TW201345344A - Manufacturing method of circuit pattern - Google Patents

Abstract

This invention provides a manufacturing method of circuit pattern. The method comprising, forming a substrate; making a metal material be attached to the substrate for obtaining a circuit layer on the substrate, wherein the circuit layer is a curved surface along the surface of the substrate; making a anti-coating layer on the circuit layer; executing a patterned processing to the anti-coating layer to make the anti-coating layer become a antenna pattern on the substrate; etching the circuit layer to make the metal material uncovered by the anti-coating layer be removed from the surface of the substrate for making the circuit layer form the antenna pattern; removing the anti-coating layer to expose the circuit layer forming the circuit pattern. Therefore, the manufacturing quality of the circuit pattern can be improved and the associated cost can be saved.

Description

Circuit pattern manufacturing method

The present invention relates to circuit patterns, and more particularly to methods of fabricating circuit patterns.

1 and 2 are schematic views of a conventional antenna structure 100, 100'. FIG. 1 illustrates a laser activating layer 12 formed on a substrate 11 by using Laser Direct Structuring (LDS). The substrate 11 may be an outer casing of a mobile device (for example, a smart phone). Since some of the regions are not completely subjected to the laser activation reaction, and unevenness occurs (the dotted line portion is the ideal line width), for example, the phenomenon of flash plating occurs, which may affect the overall performance of the antenna structure. As shown in FIG. 2, when the laser beam L is activated on some of the substrate 11 having the through hole, the partial size of the hole wall may be affected by factors such as the size and shape of the through hole and the angle of the laser. It is not fully activated by the laser, and thus the upper and lower laser activating layers 12 are not in communication, or only a small part of the contact, which may also affect the overall performance of the line. Therefore, when using the laser engraving process, it is usually combined with a through hole having a large aperture. A possible problem with the above-described eagle antenna structure is that it is worth further improvement to fabricate an antenna or other related conductive line in the field.

Embodiments of the present invention provide a method for manufacturing a line pattern, which can form a three-dimensional patterned or curved line pattern on a substrate, which can reduce the manufacturing cost of the line pattern such as the antenna structure and improve the manufacturing quality.

Embodiments of the present invention provide a method for manufacturing a line pattern, including the following steps. First, a substrate is formed. Then, a metal material is attached to the substrate to form a wiring base layer on the substrate, and the wiring base layer forms a curved structure along a curve of the surface of the substrate. Next, a plating resist is formed on the wiring substrate. Further, the plating resist is patterned to form a wiring pattern on the wiring substrate. Then, the wiring layer is etched, and the metal material not covered by the wiring pattern of the plating resist is removed from the substrate by etching, and the wiring base layer is formed into a wiring pattern. Next, the plating resist is removed so that the wiring base layer on which the wiring pattern has been formed is exposed on the surface of the substrate.

In summary, the method for manufacturing a circuit pattern provided by the embodiment of the present invention can form a three-dimensional patterned or curved circuit pattern on a substrate, which not only can have sufficient bonding force between the circuit pattern and the substrate, but also It can reduce the manufacturing cost of the line pattern and improve the manufacturing quality. The plastic material of the substrate carrying the line pattern is not limited to a specific material, and the substrate color shift which may be caused by the conventional laser engraving three-dimensional pattern can be avoided and the manufacturing cost caused by the laser engraving step can be reduced.

The detailed description of the present invention and the accompanying drawings are to be understood by the claims The scope is subject to any restrictions.

[Embodiment of Manufacturing Method of Line Pattern]

In the method for manufacturing a line pattern according to an embodiment of the present invention, a three-dimensional patterned or curved antenna structure or a line pattern for other purposes can be formed on a commonly used substrate. The method for manufacturing a line pattern according to an embodiment of the present invention is described by taking an example for manufacturing an antenna structure, but the present invention is not limited to the manufacture of an antenna structure. In this embodiment, the substrate is, for example, a casing of a smart phone, and the casing of the smart phone is usually a substrate using plastic or glass. However, the invention does not therefore limit the type of substrate. In order to provide sufficient bonding force of the antenna structure on the substrate, the present embodiment is described by taking an antenna structure fabricated on the casing as an example.

Referring to FIG. 3, FIG. 4A to FIG. 4F, FIG. 3 is a flowchart of a method for manufacturing an antenna structure (or a line pattern) according to an embodiment of the present invention, and FIG. 4A to FIG. 4F are schematic diagrams of an antenna structure corresponding to the step flow. . The method of manufacturing the antenna structure includes the following steps. First, in step S300, a substrate is formed as shown in Fig. 4A. The substrate 40 may be a plastic substrate and formed by injection molding or the like, but the present invention is not limited thereto. For example, the substrate 40 is a polycarbonate (PC), a polycarbonate and an Acrylonitrile Butadiene Styrene (ABS) or a material containing glass fibers. The substrate 40 may also be a glass substrate. The substrate 40 may have any predetermined shape, that is, a three-dimensional structure, so that the antenna structure fabricated on the substrate 40 is also a three-dimensional structure.

Referring to FIG. 3 and FIG. 4B simultaneously, in step S310, a metal material is attached to the substrate 40 to form a wiring base layer 41 on the substrate 40. The wiring base layer 41 forms a curved surface along a curve of the surface of the substrate 40. . The step of attaching the metal material to the substrate 40 may be performed by sputtering, plating, or the like, and has sufficient bonding force between the circuit substrate 41 and the substrate 40. However, the present invention is not limited to attaching the metal material to the substrate. The manner of the substrate 40, for example, when the metal material is copper with good electrical conductivity, the conventional method of copper plating includes at least sputtering, chemical copper and electroplating copper. Commonly used antenna structures In order to achieve light and thin and improve the wireless transceiving capability of RF signals, the antenna structure can be designed as a patterned surface.

In other words, the wiring base layer 41 forms a curved structure along the curve of the surface of the substrate 40. The metal material may be, for example, a metal including copper, titanium, aluminum, molybdenum, indium tin oxide (ITO) (90 wt% In 2 O 3 and 10 wt % SnO 2 ) or a nickel chromium alloy, but the invention is not limited thereby. The type of metal material. Regardless of the manner in which the metal material is plated on the surface of the substrate 40, the completed antenna structure can be well bonded to the substrate 40 by the wiring base layer 41. Thereby, not only the stability of the antenna structure can be achieved, but also the antenna structure can be further tested after the completion of the product manufacturing to improve the manufacturing yield.

It is worth mentioning that, in step S310, when the substrate 40 has a via hole (or a via hole), the process method of the embodiment of the present invention can reduce the through hole to about 0.1 mm to 0.3. Between the metrics. The process of the embodiment of the present invention can greatly reduce the size (or diameter) of the through hole relative to the process of conventionally making a line pattern on a substrate. In other words, when the substrate 40 has a through hole and the size of the through hole is between 0.1 mm and 0.3 mm, the step S310 can still attach the metal material to the substrate 40, including attaching the metal material. The inside of the hole. Thereby, the line patterns on the different faces of the substrate 40 can be electrically connected to each other. For example, the line pattern on the front surface of the substrate 40 can penetrate the line pattern of the back surface of the substrate through the through holes. Furthermore, if the circuit substrate layer 41 is thickened by full-plate copper plating in a subsequent step, the through-holes may be further reduced or even filled (for example, filled with thickened copper), The presence of the through holes is not visible on the surface of the substrate 40, thereby improving the flatness and visual appearance of the surface of the substrate 40, especially when the substrate 40 is used for the outer casing exposed to the surface of the product, the aesthetic substrate 40 is more susceptible to consumers. Love, to enhance the competitiveness of the product. In addition, when the substrate 40 is used for the outer casing exposed to the surface of the product, a smaller through hole (or a filled through hole) can prevent moisture and other foreign matter outside the casing (substrate) from penetrating into the product content, Improve the effectiveness of the chassis protection products.

Please refer to FIG. 3 and FIG. 5 simultaneously. FIG. 5 is a sub-flowchart corresponding to step S310 according to an embodiment of the present invention. The step of forming the wiring base layer 41 on the substrate 40 (S310) can be accomplished by using the electroless plating process of FIG. 5, in addition to being performed by sputtering or plating. First, in step S311, the surface of the substrate 40 is roughened, and the roughening may be performed using a mechanical or chemical formula. Then, in step S313, the surface of the roughened substrate 40 is subjected to a chemical copper process to adhere copper to the substrate. Next, in step S315, the thickness of copper adhering to the substrate is increased by electroplating. For example, a metal thickening layer is formed on the wiring base layer 41, and the total thickness of the wiring base layer 41 and the metal thickening layer is brought to a predetermined thickness. For example, the predetermined thickness may be a predetermined thickness of copper formed by electroplating, for example, 3 to 16 micrometers (um) of copper. However, the predetermined thickness may be adjusted according to design requirements, and the present invention is not limited thereto.

Referring to FIG. 3 and FIG. 4C simultaneously, in step S330, a plating resist is formed on the wiring base layer. The plating resist 42 may be a photopolymerizable or hot baked multi-polymer. In the present embodiment, the plating resist 42 can be subjected to a hot-baking type resist film thickness processing procedure by, for example, a spray coating method. Then, the wet film resist is polymerized by an infrared baking process, and the bonding strength of the wet film resist is enhanced. Alternatively, a dry film of a resist is formed by using a photoresist dry film and exposing and developing through a film.

Referring to FIG. 3 and FIG. 4D simultaneously, in step S350, the anti-plating layer 42 is patterned to form the anti-plating layer 42 on the line base layer 41, as shown in FIG. 4D, the anti-plating layer 42 The pattern formed is a pattern of the body of the antenna structure. In the step of patterning the plating resist 42, the periphery of the wiring pattern of the plating resist may be ablated by laser to remove the plating resist 42 other than the desired wiring pattern. The periphery of the line pattern of the anti-plating layer is ablated by laser to modify the line pattern. The laser may be a yttrium vanadate (YVO ₄ ) laser having a wavelength of 1064 nanometers (nm). It is worth mentioning that, traditionally, the lightning engraving technique for conducting conductive lines or metal lines may need to adjust the scanning time of the laser energy and the laser to avoid excessive laser damage to the surface of the substrate 40. Or avoiding insufficient laser energy to remove conductive or metal lines. The cost of traditional eagle carving has also increased.

Furthermore, the energy of the yttrium vanadate (YVO ₄ ) laser used in the present embodiment does not need to be finely adjusted as long as it is sufficient to remove the plating resist 42 and to remove the laser energy of the plating resist 42. Lower than the traditional laser energy for conductive or metal lines. Therefore, the laser energy used in the present embodiment is low and it is not easy to cause damage to the substrate 40. In other words, when the patterning process is actually performed, the laser is easily removed by the anti-plating layer 42, and the influence on the substrate 40 can be greatly reduced. However, the present invention does not limit the type of laser, and other lasers such as a green laser having a wavelength of 532 nm can also be used in the present invention.

Referring to FIG. 3 and FIG. 4E simultaneously, in step S370, the wiring layer 41 is etched, and the metal material not covered by the wiring pattern of the plating resist 42 is removed from the substrate 40 by etching, and the wiring base layer 41 is removed. Form a line pattern. As shown in FIG. 4E, the etching portion 41a is not covered by the plating resist 42. The embodiment of step S370 may be to remove the etched portion 41a using an acidic etchant. The main components of the acidic etching solution usually include (chelating agent) nitric acid, sulfuric acid, hydrochloric acid, hydrogen peroxide, hydrogen fluoride, sodium chlorate (NaClO ₃ ), ferric chloride, sodium persulfate (sodium polydithiodipropane sulfonate, SPS). Etc., but the invention does not limit the type of acidic etchant.

Referring to FIG. 3 and FIG. 4F simultaneously, in step S390, the plating resist 42 is removed, so that the wiring base layer 41 on which the wiring pattern has been formed is exposed on the surface of the substrate 40. The line pattern of the wiring base layer 41 is a pattern of the plating resist 42 as in FIG. 4D. The removal of the plating resist 42 can use a de-filming liquid. For example, the dry film resist is completely stripped using a de-filming solution. The main component of the deionizing liquid may be, for example, a sodium carbonate (Na ₂ CO ₃ ) or potassium carbonate (K ₂ CO ₃ ) component having a pH of more than 13. However, the present invention is not limited to the components of the membrane-removing liquid, and the membrane-removing liquid may be a solvent such as sodium hydroxide (NaOH) / potassium hydroxide (KOH), amine ethers, or polyethylene glycol (ethanolamine).

After step S390, a metal thickening layer may also be formed over the wiring base layer 41 to increase the total thickness of the wiring base layer 41 and the metal thickening layer. In addition, in order to protect the antenna structure, a step of forming a metal protective layer on the wiring base layer 41 may be performed after step S390. The manner in which the metal protective layer is formed is usually done by electroplating or electroless plating, and the metal protective layer may be palladium, nickel palladium, nickel gold or nickel plus a nickel resist attached to the nickel layer. The thickness of the metal protective layer may be 5 micrometers (um) or more, and the thickness may be adjusted as needed.

The above embodiment is explained by taking only a line pattern as an antenna structure as an example. The method for fabricating the line pattern of the embodiment of the present invention can also be used to manufacture a circuit pattern of an electronic circuit such as a Charge Coupled Device (CCD), or to manufacture a three-dimensional patterned conductive line on a commonly used plastic substrate. In other words, the present invention does not limit the use of the conductive line pattern produced by the method of manufacturing the line pattern.

[Possible efficacy of the embodiment]

According to the embodiment of the present invention, the method for manufacturing the circuit pattern can form a three-dimensional patterned or curved circuit pattern on a commonly used substrate such as plastic or glass, which not only can have sufficient bonding force between the circuit pattern and the substrate, It also reduces the manufacturing cost of the line pattern and improves the manufacturing quality. The plastic or glass used for the substrate carrying the line pattern need not be limited to a specific material, so that the material cost of the substrate can be reduced. In the process step, the step of using the anti-plating layer can avoid the substrate color shift which may be caused by the conventional laser engraving three-dimensional pattern and reduce the manufacturing cost caused by the laser engraving step. Moreover, when there is a through hole in the substrate, the through hole used can be reduced or filled to improve the flatness of the surface of the substrate to achieve an aesthetic effect, and is smaller or filled. The hole can prevent foreign matter such as moisture from entering the product.

The above description is only an embodiment of the present invention, and is not intended to limit the scope of the invention.

100, 100’. . . Traditional antenna structure

11, 40. . . Substrate

12. . . Laser activation layer

L. . . Laser beam

41. . . Line base

42. . . Anti-plating

41a. . . Etching department

S300, S310, S330, S350, S370, S390, S311, S313, S315. . . Step flow

Figure 1 is a schematic illustration of a conventional antenna structure.

2 is a schematic diagram of a conventional antenna structure.

3 is a flow chart showing a method of fabricating an antenna structure in accordance with an embodiment of the present invention.

4A is a cross-sectional view showing the structure of an antenna corresponding to step S300 according to an embodiment of the present invention.

4B is a cross-sectional view showing the structure of the antenna corresponding to step S310 according to an embodiment of the present invention.

4C is a cross-sectional view showing the structure of the antenna corresponding to step S330 according to an embodiment of the present invention.

4D is a top plan view of the antenna structure corresponding to step S350 according to an embodiment of the present invention.

4E is a cross-sectional view showing the structure of the antenna corresponding to step S370 according to an embodiment of the present invention.

4F is a cross-sectional view showing the structure of the antenna corresponding to step S390 according to an embodiment of the present invention.

FIG. 5 is a sub-flowchart corresponding to step S310 according to an embodiment of the present invention.

S300, S310, S330, S350, S370, S390. . . Step flow

Claims (10)

A method for manufacturing a circuit pattern, comprising: forming a substrate; attaching a metal material to the substrate to form a circuit substrate on the substrate, wherein the circuit substrate forms a curved surface along a curve of the surface of the substrate Forming an anti-plating layer on the circuit substrate; patterning the anti-plating layer to form a line pattern on the circuit substrate; etching the circuit layer so that the anti-plating layer is not The metal material covered by the circuit pattern is removed from the substrate by etching, and the wiring substrate is formed into the wiring pattern; and the plating resist is removed, so that the wiring substrate on which the wiring pattern has been formed is exposed on the substrate The surface. The method for manufacturing a circuit pattern according to claim 1, wherein after the step of attaching the metal material to the substrate, and before the step of forming the plating resist on the circuit substrate, the method further comprises: A metal thickening layer is formed on the wiring base layer, and the total thickness of the wiring base layer and the metal thickening layer is a predetermined thickness. The method for manufacturing a line pattern according to claim 2, wherein the step of attaching the metal material to the substrate may be performed by sputtering, chemical copper or electroplating. The method of manufacturing a line pattern according to claim 2, wherein the metal material comprises copper, titanium, aluminum, molybdenum, nichrome or indium tin oxide (ITO, 90 wt% In2O3 and 10 wt% SnO2) gold. The method for producing a line pattern according to claim 1, wherein the plating resist layer may be a photopolymerizable or hot baked multi-molecular polymer. The method of manufacturing a circuit pattern according to claim 1, wherein the step of removing the plating resist further comprises: forming a metal thickening layer over the wiring substrate. The method for manufacturing a line pattern according to claim 1, wherein in the step of patterning the plating resist layer, the periphery of the line pattern of the anti-plating layer is ablated by a laser to modify the Line pattern. The method for manufacturing a circuit pattern according to claim 1, wherein after the step of removing the plating resist, further comprising forming a metal protective layer over the wiring substrate on which the wiring pattern has been formed. The method for manufacturing a line pattern according to claim 1, wherein the step of attaching the metal material to the substrate to form the circuit substrate on the substrate is performed by an electroplating copper process. The at least consistent pores on the surface have a size between 0.1 mm and 0.3 mm. The method for manufacturing a circuit pattern according to claim 1, wherein the step of attaching the metal material to the substrate comprises: roughening the surface of the substrate; and performing an electrochemical copper process on the surface of the roughened substrate. And attaching copper to the substrate; and thickening the thickness of the copper attached to the substrate by electroplating.