TW201410484A - Controlling adhesives between substrates and carriers - Google Patents

Abstract

Controlling adhesives between substrates and carriers includes forming a depression into a bonding area of a backside surface of a substrate of a print head where the bonding area being formed proximate an ink feed slot formed through the thickness of the substrate from the backside surface to a front side surface; placing an adhesive between the bonding area and a substrate carrier, and moving the substrate and the substrate carrier together such that the adhesive flows into the depression.

Description

Technique for controlling the adhesive between the substrate and the carrier

The present invention relates to a technique for controlling an adhesive between a substrate and a carrier.

Background of the invention

In the field of ink jet printing, ink droplets are discharged from a nozzle array located in a row of printheads onto a print medium such as paper. The ink is bonded to one of the surface of the printing medium and forms a pattern, text, or other image. The ink droplets are accurately released to ensure accurate image formation. In general, the media is delivered beneath the printhead while the droplets are selectively released. The media transport speed series is included in the parameters of the droplet release timing.

The print head typically includes a number of ink chambers, also referred to as firing chambers. Each of the ink chambers is fluidly coupled to one of the nozzles in the array and provides ink dispensed by the individual printhead nozzles. Prior to the release of the droplets, the ink located in the ink chamber remains from leaking out of the nozzle due to the capillary forces acting on the ink located in the nozzle passage and or back pressure.

During release of the droplets, the ink located in the ink chamber exits the nozzle by actively increasing the pressure in the chamber. Some print heads An impedance heater disposed in the chamber is used to evaporate a small amount of at least one component of the liquid ink. In many cases, one of the liquid inks is primarily composed of water and the resistive heater evaporates water. The evaporated component or components are expanded to form a gaseous driving bubble in the ink chamber. This expansion exceeds the holding force enough to expel a single drop out of the nozzle. Other ink chambers use a thin film of piezoelectric material to eject ink droplets. When a voltage is applied to the piezoelectric material, the piezoelectric material expands, which increases the internal pressure of the ink chamber and overcomes the holding force to discharge the droplets.

An ink reservoir is capable of supplying ink to the ink chamber. The ink reservoir can be fluidly coupled to the chamber with at least one ink supply slot that connects the ink chamber to the ink reservoir. Generally, the ink supply tank is formed in a crucible base bonded to the body of the ink reservoir.

According to an embodiment of the present invention, a method for controlling an adhesive between a substrate and a carrier is specifically proposed, the method comprising: forming a recess in an adhesive region of a back side surface of a substrate of one of the print heads The adhesive region is formed adjacent to an ink supply passage formed from the back side surface to a front side surface and extending through the thickness of the base body, the back side surface being adjacent to an ink reservoir, and the front side surface is adjacent to an ink The firing chamber; an adhesive is disposed between the bonding region and a substrate carrier; the substrate and the substrate carrier are moved together such that the adhesive flows into the recess.

100‧‧‧Printing system

101‧‧‧ Controller

102‧‧‧Printing media

103‧‧‧Printing media transport agency

104‧‧‧Print head with grooved base

105‧‧‧Ink reservoir

200‧‧‧ pieces

201‧‧‧Print head

202‧‧‧Ink reservoir

203‧‧‧Electronic contacts

204‧‧‧ hatching

205‧‧‧ nozzle

206‧‧‧Nozzle layer

300‧‧‧Print head

301‧‧‧Ink chamber

302‧‧‧Nozzle layer

303‧‧‧ base

304‧‧‧ nozzle

305‧‧‧Drop release mechanism

306‧‧‧Ink reservoir

307‧‧‧Ink feed trough

308‧‧‧ Back side surface

309‧‧‧ front side surface

310‧‧‧Base carrier

311‧‧‧Ink reservoir body

312‧‧‧bonding area

313‧‧‧ recess

314‧‧‧Adhesive

315‧‧ ‧ gap height

316‧‧‧ recess depth

317‧‧‧ recess width

318‧‧‧External joints

319‧‧‧External joints

320‧‧‧Internal joints

321‧‧‧Internal joints

322‧‧‧Adhesive protrusions

323‧‧‧ wall pieces

325‧‧‧Ink feed trough

326‧‧‧Ink feed trough

400‧‧‧ Back side surface

401‧‧‧ base

402‧‧‧First bonding area

403‧‧‧First ink supply tank

404‧‧‧Second ink supply tank

405‧‧‧Second bonding area

407‧‧‧third ink supply tank

408‧‧‧Multiple trenches

411‧‧‧Multiple trenches

412‧‧‧Multiple trenches

413‧‧‧Multiple trenches

414‧‧‧First length

415‧‧‧second length

500‧‧‧Print head

501‧‧‧Internal contacts

502‧‧‧Internal contacts

503‧‧‧ trench

504‧‧‧ trench

505‧‧‧bonding area

506‧‧‧bonding area

507‧‧‧ Groove wall

508‧‧‧Adhesive

509‧‧‧ base

510‧‧‧Base carrier

511‧‧‧ surface

600‧‧‧ Back side surface

601‧‧‧ base

602‧‧‧ trench

603‧‧‧ trench

604‧‧‧Ink feed trough

605‧‧‧Width

606‧‧‧bonding area

607‧‧‧bonding area

608‧‧‧Ink feed trough

609‧‧‧Ink feed trough

700‧‧‧Print head

701‧‧‧bonding area

702‧‧‧ Bonding area

703‧‧‧Inside joint

704‧‧‧Inside joint

705‧‧‧ recess

706‧‧‧Ink feed trough

707‧‧‧ inner wall

708‧‧‧Adhesive

709‧‧‧ base

710‧‧‧Base carrier

800‧‧‧ Back side surface

801‧‧‧ base

802‧‧‧ recess

803‧‧‧bonding area

804‧‧‧bonding area

805‧‧‧Ink feed trough

900‧‧‧Print head

901‧‧‧Outer joint

902‧‧‧ base

903‧‧‧Base carrier

904‧‧‧ Bonding area

905‧‧‧ trench

906‧‧‧ Keep lip

908‧‧‧Ink feed trough

1000‧‧‧ first stage

1001‧‧‧Anti-etching layer

1002‧‧‧ Back side surface

1003‧‧‧ base

1004‧‧‧ second stage

1005‧‧‧Exposed areas

1006‧‧‧ third stage

1007‧‧‧ groove

1008‧‧‧ front side surface

1009‧‧‧ base film

1010‧‧‧ fourth stage

1011‧‧‧Ink feed trough

1012‧‧‧ recess

1100‧‧‧ exemplary method

Steps 1101, 1102, 1103‧‧

1200‧‧‧Plotting

1201‧‧‧y axis

1202‧‧‧x axis

1203‧‧‧plotting line

1204‧‧‧plotting line

1205‧‧‧plotting line

1206‧‧‧plotting line

1207‧‧‧ Signature legend

The drawings show different examples of the principles disclosed herein. And become part of this manual. The examples shown are for illustrative purposes only and are not intended to be limiting of the scope of the application.

1 is a diagram of an exemplary printing system in accordance with the principles described herein.

2 is a diagram of an exemplary ink cartridge in accordance with the principles described herein.

3 is a cross-sectional view of an exemplary printhead in accordance with the principles described herein.

4 is a diagram of an exemplary backside surface of one of the substrates in accordance with the principles described herein.

Figure 5 is a cross-sectional view of an exemplary printhead in accordance with the principles described herein.

6 is a diagram of an exemplary backside surface of one of the substrates in accordance with the principles described herein.

Figure 7 is a cross-sectional view of an exemplary printhead in accordance with the principles described herein.

Figure 8 is a diagram of an exemplary backside surface of one of the substrates in accordance with the principles described herein.

9 is a cross-sectional view of an exemplary cross section of a row of printheads in accordance with the principles described herein.

10 is a diagram of an exemplary stage of fabrication in accordance with the principles described herein.

Figure 11 is a diagram for use in accordance with the principles described herein. A diagram of an exemplary method of controlling an adhesive between a substrate and a carrier.

Figure 12 is an exemplary plot showing the relationship of the gap height to the recess from the ink supply slot in accordance with the principles described herein.

Detailed description of the invention

The width of the ink feed slot may be on the micrometer scale. Therefore, tiny obstructions may adversely affect the flow of ink from the ink reservoir to the ink chamber. In addition, the obstruction may trap air or other gases in the ink chamber. If an adhesive that bonds the substrate to the body of the ink reservoir protrudes far enough to fit into the width of the ink supply slot, the adhesive may impede ink flow and air management of the printhead.

A method for controlling an adhesive between a substrate and a substrate carrier such as a body of the ink reservoir can include forming a recess in an adhesive region of a backside surface of the substrate of a row of printheads. The adhesive region can be formed adjacent to an ink supply passage such as a groove, and can be formed from the back side surface through the thickness of the base to a front side surface. In addition, the method can also include disposing an adhesive between the bonding region and a substrate carrier and moving the substrate together with the substrate carrier to allow the adhesive to flow into the recess.

In the following description, for the sake of solution, a number of different specific details are set forth to provide a thorough understanding of the present system and method. However, it will be apparent to those skilled in the art that the device, system, and method of the present invention can be practiced without the specific details. The word "an example" or similar words in the specification of the present invention means that one of the specific features, configurations, or characteristics described is included in at least one example, but not necessarily in other examples.

1 is an exemplary printing system 100 in accordance with the principles described herein. In this example, the printing system 100 can be a domestic, commercial, or industrial printer. A controller 101 of the printing system is capable of receiving a print command from a near or far source to print an image onto a print medium 102. The print medium can include any type of suitable sheet or roll material such as paper, card, transparencies, mela, polyester, wood splint, foam board, fiber, canvas, other media, or combinations thereof. The controller 101 is capable of controlling a transport mechanism 103 that moves the print media beneath a stack of print heads 104. The controller 101 is capable of causing a print head to release ink droplets onto the print medium from a nozzle array formed in the print head. The controller 101 is capable of controlling droplet release by means of a piezoelectric material film or a thermal resistor in accordance with instructions to increase the internal pressure of the ink chamber to a level sufficient to discharge ink droplets.

An ink reservoir 105 is fluidly connectable to the ink chamber of the printhead 104. The ink reservoir 105 is capable of supplying ink to the ink chamber through at least one ink supply passage formed between the ink reservoir 105 and the ink chamber. In some examples, the ink feed channel can be a slot, other channels, multiple slots or other channels, or a combination thereof. In the example of FIG. 1, a substrate separates the ink chamber from the ink reservoir 105, and the substrate is provided with a groove on one of the adhesive surfaces of the back side surface thereof.

2 is an exemplary component in accordance with the principles described herein. One of the patterns of 200. In this example, the element 200 is a removable, integrated ink cartridge that incorporates a row of printheads 201. An ink reservoir 202 can occupy a substantial portion of the volume of the cartridge and can be dedicated to supply ink to the printhead 201. Electronic contacts 203 are electrically connectable to the ink chamber and are capable of accepting commands from the printhead controller. The reaction-instruction emits ink in an ink chamber, and the droplet discharge mechanism of the print head 201 is capable of increasing the internal pressure in the ink chamber sufficiently to release the ink droplets.

In the example of FIG. 2, hatching 204 indicates that FIG. 3 is a cross-sectional view of one of printheads 201. The print head 201 has a plurality of nozzles 205 formed in a nozzle layer 206.

3 is a cross-sectional view of an exemplary printhead 300 as viewed from section line 204 of the example shown in FIG. 2. In this example, the ink chamber 301 is formed between a nozzle layer 302 and a substrate 303. Some nozzles 304 are formed in the nozzle layer 302. A drop release mechanism 305 can be disposed beneath each of the nozzles 304 to produce a drop release in accordance with the instructions. In some examples, the drop release mechanism 305 is an impedance heater, a film of piezoelectric material, other ink droplet release mechanisms, or a combination thereof. The ink release mechanism can increase the internal pressure in the ink chamber 301 by expanding itself or forming a bubble expansion. These expansions are capable of discharging a droplet from the ink chamber via the nozzle.

The ink from an ink reservoir 306 can flow through the ink supply tank 307 formed in the substrate 303 to replenish the volume of ink lost due to droplet discharge. Although the example of Figure 3 includes three ink feed slots 307, 325, 326, any number of ink supply slots can be formed in the substrate 303. The ink supply slots 307, 325, 326 can extend from the back side surface 308 of the base 303 through the entire thickness of the base 303 to a front side surface 309 of the base 303. In some examples, the ink chamber 301 can be coupled to the ink reservoir 306 with at least one ink supply aperture or other channel formed in the substrate.

The back side surface 308 of the base 303 can be bonded to the base carrier of the ink reservoir body 311 at the adhesive region 312 formed in the back side surface 308. At least one recess 313 can be formed in the adhesive region 312 to accommodate the flow of the adhesive 314 as the substrate 303 and the substrate carrier 310 move together. In the example of FIG. 3, the recess 313 is a groove adjacent to an ink supply slot 326 and formed along the length of the ink supply slot 326.

The recess 313 prevents the adhesive from being inserted into the ink supply slot 326 as the base carrier 310 moves with the base 303. Adhesive 314 is capable of bonding the substrate carrier 310 to the substrate 303 while avoiding leakage from an ink supply tank to other supply tanks. The base 303 can be formed of tantalum. In some examples, the base system is a crystalline matrix, such as a doped crystal matrix, an undoped crystal matrix, a single crystal germanium matrix, a polycrystalline germanium matrix, or a combination thereof. Other suitable examples of substrates include: gallium, gallium arsenide, gallium phosphide, phosphatase, glass, germanium dioxide, ceramics, semiconductor materials, other materials, or combinations thereof. The thickness of the substrate can be between 100 and 2000 microns. In some examples. The substrate has a thickness of about 675 microns.

The gap height 315 between the base 303 and the base carrier 310 can be 10 Micron to 250 microns. In certain embodiments, the gap height is between 125 and 175 microns. In some embodiments, the recess has a recess depth 316 that is substantially equal to the gap height 315. In certain embodiments, the recess depth 316 is between 10 microns and 250 microns. In some embodiments, the recess depth 316 is between 80 and 160 microns.

In some embodiments, the recess 313 is spaced a distance from the ink supply slot 326. In certain embodiments, the distance is less than 250 microns, less than 150 microns, less than 75 microns, less than 40 microns, less than 15 microns, other distances, or a combination thereof. In certain embodiments, the recess has a recess width 317 of less than 250 microns, less than 150 microns, less than 75 microns, less than 40 microns, less than 15 microns, other distances, or a combination thereof.

In the example of FIG. 3, the outer joints 318, 319 have no recessed areas of adhesion, while the inner joints 320, 321 have grooved areas of adhesion. In FIG. 3, the adhesive of the outer joints 318, 319 is shown to protrude beyond the wall member 323 of the ink supply tank and into the space of the ink supply tank 307. On the other hand, the adhesion of the inner joints 320, 321 is maintained outside the space of the ink supply tank. In the example shown, the adhesive protrusions 322 may interfere with the flow of ink from the ink reservoir 306 to the ink chamber 301 and/or the protrusions 322 may trap air or other debris in the ink. In the trough 307.

The ink supply tanks 307, 325, 326 can have a gradually increasing cross-sectional area as the crotch portions of the ink supply tanks 307, 325, 326 approach the back side surface 308 from the front side surface 309. When the droplet is released, air or bubbles may enter the ink through a leak in the printhead or other reason. Chamber. Air bubbles in the ink chamber can interfere with ink release, and the progressively larger diameter of the ink supply slot can provide a path for the air bubbles to move away from the ink chamber 301. However, debris or adhesive projections may trap air bubbles in the ink supply slots 307, 325, 326. As a result, the recess 313 in the adhesive region 312 can prevent air from trapping in the ink supply slots 307, 325, 326.

4 is an exemplary backside surface 400 of one of the substrates 401 in accordance with the principles described herein. In this example, a first bonding region 402 is located between a first ink supply slot 403 and a second ink supply slot 404. The first ink supply slot 403 can have a first length 414 and the second ink supply slot 404 can have a second length 415. A second bonding region 405 can be located between the second ink supply tank 404 and a third ink supply tank 407. In the bonded regions 402, 405, the recesses can take the form of multiple grooves 408, 411, 412, 413 that extend along the length of the ink supply slots 403, 404, 407. In the example of FIG. 4, the grooves 408, 411, 412, 413 are substantially parallel to the ink supply slots 403, 404, 407. However, in other embodiments, at least one of the grooves 408, 411, 412, 413 may not be parallel with at least one of the ink supply slots 403, 404, 407. The grooves 408, 411, 412, 413 can be spaced apart from the ink supply slots 403, 404, 407 and the grooves 408, 411, 412, 413 can extend beyond the length of the ink supply slots 403, 404, 407. In some examples, a recess such as a groove is formed along the width of at least one of the ink feed slots 403, 404, 407.

Figure 5 is an exemplary column in accordance with the principles described herein. A cross-sectional view of the printhead 500. In this example, the inner contacts 501, 502 are provided with recesses with individual grooves 503, 504 that span more than fifty percent of the width of the individual bonded regions 505, 506. In some examples, the grooves span ninety-five percent or less of the width of the bonded regions. In some examples, the grooves span less than ninety percent of the width of the bonded region, less than seventy-five percent of the width of the bonded region, and less than the width of the bonded region. Sixty, less than the other percentages, or a combination thereof.

A grooved wall portion 507 can help maintain a slight amount of adhesive 508 from projecting into the ink supply slot 508. In some examples, the grooved crotch portion 507 has a strength sufficient to withstand the adhesive expansion force when the base 509 and the base carrier 510 are brought together. In some examples, the grooved crotch portion 507 is arranged to form an angle with respect to one of the surfaces 511 of the base carrier 510. In some examples, the angle formed by the surface of the substrate carrier and the grooved crotch is ninety degrees. In other examples, the angle is between 130 degrees and 20 degrees. In some examples, any suitable angle can be used as long as the angle is sufficient to prevent the adhesive protrusion from entering the ink supply slot 508.

FIG. 6 is an exemplary backside surface 600 of a substrate 601 in accordance with the principles described herein. In this example, the recess is a separate groove 602, 603 between the ink supply slots 604, 608, 609. The grooves 602, 603 can span more than fifty percent of the width 605 of the bonded regions 606, 607 located between the ink supply slots 604, 608, 609.

7 is a cross-sectional view of an exemplary printhead 700 in accordance with the principles described herein. In this example, the inner joints 703, 704 Bonding regions 701, 702 have recesses 705 that are in fluid connection with ink supply slots 706. For example, at least one recess 705 can bond the adhesive region 701 to the inner wall 707 of an ink supply tank 706. When the substrate 709 and the base carrier 710 are moved together, the adhesive 708 can flow into the recess 705 as the adhesive moves. In some examples, the adhesive 708 will slightly bulge into the space of the ink supply trough 706, but it will be less than the bulging condition of the adhesive when the recess 705 is not provided. In other examples, the adhesive 708 will slightly bulge into the space of the ink supply slot 706, but will not penetrate deep into the ink flow or trap the air in the ink supply slot 705. In other examples, the recess 705 that is fluidly coupled to the ink supply slot 706 retains the adhesive 708 such that the adhesive 708 does not enter the space of the ink supply slot 706.

The recess 705 can have any suitable shape. For example, the recess 705 fluidly coupled to the ink supply slot 706 can have a flat surface, a raised surface, a recessed surface, a curved surface, a continuous surface, a discontinuous surface, a corrugated surface. Angled surface, other surfaces, or a combination thereof.

FIG. 8 is a diagram of an exemplary backside surface 800 of one of the substrates 801 in accordance with the principles described herein. In this example, the recess 802 is partially formed in the adhesive regions 803, 804 of the back side surface 800 of the base 801. The recess 802 is capable of connecting the adhesive regions 803, 804 to the crotch portion of the ink supply slot 805. When the base 801 and the base carrier are moved together, the adhesive therebetween can be squeezed into the open space created by the recess 802.

9 is a cross-sectional view of an exemplary cross-section of a row of printheads 900 in accordance with the principles described herein. In this example, bonding to the base The outer joint 901 of the base 902 of the body carrier 903 is provided with an adhesive region 904 with a recess. In this example, the recess is a groove 905 that forms a retaining lip 906 to block the adhesive from entering the space of the ink supply slot 908. In other examples, the trench span exceeds fifty percent of the width of the bonded region 904. In another example, the recess is fluidly coupled to the ink supply slot 908 such that the recess connects the adhesive region 904 to the wall of the ink supply slot 908.

10 is a diagram of an exemplary stage of fabrication in accordance with the principles described herein. In this example, during the first stage 1000, an anti-etching layer 1001 is deposited on one of the backside surfaces 1002 of the substrate 1003. The anti-etching layer 1001 can be a mask layer made of any suitable material that is resistant to the etching environment. For example, the anti-etching layer 1001 can be a grown thermal oxide, a grown or deposited dielectric material such as a chemical vapor deposition (CVD) oxide, yttrium oxide formed by tetraethyl oxane (TEOS) pre-sinter, carbonization. Niobium, tantalum nitride, aluminum, titanium, copper, aluminum-copper alloy, aluminum-titanium alloy, gold, other materials or combinations thereof.

During the second phase 1004, the anti-etching layer 1001 can be patterned to create an exposed region 1005 of the backside surface 1002 of the substrate 1003. In some examples, the anti-etching layer 1001 is removed using a laser cutting process. However, other suitable patterning procedures can also be used, such as photolithography procedures in conjunction with gas or liquid chemical etching. Certain exposed areas 1005 can be wider than others. For example, some exposed areas can be expected to be used as ink feed slots, while other exposed areas can be expected to be recessed to control the adhesive when the substrate is bonded to the substrate carrier. flow. In this example, the areas expected to be the ink supply trough and the areas expected to be recesses can have different widths.

During a third stage 1006, certain matrix materials are removed from the exposed areas that are expected to be ink supply tanks. In some examples, the material is removed using a laser cutting program. Other techniques suitable for removing materials can include dry etching with plasma enhanced reactive ion etching (RIE), alternating sulfur hexafluoride (SF6) etching with octafluorobutene (C4F8) deposition, sand drilling, sawing or It is the abrasive that mechanically contacts the matrix material, or a combination thereof. Material removal can create a groove 1007 that passes through less than the entire thickness of the substrate 1003. In the example where a thin film layer is deposited on the front side surface 1008 of the substrate, a thin base film 1009 can be retained to protect the thin film layer from laser beam or other material removal techniques. Any impact that may cause damage.

During the fourth stage 1010, additional material can be removed from the substrate 1003 by a wet etch process. In some examples, wet etching is achieved by immersing the substrate 1003 in an anisotropic etchant for a period of time sufficient to complete the formation of the ink supply channel 1011 and the formation of the recess 1012. In some examples, the substrate 1003 is immersed in an etchant such as tetramethylammonium hydroxide (TMAH) or potassium hydroxide (KOH) for a period of one hour to three hours. The etchant can be any anisotropic wet etchant that is selective for the etch resist layer, any other film, any other layer that is to be retained after the wet etch is performed.

In some examples, a single wet etch is sufficient to form ink supply trough 1011 and recess 1012, and in other examples multiple uses. Wet etching procedure. For example, different etchants can be used at different times to form the ink supply tank 1011 or the recess 1012 into a predetermined shape. In particular, different etchants can have different etch rates. In other examples, the etchant is anisotropic, and thus the substrate is etched only in a particular direction. An anisotropic etchant can be used to form a straight cross-section in the ink feed slot, and a fast etch etchant can be used to remove a wider material than the exposed regions. In some examples, a slow etch etchant is used to etch a narrower profile of the ink feed slot and recess.

In some cases, different stages and procedures are used. Moreover, the stages can be implemented in a different order. For example, it is possible to produce exposed areas only in the area where the ink supply tank 1011 is to be made, and then perform etching only in those areas. After the ink supply tank 1011 is formed, an etch mask can then be deposited onto the surface of the ink supply tanks 1011. The area to be recess 1012 can then be cut to remove the etched resist layer, and then those areas are etched to form recess 1012.

11 is an exemplary method 1100 for controlling an adhesive between a substrate and a substrate carrier in accordance with the principles described herein. In this example, the method 1100 includes forming a recess in an adhesive region 1101 of a backside surface of a substrate of a printhead, wherein the adhesive region is formed adjacent to an ink supply slot, the ink supply slot Forming a thickness from the back side surface through the substrate to a front side surface, disposing an adhesive between the bonding area and a substrate carrier 1102, and moving the substrate together with the substrate carrier, so that the adhesive is applied Flow into the recess 1103.

In some examples, forming the recess in an adhesive region includes removing the etched resistive layer formed on the backside surface by laser cutting. The recess can be formed by wet etching the region exposed on the back side surface by removing the etching resist layer.

In some examples, the bond area is between an ink feed slot and other ink feed channels formed in the backside surface of the substrate. Forming the recess can include forming a first trench and a second trench, wherein the first trench runs along a first ink supply slot for a first length, and the second trench follows the first The two ink supply tanks are operated for a second length. In other examples, forming the recess includes forming a groove that runs along one of the ink supply slots for a length, and wherein the groove has a width that spans at least from the first ink supply slot to Fifty percent of the distance of the second ink supply tank.

In some examples, the backside surface of the substrate is contoured to form an ink supply slot and the recess includes laser cutting a etched resist layer formed in the backside surface to form an ink supply slot Opening, laser cutting the etch resist layer to form an opening for the recess, performing deep laser cutting to form a groove in the substrate, and performing wet etching to form an ink supply groove and a recess . In some examples, the trench is approximately 600 microns and the total thickness of the substrate is approximately 675 microns. In this example, the wet etch can last for ninety minutes.

In other examples, the backside surface of the substrate is contoured to form an ink supply slot and the recess includes an etch resist layer formed by laser cutting on the backside surface of the substrate to form an ink supply slot Take And the opening of the recess, cleaning the back side surface of the substrate due to any debris generated by the laser cutting, depositing a metal dry etching mask onto the back side surface of the substrate, and laser cutting a deep laser groove The trench reaches a depth of about 500 microns, and a dry etching process (such as SF6 etching and C4F8 deposition in turn) removes the thin substrate film produced by the laser trench cutting, and performs wet etching to complete the ink supply. Forming of grooves and recesses. In this example, the wet etch can last for fifty minutes.

In another example, contouring the backside surface of the substrate to form the ink supply slot and the recess includes coating an etched resist layer on the backside surface of the substrate and patterning it for dry etching To remove the etch resist layer to expose areas of the ink supply bath and recesses, remove any residue (materials expected to be selected as temporary masks when the substrate is etched), deposit a metal dry etch mask Forming a pattern for the trench region of the dry etching, dry etching a deep trench to initially penetrate the front side surface of the substrate, and performing a wet etching to complete the formation of the ink supply groove and the recess. In this example, the wet etch can last for about fifty minutes.

In some cases, the depth of the recess is controlled by the initial depth formed during the laser cutting process. In some examples, the initial depth is approximately 6 microns. The remaining depth of the recess can be controlled by the type of etchant and the etching time. In some examples, the final depth is approximately 90 to 150 microns.

Figure 12 is a diagram of an exemplary plot 1200 showing the gap height versus the recess from the ink supply slot, in accordance with the principles described herein. The relationship between distances. In this example, the plot 1200 has a y-axis 1201 that roughly represents the gap height between the substrate and the substrate carrier, and an x-axis 1202 that roughly represents the adhesive when the substrate carrier moves with the substrate. The distance moved. The moving distance is measured by measuring the distance of the edge of the adhesive from the central axis of the adhesive. The same volume of adhesive is used in each of the cases described in plot 1200. A designation legend 1207 displays different plot lines 1203, 1204, 1205 corresponding to different situations.

As outlined by the solid plot line 1203, in this example of the case, the movement produced when there is no recess in the bonded area is substantially flush. In this case, the relationship between the gap height and the movement of the adhesive is linear. However, as roughly represented by the plot line 1204, in the case where the bond area is from two grooves, the relationship begins to deviate from the linear relationship. However, at a particular gap height of 1205, the movement will generally decrease. In the case where a single wide trench is used, as represented by plot line 1206, the relationship also exhibits a non-linear relationship.

Although the recess has been specifically described above as an adhesive region formed on the back side surface of the substrate, the recess can be formed in one surface of the base carrier. In some examples, the recesses are arranged in a manner such that the adhesive can flow into the recess as the substrate and the substrate carrier move together.

Although the recesses have been described above as having a particular configuration and geometry, any configuration or geometry that prevents the adhesive projections from entering the ink supply slot can be used. For example, the recess can be a groove, a dimple, a recess, a recess, a pocket, other types of recesses, or a combination thereof. In some In an example, the recess includes a plurality of grooves, a plurality of dimples, a plurality of dimples, a plurality of dimples, a plurality of dimples, a plurality of recesses of other types, or a combination thereof. In some cases, the recess runs along the length of the ink feed slot, runs perpendicular to the length of the ink feed slot, runs at an angle to the ink feed slot, or otherwise operates in a combination. In the example where the recess is at least one groove, the groove can be substantially straight, curved, continuous, non-continuous, angled, curved, take other forms, or a combination thereof. In the example where the recess is at least one groove, the groove can have a U-shaped cross section, a V-shaped cross-section, a square cross-section, a rectangular cross-section, a cross-section of other shapes, or a combination thereof. .

Although the above examples have been described with a particular number of ink supply slots, the principles described herein enable the use of any number of ink supply slots. For example, a substrate can have between one and five ink feed slots.

The previous description is presented merely to illustrate and explain the principles described herein. This description is not intended to limit the invention to any precise and precise disclosure, and many modifications and changes can be made by those skilled in the art.

300‧‧‧Print head

301‧‧‧Ink chamber

302‧‧‧Nozzle layer

303‧‧‧ base

304‧‧‧ nozzle

305‧‧‧Drop release mechanism

306‧‧‧Ink reservoir

307‧‧‧Ink feed trough

308‧‧‧ Back side surface

309‧‧‧ front side surface

310‧‧‧Base carrier

311‧‧‧Ink reservoir body

312‧‧‧bonding area

313‧‧‧ recess

314‧‧‧Adhesive

315‧‧ ‧ gap height

316‧‧‧ recess depth

317‧‧‧ recess width

318‧‧‧External joints

319‧‧‧External joints

320‧‧‧Internal joints

321‧‧‧Internal joints

322‧‧‧Adhesive protrusions

323‧‧‧ wall pieces

325‧‧‧Ink feed trough

326‧‧‧Ink feed trough

Claims (15)

A method for controlling an adhesive between a substrate and a carrier, the method comprising: forming a recess in an adhesive region of a back side surface of a substrate of a print head, the adhesive region being adjacent to a back side The surface is formed to a front side surface formed by an ink supply passage extending through the thickness of the substrate, the back side surface being adjacent to an ink reservoir, and the front side surface is adjacent to an ink firing chamber; an adhesive is disposed thereon Between the bonding region and a substrate carrier; moving the substrate together with the substrate carrier such that the adhesive flows into the recess. The method of claim 1, wherein forming a recess in the adhesive region of the back side surface of the substrate of one of the print heads comprises removing a etched resist layer formed on the back side surface by laser cutting. The method of claim 1, wherein forming a recess in the adhesive region of the back side surface of the substrate of one of the print heads comprises exposing the etching resist layer on the back side surface by laser cutting removal The area of the back side surface is wet etched. The method of claim 1, wherein the bonding region is between the ink supply channel and a second ink supply channel formed in the backside surface. The method of claim 4, wherein a recess is formed in one of the print heads The bonding region of the back side surface of the substrate includes a first trench and a second trench, wherein the first trench runs along the first ink supply channel by a first length, and the second trench A second length is then run along the second ink supply channel. The method of claim 4, wherein forming a recess in one of the back side surfaces of one of the substrates of the one of the print heads comprises forming a groove along the first ink supply slot and the second One of the ink feed slots runs a length, wherein the groove includes a width that spans at least fifty percent of the distance from the first ink feed slot and the second ink feed slot. A printhead having a controlled adhesive between a substrate and a carrier, comprising: a substrate having a front side surface and a back side surface; at least one ink firing chamber adjacent the front side surface, and a An ink reservoir adjacent to the backside surface; an ink supply slot formed from the backside surface through the thickness of the substrate to the front side surface; and the backside surface including a bond adjacent the ink supply slot a region, and at least one recess formed in the bonding region. The print head of claim 7, wherein the at least one recess is a groove that runs along the length of the ink supply slot. The print head of claim 7, wherein the adhesive region is between the ink supply slot and a second ink supply slot formed in the backside surface. The print head of claim 9, wherein the at least one recess is a first groove and a second groove, wherein the first groove runs along the ink supply slot by a first length, and the first groove The second groove runs a second length along the second ink supply slot. The print head of claim 9, wherein the at least one recess is a groove running along a length of one of the ink supply slot and the second ink supply slot, wherein the groove comprises a groove a width that spans at least fifty percent of the distance from the ink supply trough and the second ink supply trough. The print head of claim 7, wherein the at least one recess is fluidly coupled to the ink supply slot. A system having a controlled adhesive between a substrate and a carrier, comprising: a substrate having a front side surface and a back side surface; at least one ink firing chamber adjacent the front side surface, and a contiguous An ink reservoir of the back side surface; an ink supply groove formed from the back side surface through the thickness of the substrate to the front side surface; the back side surface being formed in the back side surface by an adhesive And bonding a bonding region in the substrate carrier to a substrate carrier, the bonding region being located between the ink supply slot and a second ink supply slot formed in the backside surface; and at least one recess, It is formed in one of the bonded regions and is at least partially filled with an adhesive. The system of claim 13, wherein the at least one recess is a first trench and a second trench, wherein the first trench runs along the ink supply slot by a first length, and the second The groove runs a second length along the second ink supply trough. The system of claim 13 wherein the at least one recess is a single groove that runs a length along one of the ink supply slot and the second ink supply slot, wherein the groove comprises a width The width spans at least fifty percent of the distance from the ink supply trough and the second ink supply trough.