TW201343850A - Adhesive tape - Google Patents
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本發明係關於一種黏著帶。 The present invention relates to an adhesive tape.
包含矽、鎵、砷等之半導體晶圓係以大直徑狀態而製造,於在表面形成圖案後對背面進行研磨,通常使晶圓之厚度薄至100~600μm左右,進而切割分離(dicing)為元件小片,進而轉移至安裝步驟。 A semiconductor wafer including germanium, gallium, arsenic or the like is manufactured in a large diameter state, and the back surface is polished after patterning on the surface, and the thickness of the wafer is usually as thin as about 100 to 600 μm, and then dicing is performed. The component is then transferred to the installation step.
於對半導體晶圓之背面進行研磨之步驟(背面研磨步驟)中,為了保護半導體晶圓之圖案面而使用黏著帶。該黏著帶通常於背面研磨步驟後被剝離。出於此種目的而使用之黏著帶必須有於背面研磨步驟中不剝離之程度之黏著力,另一方面亦要求於背面研磨步驟後可容易地剝離,且為不損傷半導體晶圓之程度之低黏著力。 In the step of polishing the back surface of the semiconductor wafer (back grinding step), an adhesive tape is used to protect the pattern surface of the semiconductor wafer. The adhesive tape is usually peeled off after the back grinding step. The adhesive tape used for this purpose must have an adhesive force that does not peel off during the back grinding step, and on the other hand, it is required to be easily peeled off after the back grinding step, and to the extent that the semiconductor wafer is not damaged. Low adhesion.
先前,作為此種黏著帶,使用於基材上塗佈有黏著劑之黏著帶,例如提出有於包含聚乙烯系樹脂之基材上設置有丙烯酸系黏著劑塗佈而成之黏著劑層的黏著帶(專利文獻1)。但,於此種黏著帶之製造中,需要使基材成膜之步驟及塗敷黏著劑溶液之步驟等大量步驟,製造成本較高。又,有排出大量CO2之問題。進而,於上述製造方法中,於塗佈黏著劑溶液後需要藉由乾燥而去除有機溶劑,因此有因有機溶劑之揮發而導致環境負荷之方面之問題。 Conventionally, as such an adhesive tape, an adhesive tape to which an adhesive is applied to a substrate is used. For example, an adhesive layer coated with an acrylic adhesive on a substrate containing a polyethylene resin is proposed. Adhesive tape (Patent Document 1). However, in the manufacture of such an adhesive tape, a large number of steps such as a step of forming a substrate and a step of applying an adhesive solution are required, and the manufacturing cost is high. Moreover, there is a problem of discharging a large amount of CO 2 . Further, in the above production method, since the organic solvent is removed by drying after the application of the pressure-sensitive adhesive solution, there is a problem in that environmental load is caused by volatilization of the organic solvent.
作為解決此種問題之方法,可列舉將基材形成材料與黏著劑形成材料共擠出之方法。但,可供於共擠出之材料為熱塑性樹脂,使用熱塑性樹脂之情形時,難以兼顧適度之黏著力與對半導體晶圓圖案之 凹凸之追隨性(階差追隨性)。即,黏著力調整至可容易地剝離之程度之黏著帶係黏著劑變得過硬而階差追隨性不充分,無法充分地達成保護半導體晶圓之目的。另一方面,為了發揮良好之階差追隨性而經調整之黏著帶係黏著力過強,有剝離時損傷半導體晶圓、或黏著劑殘留於半導體晶圓上之問題。 As a method for solving such a problem, a method of coextruding a substrate forming material and an adhesive forming material can be mentioned. However, the material available for co-extrusion is a thermoplastic resin, and in the case of using a thermoplastic resin, it is difficult to achieve both a proper adhesion and a pattern for a semiconductor wafer. Follow-up of bumps (step follower). That is, the adhesive tape-adhering agent adjusted to such an extent that the adhesive force can be easily peeled off is too hard, and the step followability is insufficient, and the purpose of protecting the semiconductor wafer cannot be sufficiently achieved. On the other hand, the adhesive tape which is adjusted to exhibit good step followability is too strong, and there is a problem that the semiconductor wafer is damaged or the adhesive remains on the semiconductor wafer during peeling.
[專利文獻1]國際公開WO2007/116856號說明書 [Patent Document 1] International Publication WO2007/116856
本發明係為了解決上述先前之問題而完成者,其目的在於提供一種黏著力與剝離性之平衡及階差追隨性優異、且可藉由共擠出成形而製造之黏著帶。 The present invention has been made to solve the above-mentioned problems, and an object thereof is to provide an adhesive tape which is excellent in balance between adhesion and peelability and step followability and which can be produced by co-extrusion molding.
本發明之黏著帶具備由包含非晶丙烯-(1-丁烯)共聚物之樹脂組合物構成之黏著劑層,該黏著帶於貼附於具有30μm階差之被黏著體時於該階差之附近浮起,該黏著帶與該被黏著體不相接之部分之寬度為650μm以下,利用根據JIS Z 0237(2000)之方法(貼合條件:2kg輥往復1次、剝離速度:300mm/分鐘、剝離角度:180°)測定之該黏著帶對矽製半導體鏡面晶圓之黏著力為2.0N/20mm以下。 The adhesive tape of the present invention comprises an adhesive layer composed of a resin composition containing an amorphous propylene-(1-butene) copolymer, which is attached to an adherend having a step of 30 μm. The width of the portion where the adhesive tape does not contact the adherend is 650 μm or less, and the method according to JIS Z 0237 (2000) is used. (Adhesion conditions: 1 kg roller reciprocating once, peeling speed: 300 mm/ Minute, peeling angle: 180°) The adhesion of the adhesive tape to the tantalum semiconductor mirror wafer was 2.0 N/20 mm or less.
於較佳之實施形態中,上述黏著劑層於20℃下之貯存模數(G')為2.0MPa以下。 In a preferred embodiment, the storage modulus (G') of the adhesive layer at 20 ° C is 2.0 MPa or less.
於較佳之實施形態中,上述黏著劑層於由奈米壓痕儀壓入1000nm時之壓痕硬度為0.8MPa以上。 In a preferred embodiment, the adhesive layer has an indentation hardness of 0.8 MPa or more when pressed into a 1000 nm by a nanoindenter.
於較佳之實施形態中,本發明之黏著帶之上述樹脂組合物包含非晶丙烯-(1-丁烯)共聚物與結晶性樹脂,且該結晶性樹脂為結晶性丙 烯-(1-丁烯)共聚物及/或結晶性乙烯-(1-丁烯)共聚物。 In a preferred embodiment, the resin composition of the adhesive tape of the present invention comprises an amorphous propylene-(1-butene) copolymer and a crystalline resin, and the crystalline resin is crystalline C. An ene-(1-butene) copolymer and/or a crystalline ethylene-(1-butene) copolymer.
於較佳之實施形態中,上述樹脂組合物中來自1-丁烯之構成單元之合計含有比率為相對於該樹脂組合物中之樹脂之總重量為5重量%以上。 In a preferred embodiment, the total content of the constituent units derived from 1-butene in the resin composition is 5% by weight or more based on the total weight of the resin in the resin composition.
於較佳之實施形態中,本發明之黏著帶中,黏著帶厚度為5μm~1000μm。 In a preferred embodiment, in the adhesive tape of the present invention, the adhesive tape has a thickness of 5 μm to 1000 μm.
於較佳之實施形態中,本發明之黏著帶係進而具備基材層,且將黏著劑層形成材料與基材層形成材料進行共擠出成形而得到。 In a preferred embodiment, the adhesive tape of the present invention further comprises a base material layer, and the adhesive layer forming material and the base material layer forming material are obtained by co-extrusion molding.
於較佳之實施形態中,本發明之黏著帶為半導體晶圓加工用。 In a preferred embodiment, the adhesive tape of the present invention is used for semiconductor wafer processing.
根據本發明,藉由具備包含特定共聚物之黏著劑層,可提供一種黏著力與剝離性之平衡及階差追隨性優異之黏著帶。此種黏著帶特別適宜用作半導體晶圓加工用黏著帶。又,根據本發明,藉由利用共擠出成形而製造,可提供不使用有機溶劑而可以較少之步驟數進行生產之黏著帶。 According to the present invention, by providing an adhesive layer containing a specific copolymer, it is possible to provide an adhesive tape having excellent balance of adhesion and peelability and excellent step followability. Such an adhesive tape is particularly suitable for use as an adhesive tape for semiconductor wafer processing. Further, according to the present invention, it is produced by co-extrusion molding, and it is possible to provide an adhesive tape which can be produced in a small number of steps without using an organic solvent.
10‧‧‧黏著劑層 10‧‧‧Adhesive layer
20‧‧‧基材層 20‧‧‧Substrate layer
100‧‧‧黏著帶 100‧‧‧Adhesive tape
200‧‧‧被黏著體 200‧‧‧Adhesive body
a‧‧‧階差之寬度 A‧‧‧ width of the step
x‧‧‧階差 X‧‧‧ step
圖1係本發明之較佳實施形態之黏著帶的概略剖面圖。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing an adhesive tape according to a preferred embodiment of the present invention.
圖2係對本發明之黏著帶之階差追隨性之指標即「浮起寬度」進行說明的圖。 Fig. 2 is a view for explaining the "floating width" which is an index of the step followability of the adhesive tape of the present invention.
A.黏著帶之整體構成 A. The overall composition of the adhesive tape
圖1係本發明之較佳實施形態之黏著帶的概略剖面圖。黏著帶100具備由包含非晶丙烯-(1-丁烯)共聚物之樹脂組合物形成之黏著劑層10。黏著帶100較佳為進而具備基材層20。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing an adhesive tape according to a preferred embodiment of the present invention. The adhesive tape 100 is provided with an adhesive layer 10 formed of a resin composition containing an amorphous propylene-(1-butene) copolymer. The adhesive tape 100 preferably further includes a base material layer 20 .
黏著帶100之厚度較佳為5μm~1000μm,進而較佳為100μm~300μm,尤佳為130μm~250μm。 The thickness of the adhesive tape 100 is preferably from 5 μm to 1000 μm, more preferably from 100 μm to 300 μm, still more preferably from 130 μm to 250 μm.
黏著劑層10之厚度較佳為2μm~100μm,進而較佳為20μm~80μm,尤佳為30μm~60μm。 The thickness of the adhesive layer 10 is preferably from 2 μm to 100 μm, more preferably from 20 μm to 80 μm, still more preferably from 30 μm to 60 μm.
基材層20之厚度較佳為3μm~900μm,進而較佳為20μm~220μm,尤佳為70μm~190μm。 The thickness of the base material layer 20 is preferably from 3 μm to 900 μm, more preferably from 20 μm to 220 μm, still more preferably from 70 μm to 190 μm.
本發明之黏著帶進而可具備任意適當之其他層。作為其它層,例如可列舉於基材層之與黏著劑層之相反側具備之可對黏著帶賦予耐熱性的表面層。 The adhesive tape of the present invention may further comprise any other suitable layer. The other layer may, for example, be a surface layer provided on the opposite side of the base layer from the adhesive layer to impart heat resistance to the adhesive tape.
於本說明書中,使用「浮起寬度」作為黏著帶之階差追隨性之指標。所謂「浮起寬度」,如圖2所示,係指於將黏著帶100貼附於具有階差x之被黏著體200時,該黏著帶於該階差之附近浮起而與被黏著體200不相接之部分的寬度a。該浮起寬度較小,意味著黏著帶之階差追隨性優異而可良好地填充被黏著體之凹凸。 In this specification, "floating width" is used as an indicator of the step followability of the adhesive tape. The "floating width" as shown in FIG. 2 means that when the adhesive tape 100 is attached to the adherend 200 having the step difference x, the adhesive tape floats near the step and adheres to the adherend. The width a of the 200 non-contact parts. This small floating width means that the adhesive tape has excellent step followability and can well fill the unevenness of the adherend.
將本發明之黏著帶貼附於矽製半導體鏡面晶圓時,剛貼附後本發明之黏著帶相對於階差30μm之被黏著體之浮起寬度較佳為650μm以下,進而較佳為500μm以下,尤佳為450μm以下。關於本發明之黏著帶相對於階差30μm之被黏著體之浮起寬度之下限值,只要可得到本發明之效果,則越小越佳,較佳為1μm以上,進而較佳為5μm以上。本發明之黏著帶浮起寬度較小,即,對被黏著體之凹凸(例如半導體晶圓之圖案)追隨性較佳,可良好地填充該凹凸。於將此種黏著帶用於半導體晶圓加工時之圖案面保護之情形時,於背面研磨步驟時,可對半導體晶圓均勻地施加壓力,半導體晶圓之背面無圖案面之凹凸之影響而可平滑地進行研磨。又,可防止半導體晶圓之破裂。進而,可防止研磨水滲入至半導體晶圓與黏著帶之間。 When the adhesive tape of the present invention is attached to a tantalum semiconductor mirror wafer, the floating width of the adhesive tape of the present invention after the attachment is preferably 650 μm or less, and more preferably 500 μm, with respect to the adhesive body having a step of 30 μm. Hereinafter, it is particularly preferably 450 μm or less. The lower limit of the floating width of the adhesive tape of the present invention with respect to the adherend having a step of 30 μm is preferably as small as possible, as long as the effect of the present invention is obtained, and is preferably 1 μm or more, and more preferably 5 μm or more. . The adhesive tape of the present invention has a small floating width, that is, it has a good followability to the unevenness of the adherend (for example, a pattern of a semiconductor wafer), and the unevenness can be satisfactorily filled. When such an adhesive tape is used for pattern surface protection in semiconductor wafer processing, pressure can be uniformly applied to the semiconductor wafer during the back grinding step, and the back surface of the semiconductor wafer is free from the unevenness of the pattern surface. Grinding can be performed smoothly. Also, cracking of the semiconductor wafer can be prevented. Further, it is possible to prevent the polishing water from infiltrating between the semiconductor wafer and the adhesive tape.
將本發明之黏著帶貼附於矽製半導體鏡面晶圓時,貼附後之1小時之相對於階差30μm之浮起寬度的增加量較佳為10%以內,進而較佳為5%以內。若為此範圍,則於將黏著帶貼附於半導體晶圓後經過 特定時間後將半導體晶圓供於背面研磨步驟的情形時,亦可維持良好地填充半導體晶圓之圖案面之凹凸之狀態,而如上所述地平滑地對背面進行研磨,又,可防止半導體晶圓產生破裂。尤佳為,上述黏著帶於貼附後經過1小時後浮起寬度亦不增加。 When the adhesive tape of the present invention is attached to a tantalum semiconductor mirror wafer, the amount of increase in the floating width with respect to a step of 30 μm after one hour of attachment is preferably within 10%, and more preferably within 5%. . If this range is used, after attaching the adhesive tape to the semiconductor wafer, When the semiconductor wafer is supplied to the back surface polishing step after a certain period of time, the state in which the unevenness of the pattern surface of the semiconductor wafer is well filled can be maintained, and the back surface can be smoothly polished as described above, and the semiconductor can be prevented. The wafer is broken. More preferably, the width of the above-mentioned adhesive tape does not increase after one hour after the attachment.
將本發明之黏著帶貼附於矽製半導體鏡面晶圓時,貼附並經過1小時後本發明之黏著帶相對於階差30μm之被黏著體之浮起寬度較佳為隨著時間進過浮起寬度不變大。 When the adhesive tape of the present invention is attached to a tantalum semiconductor mirror wafer, the floating width of the adhesive tape of the present invention with respect to a step of 30 μm after attaching and passing for one hour is preferably over time. The floating width does not change.
本發明之黏著帶以半導體鏡面晶圓(矽製)為試驗板、利用根據JIS Z 0237(2000)之方法(貼合條件:2kg輥往復1次、剝離速度:300mm/分鐘、剝離角度:180°)測定的黏著力為2.0N/20mm以下,較佳為0.1N/20mm~2.0N/20mm,進而較佳為0.15N/20mm~1.5N/20mm,更佳為0.15N/20mm~1.0N/20mm,尤佳為0.25N/20mm~1.0N/20mm。若為此範圍,則可得到可兼顧黏著力與剝離性、例如於半導體晶圓之背面研磨步驟中於研磨加工中不剝離、於研磨加工後可容易地剝離的黏著帶。於本發明中,例如,可使黏著劑層中含有非晶丙烯-(1-丁烯)共聚物作為主成分而使之表現黏著力,進而藉由添加結晶性樹脂而調整黏著力。黏著劑層之構成成分之詳細情況於後文敍述。 The adhesive tape of the present invention uses a semiconductor mirror wafer (manufactured by a tantalum) as a test plate, and uses a method according to JIS Z 0237 (2000) (adhesion conditions: 1 kg roller reciprocating once, peeling speed: 300 mm/min, peeling angle: 180 °) The measured adhesive force is 2.0 N/20 mm or less, preferably 0.1 N/20 mm to 2.0 N/20 mm, further preferably 0.15 N/20 mm to 1.5 N/20 mm, more preferably 0.15 N/20 mm to 1.0 N. /20mm, especially preferably 0.25N/20mm~1.0N/20mm. In this range, it is possible to obtain an adhesive tape which can achieve both adhesion and peeling properties, for example, does not peel off during polishing in the back surface polishing step of the semiconductor wafer, and can be easily peeled off after the polishing process. In the present invention, for example, an amorphous propylene-(1-butene) copolymer is contained in the adhesive layer as a main component to exhibit an adhesive force, and the adhesive force is adjusted by adding a crystalline resin. The details of the constituent components of the adhesive layer will be described later.
本發明之黏著帶以聚醯亞胺塗層晶圓為試驗板、利用根據JIS Z 0237(2000)之方法(貼合條件:2kg輥往復1次、剝離速度:300mm/分鐘、剝離角度:180°)測定的對聚醯亞胺塗層面之黏著力較佳為0.1N/20mm~3.5N/20mm,進而較佳為0.3N/20mm~2.0N/20mm,更佳為0.3N/20mm~1.5N/20mm,尤佳為0.5N/20mm~1.2N/20mm。 The adhesive tape of the present invention uses a polyimide-coated wafer as a test plate and uses a method according to JIS Z 0237 (2000) (adhesion conditions: 1 kg roller reciprocating once, peeling speed: 300 mm/min, peeling angle: 180 °) The adhesion to the polyimide coating surface is preferably 0.1 N/20 mm to 3.5 N/20 mm, more preferably 0.3 N/20 mm to 2.0 N/20 mm, and more preferably 0.3 N/20 mm. 1.5N/20mm, especially 0.5N/20mm~1.2N/20mm.
將本發明之黏著帶貼附於4英吋半導體晶圓之鏡面面,於23℃、相對濕度50%之環境下經過1小時後進行剝離,此時該鏡面面上之粒徑為0.28μm以上之微粒數較佳為0個/cm2~500個/cm2,進而較佳為0 個/cm2~100個/cm2,尤其佳為0個/cm2~50個/cm2,最佳為0個/cm2~20個/cm2。微粒數之測定可使用微粒計數器進行測定。又,將本發明之黏著帶貼附於半導體晶圓之鏡面面,於40℃、相對濕度50%之環境下經過1天後進行剝離,此時晶圓表面之碳原子之增加量(即轉印至晶圓上之有機物之量)相對於黏著帶貼附前,較佳為1原子%~45原子%,進而較佳為1原子%~30原子%。晶圓表面之碳原子之量可使用ESCA(Electron Spectroscopy for Chemical Analysis,化學分析電子能譜)進行測定。關於晶圓表面之碳原子之增加量(即轉印至晶圓上之有機物之量),具體而言,可測定未貼附黏著帶之半導體晶圓之鏡面面上之碳原子的量及如上所述地進行貼附、剝離後之半導體晶圓之鏡面面上之碳原子的量,並根據該等之差而算出。作為ESCA裝置,例如可使用ULVAC-PHI公司製造之商品名「model 5400」。 The adhesive tape of the present invention is attached to the mirror surface of a 4-inch semiconductor wafer, and is peeled off after being exposed to an environment of 23° C. and a relative humidity of 50% for 1 hour. At this time, the particle size on the mirror surface is 0.28 μm or more. The number of particles is preferably from 0/cm 2 to 500 /cm 2 , more preferably from 0 /cm 2 to 100 /cm 2 , particularly preferably from 0 /cm 2 to 50 /cm 2 , most Preferably, it is 0 pieces/cm 2 ~ 20 pieces/cm 2 . The measurement of the number of particles can be carried out using a particle counter. Moreover, the adhesive tape of the present invention is attached to the mirror surface of the semiconductor wafer, and is peeled off after being exposed to an environment of 40° C. and a relative humidity of 50% for one day, and the amount of carbon atoms on the surface of the wafer is increased. The amount of the organic substance printed on the wafer is preferably from 1 atom% to 45 atom%, more preferably from 1 atom% to 30 atom%, before being attached to the adhesive tape. The amount of carbon atoms on the surface of the wafer can be measured using ESCA (Electron Spectroscopy for Chemical Analysis). Regarding the amount of carbon atoms on the surface of the wafer (ie, the amount of organic matter transferred onto the wafer), specifically, the amount of carbon atoms on the mirror surface of the semiconductor wafer to which the adhesive tape is not attached can be measured and The amount of carbon atoms on the mirror surface of the semiconductor wafer after being attached and peeled is calculated based on the difference therebetween. As the ESCA device, for example, a brand name "model 5400" manufactured by ULVAC-PHI Corporation can be used.
本發明之黏著帶可由隔片保護而提供。本發明之黏著帶可於由隔片保護之狀態下捲取成捲筒狀。隔片具有作為保護黏著帶直至供於使用前之保護材料的功能。作為隔片,例如可列舉經矽系剝離劑、氟系剝離劑、丙烯酸長鏈烷基酯系剝離劑等剝離劑進行表面塗佈之塑膠(例如,聚對苯二甲酸乙二酯(PET)、聚乙烯、聚丙烯)膜、不織布或紙等。 The adhesive tape of the present invention can be provided by a spacer. The adhesive tape of the present invention can be wound into a roll shape in a state protected by a separator. The spacer has the function of protecting the adhesive tape until it is supplied with a protective material before use. Examples of the separator include a plastic coated with a release agent such as a bismuth release agent, a fluorine release agent, or a long-chain alkyl acrylate release agent (for example, polyethylene terephthalate (PET). , polyethylene, polypropylene) film, non-woven fabric or paper.
本發明之黏著帶例如於未由隔片保護之情形時,亦可於與黏著劑層相反側之最外層進行背面處理。背面處理例如可使用矽系剝離劑或丙烯酸長鏈烷基酯系剝離劑等剝離劑而進行。本發明之黏著帶藉由進行背面處理可捲取成捲筒狀。 The adhesive tape of the present invention may be subjected to back treatment on the outermost side opposite to the adhesive layer, for example, when it is not protected by the separator. The back surface treatment can be carried out, for example, by using a release agent such as a ruthenium release agent or a long-chain alkyl acrylate release agent. The adhesive tape of the present invention can be wound into a roll shape by performing back surface treatment.
B.黏著劑層 B. Adhesive layer
上述黏著劑層由包含非晶丙烯-(1-丁烯)共聚物之樹脂組合物形成。若為此種黏著劑層,則可藉由與基材層之共擠出成形而製造黏著帶,而可以較少之步驟數且不使用有機溶劑而得到黏著帶。再者,於 本說明書中,所謂「非晶」,係指不具有如結晶質般明確之熔點之性質。 The above adhesive layer is formed of a resin composition containing an amorphous propylene-(1-butene) copolymer. In the case of such an adhesive layer, an adhesive tape can be produced by co-extrusion molding with a base material layer, and an adhesive tape can be obtained with a small number of steps and without using an organic solvent. Furthermore, In the present specification, the term "amorphous" means a property which does not have a melting point as defined by crystallinity.
上述非晶丙烯-(1-丁烯)共聚物中,來自1-丁烯之構成單元之含有比率較佳為1重量%~40重量%、更佳為2重量%~30重量%、進而較佳為2重量%~10重量%、尤佳為2重量%~5重量%。若為此種範圍,則1-丁烯阻礙丙烯之結晶化而保持非晶質從而柔軟性優異,因此可得到上述階差追隨性優異之黏著帶。 In the above amorphous propylene-(1-butene) copolymer, the content ratio of the constituent unit derived from 1-butene is preferably from 1% by weight to 40% by weight, more preferably from 2% by weight to 30% by weight, and furthermore It is preferably from 2% by weight to 10% by weight, particularly preferably from 2% by weight to 5% by weight. When it is such a range, 1-butene inhibits crystallization of propylene and remains amorphous, and is excellent in flexibility, so that an adhesive tape excellent in the above-described step followability can be obtained.
上述非晶丙烯-(1-丁烯)共聚物中,來自丙烯之構成單元之含有比率較佳為60重量%~99重量%,更佳為70重量%~98重量%,進而較佳為90重量%~98重量%,尤佳為95重量%~98重量%。若處於此範圍,則不會由於1-丁烯變多、分子鏈擴大而使黏著劑層變得過於柔軟,而可於帶剝離時穩定地進行剝離。 In the above amorphous propylene-(1-butene) copolymer, the content ratio of the constituent unit derived from propylene is preferably 60% by weight to 99% by weight, more preferably 70% by weight to 98% by weight, still more preferably 90% by weight. It is preferably from 95% by weight to 98% by weight, particularly preferably from 98% by weight to 98% by weight. When it is in this range, the adhesive layer is not too soft due to the increase in 1-butene and the molecular chain is enlarged, and the peeling can be stably performed when the tape is peeled off.
上述非晶丙烯-(1-丁烯)共聚物可為嵌段共聚物亦可為無規共聚物。 The above amorphous propylene-(1-butene) copolymer may be a block copolymer or a random copolymer.
上述非晶丙烯-(1-丁烯)共聚物之重量平均分子量(Mw)為200,000以上,較佳為200,000~500,000,進而較佳為200,000~300,000。若非晶丙烯-(1-丁烯)共聚物之重量平均分子量(Mw)為此範圍,則可得到與通常之苯乙烯系熱塑性樹脂、丙烯酸系熱塑性樹脂(Mw為100,000以下)相比低分子量成分較少、可防止被黏著體之污染的黏著帶。又,共擠出成形時,可無加工不良地形成黏著劑層,且可得到適當之黏著力。 The amorphous propylene-(1-butene) copolymer has a weight average molecular weight (Mw) of 200,000 or more, preferably 200,000 to 500,000, and more preferably 200,000 to 300,000. When the weight average molecular weight (Mw) of the amorphous propylene-(1-butene) copolymer is in this range, a low molecular weight component can be obtained as compared with a usual styrene-based thermoplastic resin or an acrylic thermoplastic resin (Mw is 100,000 or less). Less adhesive tape that prevents contamination by the adherend. Further, at the time of co-extrusion molding, the adhesive layer can be formed without processing, and an appropriate adhesive force can be obtained.
上述非晶丙烯-(1-丁烯)共聚物進而可於不損害本發明之效果之範圍內包含來自其他單體之構成單元。作為其他單體,例如可列舉:乙烯、1-戊烯、1-己烯、1-辛烯、1-癸烯、4-甲基-1-戊烯、3-甲基-1-戊烯等α-烯烴。 Further, the above-mentioned amorphous propylene-(1-butene) copolymer may contain constituent units derived from other monomers within a range not impairing the effects of the present invention. Examples of the other monomer include ethylene, 1-pentene, 1-hexene, 1-octene, 1-decene, 4-methyl-1-pentene, and 3-methyl-1-pentene. And other alpha-olefins.
上述非晶丙烯-(1-丁烯)共聚物較佳為藉由使用茂金屬觸媒使丙烯 與1-丁烯聚合而得到。例如,非晶丙烯-(1-丁烯)共聚物可藉由進行使用茂金屬觸媒使丙烯與1-丁烯聚合的聚合步驟、於該聚合步驟後進行殘留觸媒去除步驟、雜質去除步驟等後處理步驟而獲得。非晶丙烯-(1-丁烯)共聚物經過該等步驟,以粉末狀、顆粒狀等形狀而得到。作為茂金屬觸媒,例如可列舉包含茂金屬化合物與鋁氧烷之茂金屬均勻混合觸媒、微粒狀之載體上載持有茂金屬化合物之茂金屬載持型觸媒等。 The above amorphous propylene-(1-butene) copolymer is preferably propylene by using a metallocene catalyst. It is obtained by polymerization with 1-butene. For example, the amorphous propylene-(1-butene) copolymer can be subjected to a polymerization step of polymerizing propylene and 1-butene using a metallocene catalyst, a residual catalyst removal step after the polymerization step, and an impurity removal step. Obtained by the post-processing steps. The amorphous propylene-(1-butene) copolymer is obtained in the form of a powder, a granule or the like through these steps. Examples of the metallocene catalyst include a metallocene-supporting catalyst containing a metallocene compound and a metallocene uniformly mixed catalyst, and a particulate carrier on which a metallocene compound is supported.
如上所述地使用茂金屬觸媒經聚合而成之非晶丙烯-(1-丁烯)共聚物顯示較窄之分子量分佈。上述非晶丙烯-(1-丁烯)共聚物之分子量分佈(Mw/Mn)較佳為2以下,進而較佳為1.1~2,尤佳為1.2~1.9。分子量分佈較窄之非晶丙烯-(1-丁烯)共聚物中低分子量成分較少,因此若使用此種非晶丙烯-(1-丁烯)共聚物,則可得到可防止由於低分子量成分之滲出而污染被黏著體之黏著帶。此種黏著帶例如適宜用作半導體晶圓加工用。 The amorphous propylene-(1-butene) copolymer polymerized using a metallocene catalyst as described above exhibits a narrow molecular weight distribution. The molecular weight distribution (Mw/Mn) of the amorphous propylene-(1-butene) copolymer is preferably 2 or less, more preferably 1.1 to 2, still more preferably 1.2 to 1.9. The amorphous propylene-(1-butene) copolymer having a narrow molecular weight distribution has a small amount of low molecular weight components, so if such an amorphous propylene-(1-butene) copolymer is used, it can be prevented due to low molecular weight. The component oozes out and contaminates the adhesive tape of the adherend. Such an adhesive tape is suitably used, for example, for semiconductor wafer processing.
上述樹脂組合物較佳為進而包含結晶性樹脂。藉由使樹脂組合物中包含結晶性樹脂,可降低黏著劑層之黏著力(結果為上述黏著帶之黏著力)。上述結晶性樹脂較佳為結晶性α-烯烴系樹脂,更佳為具有來自1-丁烯之構成單元之結晶性之均聚物或共聚物,尤佳為結晶性丙烯-(1-丁烯)共聚物或結晶性乙烯-(1-丁烯)共聚物。該等結晶性樹脂可單獨使用或將2種以上組合使用。若使用具有來自1-丁烯之構成單元之結晶性樹脂,則可抑制由添加結晶性樹脂引起之黏著劑層之彈性模數上升(即抑制階差追隨性之降低),且可降低黏著劑層之黏著力。 The resin composition preferably further contains a crystalline resin. By including a crystalline resin in the resin composition, the adhesion of the adhesive layer can be lowered (resulting in the adhesive force of the above adhesive tape). The crystalline resin is preferably a crystalline α-olefin-based resin, more preferably a homopolymer or a copolymer having crystallinity derived from a constituent unit of 1-butene, and more preferably a crystalline propylene-(1-butene). a copolymer or a crystalline ethylene-(1-butene) copolymer. These crystalline resins may be used singly or in combination of two or more. When a crystalline resin having a constituent unit derived from 1-butene is used, it is possible to suppress an increase in the elastic modulus of the adhesive layer caused by the addition of the crystalline resin (that is, to suppress a decrease in step followability), and to lower the adhesive. The adhesion of the layers.
上述結晶性樹脂之結晶度較佳為10%以上,進而較佳為20%以上。結晶度代表性地可利用示差掃描熱量分析(DSC)或X射線繞射而求出。 The crystallinity of the crystalline resin is preferably 10% or more, and more preferably 20% or more. The degree of crystallinity can be representatively obtained by differential scanning calorimetry (DSC) or X-ray diffraction.
上述結晶性樹脂較佳為與上述非晶丙烯-(1-丁烯)共聚物同樣地藉 由使用茂金屬觸媒進行聚合而得到。若使用以此方式得到之結晶性樹脂,則可防止由於低分子量成分之滲出而污染被黏著體。 The crystalline resin is preferably borrowed in the same manner as the above amorphous propylene-(1-butene) copolymer. It is obtained by polymerization using a metallocene catalyst. When the crystalline resin obtained in this manner is used, it is possible to prevent the adherend from being contaminated by the bleeding of the low molecular weight component.
上述非晶丙烯-(1-丁烯)共聚物與上述結晶性樹脂之重量比(非晶丙烯-(1-丁烯)共聚物:結晶性樹脂)較佳為90:10~50:50,進而較佳為90:10~60:40,尤佳為90:10~70:30。若為此範圍,則可將黏著劑層之硬度(貯存模數)調節為適當之範圍,而可得到具有更適合保護半導體晶圓之黏著力與階差追隨性、且剝離性優異之黏著帶。 The weight ratio of the amorphous propylene-(1-butene) copolymer to the above crystalline resin (amorphous propylene-(1-butene) copolymer: crystalline resin) is preferably from 90:10 to 50:50. Further preferably, it is 90:10 to 60:40, and particularly preferably 90:10 to 70:30. If it is in this range, the hardness (storage modulus) of the adhesive layer can be adjusted to an appropriate range, and an adhesive tape which is more suitable for protecting the adhesion and step followability of the semiconductor wafer and having excellent peelability can be obtained. .
上述樹脂組合物中,來自1-丁烯之構成單元之合計含有比率為相對於樹脂組合物中之樹脂之總重量較佳為5重量%以上,進而較佳為5重量%~40重量%,更佳為5重量%~30重量%,尤佳為5重量%~10重量%,最佳為8重量%~10重量%。若為此範圍,則可將黏著劑層之硬度(貯存模數)調節為適當之範圍,而可得到具有更適合保護半導體晶圓之黏著力與階差追隨性、且剝離性優異之黏著帶。此種效果係藉由使樹脂組合物中包含具有來自1-丁烯之構成單元之結晶性樹脂、並將樹脂組合物中來自1-丁烯之構成單元之合計含有比率調整為上述範圍內而變得更加顯著。再者,於本說明書中,「樹脂組合物中來自1-丁烯之構成單元之合計含有比率」係指樹脂組合物中全部樹脂具有之來自1-丁烯之構成單元之合計含有比率。具體而言,於上述樹脂組合物中除非晶丙烯-(1-丁烯)共聚物以外亦包含具有來自1-丁烯之構成單元之結晶性樹脂(例如,結晶性丙烯-(1-丁烯)共聚物、結晶性乙烯-(1-丁烯)共聚物)的情形時,係指非晶丙烯-(1-丁烯)共聚物中來自1-丁烯之構成單元與結晶性樹脂中來自1-丁烯之構成單元的合計含有比率。 In the above resin composition, the total content of the constituent units derived from 1-butene is preferably 5% by weight or more, and more preferably 5% by weight to 40% by weight based on the total weight of the resin in the resin composition. More preferably, it is 5% by weight to 30% by weight, particularly preferably 5% by weight to 10% by weight, most preferably 8% by weight to 10% by weight. If it is in this range, the hardness (storage modulus) of the adhesive layer can be adjusted to an appropriate range, and an adhesive tape which is more suitable for protecting the adhesion and step followability of the semiconductor wafer and having excellent peelability can be obtained. . This effect is obtained by adjusting the total content ratio of the crystalline resin having a constituent unit derived from 1-butene and the constituent unit derived from 1-butene in the resin composition to the above range. It has become more prominent. In the present specification, the "total content ratio of the constituent units derived from 1-butene in the resin composition" means the total content ratio of the constituent units derived from 1-butene of all the resins in the resin composition. Specifically, in the above resin composition, a crystalline resin having a constituent unit derived from 1-butene (for example, crystalline propylene-(1-butene) is contained in addition to the crystalline propylene-(1-butene) copolymer. In the case of a copolymer or a crystalline ethylene-(1-butene) copolymer, it means that the constituent unit derived from 1-butene and the crystalline resin in the amorphous propylene-(1-butene) copolymer are derived from The total content ratio of the constituent units of 1-butene.
上述樹脂組合物於230℃、2.16kgf下之熔融流動速率較佳為1g/10分鐘~50g/10分鐘,進而較佳為5g/10分鐘~30g/10分鐘,尤佳為5g/10分鐘~20g/10分鐘。若上述樹脂組合物之熔融流動速率為此範圍,則可藉由共擠出成形而無加工不良地形成厚度均勻之黏著劑 層。熔融流動速率可利用依據JISK7210之方法進行測定。 The melt flow rate of the above resin composition at 230 ° C and 2.16 kgf is preferably from 1 g/10 min to 50 g/10 min, more preferably from 5 g/10 min to 30 g/10 min, and particularly preferably 5 g/10 min. 20g/10 minutes. If the melt flow rate of the above resin composition is in this range, an adhesive having a uniform thickness can be formed by co-extrusion molding without processing. Floor. The melt flow rate can be measured by the method according to JIS K7210.
上述黏著劑層於20℃下之貯存模數(G')較佳為2.0MPa以下,進而較佳為0.5MPa~2.0MPa,更佳為0.5MPa~1.8MPa,尤佳為0.5MPa~1.6MPa。若上述黏著劑層之貯存模數(G')為此範圍,則可得到適合保護半導體晶圓之階差追隨性。將此種本發明之黏著帶用於保護半導體晶圓時,可良好地填充半導體晶圓圖案之凹凸而可有助於達到半導體晶圓之背面研磨之優異研磨精度,且可防止研磨加工中由水之滲入引起之半導體晶圓之污染或破損。進而,若貯存模數(G')為上述範圍,則可得到黏著力及剝離性之平衡優異之黏著帶。更詳細而言,本發明之黏著帶即便黏著劑層之貯存模數(G')如上所述般較小,黏著力亦不變得過高,黏著力及剝離性之平衡優異。此種黏著帶於背面研磨中可充分地保護半導體晶圓之表面,並且可得到上述效果(優異之研磨精度、防止水滲入),進而於研磨加工後可容易地剝離且可防止半導體晶圓之破損。此種貯存模數(G')及黏著力均較低之黏著劑層例如可藉由如下方式而獲得:使上述樹脂組合物中包含具有來自1-丁烯之構成單元之結晶性樹脂而調整黏著劑層之黏著力,藉此抑制貯存模數(G')之上升並且降低黏著力。再者,本發明之貯存模數(G')可利用動態黏彈性光譜測定來進行測定。 The storage modulus (G') of the above adhesive layer at 20 ° C is preferably 2.0 MPa or less, more preferably 0.5 MPa to 2.0 MPa, still more preferably 0.5 MPa to 1.8 MPa, and particularly preferably 0.5 MPa to 1.6 MPa. . If the storage modulus (G') of the above adhesive layer is in this range, the step followability suitable for protecting the semiconductor wafer can be obtained. When the adhesive tape of the present invention is used for protecting a semiconductor wafer, the unevenness of the semiconductor wafer pattern can be well filled, which can contribute to the excellent polishing precision of the back surface polishing of the semiconductor wafer, and can prevent the polishing process from being Contamination or damage to the semiconductor wafer caused by the infiltration of water. Further, when the storage modulus (G') is in the above range, an adhesive tape excellent in balance between adhesion and peelability can be obtained. More specifically, the adhesive tape of the present invention has a small balance between the adhesive force and the peeling property even if the storage modulus (G') of the adhesive layer is small as described above, the adhesive force is not excessively high. Such an adhesive tape can sufficiently protect the surface of the semiconductor wafer in the back grinding, and the above effects (excellent polishing precision, prevention of water penetration) can be obtained, and can be easily peeled off after the polishing process and the semiconductor wafer can be prevented. damaged. Such an adhesive layer having a low storage modulus (G') and a low adhesive force can be obtained, for example, by adjusting a crystalline resin having a constituent unit derived from 1-butene in the above resin composition. The adhesion of the adhesive layer, thereby suppressing the rise in the storage modulus (G') and reducing the adhesion. Further, the storage modulus (G') of the present invention can be measured by dynamic viscoelastic spectroscopy.
上述黏著劑層於奈米壓痕儀壓入1000nm時之壓痕硬度較佳為0.8MPa以上,進而較佳為0.8MPa~3.5MPa,尤佳為0.8MPa~3.0MPa,最佳為0.8MPa~1.5MPa。若為此範圍,則可得到具有適合保護半導體晶圓之黏著力、剝離性及階差追隨性之黏著帶。更具體而言,若奈米壓痕儀壓入1000nm時之壓痕硬度為0.8MPa以上,則可防止黏著帶追隨並牢固地貼附至晶圓表面之極微小之凹凸(例如,PI(Polyimide,聚醯亞胺)保護膜、電路圖案等之奈米級凹凸),而可得到剝離性優異之黏著帶。上述黏著劑層尤佳為貯存模數(G')處於上 述範圍,且於奈米壓痕儀壓入1000nm時之壓痕硬度處於上述範圍。根據本發明,可得到黏著劑層整體較為柔軟、但黏著劑層之表面相對較硬之黏著帶。具備此種黏著劑層之黏著帶具有適合保護半導體晶圓之階差追隨性及黏著力。再者,由奈米壓痕儀獲得之硬度可使用奈米壓痕儀(例如HYSITRON公司製造)進行測定。 The indentation hardness of the above adhesive layer when pressed into the nanometer indenter by 1000 nm is preferably 0.8 MPa or more, further preferably 0.8 MPa to 3.5 MPa, particularly preferably 0.8 MPa to 3.0 MPa, and most preferably 0.8 MPa. 1.5MPa. If it is this range, an adhesive tape which is suitable for protecting the adhesion, peeling property, and step followability of a semiconductor wafer can be obtained. More specifically, if the indentation hardness of the nanoindenter pressed at 1000 nm is 0.8 MPa or more, it is possible to prevent the adhesive tape from following and firmly adhering to the minute unevenness of the wafer surface (for example, PI (Polyimide, Polyimide (protective film, nano-scale irregularities such as circuit patterns), and an adhesive tape excellent in peelability can be obtained. The above adhesive layer is particularly preferably a storage modulus (G') The range is described, and the indentation hardness when the nanoindenter is pressed into 1000 nm is in the above range. According to the present invention, an adhesive tape in which the entire adhesive layer is relatively soft but the surface of the adhesive layer is relatively hard can be obtained. The adhesive tape having such an adhesive layer has a step followability and adhesion suitable for protecting the semiconductor wafer. Further, the hardness obtained by the nanoindenter can be measured using a nanoindenter (for example, manufactured by HYSITRON Co., Ltd.).
較佳為,上述黏著劑層實質上不包含F-、Cl-、Br-、NO2 -、NO3 -、SO4 2-、Li+、Na+、K+、Mg2+、Ca2+、NH4+。其原因在於可防止該離子污染被黏著體。具備此種黏著劑層之黏著帶例如於用於半導體晶圓加工用之情形時,不產生電路之斷線或短路等。不包含上述離子之黏著劑層例如,可藉由如上所述般使用茂金屬觸媒使該黏著劑層中所包含之非晶丙烯-(1-丁烯)共聚物進行溶液聚合而得到。於使用該茂金屬觸媒之溶液聚合中,非晶丙烯-(1-丁烯)共聚物可使用與聚合溶劑不同之不良溶劑重複進行析出分離(再沈澱法)而進行提純,因此可得到不包含上述離子之黏著劑層。再者,於本說明書中,所謂「實質上不包含F-、Cl-、Br-、NO2 -、NO3 -、SO4 2-、Li+、Na+、K+、Mg2+、Ca2+、NH4 +」,係指於標準之離子色譜分析(例如,使用Dionex公司製造、商品名「DX-320」、「DX-500」之離子色譜分析)中未達檢測極限。具體而言係指如下情形:相對於1g黏著劑層,F-、Cl-、Br-、NO2 -、NO3 -、SO4 2-及K+分別為0.49μg以下,Li+及Na+分別為0.20μg以下,Mg2+及Ca2+分別為0.97μg以下,NH4 +為0.5μg以下。 Preferably, the adhesive layer does not substantially contain F - , Cl - , Br - , NO 2 - , NO 3 - , SO 4 2- , Li + , Na + , K + , Mg 2+ , Ca 2+ , NH 4+ . The reason for this is that the ion can be prevented from contaminating the adherend. When the adhesive tape having such an adhesive layer is used for processing a semiconductor wafer, for example, disconnection or short circuit of the circuit is not caused. The adhesive layer not containing the above ions can be obtained, for example, by solution polymerization of an amorphous propylene-(1-butene) copolymer contained in the adhesive layer by using a metallocene catalyst as described above. In the solution polymerization using the metallocene catalyst, the amorphous propylene-(1-butene) copolymer can be purified by repeating precipitation separation (reprecipitation method) using a poor solvent different from the polymerization solvent, so that no An adhesive layer containing the above ions. In addition, in the present specification, "substantially does not include F - , Cl - , Br - , NO 2 - , NO 3 - , SO 4 2 -, Li + , Na + , K + , Mg 2+ , Ca 2+ , NH 4 + ” means that the detection limit is not reached in standard ion chromatography (for example, ion chromatography using Dionex, trade name “DX-320” or “DX-500”). Specifically, it means a case where F - , Cl - , Br - , NO 2 - , NO 3 - , SO 4 2- and K + are respectively 0.49 μg or less, Li + and Na + with respect to 1 g of the adhesive layer. Each is 0.20 μg or less, and Mg 2+ and Ca 2+ are each 0.97 μg or less, and NH 4 + is 0.5 μg or less.
上述黏著劑層進而可於不損害本發明之效果之範圍內包含其他成分。作為該其他成分,例如可列舉:抗氧化劑、紫外線吸收劑、光穩定劑、耐熱穩定劑、抗靜電劑等。其他成分之種類及用量可根據目的而適當地選擇。 The above adhesive layer may further contain other components within a range not impairing the effects of the present invention. Examples of the other component include an antioxidant, an ultraviolet absorber, a light stabilizer, a heat stabilizer, and an antistatic agent. The kind and amount of other ingredients can be appropriately selected depending on the purpose.
C.基材層 C. substrate layer
上述基材層可由任意適當之樹脂而形成。較佳為可共擠出成形 之熱塑性樹脂,例如可列舉聚乙烯系樹脂。作為聚乙烯系樹脂之具體例,可列舉:乙烯-乙酸乙烯酯共聚物(EVA)、乙烯-丙烯酸乙酯共聚物(EEA)、乙烯-甲基丙烯酸共聚物(EMA)、苯乙烯-乙烯-丁烯-苯乙烯嵌段聚合物(SEBS)、高分子量聚乙烯(HDPE)、低分子量聚乙烯(LDPE)、直鏈狀低分子量聚乙烯(LLDPE)、高密度聚乙烯、低密度聚乙烯等。 The above substrate layer may be formed of any suitable resin. Preferably coextrudable The thermoplastic resin is, for example, a polyethylene resin. Specific examples of the polyethylene-based resin include ethylene-vinyl acetate copolymer (EVA), ethylene-ethyl acrylate copolymer (EEA), ethylene-methacrylic acid copolymer (EMA), and styrene-ethylene- Butylene-styrene block polymer (SEBS), high molecular weight polyethylene (HDPE), low molecular weight polyethylene (LDPE), linear low molecular weight polyethylene (LLDPE), high density polyethylene, low density polyethylene, etc. .
上述乙烯-乙酸乙烯酯共聚物之重量平均分子量(Mw)較佳為10,000~200,000,進而較佳為30,000~190,000。若乙烯-乙酸乙烯酯共聚物之重量平均分子量(Mw)處於此範圍,則可於共擠出成形時無加工不良地形成基材層。 The weight average molecular weight (Mw) of the above ethylene-vinyl acetate copolymer is preferably from 10,000 to 200,000, more preferably from 30,000 to 190,000. When the weight average molecular weight (Mw) of the ethylene-vinyl acetate copolymer is in this range, the base material layer can be formed without processing at the time of co-extrusion molding.
形成上述基材層之樹脂於190℃、2.16kgf下之熔融流動速率較佳為2g/10分鐘~20g/10分鐘,進而較佳為5g/10分鐘~15g/10分鐘,尤佳為7g/10分鐘~12g/10分鐘。若乙烯-乙酸乙烯酯共聚物之熔融流動速率處於此範圍,則可藉由共擠出成形而無加工不良地形成基材層。 The melt flow rate of the resin forming the substrate layer at 190 ° C and 2.16 kgf is preferably 2 g/10 min to 20 g/10 min, more preferably 5 g/10 min to 15 g/10 min, and particularly preferably 7 g / 10 minutes~12g/10 minutes. When the melt flow rate of the ethylene-vinyl acetate copolymer is in this range, the base material layer can be formed by co-extrusion molding without processing.
上述基材層進而可於不損害本發明之效果之範圍內包含其他成分。作為該其他成分,例如可使用與上述B項中所說明之黏著劑層可包含之其他成分相同者。 The base material layer may further contain other components within a range that does not impair the effects of the present invention. As the other component, for example, the same components as those which may be included in the adhesive layer described in the above item B can be used.
D.黏著帶之製造方法 D. Manufacturing method of adhesive tape
本發明之黏著帶較佳為將上述黏著劑層及上述基材層之形成材料共擠出成形而製造。藉由共擠出成形,可以較少之步驟數且不使用有機溶劑而製造層間之接著性良好之黏著帶。再者,於本說明書中,所謂「黏著劑層之形成材料(黏著劑層形成材料)」係指上述樹脂組合物與上述其他成分之混合物。 The adhesive tape of the present invention is preferably produced by co-extruding a material for forming the pressure-sensitive adhesive layer and the base material layer. By co-extrusion molding, an adhesive tape having good adhesion between layers can be produced with a small number of steps and without using an organic solvent. In the present specification, the term "forming material (adhesive layer forming material) of the adhesive layer" means a mixture of the above resin composition and the above other components.
於上述共擠出成形中,上述黏著劑層及上述基材層之形成材料可使用以任意適當之方法將上述各層之成分混合而成之材料。 In the above coextrusion molding, a material obtained by mixing the components of the above layers by any appropriate method may be used as the material for forming the pressure-sensitive adhesive layer and the base material layer.
作為上述共擠出成形之具體方法,例如可列舉如下者:於連接於模嘴之至少2台擠出機中,分別向1台供給黏著劑層形成材料,向另一台供給基材層形成材料,熔融後擠出並藉由接觸輥成形法進行抽取,而成形積層體。擠出時,各形成材料合流之部分越靠近模嘴出口(模唇)越佳。其原因在於:於模嘴內各形成材料難以發生合流不良。因此,作為上述模嘴,較佳地使用多歧管形式之模嘴。再者,發生合流不良之情形時,產生合流不均等外觀不良,具體而言為於被擠出之黏著劑層與基材層之間產生波狀之外觀不均,欠佳。又,合流不良係例如由於不同種形成材料於模嘴內之流動性(熔融黏度)之差大、以及各層之形成材料之剪切速度之差較大而產生,因此若使用多歧管形式之模嘴,則對於具有流動性差之不同種形成材料,與其他形式(例如,進料模組形式)相比材料之選擇範圍擴寬。用於各形成材料之熔融之擠出機之螺桿類型可為單螺桿或雙螺桿。擠出機亦可為3台以上。擠出機為3台以上之情形時,進而可供給其它層之形成材料。又,使用3台以上之擠出機製造2層構造(基材層+黏著劑層)之黏著帶之情形時,向相鄰之2台以上之擠出機供給同一種形成材料即可,例如於使用3台擠出機之情形時,可向相鄰之2台擠出機供給同一種形成材料。 As a specific method of the above-described co-extrusion molding, for example, in at least two extruders connected to a die, one of the adhesive layer forming materials is supplied to one, and the other base material layer is formed. The material was melted, extruded, and drawn by a contact roll forming method to form a laminate. When extruding, the portion where the respective forming materials merge is closer to the nozzle outlet (mould lip). The reason for this is that it is difficult to cause a poor joining force in each of the forming materials in the nozzle. Therefore, as the above-mentioned nozzle, a nozzle in the form of a multi-manifold is preferably used. Further, in the case where the merging failure occurs, the appearance unevenness such as merging unevenness occurs, and specifically, the appearance of the wavy appearance between the extruded adhesive layer and the substrate layer is uneven, which is not preferable. Further, the merging failure occurs, for example, because the difference in fluidity (melt viscosity) between the different kinds of material forming materials in the nozzle and the difference in the shear rate of the material forming the layers are large, so that the manifold type is used. The die mouth is wider for a different material forming material having a poor fluidity than other forms (for example, a feed module form). The type of screw used for the extruder for melting each of the formed materials may be a single screw or a twin screw. The extruder can also be three or more. When the number of extruders is three or more, the material for forming the other layers can be supplied. Further, when three or more extruders are used to produce an adhesive tape having a two-layer structure (base material layer + adhesive layer), the same forming material may be supplied to two or more adjacent extruders, for example, for example. In the case of using three extruders, the same forming material can be supplied to two adjacent extruders.
上述共擠出成形之成形溫度較佳為160℃~220℃,進而較佳為170℃~200℃。若為此範圍,則成形穩定性優異。 The forming temperature of the above coextrusion molding is preferably from 160 ° C to 220 ° C, more preferably from 170 ° C to 200 ° C. If it is this range, it is excellent in shaping|molding stability.
上述黏著劑層形成材料與上述基材層形成材料於溫度180℃、剪切速度100sec-1下之剪切黏度之差(黏著劑形成材料-基材層形成材料)較佳為-150Pa.s~600Pa.s以下,進而較佳為-100Pa.s~550Pa.s,尤佳為-50Pa.s~500Pa.s。若處於此範圍,則可使上述黏著劑形成材料及基材層形成材料於模嘴內之流動性相接近而防止發生合流不良。再者,剪切黏度可利用雙毛細管型之伸長黏度計進行測定。 The difference between the adhesive layer forming material and the base material forming material at a temperature of 180 ° C and a shear rate of 100 sec -1 (adhesive forming material - base material forming material) is preferably -150 Pa. s~600Pa. s is below, and further preferably -100 Pa. s~550Pa. s, especially good for -50Pa. s~500Pa. s. When it is in this range, the fluidity of the adhesive forming material and the base material layer forming material in the nozzle can be made close to each other, and the occurrence of merging failure can be prevented. Further, the shear viscosity can be measured by a double capillary type elongational viscometer.
以下,藉由實施例對本發明進行具體說明,但本發明不受該等實施例任何限制。再者,實施例等中之試驗及評價方法係如下所述。又,份係指重量份。 Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited by the examples. Further, the test and evaluation methods in the examples and the like are as follows. Further, the parts are parts by weight.
作為黏著劑層形成材料,使用包含90份利用茂金屬觸媒經聚合而成之非晶丙烯-(1-丁烯)共聚物(住友化學公司製造,商品名「Tafthren H5002」,來自1-丁烯之構成單元:2重量%)、及10份結晶性丙烯-(1-丁烯)共聚物(三井化學公司製造,商品名「TAFMER XM7070」,來自1-丁烯之構成單元:34重量%)的樹脂組合物(樹脂組合物中來自1-丁烯之構成單元之合計含有比率:5.2重量%)。 As the adhesive layer forming material, an amorphous propylene-(1-butene) copolymer obtained by polymerizing using a metallocene catalyst (manufactured by Sumitomo Chemical Co., Ltd., trade name "Tafthren H5002", from 1-butyl is used. The constituent unit of the olefin: 2% by weight), and 10 parts of the crystalline propylene-(1-butene) copolymer (manufactured by Mitsui Chemicals, Inc., trade name "TAFMER XM7070", constituent unit derived from 1-butene: 34% by weight Resin composition (total content ratio of constituent units derived from 1-butene in the resin composition: 5.2% by weight).
作為基材層形成材料,使用乙烯-乙酸乙烯酯共聚物(三井杜邦公司製造,商品名「EVAFLEX P-1007」)。 As the base material forming material, an ethylene-vinyl acetate copolymer (manufactured by Mitsui DuPont, trade name "EVAFLEX P-1007") was used.
將上述黏著劑形成材料與基材層形成材料投入至各自之擠出機中,進行T型模嘴熔融共擠出(擠出機:GM Engineering公司製造,商品名「GM30-28」/T型模嘴:進料模組方式;擠出溫度180℃),將熔融狀態之樹脂與向接觸輥成形部通紙之Si塗佈PET隔片(三菱化學公司製造,商品名「Diafoil MRF」:38μm)積層,此後進行冷卻,得到黏著劑層之厚度為30μm、基材層之厚度為100μm的黏著帶。其中,各層之厚度藉由T型模嘴出口之形狀進行控制。 The adhesive forming material and the base layer forming material were placed in respective extruders, and T-die melt co-extrusion was performed (extruder: GM Engineering, trade name "GM30-28" / T type Mold nozzle: feed module method; extrusion temperature: 180 ° C), a molten PET resin and a Si coated PET separator that is passed through the contact roll forming section (Mitsubishi Chemical Co., Ltd., trade name "Diafoil MRF": 38 μm The laminate was laminated, and thereafter, cooling was carried out to obtain an adhesive tape having a thickness of the adhesive layer of 30 μm and a thickness of the substrate layer of 100 μm. The thickness of each layer is controlled by the shape of the T-die nozzle outlet.
作為黏著劑層形成材料,使用包含80份利用茂金屬觸媒經聚合而成之非晶丙烯-(1-丁烯)共聚物(住友化學公司製造,商品名「Tafthren H5002」,來自1-丁烯之構成單元:2重量%)、及20份結晶性丙烯-(1-丁烯)共聚物(三井化學公司製造,商品名「TAFMER XM7070」,來自1-丁烯之構成單元:34重量%)的樹脂組合物(樹脂組 合物中來自1-丁烯之構成單元之合計含有比率:8.4重量%),除此以外,以與實施例1同樣之方式得到黏著帶。 As the adhesive layer forming material, 80 parts of an amorphous propylene-(1-butene) copolymer polymerized by a metallocene catalyst (manufactured by Sumitomo Chemical Co., Ltd., trade name "Tafthren H5002", from 1-butyl is used. The constituent unit of the olefin: 2% by weight), and 20 parts of the crystalline propylene-(1-butene) copolymer (manufactured by Mitsui Chemicals, Inc., trade name "TAFMER XM7070", constituent unit derived from 1-butene: 34% by weight Resin composition (resin group) An adhesive tape was obtained in the same manner as in Example 1 except that the total content of the constituent units derived from 1-butene was 8.4% by weight.
作為黏著劑層形成材料,使用包含70份利用茂金屬觸媒經聚合而成之非晶丙烯-(1-丁烯)共聚物(住友化學公司製造,商品名「Tafthren H5002」,來自1-丁烯之構成單元:2重量%)、及30份結晶性丙烯-(1-丁烯)共聚物(三井化學公司製造,商品名「TAFMER XM7070」,來自1-丁烯之構成單元:34重量%)的樹脂組合物(樹脂組合物中來自1-丁烯之構成單元之合計含有比率:11.6重量%),使黏著劑層之厚度為45μm,使基材層之厚度為160μm,除此以外,以與實施例1同樣之方式得到黏著帶。 As the adhesive layer forming material, 70 parts of an amorphous propylene-(1-butene) copolymer polymerized by a metallocene catalyst (manufactured by Sumitomo Chemical Co., Ltd., trade name "Tafthren H5002", from 1-butyl is used. A constituent unit of an olefin: 2% by weight), and 30 parts of a crystalline propylene-(1-butene) copolymer (manufactured by Mitsui Chemicals, Inc., trade name "TAFMER XM7070", constituent unit derived from 1-butene: 34% by weight In addition, the resin composition (the total content ratio of the constituent units derived from 1-butene in the resin composition: 11.6% by weight) has a thickness of the adhesive layer of 45 μm and a thickness of the base material layer of 160 μm. An adhesive tape was obtained in the same manner as in Example 1.
作為黏著劑層形成材料,使用包含60份利用茂金屬觸媒經聚合而成之非晶丙烯-(1-丁烯)共聚物(住友化學公司製造,商品名「Tafthren H5002」,來自1-丁烯之構成單元:2重量%)、及40份結晶性丙烯-(1-丁烯)共聚物(三井化學公司製造,商品名「TAFMER XM7070」,來自1-丁烯之構成單元:34重量%)的樹脂組合物(樹脂組合物中來自1-丁烯之構成單元之合計含有比率:14.8重量%),使黏著劑層之厚度為45μm,使基材層之厚度為160μm,除此以外,以與實施例1同樣之方式得到黏著帶。 As the adhesive layer forming material, 60 parts of an amorphous propylene-(1-butene) copolymer polymerized by a metallocene catalyst (manufactured by Sumitomo Chemical Co., Ltd., trade name "Tafthren H5002", from 1-butyl is used. A constituent unit of an olefin: 2% by weight), and 40 parts of a crystalline propylene-(1-butene) copolymer (manufactured by Mitsui Chemicals, Inc., trade name "TAFMER XM7070", a constituent unit derived from 1-butene: 34% by weight In addition, the resin composition (the total content ratio of the constituent units derived from 1-butene in the resin composition: 14.8% by weight) has a thickness of the adhesive layer of 45 μm and a thickness of the base material layer of 160 μm. An adhesive tape was obtained in the same manner as in Example 1.
作為黏著劑層形成材料,使用包含80份利用茂金屬觸媒經聚合而成之非晶丙烯-(1-丁烯)共聚物(住友化學公司製造,商品名「Tafthren H5002」,來自1-丁烯之構成單元:2重量%)、及20份結晶性乙烯-(1-丁烯)共聚物(三井化學公司製造,商品名「TAFMER BL3450」,來自1-丁烯之構成單元:87重量%)的樹脂組合物(樹脂組合 物中來自1-丁烯之構成單元之合計含有比率:19重量%),使黏著劑層之厚度為45μm,使基材層之厚度為160μm,除此以外,以與實施例1同樣之方式得到黏著帶。 As the adhesive layer forming material, 80 parts of an amorphous propylene-(1-butene) copolymer polymerized by a metallocene catalyst (manufactured by Sumitomo Chemical Co., Ltd., trade name "Tafthren H5002", from 1-butyl is used. The constituent unit of the olefin: 2% by weight), and 20 parts of the crystalline ethylene-(1-butene) copolymer (manufactured by Mitsui Chemicals, Inc., trade name "TAFMER BL3450", constituent unit derived from 1-butene: 87% by weight Resin composition (resin combination) In the same manner as in Example 1, except that the total content of the constituent units derived from 1-butene was 19% by weight, and the thickness of the adhesive layer was 45 μm, and the thickness of the base material layer was 160 μm. Get an adhesive tape.
作為黏著劑層形成材料,使用包含70份利用茂金屬觸媒經聚合而成之非晶丙烯-(1-丁烯)共聚物(住友化學公司製造,商品名「Tafthren H5002」,來自1-丁烯之構成單元:2重量%)、及30份結晶性乙烯-(1-丁烯)共聚物(三井化學公司製造,商品名「TAFMER BL3450」,來自1-丁烯之構成單元:87重量%)的樹脂組合物(樹脂組合物中來自1-丁烯之構成單元之合計含有比率:27.5重量%),除此以外,以與實施例1同樣之方式得到黏著帶。 As the adhesive layer forming material, 70 parts of an amorphous propylene-(1-butene) copolymer polymerized by a metallocene catalyst (manufactured by Sumitomo Chemical Co., Ltd., trade name "Tafthren H5002", from 1-butyl is used. The constituent unit of the olefin: 2% by weight), and 30 parts of a crystalline ethylene-(1-butene) copolymer (manufactured by Mitsui Chemicals, Inc., trade name "TAFMER BL3450", constituent unit derived from 1-butene: 87% by weight An adhesive tape was obtained in the same manner as in Example 1 except that the resin composition (the total content ratio of the constituent units derived from 1-butene in the resin composition: 27.5 wt%) was used.
作為黏著劑層形成材料,使用包含60份利用茂金屬觸媒經聚合而成之非晶丙烯-(1-丁烯)共聚物(住友化學公司製造,商品名「Tafthren H5002」,來自1-丁烯之構成單元:2重量%)、及40份結晶性乙烯-(1-丁烯)共聚物(三井化學公司製造,商品名「TAFMER BL3450」,來自1-丁烯之構成單元:87重量%)的樹脂組合物(樹脂組合物中來自1-丁烯之構成單元之合計含有比率:36重量%),除此以外,以與實施例1同樣之方式得到黏著帶。 As the adhesive layer forming material, 60 parts of an amorphous propylene-(1-butene) copolymer polymerized by a metallocene catalyst (manufactured by Sumitomo Chemical Co., Ltd., trade name "Tafthren H5002", from 1-butyl is used. The constituent unit of the olefin: 2% by weight), and 40 parts of the crystalline ethylene-(1-butene) copolymer (manufactured by Mitsui Chemicals, Inc., trade name "TAFMER BL3450", constituent unit derived from 1-butene: 87% by weight An adhesive tape was obtained in the same manner as in Example 1 except that the resin composition (the total content ratio of the constituent units derived from 1-butene in the resin composition: 36% by weight) was used.
作為黏著劑層形成材料,使用包含100份利用茂金屬觸媒經聚合而成之非晶丙烯-(1-丁烯)共聚物(住友化學公司製造,商品名「Tafthren H5002」,來自1-丁烯之構成單元:2重量%)的樹脂組合物(樹脂組合物中來自1-丁烯之構成單元之合計含有比率:2重量%),除此以外,以與實施例1同樣之方式得到黏著帶。 As the adhesive layer forming material, an amorphous propylene-(1-butene) copolymer obtained by polymerization using 100 parts of a metallocene catalyst (manufactured by Sumitomo Chemical Co., Ltd., trade name "Tafthren H5002", from 1-butyl is used. Adhesive in the same manner as in Example 1 except that the resin composition (2% by weight) of the resin composition (the total content of the constituent units derived from 1-butene in the resin composition: 2% by weight) was used. band.
作為黏著劑層形成材料,使用包含90份利用茂金屬觸媒經聚合而成之非晶丙烯-(1-丁烯)共聚物(住友化學公司製造,商品名「Tafthren H5002」,來自1-丁烯之構成單元:2重量%)、及10份利用茂金屬觸媒經聚合而成之結晶性聚丙烯系樹脂(Japan Polypropylene公司製造,商品名「WINTEC WFX4」)的樹脂組合物(樹脂組合物中來自1-丁烯之構成單元之合計含有比率:1.8重量%),除此以外,以與實施例1同樣之方式得到黏著帶。 As the adhesive layer forming material, an amorphous propylene-(1-butene) copolymer obtained by polymerizing using a metallocene catalyst (manufactured by Sumitomo Chemical Co., Ltd., trade name "Tafthren H5002", from 1-butyl is used. A resin composition (resin composition) of a crystalline polypropylene resin (manufactured by Japan Polypropylene Co., Ltd., trade name "WINTEC WFX4") obtained by polymerization of a metallocene catalyst (2% by weight) An adhesive tape was obtained in the same manner as in Example 1 except that the total content of the constituent units derived from 1-butene was 1.8% by weight.
作為黏著劑層形成材料,使用包含80份利用茂金屬觸媒經聚合而成之非晶丙烯-(1-丁烯)共聚物(住友化學公司製造,商品名「Tafthren H5002」,來自1-丁烯之構成單元:2重量%)、及20份利用茂金屬觸媒經聚合而成之結晶性聚丙烯系樹脂(Japan Polypropylene公司製造,商品名「WINTEC WFX4」)的樹脂組合物(樹脂組合物中來自1-丁烯之構成單元之合計含有比率:1.6重量%),除此以外,以與實施例1同樣之方式得到黏著帶。 As the adhesive layer forming material, 80 parts of an amorphous propylene-(1-butene) copolymer polymerized by a metallocene catalyst (manufactured by Sumitomo Chemical Co., Ltd., trade name "Tafthren H5002", from 1-butyl is used. A resin composition (resin composition) of a crystalline polypropylene resin (manufactured by Japan Polypropylene Co., Ltd., trade name "WINTEC WFX4") obtained by polymerization of a metallocene catalyst (2% by weight) An adhesive tape was obtained in the same manner as in Example 1 except that the total content of the constituent units derived from 1-butene was 1.6% by weight.
作為黏著劑層形成材料,使用包含70份利用茂金屬觸媒經聚合而成之非晶丙烯-(1-丁烯)共聚物(住友化學公司製造,商品名「Tafthren H5002」,來自1-丁烯之構成單元:2重量%)、及30份利用茂金屬觸媒經聚合而成之結晶性聚丙烯系樹脂(Japan Polypropylene公司製造,商品名「WINTEC WFX4」)的樹脂組合物(樹脂組合物中來自1-丁烯之構成單元之合計含有比率:1.4重量%),除此以外,以與實施例1同樣之方式得到黏著帶。 As the adhesive layer forming material, 70 parts of an amorphous propylene-(1-butene) copolymer polymerized by a metallocene catalyst (manufactured by Sumitomo Chemical Co., Ltd., trade name "Tafthren H5002", from 1-butyl is used. A resin composition (resin composition) of a crystalline polypropylene resin (manufactured by Japan Polypropylene Co., Ltd., trade name "WINTEC WFX4") obtained by polymerizing a metallocene catalyst by polymerization of 2% by weight) An adhesive tape was obtained in the same manner as in Example 1 except that the total content of the constituent units derived from 1-butene was 1.4% by weight.
將實施例及比較例中得到之黏著帶供於以下之評價。將結果示於表1。 The adhesive tapes obtained in the examples and the comparative examples were subjected to the following evaluations. The results are shown in Table 1.
(1)壓痕硬度 (1) Indentation hardness
黏著劑層之壓痕硬度係使用奈米壓痕儀(HYSITRON公司製造),於室溫25℃之環境下將三角錐型壓頭對黏著劑表面以速度100nm/秒壓入1000nm,根據此時之荷重μN(Pmax)利用下式算出。 The indentation hardness of the adhesive layer was measured by using a nanoindenter (manufactured by HYSITRON Co., Ltd.) at a room temperature of 25 ° C to press the triangular pyramid indenter against the surface of the adhesive at a speed of 100 nm/sec to 1000 nm. The load μN (Pmax) was calculated by the following formula.
壓痕硬度=(Pmax)/A;接觸投影面積 Indentation hardness = (Pmax) / A; contact projected area
(2)貯存模數(G') (2) Storage modulus (G')
黏著劑層於20℃下之貯存模數可使用動態光譜測定器(Rheometric Scientific公司製造,商品名「ARES」),以頻率10Hz、升溫速度5℃/分鐘於-50℃~100℃之範圍內進行測定。 The storage modulus of the adhesive layer at 20 ° C can be measured by a dynamic spectrometer (manufactured by Rheometric Scientific, trade name "ARES") at a frequency of 10 Hz, a temperature increase rate of 5 ° C / min, and a range of -50 ° C to 100 ° C. The measurement was carried out.
(3)黏著力(對矽) (3) Adhesion (opposite)
利用依據JIS Z 0237(2000)之方法(貼合條件:2kg輥往復1次、剝離速度:300mm/分鐘、剝離角度:180°)測定所得之黏著帶對4英吋半導體晶圓之鏡面面(矽製)的黏著力。 The obtained adhesive tape was measured on the mirror surface of the 4-inch semiconductor wafer by the method according to JIS Z 0237 (2000) (adhesion conditions: 1 kg roller reciprocating once, peeling speed: 300 mm/min, peeling angle: 180°) The adhesion of the system.
(4)黏著力(對聚醯亞胺) (4) Adhesion (for polyimine)
利用依據JIS Z 0237(2000)之方法(貼合條件:2kg輥往復1次、剝離速度:300mm/分鐘、剝離角度:180°)測定所得之黏著帶對聚醯亞胺塗層晶圓之聚醯亞胺塗層面的黏著力。 The adhesive tape on the polyimine coated wafer was measured by the method according to JIS Z 0237 (2000) (adhesion conditions: 1 kg roller reciprocating once, peeling speed: 300 mm/min, peeling angle: 180°) The adhesion of the bismuth imide coated surface.
(5)階差追隨性(浮起寬度) (5) Step followability (floating width)
於8英吋半導體晶圓(矽製)上放置厚度30μm、寬度2cm之鋁板。以橫穿過該鋁板之方式使用帶貼附裝置DR-3000II(日東精機股份有限公司製造)貼附黏著帶,利用顯微鏡觀察相對於階差30μm之浮起寬度,並進行測定。 An aluminum plate having a thickness of 30 μm and a width of 2 cm was placed on a 8-inch semiconductor wafer. The adhesive tape was attached to the aluminum plate by means of a tape attachment device DR-3000II (manufactured by Nitto Seiki Co., Ltd.), and the floating width with respect to a step of 30 μm was observed with a microscope and measured.
(6)剝離性 (6) Stripping
將黏著帶貼附於8英吋半導體晶圓(矽製)上,使用背面研磨裝置DFG 8560(DISCO股份有限公司製造)研磨至100μm後,使用帶剝離裝置MA 3000III(日東精機股份有限公司)進行帶剝離。將可1次剝離者記 作○,將無法剝離者記作×,進行評價。 The adhesive tape was attached to a 8-inch semiconductor wafer (manufactured by Nippon Seiki Co., Ltd.) using a back-grinding device DFG 8560 (manufactured by DISCO Co., Ltd.) and ground to 100 μm. Stripped. Will be able to peel off once ○, the person who could not be peeled off was denoted by ×, and the evaluation was performed.
根據實施例可明確,根據本案發明,可得到一種黏著力與剝離性之平衡及階差追隨性優異之黏著帶。 According to the embodiment, it is clear that according to the present invention, an adhesive tape having excellent balance of adhesion and peelability and excellent step followability can be obtained.
本發明之黏著帶例如可適宜地用於保護半導體裝置製造時之工件(半導體晶圓等)。 The adhesive tape of the present invention can be suitably used, for example, to protect a workpiece (semiconductor wafer or the like) at the time of manufacture of a semiconductor device.
10‧‧‧黏著劑層 10‧‧‧Adhesive layer
20‧‧‧基材層 20‧‧‧Substrate layer
100‧‧‧黏著帶 100‧‧‧Adhesive tape
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JP5959240B2 (en) * | 2012-03-12 | 2016-08-02 | 日東電工株式会社 | Adhesive sheet |
JP2017066395A (en) * | 2015-09-30 | 2017-04-06 | 東レ株式会社 | Laminate |
JP7017334B2 (en) * | 2017-04-17 | 2022-02-08 | 日東電工株式会社 | Dicing die bond film |
KR20210145135A (en) * | 2019-03-26 | 2021-12-01 | 디아이씨 가부시끼가이샤 | Adhesive, method of assembling the adhesive, and method of disassembling the adhesive |
TW202140713A (en) * | 2020-04-22 | 2021-11-01 | 日商日東電工股份有限公司 | Adhesive sheet having both step-following properties and peelability |
JP2022116798A (en) * | 2021-01-29 | 2022-08-10 | 日東電工株式会社 | Adhesive sheet for electronic component transfer and method for processing electronic component using adhesive sheet for electronic component transfer |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4393934B2 (en) * | 2004-06-23 | 2010-01-06 | リンテック株式会社 | Adhesive sheet for semiconductor processing |
JP2006299060A (en) * | 2005-04-20 | 2006-11-02 | Sumitomo Chemical Co Ltd | Polypropylene-based drawing adhesive film |
JP2008087169A (en) * | 2006-09-29 | 2008-04-17 | Sumitomo Chemical Co Ltd | Pressure-sensitive adhesive film and its manufacturing method |
JP2008208173A (en) * | 2007-02-23 | 2008-09-11 | Nitto Denko Corp | Surface protecting sheet |
JP5184161B2 (en) * | 2008-03-17 | 2013-04-17 | 古河電気工業株式会社 | Semiconductor processing tape |
JP2011178879A (en) * | 2010-03-01 | 2011-09-15 | Nitto Denko Corp | Protective sheet and use thereof |
JP5685118B2 (en) * | 2011-03-17 | 2015-03-18 | 日東電工株式会社 | Adhesive tape |
JP5970191B2 (en) * | 2012-01-13 | 2016-08-17 | 日東電工株式会社 | Adhesive tape |
-
2012
- 2012-02-13 JP JP2012028150A patent/JP2013163775A/en active Pending
-
2013
- 2013-01-18 TW TW102102121A patent/TW201343850A/en unknown
- 2013-02-06 CN CN2013100485031A patent/CN103242751A/en active Pending
Also Published As
Publication number | Publication date |
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JP2013163775A (en) | 2013-08-22 |
CN103242751A (en) | 2013-08-14 |
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