TW201342500A - Clip supplying apparatus for clip bonder, and clip bonder having the same - Google Patents

Clip supplying apparatus for clip bonder, and clip bonder having the same Download PDF

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Publication number
TW201342500A
TW201342500A TW101130097A TW101130097A TW201342500A TW 201342500 A TW201342500 A TW 201342500A TW 101130097 A TW101130097 A TW 101130097A TW 101130097 A TW101130097 A TW 101130097A TW 201342500 A TW201342500 A TW 201342500A
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Taiwan
Prior art keywords
copper wire
forming
unit
supply module
wound
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TW101130097A
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Chinese (zh)
Inventor
Jea-Young Park
Jong-Hun Chae
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Daehwa Engineering Co Ltd
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Publication of TW201342500A publication Critical patent/TW201342500A/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/77Apparatus for connecting with strap connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401Disposition
    • H01L2224/40151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401Disposition
    • H01L2224/40151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/40247Connecting the strap to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/77Apparatus for connecting with strap connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/848Bonding techniques
    • H01L2224/84801Soldering or alloying
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1305Bipolar Junction Transistor [BJT]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1305Bipolar Junction Transistor [BJT]
    • H01L2924/13055Insulated gate bipolar transistor [IGBT]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1306Field-effect transistor [FET]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1306Field-effect transistor [FET]
    • H01L2924/13091Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Wire Processing (AREA)

Abstract

Disclosed is a clip supplying apparatus for a clip bonder including: a copper wire supplying unit for supplying a copper wire; a copper wire rolling unit for rolling the copper wire into a rolled copper wire; and a forming/cutting unit for receiving the rolled copper wire and forming and cutting the rolled copper wire into a clip shape.

Description

固定元件接合裝置及其固定元件供應模組 Fixed component joint device and its fixed component supply module

本發明係關於一種固定元件供應模組,其係應用於一固定元件接合裝置,本發明亦關於一種具有固定元件供應模組之固定元件接合裝置。特別的是,本發明關於一種固定元件供應模組,其係設置於固定元件接合裝置內,加工一銅線而產生一固定元件,並將固定元件供應至固定元件接合裝置。 The present invention relates to a fixed component supply module for use in a fixed component engagement device, and to a fixed component engagement device having a fixed component supply module. In particular, the present invention relates to a fixed component supply module that is disposed in a fixed component engagement device, processes a copper wire to produce a fixed component, and supplies the fixed component to the fixed component engagement device.

一般而言,在製作半導體封裝體時,從一晶圓(wafer)上切割下來之一晶片(或晶粒)係設置於一晶粒墊上,並藉由一導線與一端子或一引線(lead)電性連接,然後再用一封裝膠進行封裝。然而,當半導體晶片為一高功率模組,例如一功率電晶體(例如一功率金氧半場效電晶體(MOSFET)或絕緣雙閘極電晶體(IGBT)),晶粒係需要藉由多條導線而與端子或引線連接,此情況會導致一接合區域或電流量出現問題,因此就需要使用具有寬剖面與低導通電阻(on-resistance)的固定元件(clip)。 Generally, in the fabrication of a semiconductor package, a wafer (or die) cut from a wafer is disposed on a die pad and is terminated by a wire and a terminal or a lead (lead). ) Electrically connected and then encapsulated with a package of adhesive. However, when the semiconductor wafer is a high-power module, such as a power transistor (such as a power MOSFET) or an insulated double-gate transistor (IGBT), the die needs to be multi-layered. The wire is connected to the terminal or the lead, which may cause a problem of a joint area or a current amount, and therefore it is necessary to use a clip having a wide cross section and a low on-resistance.

圖1為一種習知半導體封裝體之剖面示意圖,其中一晶粒與一引線係藉由一固定元件相互連接。 1 is a schematic cross-sectional view of a conventional semiconductor package in which a die and a lead are connected to each other by a fixing member.

請參照圖1,在半導體封裝體1中,一晶粒3係接合於一晶粒墊2之上,並且晶粒3與一引線5係藉由一固定元件7相互連接,並由一封裝膠9封裝。包含晶粒墊2以 及引線5之一引線架(lead frame)係供應至一晶粒接合機(die bonder),然後在晶粒接合機中進行將一固定元件(clip)7接合至該引線架之上表面的製程。 Referring to FIG. 1, in a semiconductor package 1, a die 3 is bonded to a die pad 2, and a die 3 and a lead 5 are connected to each other by a fixing member 7, and an encapsulant is used. 9 packages. Include die pad 2 to And a lead frame of one of the leads 5 is supplied to a die bonder, and then a process of bonding a fixing member 7 to the upper surface of the lead frame is performed in the die bonder. .

然而,依據習知技術,固定元件7經由一打印(stamping)製程、一清洗製程、一檢測製程或其他製程而製成,在製成之後,固定元件7係供應至一固定元件接合機(clip bonder),然後固定元件接合機係使用該固定元件進行一固定元件接合作業於晶粒上。據此,習知技術就需要一固定元件製程以及相關的製造設備,並且需要一傳送作業以將製成之固定元件傳送至接合的位置,結果就導致製造成本增加。 However, according to the prior art, the fixing member 7 is made through a stamping process, a cleaning process, a detecting process or other processes, and after being manufactured, the fixing member 7 is supplied to a fixing component bonding machine (clip) Bonder), then the fixing element bonding machine uses the fixing element to perform a fixing element bonding operation on the die. Accordingly, the prior art requires a fixed component process and associated manufacturing equipment, and requires a transfer operation to transfer the finished fixed component to the bonded position, resulting in an increase in manufacturing cost.

本發明係提供一種其固定元件供應模組,其係設置於固定元件接合裝置內,加工一銅線而產生一固定元件,並將固定元件供應至固定元件接合裝置。 The present invention provides a fixing component supply module which is disposed in a fixing component engaging device, processes a copper wire to produce a fixing component, and supplies the fixing component to the fixing component engaging device.

本發明係提供一種固定元件接合裝置,其包含固定元件供應模組並藉由使用一供應之固定元件進行一固定元件接合作業。 The present invention provides a fixing member engaging device including a fixing member supply module and performing a fixing member engaging operation by using a supplied fixing member.

本發明之一實施例係提供一種固定元件供應單元,其係應用於一固定元件接合裝置,並包含一銅線供應單元、一銅線捲繞單元以及一成形/切割單元,銅線供應單元係供應一銅線,銅線捲繞單元係捲繞銅線使其成為一捲繞銅線,成形/切割單元係接收捲繞銅線並成形、切割捲繞銅 線,使其成為一固定元件之形狀。 An embodiment of the present invention provides a fixed component supply unit for use in a fixed component bonding apparatus, and includes a copper wire supply unit, a copper wire winding unit, and a forming/cutting unit, and a copper wire supply unit A copper wire is supplied, and the copper wire winding unit winds the copper wire to form a wound copper wire, and the forming/cutting unit receives the wound copper wire and forms and cuts the wound copper wire. The line is made into the shape of a fixed element.

在一實施例中,銅線供應單元包含一繞線架,一銅線係捲繞於繞線架。 In one embodiment, the copper wire supply unit includes a bobbin, and a copper wire is wound around the bobbin.

在一實施例中,銅線捲繞單元包含一主捲輪、一支持軸承以及一捲繞導引元件,該支持軸承係支持該主捲輪,該捲繞導引元件係與該主捲輪嚙合以捲繞該銅線。 In one embodiment, the copper wire winding unit includes a main reel, a support bearing, and a winding guide member, the support bearing supports the main reel, and the winding guide member is coupled to the main reel Engage to wind the copper wire.

在一實施例中,固定元件供應模組更包含一捲繞銅線感測單元,其係感測銅線捲繞單元所捲繞並供應之捲繞銅線。捲繞銅線感測單元可為一接觸式感測器。 In one embodiment, the fixed component supply module further includes a wound copper wire sensing unit that senses the wound copper wire wound and supplied by the copper wire winding unit. The wound copper wire sensing unit can be a contact sensor.

在一實施例中,成形/切割單元包含一饋送構件、一成形構件以及一切割構件,饋送構件係供應捲繞銅線,成形構件係將捲繞銅線成形為一固定元件形狀,切割構件係切割成形構件所成形之固定元件。 In one embodiment, the forming/cutting unit comprises a feeding member, a forming member and a cutting member, the feeding member supplying the wound copper wire, the forming member shaping the wound copper wire into a fixing element shape, and the cutting member system The fixing member formed by cutting the shaped member.

在一實施例中,饋送構件包含一移動塊以及一按壓塊,一驅動鏈結元件與一支持彈簧之相互作動係使該移動塊向前並向後移動,該驅動鏈結元件係由一饋送凸輪驅動,該按壓塊係選擇性地按壓位於該移動塊內之該捲繞銅線之一上部位。按壓塊可由一螺線管所驅動。 In one embodiment, the feed member includes a moving block and a pressing block, and a driving link element and a supporting spring move the moving block forward and backward, the driving link element is a feeding cam Driven, the pressing block selectively presses a portion of the wound copper wire located in the moving block. The pressing block can be driven by a solenoid.

在一實施例中,成形構件包含一成形模以及一擊壓件,該成形模具有一成形凹處,該擊壓件係被驅動以致其至少一部分嚙合於該成形模。一擊壓彈簧可支持該擊壓件之一下部位,並且擊壓件與擊壓彈簧可形成一擊壓組件。 In one embodiment, the forming member includes a forming die and a striking member having a forming recess that is driven such that at least a portion thereof engages the forming die. A pressing spring can support a lower portion of the pressing member, and the pressing member and the pressing spring can form a pressing assembly.

在一實施例中,切割構件包含一切割器,該切割器具有一切割部。切割器可由一上升凸輪驅動。 In an embodiment, the cutting member includes a cutter having a cutting portion. The cutter can be driven by a rising cam.

在一實施例中,成形構件與切割構件包含一上升凸輪、一上升驅動部、一擊壓切割器以及一成形模,上升驅動部係由上升凸輪驅動,擊壓切割器係由上升驅動部所驅動,成形模之至少一部分係嚙合於擊壓切割器之一擊壓件,並且一切割部與擊壓件可一同形成於該擊壓切割器內,切割部係切割已完全成形之固定元件。 In one embodiment, the forming member and the cutting member comprise a rising cam, a rising driving portion, a pressing cutter and a forming die, the rising driving portion is driven by the rising cam, and the pressing cutter is driven by the rising driving portion. Driven, at least a portion of the forming mold is engaged with one of the pressing members of the crushing cutter, and a cutting portion and the pressing member are formed together in the pressing cutter, and the cutting portion cuts the fully formed fixing member.

在一實施例中,螺線管之一作動係由一光學感測中斷板控制,光學感測中斷板係與饋送凸輪一同旋轉並具有一切斷部以及一光學感測器,光學感測器之一光發射部與一光接收部係由光學感測中斷板中斷或作動。 In one embodiment, one of the actuators of the solenoid is controlled by an optical sensing interrupting plate that rotates with the feeding cam and has a cutting portion and an optical sensor, the optical sensor A light emitting portion and a light receiving portion are interrupted or actuated by an optical sensing interrupter.

本發明亦揭露一種固定元件接合裝置其係包含一焊料設置單元、一固定元件供應模組以及一固定元件接合單元。焊料設置單元係設置一焊料至一引線架,一晶粒係接合於引線架。固定元件供應模組係加工一銅線而成為一固定元件並供應固定元件。固定元件接合單元係拿起固定元件供應模組所供應之固定元件並將固定元件定位至引線架上。其中,固定元件供應單元包含一銅線供應單元、一銅線捲繞單元以及一成形/切割單元,該銅線供應單元係供應一銅線,該銅線捲繞單元係捲繞該銅線使其成為一捲繞銅線,該成形/切割單元係接收該捲繞銅線並成形、切割該捲繞銅線,使其成為一固定元件之形狀。 The invention also discloses a fixing component bonding device which comprises a solder setting unit, a fixing component supply module and a fixing component bonding unit. The solder setting unit is provided with a solder to a lead frame, and a die is bonded to the lead frame. The fixed component supply module processes a copper wire to form a fixed component and supplies the fixed component. The fixing member engaging unit picks up the fixing member supplied from the fixing member supply module and positions the fixing member to the lead frame. Wherein, the fixing component supply unit comprises a copper wire supply unit, a copper wire winding unit and a forming/cutting unit, wherein the copper wire supply unit supplies a copper wire, and the copper wire winding unit winds the copper wire It becomes a wound copper wire, and the forming/cutting unit receives the wound copper wire and shapes and cuts the wound copper wire into a shape of a fixing member.

承上所述,由於一固定元件係藉由使用一銅線而直接產生,並被供應至一固定元件接合裝置,因而可不需要固定元件的製造設備。據此,在半導體封裝體製程中,接合 固定元件之成本可大幅降低。 As described above, since a fixing member is directly produced by using a copper wire and supplied to a fixing member engaging device, a manufacturing device for fixing the member can be omitted. Accordingly, in the semiconductor packaging process, bonding The cost of fixed components can be significantly reduced.

承上所述,由於不需要固定元件之存貨,因而可大幅縮減元件的運送及儲存成本。 As described above, since the inventory of the fixed components is not required, the transportation and storage costs of the components can be greatly reduced.

承上所述,本發明僅藉由單一裝置即可使一固定元件成形單元進行供應、成形並切割捲繞銅線的作業。並且上述供應、成形及切割銅線的驅動作業可藉由單一馬達來進行。 As described above, the present invention enables a fixed component forming unit to supply, shape, and cut a wound copper wire by a single device. Further, the above-described driving operation of supplying, forming, and cutting the copper wire can be performed by a single motor.

以下將參照相關圖式,說明依據本發明較佳實施例之固定元件接合裝置及其固定元件供應模組,其中相同的元件將以相同的參照符號加以說明。 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a fixing member engaging device and a fixing member supply module thereof according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings, wherein the same elements will be described with the same reference numerals.

圖2為本發明較佳實施例之一種固定元件接合裝置的平面示意圖。 2 is a schematic plan view of a fixing member engagement device in accordance with a preferred embodiment of the present invention.

本實施例之固定元件接合裝置10包含一載入單元12、一焊料設置單元14、一攝像單元18、一固定元件供應模組20、一固定元件接合單元22、一卸載單元28以及一轉移單元26。載入單元12係容置一引線架,一晶粒係接合於引線架。焊料設置單元14係設置一焊料至引線架。攝像單元18係對引線架取得一影像。固定元件供應模組20係將一銅線製作於一固定元件7內以供應固定元件7。固定元件接合單元22係拿起由固定元件供應模組20所供應之固定元件7,並將其定位於引線架上。卸載單元28係卸載已接合固定元件7之引線架。轉移單元26係依序將 引線架從載入單元12轉移至卸載單元28。 The fixing component bonding apparatus 10 of the embodiment includes a loading unit 12, a solder setting unit 14, an imaging unit 18, a fixed component supply module 20, a fixed component bonding unit 22, an unloading unit 28, and a transfer unit. 26. The loading unit 12 houses a lead frame, and a die attaches to the lead frame. The solder setting unit 14 is provided with a solder to the lead frame. The camera unit 18 takes an image of the lead frame. The fixing member supply module 20 is formed by forming a copper wire in a fixing member 7 to supply the fixing member 7. The fixing member engaging unit 22 picks up the fixing member 7 supplied from the fixing member supply module 20 and positions it on the lead frame. The unloading unit 28 unloads the lead frame to which the fixed element 7 has been engaged. Transfer unit 26 will be sequentially The lead frame is transferred from the loading unit 12 to the unloading unit 28.

一引線架係載入至載入單元12,然後再藉由轉移單元26依序被轉移至卸載單元28。 A lead frame is loaded into the loading unit 12 and then transferred to the unloading unit 28 in sequence by the transfer unit 26.

焊料設置單元14設置一焊料至一接合於引線架與一引線5之一晶粒3。在本實施例中,一設置頭16係裝設於焊料設置單元14內並用以設置該焊料。 The solder setting unit 14 is provided with a solder to a die 3 bonded to the lead frame and a lead 5. In the present embodiment, a setting head 16 is mounted in the solder setting unit 14 and used to set the solder.

固定元件接合單元22拿起由固定元件供應模組20所供應之固定元件7並將其定位於引線架上,以致固定元件7接觸晶粒3以及引線架之引線5。一固定元件接合頭24係裝設於固定元件接合單元22以拿起並定位固定元件7。 The fixing member engaging unit 22 picks up the fixing member 7 supplied from the fixing member supply module 20 and positions it on the lead frame, so that the fixing member 7 contacts the die 3 and the lead 5 of the lead frame. A fixing member engaging head 24 is attached to the fixing member engaging unit 22 to pick up and position the fixing member 7.

固定元件7係藉由焊料接合於引線架,然後引線架係藉由轉移單元26轉移至卸載單元28。 The fixing member 7 is bonded to the lead frame by solder, and then the lead frame is transferred to the unloading unit 28 by the transfer unit 26.

圖3為本發明較佳實施例之一種固定元件供應模組的示意圖,圖4為本發明較佳實施例之一種固定元件供應模組的前視示意圖。 3 is a schematic diagram of a fixed component supply module according to a preferred embodiment of the present invention, and FIG. 4 is a front view of a fixed component supply module according to a preferred embodiment of the present invention.

本實施例之固定元件供應模組20係包含一銅線供應單元30、一銅線捲繞單元40以及一成形/切割單元60。固定元件供應模組20可更包含一固定單元54,銅線供應單元30、銅線捲繞單元40與成形/切割單元60係固定於固定單元54。固定單元54可為一平板狀或一桿狀。固定單元54可被固定於固定元件接合裝置10之一上表面。 The fixing component supply module 20 of the present embodiment includes a copper wire supply unit 30, a copper wire winding unit 40, and a forming/cutting unit 60. The fixing component supply module 20 may further include a fixing unit 54, and the copper wire supplying unit 30, the copper wire winding unit 40, and the forming/cutting unit 60 are fixed to the fixing unit 54. The fixing unit 54 may be in the form of a flat plate or a rod. The fixing unit 54 can be fixed to an upper surface of the fixing member engagement device 10.

在本實施例中,銅線供應單元30包含一繞線架(bobbin)32,繞線架32可裝設而沿著一繞線架旋轉軸34轉動,繞線架旋轉軸34係耦接於一繞線架固定桿36。 一銅線56係繞設於繞線架32上。繞設於繞線架32之銅線56可為一裸露銅線並可具有一圓剖面。在另一實施例中,銅線56之剖面可不為圓形而是橢圓形。 In this embodiment, the copper wire supply unit 30 includes a bobbin 32. The bobbin 32 can be mounted to rotate along a bobbin rotating shaft 34. The bobbin rotating shaft 34 is coupled to the bobbin. A bobbin fixing rod 36. A copper wire 56 is wound around the bobbin 32. The copper wire 56 wound around the bobbin 32 can be a bare copper wire and can have a circular cross section. In another embodiment, the copper wire 56 may have a cross section that is not circular but elliptical.

由銅線供應單元30所供應之銅線56係經由銅線捲繞單元40而供應至成形/切割單元60。 The copper wire 56 supplied from the copper wire supply unit 30 is supplied to the forming/cutting unit 60 via the copper wire winding unit 40.

銅線捲繞單元40係將銅線56捲繞成一平板狀。為達此目的,銅線捲繞單元40包含一主捲輪42、一支持軸承46、一捲繞導引元件44以及一捲繞馬達50。支持軸承46係支持主捲輪42,捲繞導引元件44係接合於主捲輪42以捲繞銅線56並使其從二者之間經過。捲繞馬達50係轉動主捲輪42。減速齒輪(reduction gear)(圖未顯示)可裝設於捲繞馬達50之一輸出端。銅線捲繞單元40可更包含一調整捲輪48,其係支持捲繞導引元件44並調整捲繞導引元件44之一位置。當捲繞導引元件44藉由調整捲輪48而更靠近主捲輪42時,銅線56可被捲繞得更平整。 The copper wire winding unit 40 winds the copper wire 56 into a flat plate shape. To this end, the copper wire winding unit 40 includes a main reel 42, a support bearing 46, a winding guide member 44, and a winding motor 50. The support bearing 46 supports the primary reel 42, and the winding guide member 44 is coupled to the primary reel 42 to wind the copper wire 56 and pass it therebetween. The winding motor 50 rotates the main reel 42. A reduction gear (not shown) may be mounted at one of the output ends of the winding motor 50. The copper wire winding unit 40 may further include an adjustment reel 48 that supports the winding guide member 44 and adjusts the position of one of the winding guide members 44. When the winding guide member 44 is closer to the main reel 42 by adjusting the reel 48, the copper wire 56 can be wound more flat.

由銅線捲繞單元40所捲繞之捲繞銅線58係供應至成形/切割單元60。在本實施例中,一捲繞銅線感測單元52可更設置於成形/切割單元60之一前端,並偵測捲繞銅線58的供應情況。捲繞銅線感測單元52可包含一接觸感測器,並可藉由捲繞馬達50之一開關元件而作動。亦即,假使捲繞銅線58未被捲繞銅線感測單元52偵測到,則捲繞馬達50係作動;假使捲繞銅線58被偵測到,則捲繞馬達50係停止作動。換言之,在捲繞銅線58被供應至成形/切割單元60之後,當一預設量之銅線56被銅線捲繞單元 40捲繞時,捲繞銅線58係接觸捲繞銅線感測單元52,如圖4所示。在此情況下,可關閉捲繞馬達50以避免不必要之銅線的捲繞作業。假使捲繞銅線58藉由成形/切割單元60成形並切割並且捲繞銅線58被用盡,則捲繞銅線58係從捲繞銅線感測單元52分開。在此情況下,捲繞馬達50係被開啟以開始捲繞銅線。 The wound copper wire 58 wound by the copper wire winding unit 40 is supplied to the forming/cutting unit 60. In the present embodiment, a wound copper wire sensing unit 52 can be further disposed at the front end of one of the forming/cutting units 60 and detect the supply of the wound copper wire 58. The wound copper wire sensing unit 52 can include a contact sensor and can be actuated by winding one of the switching elements of the motor 50. That is, if the wound copper wire 58 is not detected by the wound copper wire sensing unit 52, the winding motor 50 is actuated; if the wound copper wire 58 is detected, the winding motor 50 is stopped. . In other words, after the wound copper wire 58 is supplied to the forming/cutting unit 60, when a predetermined amount of the copper wire 56 is wound by the copper wire winding unit When 40 is wound, the wound copper wire 58 contacts the wound copper wire sensing unit 52 as shown in FIG. In this case, the winding motor 50 can be turned off to avoid unnecessary winding of the copper wire. If the wound copper wire 58 is formed and cut by the forming/cutting unit 60 and the wound copper wire 58 is used up, the wound copper wire 58 is separated from the wound copper wire sensing unit 52. In this case, the winding motor 50 is turned on to start winding the copper wire.

成形/切割單元60係用以接收由銅線捲繞單元40所捲繞之捲繞銅線58,並成形、切割捲繞銅線58,使其具有一固定元件(例如夾持元件)之形狀。一凸輪驅動馬達(cam driving motor)62係裝設於成形/切割單元60內。成形/切割單元60之詳細的構造會在以下詳述。 The forming/cutting unit 60 is for receiving the wound copper wire 58 wound by the copper wire winding unit 40, and shaping and cutting the wound copper wire 58 to have a shape of a fixing member (for example, a clamping member). . A cam driving motor 62 is mounted in the forming/cutting unit 60. The detailed construction of the forming/cutting unit 60 will be described in detail below.

圖5為本發明較佳實施例之設置於固定元件供應模組內之一成形/切割單元的示意圖,圖6為本發明較佳實施例之設置於固定元件供應模組內之成形/切割單元的分解示意圖,圖7為圖6之固定供應模組沿A-A線段的剖面示意圖。 5 is a schematic view of a forming/cutting unit disposed in a fixed component supply module according to a preferred embodiment of the present invention, and FIG. 6 is a forming/cutting unit disposed in the fixed component supply module according to a preferred embodiment of the present invention; FIG. 7 is a schematic cross-sectional view of the fixed supply module of FIG. 6 along the AA line segment.

成形/切割單元60係用以供應一預設長度之捲繞銅線58,並將捲繞銅線成形為一固定元件形狀,且切割所成形之固定元件。成形/切割單元60包含一第一基塊64、一饋送構件、一成形構件以及一切割構件。饋送構件用以供應捲繞銅線58,成形構件用以將由饋送構件所供應之捲繞銅線成形為一固定元件形狀,切割構件用以切割所成形之固定元件。 The forming/cutting unit 60 is for supplying a predetermined length of the wound copper wire 58 and forming the wound copper wire into a fixed element shape, and cutting the formed fixing member. The forming/cutting unit 60 includes a first base block 64, a feed member, a forming member, and a cutting member. The feeding member is for supplying a wound copper wire 58 for shaping the wound copper wire supplied from the feeding member into a fixing member shape for cutting the formed fixing member.

饋送構件包含一移動塊66、一輔助塊72、一螺線管 (solenoid)74以及一驅動鏈結元件98。移動塊66係在第一基塊64上被驅動向前與向後,輔助塊72裝設於移動塊66上,螺線管74裝設於輔助塊72上,驅動鏈結元件98係驅動移動塊66向前與向後。 The feeding member includes a moving block 66, an auxiliary block 72, and a solenoid (solenoid) 74 and a drive link element 98. The moving block 66 is driven forward and backward on the first base block 64, the auxiliary block 72 is mounted on the moving block 66, the solenoid 74 is mounted on the auxiliary block 72, and the drive link element 98 drives the moving block. 66 forward and backward.

移動塊66位於第一基塊64上並被驅動向前、向後移動。一導引孔67係形成於移動塊66內,並且一導引桿68係插設於導引孔67內。導引桿68係固定於一第二基塊76,第二基塊76耦接於第一基塊64。一支持彈簧70裝設於導引桿68內。當移動塊66被向前、向後驅動時,可被導引而沿導引桿68移動,並可藉由支持彈簧70而具有回復力。據此,當移動塊66被驅動鏈結元件98而向後移動時,由於驅動鏈結元件98的關係,支持彈簧70係在與移動塊66之前進方向相反之方向上支持移動塊66,並且施加一回復力給移動塊66。在本實施例中,為導引移動塊66向前及向後的移動,一導引軌65可設置於第一基塊64,並且對應導引軌65之一溝槽可沿長度方向形成於移動塊66之下部位。 The moving block 66 is located on the first base block 64 and is driven to move forward and backward. A guiding hole 67 is formed in the moving block 66, and a guiding rod 68 is inserted into the guiding hole 67. The guiding rod 68 is fixed to a second base block 76 , and the second base block 76 is coupled to the first base block 64 . A support spring 70 is mounted in the guide rod 68. When the moving block 66 is driven forward and backward, it can be guided to move along the guide rod 68, and can have a restoring force by the support spring 70. Accordingly, when the moving block 66 is moved rearward by the drive link member 98, the support spring 70 supports the moving block 66 in the direction opposite to the forward direction of the moving block 66 due to the relationship of the drive link member 98, and is applied. A restoring force is given to the moving block 66. In the present embodiment, in order to guide the forward and backward movement of the moving block 66, a guiding rail 65 may be disposed on the first base block 64, and a groove corresponding to the guiding rail 65 may be formed in the longitudinal direction. Below the block 66.

輔助塊72係設置於移動塊66上,且使得捲繞銅線58穿過移動塊66與輔助塊72之間。螺線管74係裝設於移動塊66上。請參照圖7,一螺線管驅動軸75係裝設於螺線管74內,並且一按壓塊77係裝設於螺線管驅動75內。另外,一捲繞銅線供應溝槽73係形成於移動塊66之一上表面,使得捲繞銅線58經由捲繞銅線供應溝槽73供應。當捲繞銅線58被饋送時,假使螺線管74作動以使螺線管 驅動軸75下降,同時驅動鏈結元件98向後移動,則按壓塊77係按壓捲繞銅線58。之後,假使移動塊66藉由支持彈簧70之一回復力而向前移動,則被按壓塊77按壓之捲繞銅線58係與移動塊66及輔助塊72一同向前移動。 The auxiliary block 72 is disposed on the moving block 66 such that the wound copper wire 58 passes between the moving block 66 and the auxiliary block 72. The solenoid 74 is mounted on the moving block 66. Referring to FIG. 7, a solenoid drive shaft 75 is mounted in the solenoid 74, and a pressing block 77 is mounted in the solenoid drive 75. In addition, a wound copper wire supply groove 73 is formed on one surface of the moving block 66 such that the wound copper wire 58 is supplied via the wound copper wire supply groove 73. When the wound copper wire 58 is fed, if the solenoid 74 is actuated to make the solenoid When the drive shaft 75 is lowered and the drive link member 98 is moved rearward, the pressing block 77 presses the wound copper wire 58. Thereafter, if the moving block 66 is moved forward by the restoring force of one of the support springs 70, the wound copper wire 58 pressed by the pressing block 77 moves forward together with the moving block 66 and the auxiliary block 72.

第二基塊76係裝設於第一基塊64內。一成形模(forming die)78係裝設於第二基塊76,並且一模固定蓋(dice fixing cover)80係裝設於成形模78上以避免成形模78脫離。一側蓋82係裝設於第二基塊76之一前表面。 The second base block 76 is mounted in the first base block 64. A forming die 78 is attached to the second base block 76, and a die fixing cover 80 is attached to the forming die 78 to prevent the forming die 78 from coming off. The one side cover 82 is mounted on a front surface of one of the second base blocks 76.

一驅動軸84連結於凸輪驅動馬達62,一上升凸輪(elevation cam)86係耦接於驅動軸84,一饋送凸輪88係設置於第二基塊76之底部。一光學感測中斷板90之形狀係類似一圓形,並具有一切斷部92,切斷部92係依據一預設角度而切斷。光學感測中斷板90係用以中斷一光學感測器94。光學感測器94可包含一光發射部與一光接收部,假使光學感測中斷板90轉動以致切斷部92位於光學感測器94之一位置,則由光發射部所產生的光可到達光接收部。 A drive shaft 84 is coupled to the cam drive motor 62. An elevation cam 86 is coupled to the drive shaft 84. A feed cam 88 is disposed at the bottom of the second base block 76. An optical sensing interrupting plate 90 is shaped like a circle and has a cutting portion 92 that is severed according to a predetermined angle. Optical sensing interrupt plate 90 is used to interrupt an optical sensor 94. The optical sensor 94 may include a light emitting portion and a light receiving portion. If the optical sensing interrupting plate 90 is rotated so that the cutting portion 92 is located at one position of the optical sensor 94, the light generated by the light emitting portion may be Arrives at the light receiving unit.

饋送凸輪88係驅動該驅動鏈結元件98。驅動鏈結元件98係接近L形。驅動鏈結元件98係沿著一旋轉軸97旋轉,旋轉軸97係固定於第二基塊76。一受驅動捲輪96係接觸饋送凸輪88,並裝設於驅動鏈結元件98之一側,並且一驅動捲輪99係接觸移動塊66並裝設於驅動鏈結元件98之一相對側。當饋送凸輪88轉動時,受驅動捲輪96係沿饋送凸輪88之一外周緣上升,並且驅動鏈結元件98 由於受驅動捲輪96之上升而沿著一旋轉軸97轉動。據此,驅動鏈結元件98之驅動捲輪99係致動移動塊66而使其向前並向後移動。 Feed cam 88 drives the drive link element 98. The drive link element 98 is approximately L-shaped. The drive link element 98 is rotated along a rotational axis 97 that is fixed to the second base block 76. A driven reel 96 contacts the feed cam 88 and is mounted on one side of the drive link member 98, and a drive reel 99 contacts the moving block 66 and is mounted on the opposite side of one of the drive link members 98. When the feed cam 88 is rotated, the driven reel 96 is raised along the outer circumference of one of the feed cams 88, and the drive link member 98 is driven. Rotating along a rotating shaft 97 due to the rise of the driven reel 96. Accordingly, the drive reel 99 of the drive link member 98 actuates the moving block 66 to move forward and backward.

上升凸輪86係使一上升驅動部100上升。上升驅動部100係使一擊壓(punch)組件(102、104)以及一切割器110上升。 The ascending cam 86 raises a rising drive unit 100. The ascending drive unit 100 raises a punch assembly (102, 104) and a cutter 110.

擊壓組件(102、104)包含一擊壓彈簧102以及一擊壓件104。擊壓彈簧102之一下部位係藉由上升驅動部100之一上端所支持,並且擊壓彈簧102之一上部位係支持擊壓件104之一下部位。當上升驅動部100上升時,由擊壓彈簧102所支持之擊壓件104係上升。一成形突物(forming boss)108係形成於擊壓件104之一上端。一成形凹處(forming recess)79係形成於成形模78內並對應成形突物108。假使擊壓件104上升,同時捲繞銅線58位於成形模78與擊壓件104之間,則位於擊壓件104之成形突物108與成形模78之成形凹處79之間之捲繞銅線58係成形為一固定元件的形狀。 The crushing assembly (102, 104) includes a striking spring 102 and a striking member 104. The lower portion of the pressing spring 102 is supported by the upper end of one of the ascending driving portions 100, and the upper portion of the pressing spring 102 supports a lower portion of the pressing member 104. When the ascending drive unit 100 ascends, the striking member 104 supported by the striking spring 102 rises. A forming boss 108 is formed at one of the upper ends of the pressing member 104. A forming recess 79 is formed in the forming die 78 and corresponds to the forming projection 108. If the pressing member 104 is raised while the winding copper wire 58 is located between the forming die 78 and the pressing member 104, the winding between the forming projection 108 of the pressing member 104 and the forming recess 79 of the forming die 78 is performed. The copper wire 58 is shaped into a fixed element.

在本實施例中,切割器110為一長板狀,並且一切割部114設置於切割器110之一上部位。切割器110係由上升驅動部100所支持並可上升。在本實施例中,一切割器插設突物(cutter insertion boss)101係形成於上升驅動部100,一抓取孔111係對應切割器插設突物101並形成於切割器110上,並且切割器插設突物101係插入抓取孔111內,以致切割器110也可以上升,如同上升驅動部100上 升一樣。另外,為導引切割器110之上升,一切割器導引突物106係設置於擊壓件104之一前表面,並且一狹縫112係形成於切割器110並可讓切割器導引突物106穿設。 In the present embodiment, the cutter 110 is in the shape of a long plate, and a cutting portion 114 is disposed on an upper portion of the cutter 110. The cutter 110 is supported by the ascending drive unit 100 and can be raised. In the present embodiment, a cutter insertion boss 101 is formed on the ascending driving portion 100, and a gripping hole 111 is formed in the cutter inserting projection 101 and formed on the cutter 110, and The cutter insertion projection 101 is inserted into the gripping hole 111 so that the cutter 110 can also be lifted, as on the ascending driving portion 100. Like the same. In addition, in order to guide the rise of the cutter 110, a cutter guiding protrusion 106 is disposed on one front surface of the pressing member 104, and a slit 112 is formed on the cutter 110 and allows the cutter to guide the protrusion. The object 106 is worn.

另外,為裝設上升驅動部100、擊壓組件(102、104)以及切割器110,一上升導引溝槽116係形成於第二基塊76。 Further, in order to mount the ascending driving unit 100, the pressing unit (102, 104), and the cutter 110, a rising guide groove 116 is formed in the second base block 76.

在上述中,可以被了解的是,擊壓組件(102、104)與成形模78係組成一成形構件,而切割器110係組成一切割構件。另外,一夾套(collet)C係設置於尚未切割之一固定元件之上,並且假使已成形之固定元件被切割,則夾套C係饋送成形之固定元件以進行一接合作業。夾套C係藉由施予一真空壓力而吸收成形之固定元件。 In the above, it can be appreciated that the pressing assembly (102, 104) and the forming die 78 form a forming member, and the cutter 110 constitutes a cutting member. Further, a jacket C is disposed on one of the fixing members that has not been cut, and if the formed fixing member is cut, the jacket C feeds the formed fixing member to perform a joining operation. The jacket C absorbs the formed fixing member by applying a vacuum pressure.

圖8至圖11為本發明較佳實施例之固定元件接合裝置之固定元件供應模組之成形/切割單元所進行之成形製程以及切割製程的示意圖。 8 to FIG. 11 are schematic views showing a forming process and a cutting process performed by a forming/cutting unit of a fixing component supply module of a fixing component joining device according to a preferred embodiment of the present invention.

圖8係顯示在移動塊66供應捲繞銅線58之後,切割器110之切割部114所進行之固定元件之切割製程開始的狀態,在此狀態中,捲繞銅線58係由擊壓件104成形。位於擊壓件104之成形突物108係與位於成形模78之一下部位之成形凹處79嚙合。據此,捲繞銅線58被成形為一固定元件的形狀。如圖6所示,擊壓件104係由位於擊壓件104下方之擊壓彈簧102所支持。既使上升凸輪86致動上升驅動部100上升,擊壓件104之一上部位仍然由成形模78所支持而不會進一步上升,但擊壓彈簧102仍 進一步被壓縮。據此,捲繞銅線58可成形的更牢固。然而,甚至當擊壓件104之上升作業停止時,切割器110仍持續上升。切割器110之切割部114在上升的同時,亦切割已完全成形之固定元件的部分。 8 is a view showing a state in which the cutting process of the fixing member by the cutting portion 114 of the cutter 110 is started after the moving block 66 supplies the wound copper wire 58, in which state the wound copper wire 58 is pressed by the pressing member. 104 formed. The forming projection 108 at the pressing member 104 is engaged with a forming recess 79 located at a lower portion of the forming die 78. Accordingly, the wound copper wire 58 is shaped into the shape of a fixing member. As shown in FIG. 6, the striking member 104 is supported by a striking spring 102 located below the striking member 104. Even if the ascending cam 86 actuates the ascending drive unit 100 to rise, the upper portion of the striking member 104 is still supported by the forming die 78 without further ascending, but the striking spring 102 remains Further compressed. Accordingly, the wound copper wire 58 can be formed more firmly. However, even when the ascending operation of the pressing member 104 is stopped, the cutter 110 continues to rise. The cutting portion 114 of the cutter 110, while rising, also cuts a portion of the fully formed fixing element.

圖9顯示驅動鏈結元件98致動移動塊66向後移動的狀態,但此時切割器110持續上升以切割完全成形之固定元件並使其上升。驅動鏈結元件98沿著旋轉軸97旋轉並且驅動捲輪99係使移動塊66向後退,同時驅動鏈結元件98之受驅動捲輪96係藉由饋送凸輪88而致動上升。在此情況下,由於螺線管74未被作動且捲繞銅線58之一端嚙合於擊壓件104與成形模78之間,故捲繞銅線58不會移動。當切割器110上升時,完全成形之固定元件係由切割部114切割。當切割部114上升時,夾套C亦上升。 Fig. 9 shows a state in which the drive link member 98 actuates the moving block 66 to move rearward, but at this time the cutter 110 continues to rise to cut the fully formed fixed member and raise it. The drive link element 98 rotates along the axis of rotation 97 and drives the reel 99 to retract the moving block 66 while the driven reel 96 of the drive link element 98 is actuated by the feed cam 88. In this case, since the solenoid 74 is not actuated and one end of the wound copper wire 58 is engaged between the pressing member 104 and the forming die 78, the wound copper wire 58 does not move. When the cutter 110 is raised, the fully formed fixing member is cut by the cutting portion 114. When the cutting portion 114 ascends, the jacket C also rises.

圖10顯示當移動塊66開始向前移動時,捲繞銅線58開始被饋送的狀態,在此狀態中,擊壓件104與切割器110係下降。在此情況下,當光學感測器94被光學感測中斷板90中斷時,螺線管74係作動。據此,位於螺線管74之下方之按壓塊77係按壓捲繞銅線58之一上部位。當驅動鏈結元件98之受驅動捲輪96下降時,驅動捲輪99不再支持移動塊66並且支持彈簧70係致動移動塊66向前移動。因此,捲繞銅線58係與移動塊66一同向前移動。在此情況下,當與上升凸輪86連結之上升驅動部100下降時,擊壓件104與切割器110係一同向下移動。 Fig. 10 shows a state in which the winding copper wire 58 starts to be fed when the moving block 66 starts moving forward, in which state the pressing member 104 and the cutter 110 are lowered. In this case, when the optical sensor 94 is interrupted by the optical sensing interrupter 90, the solenoid 74 is actuated. Accordingly, the pressing block 77 located below the solenoid 74 presses the upper portion of the wound copper wire 58. When the driven reel 96 of the drive link element 98 is lowered, the drive reel 99 no longer supports the moving block 66 and the support spring 70 actuates the moving block 66 to move forward. Therefore, the wound copper wire 58 moves forward together with the moving block 66. In this case, when the ascending driving portion 100 coupled to the ascending cam 86 is lowered, the striking member 104 moves downward together with the cutter 110.

圖11係顯示在擊壓件104與切割器110到達捲繞銅線 58之一方向之前,移動塊66完全地向前且簡短地移動之狀態。當受驅動捲輪96從圖10所示之狀態而進一步向下移動時,移動塊66係向前移動,且捲繞銅線58據此完全地被饋送。當光學感測中斷板90之切斷部92開始位於光學感測器94之光發射部與光接收部之間時,螺線管74之一作動係停止。捲繞銅線58完全成形為一固定元件形狀之部分已移動至切割器110之一部分,並且捲繞銅線58之未成形之部分係位於擊壓件104之一上部位。 Figure 11 shows the arrival of the crimping member 104 and the cutter 110 to the wound copper wire. Before one of the directions 58, the moving block 66 is completely forward and briefly moved. When the driven reel 96 is further moved downward from the state shown in Fig. 10, the moving block 66 is moved forward, and the wound copper wire 58 is completely fed accordingly. When the cutting portion 92 of the optical sensing interrupting plate 90 starts to be positioned between the light emitting portion and the light receiving portion of the optical sensor 94, one of the actuators of the solenoid 74 is stopped. The portion of the wound copper wire 58 that is completely shaped into a fixed element shape has been moved to a portion of the cutter 110, and the unformed portion of the wound copper wire 58 is located on one of the portions of the crushing member 104.

當圖8至圖11所示之狀態依序進行時,捲繞銅線58持續成形並被初割為一固定元件之形狀。 When the states shown in Figs. 8 to 11 are sequentially performed, the wound copper wire 58 is continuously formed and is initially cut into the shape of a fixing member.

圖12為本發明另一較佳實施例之固定元件接合裝置之固定元件供應模組之一成形/切割單元之一擊壓切割器(punch cutter)的剖面示意圖。 Figure 12 is a cross-sectional view showing a punch cutter of a forming/cutting unit of a fixing member supply module of a fixing member engaging device according to another preferred embodiment of the present invention.

在圖6中,擊壓件104與切割器110係分別設置,但在圖12中,一擊壓件與一切割器係為一體而成為一擊壓切割器120。擊壓切割器120係由上升驅動部100所驅動,並具有一成形突物122以及一切割部124,成形突物122與切割部124係位於擊壓切割器120之一上部位且二者之間有一落差。當擊壓切割器120上升時,切割部124切割捲繞銅線58成形為固定元件形狀之部分,然後假使擊壓切割器120進一步上升,則成形突物122係使捲繞銅線58成形為固定元件之形狀。 In Fig. 6, the pressing member 104 and the cutter 110 are separately provided, but in Fig. 12, a pressing member is integrated with a cutter to become a pressing cutter 120. The crushing cutter 120 is driven by the ascending driving portion 100 and has a forming protrusion 122 and a cutting portion 124. The forming protrusion 122 and the cutting portion 124 are located on one of the pressing cutters 120 and both of them. There is a gap between them. When the crushing cutter 120 is raised, the cutting portion 124 cuts the portion of the wound copper wire 58 that is shaped into the shape of the fixing member, and then, if the crushing cutter 120 is further raised, the forming projection 122 forms the wound copper wire 58 into The shape of the fixing element.

以上所述僅為舉例性,而非為限制性者。任何未脫離本發明之精神與範疇,而對其進行之等效修改或變更,均 應包含於後附之申請專利範圍中。 The above is intended to be illustrative only and not limiting. Any equivalent modifications or variations to the spirit and scope of the invention are It should be included in the scope of the patent application attached.

1‧‧‧半導體封裝體 1‧‧‧Semiconductor package

2‧‧‧晶粒墊 2‧‧‧ die pad

3‧‧‧晶粒 3‧‧‧ grain

5‧‧‧引線 5‧‧‧Lead

7‧‧‧固定元件 7‧‧‧Fixed components

9‧‧‧封裝膠 9‧‧‧Package

10‧‧‧固定元件接合裝置 10‧‧‧Fixed component jointing device

12‧‧‧載入單元 12‧‧‧Loading unit

14‧‧‧焊料設置單元 14‧‧‧Solder setting unit

16‧‧‧設置頭 16‧‧‧Set head

18‧‧‧攝像單元 18‧‧‧ camera unit

20‧‧‧固定元件供應模組 20‧‧‧Fixed component supply module

22‧‧‧固定元件接合單元 22‧‧‧Fixed element joint unit

24‧‧‧固定元件接合頭 24‧‧‧Fixed element joint head

26‧‧‧轉移單元 26‧‧‧Transfer unit

28‧‧‧卸載單元 28‧‧‧Unloading unit

30‧‧‧銅線供應單元 30‧‧‧ copper supply unit

32‧‧‧繞線架 32‧‧‧ Winding frame

34‧‧‧繞線架旋轉軸 34‧‧‧winding frame rotation axis

36‧‧‧繞線架固定桿 36‧‧‧winding frame fixing rod

40‧‧‧銅線捲繞單元 40‧‧‧ copper wire winding unit

42‧‧‧主捲輪 42‧‧‧Main reel

44‧‧‧捲繞導引元件 44‧‧‧Winding guide element

46‧‧‧支持軸承 46‧‧‧Support bearings

48‧‧‧調整捲輪 48‧‧‧Adjust reel

50‧‧‧捲繞馬達 50‧‧‧winding motor

52‧‧‧捲繞銅線感測單元 52‧‧‧Wound copper wire sensing unit

54‧‧‧固定單元 54‧‧‧Fixed unit

56‧‧‧銅線 56‧‧‧ copper wire

58‧‧‧捲繞銅線 58‧‧‧Wound copper wire

60‧‧‧成形/切割單元 60‧‧‧forming/cutting unit

62‧‧‧凸輪驅動馬達 62‧‧‧Cam drive motor

64‧‧‧第一基塊 64‧‧‧ first block

65‧‧‧導引軌 65‧‧‧ Guide rail

66‧‧‧移動塊 66‧‧‧moving block

67‧‧‧導引孔 67‧‧‧ Guide hole

68‧‧‧導引桿 68‧‧‧ Guide rod

70‧‧‧支持彈簧 70‧‧‧Support spring

72‧‧‧輔助塊 72‧‧‧Auxiliary block

73‧‧‧捲繞銅線供應溝槽 73‧‧‧Wound copper wire supply groove

74‧‧‧螺線管 74‧‧‧ Solenoid

75‧‧‧螺線管驅動軸 75‧‧‧ Solenoid drive shaft

76‧‧‧第二基塊 76‧‧‧second base block

77‧‧‧按壓塊 77‧‧‧ Pressing block

78‧‧‧成形模 78‧‧‧ Forming die

79‧‧‧成形凹處 79‧‧‧ forming recess

80‧‧‧模固定蓋 80‧‧‧Mold fixed cover

82‧‧‧側蓋 82‧‧‧ side cover

84‧‧‧驅動軸 84‧‧‧ drive shaft

86‧‧‧上升凸輪 86‧‧‧ rising cam

88‧‧‧饋送凸輪 88‧‧‧Feed cam

90‧‧‧光學感測中斷板 90‧‧‧ Optical Sensing Interrupt Board

92‧‧‧切斷部 92‧‧‧cutting department

94‧‧‧光學感測器 94‧‧‧ Optical Sensor

96‧‧‧受驅動捲輪 96‧‧‧ Driven reel

97‧‧‧旋轉軸 97‧‧‧Rotary axis

98‧‧‧驅動鏈結元件 98‧‧‧Drive chain components

99‧‧‧驅動捲輪 99‧‧‧Drive reel

100‧‧‧上升驅動部 100‧‧‧Rising Drives

101‧‧‧切割器插設突物 101‧‧‧Cutter inserts

102‧‧‧擊壓彈簧 102‧‧‧Squeezing spring

104‧‧‧擊壓件 104‧‧‧Bearing parts

106‧‧‧切割器導引突物 106‧‧‧Cutter guide projection

108‧‧‧成形突物 108‧‧‧ Forming protrusions

110‧‧‧切割器 110‧‧‧Cutter

111‧‧‧抓取孔 111‧‧‧ Grab the hole

112‧‧‧狹縫 112‧‧‧slit

114、124‧‧‧切割部 114, 124‧‧‧ Cutting Department

116‧‧‧上升導引溝槽 116‧‧‧Upward guiding groove

120‧‧‧擊壓切割器 120‧‧‧Squeezing cutter

122‧‧‧成形突物 122‧‧‧ Forming protrusions

C‧‧‧夾套 C‧‧‧ jacket

圖1為一種習知半導體封裝體之剖面示意圖,其中一晶粒與一引線係藉由一固定元件相互連接;圖2為本發明較佳實施例之一種固定元件接合裝置的平面示意圖;圖3為本發明較佳實施例之一種固定元件供應模組的示意圖;圖4為本發明較佳實施例之一種固定元件供應模組的前視示意圖;圖5為本發明較佳實施例之設置於固定元件供應模組內之一成形/切割單元的示意圖;圖6為本發明較佳實施例之設置於固定元件供應模組內之成形/切割單元的分解示意圖;圖7為圖6之固定供應模組沿A-A線段的剖面示意圖;圖8至圖11為本發明較佳實施例之固定元件接合裝置之固定元件供應模組之成形/切割單元所進行之成形製程以及切割製程的示意圖;以及圖12為本發明另一較佳實施例之固定元件接合裝置之固定元件供應模組之一成形/切割單元之一擊壓切割器的剖面示意圖。 1 is a schematic cross-sectional view of a conventional semiconductor package in which a die and a lead are connected to each other by a fixing member; FIG. 2 is a plan view of a fixing component engaging device according to a preferred embodiment of the present invention; FIG. 4 is a schematic front view of a fixed component supply module according to a preferred embodiment of the present invention; FIG. 5 is a front view of a preferred embodiment of the present invention; FIG. 6 is a schematic exploded view of a forming/cutting unit disposed in a fixed component supply module according to a preferred embodiment of the present invention; FIG. 7 is a fixed supply of FIG. FIG. 8 to FIG. 11 are schematic diagrams showing a forming process and a cutting process performed by a forming/cutting unit of a fixing component supply module of a fixing component joining device according to a preferred embodiment of the present invention; and FIG. 12 is a schematic cross-sectional view showing one of the forming/cutting units of one of the fixing member supply modules of the fixing member engaging device of another preferred embodiment of the present invention.

20‧‧‧固定元件供應模組 20‧‧‧Fixed component supply module

30‧‧‧銅線供應單元 30‧‧‧ copper supply unit

32‧‧‧繞線架 32‧‧‧ Winding frame

34‧‧‧繞線架旋轉軸 34‧‧‧winding frame rotation axis

36‧‧‧繞線架固定桿 36‧‧‧winding frame fixing rod

40‧‧‧銅線捲繞單元 40‧‧‧ copper wire winding unit

42‧‧‧主捲輪 42‧‧‧Main reel

44‧‧‧捲繞導引元件 44‧‧‧Winding guide element

46‧‧‧支持軸承 46‧‧‧Support bearings

48‧‧‧調整捲輪 48‧‧‧Adjust reel

52‧‧‧捲繞銅線感測單元 52‧‧‧Wound copper wire sensing unit

54‧‧‧固定單元 54‧‧‧Fixed unit

56‧‧‧銅線 56‧‧‧ copper wire

58‧‧‧捲繞銅線 58‧‧‧Wound copper wire

60‧‧‧成形/切割單元 60‧‧‧forming/cutting unit

Claims (17)

一種固定元件供應模組,用於一固定元件接合裝置,包含:一銅線供應單元,係供應一銅線;一銅線捲繞單元,係捲繞該銅線使其成為一捲繞銅線;以及一成形/切割單元,係接收該捲繞銅線並成形、切割該捲繞銅線,使其成為一固定元件之形狀。 A fixing component supply module for a fixing component bonding device comprises: a copper wire supply unit for supplying a copper wire; and a copper wire winding unit for winding the copper wire to form a wound copper wire And a forming/cutting unit that receives the wound copper wire and shapes and cuts the wound copper wire into a shape of a fixing member. 如申請專利範圍第1項所述之固定元件供應模組,其中該銅線供應單元包含一繞線架,一銅線係捲繞於該繞線架。 The fixed component supply module of claim 1, wherein the copper wire supply unit comprises a bobbin, and a copper wire is wound around the bobbin. 如申請專利範圍第1項所述之固定元件供應模組,其中該銅線捲繞單元包含一主捲輪、一支持軸承以及一捲繞導引元件,該支持軸承係支持該主捲輪,該捲繞導引元件係與該主捲輪嚙合以捲繞該銅線。 The fixed component supply module of claim 1, wherein the copper wire winding unit comprises a main reel, a support bearing and a winding guiding element, wherein the supporting bearing supports the main reel, The winding guide member is engaged with the main reel to wind the copper wire. 如申請專利範圍第1項所述之固定元件供應模組,更包含:一捲繞銅線感測單元,係感測該銅線捲繞單元所捲繞並供應之該捲繞銅線。 The fixed component supply module of claim 1, further comprising: a wound copper wire sensing unit that senses the wound copper wire wound and supplied by the copper wire winding unit. 如申請專利範圍第4項所述之固定元件供應模組,其中該捲繞銅線感測單元係為一接觸式感測器。 The fixed component supply module of claim 4, wherein the wound copper wire sensing unit is a contact sensor. 如申請專利範圍第5項所述之固定元件供應模組,其中當該捲繞銅線接觸該接觸式感測器時,該銅線捲繞單元之一作業係停止。 The fixed component supply module of claim 5, wherein when the wound copper wire contacts the contact sensor, one of the copper wire winding units stops. 如申請專利範圍第1項至第6項之任一項所述之固定元件供應模組,其中該成形/切割單元包含一饋送構件、一成形構件以及一切割構件,該饋送構件係供應該捲繞銅線,該成形構件係將該捲繞銅線成形為一固定元件形狀,該切割構件係切割該成形構件所成形之該固定元件。 The fixing member supply module according to any one of claims 1 to 6, wherein the forming/cutting unit comprises a feeding member, a forming member and a cutting member, the feeding member supplying the roll The copper wire is formed by forming the wound copper wire into a shape of a fixing member that cuts the fixing member formed by the forming member. 如申請專利範圍第7項所述之固定元件供應模組,其中該饋送構件包含一移動塊以及一按壓塊,一驅動鏈結元件與一支持彈簧之相互作動係使該移動塊向前並向後移動,該驅動鏈結元件係由一饋送凸輪驅動,該按壓塊係選擇性地按壓位於該移動塊內之該捲繞銅線之一上部位。 The fixed component supply module of claim 7, wherein the feeding member comprises a moving block and a pressing block, and a driving link element and a supporting spring actuate the moving block forward and backward. Moving, the drive link element is driven by a feed cam that selectively presses a portion of the wound copper wire located within the moving block. 如申請專利範圍第8項所述之固定元件供應模組,其中該按壓塊係由一螺線管所驅動。 The fixed component supply module of claim 8, wherein the pressing block is driven by a solenoid. 如申請專利範圍第7項所述之固定元件供應模組,其中該成形構件包含一成形模以及一擊壓件,該成形模具有一成形凹處,該擊壓件係被驅動以致其至少一部分嚙合於該成形模。 The fixing member supply module of claim 7, wherein the forming member comprises a forming die and a striking member, the forming die having a forming recess, the pressing member being driven such that at least a portion thereof is engaged In the forming die. 如申請專利範圍第10項所述之固定元件供應模組,其中一擊壓彈簧係支持該擊壓件之一下部位。 The fixed component supply module of claim 10, wherein a pressing spring supports a lower portion of the pressing member. 如申請專利範圍第7項所述之固定元件供應模組,其中該切割構件包含一切割器,該切割器具有一切割部。 The fixing member supply module of claim 7, wherein the cutting member comprises a cutter having a cutting portion. 如申請專利範圍第12項所述之固定元件供應模組, 其中該成形構件包含一成形模以及一擊壓件,該成形模具有一成形凹處,該擊壓件係受驅動以致其至少一部分嚙合於該成形模,並且該擊壓件以及該切割器係由一上升凸輪驅動。 For example, the fixed component supply module described in claim 12, Wherein the forming member comprises a forming die and a striking member, the forming die having a forming recess, the striking member being driven such that at least a portion thereof is engaged with the forming die, and the striking member and the cutter are A rising cam drive. 如申請專利範圍第7項所述之固定元件供應模組,其中該成形構件與該切割構件包含一上升凸輪、一上升驅動部、一擊壓切割器以及一成形模,該上升驅動部係由該上升凸輪驅動,該擊壓切割器係由該上升驅動部所驅動,該成形模之至少一部分係嚙合於該擊壓切割器之一擊壓件,並且一切割部與該擊壓件係一同形成於該擊壓切割器內,該切割部係切割已完全成形之固定元件。 The fixed component supply module of claim 7, wherein the forming member and the cutting member comprise a rising cam, a rising driving portion, a pressing cutter and a forming die, wherein the rising driving portion is The rising cam is driven by the ascending driving portion, at least a portion of the forming mold is engaged with one of the pressing members of the pressing cutter, and a cutting portion is combined with the pressing member Formed in the crushing cutter, the cutting portion cuts the fully formed fixing member. 如申請專利範圍第9項所述之固定元件供應模組,其中該螺線管之一作動係由一光學感測中斷板控制,該光學感測中斷板係與該饋送凸輪一同旋轉並具有一切斷部以及一光學感測器,該光學感測器之一光發射部與一光接收部係由該光學感測中斷板中斷或作動。 The fixed component supply module of claim 9, wherein one of the actuators of the solenoid is controlled by an optical sensing interrupting plate that rotates together with the feeding cam and has everything And a light sensor, wherein the light emitting portion and the light receiving portion are interrupted or actuated by the optical sensing interrupting plate. 一種固定元件接合裝置,包含:一焊料設置單元,係設置一焊料至一引線架,一晶粒係接合於該引線架;一固定元件供應模組,係加工一銅線而成為一固定元件並供應該固定元件;以及一固定元件接合單元,係拿起該固定元件供應模組所供應之該固定元件並將該固定元件定位至該引線架 上,其中,該固定元件供應單元包含一銅線供應單元、一銅線捲繞單元以及一成形/切割單元,該銅線供應單元係供應一銅線,該銅線捲繞單元係捲繞該銅線使其成為一捲繞銅線,該成形/切割單元係接收該捲繞銅線並成形、切割該捲繞銅線,使其成為一固定元件之形狀。 A fixing component bonding device comprising: a solder setting unit, wherein a solder is provided to a lead frame, a die is bonded to the lead frame; and a fixed component supply module processes a copper wire to form a fixed component and Supplying the fixing component; and a fixing component engaging unit picking up the fixing component supplied by the fixing component supply module and positioning the fixing component to the lead frame The fixing component supply unit comprises a copper wire supply unit, a copper wire winding unit and a forming/cutting unit, wherein the copper wire supply unit supplies a copper wire, and the copper wire winding unit winds the wire The copper wire is made into a wound copper wire, and the forming/cutting unit receives the wound copper wire and shapes and cuts the wound copper wire into a shape of a fixing member. 如申請專利範圍第16項所述之固定元件接合裝置,其中該成形/切割單元包含一饋送構件、一成形構件以及一切割構件,該饋送構件係供應該捲繞銅線,該成形構件係將該捲繞銅線成形為一固定元件形狀,該切割構件係切割該成形構件所成形之該固定元件。 The fixing member joining device of claim 16, wherein the forming/cutting unit comprises a feeding member, a forming member and a cutting member, the feeding member supplying the wound copper wire, the forming member being The wound copper wire is shaped into a fixing member that cuts the fixing member formed by the forming member.
TW101130097A 2012-04-02 2012-08-20 Clip supplying apparatus for clip bonder, and clip bonder having the same TW201342500A (en)

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* Cited by examiner, † Cited by third party
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