TW201351498A - 半導體晶圓的洗淨方法 - Google Patents

半導體晶圓的洗淨方法 Download PDF

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Publication number
TW201351498A
TW201351498A TW102116254A TW102116254A TW201351498A TW 201351498 A TW201351498 A TW 201351498A TW 102116254 A TW102116254 A TW 102116254A TW 102116254 A TW102116254 A TW 102116254A TW 201351498 A TW201351498 A TW 201351498A
Authority
TW
Taiwan
Prior art keywords
cleaning
hydrogen peroxide
semiconductor wafer
washing
wafer
Prior art date
Application number
TW102116254A
Other languages
English (en)
Chinese (zh)
Inventor
Hitoshi Kabasawa
Tatsuo Abe
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of TW201351498A publication Critical patent/TW201351498A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
TW102116254A 2012-06-01 2013-05-07 半導體晶圓的洗淨方法 TW201351498A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012126528A JP2013251461A (ja) 2012-06-01 2012-06-01 半導体ウェーハの洗浄方法

Publications (1)

Publication Number Publication Date
TW201351498A true TW201351498A (zh) 2013-12-16

Family

ID=49672800

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102116254A TW201351498A (zh) 2012-06-01 2013-05-07 半導體晶圓的洗淨方法

Country Status (3)

Country Link
JP (1) JP2013251461A (fr)
TW (1) TW201351498A (fr)
WO (1) WO2013179569A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI795547B (zh) * 2018-05-29 2023-03-11 日商信越半導體股份有限公司 矽晶圓的洗淨方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105551940A (zh) * 2016-01-11 2016-05-04 上海华虹宏力半导体制造有限公司 去除含有颗粒缺陷的光刻抗反射层的方法
CN109841496A (zh) * 2017-11-27 2019-06-04 东莞新科技术研究开发有限公司 半导体硅片的清洗方法
JP2019161161A (ja) * 2018-03-16 2019-09-19 栗田工業株式会社 基板の洗浄装置及び基板の洗浄方法
JP2023073560A (ja) * 2021-11-16 2023-05-26 信越半導体株式会社 シリコンウェーハの洗浄方法及び自然酸化膜付きシリコンウェーハの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001044429A (ja) * 1999-08-03 2001-02-16 Nec Corp ゲート絶縁膜形成前処理方法及びその前処理装置
JP5233277B2 (ja) * 2007-12-25 2013-07-10 富士通セミコンダクター株式会社 半導体基板の処理方法及び半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI795547B (zh) * 2018-05-29 2023-03-11 日商信越半導體股份有限公司 矽晶圓的洗淨方法

Also Published As

Publication number Publication date
WO2013179569A1 (fr) 2013-12-05
JP2013251461A (ja) 2013-12-12

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