefore, the resin layer (II) may have a crosslinked structure before the application of the fluid, or a crosslinked structure may be formed after the application of the fluid, for example, by heating in a baking step or the like. .

The composite resin (II-1) which can be used in the above-mentioned resin composition (R) includes a urethane resin and an acrylic resin to form composite resin particles and can be dispersed in an aqueous medium.

Specifically, the composite resin particles may be partially or wholly present in the resin particles formed of the urethane resin. In this case, the acrylic resin may be dispersed in a plurality of particles in the urethane resin particles, and it is preferable to form the acrylic resin as a core layer and the hydrophilic layer as a shell layer. A core-shell composite resin particle of a urethane resin. In particular, when forming a conductive pattern, it is preferred to use the above-mentioned core/shell type composite resin particles which do not require the use of a surfactant which can reduce electrical characteristics. Further, as the composite resin particles, it is preferred to substantially completely cover the propylene by the urethane resin. The acid resin may be present in the outermost portion of the composite resin particles in a range that does not impair the effects of the present invention, but it is not essential. The urethane resin and the acrylic resin may form a covalent bond, but it is preferred that no bond is formed.

Further, from the viewpoint of maintaining good water dispersion stability, the composite resin particles preferably have an average particle diameter in the range of 5 nm to 100 nm. The average particle diameter referred to herein means an average particle diameter based on a volume measured by a dynamic light scattering method as described in the following examples.

The above-mentioned composite resin (II-1) preferably contains the above urethane resin and the above acrylic resin in the range of [urethane resin/acrylic resin]=90/10 to 10/90. More preferably, the above urethane resin and the above acrylic resin are contained in the range of 70/30 to 10/90.

The urethane resin which can be used for the production of the above composite resin (II-1) can be obtained by reacting various polyols, polyisocyanates and, if necessary, chain extenders.

As the above polyol, for example, a polyether polyol, a polyester polyol, a polyester ether polyol, a polycarbonate polyol, or the like can be used.

As the polyester polyol, for example, an aliphatic polyester polyol or an aromatic polyester polyol obtained by esterifying a low molecular weight polyol with a polycarboxylic acid can be used; and a ring such as ε-caprolactone can be used. The polyester obtained by subjecting the ester compound to ring-opening polymerization; or the copolymerized polyester or the like.

As the low molecular weight polyol, for example, ethylene glycol, propylene glycol, 1,6-hexanediol, neopentyl glycol or the like can be used.

Further, as the polycarboxylic acid, for example, an aliphatic polycarboxylic acid such as succinic acid, adipic acid, sebacic acid or dodecanedicarboxylic acid; or terephthalic acid, isophthalic acid or phthalic acid can be used. An aromatic polycarboxylic acid; and such an anhydrate or ester forming derivative.

In addition, as the polyether polyol, for example, one or two or more kinds of compounds having two or more active hydrogen atoms may be used as a starter to form an alkylene oxide polymerizer.

As the above initiator, for example, ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, 1,3-propanediol, 1,3-butylene glycol, 1,4-butanediol, 1,6 can be used. - hexanediol, neopentyl glycol, glycerin, trimethylolethane, trimethylolpropane, or the like, or bisphenol A, bisphenol F, bisphenol B, bisphenol AD, and the like.

Further, as the alkylene oxide, for example, ethylene oxide, propylene oxide, butylene oxide, styrene oxide, epichlorohydrin, tetrahydrofuran or the like can be used.

Further, as the polyester ether polyol, for example, a polyether polyol obtained by adding the above alkylene oxide and the above initiator, and a polycarboxylic acid can be used. As the above-mentioned initiator or the above-mentioned alkylene oxide, the same as those exemplified as the above-mentioned initiator or the above-mentioned alkylene oxide which can be used in the production of the above polyether polyol can be used. Further, as the polycarboxylic acid, the same as those exemplified as the above-mentioned polycarboxylic acid which can be used in the production of the above polyester polyol can be used.

In addition, as the polycarbonate polyol, for example, those obtained by reacting a carbonate with a polyol or those obtained by reacting carbonium chloride with bisphenol A or the like can be used.

As the above carbonate, methyl carbonate, dimethyl carbonate, ethyl carbonate, diethyl carbonate, cyclic carbonate or diphenyl carbonate can be used.

As the polyol reactive with the above carbonate, for example, ethylene glycol, diethylene glycol, triethylene glycol, 1,2-propanediol, 1,3-propanediol, dipropylene glycol, 1,4-butane can be used. Alcohol, 1,3-butanediol, 1,2-butanediol, 2,3-butanediol, 1,5-pentanediol, 1,5-hexanediol, 2,5-hexanediol, 1,6-hexanediol, 1,7-heptanediol, 1,8-octanediol, 1,9-nonanediol, 1,10-nonanediol, 1,11-undecanediol, 1,12-dodecanediol, 3-methyl-1,5-pentanediol, 2-ethyl-1,3-hexanediol, 2-methyl-1,3-propanediol, 2-methyl Base-1,8-octanediol, 2-butyl-2-ethylpropanediol, 2-methyl-1,8-octanediol, neopentyl glycol, 1,4-cyclohexane a relatively low molecular weight dihydroxy compound such as a diol, 1,4-cyclohexanedimethanol, hydroquinone, resorcin, bisphenol-A, bisphenol-F, 4,4'-biphenol; Polyether polyols such as polyethylene glycol, polypropylene glycol, polyether diol, or polyester polyols such as polyhexamethylene adipate, hexamethylene polysuccinate, and polycaprolactone.

Further, as the above polyol, from the viewpoint of introducing a hydrophilic group into the urethane resin, for example, 2,2'-dimethylolpropionic acid or 2,2'-dimethylol can be used. 2,2'-dimethylol butane acid, 2,2'-dimethylol butyric acid, 5-sulfoisophthalic acid, sulfoterephthalic acid , 4-sulfophthalic acid, 5[4-sulfophenoxy]isophthalic acid, and the like.

As the polyisocyanate, for example, a polyisocyanate having an aromatic structure such as 4,4'-diphenylmethane diisocyanate, 2,4'-diphenylmethane diisocyanate or tolylene diisocyanate; or hexamethylene group can be used. An aliphatic polyisocyanate such as diisocyanate, cyclohexane diisocyanate, isophorone diisocyanate, dicyclohexylmethane diisocyanate, benzodimethyl diisocyanate or tetramethyl dimethyl diisocyanate or an aliphatic cyclic structure Polyisocyanate. Among them, it is preferred to use a polyisocyanate having an aliphatic cyclic structure.

Further, as the chain extender, for example, ethylenediamine or piperazine can be used. Previously known as isophorone diamine.

In addition, as the acrylic resin which can be used for the production of the above-mentioned composite resin (II-1), those obtained by polymerizing various (meth)acrylic monomers typified by methyl (meth)acrylate can be used.

As the (meth)acrylic monomer, for example, methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, (A) can be used. A (meth)acrylic acid alkyl ester such as tributyl acrylate, 2-ethylhexyl (meth) acrylate, hexyl (meth) acrylate or cyclohexyl (meth) acrylate.

In the above, it is required to have a thickness of about 0.01 μm to 200 μm, preferably 0.01 μm to 150, which is required to print a conductive pattern such as an electronic circuit without causing blurring. Methyl methacrylate is preferably used in terms of a fine line having a width of about μm (increased in fine linearity).

Further, it is preferred to use an alkyl (meth)acrylate having an alkyl group having 2 to 12 carbon atoms together with the above methyl methacrylate, and more preferably having 3 to 8 carbon atoms. As the alkyl acrylate of the alkyl group, n-butyl acrylate is preferably used in terms of obtaining a printed matter excellent in printability. Further, even in the case of using a conductive ink, it is particularly preferable in terms of forming a conductive pattern which is free from blur and the like and excellent in fine linearity.

In addition, as the (meth)acrylic monomer, the crosslinkability such as one or more kinds of amidino groups selected from the group consisting of a hydroxymethylguanamine group and an alkoxymethylguanamine group is used. A functional group is introduced into the acrylic resin to further improve adhesion and the like, and a (meth)acrylic monomer containing a crosslinkable functional group can be used.

In the case of obtaining a layered body such as a conductive pattern having excellent linearity or adhesion, a (meth)acrylic monomer having a crosslinkable functional group is preferably N-n-butoxymethyl ( Methyl) acrylamide, N-isobutoxymethyl (meth) acrylamide.

The above composite resin (II-1) can be produced, for example, by producing an aqueous dispersion of a urethane resin by reacting and dispersing the above polyol, polyisocyanate and, if necessary, a chain extender. And a step of polymerizing the (meth)acrylic monomer in the aqueous dispersion to produce an acrylic resin.

Specifically, the urethane resin is obtained by reacting the above polyisocyanate with a polyol in the absence of a solvent or an organic solvent or a reactive diluent such as a (meth)acrylic monomer, and then, A part or all of the hydrophilic group of the urethane resin is neutralized with an optional basic compound or the like, and if necessary, further reacted with a chain extender to be dispersed in an aqueous medium, thereby producing an amine group. An aqueous dispersion of a formate resin.

Then, the (meth)acrylic monomer is supplied to the aqueous dispersion of the urethane resin obtained in the above, and the (meth)acrylic monomer is added to the above urethane. The ester resin particles are subjected to radical polymerization to produce an acrylic resin. Further, when the urethane resin is produced in the presence of a (meth)acrylic monomer, a polymerization initiator or the like is supplied after the production of the urethane resin, thereby The acrylic resin is radically polymerized to produce an acrylic resin.

Thereby, the resin composition (R) in which the composite resin particles which are partially or wholly contained in the urethane resin particles are dispersed in the aqueous medium can be produced.

Further, as the resin composition (R), those containing a urethane resin can be used.

As the above urethane resin, for example, a urethane resin having a polyether structure, a urethane resin having a polycarbonate structure, or a urethane resin having a polyester structure, or the like can be used.

The urethane resin can be used by using the same polyol as the one described in the description of the above composite resin (II-1) or a polyol such as a previously known polycarbonate polyol, and the like. A urethane resin obtained by reacting a polyisocyanate or a chain extender. In this case, by appropriately selecting the above polyether polyol, a previously known polycarbonate polyol or an aliphatic polyester polyol, or the like as the above polyol, a urethane resin having the above-described desired structure can be produced.

In addition, as the vinyl resin which can be used in the above-mentioned resin composition (R), a (meth)acrylic monomer described in the description of the above composite resin (II-1) or a styrene or the like can be used. A vinyl-based resin obtained by radical polymerization of a vinyl monomer.

Further, as the resin composition (R) which can form the resin layer (II), it is preferable to use a melamine resin (II-2) in terms of producing a laminate having excellent adhesion or heat resistance. By.

As the above melamine resin (II-2), for example, melamine or benzoquinone can be used. Have three A methylolide or alkoxylate obtained by reacting a cyclic amine compound with formaldehyde.

As the above-mentioned methylolide, for example, a methoxymethylolated melamine resin, a butylated methylolated melamine resin or the like can be used.

In the above-mentioned alkoxylate, a part or all of the methylol group of the above-mentioned methylolated product may be sealed with a monohydric alcohol or the like, and examples thereof include an alkoxylated melamine resin such as a methoxymethylolated melamine resin. .

The above alkoxylated melamine resin can be used to add melamine or benzoquinone in one time. Etc. The amino group-based compound of the ring, the above-mentioned formaldehyde and the above-mentioned monool are obtained by a reaction, and may be used in advance to have three The amine compound of the ring is reacted with the above-mentioned formaldehyde to obtain a methylolated melamine compound, which is then obtained by reacting with the above monoalcohol.

As the alkoxylated melamine resin, specifically, Beckamine M-3 manufactured by DIC Corporation can be used.

The number average molecular weight of the melamine resin (II-2) is preferably from 100 to 10,000, more preferably from 300 to 2,000.

The resin composition (R) may preferably contain a pH adjusting agent represented by a crosslinking agent, a film forming auxiliary agent, a leveling agent, a tackifier, a water repellent agent, an antifoaming agent, etc., as needed. additive.

The crosslinking agent may be formed by applying a resin layer (II) having a crosslinked structure or a fluid body before the application of the fluid, and then forming a crosslinked structure by heating in a baking step or the like. Resin layer (II).

As the crosslinking agent, for example, a metal chelate compound, a polyamine compound, an aziridine compound, a metal chloride compound, an isocyanate compound, or the like can be used to form a crosslinked structure at a relatively low temperature of less than 25 ° C to 100 ° C. a thermal crosslinking agent; selected from the group consisting of melamine-based compounds, epoxy-based compounds, One or more of the group consisting of an oxazoline compound, a carbodiimide compound, and a blocked isocyanate compound can be reacted at a relatively high temperature of 100 ° C or higher to form a crosslinked structure of a thermal crosslinking agent; or various light crosslinks Joint agent.

The above-mentioned crosslinking agent is preferably used in an amount of 0.01% by mass to 60% by mass based on 100 parts by mass of the total mass of the resin contained in the primer, and is preferably used in accordance with the type and the like. When it is used in the range of 0.1% by mass to 10% by mass, and when it is used in the range of 0.1% by mass to 5% by mass, it is possible to form a conductive pattern which is excellent in adhesion or conductivity and excellent in durability. good.

In the above manner, by applying the above resin composition (R) to a part or the entire surface of the support (I1) or the support (I2) by the above method, the above resin layer (II) can be laminated on the above layer. (I).

Next, a method of forming a conductive layer (III) by applying a fluid containing a conductive material (x) to a part or the entire surface of the resin layer (II) and baking it will be described.

Examples of the method of applying the fluid to the surface of the resin layer (II) include an inkjet printing method, a reverse printing method, a screen printing method, a lithography method, a spin coating method, and a spray coating method. Bar coating method, die coating method, slit coating method, roll coating method, dip coating method, and the like.

In the case where the above-mentioned conductive layer (III) having a fine line shape of about 0.01 μm to 100 μm required for achieving high density of an electronic circuit or the like is formed by using the above-described fluid, it is preferable to use inkjet printing or inversion. The above-mentioned fluid is applied by a printing method.

As the above inkjet printing method, a person generally referred to as an inkjet printer can be used. Specific examples include Konica Minolta EB100, XY100 (manufactured by Konica Minolta IJ Co., Ltd.), Dimatix Materials Printer DMP-3000, Dimatix Materials Printer DMP-2831 (manufactured by Fujifilm Co., Ltd.), and the like.

Further, as the reverse printing method, a letterpress reverse printing method, a gravure reverse printing method, or the like is known, and for example, a method in which the above-mentioned fluid is applied to the surface of each of the outer layers and the non-line portion is protruded is known. Contacting the plate, and selectively transferring the fluid corresponding to the non-line portion to the surface of the plate, thereby forming the above-mentioned surface on the surface of the jacket layer or the like Then, the pattern is transferred onto the surface of the layer (I) including the support (I1) or the support (I2) or the surface of the resin layer (II).

The purpose of the calcination after the application of the above-described fluid by the above-described method is to form a conductive layer (II) by adhering and bonding the conductive material (x) such as a metal contained in the fluid. The calcination is preferably carried out in the range of from 80 ° C to 300 ° C for from 2 minutes to 200 minutes. The calcination may be carried out in the atmosphere, but some or all of the calcination steps may be carried out in a reducing environment from the viewpoint of preventing oxidation of the above metal.

Further, the calcination step can be carried out, for example, by an oven, a hot air drying oven, an infrared drying oven, laser irradiation, photo-fusing (photo-baking), light pulse irradiation, microwave, or the like.

As the fluid for forming the conductive layer (III), the conductive material (x), a solvent or an additive as necessary may be used, and those which can be generally used for a conductive ink or a plating nucleating agent are mentioned.

As the above-mentioned conductive substance (x), a transition metal or a compound thereof can be used. Preferably, an ionic transition metal is used. For example, a transition metal such as copper, silver, gold, nickel, palladium, platinum, or cobalt is preferably used, and since a conductive pattern having low resistance and high corrosion is formed, More preferably, copper, silver, gold, or the like is used, and silver is preferably used.

In the case where the fluid is used for a plating nucleating agent, the conductive material (x) may be a metal particle containing the transition metal as described above, and the oxide of the transition metal may be used. Or one or more types in which the surface is covered with an organic substance.

The oxide of the above transition metal is usually in an inert (insulating) state, and for example, it can be treated by using a reducing agent such as dimethylamine borane to expose the metal and impart activity (conductivity).

In addition, as the metal whose surface is covered with the above-mentioned organic substance, a metal is present in the inside of the resin particle (organic substance) formed by the emulsion polymerization method or the like. These are generally inert (insulating) states, such as by removing the organic matter by using a laser or the like. Exposed and imparted activity (conductivity).

As the conductive material (x), it is preferable to use a particle having an average particle diameter of about 1 nm to 100 nm, and it can be formed by comparison with a case where a conductive substance (x) having an average particle diameter of a micron order is used. The fine conductive pattern can further reduce the resistance value after baking, and therefore it is more preferable to use an average particle diameter of 1 nm to 50 nm. Further, the above "average particle diameter" is a volume average value obtained by diluting the above-mentioned conductive substance (x) with a dispersion good solvent and measuring by a dynamic light scattering method. For the measurement, Nanotrac UPA-150 manufactured by Microtrac Co., Ltd. can be used.

The conductive material (x) is preferably contained in the range of 5 mass% to 90 mass%, more preferably 10 mass% to 60 mass%, based on the total amount of the fluid used in the present invention. Used within the scope.

Further, from the viewpoint of improving the easiness of coating, etc., the fluid is preferably a solvent. As the above solvent, an organic solvent or an aqueous medium can be used.

The solvent is, for example, an aqueous medium such as distilled water, ion-exchanged water, pure water or ultrapure water, and an organic solvent such as an alcohol, an ether, an ester or a ketone can be used.

As the above alcohol, for example, methanol, ethanol, n-propanol, isopropanol, n-butanol, isobutanol, second butanol, tert-butanol, heptanol, hexanol, octanol, decyl alcohol, hydrazine can be used. Alcohol, undecyl alcohol, dodecanol, tridecyl alcohol, tetradecanol, pentadecyl alcohol, stearyl alcohol, allyl alcohol, cyclohexanol, rosinol, terpineol, dihydroterpineol , ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monobutyl ether, tetraethylene glycol monobutyl Ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, tripropylene glycol monomethyl ether, propylene glycol monopropyl ether, dipropylene glycol monopropyl ether, propylene glycol monobutyl ether, dipropylene glycol monobutyl ether, tripropylene glycol monobutyl ether, and the like.

Further, in the above-mentioned fluid, for example, ethylene glycol, diethylene glycol, 1,3-butylene glycol or isoprene glycol may be used together with the above-mentioned conductive material (x), solvent or the like.

As the above-mentioned fluid, it is preferably measured using a B-type viscometer at 25 ° C. A liquid or viscous liquid having a viscosity of 0.1 mPa ‧ s to 500,000 mPa ‧ s, preferably 0.5 mPa ‧ s to 10,000 mPa ‧ s. In the case where the above-mentioned fluid is applied (printed) by the above-described inkjet printing method or relief printing, it is preferred to use a viscosity of 5 mPa‧s to 20 mPa‧s.

An oxidation treatment may also be performed on a part or the entire surface of the conductive layer (III) formed by applying the above-mentioned fluid and baking it. Specifically, the surface of the conductive layer (III) may be subjected to a plasma discharge treatment such as corona treatment.

The plasma discharge treatment is not particularly limited, and examples thereof include a vacuum plasma treatment method such as a corona discharge treatment method or a glow plasma treatment method such as a glow discharge treatment method or an arc discharge treatment method under vacuum or reduced pressure. The treatment is carried out by the discharge treatment method.

The above-described normal piezoelectric slurry discharge treatment method is a method of performing plasma discharge treatment in an environment having an oxygen concentration of about 0.1% by mass to about 25% by mass. In the present invention, in terms of imparting excellent adhesion, it is particularly preferred to carry out the above treatment in a range of preferably from 10% by mass to 22% by mass, more preferably in air (with an oxygen concentration of about 21% by mass). Corona discharge treatment of plasma discharge treatment.

Further, since the excellent adhesion can be imparted without imparting excessive irregularities to the surface of the conductive layer (III), the above-described normal piezoelectric slurry discharge treatment is preferably in the environment containing the above oxygen and inert gas. get on. As the inert gas, argon or nitrogen or the like can be used.

When the treatment is carried out by the above-described normal piezoelectric slurry discharge treatment method, for example, a normal piezoelectric slurry processing apparatus (AP-T01) manufactured by Sekisui Chemical Co., Ltd., or the like can be used.

When the treatment is carried out by the above-described normal piezoelectric slurry discharge treatment method, the flow rate of the gas such as air is preferably in the range of 5 liters/minute to 50 liters/minute. Further, as the output, it is preferably in the range of 50 W to 500 W. Further, the treatment time by the plasma is preferably in the range of 1 second to 500 seconds.

As the above-described normal piezoelectric slurry discharge treatment method, specifically, it is preferable to use the above-mentioned electricity Halo discharge treatment. In the case of the above-described corona discharge treatment method, for example, a corona surface modification evaluation device (TEC-4AX) manufactured by Kasuga Electric Co., Ltd. or the like can be used.

When the treatment is carried out by the above-described corona discharge treatment method, it is preferably carried out in the range of 5 W to 300 W as an output. Further, the time of the corona discharge treatment is preferably in the range of 0.5 second to 600 seconds.

It is preferable that the plasma discharge treatment such as the corona discharge treatment is carried out under the condition that the surface of the layer (II) is not uneven by the treatment.

For the surface of the conductive layer (III) formed by the above method, a plating treatment is preferably performed. The plating treatment may be performed on the oxidized surface of the conductive layer (III) or on the surface of the unoxidized conductive layer (III).

Examples of the plating treatment method include a dry plating method such as a sputtering method or a vacuum vapor deposition method, a wet plating method such as an electroless plating method or a plating method, or a combination of two or more types of the plating methods. method.

The plating layer (IV) formed by the above plating treatment method has excellent adhesion to the surface of the above-mentioned conductive layer (III). Among them, the plating layer (IV) formed by the plating method can exhibit particularly excellent adhesion to the surface of the above-mentioned conductive layer (III).

As the dry plating treatment step, a sputtering method, a vacuum evaporation method, or the like can be used. The sputtering method introduces an inert gas (mainly argon) into a vacuum to apply a negative ion to the plating layer (IV) forming material to generate a glow discharge, and then ionizes the inert gas atom to cause the gas ions to collide with the gas at a high speed. The plating layer (IV) forms a surface of the material, and a method of forming the plating layer (III) by ejecting atoms or molecules constituting the material of the plating layer (IV) and firmly adhering to the surface of the above-mentioned conductive layer (III).

As the material for forming the plating layer (IV), chromium (Cr), copper (Cu), titanium (Ti), silver (Ag), platinum (Pt), gold (Au), nickel-chromium (Ni-Cr), or the like can be used. SUS, copper-zinc (Cu-Zn), ITO, SiO ₂ , TiO ₂ , Nb ₂ O ₅ , ZnO, or the like.

When the plating treatment is performed by the above sputtering method, for example, a magnetron sputtering device can be used. Wait.

Further, in the vacuum vapor deposition method, various metals or metal oxides which are materials for forming the plating layer (IV) are heated in a vacuum to be melted, evaporated, and sublimated, and the metal atoms or molecules are attached to the conductive layer ( The surface of IV), whereby the method of forming the plating layer (IV).

As a material for forming the plating layer (IV) which can be used in the above vacuum vapor deposition method, for example, aluminum (Al), silver (Ag), gold (Au), titanium (Ti), nickel (Ni), copper (Cu) can be used. , chromium (Cr), tin (Sn), indium (In), SiO ₂ , ZrO ₂ , Al ₂ O ₃ , TiO _{2 ,} and the like.

Further, the electroless plating treatment method which can be used as the plating treatment method is, for example, bringing an electroless plating solution into contact with a conductive material such as palladium or silver constituting the conductive layer (III), thereby allowing the electroless plating solution to be used. A method of depositing a metal such as copper to form an electroless plating layer (film) including a metal film.

As the electroless plating solution, for example, a conductive material including a metal such as copper, nickel, chromium, cobalt, or tin, a reducing agent, and a solvent such as an aqueous medium or an organic solvent can be used.

As the reducing agent, for example, dimethylaminoborane, hypophosphorous acid, sodium hypophosphite, dimethylamine borane, hydrazine, formaldehyde, sodium borohydride, phenol or the like can be used.

Further, as the electroless plating solution, if necessary, the following may be included: a monocarboxylic acid such as acetic acid or formic acid; malonic acid, succinic acid, adipic acid, maleic acid, and antibutene Dicarboxylic acid such as acid; hydroxycarboxylic acid such as malic acid, lactic acid, glycolic acid, gluconic acid, citric acid; glycine acid, alanine, iminodiacetic acid, arginine, aspartic acid, glutamic acid, etc. Organic acids such as amino acid, iminodiacetic acid, nitrilotriacetic acid, ethylenediamine diacetic acid, ethylenediaminetetraacetic acid, diamethylenetriaminepentaacetic acid, and the like, such organic acids A soluble salt (sodium salt, potassium salt, ammonium salt, etc.), an amine such as ethylenediamine, di-ethyltriamine or tri-ethyltetramine.

The temperature of the above electroless plating solution when the above electroless plating solution is used is preferably in the range of 20 ° C to 98 ° C.

Further, the plating treatment method which can be used as the plating treatment method is, for example, a conductive material constituting the conductive layer (III) or an electroless plating layer (film) formed by the above-described electroless treatment in a state in which a plating solution is contacted. When the surface is energized, a metal such as copper contained in the plating solution is deposited on the surface of the electroconductive material constituting the conductive layer (III) provided on the negative electrode or the electroless plating layer (film) formed by the electroless treatment. A method of forming a plating film (metal film).

As the plating solution, a metal such as copper, nickel, chromium, cobalt or tin, a sulfide such as these, sulfuric acid or the like, and an aqueous medium can be used. Specifically, those containing copper sulfate, sulfuric acid, and an aqueous medium can be used.

The temperature of the plating solution when the plating solution is used is preferably in the range of 20 ° C to 98 ° C.

In the above plating treatment method, since a substance having high toxicity is not used and workability is preferable, it is preferable to form a layer containing copper by a plating method.

The laminate obtained by the above method can be used as a conductive pattern. Specifically, it can be preferably used for forming an electronic circuit using silver ink or the like; forming a layer of an organic solar cell, an e-book end, an organic EL, an organic transistor, a flexible printed circuit board, or an RFID, or a peripheral wiring. A conductive pattern, more specifically, a circuit substrate, for manufacturing a wiring of an electromagnetic wave mask of a plasma display.

When the laminated body is used for a conductive pattern, a fluid which can form the conductive layer (III) is applied at a position corresponding to a desired pattern shape to be formed, and baked, etc., thereby being manufactured. A conductive pattern with the desired pattern.

Further, the conductive pattern can be produced, for example, by a photolithography method such as a subtractive method, a semi-additive method, or a full additive method.

The above-described subtractive method is applied to a plating layer (IV) constituting the laminated body of the present invention which is formed in advance, and an etching resist layer having a shape corresponding to a desired pattern shape is formed, and the above-described developing treatment is used to remove the above-mentioned developing treatment using a chemical liquid. Part of the resist (IV) and conductive layer (III) dissolve and go In addition, a method of forming a desired pattern thereby. As the chemical liquid, a chemical liquid containing copper chloride or iron chloride can be used.

The semi-additive method is a laminate comprising a layer (I) including the support (I1) or the support (I2), the resin layer (II), and the conductive layer (III), and then, if necessary, After the surface of the conductive layer (III) is oxidized by plasma discharge treatment, a plating resist layer having a shape corresponding to a desired pattern is formed on the surface of the oxidation, and then, by electroplating or The plating layer (IV) is formed by electroplating, and then the plating resist layer and the conductive layer (III) in contact therewith are dissolved and removed using a chemical solution or the like to form a desired pattern.

Further, the above-described full addition method is based on the layer (I) including the support (I1) or the support (I2), and the resin layer (II) is provided, and the conductive layer (III) is printed by an inkjet method or a reverse printing method. After the pattern, a pattern is formed by plasma-discharging the surface of the conductive layer (III) as needed, and then a plating layer is formed on the oxidized surface of the conductive layer (III) by electroplating or electroless plating. (IV), whereby a method of forming a desired pattern is formed.

The conductive pattern obtained by the above method can provide particularly excellent durability at a level that maintains good electrical conductivity without causing peeling between the layers, and the like, and thus can be preferably used for using silver ink or the like. Forming a circuit-forming substrate used in an electronic circuit or an integrated circuit; forming an organic solar cell, an electronic book terminal, an organic EL, an organic transistor, a flexible printed circuit board, an RFID, or the like, or forming a peripheral wiring; In the wiring of electromagnetic wave shields of displays, etc.; especially for applications requiring durability. In particular, the conductive pattern that performs the plating treatment can form a highly reliable wiring pattern that maintains good electrical conductivity without causing disconnection for a long period of time, and thus can be used, for example, as a copper clad laminate. (CCL: Copper Clad Laminate) Flexible Printed Circuit (FPC), Tape Automated Bonding (TAB), Film Over Film (COF), and Printed Wiring Board (PWB, Printed Wiring Board) and other uses.

[Examples]

Hereinafter, the present invention will be described in detail by way of examples.

[Preparation of support (F-1)]

Prepare pyromellitic dianhydride and 4,4'-diaminodiphenyl ether in a ratio of 50/50 in terms of molar ratio, so that the polymerization is equal to N,N"-dimethylacetamide. This obtained a polyamine acid solution (A-1) having a nonvolatile content of 20% by mass.

Further, biphenyl 3,4,3',4'-tetracarboxylic acid dihydrate and 4,4'-diaminodiphenyl ether are prepared in a ratio of 50/50 in terms of molar ratio, so that the ratio is equal to N, Polymerization was carried out in N'-dimethylacetamide, whereby a polyamine acid solution (A-2) having a nonvolatile content of 20% by mass was obtained.

Then, it is [the mass of the polylysine contained in the above polyamic acid solution (A-1)] / [the mass of the polylysine contained in the above polyamic acid solution (A-2)] Mixing the above polyamic acid solution (A-1) and the above polyamic acid solution (A-2) in a manner of =35/65, and mixing 0.2% by mass of cerium oxide particles having an average particle diameter of 0.3 μm. The mixture was obtained.

Thereafter, the mixture was subjected to filtration and defoaming treatment, and extruded from a T mold and cast on a drum.

The cast film was dried at 100 ° C for 60 seconds to prepare a film containing the above polyamic acid and the above-mentioned cerium oxide.

After peeling off the film from the roll, it was dried at 250 ° C for 60 seconds, then dried at 300 ° C for 60 seconds, and then dried at 400 ° C for 75 seconds, thereby obtaining a support comprising a polyimide film. (F-1). The film thickness of the above support was 40 μm.

[Preparation of support (F-2)]

Prepare pyromellitic dianhydride, 4,4'-diaminodiphenyl ether, biphenyl 3,4,3',4'-tetracarboxylic acid dihydrate in a ratio of 50/50/100 in terms of molar ratio And 4,4'-diaminodiphenyl ether, which was polymerized in N,N'-dimethylacetamide, thereby obtaining a polyamine acid solution having a nonvolatile content of 20% by mass. Further, 0.2% by weight of cerium oxide particles having an average particle diameter of 0.3 μm were mixed, whereby a mixture was obtained.

Thereafter, the mixture was subjected to filtration and defoaming treatment, and extruded from a T mold and cast on a drum.

The cast film was dried at 100 ° C for 60 seconds to prepare a film containing the above polyamic acid and the above-mentioned cerium oxide.

After peeling off the film from the roll, it was dried at 250 ° C for 60 seconds, then dried at 300 ° C for 60 seconds, and then dried at 400 ° C for 75 seconds, thereby obtaining a support comprising a polyimide film. (F-2). The film thickness of the above support was 39 μm.

[Preparation of support (F-3)]

Polyfluorene obtained by polymerizing biphenyl 3,4,3',4'-tetracarboxylic acid dihydrate and 1,4-diaminobenzene in a ratio of 50/50 in terms of molar ratio. In addition to the polyamic acid solution (A-1) and the polyamic acid (A-2), an amine acid is produced by the same method as the above-mentioned support (F-1). The support of the imine film (F-3). The film thickness of the above support was 49 μm.

[Preparation of support (F-4)]

Instead of the above polyamic acid solution, a polylysine obtained by polymerizing pyroic anhydride and 4,4'-diaminodiphenyl ether in a ratio of 50/50 in molar ratio is used. -1) and the above-mentioned poly-proline (A-2), and using 0.05% by mass of calcium phosphate having an average particle diameter of 1 μm instead of the above-mentioned ceria having an average particle diameter of 0.2 μm, and using the above support The support (F-4) containing a polyimide film was produced in the same manner as in the production method of (F-1). The film thickness of the above support was 50 μm.

[Preparation of Resin Composition (R-1)]

A polyester polyol (a polyester obtained by reacting 1,4-cyclohexanedimethanol, neopentyl glycol, and adipic acid) in a nitrogen-substituted vessel equipped with a thermometer, a nitrogen gas introduction tube, and a stirrer 100 parts by mass of alcohol, 17.6 parts by mass of 2,2-dimethylolpropionic acid, 21.7 parts by mass of 1,4-cyclohexanedimethanol, 106.2 parts by mass of dicyclohexylmethane diisocyanate in 178 mass of methyl ethyl ketone a reaction in a mixed solvent, thereby obtaining isocyanide at the end of the molecule An organic solvent solution of an acid ester based urethane prepolymer.

Then, by adding 13.3 parts by mass of triethylamine to the organic solvent solution of the urethane resin, one or all of the carboxyl groups of the urethane resin are neutralized, and water 380 is further added. The mixture was thoroughly stirred to obtain an aqueous dispersion of the urethane resin.

Then, by adding 8.8 parts by mass of a 25% by mass aqueous solution of ethylenediamine to the aqueous dispersion and stirring, the chain of the particulate polyurethane resin is elongated, and then aging and solvent removal are performed. An aqueous dispersion of a urethane resin (r-1) having a solid content concentration of 30% by mass was obtained. The above urethane resin (r-1) had a weight average molecular weight of 53,000.

Then, 140 parts by mass of deionized water was added to a reaction vessel equipped with a stirrer, a reflux cooling tube, a nitrogen introduction tube, a thermometer, a dropping funnel for dropping a monomer mixture, and a dropping funnel for a polymerization catalyst dropping, and the above-mentioned medium 100 parts by mass of the obtained aqueous dispersion of the urethane resin (r-1) was heated to 80 ° C while blowing nitrogen gas.

In a reaction vessel heated to 80 ° C, the temperature in the reaction vessel was maintained at 80 ± 2 ° C while stirring, and 60 parts by mass of methyl methacrylate and n-butyl acrylate were added dropwise from each dropping funnel over 120 minutes. 30 parts by mass of a monomer mixture of 10 parts by mass of N-n-butoxymethyl acrylamide and 20 parts by mass of an aqueous solution of ammonium persulfate (concentration: 0.5% by mass) were polymerized.

After completion of the dropwise addition, the mixture was stirred at the same temperature for 60 minutes to obtain an aqueous dispersion containing the shell layer of the above urethane resin (r-1) and the core layer of the vinyl polymer.

The temperature in the reaction vessel was cooled to 40° C., and then deionized water was used so that the nonvolatile content was 20.0% by mass, and then filtered through a 200-mesh filter cloth to obtain a resin composition (R-1).

[Preparation of Resin Composition (R-2)]

In a reaction flask equipped with a reflux condenser, thermometer, and agitator, including 37 200 parts by mass of formalin and 7% by mass of methanol of formalin and formaldehyde (content: 222 parts by mass (7.4 mol), methanol content: 42 parts by mass (1.31 mol)), 200 parts by mass of water and 350 parts by mass of methanol (10.92 mol). After adding a 25% by mass aqueous sodium hydroxide solution to the aqueous solution to adjust the pH to 10, 310 parts by mass of melamine (2.46 mol) was added, and the liquid temperature was raised to 85 ° C to carry out methylolation (primary reaction). Reaction time: 1 hour).

Thereafter, formic acid was added to adjust the pH to 7, and then the mixture was cooled to 60 ° C to carry out an etherification reaction (secondary reaction). A 25% by mass aqueous sodium hydroxide solution was added to a clouding temperature of 40 ° C to adjust the pH to 9, and the etherification reaction was stopped (reaction time: 1 hour). The residual methanol was removed under reduced pressure of 50 ° C (demethylation time: 4 hours) to obtain a melamine resin-containing resin composition (R-2) having a nonvolatile content of 80% by mass.

In addition, the measuring method of the said white turbid temperature is demonstrated below. 1 g of the resin was taken, and the resin was mixed with 100 ml of hot water adjusted to a predetermined temperature. At this time, the maximum temperature at which the resin is insoluble in hot water and becomes cloudy is set to a white turbid temperature.

[Preparation of Conductive Ink]

Conductive ink 1 was prepared by dispersing silver particles having an average particle diameter of 30 nm in a mixed solvent of 45 parts by mass of ethylene glycol and 55 parts by mass of ion-exchanged water.

[Example 1]

Using TEC-4AX (corona surface modification evaluation device manufactured by Kasuga Electric Co., Ltd., gas: air (oxygen concentration: about 21% by mass), pitch: 1.5 mm, output: 100 W, processing time: 2 seconds) The surface of the body (F-1) was subjected to corona discharge treatment.

Thereafter, the resin composition (R-1) was applied to the surface of the support by a spin coater so that the dried film thickness was 0.1 μm, and then dried at 80 ° C by a hot air dryer. After 5 minutes, a layered body in which the resin layer (II) was laminated on the surface of the layer (I) including the above-mentioned support was obtained.

Then, on the surface of the above resin layer (II), the above-mentioned conductive coating is applied by a spin coating method. The ink was then fired at 250 ° C for 3 minutes to prepare a conductive layer (III) (thickness: 0.1 μm) formed of the above silver. The surface resistance of the above-mentioned conductive layer (III) was measured by the following method and found to be 2 Ω / □.

Then, TEC-4AX (corona surface modification evaluation device manufactured by Kasuga Electric Co., Ltd., gas: air (oxygen concentration: about 21% by mass), pitch: 1.5 mm, output: 100 W, processing time: 2 seconds) was used. The surface of the above conductive layer (III) is subjected to corona discharge treatment. The surface resistance of the above-mentioned conductive layer (III) before the corona discharge treatment was 2 Ω/□, but the surface resistance of the corona discharge-treated conductive layer (III) was increased to 5 Ω/□. Further, the surface was analyzed by the same X-ray photoelectron analyzer described above, and as a result, it was confirmed that the peak in which the silver forming the conductive layer (III) was oxidized was observed.

Then, the oxidized surface of the conductive layer (III) is set as a cathode, phosphorus-containing copper is set as an anode, and plating is performed for 15 minutes at a current density of 2 A/dm ² using a plating solution containing copper sulfate. A copper plating layer having a surface layer thickness of 8 μm of the layer (III). As the plating solution, 70 g/liter of copper sulfate, 200 g/liter of sulfuric acid, 50 mg/liter of chloride ion, and 5 g/liter of Top Lucina SF (gloss agent manufactured by Okuno Pharmaceutical Co., Ltd.) were used.

By the above method, a layered product (L-1) in which the layer (I) including the support, the resin layer (II), the conductive layer (III), and the plating layer (IV) are laminated is obtained.

[Embodiment 2]

A layer (I) including a support layer and a resin layer were laminated in the same manner as in Example 1 except that the resin composition (R-2) was used instead of the above resin composition (R-1). (II), a laminate (L-2) of the conductive layer (III) and the plating layer (IV).

[Example 3]

The support (F-2) is used in place of the above support (F-1), and a mixture of the resin composition (R-1) and the resin composition (R-2) is used in a ratio of 50/50 (solid content). A product obtained by the same method as in Example 1 was used instead of the above resin composition (R-1). The layer has a layered body (L-3) including the layer (I) of the support, the resin layer (II), the conductive layer (III), and the plating layer (IV).

[Comparative Example 1]

A layer (I) and a resin layer (II) containing the above-mentioned support were laminated in the same manner as in Example 1 except that the support (F-3) was used instead of the above-mentioned support (F-1). And a laminated body (L'-1) of the conductive layer (III) and the plating layer (IV).

[Comparative Example 2]

A layer (I) and a resin layer (II) containing the above-mentioned support were laminated in the same manner as in Example 1 except that the support (F-4) was used instead of the above-mentioned support (F-1). ), the above-mentioned conductive layer (III) and the laminated body of the above-mentioned plating layer (IV) (L'-2)

<Adhesion: Evaluation by peeling test>

The peel strength measurement of the laminate obtained in the above was carried out by the method according to IPC-TM-650, NUMBER2.4.9. The wire width used for the measurement was set to 1 mm, and the angle of peeling was set to 90°. In addition, the peeling strength tends to increase as the thickness of the plating layer becomes thicker, and the peel strength in the present invention is measured based on the measured value of the plating layer of 8 μm which is currently used.

<Heat resistance: Evaluation by peel test after heat resistance test (temperature 150 ° C)>

The laminate obtained above was dried for 168 hours using a dryer set at 150 °C. The peel strength was measured by the same method as the method described in the above [Evaluation by Peel Test], except that the laminate after drying was used.

<Heat and heat resistance: Evaluation by peel test after heat and humidity resistance test (temperature 135 ° C and humidity 85%) >

The laminate obtained in the above was placed in a HAST tester set at a temperature of 135 ° C and a humidity of 85% for 168 hours. The peeling strength was measured by the same method as the method described in the above [Evaluation by Peel Test], except for using the laminate after the above-described humidity resistance test.

Claims (8)

A layered product comprising: a layer (I) comprising a polyimide resin (i-1) having a structure represented by the following formula (1) and having the following formula (2) A support (I1) of the polyimine resin (i-2) having a structure represented by the above, or a polyfluorene having a structure represented by the following formula (1) and a structure represented by the following formula (2) a support (I2) of the imine resin (i-3); a resin layer (II) receiving a fluid containing the conductive material (x); and a conductive layer (III) composed of the conductive material (x) Formed [R ¹ to R ⁸ in the formula (1) each independently represent a hydrogen atom, a halogen atom or an organic group, and n represents an integer of 1 to 1,000] [R ⁹ to R ²² in the formula (2) each independently represent a hydrogen atom, a halogen atom or an organic group, and m represents an integer of from 1 to 1,000]. The laminate according to claim 1, wherein the layer (I) comprising the support further contains cerium oxide microparticles having an average particle diameter of from 0.01 μm to 1 μm. The laminate according to claim 1, wherein the resin layer (II) is a composite resin (II-1) comprising a urethane resin and an acrylic resin, or a melamine resin (II-2). The laminate according to claim 1, wherein a part or all of the surface of the conductive layer (III) has a plating layer (IV). The laminate of claim 4, wherein one or both of the conductive layers (III) comprise oxidized silver. The laminate according to claim 4, wherein the plating layer (IV) is formed by electrolytic copper plating. A conductive pattern comprising the laminate according to any one of claims 1 to 6. A circuit having a laminate as claimed in any one of claims 1 to 6.