CN110416150B - Silicon wafer clamping device - Google Patents
Silicon wafer clamping device Download PDFInfo
- Publication number
- CN110416150B CN110416150B CN201910649553.2A CN201910649553A CN110416150B CN 110416150 B CN110416150 B CN 110416150B CN 201910649553 A CN201910649553 A CN 201910649553A CN 110416150 B CN110416150 B CN 110416150B
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- Prior art keywords
- cover plate
- clamping
- plate structure
- silicon wafer
- workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Abstract
The invention provides a silicon wafer clamping device, which relates to the field of semiconductor cleaning, and comprises: the clamping body is used for clamping a workpiece; the fixing part is positioned at the lower end of the clamping main body and used for fixing the clamped workpiece, and the fixing part and the clamping main body enclose a clamping space for accommodating the workpiece; the cover plate structure is arranged at the upper end of the clamping main body and is positioned above the clamping space. The embodiment of the invention effectively solves the problem that the concentration of chemicals for cleaning the surface of the silicon wafer is increased due to water volatilization in the transportation process of the silicon wafer cleaning process, so that the surface quality of the silicon wafer is influenced.
Description
Technical Field
The invention relates to the field of semiconductor cleaning, in particular to a silicon wafer clamping device.
Background
The cleaning process of the silicon wafer is an important process in the production of semiconductor elements, and comprises the steps of cleaning chemicals, washing with ultrapure water, drying and the like in the cleaning process, and the silicon wafer is transported by using a silicon wafer clamping device among the steps. With the increasingly refined semiconductor elements, the requirements on the silicon wafer cleaning process are increasingly improved, however, in the process of transporting the silicon wafer by the silicon wafer clamping device during cleaning, water is volatilized from the surface of the silicon wafer, so that the local concentration of chemicals for cleaning the surface of the silicon wafer is increased, and the substances and the forms on the surface of the silicon wafer are changed, thereby causing the quality of the surface of the silicon wafer to be reduced.
Disclosure of Invention
In view of the above, the invention provides a silicon wafer clamping device, which is used for solving the problem that the quality of the surface of a silicon wafer is reduced due to excessive volatilization of moisture on the surface of the silicon wafer in the transportation process.
In order to solve the above technical problem, the present invention provides a silicon wafer clamping device, comprising:
the clamping body is used for clamping a workpiece;
the fixing part is positioned at the lower end of the clamping main body and used for fixing the clamped workpiece, and the fixing part and the clamping main body enclose a clamping space for accommodating the workpiece;
and the cover plate structure is arranged at the upper end of the clamping main body and is positioned above the clamping space.
Optionally, the cover plate structure has an upper surface with a high middle portion and a low edge.
Optionally, the cover plate structure includes a plurality of cover plates, the cover plates enclose the cover plate structure, and at least a part of the cover plates are disposed obliquely.
Optionally, the cover plate structure includes:
the first inclined cover plate and the second inclined cover plate are overlapped to form an inverted V-shaped structure;
the side cover plates are arranged on two sides of the inverted V-shaped structure, and the side cover plates, the first inclined cover plate and the second inclined cover plate are enclosed to form the cover plate structure.
Optionally, the side cover plate includes a plurality of first sub-baffles, and a gap is formed between adjacent first sub-baffles.
Optionally, the silicon wafer clamping device further comprises a side wall plate structure, the side wall plate structure is arranged on the clamping main body and located below the cover plate structure, a gap is formed between the side wall plate structure and the cover plate structure, and part of the clamping space can be surrounded by the side wall plate structure.
Optionally, the gap between the side wall plate structure and the cover plate structure is 5-15 mm.
Optionally, the upper edge of the side wall plate structure is higher than or equal to the upper edge of the clamping space.
Optionally, the side wall plate structure includes a first side wall plate, a second side wall plate, a third side wall plate and a fourth side wall plate which are arranged on the outer surface of the clamping main body.
Optionally, at least one of the first side enclosure, the second side enclosure, the third side enclosure, and the fourth side enclosure comprises a plurality of second sub-enclosures.
The technical scheme of the invention has the following beneficial effects: the silicon wafer clamping device with the baffle plate has the advantages that gas of the cleaning machine from top to bottom is blocked through the cover plate structure, air circulation on the surface of a workpiece is reduced, the volatilization speed of moisture on the surface of the workpiece is reduced, meanwhile, a humid environment is created for the workpiece through the side wall plate structure, the volatilization of moisture on the periphery of the workpiece is blocked, the purpose of keeping local concentration of chemicals for cleaning on the surface of the workpiece is finally achieved, and the cleaning quality of the workpiece is improved.
Drawings
FIG. 1 is a front view of a wafer clamping device according to an embodiment of the present invention;
FIG. 2 is a side view of a wafer clamping device in accordance with an embodiment of the present invention;
FIG. 3 is a view showing the surface composition of a silicon wafer transported by using a prior art silicon wafer holding apparatus at the time of cleaning;
FIG. 4 is a view showing the surface composition of a silicon wafer transported by using the wafer holding apparatus in the embodiment of the present invention at the time of cleaning.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
Referring to fig. 1 and 2, fig. 1 is a front view of a wafer clamping device according to an embodiment of the present invention, and fig. 2 is a side view of the wafer clamping device according to an embodiment of the present invention, the wafer clamping device including:
a clamping body 101 for clamping a workpiece;
the fixing part 102 is positioned at the lower end of the clamping main body 101 and is used for fixing the clamped workpiece, and the fixing part 102 and the clamping main body 101 enclose a clamping space for accommodating the workpiece;
the cover plate structure 103 is arranged at the upper end of the clamping main body 101 and is positioned above the clamping space;
the silicon wafer clamping device can be a mechanical arm or other devices with clamping and transporting functions;
wherein the clamping body 101 comprises a left clamping body and a right clamping body;
the material of the cover plate structure 103 has the characteristic of not reacting with cleaning chemicals, and is not decomposed or fallen off, so that the cover plate structure can be used in a clean room.
In the embodiment of the invention, the silicon wafer clamping device provided with the cover plate structure is provided, and the cover plate structure is used for blocking wind blown from a filter above the silicon wafer clamping device, so that the volatilization of water on the surface of a workpiece is weakened, the concentration of chemicals for cleaning the surface of the workpiece is kept, and the cleaning quality of the workpiece is improved.
In some embodiments of the present invention, optionally, the cover plate structure 103 has an upper surface with a high middle portion and a low edge.
In the embodiment of the invention, the upper surface of the cover plate structure is high in the middle and low in the edge, and liquid above the cover plate structure can flow down along the cover plate structure in the process of cleaning a workpiece, so that the chemical reagent is prevented from dropping on the surface of the silicon wafer to cause pollution.
In some embodiments of the present invention, optionally, the cover plate structure 103 includes a plurality of cover plates, and the plurality of cover plates enclose the cover plate structure, wherein at least a portion of the cover plates are obliquely arranged to form an upper surface with a high middle part and a low edge.
In the embodiment of the invention, the cover plate structure is composed of a plurality of cover plates, so that the cover plate structure is convenient to mount and dismount, and the manufacturing difficulty of the cover plate structure is reduced.
In some embodiments of the present invention, optionally, as shown in fig. 1 and 2, the cover plate structure 103 includes:
a first inclined cover plate 1031 and a second inclined cover plate 1032, wherein the first inclined cover plate 1031 and the second inclined cover plate 1032 are overlapped to form an inverted V-shaped structure;
side cover plates 1033 disposed at both sides of the inverted V-shaped structure, the side cover plates 1033, the first inclined cover plate 1031 and the second inclined cover plate 1032 enclosing the cover plate structure;
the upper edge of the side cover 1033 is connected to the edge of the first inclined cover 1031 and the edge of the second inclined cover 1032, as shown in fig. 1, the side cover 1033 may be a triangular cover or a cover with other shapes.
In the embodiment of the invention, the cover plate structure is enclosed by the four cover plates, so that the wind above the silicon wafer clamping device is blocked, and the chemical reagent is prevented from dropping on the workpiece, so that the surface of the silicon wafer is not polluted, and the quality of the cleaned workpiece is ensured.
In some embodiments of the present invention, optionally, the side cover plate includes a plurality of first sub-baffles, and a gap is formed between adjacent first sub-baffles;
the side cover plates 1033 on both sides of the inverted V-shaped structure may respectively include different numbers of first sub-baffles, or may include the same number of first sub-baffles.
In the embodiment of the invention, the side cover plate is formed by the plurality of first sub-baffles, so that the side cover plate is convenient to mount and dismount, and meanwhile, a gap is reserved between the first sub-baffles, so that a small amount of wind in the filter of the cleaning machine can be blown to the cover plate structure, and the cleanness of the cover plate structure is kept.
In some embodiments of the present invention, optionally, the silicon wafer clamping device further includes a side-plate structure 104, which is disposed on the clamping main body 101, located below the cover plate structure 103, and has a gap with the cover plate structure 103, where the side-plate structure 104 can surround part of the clamping space.
In the embodiment of the invention, the side wall plate structure is used for preventing the moisture in the space around the workpiece from evaporating, so that a humid environment is created for the workpiece, the moisture evaporation speed of the surface of the workpiece is reduced, and the concentration of chemicals for cleaning the surface of the workpiece is kept.
In some embodiments of the present invention, optionally, the gap between the side wall structure 104 and the cover plate structure 103 is 5-15 mm.
In the embodiment of the invention, a small gap is reserved between the side wall plate structure and the cover plate structure, so that part of air of the filter of the cleaning machine can pass through, the cleanness of a clamping space is ensured, and meanwhile, the moist environment around the workpiece is kept.
In some embodiments of the present invention, optionally, the upper edge of the side gusset structure 104 is higher than or equal to the upper edge of the clamping space;
wherein, the lower edge of the side wall plate structure 104 does not exceed the joint of the clamping main body 101 and the fixing part 102.
In the embodiment of the invention, the moisture on the surface of the workpiece flows downwards under the action of gravity, so that the upper half part of the workpiece is poor in humid environment, and the upper edge of the side wall plate structure is arranged to be higher than the upper edge of the clamping space, so that the humid environment at the upper end of the workpiece can be effectively protected.
In some embodiments of the present invention, optionally, the side wall structure 104 includes a first side wall 1041, a second side wall 1042, a third side wall and a fourth side wall, the first side wall 1041, the second side wall 1042, the third side wall and the fourth side wall are disposed on the outer surface of the clamping body;
the first side enclosing plate 1041, the second side enclosing plate 1042, the third side enclosing plate and the fourth side enclosing plate may be square side enclosing plates, or side enclosing plates with other shapes.
In the embodiment of the invention, the four side wall plates are enclosed to form the side wall plate structure so as to maintain the humid environment around the workpiece, thereby reducing the evaporation speed of the water on the surface of the workpiece and maintaining the concentration of the chemicals for cleaning the surface of the workpiece.
In some embodiments of the invention, optionally, at least one of the first side enclosure, the second side enclosure, the third side enclosure, and the fourth side enclosure comprises at least two second sub-baffles.
In the embodiment of the invention, the side coamings are formed by the plurality of second sub-baffles, so that the installation and the disassembly of the side coamings are convenient.
Referring to fig. 3 and 4, fig. 3 is a surface composition diagram of a silicon wafer transported by using a silicon wafer clamping device in the prior art during cleaning, fig. 4 is a surface composition diagram of a silicon wafer transported by using a silicon wafer clamping device in an embodiment of the present invention during cleaning, and a white portion in the diagram is a chemical reagent for cleaning remaining on the surface of the silicon wafer, as can be seen from comparing fig. 3 and 4, the chemical reagent dosage remaining on the surface of the silicon wafer in fig. 4 is less than the chemical reagent dosage remaining on the surface of the silicon wafer in fig. 3, so in the above embodiment of the present invention, by providing the cover plate structure and the side wall structure on the silicon wafer clamping device, the volatilization degree of moisture on the surface of a workpiece can be effectively reduced, the chemical reagent on the surface of the workpiece is ensured to be within a certain concentration interval, and the cleaning quality of the workpiece is improved.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (9)
1. A silicon wafer holding apparatus, comprising:
the clamping body is used for clamping a workpiece;
the fixing part is positioned at the lower end of the clamping main body and used for fixing the clamped workpiece, and the fixing part and the clamping main body enclose a clamping space for accommodating the workpiece;
the cover plate structure is arranged at the upper end of the clamping main body and is positioned above the clamping space, the cover plate structure comprises a plurality of cover plates, the cover plates are enclosed into the cover plate structure, and at least part of the cover plates are obliquely arranged.
2. The wafer holding apparatus of claim 1, wherein the cover plate structure has an upper surface with a high center and a low edge.
3. The wafer clamping device of claim 1, wherein the cover plate structure comprises:
the first inclined cover plate and the second inclined cover plate are overlapped to form an inverted V-shaped structure;
the side cover plates are arranged on two sides of the inverted V-shaped structure, and the side cover plates, the first inclined cover plate and the second inclined cover plate are enclosed to form the cover plate structure.
4. The wafer holding apparatus according to claim 3, wherein the side cover plate includes a plurality of first sub-dams therein, and a gap is provided between adjacent first sub-dams.
5. The silicon wafer clamping device of claim 1, further comprising a side wall structure disposed on the clamping body below the cover plate structure with a gap therebetween, wherein the side wall structure can surround a portion of the clamping space.
6. The wafer clamping device of claim 5 wherein the gap between the side wall plate structure and the cover plate structure is 5-15 mm.
7. The wafer clamping device of claim 5 wherein the upper edge of the side fence structure is higher than or equal to the upper edge of the clamping space.
8. The wafer clamping device of claim 5 wherein the side enclosure structure comprises a first side enclosure, a second side enclosure, a third side enclosure and a fourth side enclosure disposed on the outer surface of the clamping body.
9. The wafer clamping device of claim 8 wherein at least one of the first side enclosure, the second side enclosure, the third side enclosure, and the fourth side enclosure comprises at least two second sub-enclosures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910649553.2A CN110416150B (en) | 2019-07-18 | 2019-07-18 | Silicon wafer clamping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910649553.2A CN110416150B (en) | 2019-07-18 | 2019-07-18 | Silicon wafer clamping device |
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| Publication Number | Publication Date |
|---|---|
| CN110416150A CN110416150A (en) | 2019-11-05 |
| CN110416150B true CN110416150B (en) | 2021-10-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910649553.2A Active CN110416150B (en) | 2019-07-18 | 2019-07-18 | Silicon wafer clamping device |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0689837A (en) * | 1992-09-08 | 1994-03-29 | Fujitsu Ltd | Substrate treatment device |
| CN103132121A (en) * | 2011-11-30 | 2013-06-05 | 大日本网屏制造株式会社 | Anodizing apparatus, an anodizing system having the same, and a semiconductor wafer |
| CN108246706A (en) * | 2018-01-15 | 2018-07-06 | 湖南英思达电波科技有限公司 | A kind of rotationally isolated cleaning device of gas-liquid integral quartz wafer |
| CN109817509A (en) * | 2017-11-20 | 2019-05-28 | 顶程国际股份有限公司 | Wafer arrangement for detecting and wafer cleaning machine |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3110218B2 (en) * | 1992-09-25 | 2000-11-20 | 三菱電機株式会社 | Semiconductor cleaning apparatus and method, wafer cassette, dedicated glove, and wafer receiving jig |
| JP2009141022A (en) * | 2007-12-04 | 2009-06-25 | Tokyo Electron Ltd | Substrate processing apparatus |
-
2019
- 2019-07-18 CN CN201910649553.2A patent/CN110416150B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0689837A (en) * | 1992-09-08 | 1994-03-29 | Fujitsu Ltd | Substrate treatment device |
| CN103132121A (en) * | 2011-11-30 | 2013-06-05 | 大日本网屏制造株式会社 | Anodizing apparatus, an anodizing system having the same, and a semiconductor wafer |
| CN109817509A (en) * | 2017-11-20 | 2019-05-28 | 顶程国际股份有限公司 | Wafer arrangement for detecting and wafer cleaning machine |
| CN108246706A (en) * | 2018-01-15 | 2018-07-06 | 湖南英思达电波科技有限公司 | A kind of rotationally isolated cleaning device of gas-liquid integral quartz wafer |
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| Publication number | Publication date |
|---|---|
| CN110416150A (en) | 2019-11-05 |
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| PB01 | Publication | ||
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| TA01 | Transfer of patent application right |
Effective date of registration: 20211014 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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| TA01 | Transfer of patent application right | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder |