TW201401348A - Micro bubble processing device - Google Patents

Micro bubble processing device Download PDF

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Publication number
TW201401348A
TW201401348A TW101123444A TW101123444A TW201401348A TW 201401348 A TW201401348 A TW 201401348A TW 101123444 A TW101123444 A TW 101123444A TW 101123444 A TW101123444 A TW 101123444A TW 201401348 A TW201401348 A TW 201401348A
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Taiwan
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liquid
processed
aeration
disposed
processing
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TW101123444A
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Chinese (zh)
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TWI443725B (en
Inventor
Toshi Miki
Kai-Yi Wang
Zhi-Qiang Peng
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Taiwan Uyemura Co Ltd
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Priority to TW101123444A priority Critical patent/TW201401348A/en
Priority to JP2013133344A priority patent/JP6053624B2/en
Priority to KR1020130073807A priority patent/KR101647542B1/en
Priority to CN201310263833.2A priority patent/CN103567183B/en
Publication of TW201401348A publication Critical patent/TW201401348A/en
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Publication of TWI443725B publication Critical patent/TWI443725B/zh

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Abstract

The invention discloses a micro bubble processing device. The micro bubble processing device includes a processing chamber. Two overflow boxes are disposed at different sides of the processing chamber. The processing chamber stores liquid. At least a element to be processed is immersed in the liquid. Two movable flow guide plates and an aeration element are disposed in the processing chamber and immersed in the liquid. One of the movable flow guide plate is disposed between any of the overflow boxes and the element to be processed. The element to be processed is disposed between two movable flow guide plates. The aeration element is disposed below the element to be processed and configured to receive a power for generating uniform and upwardly moving micro bubbles moving along with a linear direction. The micro bubbles touch the surface of the element to be processed and removes the impurities from the surface of the element to be processed. In addition, the micro bubbles keep moving upwardly in the liquid and guided into the overflow box through the movable flow guide plates. The invention can achieve purpose of reducing the cost, improving the clean efficiency and increasing the production.

Description

微氣泡式處理裝置 Micro bubble processing device

本發明係有關一種處理裝置,特別是關於一種微氣泡式處理裝置。 The present invention relates to a processing apparatus, and more particularly to a microbubble processing apparatus.

微處理器、記憶體、電荷耦合元件(CCD)等之半導體裝置,或薄膜電晶體(TFT)液晶等之平面板顯示裝置之製造步驟,係於矽或二氧化矽(SiO2)、玻璃等之基板表面由亞微米~亞微0.1微米之尺寸進行形成圖型或形成薄膜,於製造之各步驟減低基板表面之微量污染為極重要之課題。 A semiconductor device such as a microprocessor, a memory, a charge coupled device (CCD), or the like, or a manufacturing process of a flat panel display device such as a thin film transistor (TFT) liquid crystal, is used for tantalum or cerium oxide (SiO 2 ), glass, or the like. The surface of the substrate is formed into a pattern or a thin film from a submicron to a submicron size of 0.1 μm, and it is extremely important to reduce the microscopic contamination on the surface of the substrate in each step of the manufacturing process.

基板表面之污染中亦特別以顆粒污染、有機物污染及金屬污染三者必需極力減低。如此污染之去除,一般以洗淨液進行基板表面之洗淨。此種洗淨,必須達到無副作用,短時間,且低成本之效果。然而,在習知技術中,如第1圖所示,以印刷電路板(PCB)製程之水洗槽為例,此槽中係安裝有複數根空氣管10,其表面具有複數穿孔,以釋放空氣,產生空氣泡。當水洗槽儲有水時,可將基板浸於水中,讓向上移動之空氣泡來洗淨待處理件表面上的污物,但此氣泡在移動時,其實並無直線性。此外,水洗槽底部亦會設置均流板,由於此板孔徑較大,造成擾流產生,使洗淨效果大幅降低。再者,若欲將基板徹底洗淨,由於上述原因,水洗槽的數量不會只有一個,必須設有數個水洗槽,方可增加洗淨效果,但是如此會增加設備長度及環境負荷,無形中提高成本。 In the pollution of the surface of the substrate, particle pollution, organic matter pollution and metal pollution must be reduced as much as possible. For the removal of such contamination, the surface of the substrate is generally washed with a cleaning solution. This kind of washing must achieve no side effects, short time, and low cost. However, in the prior art, as shown in FIG. 1, a water washing tank of a printed circuit board (PCB) process is exemplified, in which a plurality of air tubes 10 are mounted, and the surface has a plurality of perforations to release air. , generating air bubbles. When the water washing tank stores water, the substrate can be immersed in water, and the upward moving air bubbles can be used to wash the dirt on the surface of the object to be treated, but the air bubbles are not linear when moving. In addition, a flow equalization plate is also arranged at the bottom of the washing tank. Due to the large hole diameter of the plate, the disturbance is generated, and the washing effect is greatly reduced. Furthermore, if the substrate is to be thoroughly washed, for the above reasons, the number of washing tanks is not limited to one, and several washing tanks must be provided to increase the washing effect, but this will increase the length of the equipment and the environmental load, which is invisible. Increase costs.

因此,本發明係在針對上述之困擾,提出一種微氣泡式處理裝置,以解決習知所產生的問題。 Accordingly, the present invention has been made in view of the above problems, and a microbubble type processing apparatus has been proposed to solve the problems caused by the prior art.

本發明之主要目的,在於提供一種微氣泡式處理裝置,其係利用不斷均勻直線上升之微氣泡清洗待處理件,以減少水洗槽與搬送機之數量、縮短設備長度、減少使用水洗水量,進而降低成本、改善洗淨效率,提升生產量。 The main object of the present invention is to provide a microbubble type treatment device which utilizes microbubbles which are continuously and uniformly raised to clean the object to be treated, thereby reducing the number of washing tanks and conveyors, shortening the length of the equipment, and reducing the amount of water used for washing. Reduce costs, improve cleaning efficiency, and increase production.

為達上述目的,本發明提供一種微氣泡式處理裝置,其係處理至少一待處理件,例如金屬板或半導體基板。此微氣泡處理裝置包含一處理槽,其相異兩側分別具有一溢流盒,此處理槽儲有一液體,例如清潔液或電鍍液。且至少一待處理件浸於液體中。處理槽中設有二活動式導流板與一曝氣元件,其係皆浸於液體中。且每一溢流盒與待處理件之間有一活動式導流板,待處理件位於二活動式導流板之間。曝氣元件位於待處理件下方,並接受一動力,以於液體中產生均勻且直線向上行進之複數微氣泡,以處理待處理件之表面後,微氣泡帶離表面上之雜質,並於液體中向上移動,且受活動式導流板之導引至溢流盒中。 To achieve the above object, the present invention provides a microbubble type processing apparatus which processes at least one member to be processed, such as a metal plate or a semiconductor substrate. The microbubble processing device comprises a processing tank having an overflow box on each of the opposite sides, the processing tank storing a liquid such as a cleaning liquid or a plating solution. And at least one of the parts to be treated is immersed in the liquid. The movable trough is provided with two movable baffles and an aeration element, all of which are immersed in the liquid. And there is a movable baffle between each overflow box and the to-be-processed part, and the to-be-processed part is located between two movable baffles. The aeration element is located below the material to be treated and receives a power to generate a plurality of microbubbles which are uniformly and linearly traveling in the liquid to process the surface of the member to be treated, and the microbubbles carry impurities on the surface and are in the liquid The middle moves upwards and is guided by the movable baffle into the overflow box.

茲為使 貴審查委員對本發明之結構特徵及所達成之功效更有進一步之瞭解與認識,謹佐以較佳之實施例圖及配合詳細之說明,說明如後: For a better understanding and understanding of the structural features and the achievable effects of the present invention, please refer to the preferred embodiment and the detailed description.

以下介紹本發明之第一實施例,請參閱第2圖與第3圖。本發明之第一實施例係處理至少一待處理件12,例如半導體基板或金屬板,本發明包含一處理槽14,其相異兩側分別具有一溢流盒16,處理槽14儲有一液體18,如作為清潔液之水或電鍍液,待處理件12設於一支撐架13上,並與其同時浸於液體18中。二活動式導流板20與作為一曝氣元件22之曝氣盒24皆設於處理槽14中,並浸於液體18,其中曝氣元件22具有複數微孔26, 每一微孔26之孔徑為30微米~100微米。每一溢流盒16與待處理件12之間有一活動式導流板20,待處理件12位於二活動式導流板20之間。曝氣元件22位於待處理件12下方,曝氣元件22接受一動力,以於液體18中從微孔26裡產生均勻且直線向上行進之複數微氣泡,以處理待處理件12之表面後,微氣泡帶離表面上之雜質,如離子或污物,並於液體18中向上移動,且受二活動式導流板20之導引至二溢流盒16中。 The first embodiment of the present invention will now be described, see Figs. 2 and 3. The first embodiment of the present invention processes at least one component 12 to be processed, such as a semiconductor substrate or a metal plate. The present invention includes a processing tank 14 having an overflow box 16 on each of the opposite sides, and the processing tank 14 stores a liquid. 18, as water or plating solution as a cleaning liquid, the member to be treated 12 is placed on a support frame 13 and simultaneously immersed in the liquid 18 at the same time. The two movable baffles 20 and the aeration box 24 as an aeration element 22 are disposed in the processing tank 14 and immersed in the liquid 18, wherein the aeration element 22 has a plurality of micropores 26, Each of the micropores 26 has a pore size of from 30 micrometers to 100 micrometers. There is a movable baffle 20 between each overflow box 16 and the to-be-processed member 12, and the to-be-processed member 12 is located between the two movable baffles 20. The aeration element 22 is located below the member to be treated 12, and the aeration element 22 receives a power to generate a plurality of microbubbles that are uniformly and linearly traveling upward from the micropores 26 in the liquid 18 to process the surface of the member 12 to be treated. The microbubbles are carried away from impurities on the surface, such as ions or dirt, and move upward in the liquid 18, and are guided by the two movable baffles 20 into the two overflow boxes 16.

處理槽14更包含一容置槽28,其相異兩側之外壁分別設有一溢流盒16,容置槽28與二溢流盒16儲有液體18,且二活動式導流板20與曝氣元件22設於容置槽28中。曝氣元件22連結一導風管30,其係透過處理槽14之容置槽28連結一鼓風機32。鼓風機32產生一氣流時,導風管30承接此氣流,以產生上述動力。 The processing tank 14 further includes a receiving groove 28, and an outer overflow wall 16 is respectively provided with an overflow box 16, the receiving groove 28 and the two overflow box 16 store the liquid 18, and the two movable baffles 20 and The aeration element 22 is disposed in the accommodating groove 28. The aeration element 22 is coupled to an air duct 30 that is coupled to a blower 32 through a receiving slot 28 of the processing tank 14. When the air blower 32 generates an air flow, the air duct 30 receives the air flow to generate the above power.

當待處理件12與支撐架13同時浸於液體18中時,鼓風機32產生一氣流,其透過導風管30送入曝氣盒24中,曝氣盒24接受此氣流所產生之動力,以通過微孔26產生均勻且直線向上行進之複數微氣泡,處理待處理件12之表面。若液體18為清潔液,則此時微氣泡帶離表面上之雜質為污物,且由於微氣泡有直線上升的性質,微氣泡與清潔液可均勻通過待處理件12之表面,故相對於習知技術,可改善槽中附著於待處理件12表面的羽毛狀物之洗淨效果,達到更好的均勻洗淨程度。若液體18為電鍍液,則此時微氣泡帶離表面上之雜質為離子,亦由於微氣泡與電鍍液可均勻通過待處理件12之表面,故平均的液流可使電鍍膜厚與表面溫度分佈均一化,具有極佳的電鍍效果。雜質被帶離後,微氣泡繼續於液體18中向上移動,且受二活動式導流板20之導引至二溢流盒16中,以降低容置槽28內之離 子濃度,使容置槽28內之液體18不含雜質。換言之,因為容置槽28內的雜質都會被送入溢流盒16中,故不用設置多個水槽來增進洗淨效果,如此亦可同時縮短設備長度,減少水槽及搬運機之數量,與使用水洗水量,以減輕環境負荷。此外,因為可以減少水槽數量,故若將本發明設置在廠房時,則可就既有設備進行改造,將多出來的空間設置其他製程設備,以同時節省空間,並縮短製程時間,提生產量。 When the to-be-processed member 12 and the support frame 13 are simultaneously immersed in the liquid 18, the air blower 32 generates an air flow which is sent to the aeration box 24 through the air duct 30, and the aeration box 24 receives the power generated by the air flow to The surface of the member to be treated 12 is treated by the micropores 26 to generate a plurality of microbubbles which are uniformly and linearly traveling upward. If the liquid 18 is a cleaning liquid, the impurities on the surface of the microbubbles are dirt at this time, and since the microbubbles have a linear rising property, the microbubbles and the cleaning liquid can uniformly pass through the surface of the member to be treated 12, so The conventional technique can improve the cleaning effect of the feathers attached to the surface of the member to be treated 12 in the tank to achieve a better uniform washing degree. If the liquid 18 is a plating solution, the impurities on the surface of the microbubbles are ions at this time, and since the microbubbles and the plating solution can uniformly pass through the surface of the member to be treated 12, the average liquid flow can make the plating film thick and surface. The temperature distribution is uniform and has an excellent plating effect. After the impurities are carried away, the microbubbles continue to move upward in the liquid 18, and are guided by the two movable baffles 20 into the two overflow boxes 16 to reduce the distance in the accommodating grooves 28. The sub-concentration is such that the liquid 18 in the accommodating tank 28 contains no impurities. In other words, since the impurities in the accommodating groove 28 are sent into the overflow box 16, it is not necessary to provide a plurality of water tanks to improve the cleaning effect, so that the length of the equipment can be shortened at the same time, and the number of the water tank and the transport machine can be reduced and used. The amount of water washed to reduce the environmental load. In addition, since the number of water tanks can be reduced, if the present invention is installed in a factory building, the existing equipment can be modified, and the additional space can be set to other processing equipment, thereby simultaneously saving space, shortening the processing time, and increasing the throughput. .

請繼續參閱第4圖,曝氣盒24由一空氣盒34與一微孔板36所構成,空氣盒34具有一開口,並連結導風管30,以接受氣流所產生之動力,微孔板36則具有複數微孔26,並位於空氣盒34上,以封閉開口,且藉由動力從微孔26中產生微氣泡。 Referring to FIG. 4, the aeration box 24 is composed of an air box 34 and a microplate 36. The air box 34 has an opening and is connected to the air duct 30 to receive the power generated by the air flow. 36 has a plurality of micropores 26 and is located on the air box 34 to close the opening and generate microbubbles from the micropores 26 by the power.

以下介紹本發明之第二實施例,在第一實施例中,曝氣元件22以曝氣盒24為例,請參閱第5圖與第6圖,第二實施例之曝氣元件22以曝氣管38為例,曝氣管38設於處理槽14中,並浸於液體18,其中曝氣管38具有複數微孔26,每一微孔26之孔徑為30微米~100微米。曝氣管38位於待處理件12下方,曝氣管38接受一動力,以於液體18中從微孔26裡產生均勻且直線向上行進之複數微氣泡,以處理待處理件12之表面後,微氣泡帶離表面上之雜質,並於液體18中向上移動,且受二活動式導流板20之導引至二溢流盒16中。 The second embodiment of the present invention is described below. In the first embodiment, the aeration element 22 is exemplified by the aeration box 24, see FIGS. 5 and 6, and the aeration element 22 of the second embodiment is exposed. For example, the air tube 38 is disposed in the treatment tank 14 and immersed in the liquid 18, wherein the aeration tube 38 has a plurality of micropores 26, each of which has a pore diameter of 30 micrometers to 100 micrometers. The aeration tube 38 is located below the member to be treated 12, and the aeration tube 38 receives a power to generate a plurality of microbubbles that are uniformly and linearly traveling from the micropores 26 in the liquid 18 to process the surface of the member 12 to be treated. The microbubbles carry away impurities on the surface and move upward in the liquid 18 and are guided by the two movable baffles 20 into the two overflow boxes 16.

第二實施例與第一實施例在運作方式上完全相同,故於此不再贅述。 The second embodiment is identical in operation to the first embodiment, and thus will not be described again.

綜上所述,本發明利用微氣泡技術,達到降低成本、提升洗淨效率與生產量之目的。 In summary, the present invention utilizes the microbubble technology to achieve the purpose of reducing cost, improving cleaning efficiency and throughput.

以上所述者,僅為本發明一較佳實施例而已,並非用來限定本發明實 施之範圍,故舉凡依本發明申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾,均應包括於本發明之申請專利範圍內。 The above is only a preferred embodiment of the present invention and is not intended to limit the present invention. </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt;

10‧‧‧空氣管 10‧‧‧ air tube

12‧‧‧待處理件 12‧‧‧Spread parts

13‧‧‧支撐架 13‧‧‧Support frame

14‧‧‧處理槽 14‧‧‧Processing tank

16‧‧‧溢流盒 16‧‧‧Overflow box

18‧‧‧液體 18‧‧‧Liquid

20‧‧‧活動式導流板 20‧‧‧Active deflector

22‧‧‧曝氣元件 22‧‧‧Aeration components

24‧‧‧曝氣盒 24‧‧‧Aeration box

26‧‧‧微孔 26‧‧‧Micropores

28‧‧‧容置槽 28‧‧‧ accommodating slots

30‧‧‧導風管 30‧‧‧air duct

32‧‧‧鼓風機 32‧‧‧Blowers

34‧‧‧空氣盒 34‧‧‧ air box

36‧‧‧微孔板 36‧‧‧Microplate

38‧‧‧曝氣管 38‧‧‧Aeration tube

第1圖為先前技術之水洗裝置之結構立體圖。 Figure 1 is a perspective view showing the structure of a prior art water washing device.

第2圖為本發明之第一實施例之結構立體圖。 Fig. 2 is a perspective view showing the structure of the first embodiment of the present invention.

第3圖為本發明之第一實施例之結構分解圖。 Figure 3 is an exploded view of the first embodiment of the present invention.

第4圖為本發明之曝氣盒之結構立體圖。 Fig. 4 is a perspective view showing the structure of an aeration tank of the present invention.

第5圖為本發明之第二實施例之結構立體圖。 Fig. 5 is a perspective view showing the structure of a second embodiment of the present invention.

第6圖為本發明之第二實施例之結構分解圖。 Figure 6 is an exploded view of the second embodiment of the present invention.

12‧‧‧待處理件 12‧‧‧Spread parts

13‧‧‧支撐架 13‧‧‧Support frame

14‧‧‧處理槽 14‧‧‧Processing tank

16‧‧‧溢流盒 16‧‧‧Overflow box

18‧‧‧液體 18‧‧‧Liquid

20‧‧‧活動式導流板 20‧‧‧Active deflector

22‧‧‧曝氣元件 22‧‧‧Aeration components

24‧‧‧曝氣盒 24‧‧‧Aeration box

26‧‧‧微孔 26‧‧‧Micropores

28‧‧‧容置槽 28‧‧‧ accommodating slots

30‧‧‧導風管 30‧‧‧air duct

32‧‧‧鼓風機 32‧‧‧Blowers

Claims (11)

一種微氣泡式處理裝置,其係處理至少一待處理件,該微氣泡處理裝置包含:一處理槽,其相異兩側分別具有一溢流盒,該處理槽儲有一液體,該至少一待處理件浸於該液體中;二活動式導流板,其係設於該處理槽中,且每一該溢流盒與該至少一待處理件之間有一該活動式導流板,該至少一待處理件位於該二活動式導流板之間,該二活動式導流板浸於該液體中;以及一曝氣元件,設於該處理槽中,並浸於該液體,且位於該至少一待處理件下方,該曝氣元件接受一動力,以於該液體中產生均勻且直線向上行進之複數微氣泡,以處理該至少一待處理件之表面後,該些微氣泡帶離該表面上之雜質,並於該液體中向上移動,且受該二活動式導流板之導引至該二溢流盒中。 A micro-bubble type processing device for processing at least one object to be processed, the micro-bubble processing device comprising: a processing tank having an overflow box on each of the opposite sides, the processing tank storing a liquid, the at least one waiting The processing member is immersed in the liquid; the movable baffle is disposed in the processing tank, and each of the overflow box and the at least one to-be-processed member has the movable baffle, the at least a to-be-processed part is located between the two movable baffles, the two movable baffles are immersed in the liquid; and an aeration element is disposed in the treatment tank and immersed in the liquid, and is located at the Under at least one of the to-be-processed components, the aeration element receives a power to generate a plurality of microbubbles that are uniformly and linearly traveling in the liquid to process the surface of the at least one to-be-processed component, the micro-bubbles being removed from the surface The upper impurity moves upward in the liquid and is guided by the two movable baffles into the two overflow boxes. 如請求項1所述之微氣泡式處理裝置,其中該曝氣元件為曝氣盒或曝氣管。 The microbubble treatment device of claim 1, wherein the aeration element is an aeration tank or an aeration tube. 如請求項1所述之微氣泡式處理裝置,其中該曝氣元件具有複數微孔,該些微氣泡由該些微孔產生之。 The microbubble treatment device of claim 1, wherein the aeration element has a plurality of micropores, and the microbubbles are generated by the micropores. 如請求項3所述之微氣泡式處理裝置,其中每一該微孔之孔徑為30微米~100微米。 The microbubble treatment device according to claim 3, wherein each of the micropores has a pore diameter of 30 μm to 100 μm. 如請求項1所述之微氣泡式處理裝置,更包含:一鼓風機,產生一氣流;以及一導風管,其係連結該曝氣元件,並透過該處理槽連結該鼓風機,該導 風管承接該氣流,以產生該動力。 The micro-bubble processing device of claim 1, further comprising: a blower to generate a gas flow; and an air duct connecting the aeration element and connecting the blower through the treatment tank, the guide The air duct receives the air flow to generate the power. 如請求項1所述之微氣泡式處理裝置,其中該處理槽更包含一容置槽,其相異兩側之外壁分別設有一該溢流盒,該容置槽與該二溢流盒儲有該液體,且該二活動式導流板與該曝氣元件設於該容置槽中。 The micro-bubble processing device of claim 1, wherein the processing tank further comprises a receiving groove, wherein the outer wall of each of the two sides is respectively provided with an overflow box, and the receiving groove and the overflow box are stored. The liquid is provided, and the two movable baffles and the aeration element are disposed in the accommodating groove. 如請求項1所述之微氣泡式處理裝置,其中該至少一待處理件設於一支撐架上,並與其同時浸於該液體中。 The microbubble treatment device of claim 1, wherein the at least one to-be-processed member is disposed on a support frame and simultaneously immersed in the liquid. 如請求項1所述之微氣泡式處理裝置,其中該至少一待處理件為金屬板或半導體基板。 The microbubble processing apparatus of claim 1, wherein the at least one object to be processed is a metal plate or a semiconductor substrate. 如請求項1所述之微氣泡式處理裝置,其中該液體為清潔液或電鍍液。 The microbubble treatment device of claim 1, wherein the liquid is a cleaning liquid or a plating solution. 如請求項9所述之微氣泡式處理裝置,其中該清潔液為水。 The microbubble treatment device of claim 9, wherein the cleaning liquid is water. 如請求項1所述之微氣泡式處理裝置,其中該雜質為離子或污物。 The microbubble treatment device of claim 1, wherein the impurity is an ion or a dirt.
TW101123444A 2012-06-29 2012-06-29 Micro bubble processing device TW201401348A (en)

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TW101123444A TW201401348A (en) 2012-06-29 2012-06-29 Micro bubble processing device
JP2013133344A JP6053624B2 (en) 2012-06-29 2013-06-26 Fine bubble processing equipment
KR1020130073807A KR101647542B1 (en) 2012-06-29 2013-06-26 Processing apparatus using a fine air bubbles
CN201310263833.2A CN103567183B (en) 2012-06-29 2013-06-27 Micro-bubble type processing device

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