JPH04241417A - Semiconductor wafer cleaning device - Google Patents

Abstract

PURPOSE:To take lateral flows of vapor into an inlet formed in the top section of a partition plate so as to prevent the vapor from getting into adjacent cleaning baths by dividing each cleaning bath with partition plates and providing a clean air intake on one side of a case and, at the same time, intakes on both sides of the top of each partition plate. CONSTITUTION:An intake 11 formed in the top section of a partition plate is composed of a long and narrow opening between a cover plate 12 covering the top section of the partition plate 4 and a passage plate 13 provided below the plate 12 at an appropriate interval. When a fan 8 is actuated, clean air flows over cleaning baths 2 from a supply opening 7 to an inlet 3 and another clean air also comes down from a ceiling section 6. Therefore, flowing of vapor from each cleaning bath to its adjacent baths is prevented, since the vapor from each cleaning bath 2 is inhaled through the inlets in the partition plates on both sides of each cleaning bath.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer cleaning apparatus in which an appropriate number of cleaning tanks including a so-called chemical tank containing a cleaning chemical and a washing tank for washing with pure water are arranged in a case. .

0002

[Prior Art] Conventionally, as a cleaning device for semiconductor wafers,
For example, those shown in FIGS. 8 and 9 are known. This type of cleaning equipment cleans a suitable number of semiconductor wafers in a carrier, as shown in FIG.
A suitable number, for example, several cleaning tanks 2 are arranged in the case 1, at least one of which is a chemical tank, that is, a tank containing a cleaning chemical such as ammonia, hydrofluoric acid, hydrochloric acid, etc. The rest consists of a washing tank that performs washing with pure water. For example, cleaning tanks 2a and 2c in FIG. 8 are used as chemical liquid tanks.

If the vapor evaporated in the chemical tank enters the adjacent washing tank, it will affect the semiconductor wafers therein, causing haze and stain films on the tops of the wafers. A clean air suction port 3 is provided on one side of the case 2, and clean air is circulated from above each cleaning tank and sucked by the suction port 3, and steam flows into the adjacent tank. It prevents you from doing so. Further, the cleaning tanks are separated by a partition plate 4. 5 is an exhaust duct communicating with each suction port 3.

As shown in FIG. 9, this type of cleaning equipment is often installed inside a clean room, with the ceiling 6
is equipped with an air filter, through which clean air flows downward, so that the suction port 3 and the auxiliary suction port 3a receive the clean air from the ceiling 6 and the chemicals along with it. Vapors etc. are inhaled. Further, 10 is a carrier in which a semiconductor wafer is housed. The semiconductor wafer is placed in a carrier 10 and moved by a robot from one end of the case 1 to the other end in a cleaning tank 2.
are cleaned by being moved sequentially.

[0005]

When the carrier 10 containing semiconductor wafers is moved to the next cleaning tank, the carrier 10 rises above the tank 2 as shown by the imaginary line 10' in FIG. It is inserted into the next cleaning tank. Therefore, at that time, steam is rapidly released along with water spray, and the cream from the ceiling 6 is released.
The downward flow of air alone cannot completely prevent the steam generated at that time from flowing to the side, and therefore the steam from the chemical bath enters the adjacent washing tank and affects the semiconductor wafers therein. There was a problem. To solve this problem, the suction force of the suction port 3 can be strengthened, but if the suction force is too strong, fine metal particles generated by the operation of the robot will be sucked into the cleaning tank, and the particles will be deposited inside the tank. There was a drawback that tickles could enter and adhere to the semiconductor wafers therein. Furthermore, if the suction power is weak, steam will be emitted to the surroundings, polluting the environment, affecting the human body, and deteriorating surrounding equipment. Furthermore, it is conceivable to circulate a large amount of clean air in order to strengthen the flow of clean air, but even if this is done, the above-mentioned problems will occur, and the cost will increase significantly, making it impractical.

The purpose of the present invention is to solve the above-mentioned problems of the prior art.Therefore, it is possible to solve the problem of particles generated by robots and the problem of environmental pollution without causing a significant increase in cost. It is an object of the present invention to provide a semiconductor wafer cleaning device which can prevent the flow of steam between cleaning tanks, and thereby prevent the steam from a chemical tank from flowing into an adjacent washing tank.

[0007]

[Means for Solving the Problems] In the semiconductor wafer cleaning apparatus according to the present invention, each cleaning tank disposed in a case is partitioned by a partition plate, and one side of the case is provided with clean air. It is characterized in that it is provided with a suction port and includes suction ports provided on both sides of the top of each partition plate in addition to the suction port. Preferably, an outlet is installed facing the inlet on the side of the case, and a cleaner is placed above each cleaning tank parallel to the partition plate.
Air is now being distributed.

[0008]

[Function] Therefore, in this cleaning device, there are suction ports on both sides of the top of each partition plate, so when the carrier moves, the steam flowing in the direction of the adjacent tank, that is, to the side, flows to the top of the partition plate. Since it is sucked in at the suction port, it is prevented from entering the adjacent tank. Furthermore, it prevents contamination of the surrounding area and also sucks fine particles generated from the robot.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1 to 3 show an example of a cleaning device according to the present invention, and as shown, this cleaning device also includes an appropriate number of cleaning tanks 2 arranged in a case 1. The at least one cleaning tank is a chemical solution tank containing a cleaning chemical solution. In addition, a clean air suction port 3 is provided on the side surface of the case on one side of each tank. Preferably, a clean air outlet 7 is provided on the opposite side. Each suction port 3 communicates with an exhaust duct 5. The cleaning tanks are separated by a partition plate 4. 6 is the ceiling of the clean room. A fan 8 and an air filter 9 are provided in association with the air outlet 7 .

The main features of this cleaning device, as clearly shown in FIG. 11, and the steam emitted from the cleaning tank can be suitably sucked together with clean air through such a suction port 11. Preferably, each suction port 11 on the partition plate 4 is also configured to communicate with the exhaust duct 5.

The suction port 11 at the top of the partition plate is shown in FIGS. 5 and 6.
As shown in FIG. 2, it is preferable that the structure is composed of a cover plate 12 that covers the top of the partition plate 4 and a passage plate 13 provided below it at an appropriate interval, and from the elongated opening between the cover plate and the passage plate. It is preferable that Therefore, in this case, the suction port 11 is provided along substantially the entire length of the partition plate 4. In addition, as seen in FIG. 2, a cover plate and a passage plate are similarly provided on the side 1a facing the partition plate 4 in the section that receives the cleaning tank 2 at the end, and a suction plate similar to the suction port 11 is provided on that side as well. Preferably, the device is provided with a mouth and configured for suction.

Further, the cover plate 12 is formed in an upwardly convex shape,
That is, it is formed so that the center of its cross section is the highest, and therefore, as shown in FIGS. 6 and 7, it is preferable that the cross section is arcuate or angular. It can immediately flow down into the tank. The cover plate 12 and the passage plate 13 are usually made of the same material as the cleaning tank 2, and are made of PVC, polypropylene, fluororesin, or the like.

It is preferable that the suction ports 11 on both sides of the top of the partition plate 4 are continuous and elongated openings, but depending on the case, they may be intermittently provided openings, and the shape thereof is not particularly limited. isn't it. Covering plate 12 is supported on channel plate 13 by suitable support members. Also, Figure 6
The passage plate 13 may be fixed to the upper part of the partition plate 4, as seen in FIG. Can be installed freely. It goes without saying that the shape of the passage plate 13 can be arbitrarily selected.

[0014] This cleaning device includes a suitable number of washing tanks, and the washing tanks other than the one for final washing are so-called QDR.
It is used as a (quick dump rinse) tank, that is, a rinsing tank in which water is rapidly drained.In such a tank, static electricity is generated due to friction between the carrier and the semiconductor wafers in it, and water, so this is used to neutralize it. As shown in FIG. 4, it is preferable that an ionizer 14 be provided under each suction port 11 at the top of the partition plate on both sides facing the washing tank 2b.

During operation, clean air flows from the air outlet 7 to the suction port 3 through the top of each cleaning tank 2 due to the operation of the fan 8, and the clean air also descends from the ceiling 6, and is further In the cleaning device, the steam in each cleaning tank is also sucked in by the suction ports 11 on the partition plates on both sides, and the steam from each cleaning tank is suitably prevented from flowing into the adjacent cleaning tank.

The carrier 10 containing the semiconductor wafer is a case.
from the cleaning tank 2 at one end of the bath towards the cleaning tank at the other end using a suitable transport device or robot 15 (Fig. 1).
) is lifted above the cleaning tank, moved over the partition plate 4, and then lowered, generating water spray and steam, but the steam and particles generated by the robot that are about to flow into the adjacent cleaning tank are Suction port 11 at the top of each partition plate
, thus preventing the vapor from migrating to the adjacent cleaning tank.

[0017]

[Effects of the Invention] Therefore, according to the present invention, since there are suction ports on both sides of the top of each partition plate, air can be sucked in a direction perpendicular to the partition plate, and therefore air flows into the adjacent cleaning tank. The desired airflow can be suitably sucked. Therefore, without increasing the suction force of the suction port or increasing the flow of clean air, it is possible to properly prevent the vapor from the chemical tank from entering the adjacent washing tank, and the vapor from the chemical tank can prevent semiconductor wafers from being removed. can be prevented from being affected. Furthermore, it is possible to prevent contamination of the surrounding environment, and it is also possible to prevent particles generated by the robot from adhering to the semiconductor wafer.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a semiconductor wafer cleaning apparatus according to an example of the present invention.

FIG. 2 is a plan view of the cleaning device shown in FIG. 1.

FIG. 3 is a cross-sectional view taken along line A-A in FIG. 2;

4 is a cross-sectional view taken along line BB in FIG. 2; FIG.

FIG. 5 is a perspective view of a part of the cleaning device according to the invention.

FIG. 6 is an enlarged view of a portion of FIG. 4;

FIG. 7 is a sectional view similar to FIG. 6 showing another embodiment.

FIG. 8 is a plan view showing a conventional cleaning device of the same type.

FIG. 9 is a longitudinal sectional view of a conventional cleaning device.

[Explanation of symbols]

2　Cleaning tank 3 Suction port 4 Partition plate 11 Suction port at the top of the partition plate 12 Covering plate 13 Passage board 14 Ionizer

Claims (3)

[Claims] Claim 1: An appropriate number of cleaning tanks are arranged in a case, and the cleaning tanks are separated by a partition plate.
In the semiconductor wafer cleaning apparatus, a clean air suction port is provided on one side of the cleaning tank, and carriers containing wafers are sequentially moved through the cleaning tank. A semiconductor wafer cleaning apparatus characterized in that suction ports are provided on both sides of the top of the cleaning tank for sucking the steam emitted from the cleaning tank together with clean air. 2. The suction port at the top of the partition plate is an elongated opening formed between a cover plate covering the top of the partition plate and a passage plate provided below the cover plate. The semiconductor wafer cleaning apparatus described above. [Claim 3] Ionizers are installed under the suction ports facing the cleaning tank at the top of the partition plates on both sides of the cleaning tank that performs water washing among the cleaning tanks and from which water is rapidly drained. A semiconductor wafer cleaning apparatus according to claim 1.