TW201408986A - Cooling plate and water cooling heat dissipation device having the same - Google Patents

Abstract

A water cooling heat dissipation device includes a cooling plate and a water cooling module. The cooling plate includes a board body and a wording fluid. The board body has a vacuum enclosure space therein. The wording fluid is accommodated in the enclosure space. The water cooling module is connected to the board body.

Description

Cooling plate and water cooling device with cooling plate

The case relates to a refrigerating plate and a water-cooling heat dissipating device having a refrigerating plate.

Electronic components often accompany high temperatures during operation. If the heat is not effectively removed, it may cause a crash, and in severe cases, it may cause burns. In general, the problem of heat dissipation for an electronic chip is usually to provide a heat sink on the electronic chip, and a heat sink, a heat pipe, a heat sink with fins, a cooling plate, or a water-cooled mold. Groups and other components to eliminate the heat generated when the wafer is working.

When the heat sink is assembled, the heat sink can be disposed on the surface of the wafer, and the heat of the heat sink can be removed by using a fan, a heat pipe or a water cooling module. Or, directly attaching the cooling plate having a thickness smaller than the heat dissipation block to the wafer, and also having the effect of dissipating heat, but the heat dissipation effect is not as good as the heat dissipation block.

In addition, the conventional overall thickness of the heat sink block is high, which is inconvenient for the demand for thinning of the electronic product. Although the conventional cold plate is thin, its structure is a solid metal plate, and the area in contact with air is small, and only the wafer can be used. The heat is transferred to the entire plate of the cold plate by conduction, and the heat storage capacity is limited, and the heat dissipation effect is limited.

The present disclosure discloses a cooling plate comprising a plate body and a working fluid. The sealed space inside the plate body. The working fluid is placed in a confined space.

The present disclosure discloses a water-cooling heat sink comprising a cooling plate and a water cooling module. The cooling plate contains the plate body and the working fluid. The plate body has a closed space with a vacuum inside. The working fluid is placed in a confined space. The water cooling module is connected to the cooling plate.

Since the cold plate of the present case has a working fluid and the working fluid is accommodated in the sealed space of the plate body, when the cooling plate is disposed on the heat source, the heat generated by the heat source can not only be thermally conductive through the plate body, but also in the plate body. The working fluid can also absorb heat to produce a phase change such that the refrigerated plate has both the ability to thermally diffuse and thermally store. In addition, when the water-cooling module is connected to the cooling plate, both the cooling plate and the cooling liquid are located in the cavity of the cooling plate connector, so that the temperature of the cooling plate can be lowered.

100‧‧‧ cold plate

100a‧‧‧ cold plate

110‧‧‧ board

112‧‧‧Confined space

114‧‧‧ outer surface

120‧‧‧Working fluid

122‧‧‧ inner surface

124‧‧‧ inner surface

132‧‧‧First concave structure

134‧‧‧second concave structure

136‧‧‧second concave structure

200‧‧‧Water cooling device

210‧‧‧Water cooling module

212‧‧‧Temperature plate connector

213‧‧‧ cavity

214‧‧‧ Mercury

215‧‧‧ coolant

216‧‧‧Hot Department

218a‧‧‧First connecting tube

218b‧‧‧Second connection tube

220‧‧‧fan

310‧‧‧heat source

320‧‧‧ boards

2-2‧‧‧ segments

5-5‧‧‧ segments

D1‧‧ Direction

D2‧‧ Direction

D3‧‧ Direction

FIG. 1 is a perspective view of a cold plate according to an embodiment of the present invention.

Figure 2 is a cross-sectional view of the cold plate of Figure 1 taken along line 2-2.

Fig. 3 is a cross-sectional view showing the cold plate of Fig. 2 used in a heat source.

4 is a perspective view of a cold plate according to another embodiment of the present invention.

Figure 5 is a cross-sectional view of the cold plate of Figure 4 taken along line 5-5.

Fig. 6 is a cross-sectional view showing the cold plate of Fig. 5 used in a heat source.

FIG. 7 is an exploded view of a water-cooling heat sink according to an embodiment of the present invention.

Figure 8 is a cross-sectional view showing the water-cooling heat sink of Figure 7 used in a heat source.

Numerous embodiments of the present invention are disclosed in the following figures, and for the sake of clarity, many practical details will be described in the following description. However, it should be understood that these practical details are not applied to limit the case. That is to say, in some implementations of this case, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

FIG. 1 is a perspective view of a cold plate 100 according to an embodiment of the present invention. 2 is a cross-sectional view of the cold plate 100 of FIG. 1 taken along line 2-2. Referring also to FIGS. 1 and 2, the refrigerating plate 100 includes a plate body 110 and a working fluid 120. The plate body 110 has a hollow structure with a vacuum confined space 112 therein. The working fluid 120 is housed in the enclosed space 112. The material of the plate body 110 may be copper, aluminum or other metal with a high heat transfer coefficient. The working fluid 120 can be water or alcohol, but is not limited to water or alcohol.

In the present embodiment, the sealed space 112 can be in a vacuum state by an evacuation process to lower the boiling point of the working fluid 120. Wherein, the pressure range of the vacuum confined space 112 includes a low vacuum (760 to 100 torr), a medium vacuum (100 to 1 torr), a medium high vacuum (1 to 10 ^-3 torr), and a high vacuum (10 ^-3 to 10 ^-7 torr) ). In fact, the pressure of the vacuum confined space 112 will be adjusted depending on the wattage of the heat source 310 or the nature of the working fluid. In the following description, the state when the above-described cooling plate 100 is used will be described.

FIG. 3 is a cross-sectional view showing the cold plate 100 of FIG. 2 used in the heat source 310. As shown, the heat source 310 is disposed on the circuit board 320. The heat source 310 can be a central processing unit (CPU), an imaging chip, or other electronic components that generate heat. When the cooling plate 100 is disposed on the heat source 310, the heat generated by the heat source 310 can be thermally conducted by the plate body 110. At the same time, the working fluid 120 in the plate body 110 can absorb the heat of the plate body 110 to cause a phase change. The side of the cooling plate 100 near the heat source 310 is at a high temperature (for example, the lower side of the cooling plate 100), and the side away from the heat source 310 is at a low temperature (for example, the upper side of the cooling plate 100).

For example, when the working fluid 120 is water, the liquid water near the inner surface 122 is heated to form water vapor and moves to the inner surface 124 in the direction D1. Since the temperature of the inner surface 124 is lower than the temperature of the inner surface 122, the water vapor can condense into liquid water at the low temperature inner surface 124. After the liquid water condensed on the inner surface 124 accumulates a certain volume of water, it is dripped back to the inner surface 122 in the direction D2 by the influence of gravity. In this way, the working fluid 120 can stabilize the temperature of the heat source 310 by continuous phase change, and prevent the heat source 310 from being overheated and damaged.

That is to say, the cooling plate 100 has the ability of heat storage in addition to the heat diffusion function.

4 is a diagram showing a cold plate 100a according to another embodiment of the present disclosure. Stereogram. Figure 5 is a cross-sectional view of the cold plate 100a of Figure 4 taken along line 5-5. Referring also to FIGS. 4 and 5, the refrigerating plate 100a includes the plate body 110 and the working fluid 120. The difference from the first embodiment and the second embodiment is that the outer surface 114 of the plate body 110 facing the closed space 112 has a plurality of first concave-convex structures 132, and the plate body 110 faces the inner surfaces 122 and 124 of the closed space 112. There are a plurality of second concave-convex structures 134, 136, respectively. The first concave-convex structure 132 and the second concave-convex structures 134, 136 may be convex ribs, grooves, meshes or a combination thereof. The first concave-convex structure 132 and the second concave-convex structures 134 and 136 may be directly processed (for example, stamped) from the plate body 110, or fixed to the plate body 110 by welding, bonding, or the like, and are not limited to the present invention.

In the following description, the state when the above-described cooling plate 100a is used will be described.

FIG. 6 is a cross-sectional view showing the heat sink 310 of FIG. 5 used in the heat source 310. When the cooling plate 100a is disposed on the heat source 310, the heat generated by the heat source 310 can be thermally conducted by the plate body 110. At the same time, the working fluid 120 in the plate body 110 can absorb the heat of the plate body 110 to cause a phase change. In the present embodiment, the second concave-convex structure 134 can increase the area of the inner surface 122 contacting the liquid working fluid 120, and can improve the heat transfer efficiency of the plate body 110 to the liquid working fluid 120 at a high temperature, and the evaporation rate of the liquid working fluid 120. accelerate. In addition, the second concave-convex structure 136 can increase the area of the inner surface 124 contacting the gaseous working fluid 120, and can improve the heat transfer efficiency of the plate body 110 to the gaseous working fluid 120 at a low temperature, and accelerate the condensation speed of the gaseous working fluid 120.

Moreover, the first concave-convex structure 132 is located on the outer surface 114 of the plate body 110, which can increase the area of the outer surface 114 contacting the air, and improve the heat dissipation efficiency of the plate body 110. That is to say, both the first concave-convex structure 132 and the second concave-convex structure 134, 136 can increase the heat exchange rate of the cold plate 100a, and effectively exclude the heat of the heat source 310.

The first concave-convex structure 132 and the second concave-convex structures 134 and 136 can be selectively designed on the plate body 110 according to the heat dissipation requirement of the heat source 310, which is not limited by the designer. For example, the plate body 110 may have only the second concave-convex structure 134 without the first concave-convex structure 132 and the second concave-convex structure 136; or the plate body 110 may have only the first concave-convex structure 132 without the first The two concave-convex structures 134, 136 can be determined according to the needs of the designer.

However, when the heat source 310 is under high load and has a high temperature, in order to effectively heat the heat source 310, the cooling plate of the present invention can be connected to a water-cooling module.

It should be understood that in the above description, the component connection relationships that have been described will not be repeated, and will be described first. In the following description, a water-cooling heat sink having a cooling plate 100a will be described as an example.

FIG. 7 is an exploded view of the water-cooling heat sink 200 according to an embodiment of the present invention. FIG. 8 is a cross-sectional view showing the water cooling device 200 of FIG. 7 used in the heat source 310. Referring also to FIGS. 7 and 8, the water-cooling heat sink 200 includes a cooling plate 100a and a water cooling module 210. The water cooling module 210 can be coupled to the refrigerating plate 100a. The water cooling module 210 includes a cooling plate connector 212 (commonly referred to as a water cooling head), a mercury mercury 214, and a heat exhausting portion 216 (commonly referred to as a water cooling row). The first connecting pipe 218a and the second connecting pipe 218b are connected to the coolant 215. Wherein, the cooling plate connector 212 has a cavity 213, and the cooling plate 100a is located in the cavity 213. Mercury 214 is disposed in the cavity 213. The second connecting pipe 218b and the first connecting pipe 218a are both connected between the cold plate connecting head 212 and the heat exhausting portion 216. The coolant 215 is housed in the cavity 213, the heat exhausting portion 216, the first connecting pipe 218a, and the second connecting pipe 218b.

In the present embodiment, the cooling liquid 215 may be water, but is not limited to water. The fan 220 may be a fan attached to the system fan or the heat exhaust unit 216. The fan 220 blows toward the heat exhausting portion 216, and the temperature of the heat exhausting portion 216 can be lowered, thereby lowering the temperature of the cooling liquid 215 in the heat exhausting portion 216.

When the heat source 310 is in operation, the water mercury 214 can cause the coolant 215 to flow in the direction D3 of the heat exhaust portion 216, the first connecting pipe 218a, the cold plate connecting head 212, and the second connecting pipe 218b. Since the outer surface 114 of the plate 110 of the refrigerating plate 100a contacting the coolant 215 has the first concavo-convex structure 132, the coolant 215 can quickly move the tropic of the plate 110 to accelerate the condensation of the gaseous working fluid 120 near the inner surface 124. The speed increases the heat exchange rate of the entire plate 100a. In this way, the water-cooling heat sink 200 can effectively reduce the temperature of the heat source 310.

When the coolant 215 passes through the refrigerating plate 100a in the cavity 213, the temperature of the coolant 215 rises and flows into the heat exhaust portion 216 via the second connecting pipe 218b. Then, the wind generated by the fan 220 can cool the heat exhaust portion 216 by the principle of heat convection, so that the coolant 215 flowing out of the heat exhaust portion 216 has a lower temperature than the heat exhaust portion 216. Thereafter, the low temperature coolant 215 can flow into the cavity of the cold plate connector 212 through the first connecting pipe 218a. 213.

In the present embodiment, the mercury mercury 214 may be a fixed speed mercury or a variable frequency mercury. When the mercury 214 is fixed-speed mercury, as long as the mercury 214 is energized, the coolant 215 circulates along the heat-dissipating portion 216, the first connecting pipe 218a, the cooling plate connecting head 212 and the second connecting pipe 218b, so that The water-cooling heat sink 200 has the effect of exhausting heat. When the mercury 214 is de-energized, the coolant 215 stops flowing. At this time, the water-cooling heat sink 200 can still store heat by the cooling plate 215 in the cooling plate 100a and the cavity 213.

When the mercury mercury 214 is a variable frequency mercury, the temperature control device (not shown) for measuring the heat source 310 can be electrically connected. The temperature control device senses the temperature of the heat source 310 and adjusts the power of the mercury mercury 214. For example, the lower the temperature of the heat source 310, the lower the power of the mercury 214, and the smaller the flow rate of the coolant 215; the higher the temperature of the heat source 310, the higher the power of the mercury 214, and the greater the flow rate of the coolant 215. In this way, the water-cooling heat sink 200 has an energy-saving effect. In addition, the temperature control device can also set the heat source 310 to be higher than a specific temperature value (for example, 70 ° C), the mercury mercury 214 is powered on, depending on the designer's needs, and does not limit the case.

The method of connecting the water-cooling module 210 to the cooling plate 210 of the other embodiments of the present invention is the same as that of the cooling plate 100a, and the principle is similar, so Repeat the details.

The cold plate and water cooling device of the present invention have the following advantages:

(1) The cooling plate has a working fluid, and the working fluid is accommodated in the sealed space of the plate body, so when the cooling plate is disposed on the heat source, the heat source is generated The heat can not only be thermally conductive by the plate body, but also the working fluid in the plate body can absorb heat to produce a phase change, so that the cooling plate has both heat diffusion and heat storage capability.

(2) When the water-cooling module is connected to the cooling plate, the cooling plate and the cooling liquid are located in the cavity of the cooling plate connector, and the coolant can quickly take away the heat of the cooling plate, thereby effectively increasing the temperature of the heat source. .

(3) The first concavo-convex structure and the second concavo-convex structure may be selectively designed on the outer surface or the inner surface of the plate of the refrigerating plate according to the heat dissipation requirement of the heat source, so that the heat exchange rate of the entire refrigerating plate is increased.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present case. Anyone skilled in the art can make various changes and refinements without departing from the spirit and scope of the case. Therefore, the scope of protection of this case is considered. The scope defined in the patent application is subject to change.

100a‧‧‧ cold plate

110‧‧‧ board

112‧‧‧Confined space

114‧‧‧ outer surface

120‧‧‧Working fluid

122‧‧‧ inner surface

124‧‧‧ inner surface

132‧‧‧First concave structure

134‧‧‧second concave structure

136‧‧‧second concave structure

200‧‧‧Water cooling device

210‧‧‧Water cooling module

212‧‧‧Temperature plate connector

213‧‧‧ cavity

214‧‧‧ Mercury

215‧‧‧ coolant

216‧‧‧Hot Department

218a‧‧‧First connecting tube

218b‧‧‧Second connection tube

220‧‧‧fan

310‧‧‧heat source

320‧‧‧ boards

D1‧‧ Direction

D2‧‧ Direction

D3‧‧ Direction

Claims (10)

A refrigerating plate comprises: a plate body having a closed space with a vacuum therein; and a working fluid housed in the confined space. The refrigerating plate of claim 1, wherein the plate body has a plurality of first concavo-convex structures on an outer surface of the confined space. The cold plate according to claim 2, wherein the first concave-convex structures are ribs, grooves, meshes or a combination thereof. The cold plate according to claim 1, wherein the plate body has a plurality of second concave-convex structures facing an inner surface of the sealed space. The cold plate according to claim 4, wherein the second uneven structures are ribs, grooves, meshes or a combination thereof. A water-cooling heat dissipating device comprising: a uniform cold plate comprising: a plate body having a sealed space of a vacuum therein; and a working fluid housed in the confined space; and a water cooling module connected to the cooling device board. The water cooling device according to claim 6, wherein the water cooling module The method comprises: a uniform cold plate connector having a cavity, wherein the cooling plate is located in the cavity; a mercury in water, disposed in the cavity; a row of hot portions; a first connecting pipe; and a second connecting pipe And the first connecting pipe is connected between the cooling plate connecting head and the heat discharging portion; and a cooling liquid is received in the cavity, the heat discharging portion, the first connecting pipe and the second pipe Connected to the tube. The water-cooling heat dissipating device of claim 7, wherein an outer surface of the plate body contacting the coolant has a plurality of first concavo-convex structures. The water-cooling heat dissipating device of claim 7, wherein the mercury in the water is constant-speed mercury or variable-temperature mercury. The water-cooling heat dissipating device of claim 6, wherein the plate body has a plurality of second concave-convex structures facing an inner surface of the sealed space.