TW201342461A - Stacked assembly for plasma reaction chamber and production method thereof - Google Patents

Abstract

The invention provides a production method of a stacked assembly for a plasma reaction chamber. The production method includes the steps of providing a first portion provided with at least one joint surface; providing a second portion provided with at least one joint surface matched with the at least one joint surface of the first portion; applying a hard combination layer to the joint surface of the first portion; softening the combination layer; and forming the stacked assembly comprising the first portion and the second portion to enable the combination layer to combine joint surfaces of the first portion and the second portion. The invention further provides the stacked assembly produced according to the production method and the plasma reaction chamber comprising the stacked assembly. The stacked assembly is good in stability and high in reliability.

Description

Laminated component for plasma reaction chamber and method of manufacturing same

The present invention relates to the field of semiconductor manufacturing, and more particularly to a laminated type element for a plasma reaction chamber and a method of manufacturing the same.

The plasma sub-reaction chamber has a plurality of laminated elements, and the laminated type elements require that at least two portions are laminated together in various ways.

The present invention seeks to provide a manufacturing method that is efficient and low-cost without affecting the function of the laminated component.

In view of the above problems in the background art, the present invention proposes a laminated type element for a plasma reaction chamber and a method of manufacturing the same.

A first aspect of the present invention provides a method of manufacturing a laminated type component for a plasma reaction chamber, wherein the manufacturing method comprises the steps of: providing a first portion having at least one joint surface, providing one having at least one and the first a portion of the second portion of the mating surface of the mating surface, a rigid first bonding layer is applied on the bonding surface of the first portion, and a second bonding layer made of an elastic material is applied on the first bonding layer. A laminated type member including the first portion and the second portion is formed such that the first bonding layer and the second bonding layer combine the respective bonding faces of the first portion and the second portion.

In an embodiment of the invention, the first bonding layer is made of metal.

In an embodiment of the invention, the first bonding layer is made of metal aluminum.

In an embodiment of the invention, the second bonding layer comprises a conductive material for A conductive path between the first portion and the second portion is provided.

In an embodiment of the invention, the bonding layer is deposited on the bonding surface of the first portion by PVD, CVD or evaporation plating.

In an embodiment of the invention, the manufacturing method further includes the step of applying a force to the second portion such that the bonding surface thereof is tightly bonded to the first bonding layer and the second bonding layer on the first portion.

In an embodiment of the invention, wherein the stacked assembly includes a gas showerhead, the first portion includes a front plate for acting as an upper electrode of the plasma reaction chamber, the second portion including for acting as a mounting plate and The back plate to which the electrodes are connected.

In an embodiment of the invention, wherein the stacked component includes an upper ground ring, the first portion includes a front plate that serves as an upper ground electrode, and the second portion includes a rear plate for acting as a mounting plate and a ground connection.

A second aspect of the invention provides a laminated type element for a plasma reaction chamber, wherein the laminated type element is produced in accordance with the manufacturing method provided by the first aspect of the invention.

In an embodiment of the invention, wherein the stacked assembly includes a gas showerhead, the first portion includes a front plate for acting as an upper electrode of the plasma reaction chamber, the second portion including for acting as a mounting plate and an electrode Connected rear panel.

In an embodiment of the invention, wherein the stacked component includes an upper ground ring, the first portion includes a front plate that serves as an upper ground electrode, and the second portion includes a rear plate for acting as a mounting plate and a ground connection.

A third aspect of the invention provides a plasma reaction chamber, wherein the plasma reaction chamber comprises a laminated type element according to the second aspect of the invention.

In an embodiment of the invention, wherein the stacked assembly includes a gas showerhead, the first portion includes a front plate for acting as an upper electrode of the plasma reaction chamber, the second portion including for acting as a mounting plate and an electrode Connected rear panel.

In an embodiment of the invention, wherein the stacked component includes an upper ground ring, the first portion includes a front plate that serves as an upper ground electrode, and the second portion includes a rear plate for acting as a mounting plate and a ground connection.

Since the present invention employs a rigid first bonding layer and an elastic second bonding layer in combination with the first portion and the second portion of the laminated member, the laminated member is made denser and has better thermal conductivity.

1‧‧‧ gas sprinkler

11‧‧‧through hole

12‧‧‧ Back panel

12a‧‧‧Second joint

13‧‧‧Combination layer

14‧‧‧ front board

14a‧‧‧First joint

15‧‧‧Second bonding layer

15a‧‧‧Upper surface

2‧‧‧Upper grounding ring

22‧‧‧ Back panel

22a‧‧‧Second joint

23‧‧‧First bonding layer

24‧‧‧ front panel

24a‧‧‧first joint

25‧‧‧Second bonding layer

1 is a schematic structural view of a plasma processing apparatus; FIG. 2 is a schematic structural view of a gas shower head and an upper grounding ring of the plasma processing apparatus; and FIG. 3 is a plasma processing apparatus for a plasma processing apparatus according to a first embodiment of the present invention. FIG. 4a to 4d are schematic views showing a method of manufacturing a laminated component for a plasma processing apparatus according to a first embodiment of the present invention; and FIG. 5 is a second embodiment of the present invention. Flowchart of a step of manufacturing a laminated type component for a plasma processing apparatus; Fig. 6 is a schematic structural view of a laminated type element for a plasma processing apparatus according to a second embodiment of the present invention.

Specific embodiments of the present invention will be described below with reference to the accompanying drawings.

Specific embodiments of the present invention will be described below with reference to the accompanying drawings.

1 is a schematic structural view of a plasma processing apparatus. The plasma reaction chamber includes a chamber in which a process zone is disposed. Process gases and other auxiliary gases enter from the top of the chamber, and RF energy is coupled to the lower electrode and provides energy to excite and generate plasma in the process zone to cause various physical or chemical reactions with the substrate therein to complete the predetermined process. its In addition, a vacuum pump is also provided for extracting redundant impurity gases and the like from the process chamber. Wherein, the plasma reaction chamber further includes a gas shower head 1 at the top and an upper ground ring 2 at the periphery of the gas shower head (showerhead) 1.

2 is a schematic view showing the structure of a gas shower head and an upper ground ring of a plasma processing apparatus. As shown in Fig. 2, the gas shower head 1 is a disk-shaped member having a certain thickness in which a plurality of through holes 11 are provided for inputting and ejecting a reaction gas into the reaction chamber. The through hole 11 is formed by ultrasonic drilling of the prepared conductive substrate, which may be a linear through hole having a uniform aperture, and may also be a through hole having a non-uniform aperture. For example, the through hole 11 has a large aperture. The upper end portion and the lower end portion having a smaller aperture. It should be understood that the through hole 11 can also be fabricated into other various non-uniform aperture shapes: for example, a tapered through hole that is large and small, or a reverse tapered through hole that is large and small, or the same as the upper and lower apertures. In the middle, there is a through hole having a small aperture, and it may be a non-linear (bent) through hole having the same or different upper and lower apertures. As shown in FIG. 2, in conjunction with FIG. 1, an upper grounding ring 2 is further disposed around the gas shower head 1 for supporting the gas shower head 1 or for increasing the lateral area of the gas shower head to improve the plasma. The uniformity of the body etching. In addition to introducing gas into the reaction chamber, the gas shower head 1 is also used as an electrode and an RF channel.

3 is a flow chart showing the steps of a method for fabricating a laminated component for a plasma processing apparatus according to a first embodiment of the present invention, and FIG. 4 is a view showing a plasma for a first embodiment according to the present invention. A schematic diagram of a method of manufacturing a laminated component of a bulk processing apparatus. The present invention will now be described with reference to a gas shower head as an example, in conjunction with FIG. 3 and FIG. It will be understood by those skilled in the art that the gas showerhead comprises at least two portions of a disk having a certain thickness, that is, a front plate and a rear plate. Wherein the front plate is typically made of tantalum or tantalum carbide for use as an upper electrode of a plasma processing apparatus; the back plate is typically made of an aluminum alloy for acting as a mounting plate and electrode Connection plate.

A first aspect of the invention provides a laminate for fabricating a plasma reaction chamber A method of manufacturing a type of component, the method of manufacturing comprising the steps of: first, performing step S11, see Fig. 4a, providing a front panel 14 having at least one first joint surface 14a, typically made of tantalum or tantalum carbide And used to serve as an upper electrode of the plasma processing apparatus; and, in step S12, a rear plate 12 having at least one second joint surface 12a mated with the first joint surface 14a of the front plate 14 is provided. The rear plate 12 serves to serve as a mounting plate and an electrode connection plate.

It should be noted that, in the embodiment, the S12 is performed by the step S11 in the first embodiment, but it should be understood that the steps S11 and S12 are not performed in a specific order relationship, and the step S12 may be performed first, and then the step S11 may be performed. Step S11 and step S12 can also be performed at the same time, and there is no necessary sequence between the two. At the same time, since the manufacturing methods and structures of the front and rear panels have mature technical support in the prior art, for the sake of brevity, details are not described herein.

Then, step S13 is performed, referring to FIG. 4b, a hard first bonding layer 13 is applied on the first bonding surface 14a of the front panel 14. Typically, the bonding layer 13 may be deposited on the first bonding surface 14a of the front panel 14 by a PVD, CVD or evaporation plating process.

Further, the first bonding layer 13 is made of metal. Typically, the bonding layer 13 is made of metallic aluminum.

Next, step S14 is performed, referring to FIG. 4c, a second bonding layer 15 is applied on the first bonding layer 13, wherein the second bonding layer 15 has an upper surface 15a made of an elastic material. Wherein the elastic material is selected from the group consisting of polymeric materials such as polycopper, organic germanium, and the like.

Further, the second bonding layer 15 includes a conductive material for providing a conductive path between the first portion and the second portion. Wherein, the conductive material comprises metal particles such as aluminum or an aluminum alloy.

Specifically, the second bonding layer may be applied by wiping, brushing, spraying, or the like. Coating onto the first bonding layer, even including subsequent densification and the step of curing the second bonding layer, and the like. Since the above method has mature technical support in the prior art, it will not be described again for the sake of brevity.

Next, step S15 is performed, referring to FIG. 4d, a gas shower head 1 including the front plate 14 and the rear plate 12 is formed such that the bonding layer 13 joins the joint faces of the front plate 14 and the rear plate 12. Specifically, a downward force may be applied to the rear plate 12 such that its second engaging surface 12a is tightly coupled to the first bonding layer 13 and the second bonding layer 15 on the front plate 14.

Finally, step S16 is performed to cool the element obtained by the above steps to room temperature, and then ultrasonically drilled thereon to form a plurality of through holes 11 sequentially passing through the front plate 14, the bonding layer 13, and the rear plate 12. That is, the gas shower head 1 including the front plate 14 and the rear plate 12, and the front plate 14 and the rear plate 12 are joined by the bonding layer 13.

According to a variant of the invention, referring to Figures 5 and 6, together with Figures 1 and 2, the manufacturing method can also be applied to the upper insulating ring 2 at the periphery of the gas shower head 1, the manufacturing method thereof and the gas spray The manufacturing method of the head 1 is similar, and includes the following steps: First, step S21 is performed to provide a front plate 24 having at least one first joint surface 24a, which is typically made of tantalum or tantalum carbide, which may be A piece of a ring that can also consist of a number of tantalum or tantalum carbide. The front plate 24 is used to serve as an upper ground electrode of a plasma processing apparatus.

And, in step S22, a rear plate 22 having at least one second engaging surface 22a that engages with the first engaging surface 24a of the front plate 24 is provided. The rear plate 22 is made of an aluminum alloy and serves to serve as a connecting plate and a ground connecting plate.

It should be noted that, in the embodiment, the step S21 is performed in the first step S21, but the step S21 is performed, and the step S21 is performed. Step S21 and step S22 can also be performed at the same time, and there is no necessary sequence between the two. At the same time, due to the manufacture of the front and back panels The method and its structure have mature technical support in the prior art, and for the sake of brevity, it will not be repeated here.

Then, step S23 is performed to apply a hard first bonding layer 23 on the first bonding surface 24a of the front panel 24. Typically, the bonding layer 13 can be deposited on the first bonding surface 24a of the front panel 24 by a PVD, CVD or evaporation plating process.

Further, the first bonding layer 23 is made of metal. Typically, the first bonding layer 23 is made of metallic aluminum.

The thickness of the first bonding layer 23 ranges from 0.1 mm to 2 mm.

Next, step S24 is performed, referring to FIG. 4c, a second bonding layer 15 is applied on the first bonding layer 13, wherein the second bonding layer 25 is made of an elastic material. Wherein the elastic material is selected from the group consisting of polymeric materials such as polycopper, organic germanium, and the like. The thickness of the second bonding layer 25 ranges from 0.1 mm to 2 mm.

Further, the second bonding layer 15 includes a conductive material for providing a conductive path between the first portion and the second portion. Wherein, the conductive material comprises metal particles such as aluminum or an aluminum alloy.

Specifically, the second bonding layer may be applied to the first bonding layer by wiping, brushing, spraying, or the like, even including subsequent densification and a step of curing the second bonding layer. Since the above method has mature technical support in the prior art, it will not be described again for the sake of brevity. Next, step S25 is performed. Referring to FIG. 6, the upper grounding ring 2 including the front plate 24 and the rear plate 22 is formed such that the bonding layer 23 joins the joint faces of the front plate 24 and the rear plate 22. Specifically, a downward force can be applied to the rear panel 22 such that its second engagement surface 22a is tightly coupled to the bonding layer 23 on the front panel 24.

Finally, cooling to room temperature, the upper grounding ring 2 is obtained.

A second aspect of the present invention also provides a laminated type element for a plasma reaction chamber, wherein the laminated type element is produced in accordance with the aforementioned manufacturing method.

Typically the stacked component is a gas showerhead or an upper grounding ring.

A third aspect of the invention also provides a plasma reaction chamber, wherein the plasma reaction chamber comprises the aforementioned stacked type assembly.

The present invention employs a first portion and a second portion of a combination of a rigid first bonding layer and an elastomeric material. Since the hard first bonding layer and the first portion of the material both comprise aluminum, the materials are similar, and the temperature can be cooled more quickly due to good thermal conductivity in the cooling of the stacked component. Moreover, since the present invention is made to be more dense due to the use of a hard bonding layer, the laminated component is not easily deformed, and the bonding layer is not easily physically or chemically changed during the manufacturing process, so that the laminated component is more stable and reliable. Strong.

Although the present invention has been described in detail by the preferred embodiments thereof, it should be understood that the foregoing description should not be construed as limiting. Various modifications and alterations of the present invention will be apparent to those skilled in the art. Therefore, the scope of the invention should be defined by the appended claims.

1‧‧‧ gas sprinkler

11‧‧‧through hole

12‧‧‧ Back panel

12a‧‧‧Second joint

13‧‧‧Combination layer

14‧‧‧ front board

14a‧‧‧First joint

15‧‧‧Second bonding layer

Claims (14)

A method of manufacturing a laminated component for a plasma reaction chamber, wherein the manufacturing method comprises the steps of: providing a first portion having at least one joint; providing a joint having at least one of the joints of the first portion a second portion of the bonding surface; applying a hard first bonding layer on the bonding surface of the first portion; applying a second bonding layer made of an elastic material on the first bonding layer; forming the first portion and the The second type of laminated component is such that the first bonding layer and the second bonding layer combine the bonding faces of the first portion and the second portion. The manufacturing method of claim 1, wherein the first bonding layer is made of metal. The manufacturing method of claim 2, wherein the first bonding layer is made of metal aluminum. The method of manufacturing of claim 3, wherein the second bonding layer comprises a conductive material for providing a conductive path between the first portion and the second portion. The manufacturing method of claim 4, wherein the bonding layer is deposited by a PVD, CVD or evaporation plating process on the bonding surface of the first portion. The manufacturing method of claim 5, wherein the manufacturing method further comprises the step of applying a force to the second portion such that the joint surface thereof is tightly coupled to the first bonding layer and the second portion on the first portion Bonding layer. The manufacturing method according to any one of the items 1 to 6, wherein the laminated component further comprises a gas shower head, the first portion comprising a front plate for serving as an upper electrode of the plasma reaction chamber, the first The second part is used to serve as a mounting plate and electrode Connected to the back panel. The manufacturing method of any one of clauses 1 to 6, wherein the laminated component further comprises an upper grounding ring, the first portion comprising a front plate serving as an upper ground electrode, the second portion comprising Install the board and the back plate of the ground connection. A laminated type member for a plasma reaction chamber, wherein the laminated type member is produced by the manufacturing method according to any one of claims 1 to 6. The laminated component of claim 9, wherein the laminated component further comprises a gas showerhead, the first portion comprising a front plate for acting as an upper electrode of the plasma reaction chamber, the second portion comprising Acts as a rear plate for the mounting plate and electrode connections. The laminated component of claim 9, wherein the laminated component further comprises an upper grounding ring, the first portion comprising a front plate serving as an upper grounding electrode, the second portion comprising a mounting plate and a grounding connection Back plate. A plasma reaction chamber, wherein the plasma reaction chamber comprises the laminated assembly according to any one of claims 1 to 6. The plasma reaction chamber of claim 12, wherein the stacked component further comprises a gas showerhead, the first portion comprising a front plate for acting as an upper electrode of the plasma reaction chamber, the second portion comprising Used as a rear plate for mounting plates and electrodes. The plasma reaction chamber of claim 12, wherein the stacked component further comprises an upper ground ring, the first portion comprising a front plate serving as an upper ground electrode, the second portion comprising for acting as a mounting plate and a ground connection The back panel.