JP2010269499A - Manufacturing method for liquid ejection head and liquid ejector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a liquid ejection head in which a plurality of members constituting the liquid ejection head can be highly accurately and easily positioned and bonded, and to provide a liquid ejector. <P>SOLUTION: The manufacturing method for the liquid ejection head includes a contacting step in which bonding positioning pins are relatively pressed with each other in an in-plane direction of a bonding surface by inserting the bonding positioning pins into a bonding positioning hole formed in the first member and a bonding positioning hole formed in the second member, thereby contacting the bonding positioning pins to inner wall surfaces of the bonding positioning holes of the first member and second member; a first bonding step in which the first member and second member are bonded by curing a first adhesive as a cyanoacrylate adhesive in a state that a relative position of the first member and second member is determined; and a second bonding step in which the first member and second member are bonded by thermally curing a second adhesive cured when heated in a state that the first member and second member are bonded by the first adhesive. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a liquid ejecting head that ejects liquid from a nozzle opening and a liquid ejecting apparatus.

  In general, various types of ink jet recording heads, which are liquid ejecting heads used in printers, facsimiles, copying machines, and the like, are known depending on the mechanism for ejecting ink droplets. For example, a part of the pressure generating chamber communicating with the nozzle opening is configured by a diaphragm, and the diaphragm is deformed by pressure generating means such as a piezoelectric element to expand or contract the volume in the pressure generating chamber. There are those that eject ink droplets, and those that eject the ink droplets from the nozzle openings by changing the volume of the pressure generation chamber by deforming the diaphragm using electrostatic force.

  Such an ink jet recording head generally has a flow path forming substrate in which a pressure generating chamber is formed, a piezoelectric element holding portion for bonding to the flow path forming substrate and protecting the piezoelectric element, and a liquid flow path. A formed protective substrate, a nozzle plate having a nozzle opening, and the like are joined by a thermosetting adhesive. Thus, since it forms by adhering and laminating a plurality of members, when a position shift occurs when adhering each member, each member cannot be positioned with high accuracy and cannot be adhered with high accuracy. There is a problem.

  As a technique for solving such problems, positioning holes are formed in the flow path forming substrate wafer and the sealing substrate (protective substrate), and positioning pins having an inner diameter substantially the same as the outer diameter of the positioning holes are inserted for positioning. The technique to do is disclosed (refer patent document 1).

JP 2004-50487 A (Claim 1, paragraph [0052])

  However, since the ink jet recording head needs to be arranged at a high density for high-precision printing, it is miniaturized, and higher precision is required for positioning when bonding each member.

  In this case, if each member is bonded with a thermosetting adhesive as in the prior art, the adhesive layer between the members may also contract due to shrinkage when the adhesive is cured. Then, even if the positioning is performed with high accuracy, each member is displaced due to the contraction, and fixing in this state tends to cause a deterioration in displacement characteristics or liquid leakage due to the displacement, and the reliability of the ink jet recording head. There is a problem that becomes low. Such a problem is not limited to the ink jet recording head, but also exists in a liquid ejecting head that ejects another liquid.

  SUMMARY An advantage of some aspects of the invention is that it provides a liquid ejecting head manufacturing method and a liquid ejecting apparatus capable of easily positioning and bonding a plurality of members constituting the liquid ejecting head with high accuracy. And

  The method of manufacturing a liquid jet head according to the present invention is a method of manufacturing a liquid jet head including a laminated member formed by bonding a first member and a second member, the first member and the second member. Adhesive positioning hole forming step for forming an adhesive positioning hole penetrating each member by photolithography, and bonding to the adhesive positioning hole formed in the first member and the adhesive positioning hole formed in the second member A positioning pin is inserted, and the first member, the second member, and the adhesive positioning pin are relatively pressed in the in-plane direction of the adhesive surface, and the inside of the adhesive positioning hole of the first member and the second member A contact step of bringing the adhesive positioning pin into contact with the wall surface, and a relative position of the first member and the second member being determined; A first adhering step of adhering the first member and the second member by curing an adhesive; and first curing by heating in a state where the first member and the second member are adhered by the first adhesive. And a second bonding step of bonding the first member and the second member by thermosetting two adhesives.

  In such an aspect, the position of each member is determined by pressing the adhesive positioning pin against the inner wall surface of the adhesive positioning hole formed in each member by pressing in the in-plane direction of the adhesive surface. Positioning can be easily performed with high accuracy. In addition, since the adhesive positioning pin has a smaller diameter than the adhesive positioning hole, it is easier to insert the adhesive positioning pin into the adhesive positioning hole than when the adhesive positioning pin has the same diameter as the adhesive positioning hole. Furthermore, after determining the position, by curing the second adhesive that is thermally cured after temporarily bonding the members without heating with the first adhesive that is a cyanoacrylate-based adhesive that cures at room temperature, Since the contraction of the member accompanying the contraction of the second adhesive due to heating can be suppressed, the above-described highly accurate positioning state can be maintained and bonded and fixed. In addition, if temporary bonding is performed with the first adhesive which is a cyanoacrylate adhesive, the time required for the manufacturing process can be shortened because the curing time is extremely short compared to other adhesives. In addition, the normal temperature as used in the field of this invention means 20-30 degreeC.

  As a preferred embodiment of the present invention, after the second adhesive is provided in a predetermined region of the bonding surface between the first member and the second member, the contact step is performed, and then the first member Alternatively, the first adhesive is provided and cured in a region other than the predetermined region of the adhesive surface through the first adhesive introduction hole provided in the second member to perform the first adhesive process, and then heated. Performing the second bonding step by thermally curing the second adhesive, or after the abutting step, the first adhesive or the first member through the first adhesive introduction hole provided in the second member. A first adhesive is applied to a predetermined region of the bonding surface between the first member and the second member and cured to perform the first bonding step, and then a second provided on the first member or the second member. The second adhesive is provided in an area other than a predetermined area of the adhesive surface through an adhesive introduction hole. It includes performing the second bonding step is cured by heating Te. According to these embodiments, it is possible to hold, bond and fix the above highly accurate positioning state in a more preferable state.

  Here, it is preferable to perform the first bonding step while performing the contact step. By performing the first bonding step while performing the contact step, it is possible to suppress the repulsion between the members that occurs by releasing the pressure on the member after the contact, thereby suppressing the positional deviation between the members. It is possible to hold and fix a more accurate positioning state.

  Moreover, it is preferable to provide a groove around the opening on the bonding surface side of the adhesive introduction hole. Since the groove portion functions as a relief groove for the adhesive, unintended diffusion of the adhesive can be suppressed.

  Here, the first member and the second member are respectively formed with the bonding positioning holes made of a single hole and a long hole. In the contact step, the first member and the second member are bonded to the first member and the second member. By relatively pressing the positioning pin in the in-plane direction of the adhesive surface and bringing the adhesive positioning pin into contact with the inner wall surface of the single hole, the in-plane direction of the adhesive surface of the first member and the second member Fixing the relative position and fixing the rotation direction of the first member and the second member with respect to the single hole by bringing the adhesive positioning pin into contact with the inner wall surface of the elongated hole; preferable. According to this, since the rotation direction is also fixed, positioning becomes more accurate.

  Preferably, the adhesion positioning hole is a square hole, and in the abutting step, the adhesion positioning pin is pressed so as to abut against two inner wall surfaces that form a corner of the adhesion positioning hole. According to this, by bringing the adhesive positioning pin into contact with the corner of the adhesive positioning hole, the adhesive positioning pin is securely fixed, and the positioning becomes more accurate.

  The first member and the second member include a head region in which a plurality of head constituent members constituting the liquid ejecting head are integrally formed and a non-head region in which the head constituent member is not formed. The bonding positioning hole is provided in the non-head region, and has a step of dividing the first member and the second member into a liquid jet head after the second bonding step. Also good. Accordingly, even a member in which a plurality of liquid ejecting heads are integrally formed can be positioned with high accuracy and easily.

  The first member and the second member are preferably silicon single crystal substrates. According to this, since it is a silicon single crystal substrate, an adhesion positioning hole etc. can be formed with high precision by etching, so that positioning can be performed with higher precision.

  In the contact step, it is preferable that the first member and the second member are sandwiched between buffer members and pressed in the stacking direction of the first member and the second member. According to this, even if the first member and the second member are strongly pressed in the contact step, the buffer member is interposed, so that the first member and the second member can be prevented from being damaged.

  Further, when the first member and the second member are bonded to each of the first member and the second member at a target position, a test pattern adjacent to the first member and the second member, which do not overlap with each other, can be photographed. The method further includes a step of forming by lithography, and after the second bonding step, light is irradiated in the stacking direction to determine the bonding position of the first member and the second member depending on the presence or absence of transmitted light from the inspection pattern. You may have the test process which test | inspects precision. According to this, by forming a predetermined inspection pattern on each member and irradiating light, the accuracy of the bonding position can be easily inspected without using a measuring instrument.

  The shape of the inspection pattern formed on the first member and the inspection pattern formed on the second member in plan view is such that one of the inspection patterns surrounds the other inspection pattern. Preferably it is. According to this, since any one of the inspection patterns is formed so as to surround the other inspection pattern, it is possible to easily determine in which direction the displacement is caused when a positional deviation occurs.

  According to another aspect of the invention, there is provided a liquid ejecting apparatus including the liquid ejecting head manufactured by the manufacturing method according to the above aspect. In such a liquid ejecting head, since each member is positioned and bonded with high accuracy, the displacement characteristics are not deteriorated and liquid leakage is not easily caused by the positional deviation, so that a highly reliable liquid ejecting apparatus can be realized.

FIG. 2 is an exploded perspective view illustrating a schematic configuration of the recording head according to the first embodiment. 2A and 2B are a plan view and a cross-sectional view of a main part of the recording head according to the first embodiment. 5 is a cross-sectional view illustrating a manufacturing process of the recording head according to Embodiment 1. FIG. 5 is a cross-sectional view illustrating a manufacturing process of the recording head according to Embodiment 1. FIG. 5 is a cross-sectional view illustrating a manufacturing process of the recording head according to Embodiment 1. FIG. 5 is a cross-sectional view illustrating a manufacturing process of the recording head according to Embodiment 1. FIG. 5 is a plan view illustrating a manufacturing process of the recording head according to Embodiment 1. FIG. 5 is a plan view illustrating a manufacturing process of the recording head according to Embodiment 1. FIG. 5 is a plan view illustrating a manufacturing process of the recording head according to Embodiment 1. FIG. FIG. 3 is an enlarged cross-sectional view of a main part of a plurality of recording heads. FIG. 3 is an enlarged cross-sectional view of a main part of a plurality of recording heads. 1 is a schematic diagram illustrating an example of an ink jet recording apparatus according to an embodiment.

Hereinafter, the present invention will be described in detail based on embodiments.
(Embodiment 1)
FIG. 1 is an exploded perspective view showing a schematic configuration of an ink jet recording head which is an example of a liquid jet head manufactured by the manufacturing method according to Embodiment 1 of the present invention, and FIG. 2 is a plan view of the ink jet recording head. It is a figure and its AA 'sectional drawing.

  As shown in the drawing, the flow path forming substrate 10 is made of a silicon single crystal substrate having a crystal plane orientation of (110) in the plate thickness direction in this embodiment, and one surface thereof is made of silicon dioxide previously formed by thermal oxidation. An elastic film 50 is formed. The flow path forming substrate 10 is anisotropically etched from the other side, so that the flow path forming substrate 10 has a plurality of pressure generating chambers 12 partitioned by a plurality of partition walls 11 in the width direction (short side). Direction). An ink supply path 14 and a communication path 15 are partitioned by a partition wall 11 at one end side in the longitudinal direction of the pressure generation chamber 12 of the flow path forming substrate 10. Further, at one end of the communication passage 15, a communication portion 13 is formed that constitutes a part of the reservoir 100 that serves as a common ink chamber (liquid chamber) for each pressure generating chamber 12. That is, the flow path forming substrate 10 is provided with a liquid flow path including a pressure generation chamber 12, a communication portion 13, an ink supply path 14, and a communication path 15.

  The ink supply path 14 communicates with one end side in the longitudinal direction of the pressure generation chamber 12 and has a smaller cross-sectional area than the pressure generation chamber 12. Each communication path 15 communicates with the side of the ink supply path 14 opposite to the pressure generation chamber 12 and has a larger cross-sectional area than the width direction (short direction) of the ink supply path 14. In the present embodiment, the communication passage 15 is formed with the same cross-sectional area as the pressure generation chamber 12. In other words, the flow path forming substrate 10 is connected to the pressure generation chamber 12, the ink supply path 14 having a smaller cross-sectional area in the short direction of the pressure generation chamber 12, the ink supply path 14, and the ink supply. A communication passage 15 having a cross-sectional area larger than the cross-sectional area in the short direction of the passage 14 and having the same cross-sectional area as the pressure generation chamber 12 is provided by being partitioned by a plurality of partition walls 11.

  Further, on the opening surface side of the flow path forming substrate 10, a nozzle plate 20 having a nozzle opening 21 communicating with the vicinity of the end portion of each pressure generating chamber 12 on the side opposite to the ink supply path 14 is provided with an adhesive or It is fixed by an adhesive layer such as a heat welding film. The nozzle plate 20 is made of glass ceramics, a silicon single crystal substrate, stainless steel, or the like.

On the other hand, as described above, the elastic film 50 made of silicon dioxide is formed on the side opposite to the opening surface of the flow path forming substrate 10. For example, zirconium oxide (ZrO ₂ ) or the like is formed on the elastic film 50. An insulating film 55 made of is laminated. On the insulator film 55, the first electrode 60 having a thickness of, for example, about 0.1 to 0.5 μm, the piezoelectric layer 70 having a thickness of, for example, about 0.5 to 5 μm, and a thickness For example, the piezoelectric element 300 including the second electrode 80 of about 0.05 μm is formed. Here, the piezoelectric element 300 refers to a portion including the first electrode 60, the piezoelectric layer 70, and the second electrode 80. In general, one electrode of the piezoelectric element 300 is used as a common electrode, and the other electrode and the piezoelectric layer 70 are patterned for each pressure generating chamber 12. In addition, here, a portion that is configured by any one of the patterned electrodes and the piezoelectric layer 70 and in which piezoelectric distortion is generated by applying a voltage to both electrodes is referred to as a piezoelectric active portion. In the present embodiment, the first electrode 60 is a common electrode of the piezoelectric element 300, and the second electrode 80 is an individual electrode of the piezoelectric element 300. However, there is no problem even if this is reversed for the convenience of the drive circuit and wiring. In any case, a piezoelectric active part is formed for each pressure generating chamber 12. Also, here, the piezoelectric element 300 and the diaphragm that is displaced by driving the piezoelectric element 300 are collectively referred to as an actuator device. In the present embodiment, the first electrode 60 is provided across the parallel arrangement direction of the plurality of piezoelectric elements 300, and the longitudinal end of the pressure generation chamber 12 of the first electrode 60 is opposed to the pressure generation chamber 12. It was provided so that it would be a position to do. In the above-described example, the elastic film 50, the insulator film 55, and the first electrode 60 function as a diaphragm. However, the present invention is not limited to this. For example, the elastic film 50 and the insulator film 55 are provided. Instead, only the first electrode 60 may act as a diaphragm.

  A lead electrode 90 made of, for example, gold (Au) or the like is connected to the second electrode 80 of each piezoelectric element 300, and a voltage is selectively applied to each piezoelectric element 300 via the lead electrode 90. Is applied.

  Further, on the flow path forming substrate 10 on which the piezoelectric element 300 is formed, the protective substrate 30 having the piezoelectric element holding portion 31 having a space that does not hinder the movement of the piezoelectric element 300 in a region facing the piezoelectric element 300. However, as will be described in detail later, the second adhesive layer 35 and the first adhesive layer 36 are bonded with high accuracy. Note that the piezoelectric element holding portion 31 only needs to have a space that does not hinder the movement of the piezoelectric element 300, and the space may be sealed or not sealed.

  Further, the protective substrate 30 is provided with a reservoir portion 32 in a region facing the communication portion 13, and the reservoir portion 32 communicates with the communication portion 13 of the flow path forming substrate 10 as described above. A reservoir 100 serving as an ink chamber common to the pressure generation chamber 12 is configured. A through hole 33 that penetrates the protective substrate 30 in the thickness direction is provided in a region between the piezoelectric element holding portion 31 and the reservoir portion 32 of the protective substrate 30, and the first electrode 60 is provided in the through hole 33. And a tip of the lead electrode 90 are exposed, and a drive circuit for driving the piezoelectric element 300 is electrically connected to the tip of the lead electrode 90 via a conductive wire (not shown).

  As the protective substrate 30, it is preferable to use substantially the same material as the coefficient of thermal expansion of the flow path forming substrate 10, for example, glass, ceramic material, etc. In this embodiment, the same material as the flow path forming substrate 10, that is, A silicon single crystal substrate having a (110) plane crystal plane orientation was used. In this embodiment, the flow path forming substrate 10 and the protective substrate 30 are manufactured using a silicon single crystal substrate wafer manufactured in the same lot.

  On the protective substrate 30, a compliance substrate 40 including a sealing film 41 and a fixing plate 42 is bonded. Here, the sealing film 41 is made of a material having low rigidity and flexibility (for example, a polyphenylene sulfide (PPS) film having a thickness of 6 μm), and the sealing film 41 seals one surface of the reservoir portion 32. It has been stopped. The fixing plate 42 is formed of a hard material such as metal (for example, stainless steel (SUS) having a thickness of 30 μm). Since the region of the fixing plate 42 facing the reservoir 100 is an opening 43 that is completely removed in the thickness direction, one surface of the reservoir 100 is sealed only with a flexible sealing film 41. Has been.

  In such an ink jet recording head of this embodiment, ink is taken in from an external ink supply means (not shown), filled with ink from the reservoir 100 to the nozzle opening 21, and then in accordance with a recording signal from a drive circuit (not shown). Then, a voltage is applied between each of the first electrode 60 and the second electrode 80 corresponding to the pressure generating chamber 12, and the elastic film 50, the insulator film 55, the first electrode 60, and the piezoelectric layer 70 are bent and deformed. As a result, the pressure in each pressure generating chamber 12 increases and ink droplets are ejected from the nozzle openings 21.

(Inkjet recording head manufacturing method)
A method for manufacturing the ink jet recording head I will be described with reference to FIGS. 3 to 6 are cross-sectional views in the longitudinal direction of the pressure generating chamber, and FIGS. 7 to 9 are plan views.

  First, as shown in FIG. 3 (a), a flow path forming substrate wafer 110 in which a plurality of flow path forming substrates 10 (corresponding to “head constituent members” in the claims) are integrally formed at the central portion. The silicon dioxide film 52 constituting the elastic film 50 is formed on the surface thereof by thermal oxidation in a diffusion furnace at about 1100 ° C.

  Next, as shown in FIGS. 3B and 7, a through hole is formed in a region (non-head region 202 </ b> A) other than the region (head region 201 </ b> A) constituting the ink jet recording head of the flow path forming substrate wafer 110. Adhesive positioning holes 501A and 502A are formed (adhesion positioning hole forming step). That is, after a resist film having a pattern of a predetermined shape is formed by a photolithography method, anisotropic etching (wet etching) using an alkaline solution such as KOH is performed, so that the non-head region of the flow path forming substrate wafer 110 is obtained. After forming adhesion positioning holes 501A and 502A in 202A, the resist film is removed. As the flow path forming substrate wafer 110, an orientation flat (orientation flat) 250A is formed on the first (111) plane whose surface crystal plane orientation is the (110) plane and perpendicular to the (110) plane of the surface. The silicon wafer which is done is used. The wall surfaces of the adhesion positioning holes 501A and 502A formed by anisotropic etching are (111) planes.

  Here, the adhesion positioning holes 501A and 502A formed in the non-head region 202A of the flow path forming substrate wafer 110 have an inner diameter larger than the outer diameter of adhesion positioning pins 511 and 512, which will be described later. By simply inserting the adhesive positioning pins 511 and 512 into the adhesive positioning holes 501A and 502A, the adhesive positioning pins 511 and 512 can move in the in-plane direction of the adhesive surface. Therefore, when the adhesion positioning pins 511 and 512 are inserted into the adhesion positioning holes 501A and 502A, the adhesion positioning holes 501A and 502A are not fixed in the direction of the adhesion surface unless the adhesion positioning pins 511 and 512 are pressed.

  Further, as shown in FIG. 7, the opening of the adhesion positioning hole 501A is a single hole made of a rhombus, and the opening of the adhesion positioning hole 502A is a long hole made of a parallelogram. The single hole means that the gap (clearance) from the outer periphery of the adhesive positioning pin 511 to the inner wall surface of the adhesive positioning hole 501A can be the same when the adhesive positioning pin 511 is inserted. Means that when the adhesive positioning pin 512 is inserted, the clearance (clearance) from the outer periphery of the adhesive positioning pin 512 to the inner wall surface of the adhesive positioning hole 502A is not the same, that is, the adhesive positioning pins 511 and 512 are bonded. When inserting into the positioning holes 501A and 502A, since the bonding positioning hole 502A formed of a long hole has a sufficient size in the long axis direction, it can be inserted into the bonding positioning hole 502A even at a slightly shifted position.

  Here, according to the photolithography method as in the present embodiment, the adhesive positioning holes 501A and 502A can be formed at a predetermined position with high accuracy, but a dimensional error may occur. If the adhesive positioning pin has an inner diameter substantially the same as the outer diameter of the positioning hole as in Patent Document 1, the adhesive positioning pin cannot be inserted into the positioning hole when a dimensional error occurs, so a very high level of dimensional accuracy is required. Become. However, if the inner diameter of the adhesive positioning hole is larger than the outer diameter of the adhesive positioning pin to be inserted as in this embodiment, even if a slight dimensional error occurs in the adhesive positioning hole, the adhesive positioning hole can be easily positioned. A pin can be inserted.

Next, as shown in FIG. 3C, an insulator film 55 made of zirconium oxide is formed on the elastic film 50 (silicon dioxide film 52). Specifically, after forming a zirconium (Zr) layer on the elastic film 50 (silicon dioxide film 52) by, for example, sputtering, the zirconium layer is thermally oxidized in a diffusion furnace at 500 to 1200 ° C., for example. Thus, the insulator film 55 made of zirconium oxide (ZrO ₂ ) is formed.

  Next, as shown in FIG. 3D, the piezoelectric element 300 is formed. Specifically, for example, after the first electrode 60 is formed by laminating platinum (Pt) and iridium (Ir) on the insulator film 55, the first electrode 60 is patterned into a predetermined shape. Thereafter, a piezoelectric layer 70 made of, for example, lead zirconate titanate (PZT) or the like, and a second electrode 80 made of, for example, platinum (Pt) or iridium (Ir) are formed on the entire surface of the flow path forming substrate 10. Thereafter, the piezoelectric element 300 is formed by patterning in a region facing each pressure generating chamber 12. As a material of the piezoelectric layer 70 constituting the piezoelectric element 300, for example, a ferroelectric piezoelectric material such as lead zirconate titanate (PZT) or a metal such as niobium, nickel, magnesium, bismuth or yttrium is used. An added relaxor ferroelectric or the like is used. The method for forming the piezoelectric layer 70 is not particularly limited. For example, in this embodiment, a so-called sol in which a metal organic material is dissolved and dispersed in a solvent is applied, dried, gelled, and further fired at a high temperature. The piezoelectric layer 70 was formed by using a so-called sol-gel method for obtaining a piezoelectric layer 70 made of an oxide. The patterning of the piezoelectric layer 70 and the second electrode 80 can be performed at once by dry etching, for example.

  Next, as shown in FIG. 4A, after forming the lead electrode 90 made of, for example, gold (Au) over the entire surface of the flow path forming substrate wafer 110, for example, a mask pattern made of a resist or the like. Patterning is performed for each piezoelectric element 300 via (not shown).

  Next, a flow path forming substrate wafer 110 and a protective substrate 30 (corresponding to the “head constituent member” in the claims) are integrally formed in a central portion with a plurality of protective substrate wafers 130 (claim “second”). It corresponds to “member”. In this embodiment, when bonding the protective substrate wafer 130 and the flow path forming substrate wafer 110, after positioning, the protective substrate wafer 130 and the flow path forming substrate wafer 110 are temporarily bonded with the first adhesive for temporary bonding. Then, the protective substrate wafer 130 and the flow path forming substrate wafer 110 are fixed with a second adhesive. By temporarily fixing with the first adhesive in this way, the wafer can be prevented from being displaced due to shrinkage due to the curing of the second adhesive, which is a thermosetting resin, and highly accurate positioning can be maintained. Hereinafter, this point will be described in detail.

  Specifically, first, as shown in FIGS. 4B and 8, a region (head) constituting an ink jet recording head of a protective substrate wafer 130 in which a plurality of protective substrates 30 are integrally formed in the central portion. Adhesive positioning holes 501B and 502B, which are through holes, are formed in a region other than the region 201B) (non-head region 202B) (adhesion positioning hole forming step), and the first adhesive is a through hole in the protective substrate wafer 130 A plurality of introduction holes 503 are formed. A plurality of protective substrates 30 are formed on the head region 201B of the protective substrate wafer 130 by a photolithography method. That is, after a resist film having a pattern having a predetermined shape is formed on the protective substrate wafer 130 by photolithography, anisotropic etching (wet etching) using an alkaline solution such as KOH is performed, whereby the protective substrate wafer 130 is obtained. Adhesive positioning holes 501B and 502B and a plurality of first adhesive introduction holes 503 are formed in the non-head region 202B. Then, the piezoelectric element holding portion 31, the reservoir portion 32, and the through hole 33 are formed in the head region 201B of the protective substrate wafer 130, and the adhesive escapes around the opening on the bonding surface side of the first adhesive introduction hole 503. A groove portion 504 that functions as a groove is formed. This is because when the second adhesive is applied as will be described later, the second adhesive penetrates into the area where the first adhesive is formed (the area near the first adhesive introduction hole 503 on the adhesive surface). Thus, it is considered that the desired effect cannot be obtained when mixed. Therefore, in the present embodiment, a groove portion 504 is provided, and the second adhesive is accumulated in the groove portion 504 so that the second adhesive does not enter the formation region of the first adhesive layer 36. The groove portion 504 is circular in plan view, but the shape is not particularly limited, and may be provided so as not to be mixed with the second adhesive layer 35.

  Silicon with orientation crystal plane orientation (110) plane and orientation flat (orientation flat) 250B formed on first (111) plane perpendicular to (110) plane of surface as protective substrate wafer 130 A wafer is used. The wall surfaces of the adhesion positioning holes 501B and 502B and the first adhesive introduction hole 503 formed by anisotropic etching are (111) surfaces. That is, the opening of the first adhesive introduction hole 503 has a rhombus shape when viewed from above. As will be described later, the size and shape of the opening are not particularly limited as long as a desired amount of the first adhesive can be introduced. Further, in this embodiment, the flow path forming substrate wafer 110 and the protective substrate wafer 130 are silicon single crystal substrate wafers manufactured in the same lot, and the flow path is formed by using the same lot. Variations in dimensions of the bonding positioning holes 501A, 501B, 502A, 502B and the like formed in the substrate wafer 110 and the protective substrate wafer 130 can be suppressed, and positioning can be performed with higher accuracy.

  Here, as shown in FIG. 8, the adhesion positioning hole 501B formed in the protective substrate wafer 130 has the same shape as the adhesion positioning hole 501A formed in the flow path forming substrate wafer 110, that is, the same inner diameter. have. Further, the adhesion positioning hole 502B formed in the protective substrate wafer 130 has the same shape as the adhesion positioning hole 502A formed in the flow path forming substrate wafer 110, that is, has the same inner diameter.

  Next, a second adhesive layer 35 is formed by providing a second adhesive in a predetermined region on at least one of the bonding surfaces of the flow path forming substrate wafer 110 and the protective substrate wafer 130. As the second adhesive, one that is cured by heating, for example, a one-component heat-curable epoxy resin-based adhesive mainly composed of a bisphenol A type epoxy resin can be used. The heating here means heating at a temperature higher than room temperature (20 to 30 ° C.). In the present embodiment, the second adhesive layer 35 is provided by applying an epoxy resin-based adhesive to a predetermined region excluding the inner side (the first adhesive introduction hole 503 side) of the groove portion 504 of the protective substrate wafer 130. It was. Instead of applying the adhesive, a heat welding film may be attached to form an adhesive layer.

  Next, as shown in FIGS. 5, 7, and 8, the bonding has a smaller diameter than the bonding positioning hole 501 </ b> A formed in the flow path forming substrate wafer 110 and the bonding positioning hole 501 </ b> B formed in the protective substrate wafer 130. The positioning pins 511 are inserted into the adhesion positioning holes 501A and 501B. Similarly, adhesion positioning holes 512A formed in the flow path forming substrate wafer 110 and adhesion positioning pins 512 having a smaller diameter than the adhesion positioning holes 502B formed in the protective substrate wafer 130 are provided in the adhesion positioning holes 502A and 502B. insert. Then, the flow path forming substrate wafer 110 and the protective substrate wafer 130 are pressed in the in-plane direction of the bonding surface, and the bonding positioning pins 511 and 512 are applied to the inner wall surfaces of the bonding positioning holes 501A, 501B, 502A, and 502B, respectively. Contact (contact process). As a result, the relative positions of the flow path forming substrate wafer 110 and the protective substrate wafer 130 are determined.

  In this way, adhesion positioning holes 501A, 501B, 502A, and 502B are formed in the flow path forming substrate wafer 110 and the protective substrate wafer 130, and adhesion positioning pins 511 having a smaller diameter than the adhesion positioning holes 501A and 501B are adhered. The adhesive positioning pins 512, which are inserted into the positioning holes 501A and 501B and have a smaller diameter than the adhesive positioning holes 502A and 502B, are inserted into the adhesive positioning holes 502A and 502B, and the flow path forming substrate wafer 110 and the protective substrate wafer 130 are inserted. Is pressed in the in-plane direction of the bonding surface, and the bonding positioning pins 511 and 512 are brought into contact with the inner wall surfaces of the bonding positioning holes 501A, 501B, 502A, and 502B, and the flow path forming substrate wafer 110 and the protective substrate wafer 130 relative positions can be determined Therefore, it is possible to easily and positioning the flow path forming substrate wafer 110 and the protective substrate wafer 130 with high accuracy. Also, since the adhesion positioning pins 511 and 512 have smaller diameters than the adhesion positioning holes 501A and 501B, 502A and 502B, respectively, the adhesion positioning pins 511 and 512 are larger than when the adhesion positioning pins have the same diameter as the adhesion positioning holes. Are easily inserted into the adhesion positioning holes 501A, 501B, 502A, and 502B.

  Further, in the present embodiment, since two adhesion positioning holes are formed in each member, the position in the in-plane direction of the adhesion surface is fixed at one point by one adhesion positioning pin 511, and the other adhesion positioning pin 512 is further provided. The rotation direction (indicated by θ in the figure) around the bonding positioning holes 501A and 501B of the flow path forming substrate wafer 110 and the protective substrate wafer 130 is also fixed by the above, so that the flow path forming substrate wafer 110 and the protective substrate The wafer 130 is positioned with higher accuracy.

  In addition, since the adhesive positioning holes 501A and 501B made of a single hole and the adhesive positioning holes 502A and 502B made of a long hole are used, the adhesive positioning pin 512 can be easily formed even if a dimensional error occurs when forming the adhesive positioning hole. It can be inserted and positioned accurately by pressing in the in-plane direction of the bonding surface.

  Further, the adhesive positioning pins 511 and 512 are pressed against the two inner wall surfaces 521A and 522A, 521B and 522B of the square holes, that is, the corners of the adhesive positioning holes 501A and 501B which are in contact with each other. Since the adhesive positioning pins abut on the corners of the adhesive positioning holes 501A and 501B made of holes and are securely fixed, the positioning becomes more accurate.

  In this embodiment, adhesion positioning pins 511 and 512 are provided on a jig 530 for pressing the flow path forming substrate wafer 110 and the protective substrate wafer 130 in the stacking direction, and the flow path forming substrate wafer 110 and the protective substrate The wafer 130 is sandwiched by a jig 530 formed with bonding positioning pins 511 and 512 via a buffer member 540 made of a flexible polymer sheet such as polytetrafluoroethylene, and the wafer 110 for flow path forming substrate and the protective substrate. The orientation flats 250A and 250B of the wafer 130 are pressed by the pressing member 550 in the in-plane direction (shown by a in the figure) of the bonding surface, and the relative position is fixed, and in the stacking direction (shown by b in the figure). Pressed. In the contact step, the relative positions of the flow path forming substrate wafer 110 and the protective substrate wafer 130 are temporarily fixed by contact, and the positions are finally fixed in the subsequent second bonding step.

  Next, the first adhesive layer 36 made of the first adhesive is formed in this contacted state (that is, during the contact process), and the first adhesive is cured at room temperature and temporarily fixed (first 1 bonding step). Thereafter, the pressure is released. By adhering the member in the first adhering step during the abutting step in this way, it is possible to suppress the repulsion that occurs when the pressure on the member is released after the abutting, and it is possible to hold highly accurate positioning. Is possible.

  As this 1st adhesive agent, what hardens | cures at normal temperature is mentioned, For example, the cyanoacrylate type adhesive agent etc. which have 2-cyanoacrylic acid ester monomer as a main component can be used. In addition, as a 1st adhesive agent, even if it uses not only what hardens | cures at normal temperature with the water | moisture content in an atmosphere like a cyanoacrylate type adhesive, for example, what added the crosslinking agent just before use, and also hardened | cured at normal temperature after that may be used. Good. In the present embodiment, the first adhesive is introduced into the bonding surface (gap) between the flow path forming substrate wafer 110 and the protective substrate wafer 130 through the first adhesive introduction hole 503, and the first adhesive is capillary action. To diffuse. In this case, the first adhesive diffuses to the inside of the region corresponding to the groove 504, that is, to a region other than the predetermined region where the second adhesive is formed. When the first adhesive is introduced into the first adhesive introduction hole 503, the liquid introduction hole 531 provided in the jig 530 and the liquid introduction hole 531 communicate with the first adhesive introduction hole 503. The first adhesive is introduced into the first adhesive introduction hole 503 through the liquid introduction hole 541 provided in the buffer member 540 that communicates.

  Since the diffused first adhesive is cured at room temperature, it is cured in a diffused state by being held in this state, and the flow path forming substrate wafer 110 and the protective substrate wafer 130 are temporarily fixed. . Here, since the first adhesive is not cured by heating, the flow path forming substrate wafer 110 and the protective substrate wafer 130 are not deformed due to heat shrinkage, and as a result, no positional deviation occurs due to thermosetting. Note that it is not preferable to bond the flow path forming substrate wafer 110 and the protective substrate wafer 130 with only the first adhesive because the first adhesive generally has less strength than the second adhesive. .

  In this manner, the second adhesive layer 35 is cured by heating or the like in a state where the relative positions of the flow path forming substrate wafer 110 and the protective substrate wafer 130 are accurately fixed by temporary bonding, thereby forming the flow path. The substrate wafer 110 and the protective substrate wafer 130 are bonded (second bonding step). Conventionally, when bonded by the second bonding step, the flow path forming substrate wafer 110 and the protective substrate wafer 130 are contracted due to contraction of the second adhesive layer 35, but the positional deviation has occurred. , The flow path forming substrate wafer 110 and the protective substrate wafer 130 are fixed by the first adhesive layer 36, so that the flow path forming substrate wafer 110 due to the shrinkage of the second adhesive layer 35 and Shrinkage of the protective substrate wafer 130 can be suppressed, and as a result, deformation and misalignment of the wafer can be suppressed. As a result, the deterioration of displacement characteristics due to deformation or misalignment of the wafer, liquid leakage, and the like are unlikely to occur, so that a highly reliable liquid jet head is obtained.

  Next, as shown in FIG. 6A, the flow path forming substrate wafer 110 is set to a predetermined thickness. Next, as shown in FIG. 6B, a mask film 51 made of, for example, silicon nitride (SiN) is newly formed on the flow path forming substrate wafer 110 and patterned into a predetermined shape. 6C, the flow path forming substrate wafer 110 is anisotropically etched (wet etching) using an alkaline solution such as KOH through the mask film 51, whereby the piezoelectric element 300 is formed. Corresponding pressure generating chambers 12, communication portions 13, ink supply passages 14, communication passages 15, and other flow path forming substrates 10 are formed.

  Here, in this embodiment, the pressure generating chamber 12 and the like are formed in the flow path forming substrate wafer 110 after the flow path forming substrate wafer 110 and the protective substrate wafer 130 are bonded together. If the formation position of 12 or the like is adjusted, it can be said that the pressure generating chamber 12 or the like can be formed at a desired position without bonding the flow path forming substrate wafer 110 and the protective substrate wafer 130 with high accuracy. The pressure generation chamber 12 and the like must be formed in consideration of the displacement. Therefore, even if the pressure generating chamber 12 and the like are formed in the flow path forming substrate wafer 110 after bonding the flow path forming substrate wafer 110 and the protective substrate wafer 130 as in the present embodiment, the flow path formation is performed. It is necessary to bond the substrate wafer 110 and the protective substrate wafer 130 with high accuracy.

  Thereafter, the flow path forming substrate 10 and the protective substrate 30 having a single chip size as shown in FIG. 1 are divided into joined bodies, and the nozzle openings 21 are formed on the surface of the flow path forming substrate 10 opposite to the protective substrate 30. The nozzle plate 20 thus drilled is bonded, and the compliance substrate 40 is bonded to the protective substrate 30, whereby the ink jet recording head of this embodiment is obtained.

  In the ink jet recording head of this embodiment manufactured as described above, the flow path forming substrate wafer 110 and the protective substrate wafer 130 are positioned with high accuracy, and are bonded while maintaining this highly accurate positioning state. Since it is formed, it is difficult for the ink ejection characteristics to be deteriorated due to misalignment, and the liquid ejecting head is highly reliable.

  Here, when each of the flow path forming substrate wafer 110 and the protective substrate wafer 130 is formed of a through hole and adhered at a target position, a test pattern that is adjacent to each other but does not overlap is formed by a photolithography method. After the second bonding step, the accuracy of the bonding position of the flow path forming substrate wafer 110 and the protective substrate wafer 130 is inspected based on the presence or absence of transmitted light from the inspection pattern by irradiating light in the stacking direction. It may be (inspection process).

  Specifically, for example, as shown in FIGS. 9A and 9B, first, an inspection pattern 260A (solid line) including through holes is formed on the flow path forming substrate wafer 110, and the protective substrate wafer 130 is formed. An inspection pattern 260B composed of a through hole is formed by photolithography. The inspection patterns 260A and 260B are formed at predetermined positions with reference to the adhesion positioning holes.

  Here, as shown in FIGS. 9A and 9B, the inspection pattern 260A formed on the flow path forming substrate wafer 110 has a diamond shape. Then, the inspection pattern 260B formed on the protective substrate wafer 130 is formed on the flow path forming substrate wafer 110 when the flow path forming substrate wafer 110 and the protective substrate wafer 130 are bonded at the correct positions. It is a shape surrounding the four sides of the rhombus of the inspection pattern 260A. A broken line written in the vicinity of the inspection pattern 260A in FIG. 9A indicates the position of the inspection pattern 260B formed on the protective substrate wafer 130 in FIG. 9B.

  As described above, the inspection patterns provided on the respective members do not overlap each other when bonded at a target position, but are adjacent to each other. Therefore, when light is irradiated in the stacking direction after the second bonding step, the flow path forming substrate is obtained. When the wafer 110 for protection and the wafer 130 for protective substrate are bonded at the correct positions, there is no transmitted light from the inspection patterns 260A and 260B. On the other hand, when it is bonded at a position shifted from the target position, the light irradiated in the stacking direction is transmitted. Thus, by providing a predetermined inspection pattern, it is possible to inspect the accuracy of the bonding position between the flow path forming substrate wafer 110 and the protective substrate wafer 130 based on the presence or absence of transmitted light in the stacking direction. In this way, the accuracy of the bonding position can be easily inspected without using a measuring instrument. Further, in this embodiment, since one inspection pattern is formed so as to surround the other inspection pattern, when light is transmitted, it is determined in which direction the bonding position is shifted from the position of the transmitted light. be able to.

(Another inkjet recording head manufacturing method)
In this embodiment, the inkjet recording head manufacturing method described above is different from the method for manufacturing the ink jet recording head in that the second adhesive is applied to the adhesive surfaces (gap) of the flow path forming substrate wafer 110 and the protective substrate wafer 130 after temporary fixing with the first adhesive. The point of application is different. Details will be described below.

  In the present embodiment, when forming the first adhesive introduction hole 503 in the protective substrate wafer 130 in the adhesion positioning hole forming step, a plurality of second adhesive introduction holes (not shown) that are through holes are further formed. To do. The second adhesive introduction hole is configured to apply a desired amount of the second adhesive layer 35 to a desired position to such an extent that the flow path forming substrate wafer 110 and the protective substrate wafer 130 can be bonded. For example, a plurality of second adhesive introduction holes are formed on the inner side in the in-plane direction of the protective substrate wafer 130 than the first adhesive introduction hole 503 in the non-head region 202B, and the head liquid is also formed in the head region 201B. A plurality are formed within a range that does not affect the injection characteristics. Further, the second adhesive introduction hole formed in this way is also formed with a (111) plane wall surface, and its opening has a rhombus shape when viewed from above.

  Next, the first adhesive is provided in a predetermined region from the first adhesive introduction hole in a state of being positioned with high accuracy while performing the contact step, and the flow path forming substrate wafer 110 and the protective substrate wafer 130 are Temporarily fix. In this case, the first adhesive fills the groove 504 from the first adhesive introduction hole 503 and diffuses to a region corresponding to the groove 504, thereby forming the first adhesive layer 36. That is, in the above-described embodiment, the groove portion 504 is provided so that the second adhesive does not enter the region where the first adhesive layer 36 is formed, but in this embodiment, the first adhesive is the second adhesive. In order to suppress intrusion to the region where the agent layer 35 is formed and mixing with the second adhesive, a groove portion 504 is provided as a relief groove for the first adhesive. Thus, the groove part 504 functions as a relief groove for the adhesive of either the first adhesive or the second adhesive.

  Thereafter, the second adhesive layer 35 is provided on at least one adhesive surface of the flow path forming substrate wafer 110 and the protective substrate wafer 130 (second adhesive layer forming step). In the present embodiment, the second adhesive layer 35 is provided by introducing the second adhesive from the second adhesive introduction hole and expanding the second adhesive in the vicinity thereof by capillary action. In other words, the second adhesive layer 35 in this case is provided in a region where the first adhesive layer 36 is not formed.

  Then, the second adhesive layer 35 is cured by heating, and the flow path forming substrate wafer 110 and the protective substrate wafer 130 are fixed. Thus, also in this embodiment, by temporarily fixing with the second adhesive, the shrinkage due to curing of the second adhesive layer can be suppressed, and bonding can be performed while maintaining high-accuracy positioning. Further, according to the above-described embodiment, the displacement characteristics are not deteriorated or liquid leakage is hardly caused by the displacement, so that the liquid jet head is highly reliable.

  In each of the embodiments described above, the first adhesive introduction hole 503 (and the second adhesive introduction hole) is provided in the protective substrate wafer 130. However, if the adhesive can be introduced, the flow path forming substrate wafer 110 is provided. May be provided. Further, although four first adhesive introduction holes 503 are provided in plan view, the number is not limited to this number as long as a desired amount of the first adhesive can be introduced.

  In each of the above-described embodiments, the first adhesive layer is formed and cured while performing the contact step. However, the present invention is not limited to this, and after the contact step, the position of the first adhesive layer is determined. It may be formed and cured.

  In each of the above-described embodiments, a cylindrical shape is used as the adhesion positioning pin. However, the shape is not limited to this, and a prismatic shape may be used. Further, the shape of the adhesion positioning hole is not particularly limited as long as the adhesion positioning pin can be fixed by pressing, and may be any of a circle, an ellipse, and a polygon. A shape that abuts and is securely fixed is preferable.

  Further, in each of the above-described embodiments, two adhesion positioning holes are provided in each of the flow path forming substrate wafer and the protective substrate wafer from the viewpoint of positioning accuracy and ease of formation. Is not particularly limited, and may be one or three or more.

  In each embodiment, the orientation flat, which is a flat surface, is pressed in the contact step, but may be pressed from any direction as long as the adhesion positioning pin can be fixed. The direction of pressing may be any direction as long as the adhesion positioning pin can be fixed, but in order to position with higher accuracy, the corners of the adhesion positioning hole are in contact with each other as in this embodiment. It is preferable to press in the direction in which the adhesive positioning pin comes into contact with the inner wall surface because it can be surely fixed.

  Furthermore, in each embodiment, the wafer on which a plurality of the flow path forming substrate 10 and the protective substrate 30 constituting the ink jet recording head are integrally bonded is adhered, but a single member constituting the ink jet recording head is used. You may make it adhere | attach.

  In this embodiment, the adhesion positioning hole is provided in the non-head area 202A. However, if there is no problem in the manufactured ink jet recording head, the adhesion positioning hole may be provided in the head area 201A.

  Further, the adhesion positioning hole forming step may be formed simultaneously with the concave portion or the through hole of the pressure generating chamber 12 or the like, or may be formed in a separate step. By forming simultaneously, a manufacturing process can be simplified and cost can be reduced.

  In each embodiment, positioning is performed while pressing in the stacking direction. However, it is not necessary to press in the stacking direction if the flow path forming substrate wafer 110 and the protective substrate wafer 130 can be positioned with high accuracy.

  In each embodiment, the manufacturing method of the present invention is applied when the flow path forming substrate wafer 110 and the protective substrate wafer 130 are bonded. However, the manufacturing method of the present invention is for the flow path forming substrate. The present invention can be applied not only to the bonding of the wafer 110 and the protective substrate wafer 130 but also to the bonding of two members constituting the ink jet recording head. For example, when the flow path forming substrate 10 and the nozzle plate 20 are bonded, a protection is provided. It can also be applied when the substrate 30 and the compliance substrate 40 are bonded.

  Moreover, in each embodiment, although the 1st adhesion process was performed, performing the contact process, it is not limited to this, You may perform a 1st adhesion process after a contact process.

  Furthermore, the manufacturing method of the present invention can also be applied when manufacturing an ink jet recording head 600 formed by mounting a plurality of ink jet recording heads I of this embodiment on a base plate 601.

  More specifically, as shown in FIG. 10 which is an enlarged cross-sectional view of the main part, the ink jet recording head 600 is formed in a head hole 602 which is provided in a base plate 601 and has a through hole having a diameter larger than that of the ink jet recording head I. A plurality of ink jet recording heads I are mounted. The ink jet recording head I is fixed by a head positioning pin 603 provided at a predetermined position of the base plate 601. The head positioning pin 603 has a head positioning pin support hole 610 through which the head positioning pin 603 is inserted. It is supported by a guide plate 620 that is provided and joined to the base plate 601 with an adhesive. Since the guide plate 620 improves the mounting strength of the head positioning pin 603 with respect to the base plate 601, even if the head positioning pin 603 is repeatedly attached and detached, the head positioning pin 603 may be displaced from the base plate 601 or tilted. Is prevented.

  Then, as shown in FIG. 11 which is an enlarged cross-sectional view of the main part in the vicinity of the head positioning pin 603 in FIG. 10, the head positioning pin 603 is erected with an adhesive or the like in the mounting groove 630 provided in the base plate 601.

  The guide plate 620 that supports the head positioning pin 603 is provided on the lowermost layer portion 621 that is joined to the base plate 601, the intermediate layer portion 622 provided on the lowermost layer portion 621, and the intermediate layer portion 622. The uppermost layer portion 623 is composed of a laminated body bonded with an adhesive layer. The lowermost layer portion 621 and the uppermost layer portion 623 are made of one silicon single crystal substrate preferentially oriented in the (110) plane, and the intermediate layer portion 622 is formed by bonding three silicon single crystal substrates. Each layer of the guide plate 620 is not limited to such a configuration, and the lowermost layer portion 621 and the uppermost layer portion 623 may be formed of a plurality of silicon single crystal substrates, or one intermediate layer portion 622 is formed. The silicon single crystal substrate may be used, and the material may not be a silicon single crystal substrate.

  The adhesive layer includes a first adhesive layer for temporary fixing and a second adhesive layer (not shown) for main fixing. In the present embodiment, first adhesive introduction holes 631 to 634, which are through holes for forming the first adhesive layer, are provided. That is, the innermost first adhesive introduction hole 631 is provided to introduce the first adhesive into the adhesive surface (gap) between the uppermost layer portion 623 and the intermediate layer portion 622, and the other three first adhesive introduction holes 631 are provided. The first adhesive introduction holes 632 to 634 are also provided so that the first adhesive can be introduced into the gaps between the respective layers. Although not shown, a plurality of these first adhesive introduction holes are provided in plan view. Similarly, second adhesive introduction holes 641 to 644 are provided so that the second adhesive can be introduced between the respective layers. Although not shown in the present embodiment, a groove functioning as an escape groove for the adhesive is provided around the opening on the adhesive side of each introduction hole so that the respective adhesives are not mixed.

  The head positioning pin support hole 610 is larger than the diameter of the head positioning pin 603 and the opening 611 of the lowermost layer portion 621 and the opening 613 of the uppermost layer portion 623 that are opened so that the head positioning pin 603 is inscribed. It consists of a communication opening 612 of the intermediate layer 622 that is opened so that the inner wall surface is isolated from the pin 603. That is, the head positioning pin 603 is supported by the opening 611 and the opening 613. The communication opening 612 does not need to be positioned with high accuracy because it does not support the head positioning pin 603.

  The guide plate 620 formed by bonding a plurality of such substrates can be manufactured by the manufacturing method of the present invention. For example, first, the lowermost layer portion (corresponding to the “first member” in the claims) 621 in which the opening portion 611 is formed, the intermediate layer portion 622 in which the communication opening portion 612 is formed, and the lowermost portion in which the opening portion 613 is formed. For example, two adhesive positioning holes that penetrate each upper layer portion (corresponding to “second member” in the claims) 623 are formed by photolithography, for example (adhesion positioning hole forming step).

  Next, an adhesive positioning pin having a diameter smaller than that of the adhesive positioning hole is inserted into the adhesive positioning hole of each member, and the respective members and the adhesive positioning pin are relatively pressed in the in-plane direction of the adhesive surface, and the inner wall surface of the adhesive positioning hole The adhesion positioning pin is brought into contact with the contact (contact process). Thereby, the relative position of each member is fixed. Thereafter, the first adhesive is introduced from the first adhesive introduction holes 631 to 634 and cured (first bonding step). Next, the second adhesive layer is formed by introducing the second adhesive between the respective layers from the second adhesive introduction holes 641 to 644 and performing the second bonding step. By manufacturing in such a process, the lowermost layer portion 621 and the uppermost layer portion 623 that constitute the guide plate 620 and support the head positioning pin 603 can be positioned with high accuracy. Movement and tilt can be regulated with high accuracy. And in the state which could position these laminated bodies with high precision, a laminated body can be fixed without the shrinkage | contraction by thermosetting. Then, the ink jet recording head I can be arranged on the base plate 601 with high accuracy by regulating the head positioning pins 603 with high accuracy.

  Also in this case, the second adhesive introduction holes 641 to 644 are not formed, the second adhesive layer 35 is formed before the contact step, and then the contact step is performed for positioning, and then the first adhesive A 1st adhesive bond layer may be formed by a layer formation process, a temporary fixing process may be performed, and a 2nd adhesion process may be finally performed. In this case, since it is not necessary to form the second adhesive introduction hole, fixing can be performed more easily.

(Other embodiments)
The exemplary embodiments of the present invention have been described above. However, the basic configuration of the present invention is not limited to the above. For example, in the above-described embodiment, the thin film type ink jet recording head manufactured by applying the film forming and lithography method is taken as an example, but of course, the present invention is not limited to this. For example, a green sheet is pasted. The present invention is also applied to a thick film type ink jet recording head formed by a method such as the above, and a longitudinal vibration type ink jet recording head in which piezoelectric materials and electrode forming materials are alternately stacked to expand and contract in the axial direction. be able to. In addition, as a pressure generating element, a heat generating element is disposed in the pressure generating chamber, and a liquid droplet is discharged from the nozzle opening by a bubble generated by heat generation of the heat generating element, or static electricity is generated between the diaphragm and the electrode. A so-called electrostatic actuator that discharges liquid droplets from the nozzle openings by deforming the diaphragm by electrostatic force can also be used.

  Further, these ink jet recording heads constitute a part of a recording head unit having an ink flow path communicating with an ink cartridge or the like, and are mounted on the ink jet recording apparatus. FIG. 12 is a schematic view showing an example of the ink jet recording apparatus.

  In the ink jet recording apparatus II shown in FIG. 12, the recording head units 1A and 1B having the ink jet recording head I are detachably provided with cartridges 2A and 2B constituting the ink supply means, and the recording head units 1A and 1B. Is mounted on a carriage shaft 5 attached to the apparatus main body 4 so as to be movable in the axial direction. The recording head units 1A and 1B, for example, are configured to eject a black ink composition and a color ink composition, respectively.

  The driving force of the driving motor 6 is transmitted to the carriage 3 via a plurality of gears and timing belt 7 (not shown), so that the carriage 3 on which the recording head units 1A and 1B are mounted is moved along the carriage shaft 5. The On the other hand, the apparatus body 4 is provided with a platen 8 along the carriage shaft 5, and a recording sheet S that is a recording medium such as paper fed by a paper feed roller (not shown) is wound around the platen 8. It is designed to be transported.

  In the first embodiment described above, an ink jet recording head has been described as an example of a liquid ejecting head. However, the present invention is widely intended for all liquid ejecting heads, and is a liquid ejecting a liquid other than ink. Of course, the present invention can also be applied to an ejection head. Other liquid ejecting heads include, for example, various recording heads used in image recording apparatuses such as printers, color material ejecting heads used in the manufacture of color filters such as liquid crystal displays, organic EL displays, and FEDs (field emission displays). Examples thereof include an electrode material ejection head used for electrode formation, a bioorganic matter ejection head used for biochip production, and the like.

  I ink jet recording head (liquid ejecting head) 10 flow path forming substrate, 12 pressure generating chamber, 13 communicating portion, 14 ink supply path, 20 nozzle plate, 21 nozzle opening, 30 protective substrate, 31 piezoelectric element holding portion, 32 reservoir Part, 40 compliance substrate, 60 first electrode, 70 piezoelectric layer, 80 second electrode, 90 lead electrode, 100 reservoir, 110 channel forming substrate wafer, 130 protective substrate wafer, 201 head region, 202 non-head region , 250 orientation flat, 260 inspection pattern, 501, 502 adhesive positioning hole, 503, 631 to 634 first adhesive introduction hole, 504 groove, 511, 512 adhesive positioning pin, 530 jig, 540 buffer member, 550 pressing member

Claims (13)

A method of manufacturing a liquid jet head comprising a laminated member formed by bonding a first member and a second member,
An adhesion positioning hole forming step of forming an adhesion positioning hole penetrating each of the first member and the second member by a photolithography method;
An adhesive positioning pin is inserted into the adhesive positioning hole formed in the first member and the adhesive positioning hole formed in the second member, and the first member, the second member, and the adhesive positioning pin are bonded. An abutting step of abutting the adhesive positioning pins on the inner wall surfaces of the adhesive positioning holes of the first member and the second member by relatively pressing in an in-plane direction of the surface;
In the state where the relative positions of the first member and the second member are determined, the first adhesive, which is a cyanoacrylate adhesive, is cured to bond the first member and the second member. Bonding process;
A second bonding step of bonding the first member and the second member by thermally curing a second adhesive that is cured by heating in a state where the first member and the second member are bonded by the first adhesive. A method of manufacturing a liquid ejecting head, comprising:   After the second adhesive is provided in a predetermined region of the adhesive surface between the first member and the second member, the contact step is performed, and then the second member provided on the first member or the second member. The first adhesive is provided and cured in a region other than the predetermined region of the adhesive surface through one adhesive introduction hole to perform the first adhesion step, and then the second adhesive is thermally cured by heating. The method of manufacturing a liquid jet head according to claim 1, wherein the second bonding step is performed.   After the abutting step, the first adhesive is passed through a first adhesive introduction hole provided in the first member or the second member, and a predetermined region on the adhesive surface between the first member and the second member The first adhesive step is performed by providing the second adhesive to the first member or the second member, and then the second adhesive is applied to a region other than a predetermined region of the adhesive surface through a second adhesive introduction hole provided in the first member or the second member. 2. The method of manufacturing a liquid jet head according to claim 1, wherein the second bonding step is performed by being provided in the region and being cured by heating.   The method of manufacturing a liquid jet head according to claim 1, wherein the first bonding step is performed while performing the contact step.   The method of manufacturing a liquid jet head according to claim 1, wherein a groove is provided around the opening on the bonding surface side of the adhesive introduction hole.   The first member and the second member are respectively formed with the adhesion positioning holes made of a single hole and a long hole. In the contact step, the first member, the second member, and the adhesion positioning pin are used. By relatively pressing in the in-plane direction of the bonding surface and bringing the bonding positioning pin into contact with the inner wall surface of the single hole, the relative direction in the in-plane direction of the bonding surface of the first member and the second member is increased. The position is fixed, and the rotation direction of the first member and the second member with respect to the single hole is fixed by bringing the adhesive positioning pin into contact with the inner wall surface of the long hole. The method for manufacturing a liquid jet head according to claim 1.   2. The adhesion positioning hole is a square hole, and in the abutting step, the adhesion positioning pin is pressed so as to abut against two inner wall surfaces that are in contact with each other and form a corner of the adhesion positioning hole. The manufacturing method of the liquid jet head as described in any one of -6.   The first member and the second member are members having a head region in which a plurality of head constituent members constituting the liquid ejecting head are integrally formed and a non-head region in which the head constituent member is not formed. The bonding positioning hole is provided in the non-head region, and has a step of dividing the first member and the second member into a liquid jet head after the second bonding step. A method for manufacturing a liquid jet head according to claim 1.   The method of manufacturing a liquid jet head according to claim 1, wherein the first member and the second member are silicon single crystal substrates.   The said contact process WHEREIN: The said 1st member and the said 2nd member are inserted | pinched with a buffer member, and it presses in the lamination direction of the said 1st member and the said 2nd member, The any one of Claims 1-9 characterized by the above-mentioned. A manufacturing method of the liquid jet head according to the above. When each of the first member and the second member is made of a through hole and the first member and the second member are bonded to each other at a target position, the adjacent inspection patterns are not overlapped with each other by a photolithography method. Further comprising the step of forming
After the second bonding step, the method includes an inspection step of irradiating light in the stacking direction and inspecting the accuracy of the bonding positions of the first member and the second member based on the presence or absence of transmitted light from the inspection pattern The method of manufacturing a liquid jet head according to claim 1.   The shape in plan view of the inspection pattern formed on the first member and the inspection pattern formed on the second member is formed so that one of the inspection patterns surrounds the periphery of the other inspection pattern. The method of manufacturing a liquid jet head according to claim 11.   A liquid ejecting apparatus comprising the liquid ejecting head manufactured by the method of manufacturing a liquid ejecting head according to claim 1.

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