TW201348644A - Light source for lighting, and lighting apparatus - Google Patents

Abstract

This light source for lighting is provided with: a light emitting module (110) having a semiconductor light emitting element (112); a drive circuit (120) for supplying power to the light emitting module (110), said drive circuit having a circuit board (121) and a circuit element (122) connected to the circuit board (121); a lead line (130) connected to the circuit board (121); and a fixing member (123), which fixes the lead line (130) and the circuit element (122) to each other.

Description

Lighting source and lighting device

The present invention relates to a light source for illumination and an illumination device, and more particularly to a light source for illumination including a light-emitting element such as a light-emitting diode (LED) and an illumination device using the light source for illumination.

Light-emitting diodes are used as high-efficiency and space-saving light sources in a variety of products. Among them, a light-emitting diode lamp using a light-emitting diode is being actively developed and researched as a light source for illumination of a conventionally known fluorescent lamp and an incandescent light bulb.

Among them, there is a straight tube type light emitting diode lamp (straight tube type light emitting diode lamp) instead of a straight tube type fluorescent lamp having electrode coils at both ends, or a bulb type light emitting diode lamp (bulb type) Instead of using a bulb-type fluorescent lamp having an arc tube (the tube having electrode coils at both ends) or an incandescent bulb using a filament coil, a device such as a light-emitting diode lamp is used as the light-emitting diode lamp. For example, in Patent Document 1, a straight tube type light emitting diode lamp is disclosed. Further, Patent Document 2 discloses a bulb type light emitting diode lamp.

Among the light-emitting diode lamps, a driving circuit (lighting circuit) for lighting the light-emitting diodes is built in. The drive circuit converts, for example, alternating current received from the base to direct current and supplies it to the light emitting diode. Generally, power supply from the lamp cap to the drive circuit or power supply from the drive circuit to the light-emitting diode is performed through the lead. The leads are connected to a predetermined place on the circuit board constituting the drive circuit. For example, the core wire (metal portion) of the lead wire is welded to the metal wiring of the circuit board.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-043447

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2009-037995

However, in the conventional light-emitting diode lamp, the connection portion (the root portion of the lead wire) between the lead wire and the circuit board is broken, and the problem of wire breakage occurs.

The case of disconnection like this occurs in the step of assembling the light-emitting diode lamp. For example, in the step of assembling the driving circuit into the casing of the lamp, after the driving circuit is inserted into the casing of the lamp, the lead wire is pulled out or pressed back to a desired position, but the wire root is broken due to the load at this time. The situation of the line. In particular, in the case of a light-emitting diode lamp, the space inside the casing of the lamp is limited, and not only in the above steps, but also in the other steps, the wire is often bent and the load is applied to the root of the wire.

In addition, there is also a case where disconnection occurs after the assembly of the light-emitting diode lamp is completed. For example, the vibration and the rushing of the illuminating diode lamp after the completion of the transfer, or the vibration of the illuminating device when the illuminating device is mounted to the illuminating device, causes the root of the lead to be loaded, resulting in a lead wire. Broken line.

Further, in the case where the circuit element and the lead are mounted on the circuit board (the drive circuit fabrication step) and the step of assembling the drive circuit into the casing of the lamp in another place (other factory, etc.), The produced drive circuit is molded and transported to the place where the next step is performed, and when the lead wires are bundled into bundles during the molding, the root portion of the lead wire is subjected to load and disconnection occurs.

As described above, in the conventional light-emitting diode lamp, the lead wire is broken. In particular, although small-sized light-emitting diode lamps have been developed in recent years, such small-sized light-emitting diode lamps have extremely narrow space in the frame of the lamp, which makes assembly work difficult, and wire breakage often occurs. In addition, since such a small-sized light-emitting diode lamp uses a thinner lead wire, even if a small load is applied, the wire breakage occurs.

Specifically, in the case where the driving circuit is inserted into the casing of the lamp (for example, in the circuit casing) and the lead wire is pulled out from the side of the light-emitting diode, the pulling portion is too long, and as described above, the wire is pressed back. Adjust the pull-out length of the leads. At this time, in the case of the small-sized light-emitting diode lamp, the frame (circuit case) of the lamp is small, and the space inside the casing of the lamp is insufficient, which causes a problem that the lead cannot be pressed back. In order to avoid such a problem, it is considered that the lead wire is shortened in advance, but if the lead wire is simply shortened, the wire breakage is likely to occur. That is, when the lead wire is to be pressed back, it is easy to cause the root of the lead wire to be loaded and disconnected.

In order to solve the above problems, an object of the present invention is to provide an illumination light source and an illumination device capable of suppressing lead wire breakage.

In order to solve the above problems, one aspect of the illumination light source of the present invention includes: a light emitting module having a light emitting element; and a driving circuit having a circuit substrate and a circuit component connected to the circuit substrate; Power is supplied to the light emitting module; a lead wire is connected to the circuit substrate; and a fixing member that fixes the lead wire and the circuit component.

Furthermore, in one of the aspects of the illumination light source of the present invention, it is preferable to provide the fixing member such that the lead wire is surrounded by the circuit component. In this case, the fixing member is preferably a heat shrinkable tube.

Further, in one aspect of the illumination light source of the present invention, the fixing member preferably does not contact the connection portion of the lead and the circuit substrate.

Further, in one aspect of the illumination light source of the present invention, the circuit component is provided in plural, and the lead wire is preferably fixed to a circuit component which is mounted at a position closest to the connection portion of the lead wire and the circuit substrate in the plurality of circuit components. on.

Further, in one aspect of the illumination light source of the present invention, the lead wire is preferably fixed to the circuit component having a terminal having the same potential as the lead wire.

Further, in one aspect of the illumination light source of the present invention, one end of the lead wire passes through the circuit board from the first main surface of the circuit board, and is soldered to the second surface facing away from the first main surface. On the main surface, the other end of the lead wire may be formed to be pulled out from the second main surface side. In this case, in one of the aspects of the illumination light source of the present invention, it is preferable to solder all of the circuit elements to the second main surface.

Furthermore, in one aspect of the illumination light source of the present invention, the light emitting module can be positioned above the second main surface of the circuit substrate, and the lead wire electrically connects the light emitting module to the driving circuit. Wire.

Further, in one aspect of the light source for illumination of the present invention, the lead may be an electric wire in which a copper alloy is coated with a resin.

Further, in one aspect of the illumination light source of the present invention, a housing accommodating the drive circuit may be further provided.

In addition, in one aspect of the illumination light source of the present invention, a lamp ball covering the light-emitting module and a lamp cap for receiving power for illuminating the light-emitting module can be further provided, and can be received by the lamp cap. A method in which power is supplied to the drive circuit. In this case, the lamp cap can be an E26 base, and the circuit substrate can be sized in 40mm or less. Or, the lamp cap can be an E17 lamp cap, and the circuit substrate can be sized in 25mm or less.

Further, in one of the aspects of the light source for illumination of the present invention, the electric wire to which the lead wire is fixed The contact surface of the path member and the fixing member is preferably a curved surface.

Further, in one aspect of the illumination light source of the present invention, the circuit component to which the lead is fixed may be a ceramic capacitor.

Further, in one aspect of the illumination light source of the present invention, the lead wire is two wires for electrically connecting the light emitting module to the driving circuit, and the circuit component is an output connected in parallel with the light emitting device. The side smoothing capacitor, the two wires, should be fixed to the smoothing capacitor on the output side.

Further, one aspect of the illumination device of the present invention is characterized in that it includes any one of the aspects of the illumination light source.

The present invention can suppress the breakage of the lead wires. In addition, it is possible to suppress an unsafe operation of the illumination light source.

100, 200, 300, 400‧‧‧ bulb type lamps

110‧‧‧Lighting module

111‧‧‧Installation substrate

112‧‧‧Semiconductor light-emitting elements

113‧‧‧Package

120‧‧‧Drive circuit

120a‧‧‧positive side output terminal

120b‧‧‧Negative side output terminal

121‧‧‧ circuit board

121a‧‧‧1st main face

121b‧‧‧2nd main face

122‧‧‧ Circuit components

122a, 122b‧‧‧Ceramic capacitors

122b1, 122b2‧‧‧ lead terminal line

122c‧‧‧ electrolytic capacitor

122d‧‧‧Current coil

122e‧‧‧ noise filter

122f‧‧‧Integrated circuit components

123‧‧‧Fixed components

130, 130a, 130b, 130c, 130d‧‧‧ lead

140, 340‧‧‧light balls

150, 450‧‧‧ abutments

150a, 160a, 463a‧‧‧through holes

160, 360, 460‧‧‧ circuit housing

161, 361, 461‧‧‧ first housing parts

162, 362, 462‧‧‧ second housing parts

170, 470‧‧‧ frame

170a‧‧‧ Space

180‧‧‧ lamp holder

181‧‧‧Shell Department

182‧‧‧Insulation

183‧‧‧Contact film

190‧‧‧Insulation ring

341‧‧‧ openings

351‧‧‧ pillar

352‧‧‧Support Desk

460a, 470a‧‧‧ blocker

471‧‧‧1st body

472‧‧‧2nd body

500‧‧‧Lighting device

520‧‧‧Lighting appliances

521‧‧‧ Appliance body

521a‧‧‧ slots

522‧‧‧Lighting cover

600‧‧‧ ceiling

Fig. 1 is a cross-sectional view showing a bulb type lamp according to an embodiment 1 of the present invention.

Fig. 2 is a view showing a structure of a drive circuit and a lead wire in a bulb type lamp according to an embodiment 1 of the present invention.

Fig. 3 is a view showing a relationship between a circuit component and a lead wire in a drive circuit of a bulb-type lamp according to an embodiment 1 of the present invention, wherein (a) is a plan view thereof, and (b) is a left side view thereof ( c) for its front view.

Fig. 4 is a view for explaining a method of fixing circuit elements and leads in a drive circuit of a bulb-type lamp according to an embodiment 1 of the present invention.

Fig. 5A is a view showing a configuration of a drive circuit and a lead wire in a bulb type lamp according to a modified embodiment of the embodiment 1 of the present invention.

[Fig. 5B] Fig. 5B is a light bulb type lamp in a modified embodiment of the embodiment 1 of the present invention. Circuit diagram of the drive circuit.

Fig. 6 is a cross-sectional view showing a bulb type lamp according to an embodiment 2 of the present invention.

Fig. 7 is a cross-sectional view showing a bulb type lamp according to an embodiment 3 of the present invention.

Fig. 8 is a cross-sectional view showing a bulb type lamp according to an embodiment 4 of the present invention.

Fig. 9 is a schematic cross-sectional view showing a lighting device according to a fifth embodiment of the present invention.

Hereinafter, the illumination light source and the illumination device according to the embodiment of the present invention will be described with reference to the drawings. Further, the embodiments described below represent preferred embodiments of the present invention. Therefore, the numerical values, shapes, materials, structural elements, arrangement positions of the structural elements, and connection forms, which are shown in the following embodiments, are examples and do not limit the gist of the present invention. Therefore, among the structural elements in the following embodiments, structural elements that are not included in the independent request items indicating the most superior concept of the present invention are not essential elements for achieving the subject of the present invention, but The components constituting the preferred aspects will be described. Moreover, each drawing is a schematic diagram and does not represent a rigorous drawing.

In each of the following embodiments, a bulb-type light-emitting diode lamp will be described as an example of a light source for illumination.

(Implementation 1)

First, the bulb-type lamp 100 according to the first embodiment of the present invention will be described with reference to Fig. 1 . BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a bulb type lamp according to an embodiment 1 of the present invention. Further, in Fig. 1, the drive circuit 120 is not a cross-sectional view but a side view. In addition, in Fig. 1, a dotted line drawn along the upper and lower sides of the paper indicates the lamp axis J (center axis) of the bulb-type light-emitting diode lamp. In the present embodiment, the lamp axis J coincides with the axis of the lamp ball. Further, the lamp shaft J is a shaft that serves as a center of rotation when the bulb-type lamp 100 is attached to a slot of an illumination device (not shown), which coincides with the rotation axis of the base 180.

As shown in FIG. 1, the light bulb type lamp 100 of the embodiment is a bulb type fluorescent lamp or A bulb-type light-emitting diode lamp for replacing an incandescent light bulb, comprising: a light-emitting module 110 as a light source; a driving circuit 120 for supplying a predetermined power to the light-emitting module 110; and a lead wire 130 and a driving circuit 120 The circuit board 121 is connected.

The light bulb type lamp 100 of the embodiment further includes a light ball 140 covering the light emitting module 110, a base 150 carrying the light emitting module 110, a circuit case 160 accommodating the driving circuit 120, and a frame 170. It covers the circuit case 160; and a base 180 that receives power from the outside. Further, in the bulb-type lamp 100 of the present embodiment, the bulb 140, the housing 170, and the base 180 constitute a peripheral.

Hereinafter, each structural element of the bulb-type lamp 100 will be described in detail with reference to FIG. 1 .

[Lighting Module]

The light-emitting module 110 is a light-emitting diode module having a light-emitting element disposed inside the light bulb 140. The light emitting module 110 includes a mounting substrate 111, a semiconductor light emitting element 112 mounted on the mounting substrate 111, and a package 113 formed on the mounting substrate 111.

The mounting substrate 111 is a base for mounting the semiconductor light emitting element 112. The mounting substrate 111 is mounted on the base 150. For example, a ceramic substrate formed of a material having a substantially square shape in a plan view and a material such as alumina can be used as the mounting substrate 111.

A plurality of semiconductor light emitting elements 112 are mounted on one surface of the mounting substrate 111. The semiconductor light emitting element 112 is, for example, a light emitting diode (light emitting diode wafer). Further, the number of the semiconductor light emitting elements 112 is not limited to a plurality, and may be one. In addition, a pair of electrodes (not shown) are disposed on the light-emitting module 110, and are electrically connected to a pair of leads 130a and 130b derived from the power output portion of the driving circuit 120. The semiconductor light-emitting element 112 is connected to the pair. The electrode supplies DC power to emit light.

The package body 113 is a package member that encapsulates the semiconductor light emitting element 112. In the present embodiment, all of the semiconductor light emitting elements 112 are uniformly packaged. Although the package body 113 is mainly formed of a light transmissive material However, in the case where it is necessary to convert the wavelength of light emitted from the semiconductor light-emitting element 112 to a predetermined wavelength, a wavelength converting material for converting the wavelength of light can be mixed into the light-transmitting material. For example, a resin such as a silicone resin can be used as the light transmissive material. Further, for example, phosphor particles can be used as the wavelength converting material. Thereby, the package 113 can be formed of a resin containing a phosphor.

In the present embodiment, a blue light-emitting diode emitting blue light is used as the semiconductor light-emitting element 112, and phosphor particles (for example, YAG-based phosphor particles) that convert wavelengths from blue light to yellow light are used. The light-transmitting resin material mixed with the phosphor particles is used as the package 113. Thereby, a part of the blue light emitted from the semiconductor light emitting element 112 is converted into yellow light by the package 113, and white light is emitted from the light emitting module 110 (the white light is a yellow light whose wavelength is converted and the wavelength is not changed. Produced by blue light mixing).

[Drive circuit]

The driving circuit (circuit unit) 120 is a lighting circuit that lights (lights) the semiconductor light emitting element 112 of the light emitting module 110, and supplies the predetermined power to the light emitting module 110. For example, the drive circuit 120 converts the AC power supplied from the base 180 through the pair of leads 130c and 130d into DC power, and supplies the DC power to the light-emitting module 110 through the pair of leads 130a and 130b. The drive circuit 120 is composed of a circuit board 121 and a plurality of circuit elements (electronic components) 122 connected to the circuit board 121.

The circuit board 121 is a printed circuit board on which metal wiring is formed in a pattern, and the plurality of circuit elements 122 and the leads 130a to 130b are electrically connected while the plurality of circuit elements 122 mounted on the circuit board 121 are electrically connected to each other. connection. In the present embodiment, the circuit board 121, the first main surface 121a, and the second main surface 121b are arranged in parallel with the lamp axis J.

The circuit element 122 is, for example, various capacitors, a resistance element, a rectifier circuit element, a coil element, a choke coil (flow resistance transformer), a filter, a diode, or an integrated circuit element. Each of the circuit elements 122 is mounted on the first main surface 121a of the circuit board 121 or the second main surface 121b facing away from the first main surface 121a. In the present embodiment, the ceramic capacitor and the electrolytic capacitor are provided. The circuit element 122 having a relatively long dimension is mounted on the first main surface 121a, and the resistance element The shorter and smaller circuit elements 122 are mounted on the second main surface 121b.

Further, in the present embodiment, all of the circuit elements 122 mounted on the circuit board 121 and all of the leads 130 are soldered only to the second main surface 121b of the circuit board 121. That is, the soldering in the driving circuit 120 is performed only on one side of the circuit substrate 121. Therefore, all of the leads 130 and all of the circuit elements 122 can be soldered by the soldering step of one pass. Therefore, the circuit element 122 mounted on the first main surface 121a passes through the through hole provided in the circuit board 121 from the first main surface 121a side through the lead terminal line of the circuit element 122, and is soldered. The method of being fixed to the second main surface 121b is connected to the metal wiring of the circuit board 121.

The driving circuit 120 is electrically connected to the light emitting module 110 by a pair of leads 130a and 130b. In addition, the driving circuit 120 is electrically connected to the base 180 by a pair of leads 130c and 130d. Further, the drive circuit 120 is housed in the circuit case 160 and fixed to the circuit case 160 by, for example, screwing, adhesion, or engagement. Specifically, the circuit substrate 121 is fixed in the circuit case 160.

[lead]

The lead 130 is formed of four leads 130a to 130d. Any of the leads 130a to 130d in this embodiment is a copper alloy lead, which is a core wire formed of a copper alloy (for example, 0.5 mm). And an insulating resin coating film covering the core wire. Further, both end portions of the lead wires 130a to 130d are formed such that the core film exposes the resin coating film.

The leads 130a and 130b are used to supply (transmit) the direct current power that illuminates the light-emitting module 110 from the drive circuit 120 to the wires of the light-emitting module 110. The respective end portions (core wires) of the lead wires 130a and 130b are electrically connected to the power output portion (metal wiring) of the circuit board 121 by soldering or the like, and the other end portion (core wire) is used by The solder is electrically connected to a power input portion (electrode terminal) of the light emitting module 110.

In the present embodiment, the lead (first lead) 130a is a lead (positive side output terminal line) for supplying a positive voltage from the drive circuit 120 to the light-emitting module 110, and a lead (second lead) 130b is used. A wire (negative side output terminal line) for supplying a negative voltage to the light emitting module 110 from the driving circuit 120. Further, the lead wires 130a and 130b are inserted and pulled out to the light-emitting module side (inside the light bulb 140) through the through hole 150a provided in the base 150. The leads 130a and 130b are fixed to the circuit component 122 by a fixing member 123 as will be described later.

Further, one end (core wire) of the leads 130a and 130b is passed through the through hole provided in the circuit board 121 from the first main surface 121a side of the circuit board 121, and then fixed to the second main surface 121b by soldering. Above, the leads 130a and 130b are connected to the metal wiring of the circuit board 121. Further, the other end of the lead 130b is pulled out to the second main surface 121b side through the notch portion provided on the side surface of the circuit board 121.

On the other hand, the leads 130c and 130d are used to supply (transfer) electric power (for example, commercial AC of 100 V) for lighting the light-emitting module 110 from the base 180 to the electric wire of the drive circuit 120. The respective end portions (core wires) of the lead wires 130c and 130d are electrically connected to the base 180 (the housing portion 181 or the contact piece 183), and at the same time, the other other end portion (core wire) is soldered or the like. The method is electrically connected to a power input portion (metal wiring) of the circuit board 121.

In the present embodiment, the lead (third lead) 130c is electrically connected to the case portion 181 of the base 180 through the through hole 160a provided in the circuit case 160. Further, the lead wire (fourth lead wire) 130d is electrically connected to the contact piece 183 of the cap 180 through the opening on the base side of the circuit case 160.

In the same manner as the lead wires 130a and 130b, one end (core wire) of the lead wires 130c and 130d is passed through the through hole provided in the circuit board 121 from the first main surface 121a side of the circuit board 121, and is fixed by soldering. The lead wires 130c and 130d are connected to the metal wiring of the circuit board 121 on the second main surface 121b.

[light ball]

The light ball 140 is a hemispherical light-transmitting cover for guiding light emitted from the light-emitting module 110 to the outside of the lamp. In the present embodiment, the opening side (the lamp head side) is formed to be inwardly contracted. Illuminate The module 110 is covered by the light bulb 140. Thereby, the light of the light-emitting module 110 incident on the inner surface of the bulb 140 is led out of the bulb 140 through the bulb 140.

In the present embodiment, the bulb 140 is disposed such that the end portion on the opening side thereof is sandwiched by the base 150 and the frame 170. When the opening side end portion of the bulb 140 is pressed into the first opening of the casing 170, the bulb 140 is attached to the first opening of the casing 170 while covering the lighting module 110.

In addition, the lamp ball 140 should be subjected to a diffusion process to diffuse the light emitted from the light-emitting module 110. For example, by forming a light diffusion film (light diffusion layer) on the inner surface or the outer surface of the bulb 140, the bulb 120 can have a function of diffusing light. In this way, by causing the lamp ball 140 to have a function of diffusing light, the light incident on the lamp ball 140 from the light-emitting module 110 can be diffused, and the light distribution angle of the lamp can be made wider.

Further, in the present embodiment, the shape of the bulb 140 is hemispherical, but it is not limited thereto. It is also possible to rotate the ellipsoid or the partial sphere as the shape of the light bulb 140. Further, a glass material or a resin material such as polycarbonate may be used as the material of the light bulb 140.

[base]

The base 150 is a light source mounting member for mounting the light-emitting module 110, and is a substantially disk-shaped substrate having a plane perpendicular to the lamp axis J, for example. On one side of the base 150, a recess for planarly arranging the light-emitting module 110 is formed. The light-emitting module 110 disposed in the recess can be fixed to the base 150 by, for example, a fixture, a screw, and a bonding.

The base 150 is mounted on the first opening (the first opening is an opening on the bulb side of the tubular casing 170), and the side wall portion of the base 150 abuts against the first opening of the casing 170. The inner surface above. That is, the base 150 is fixed to one side of the first opening of the casing 170 in an embedded state.

In the base 150, two through holes 150a are provided so as to connect the main surface on the bulb side and the main surface on the frame side, and the pair of leads 130a and 130b of the drive circuit 120 pass through the through holes. The hole 150a is led out to the light emitting module side of the base 150.

Further, the base 150 in the present embodiment is formed of, for example, a metal material. For example, it is conceivable to use Al, Ag, Au, Ni, Rh, Pd, or an alloy formed of two or more of these materials, or a material such as an alloy of Cu and Ag as a metal material. For example, the base 150 may be a substantially circular plate-shaped metal substrate that is die-cast by aluminum.

[circuit housing]

The circuit case 160 is an insulating resin case (circuit holder) for housing the drive circuit 120, and is housed in the housing 170 and the base 180. The circuit case 160 is, for example, a substantially cylindrical case that is open on both sides, and is a first case portion (large diameter portion) 161 having a large diameter and a cylindrical shape that is substantially the same shape as the frame body 170, and the first case. The casing portion 161 is configured to be connected to a small-diameter cylindrical second casing portion (small diameter portion) 162 having a shape substantially the same as that of the base 180.

The first case portion 161 located on the side of the bulb is housed in the housing 170. On the other hand, the second case portion 162 on the base side is housed in the base 180, and the base 180 is externally fitted to the second case portion 162. Thereby, the opening on the base side of the circuit case 160 is covered. In the present embodiment, the outer circumferential surface of the second casing portion 162 is formed with a screwing portion for screwing with the base 180, and the base portion 180 is screwed into the second casing portion 162 to fix it to the circuit. On the housing 160. The circuit case 160 can be integrally molded using an insulating resin material such as polybutylene terephthalate (PBT).

[framework]

The casing 170 is exposed to the outer outer casing, and is disposed between the bulb 140 and the base 180. The frame 170 has both ends opened in the direction of the lamp axis J, and is constituted by a slightly cylindrical substantially truncated cone member whose diameter is reduced from the bulb side toward the base side.

In the opening (first opening) on the bulb side of the casing 170, the base 150 and the opening-side end of the bulb 140 are housed, and the frame 170 is fixed to the base 150 by, for example, caulking. Further, an adhesive may be poured into the space 170a surrounded by the frame 170, the base 150, and the bulb 140 to adhere and fix the frame 170 to the base 150.

In the present embodiment, the casing 170 is a metal casing made of metal. Thereby, the casing 170 has a function as a heat sink, and the heat generated by the light-emitting module 110 and the driving circuit 120 can be efficiently discharged to the outside of the bulb-type lamp 100 through the casing 170. It is conceivable to use, for example, Al, Ag, Au, Ni, Rh, Pd or an alloy formed of two or more of these materials, or an alloy of Cu and Ag as a metal material constituting the frame 170. . Since such a metal material has good thermal conductivity, heat transferred to the casing 170 can be efficiently transmitted to the base side. Therefore, the heat generated from the light-emitting module 110 and the driving circuit 120 can be discharged to the lighting fixture side through the base 180. In the present embodiment, the frame 170 is made of an aluminum alloy material. Further, in order to increase the heat emissivity of the frame 170, an aluminum anode treatment may be performed on the surface of the frame 170. Further, the material of the frame 170 is not limited to metal, and may be a resin. For example, the casing 170 may be formed of a material such as a resin having a high thermal conductivity.

[light head]

The base 180 is a power receiving unit that receives an alternating current that causes the light emitting module 110 to emit light from the outside by two contacts, and is mounted in, for example, a slot of the lighting fixture. In this case, when the bulb-type lamp 100 is turned on, the cap 180 receives electric power from the slot of the lighting fixture. Further, the electric power received by the base 180 is input to the electric power input unit of the drive circuit 120 through the leads 130c and 130d.

The base 180 has a substantially cylindrical shape, and its outer circumferential surface includes a case portion 181 that forms a male screw portion and a contact piece 183 that is attached to the case portion 181 through the insulating portion 182. Further, an insulating ring 190 for ensuring insulation between the casing 170 and the base 180 is provided between the casing portion 181 and the casing 170. The inner circumferential surface of the base 180 forms a screwing portion for screwing with the circuit case 160. Further, the base 180 is in the shape of a cylinder having a bottom made of metal.

Although the type of the base 180 is not particularly limited, for example, a screw-in type Edison type (E-type) base can be used, and a model such as an E26 base, an E17 base, or an E16 base can be exemplified.

Next, the relationship between the drive circuit 120 and the lead 130 in the bulb-type lamp 100 of the first embodiment of the present invention will be described in detail with reference to FIGS. 2 and 3. Figure 2 shows the implementation A diagram of the construction of a driver circuit and a lead in a bulb-type luminaire. Fig. 3 is a view showing the relationship between circuit elements and leads in the drive circuit of the bulb-type lamp of the embodiment, (a) is a plan view thereof, (b) is a left side view thereof, and (c) is a front view thereof. Further, although only the lead 130a and the ceramic capacitor 122a are shown in FIG. 3, the lead 130b and the ceramic capacitor 122b are also the same.

As shown in FIG. 2, in the drive circuit 120 of the present embodiment, a ceramic capacitor 122a as an output side smoothing capacitor and a ceramic capacitor 122b as a filter capacitor are mounted on the first main surface 121a of the circuit board 121. The electrolytic capacitor 122c, the choke coil 122d, the noise filter 122e, and the integrated circuit element 122f. Further, although not shown in the drawing, elements such as a resistor element and a rectifier circuit element are mounted on the second main surface 121b of the circuit board 121. Further, in the present embodiment, an element having a rectangular shape in plan view is used as the circuit board 121, but an element having a circular or elliptical shape in plan view may be used.

The end of each of the four lead wires 130a to 130d is electrically connected to the first main surface 121a of the circuit board 121. The leads 130a and 130b are respectively disposed in the plurality of circuit elements 122 so as to be mounted around the circuit elements 122 closest to the leads 130a and 130b. In the present embodiment, the lead 130a and the ceramic capacitor 122a are disposed adjacent to each other. Further, the lead 130b and the ceramic capacitor 122b are disposed adjacent to each other.

Next, the leads 130a and 130b are respectively fixed to the circuit elements 122 mounted closest to the respective positions. That is, the leads 130a and 130b are respectively fixed to the circuit elements 122 mounted at positions closest to the respective connection portions (the roots of the leads) of the leads 130a and 130b and the circuit substrate 121. In the present embodiment, since the lead (positive side output terminal line) 130a is disposed adjacent to the ceramic capacitor (output side smoothing capacitor) 122a, it is fixed on the ceramic capacitor 122a. In addition, since the lead (negative side output terminal line) 130b is disposed adjacent to the ceramic capacitor (filter capacitor) 122b, it is fixed to the ceramic capacitor 122b.

As shown in FIGS. 2 and 3, the lead 130a and the ceramic capacitor 122a are fixed by the fixing member 123. Similarly, the lead 130b and the ceramic capacitor 122b are fixed by the fixing member 123. fixed The member 123 is disposed in such a manner as to contact the lead 130a (or the lead 130b) and the ceramic capacitor 122a (or the ceramic capacitor 122b) and surround the elements.

The fixing member 123 is an insulating band-shaped resin member. In the present embodiment, a heat shrinkable tube which is diametrically contracted (the diameter becomes small) if it is heated is used as the fixing member 123. For example, the material may be crosslinked polyethylene, the shrinkage temperature is 90 ° C, the use temperature range is -40 ° C to 125 ° C, the radial shrinkage is 50% or more, the axial shrinkage is 5% or less, and the tensile strength is 10.4 MPa. As described above, a material having an elongation at break of 200% or more is regarded as such a heat shrinkable tube.

By using the heat shrinkable tube as the fixing member 123, as shown in Fig. 3, the components can be firmly fixed by binding the lead wires 130a and the ceramic capacitor 122a without using an adhesive.

By fixing the lead 130a to the ceramic capacitor 122a by using the fixing member 123, the connection portion of the core wire of the lead 130a and the circuit board 121 in the first main surface 121a of the circuit board 121 (the root of the lead 130a) can be prevented from being generated. shake. Thereby, even in the case where stress is applied to the lead 130a (for example, a case where the lead 130a is bent), the stress concentrated portion (curved portion) of the lead 130a is not the root of the lead 130a but the lead 130a and the fixing member 123 (or It is an upper side portion (portion on the opposite side to the circuit substrate 121) in the contact portion of the ceramic capacitor 122a). That is, by the fixing member 123, the movable portion of the lead 130a when stress is applied to the lead 130a can be changed from the root portion (core wire) of the lead 130a to the fixing member 123 (or the ceramic capacitor 122a) in the lead 130a. The part to be contacted (resin coated film). Therefore, for example, even in the case where the lead 130a is pulled out during the assembly step of the lamp, since the load is not applied to the root of the lead 130a, the lead 130a does not have a root portion cut off. Further, in this case, although a load is applied to the portion of the lead 130a that is in contact with the fixing member 123, since the contact portion covers the core portion of the lead 130a by the resin coating film, no disconnection occurs. situation.

Further, in the present embodiment, the lead 130a as the positive electrode side output terminal line in the drive circuit 120 has the same potential as the positive electrode of the ceramic capacitor 122a which is the output side smoothing capacitor. Therefore, as shown in FIG. 3, the lead wire 130a is preferably disposed adjacent to the lead terminal line on the positive electrode side of the ceramic capacitor 122a, and is fixed to the ceramic capacitor 122a.

That is, for example, the lead 130 may be fixed on the circuit element 122 of the lead terminal line having a potential different from the lead 130, but in this case, the different potential lead terminal line and lead 130 It becomes close, so there is a possibility that a short circuit occurs during the welding step.

In this regard, as in the present embodiment, by fixing the lead 130 to the circuit element 122 having the same potential terminal line as the lead 130, even if the lead 130 is close to the circuit element 122, no short circuit is produced. The phenomenon. Thereby, a highly reliable bulb type lamp can be realized.

Further, in the present embodiment, as shown in FIG. 3(a), the ceramic capacitor 122a has no corner portion in the outer peripheral shape of the cross section, and the side surface of the ceramic capacitor 122a has a curved surface. As such, the circuit component 122 of the fixed lead 130 preferably has a cross-sectional shape in the shape of a cross section, and the surface in contact with the fixing member 123 is preferably a curved surface.

That is, for example, the lead wire and the circuit component are fixed by a heat shrinkable tube (the shape of the cross section is rectangular and the outer circumference is a corner), and the gap (space region) generated between the heat shrinkable tube and the circuit component becomes large, and heat shrinkage occurs. The contact area between the tube and the circuit component is reduced, and not only the strength of the bundle generated by the heat shrinkable tube is reduced, but also the crack or heat shrinkage on the heat shrinkable tube is started from the corner (edge) of the circuit component. The possibility of tube breakage.

On the other hand, in the ceramic capacitor 122a of the present embodiment, by making the surface of the circuit element 122 in contact with the fixing member (heat shrinkable tube) 123 a curved surface, the above-mentioned slit can be reduced, and the fixing member (heat shrinkable tube) 123 can be added. The contact area with the circuit component 122 enhances the force of the bundle produced by the heat shrinkable tube. Further, by eliminating the corners (corners) of the outer peripheral portion of the circuit element 122, it is possible to suppress cracking of the fixing member (heat shrinkable tube) 123 or breakage of the fixing member (heat shrinkable tube) 123.

Further, as shown in FIGS. 3(b) and 3(c), the fixing member 123 preferably does not cover the connection portion of the lead 130a and the circuit board 121, and does not come into contact with the connection portion. That is, the fixing member 123 is preferably a core wire (metal) which is not connected to the circuit board 121 in the lead 130a (the root of the lead 130a). The part is formed by contact, but the core of the root of the lead 130a is exposed.

For example, when the core wire of the root portion of the lead wire 130a is brought into contact with the fixing member 123, heat from the core wire is transmitted to the fixing member 123, and the fixing member 123 is deteriorated. In this case, with the deterioration of the fixing member 123, the strength of the bundle of the fixing member 123 is lowered, and the lead 130b is separated from the ceramic capacitor 122b, and the root portion (core wire) of the lead 130a is brought into a movable state. Therefore, when a load is applied to the lead 130a, the root of the lead 130b has a possibility of being cut off.

On the other hand, by making the fixing member 123 and the root portion of the lead 130a non-contact, it is possible to suppress deterioration of the fixing member 123 due to heat. In particular, in the case where the fixing member 123 is formed of an adhesive resin such as a silicone resin, the possibility of peeling of the adhesive resin is increased due to the influence of the heat of the core of the lead 130a, so that the fixing member (adhesive resin) 123 is not required. It is in contact with the root of the lead 130a.

Further, in the present embodiment, the connection portion between the lead 130a and the circuit board 121 is not covered by the fixing member 123, and the core of the root portion of the lead 130a is exposed, but the invention is not limited thereto. For example, the lower end of the fixing member 123 may be in contact with the surface of the circuit board 121, and the connection portion between the lead 130a and the circuit board 121 may be covered by the fixing member 123 (heat shrinkable tube).

Next, a specific method of fixing the lead (positive side output terminal line) 130a and the ceramic capacitor (output side smoothing capacitor) 122a will be described with reference to FIG. 4. Fig. 4 is a view for explaining a method of fixing a circuit component and a lead wire in a drive circuit of a bulb type lamp of the present embodiment, the left side is a front view thereof, and the right side is a plan view thereof. Further, in FIG. 4, a method of fixing the lead 130a and the ceramic capacitor 122a will be described. However, the other lead 130 such as the lead 130b is fixed in the same manner as the other circuit element 122 such as the ceramic capacitor 122b.

First, as shown in FIG. 4(a), first, a circuit element 122 such as a ceramic capacitor 122a is mounted on the circuit board 121 and soldered, and a lead 130 such as a lead 130a is soldered.

Next, as shown in FIG. 4(b), the fixing member 123 as a heat shrinkable tube is inserted so as to surround the ceramic capacitor 122a and the lead 130a, and the ceramic capacitor 122a and the lead 130a are temporarily fixed by the fixing member 123.

Next, the fixing member 123 (heat shrinkable tube) is shrunk by heating. At this time, as shown in FIG. 4(c), the lead 130a is brought close to the ceramic capacitor 122a by the contraction of the fixing member 123, and the resin coating film portion of the lead 130a is in contact with the side surface of the ceramic capacitor 122a. Thereby, the lead wire 130a can be fixed to the ceramic capacitor 122a. Further, for example, an electric furnace can be used as the heating means.

In the light bulb type lamp 100 of the first embodiment of the present invention, the lead wire 130 is fixed to the circuit component 122 of the circuit substrate 121, so that the connection portion with the circuit substrate 121 in the lead wire 130 can be avoided. The root part is composed of a rocking method. Thereby, even if the lead wire 130 is bent and stress is applied to the lead wire 130, excessive load is applied to the root portion of the lead wire 130. As a result, since the disconnection of the lead wire 130 can be avoided, the wire breakage of the lead wire 130 can be reduced. Therefore, it is possible to suppress an unsafe action occurring in the bulb type lamp 100. As such, in the present embodiment, by fixing the lead 130 to the circuit component 122, the durability of the lead 130 can be improved while improving the bending characteristics of the lead 130.

Further, as in the present embodiment, it is preferable to use a heat shrinkable tube as a fixing member for fixing the lead 130 and the circuit member 122.

For example, although an adhesive tape is also considered as a method of fixing the lead 130 and the circuit component 122, in this case, the temperature of the drive circuit 120 becomes high due to heat generated from the light-emitting module 110 and heat generated from the circuit component 122. Therefore, the adhesive force of the adhesive tape is lowered by heat, causing the lead wire 130 to be detached from the circuit component 122. In this case, the root portion (core wire) of the lead wire 130 is in a movable state, and the load on the root portion may cause the lead wire 130b to be broken.

In this regard, by fixing the lead 130 and the circuit component 122 with a heat shrinkable tube, it is not necessary to use a tool such as an adhesive tape or an adhesive, and the lead 130 can be firmly fixed by the elastic bundling of the heat shrinkable tube. And circuit element 122. Further, since the heat shrinkable tube is an elastic member and its degree of freedom in shape is large, a desired shape change can be performed along the outer peripheral shape of the circuit member 122. Thereby, since the contact area of the circuit component 122 and the heat shrinkable tube can be sufficiently ensured, the lead 130 and the circuit component 122 can be firmly fixed.

Further, in the present embodiment, among the four leads 130a to 130d, the two leads 130a and 130b connected to the light-emitting module 110 and the drive circuit 120 are connected to the circuit element 122 (the ceramic capacitors 122a and 122b). , but not limited to this. For example, the leads 130c and 130d may be fixed to the circuit elements 122 such as the ceramic capacitors 122a and 122b. Alternatively, instead of the two leads 130, one lead 130 may be fixed to the circuit component 122, or all three or four leads 130 may be fixed to the circuit component 122.

Further, in the present embodiment, the lead wires 130a and 130b are fixed to the ceramic capacitors 122a and 122b, but the circuit element 122 to be fixed to the leads 130a and 130b is not limited thereto. For example, the leads 130a and 130b may be fixed to the electrolytic capacitor 122c, the choke coil 122d, the noise filter 122e, or the circuit component 122 such as the integrated circuit component 122f. However, as the circuit element 122 that forms the fixed object of the lead 130, a circuit element having a long size such as the ceramic capacitors 122a and 122b is preferable. The lead 130 and the circuit component 122 can be easily secured using a heat shrinkable tube by being attached to the longer length circuit component 122.

(Variation of Embodiment 1)

Next, a bulb-type lamp according to a modified embodiment of the embodiment 1 of the present invention will be described with reference to FIGS. 5A and 5B. Fig. 5A is a view showing the configuration of a drive circuit and leads in a bulb-type lamp of the present modified embodiment. Fig. 5B is a circuit diagram of a drive circuit in the bulb type lamp of the modified embodiment.

The overall configuration of the bulb-type lamp and the basic configuration of the drive circuit in the present modified embodiment are the same as those of the bulb-type lamp and the drive circuit in the embodiment 1 shown in FIGS. 1 and 2. Therefore, in the present modified embodiment, a description will be given focusing on a point different from the embodiment 1.

In the first embodiment described above, one lead 130 is fixed to one circuit element 122. In contrast, in the present variation, a plurality of leads 130 are fixed to one circuit element 122. Specifically, as shown in FIG. 5A, in the present variation, both the lead 130a and the lead 130b are disposed adjacent to the ceramic capacitor 122a, and both of the leads 130a and 130b are fixed to the ceramic by the fixing member 123. Above capacitor 122a.

Therefore, a plurality of leads 130 can be fixed to one circuit element 122. Thereby, in the case where the lead 130 and the circuit element 122 are fixed by the fixing member 123, since the plurality of leads 130 can be folded and fixed to the circuit element 122, the work of fixing the lead 130 and the circuit element 122 can be simplified. In particular, in the case where the heat shrinkable tube is used as the fixing member 123, since the plurality of leads 130 and one circuit element 122 can be gathered and enclosed, the elements can be easily fixed.

Further, as in the modified embodiment, the two leads 130a and 130b are preferably fixed to the ceramic capacitor 122a which is the output side smoothing capacitor. The ceramic capacitor (output side smoothing capacitor) 122a is a capacitor for suppressing the blinking of the semiconductor light emitting element 112. As shown in FIG. 5B, the ceramic capacitor is connected in parallel with the semiconductor light emitting element (light emitting diode) 112 of the light emitting module 110. Therefore, the terminal (positive electrode) 122a1 on one side of the ceramic capacitor 122a has the same potential as the lead 130a connected to the positive electrode side output terminal 120a, and the other terminal (negative electrode) 122a2 of the ceramic capacitor 122a is on the other hand. The lead wires 130b connected to the negative electrode side output terminal 120b have the same potential.

Therefore, as shown in FIG. 5A, it is preferable to arrange the lead terminal line 122a1 on one side of the ceramic capacitor 122a and the lead 130a in an adjacent manner, and to arrange the lead terminal line on the other side of the ceramic capacitor 122a in an adjacent manner. 122a2 and lead 130b. Thereby, even if the two lead wires 130a and 130b are fixed to one circuit element 122, the lead terminal lines of the circuit elements 122 which are closest to the two lead wires 130a and 130b, respectively, have the same potential as the respective lead wires 130a and 130b. Therefore, it is possible to reduce the occurrence of a short circuit during the soldering step.

Further, the present modified embodiment can also be applied to the following embodiments.

(Implementation 2)

Next, a bulb-type lamp 200 according to an embodiment 2 of the present invention will be described with reference to FIG. Figure 6 is a cross-sectional view showing a bulb type lamp of an embodiment 2 of the present invention. In addition, in FIG. 6, the same structural elements as those of the structural elements shown in FIG. 1 are denoted by the same reference numerals, and the detailed description is omitted or simplified. In addition, in FIG. 6, the drive circuit 120 is not a sectional view but a side view.

The light bulb type lamp 200 of the present embodiment shown in FIG. 6 is different from the bulb type lamp 100 of the embodiment 1 shown in FIG. 1 in the configuration of the drive circuit 120 (circuit substrate 121). In other words, in the circuit board 121 of the first embodiment, the first main surface 121a and the second main surface 121b are arranged in parallel with the lamp axis J. In contrast, the circuit board in the second embodiment is used. 121 is a state in which the first main surface 121a and the second main surface 121b are perpendicular to the lamp axis J.

Specifically, as shown in FIG. 6 , the circuit board 121 faces the base side with the first main surface 121 a on which the circuit element 122 is mounted, and the second main surface 121 b opposite to the first main surface 121 a faces the light-emitting module. Side mode configuration. That is, in the present embodiment, the light-emitting module 110 is positioned above the second main surface 121b of the circuit board 121.

Further, in the present embodiment, as in the first embodiment, in order to solder all the leads 130 and all the circuit elements 122 in the single-step soldering step, only the second main surface 121b of the circuit board 121 is entirely The circuit component 122 is soldered to all of the leads 130.

Further, in the present embodiment, as in the modified embodiment of the first embodiment, both of the leads 130a and 130b are fixed to the ceramic capacitor (output side smoothing capacitor) 122a by the fixing member 123. In addition, a heat shrinkable tube is used as the fixing member 123.

In the present embodiment, as in the first embodiment, one end (core) of the leads 130a to 130d is passed through the through hole provided in the circuit board 121 from the first main surface 121a side of the circuit board 121, and Soldering on the second main surface 121b connects the leads 130a to 130d to the metal wiring of the circuit board 121. On the other hand, in the present embodiment, because of the matching of the circuit substrate 121 The two rows 130a and 130b connected to the light-emitting module 110 are not only the lead wires 130b but the other ends of the two wires are pulled out to the second main body. The side of the surface 121b is further extended into the bulb 140.

As described above, in the bulb-type lamp 200 of the present embodiment, the two leads 130a and 130b are pulled out from the first main surface 121a of the circuit board 121 to the second main surface 121b. In such a configuration, the breakage of the lead wire 130 is liable to occur. That is, in the present embodiment, when the lead wire 130 is not fixed to the circuit component 122, for example, the lead wires 130a and 130b are bent to be pulled out to the second main surface 121b side (the light emitting module 110 side). When the stress is concentrated on the connection portion (the root of the lead) of the lead wires 130a and 130b to the circuit board 121, the lead wires 130a and 130b are cut at the root portion.

On the other hand, in the bulb-type lamp 200 of the present embodiment, since the leads 130a and 130b are fixed to the ceramic capacitor 122a, the same effects as those of the embodiment 1 can be obtained. That is, even if stress is applied to the leads 130a and 130b, the leads 130a and 130b are not broken. Thereby, it is possible to suppress an unsafe operation in the bulb-type lamp 200.

Further, in the present embodiment, the shape of the circuit board 121 and the circuit case 160 corresponding to the drive circuit 120 is a circular element in plan view, for example, in the case where the base 180 is an E26 base, the circuit substrate The size of 121 (substrate size) is 40mm or less. In addition, in the case where the base 180 is an E17 base, the size of the circuit substrate 121 is 25mm or less. Because of the relationship with the base 180 and the size of the circuit board 121 having the relationship as described above, the lead 130 is liable to cause a wire breakage, and in particular, in this case, the lead 130 is fixed to the circuit component 122. In the above, the wire breakage of the lead wire 130 can be effectively reduced.

(Implementation 3)

Next, a bulb-type lamp 300 according to an embodiment 3 of the present invention will be described with reference to FIG. Figure 7 is a cross-sectional view showing a bulb type lamp according to an embodiment 3 of the present invention. In addition, in FIG. 7, the same components as those shown in FIG. 1 are denoted by the same reference numerals, and the detailed description is omitted or simplified. In addition, in FIG. 7, the drive circuit 120 is not a sectional view but a side view.

As shown in FIG. 7, the light bulb type lamp 300 of the present embodiment is the same as the first embodiment, and includes a light emitting module 110, a driving circuit 120, a lead 130, a lamp ball 340, a circuit case 360, and a lamp cap 180. Further, the aspect of the drive circuit 120 (circuit board 121) is the same as that of the second embodiment. The light bulb type lamp 300 of this embodiment further includes a support 351 and a support stand 352. Further, the bulb-type lamp 300 in the present embodiment is different from the first and second embodiments, and the peripheral device is composed of the bulb 340, the circuit case 360 (the first housing portion 361), and the base 180. .

Hereinafter, the structural elements of the bulb-type lamp 300 in the present embodiment will be described focusing on members different from the first embodiment.

(light ball)

The light bulb 340 transmits the light emitted from the light emitting module 110 to the outside of the light fixture while accommodating the light emitting module 110. In the present embodiment, the bulb 340 is a glass bulb (transparent bulb) made of quartz glass that is transparent to visible light. Therefore, the light-emitting module 110 housed in the bulb 340 can be visually recognized from the outside of the bulb 340.

The shape of the bulb 340 is such that one end is spherically covered and the other end has the shape of the opening 341. In other words, the shape of the bulb 340 is a part of the hollow sphere, and as it extends away from the center of the sphere, The narrower the shape, the opening 341 is formed at a position away from the center of the sphere. A glass bulb of the same shape as a general incandescent bulb can be used as the bulb 340 of this shape. For example, a glass bulb such as a type A, a type G, or an E type can be used as the light bulb 340.

Moreover, the light ball 340 does not necessarily need to be transparent (relative to visible light), and the light ball 340 can also have a function of diffusing light. Further, the bulb 340 is not necessarily made of quartz glass, and may be made of a resin such as acrylic.

(pillar)

The pillar 351 is a metal rod extending from the vicinity of the opening 341 of the bulb 340 toward the inside of the bulb 340.

The pillar 351 has a function as a holding member for holding the light-emitting module 110. One end of the pillar 351 is connected to the light-emitting module 110, and the other end of the pillar 351 is connected to the support base 352. The light-emitting module 110 is held by a support 351 in a hollow space in the light bulb 340. Specifically, the light-emitting module 110 is disposed at a center position of the sphere formed by the bulb 340 by the pillar 351 (for example, inside the large-diameter portion having a large inner diameter of the bulb 340). As described above, by arranging the light-emitting module 110 at the center of the light bulb 340, the light distribution characteristics of the bulb-type lamp 300 can be approximated to the conventional incandescent bulb using the filament coil.

Further, the pillar 351 is made of a metal material, and has a function as a heat releasing member to discharge heat generated by the light-emitting module 110. In this embodiment, the pillar 351 has a thermal conductivity of 237 [W/m. K] is made of aluminum. In this manner, since the pillars 351 are made of a metal material, the heat of the light-emitting module 110 can be efficiently transmitted to the pillars 351 through the mounting substrate 111. Thereby, the heat of the light emitting module 110 can be guided to the side of the base 180. As a result, problems such as a decrease in luminous efficiency of the light-emitting diode due to an increase in temperature and a shortened life can be suppressed.

(support desk)

The support table (support plate) 352 is a support member that supports the support post 351 and is connected to the open end of the opening portion 341 of the bulb 340. Further, the support base 352 is configured to cover the opening 341 of the bulb 340. In this embodiment, the support table 352 is fixed to the circuit case 360.

The support stand 352 is made of a metal material, and in the present embodiment, like the support 351, it is made of aluminum. Thereby, the heat conducted to the light-emitting module 110 of the pillar 351 is efficiently conducted to the support table 352. As a result, it is possible to suppress a decrease in luminous efficiency of the light-emitting diode due to an increase in temperature and a reduction in service life.

Further, in the present embodiment, the support table 352 is a structure of a disk-shaped member having a step portion. Since the open end of the opening 341 of the bulb 340 abuts on the step, the opening 341 of the bulb 340 is closed. Further, in the step portion, the open end of the opening portion 341 of the support base 352, the circuit case 360, and the bulb 340 is bonded by an adhesive.

(circuit housing)

The circuit case 360 has an insulating resin case (circuit holder) that houses the drive circuit 120 while insulating the post 351 from the base 180. The circuit case 360 is formed of a first case portion 361 having a large diameter cylindrical shape and a second case portion 362 having a small diameter cylindrical shape. Since the outer surface of the first case portion 361 is exposed to the outside, heat conducted to the circuit case 360 is mainly discharged from the first case portion 361. The second casing portion 362 is configured such that the outer circumferential surface is in contact with the inner circumferential surface of the base 180. In the present embodiment, the outer circumferential surface of the second casing portion 362 is formed to be screwed with the base 180. The screw joint. The circuit housing 360 can be formed by, for example, polybutylene terephthalate (PBT).

As described above, according to the light bulb type lamp 300 of the present embodiment, the light distribution characteristics of the light distribution angle can be realized in the same manner as the conventional incandescent light bulb.

In addition, in the bulb-type lamp 300 of the present embodiment, the lamp ball 340 is larger than the lamp ball 140 in the first and second embodiments, and the lamp ball 340 accounts for a large proportion in the entire lamp. Therefore, since the casing (circuit casing 360) of the lamp housing the drive circuit 120 is smaller than the first and second embodiments, the storage space of the drive circuit 120 is narrow. In such a configuration, the breakage of the lead wire 130 is liable to occur. That is, in the present embodiment, when the lead wire 130 is not fixed to the circuit component 122, for example, the lead wires 130a and 130b are bent to be pulled out from the second main surface 121b side (the light emitting module 110 side), and the stress is applied. Since the connection portion (the root portion of the lead) of the lead wires 130a and 130b to the circuit board 121 is concentrated, the lead wires 130a and 130b are cut at the root portion.

On the other hand, according to the light bulb type lamp 300 of the present embodiment, since the lead wires 130a and 130b are fixed to the ceramic capacitor 122a, the same effects as those of the first embodiment can be obtained. That is, even if stress is applied to the leads 130a and 130b, the breakage of the leads 130a and 130b is not generated. Thereby, an unsafe operation in the bulb-type lamp 300 can be suppressed.

Further, in the present embodiment, the circuit board 121 also has a shape corresponding to the circuit case 160 and is a circular element in plan view. For example, in the case where the base 180 is an E26 base, the size of the circuit substrate 121 ( Substrate size) is 40mm or less. In addition, in the case where the base 180 is an E17 base, the size of the circuit substrate 121 is 25mm or less.

(Implementation 4)

Next, a bulb-type lamp 400 according to an embodiment 4 of the present invention will be described with reference to FIG. Figure 8 is a cross-sectional view showing a bulb type lamp according to an embodiment 4 of the present invention. In addition, in FIG. 8, the same structural elements as those of the structural elements shown in FIG. 1 are denoted by the same reference numerals, and the detailed description is omitted or simplified. In addition, in FIG. 8, the drive circuit 120 is not a sectional view but a side view.

As shown in FIG. 8 , the light bulb type lamp 400 of the present embodiment is the same as the first embodiment, and includes a light emitting module 110 , a driving circuit 120 , a lead wire 130 , a light ball 140 , a base 450 , and a circuit housing 460 . The frame body 470, the base 180 and the insulating ring 190. Further, in the present embodiment, the bulb 140, the base 450, and the housing 470 are collectively referred to as "lamp main body portion (rack base)". Further, the circuit case 460, the base 180, and the insulating ring 190 are collectively referred to as a "lamp head".

The bulb-type lamp 400 according to the present embodiment differs from the first embodiment in that it has a rotation mechanism that can change the illumination direction, and is configured such that the lamp body portion can relatively rotate with respect to the lamp head. Further, in the bulb-type lamp 400, the mounting substrate 111 of the light-emitting module 110 is disposed to be inclined with respect to the axis of the base 180. Such a bulb-type luminaire 400 is configured to mount a lighting fixture in such a manner that the irradiation direction is formed vertically downward. A lighting fixture such as this includes a half bulb type main body portion mounted on a top plate and a socket in which a bulb type lamp is mounted. The slot is set to be approximately inclined with respect to the horizontal line so that the insertion port into which the base of the bulb-type lamp is inserted faces the lower side.

Hereinafter, the structural elements of the bulb-type lamp 400 of the present embodiment will be described focusing on members different from the first embodiment.

(base)

The base plate (module plate) 450 is a light source mounting member for carrying the light-emitting module 110, and is, for example, a member having an inclined surface (mounting surface) having an inclination angle of 60° with the lamp shaft (the lamp head shaft). . On the abutment The inclined surface of 450 mounts and fixes the light emitting module 110.

Further, the base 450 covers the cover member on the side of the lamp ball 140 of the circuit case 460. The drive circuit 120 (circuit substrate 121) is fixed to the base 450. That is, the circuit substrate 121 is rotated as a part of the lamp body portion.

The base 450 configured as described above is housed in the first frame portion 471 of the casing 470. Further, two through holes 463a through which the leads 130a and 130b pass are provided on the base 450. The base 450 can be formed using an insulating resin material such as polybutylene terephthalate (PBT).

(circuit housing)

The circuit case 460 is an insulating resin case (circuit holder) for accommodating a part of the drive circuit 120, and is housed in the second frame portion 472 of the housing 470 and the base 180. The circuit case 460 in the present embodiment has a large-diameter cylindrical first case portion 461 which is approximately the same shape as the second frame body portion 472, and is coupled to the first case portion 461 and the base. 180 is approximately the same shape of the second cylindrical portion 462 having a small diameter and a cylindrical shape.

Among the first case portion 461 and the second case portion 462, the first case portion 461 located on the side of the bulb 140 is housed in the second frame portion 472, and the second case portion on the side of the base 180 The 462 is housed in the base 180. Further, the base 180 is externally fitted to the second case portion 462. In the present embodiment, a screw portion for screwing with the base 180 is formed on the outer circumferential surface of the second case portion 462.

Further, a stopper (projecting portion) 460a is provided on the circuit case 460, which protrudes toward the frame body 470 and serves to stop the action of the lamp body portion and the lamp head in the rotational direction. The stopper 460a is formed at one place in the circumferential direction of the surface of the circuit case 460 opposed to the frame 470. In the present embodiment, the stopper 460a is provided at the end portion of the second casing portion 462 on the base side. The relative rotation of the lamp body portion and the lamp head is stopped by the stopper 460a of the circuit case 460 abutting against the stopper 470a of the frame body 470.

The first case portion 461 and the second case portion 462 configured as described above can be formed using a material such as an insulating resin material such as polybutylene terephthalate (PBT). Further, the first case portion 461 and the second case portion 462 may be integrally formed.

(framework)

The casing 470 is an outer casing exposed outside, and is disposed between the bulb 140 and the base 180. In the present embodiment, the housing 470 is composed of the first housing portion 471 and the second housing portion 472.

The first frame body portion 471 accommodates the base 450 as described above. The second frame body portion 472 houses the first case portion 461 of the circuit case 460.

A blocker (projecting portion) 470a is provided on the frame body 470, which protrudes toward the circuit case 460 and serves to stop the action of the lamp body portion and the lamp head in the rotational direction. The stopper 470a is formed at a position in the circumferential direction of the surface opposite to the circuit case 460 in the casing 470. In the present embodiment, the stopper 470a is provided at the base end portion of the second frame portion 472.

In the present embodiment, the housing 470 is a heat sink made of metal, and the heat generated by the light-emitting module 110 and the driving circuit 120 is discharged to the outside of the bulb-type lamp 400 through the housing 470. The frame 470 can be constructed, for example, of an aluminum alloy material.

Further, in the present embodiment, the core wires of the leads 130c and 130d connected to the base 180 are composed of stranded wires.

As described above, according to the light bulb type lamp 400 of the present embodiment, since the lamp body portion can be rotated relative to the lamp head portion, the illumination direction can be adjusted within a certain angle range by rotating the lamp body portion. Specifically, when the lamp body portion (the lamp ball 140, the base 450, and the frame 470) is rotated, the stopper 460a of the circuit case 460 and the stopper 470a of the frame 470 abut each other, and can be stopped. The structure of the rotating motion of the lamp body portion. That is, the bulb-type lamp 400 is constructed in such a manner that the lamp body portion can be rotated within a predetermined angular range.

In the bulb type lamp having such a rotating mechanism, the wire breakage of the lead wire 130 easily occurs.

That is, in the bulb type lamp having the rotating mechanism as in the present embodiment, if the lead wire 130 is not fixed to the circuit component 122 and the lamp body portion is rotated, the lead wire 130 is twisted with rotation, and stress is concentrated on the lead wire. Among the parts of 130 that are connected to the circuit board 121 (the root of the lead), there is a possibility that the lead wire 130 is cut at the root.

Further, as in the present embodiment, the light bulb type lamp in which the light emitting module 110 (the mounting substrate 111) is inclined with respect to the axis of the base 180 is attached to the lighting fixture in the oblique direction because Since it is small, the space for housing the drive circuit 120 is small. In this case, in the case where the lead 130 is not fixed to the circuit component 122, the driving circuit 120 is inserted into the circuit case 460, and the lead 130 is pulled out to a desired position and then pressed back because at the root of the lead 130 There are many situations in which a load is generated and a disconnection occurs.

On the other hand, according to the light bulb type lamp 400 of the present embodiment, since the lead wires 130 (the leads 130a and 130b) are fixed to the circuit element 122 (for example, the ceramic capacitor 122a), the same effects as those of the first embodiment can be obtained. That is, even if stress is applied to the lead 130, the breakage of the lead 130 is not generated. Thereby, an unsafe operation in the bulb-type lamp 400 can be suppressed.

Further, the leads 130c and 130d are also the same, and by fixing the leads 130c and 130d to the circuit element 122, the lead wires 130c and 130d can be broken due to the rotation of the lamp body portion.

Further, in the present embodiment, the circuit board 121 of the drive circuit 120 can use an element which is circular or elliptical in plan view.

(Implementation 5)

Next, the illuminating device 500 according to the fifth embodiment of the present invention will be described with reference to Fig. 9 . Figure 9 is a schematic cross-sectional view of a lighting device according to a fifth embodiment of the present invention.

As shown in FIG. 9, the illuminating device 500 according to the fifth embodiment of the present invention can be installed and used, for example, on a ceiling 600 of an indoor embodiment, and includes the above-described light bulb type luminaire 100 and lighting fixture according to an embodiment 1 of the present invention. 520.

The lighting fixture (lighting fixture) 520 is a device that turns off and lights the bulb-type lamp 100, and the fixture main body 521 attached to the ceiling 600 includes a translucent lamp housing 522 that covers the bulb-type lamp 100.

The fixture body 521 has a slot 521a. The slot 521a is for mounting a mounting member of a conventional incandescent light bulb and a lamp type lamp 100, and a power supply member for supplying power to the bulb type lamp 100. For example, the bulb type lamp 100 is mounted in the slot 521a by screwing the base of the bulb type lamp 100 into the slot 521a. Further, commercial power of 100 V can be supplied to the bulb-type lamp 100 from the slot 521a.

As such, the bulb type lamp 100 of the above-described embodiment 1 can be realized as the illumination device 500.

Further, the slot 521a is not limited to a structure in which the base of the bulb-type lamp is screwed, and a structure in which only the cap is simply inserted. Further, in the present embodiment, the bulb-type lamp 100 of the first embodiment is used, but other embodiments and lamps of the modified embodiment may be used.

(other)

As described above, the illumination light source and the illumination device of the present invention are described based on the embodiments and their modified embodiments, but the present invention is not limited to the embodiments and the modified embodiments.

For example, in the above-described embodiment and the modified embodiment, the heat shrinkable tube is used as the fixing member 123, but it is not limited thereto. A material such as a silicone resin can also be used as the fixing member 123. In this case, for example, the lead 130 can be brought close to and brought into contact with the circuit component 122, and the contact portion of the lead 130 and the circuit component 122 can be potted and hardened to make the lead 130 is attached to circuit component 122. That is, the epoxy resin may be partially disposed to fix the lead 130 to the circuit component 122. In this case, as described above, it is preferable that the fixing member 123 (oxygenated resin) is not in contact with the root of the lead 130b.

Further, in the above-described embodiment and the modified embodiment, the drive circuit 120 is configured as a non-dimming circuit, but may be used as a configuration of the dimming circuit. In this case, the control integrated circuit element for dimming can be mounted on the second main surface 121b of the circuit board 121 as the circuit element 122.

Further, in the above-described embodiment and the modified embodiment, the ceramic capacitors 122a and 122b are used as the circuit component 122 of the fixed lead 130, but in the case where the film capacitor is used as the circuit component 122, A lead 130 is attached to the film capacitor.

Further, in the above-described embodiment and the modified embodiment, the light-emitting module 110 is configured to emit white light by the blue light-emitting diode chip and the yellow phosphor, but is not limited thereto. For example, a phosphor-containing resin containing a red phosphor and a green phosphor may be used, and this may be combined with a blue light-emitting diode wafer to emit white light.

Further, the semiconductor light-emitting element (light-emitting diode wafer) 12 may be a light-emitting diode wafer that emits light of a color other than blue. For example, in the case where a light-emitting diode wafer using ultraviolet light is used as the semiconductor light-emitting element 112, a substance in which phosphor particles of respective colors of three primary colors (red, green, blue) are combined can be used as a package. Phosphor particles in 113. Further, a wavelength conversion material other than the phosphor particles may be used. For example, a semiconductor, a metal complex, an organic dye, a pigment, or the like may be used, which includes light that absorbs a specific wavelength and emits light of a wavelength different from the absorbed light. The substance is used as a wavelength conversion material.

Further, in the above-described embodiment and the modified embodiment, although the light-emitting diode is used as an example of the light-emitting element, a semiconductor light-emitting element such as a semiconductor laser or an organic EL (Electro Luminescence) may be used. Illumination) and EL elements such as inorganic ELs can also be used His solid light-emitting element.

In addition, in the above embodiments and the modified embodiments, the COB (Chip On Board) type LED module is used as the light emitting module 110 (the COB type LED module) The structure in which the light-emitting diode wafer (bare wafer) is directly mounted on the mounting substrate) is not limited thereto. For example, a light-emitting module in which a plurality of SMD (Surface Mount Device) type light-emitting diode elements are mounted on a substrate, which is a surface-adhesive light-emitting diode element, may be used. A light-emitting diode wafer is mounted in a resin-molded container (cavity), and a package-type light-emitting diode element inside the container is covered by a resin containing a phosphor.

Further, in the above-described embodiment and the modified embodiment, the bulb type lamp is described as an example of the light source for illumination, but the invention is not limited thereto. For example, the present invention is also applicable to a straight tube type lamp having a light-emitting module and a drive circuit in a long tubular straight tube or a round tube type lamp having a light-emitting module and a drive circuit in a ring-shaped circular tube. Further, the present invention is also applicable to a light source for illumination such as a light-emitting diode unit in which a drive circuit is built, or an illumination system including a drive circuit.

In addition, the various changes that are considered by those skilled in the art can be implemented in the apparatus of the present embodiment and the modified embodiment, or the structural elements in the embodiment and the modified embodiment, without departing from the gist of the present invention. The aspects established by the combination are also included in the scope of the present invention.

[Industrial availability]

The present invention can be widely used in lighting sources such as light bulb type lamps and lighting devices.

100‧‧‧Light bulb type lamps

110‧‧‧Lighting module

111‧‧‧Installation substrate

112‧‧‧Semiconductor light-emitting elements

113‧‧‧Package

120‧‧‧Drive circuit

121‧‧‧ circuit board

121a‧‧‧1st main face

121b‧‧‧2nd main face

122‧‧‧ Circuit components

122a, 122b‧‧‧Ceramic capacitors

122c‧‧‧ electrolytic capacitor

122d‧‧‧Current coil

122f‧‧‧Integrated circuit components

123‧‧‧Fixed components

130, 130a, 130b, 130c, 130d‧‧‧ lead

140‧‧‧light ball

150‧‧‧Abutment

150a, 160a‧‧‧through holes

160‧‧‧ circuit housing

161‧‧‧1st housing part

162‧‧‧2nd housing part

170‧‧‧ frame

170a‧‧‧ Space

180‧‧‧ lamp holder

181‧‧‧Shell Department

182‧‧‧Insulation

183‧‧‧Contact film

190‧‧‧Insulation ring

Claims (18)

A light source for illumination, comprising: a light emitting module having a light emitting element; a driving circuit having a circuit substrate and a circuit component connected to the circuit substrate, and for supplying power to the light emitting module; and a lead wire connected to the circuit substrate; And a fixing member for fixing the lead and the circuit component. The illumination light source of claim 1, wherein the fixing member is disposed to surround the lead wire and the circuit component. The illumination light source of claim 2, wherein the fixing member is a heat shrinkable tube. The illumination light source of claim 1, wherein the fixing member does not contact a connection portion of the lead and the circuit substrate. The light source for illumination according to the first aspect of the invention, wherein: the circuit component is provided in plurality; the lead wire is fixed in a circuit of the plurality of circuit components installed at a position closest to a connection portion of the lead wire and the circuit substrate; On the component. The light source for illumination according to any one of claims 1 to 5, wherein the lead wire is fixed to the circuit component having a terminal having the same potential as the lead wire. The light source for illumination according to claim 1, wherein one end of the lead penetrates the circuit board from the first main surface of the circuit board and is soldered to the second main surface facing away from the first main surface. The other end of the lead wire is pulled out from the second main surface side. The illumination light source of claim 7, wherein all of the circuit components are soldered to the second main surface. The illumination light source of claim 7 or 8, wherein the illumination module is located above the second main surface of the circuit substrate, and the lead is used to electrically connect the illumination module to the driving circuit. wire. The light source for illumination according to the first aspect of the invention, wherein the lead is a wire coated with a copper alloy with a resin. The illumination source for illumination according to claim 1, further comprising: a housing that houses the drive circuit. The light source for illumination according to claim 1, further comprising: a light bulb covering the light emitting module; and a light head receiving power for causing the light emitting module to emit light; the power received by the light head is supplied to The drive circuit. The illumination source of claim 12, wherein the lamp holder is an E26 lamp cap, and the size of the circuit substrate is 40mm or less. The illumination source of claim 12, wherein the lamp holder is an E17 lamp cap, and the size of the circuit substrate is 25mm or less. The illumination light source of claim 1, wherein the contact surface of the circuit component and the fixing member to which the lead wire is fixed is a curved surface. The illumination light source of claim 1, wherein the circuit component to which the lead is fixed is a ceramic capacitor. The light source for illumination according to the first aspect of the invention, wherein the lead wire is two wires for electrically connecting the light emitting module and the driving circuit, and the output side of the circuit component connected in parallel with the light emitting component is smoothed. A capacitor, the two wires are fixed to the output side smoothing capacitor. A lighting device comprising: the light source for illumination according to any one of claims 1 to 17.