TW201350266A - 研磨墊 - Google Patents

研磨墊 Download PDF

Info

Publication number
TW201350266A
TW201350266A TW102106889A TW102106889A TW201350266A TW 201350266 A TW201350266 A TW 201350266A TW 102106889 A TW102106889 A TW 102106889A TW 102106889 A TW102106889 A TW 102106889A TW 201350266 A TW201350266 A TW 201350266A
Authority
TW
Taiwan
Prior art keywords
polishing
groove
rate
square
pitch
Prior art date
Application number
TW102106889A
Other languages
English (en)
Chinese (zh)
Inventor
Tomoyuki Honda
Seiji Fukuda
Ryoji Okuda
Nana Takeuchi
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Publication of TW201350266A publication Critical patent/TW201350266A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW102106889A 2012-02-27 2013-02-27 研磨墊 TW201350266A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012039557 2012-02-27

Publications (1)

Publication Number Publication Date
TW201350266A true TW201350266A (zh) 2013-12-16

Family

ID=49082623

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102106889A TW201350266A (zh) 2012-02-27 2013-02-27 研磨墊

Country Status (3)

Country Link
JP (1) JPWO2013129426A1 (ja)
TW (1) TW201350266A (ja)
WO (1) WO2013129426A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI812450B (zh) * 2021-12-30 2023-08-11 大陸商西安奕斯偉材料科技股份有限公司 一種用於對矽片進行拋光的拋光墊和拋光設備

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7087365B2 (ja) * 2017-12-05 2022-06-21 日本電気硝子株式会社 研磨パッド

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07256560A (ja) * 1994-03-18 1995-10-09 Fujitsu Ltd 研磨布及びその作製方法及び基板の平坦化方法
JP2000246629A (ja) * 1999-02-26 2000-09-12 Canon Inc 研磨装置および研磨方法
JP2000354952A (ja) * 1999-04-05 2000-12-26 Nikon Corp 研磨部材、研磨方法、研磨装置、半導体デバイス製造方法、及び半導体デバイス
JP2006110665A (ja) * 2004-10-14 2006-04-27 Nihon Micro Coating Co Ltd 研磨パッド
US8562389B2 (en) * 2007-06-08 2013-10-22 Applied Materials, Inc. Thin polishing pad with window and molding process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI812450B (zh) * 2021-12-30 2023-08-11 大陸商西安奕斯偉材料科技股份有限公司 一種用於對矽片進行拋光的拋光墊和拋光設備

Also Published As

Publication number Publication date
JPWO2013129426A1 (ja) 2015-07-30
WO2013129426A1 (ja) 2013-09-06

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