TW201340420A - Light emitting diode package and method for fabricating the same - Google Patents

Abstract

An LED package is provided. The LED package includes a first electrode slice and a second electrode slice coated with a plating layer other their surfaces. A cup-shaped insulator having a recessed functional area is formed on the first and second electrode slices and exposes them by means of the recessed functional area. Each of the first and second electrode slices has a terminal surface extending over the cup-shaped insulator along a first coordination or has a side surface extending over the cup-shaped insulator along a second coordination, wherein each the terminal surface has at least one depression. In addition, a method for fabricating the LED package described above is also provided.

Description

Light-emitting diode package and method of manufacturing same

The present invention relates to a light-emitting diode lead frame, and more particularly to a light-emitting diode lead frame having a side electrode and a method of fabricating the same.

The light-emitting diode lead frame is an important component for the light-emitting diode to carry the light-emitting chip, to provide the light-emitting chip to the external electrode, to improve the luminous efficiency, and to improve the heat dissipation of the chip. The manufacture of the light-emitting diode lead frame is usually carried out by steps of metal stent shaping, metal stent plating, metal stent burying and injection molding.

When the lead frame of the light-emitting diode is formed of a thermosetting plastic, it must be fabricated by a transfer molding method, and is a connection form in which the lead frame units are mutually connected.

Due to the use of the connection plate form, when the LED package is packaged, it must be separated by cutting. The packaging process is complicated and the output per unit time is small. The cut LED package will produce a cross section of the metal material covered by the silver-free layer. Although this area is electrically conductive, it has the problem of easy oxidation and cannot be used as a light-emitting diode and an external circuit. Reliable connection method, and it is not easy to climb tin during the soldering process.

Also, due to the use of the thermoluminescent plastic light-emitting diode finished product, only the electrode with the silver-plated layer on the bottom is a reliable electrical transmission path, so the probe can only touch the bottom electrode upwards during the package test, so the test The machine must add a stop on the light-emitting side to fix the test object, but the block has the problem of shielding the light source, and the test machine structure is more complicated.

Therefore, for a light-emitting diode using a thermosetting plastic, what is required in the industry is a novel light-emitting diode package and a method of manufacturing the same, so that it is not necessary to use a cutting method in the light-emitting diode packaging process. The unit is separated to achieve simple and efficient production. In addition to the reliable electrode at the bottom, the finished product of the LED also has a side electrode protected by a plating layer on the side, which is beneficial to the conventional conventional splicing form lead frame for the package test and the soldering process.

The embodiment of the invention provides a method for manufacturing a light emitting diode package, comprising: providing a lead frame comprising a first electrode piece and a second electrode piece surrounded by a peripheral base, wherein the first electrode The first electrode sheet includes a first functional portion and at least one first connecting portion, and the second electrode sheet includes a second functional portion and At least one second connecting portion, the at least one first connecting portion and the at least one second connecting portion are respectively connected to the first functional portion and the second functional portion along the first axis or along a second axis from the peripheral base portion The width of the at least one first connecting portion and the width of the at least one second connecting portion are smaller than the width of the first and second functional portions, and the second axis is substantially perpendicular to the first axis; Electroplating layer on the surface of the lead frame; emitting a cup-shaped insulator provided with a recessed functional area, covering at least part of the first electrode piece and a portion of the second electrode piece, and exposing the first and second portions Functional part in this recessed functional area Cutting the connection between the first functional portion and the second functional portion and the at least one first connecting portion and the at least one second connecting portion, so that the first functional portion and the second functional portion each have At least one notch is recessed in one of the end surfaces in the direction parallel to the second axis or recessed in one of the side surfaces in the direction parallel to the first axis; at least one light emitting diode chip is mounted on the first functional portion And electrically coupled to the first functional portion and the second functional portion; and forming a package adhesive in the cup-shaped insulator to encapsulate the LED.

The embodiment of the invention also provides a light-emitting diode package, comprising: a first electrode sheet and a second electrode sheet, the surface of which is plated with a plating layer; and a cup-shaped insulator provided with a recessed functional area, located at the first a first electrode sheet and the second electrode sheet are exposed on an electrode sheet and a second electrode sheet by recessing the functional region; at least one light emitting diode wafer, the first electrode located in the cup insulator And an encapsulating package for encapsulating the LED chip, wherein the first and second electrode sheets each have a first end extending on one end surface of the cup insulator or a second axis Each of the upper surfaces has a side surface extending from the cup-shaped insulator, and the end surfaces or the side surfaces have at least one notch recessed therein, wherein the second axis is substantially perpendicular to the first axis.

The above and other objects, features and advantages of the present invention will become more <RTIgt;

The invention will be followed by a number of different embodiments to implement different features of the invention. The compositions and configurations in the specific embodiments are described below to simplify the present invention. These are not intended to limit the invention. In addition, repeated element symbols may be present in various examples of the present description in order to simplify the description, but this does not represent any particular connection between the various embodiments or the drawings.

The embodiment of the present invention provides a light emitting diode package and a method of fabricating the same for a light emitting diode using a thermosetting plastic. A light emitting diode package according to an embodiment of the invention includes a side electrode protected by a plating layer and an insulating cup using a thermosetting material, and a plurality of grooves may be formed on a side of the insulating cup.

1A to 1F are views showing a method of manufacturing a light-emitting diode package according to a first embodiment of the present invention and its schematic diagrams at various intermediate process stages. First, referring to Fig. 1A, a metal lead frame formed by stamping is provided. This lead frame can contain copper. In this embodiment, the lead frame can be a separate lead frame. The leadframe can include a first electrode sheet 104, a second electrode sheet 106, and a plurality of pre-inserted structures 108 surrounded by a peripheral base 102. The first electrode sheet 104 and the second electrode sheet 106 may have a space 105 therebetween to provide the first electrode sheet 104 and the second electrode sheet 106 from being isolated from each other in the final product of the LED package. The first electrode sheet 104 can include a first functional portion 104a and at least one first connecting portion 104b. The second electrode sheet 106 may include a second functional portion 106a and at least one second connecting portion 106b. The first electrode piece 104 and the second electrode piece 106 may extend on the first axis (the x-axis direction as shown in the drawing) such that the first connecting portion 104b may be connected to the first axis from the peripheral base 102 along the first axis The functional portion 104a, and the second connecting portion 106b is connectable from the peripheral base 102 along the first axis to the second functional portion 106a.

The width of the first connecting portion 104b on the second axis (the y-axis direction as shown in the drawing) is smaller than the width of the first functional portion 104a. Similarly, the width of the second connecting portion 106b on the second axis (the y-axis direction as shown in the drawing) is smaller than the width of the second functional portion 106a. The second axis is substantially perpendicular to the first axis. Therefore, the first electrode sheet 104 and the second electrode sheet 106 each have an end surface 110 that is parallel to the second axis. The first connecting portion 104b may be a strip connecting the end surface 110 of the first functional portion 104a to the peripheral base portion 102 along the first axis, and the second connecting portion 106b may be an end connecting the second functional portion 106a along the first axis. The strip 110 is to the strip of the peripheral base 102. For example, as shown in FIG. 1A, the first connecting portion 104b is connected to the center of the end surface 110 of the first functional portion 104a, and the second connecting portion 106b is connected to the center of the end surface of the second functional portion 106a. In one embodiment, the portion of the end surface 110 that is not covered by the first connection portion 104b and the second connection portion 106b is the exposed surface of the metal lead frame.

In an embodiment, the plurality of pre-insertion structures 108 can extend over the second axis. The pre-insertion structures 108 can have one end connected to the peripheral base 102 and have a distal end 109 extending along the second axis to be adjacent to the first electrode sheet 104 and the second electrode sheet 106.

For example, taking FIG. 1A as an example, four pre-insertion structures 108 are respectively located on both sides of the first electrode piece 104 and the second electrode piece 106 on the second axis. The pre-insertion structures 108 each have a terminal end 109 and a region extending adjacent to the first electrode sheet 104, and are not substantially connected to the first electrode sheet 104 and the second electrode sheet 106 to facilitate subsequent bending of the pre-insertion structures 108. . It should be noted that although only four pre-insertion structures 108 are shown in FIG. 1A, the number and position of the pre-insertion structures may not be limited thereto in other embodiments, for example, the pre-insertion structure may be other more or more. A small number. In addition, the pre-insertion structures 108 may be symmetric with respect to the first electrode sheet 104 and the second electrode sheet 106 to prevent the first electrode sheet 104 and the second electrode sheet 106 from being tilted due to uneven force. For example, taking FIG. 1A as an example, the two pre-insertion structures 108 are symmetrically located on the two sides of the first functional area 104a on the second axis, and the other two pre-insertion structures are symmetrically located on the sides of the second axis. .

Next, referring to Figure 1B, the leadframe surface is electroplated to form a plating layer 120 covering all surfaces of the leadframe. The plating layer 120 may cover all surfaces of the first electrode sheet 104, the second electrode sheet 106, the peripheral base portion 102, and the plurality of pre-insertion structures 108. For example, the plating layer 120 may cover the upper surface and the bottom surface including the first electrode sheet 104 and the second electrode sheet 106, and the end surface 110 of the first functional portion 104a and the second functional portion 104b. The plating layer 120 may comprise silver or other electrically conductive material that is not susceptible to oxidation. The plating layer 120 provides protection to the surface of the lead frame, making it less susceptible to oxidation and affecting its electrical properties. Plating layer 120 can be formed by electroplating, electroless plating, sputtering, evaporation, or other suitable method.

Referring to Figure 1C, it is shown that a cup of insulator 124 is formed overlying the leadframe. The cup insulator 124 may comprise a thermosetting resin such as an epoxy resin, a silicone or a combination of the foregoing. The thermosetting resin has better high light and heat resistance than the thermoplastic resin, and has higher design flexibility and higher initial reflectance than the ceramic material and the ruthenium substrate. The cup insulator 124 can be formed by a buried incident process. The cup insulator 124 may cover at least a portion of the first electrode sheet 104 and the second electrode sheet 106 and be provided with a recessed functional area. The recessed functional region can expose the upper surfaces of the first electrode sheet 104 and the second electrode sheet 106 as mounting positions of the light emitting diode wafer. The cup insulator 124 may be filled in the space 105 between the first electrode sheet 104 and the second electrode sheet 106 to isolate the first electrode sheet 104 and the second electrode sheet 106 from each other. It should be noted that the cup-shaped insulator 124 does not extend beyond the ends of the first functional portion 104b and the second functional portion 106b on both sides of the first shaft. That is, the first functional portion 104a and the second functional portion 106b may each have a portion that extends beyond the cup insulator 124 on the first axis. The end surface 110 is still only covered by the plating layer 120 as an electrode. Further, the width of the cup insulator 124 on the second shaft may exceed the width of the first functional portion 104a and the second functional portion 106a. Therefore, the cup insulator 124 can cover at least a plurality of pre-insertion structures 108 (including the cover end 109), and the side surfaces of the first functional portion 104a and the second functional portion 106a parallel to the first axis.

Next, referring to FIG. 1D, the connection between the first functional portion 104a and the first connecting portion 104b and the connection between the second functional portion 106a and the second functional portion 106b are performed so that the first functional portion 104a and the first functional portion 104a The end surfaces 110 of the two functional portions 104b each have a notch 130 recessed therein to form a discontinuous surface. The notch 130 can have any shape and depth, and it can be determined by the shape and size of the cutting blade. The surface of the notch 130 exposes the original metal material of the lead frame, such as the original material copper that exposes the lead frame. Except for the notch 130, the end surfaces 110 of the remaining first functional portion 104a and the second functional portion 106a are still flat surfaces covered by the plating layer 120. For example, in the present embodiment, the end surfaces 110 of the first functional portion 104a and the second functional portion 106a each include a notch 130 having a bare copper surface recessed in a silver-plated flat surface.

Next, referring to FIG. 1E, a packaging process of the LED chip is performed, and the LED chip 140 is mounted on the first electrode pad 104 in the recessed functional region of the cup insulator 124, and is connected to the first electrode by the wire 145. The electrode sheet 104 and the second electrode sheet 106 are electrically connected. Alternatively, it can also be applied to a flip chip packaging process without the need for wire bonding. Next, referring to FIG. 1F, the cup insulator 124 is covered with an encapsulant 160, and the encapsulant 160 is baked and cured. Finally, referring to FIG. 1G, the pre-insertion structure 108 is bent to separate the LED package from the metal lead frame, that is, to complete the LED package as shown. It is noted that since the cup-shaped insulator 124 partially covers a portion of the pre-insertion structure 108 at the time of injection molding, and fills the gap between the pre-insertion structure 108 and the first and second electrode sheets. After removal of the pre-inserted structures 108, the recesses 150, 152 left by the pre-inserted structures 108 are left on the side surfaces of the first axis of the cup-shaped insulator 124. Wherein, the surface material in the grooves 150 and 152 is also a thermosetting insulator material, but the surface roughness is high due to contact with the end 109 of the pre-insertion structure 108, and the surface of the insulator in the remaining area still retains the initial mold after injection molding. The smoother surface, in contrast, the surface roughness of the grooves 150 and 152 is higher than the other portions of the cup insulator 124. The pre-insertion structure 108 can be folded, for example, by mechanical stamping or the like.

As such, the LED package structure can include a first electrode sheet 104, a second electrode sheet 106, and a cup insulator 124 having a recessed functional region. The first electrode sheet 104 and the second electrode sheet 106 are covered by the plating layer 120 and have a space 105 therebetween. The first electrode sheet 104 and the second electrode sheet 106 each extend over the first axis to protrude from the cup insulator 124 to have an exposed end surface 110. The end surface 110 can have a notch 130 recessed in a flat surface covered by the plating layer 120. The cup-shaped insulator 124 may be disposed on the first electrode sheet 104 and the second electrode sheet 106, and has a recessed functional region exposing the upper surfaces of the first electrode sheet 104 and the second electrode sheet 106 for the light-emitting diode wafer The 140 is mounted thereon. In addition, the cup-shaped insulator 124 has a plurality of grooves 150 and 152 parallel to one side of the first axis.

The light emitting diode package structure as described in this embodiment may have side electrodes protected by a plating layer. Therefore, not only can the performance of the LED component of the light-emitting diode be directly tested by the side-clamp tester, but the side electrode can be kept stable for a long time and is not easily oxidized. It should be noted that although the surface of the notch is still the original material of the lead frame which is easy to be oxidized, the notch is a recessed area, and the side clamp type test instrument only contacts the outer plating layer during the clamping test, and does not touch. To the gap. Therefore, even if the gap is oxidized, it will not affect the test results. In addition, since the side electrodes have been covered by the plating layer, the side electrodes can also be used as a soldering area as a surface mounting technique, which further increases the selection of the soldering direction of the separate lead frame. In addition, the gap between the first electrode sheet and the second electrode sheet of the LED package structure of the embodiment is a small portion at the center of the end surface of the first electrode sheet and the second electrode sheet, and thus Most of the surface of the end surface of one of the electrode sheets and the second electrode sheet may still be covered by the plating layer.

2A to 2C are views showing a method of manufacturing a light-emitting diode lead frame according to a second embodiment of the present invention and its schematic diagrams at various intermediate process stages. The technical features of this embodiment and the foregoing first embodiment are substantially the same as those of the foregoing embodiment, and thus the description thereof will not be repeated. This embodiment differs from the first embodiment described above in that the end surfaces of the first electrode sheet and the second electrode sheet have two or more notches.

First, referring to Fig. 2A, a lead frame similar to that shown in Fig. 1A is shown. However, it should be noted that the first electrode piece 204 includes a first functional portion 204a and two first connecting portions 204b, and the second electrode plate 206 includes a second functional portion 206b and two second connecting portions 206b. The first electrode sheet 204 and the second electrode sheet 206 each have an end surface 210 that is parallel to the second axis. The two first connecting portions 204b are connected from the peripheral base 102 along the first axis (x-axis direction) to the end surface 210 of the first functional portion 204a, and the two second connecting portions 206b are connected from the peripheral base 102 along the first axis to the second function. The end surface of portion 206a. Furthermore, the total width of the two first connecting portions 204b on the second axis may be smaller than the width of the first functional portion 204a. Similarly, the total width of the two second connecting portions 206b on the second axis may be smaller than the width of the second functional portion 206a. Therefore, as shown in FIG. 2A, the two first connecting portions 204b may be two strips connecting the two ends of the end surface 210 of the first functional portion 204a to the peripheral base portion 102, and the two second connecting portions 206b may be connected. Two ends of the end surface 210 of one functional portion 206a to two long strips of the peripheral base portion 102.

Next, the metal lead frame shown in FIG. 2A is subjected to the same steps as in FIGS. 1B to 1F, for example, subsequently plating the lead frame surface, ejecting the cup insulator, cutting the first electrode sheet and the second electrode sheet, and first a connection portion between the connecting portion and the second connecting portion, mounting and encapsulating the light emitting diode, and bending the pre-insertion structure to separate the light emitting diode package from the metal lead frame, and finally forming the light emitting diode as shown in FIG. 2B Body package. Referring to FIG. 2B, the cup-shaped insulator 124 does not extend beyond the ends of the first functional portion 204a and the second functional portion 206a on both sides of the first shaft. That is, the first functional portion 204a and the second functional portion 206a may each have a portion that extends beyond the cup insulator 124 on the first axis. The end surfaces 210 of the first functional portion 204a and the second functional portion 206a each have two notches 230 recessed therein to form a discontinuous surface. For example, the end surfaces 210 of the first functional portion 204a and the second functional portion 206b may include a protruding flat surface sandwiched between the two notches 230. The surface of the notch 230 exposes the original metal material of the lead frame, such as the original material copper that exposes the lead frame. The protruding flat surface of the end surface 210 is a flat surface covered by the plating layer 220. The notch 230 can have any shape and depth that can be determined by the shape and size of the cutting blade used to perform the cutting.

In the present embodiment, as in the first embodiment described above, the cup-shaped insulator 124 partially covers a portion of the pre-insertion structure 108 during injection molding. Therefore, after the pre-insertion structure 108 is bent to separate the LED package from the metal lead frame, the cup-shaped insulator 124 also leaves the pre-insertion structure 108 on its side parallel to the first axis. The grooves 150, 152 left. Also, the surface roughness of the grooves 150 and 152 is higher than other portions of the cup insulator.

The light emitting diode package structure as described in this embodiment may have side electrodes protected by a plating layer. Therefore, it can also be applied to directly test the performance of the side clamp type test device, and can keep the side electrode stable for a long time and is not easily oxidized. Although the surface of the notch is still a metal lead frame material which is easy to oxidize, the notch is a recessed area, and when the side clamp type tester is clamped, the probe only contacts the outer plating layer and does not touch the notch. Therefore, even if the gap is oxidized, it will not affect the test results. In addition, since the side electrodes have been covered by the plating layer, the side electrodes can also be used as the soldering area of the surface mounting technology, which further increases the selection of the soldering direction of the separate lead frame. In addition, the first electrode sheet and the second electrode sheet of the LED lead frame of the embodiment are notched at the ends of the end surfaces of the first electrode sheet and the second electrode sheet, and can be directly cut by the corner. It is easier and more acceptable to remove the first connecting portion and the second connecting portion.

3A to 3C are views showing a method of manufacturing a light-emitting diode lead frame according to a third embodiment of the present invention and a schematic view thereof at various intermediate process stages. The technical features of the present embodiment and the foregoing embodiments are substantially the same as those of the foregoing first embodiment, and thus the description thereof will not be repeated. The first embodiment differs from the first embodiment in that the first connecting portion and the second connecting portion connect the first functional portion and the second functional portion to the peripheral base along the second axis.

First, referring to Fig. 3A, a metal lead frame similar to that shown in Fig. 1A is shown. The leadframe can include a first electrode sheet 304, a second electrode sheet 306, and a plurality of pre-inserted structures 108 surrounded by a peripheral base 102. The first electrode sheet 304 and the second electrode sheet 306 may have a space 105 therebetween to provide the first electrode sheet 304 and the second electrode sheet 306 from being isolated from each other in the final product of the LED package. The first electrode sheet 304 may include a first functional portion 304a and at least one first connecting portion 304b. The second electrode sheet 306 can include a second functional portion 306a and at least one second connecting portion 306b. However, it is to be noted that the first connecting portion 304b and the second connecting portion 306b respectively connect the first functional portion 304a and the second functional portion 306a to the peripheral base portion 102 along the second axis. A plurality of pre-insertion structures 308 extend from the peripheral base 102 along the first axis to adjacent the first functional portion 304a and the second functional portion 306ba. For example, as shown in FIG. 3A, the first connecting portion 304b and the second connecting portion 306b are located on the same side of the first electrode piece 304 and the second electrode piece 306 on the second axis, and are connected to the first axis along the second axis. The functional portion 104a and the second functional portion 106a are connected to the peripheral base. The two pre-pins 308 are respectively located on opposite sides of the first functional portion 304a and the second functional portion 306a on the first axis, and extend from the peripheral base 102 along the first axis to adjacent to the first functional portion 304a and the first The second functional unit 306a is not substantially connected to the first functional unit 304a and the second functional unit 306a. It should be noted that although only two pre-insertion structures 308 are shown in FIG. 3A, the number and position of the pre-insertion structures may not be limited thereto in other embodiments, for example, the pre-insertion structure may be other more or more. A small number.

Next, steps of FIGS. 1B to 1F are performed to form a light emitting diode package structure as shown in FIG. 3B. It should be noted that in the present embodiment, when the cup-shaped insulator 124 is injection-molded as in the step 1C, the cup-shaped insulator 124 does not cover the first functional portion 304a and the second functional portion 306a on the second axis. The side surfaces 310 of the first connection portion 306a and the second connection portion 306b are adjacent to each other, but a portion of the pre-insertion structure 308 is covered. Therefore, after performing the cutting step as shown in FIG. 1D, the side surfaces 310 of the first functional portion 304a and the second functional portion 306a parallel to the first axis may each have a notch 330 recessed therein to form a discontinuity. The surface (as shown in Figure 3B). It should be noted that the side surfaces 310 of the first functional portion 304a and the second functional portion 306a parallel to the first axis are located on the same side of the cup insulator 124. The notch 330 can have any shape and depth and can be determined by the shape and size of the cutting blade. The surface of the notch 330 exposes the original metal material of the lead frame, such as the original material copper that exposes the lead frame. In addition to the notch 330, the remaining side surfaces 310 of the first functional portion 304a and the second functional portion 306a parallel to the first axis are still flat surfaces covered by the plating layer 320.

Finally, referring to FIG. 3C, the pre-insertion structure 308 is bent to separate the LED package from the metal lead frame. Grooves 350 each having a bent pre-inserted structure 308 are formed on both sides of the parallel second axis of the cup-shaped insulator 124. Also, the surface roughness of the groove 350 is higher than other portions of the cup insulator.

Therefore, in the present embodiment, the first functional portion 304a and the second functional portion 306a have portions protruding from the cup insulator on the second axis, and thus have side surfaces 310 parallel to the first axis. Therefore, the LED package formed in accordance with the present embodiment can further have a larger area of the side electrodes. In addition, the side surface 310 parallel to the first axis is also protected by the plating layer 320, thereby facilitating creeping. Therefore, the LED package according to the embodiment can be applied to directly test the performance of the side-clamp test device, and the LED package can be directly mounted on the side surface 310 to other electronic components. For example, printed circuit boards (PCBs) provide more design flexibility.

4A to 4C are views showing a method of manufacturing a light-emitting diode lead frame according to a fourth embodiment of the present invention and its schematic diagrams at various intermediate process stages. The technical features of the present embodiment and the foregoing embodiments are substantially the same as those of the foregoing first embodiment, and thus the description thereof will not be repeated. The first embodiment differs from the first embodiment in that the metal lead frame does not include a pre-pin, and the first electrode piece and the second electrode piece are connected to the peripheral base only by the first connecting portion and the second connecting portion.

First, referring to Fig. 4A, a metal lead frame similar to that shown in Fig. 1A is shown. However, it is worth noting that the metal lead frame does not include the pre-inserted structure 108. Next, the steps of FIGS. 1B to 1F are performed to form a light emitting diode package structure as shown in FIG. 4B. It is to be noted that, in the present embodiment, when the cup-shaped insulator 424 is injection-molded as in the step 1C, the cup-shaped insulator 424 fills the first functional portion 104a and the second functional portion 106a and the peripheral base portion 102. The gap on the two axes. In an embodiment, the cup insulator 424 may be substantially aligned with the peripheral base 102 on the outer side of the second shaft. Therefore, the side surfaces of the first functional portion 104a and the second functional portion 104b parallel to the first axis are covered by the cup insulator. Since the cup-shaped insulator 424 fills the gap between the first functional portion 104a and the second functional portion 106a and the peripheral base portion 102 on the second axis, the cup-shaped insulator 424 can be caught between the first electrode sheet 104 and the second electrode sheet 106. It is a function between the peripheral bases 102 and thus a pre-inserted structure, and the first electrode sheets 104 and the second electrode sheets 106 are fixed on the metal lead frame. Therefore, even if the first connection portion 106a and the second connection portion 106b are cut off as in the step of FIG. 1D, the first electrode piece 104 and the second electrode piece 106 are still fixed to the metal lead frame by the cup insulator 424. .

Finally, referring to Fig. 4C, an external force is applied to the metal lead frame to separate the light emitting diode package from the metal lead frame. For example, the metal lead frame can be mechanically stamped. As shown in FIG. 4C, in accordance with the LED package of the present embodiment, the two sides of the cup-shaped insulator 424 parallel to the first axis do not include a groove, but have traces for removing the metal lead frame, such as in the figure. The stamp 425 is shown.

Similarly, with the die mark 425 as a reference line, the surface of the cup-shaped insulator 424 below the die mark 425 is in contact with the peripheral base 102, and the surface of the cup-shaped insulator above the die mark 425 remains without contact with the peripheral base 102. The smoother insulator surface after injection molding. Therefore, the surface roughness of the portion of the cup-shaped insulator 424 parallel to the side surface of the first axis that is below the mold mark 425 is higher than the other portions of the cup-shaped insulator 424.

Therefore, in the present embodiment, the metal lead frame can eliminate the need to form a pre-inserted structure, reducing the manufacturing complexity of the metal lead frame. In addition, the LED package according to the embodiment also has a side electrode protected by a plating layer, which is suitable for directly testing the performance of the side clamp type tester, and can be kept from being oxidized for a long time.

While the invention has been described above in terms of several preferred embodiments, it is not intended to limit the scope of the present invention, and any one of ordinary skill in the art can make any changes without departing from the spirit and scope of the invention. And the scope of the present invention is defined by the scope of the appended claims.

102. . . Peripheral base

104. . . First electrode sheet

104a. . . First function

104b. . . First connection

105. . . interval

106. . . Second electrode sheet

106a. . . Second function

106b. . . Second connection

108. . . Pre-inserted structure

109. . . End of pre-inserted structure

110. . . End surface

120. . . Plating

124. . . Cup insulator

130. . . gap

140. . . Light-emitting diode chip

145. . . wire

150. . . Groove

152. . . Groove

160. . . Packaging adhesive

204. . . First electrode sheet

204a. . . First function

204b. . . First connection

206. . . Second electrode sheet

206a. . . Second function

206b. . . Second connection

210. . . End surface

220. . . Plating

230. . . gap

304. . . First electrode sheet

304a. . . First function

304b. . . First connection

206. . . Second electrode sheet

306a. . . Second function

306b. . . First connection

308. . . Pre-inserted structure

310. . . Side surface

320. . . Plating

330. . . gap

350. . . Groove

424. . . Cup insulator

425. . . Mold mark

1A to 1G are views showing a method of manufacturing a light-emitting diode lead frame according to a first embodiment of the present invention and its schematic diagrams at various intermediate process stages.

2A to 2B are views showing a method of manufacturing a light-emitting diode lead frame according to a second embodiment of the present invention and its schematic diagrams at various intermediate process stages.

3A to 3C are views showing a method of manufacturing a light-emitting diode lead frame according to a third embodiment of the present invention and a schematic view thereof at various intermediate process stages.

4A to 4C are views showing a method of manufacturing a light-emitting diode lead frame according to a fourth embodiment of the present invention and its schematic diagrams at various intermediate process stages.

120. . . Plating

130. . . gap

150. . . Groove

152. . . Groove

160. . . Packaging adhesive

Claims (29)

A manufacturing method of a light emitting diode package includes: providing a lead frame comprising a first electrode piece and a second electrode piece surrounded by a peripheral base, wherein the first electrode piece and the second electrode The first electrode piece includes a first functional portion and at least one first connecting portion, and the second electrode plate includes a second functional portion and at least a second connecting portion. The at least one first connecting portion and the at least one second connecting portion respectively connect the first functional portion and the second functional portion along the first axis or along a second axis, wherein the at least one The width of a connecting portion and the width of the at least one second connecting portion are smaller than the width of the first and second functional portions, and the second axis is substantially perpendicular to the first axis; plating a plating layer on the lead frame Forming a cup-shaped insulator provided with a recessed functional area, covering at least a portion of the first electrode sheet and a portion of the second electrode sheet, and exposing the first and second functional portions of the exposed portion to the recess In the ribbon; from the first function And cutting the connection between the second functional portion and the at least one first connecting portion and the at least one second connecting portion, so that the first functional portion and the second functional portion each have at least one notch recessed therein In one of the end surfaces parallel to the second axis direction or recessed in one of the side surfaces parallel to the first axis direction; mounting at least one light emitting diode chip on the first functional portion and electrically The first functional portion and the second functional portion are coupled to each other; and an encapsulant is formed in the cup-shaped insulator to encapsulate the light-emitting diode wafer. The method of manufacturing a light-emitting diode package according to claim 1, wherein the cup-shaped insulator comprises a thermosetting resin. The method of manufacturing a light emitting diode package according to claim 1, wherein the lead frame comprises copper. The method of manufacturing a light emitting diode package according to claim 1, wherein the plating layer comprises silver. The method for manufacturing a light emitting diode package according to claim 1, wherein the surface of the at least one notch exposes an original material of the lead frame. The method for manufacturing a light emitting diode package according to claim 1, wherein the at least one first connecting portion is connected to the end of the first functional portion from the peripheral base along the first axis. a strip of a center of the surface, the at least one second connecting portion being a strip extending from the peripheral base along the first axis to a center of the end surface of the second functional portion. The method of manufacturing the LED package of claim 1, wherein the at least one first connecting portion is two from the peripheral base connected to the first functional portion along the first axis. a strip of end surfaces, the at least one second connecting portion being two strips from the peripheral base connected to the end surface of the second functional portion along the first axis. The method of manufacturing the light emitting diode package of claim 1, wherein the at least one first connecting portion is a side surface connected to the first functional portion from the peripheral base along the second axis. a strip, the at least one second connecting portion being a strip connected from the peripheral base to the side surface of the second functional portion along the second axis. The method of manufacturing the light emitting diode package of claim 1, wherein the lead frame further comprises a plurality of pre-insertion structures, wherein each of the pre-insertion structures is connected to the peripheral base and has an end along the first a shaft or the second shaft extends adjacent to the first functional portion and the second functional portion, wherein the at least one first and second connecting portions are connected to the connecting direction of the first and second functional portions and the The distal end of the pre-inserted structure extends to be different from the direction in which the first and second functional portions extend. The method of fabricating a light emitting diode package according to claim 9, wherein the step of emitting the cup insulator comprises covering an end of the pre-inserted structures. The method for manufacturing a light-emitting diode package according to claim 10, further comprising: after the cup-shaped insulator is ejected, bending the pre-insertion structures such that the cup-shaped insulator is parallel to the first The shaft or the side of the second shaft has a groove that is bent away from the pre-inserted structures. The method for manufacturing a light emitting diode package according to claim 11, wherein the at least one first and second connecting portions of the lead frame are respectively connected to the peripheral axis along the first axis. The first and second functional portions extend along the second axis to the first and second functional portions to enable the first functional portion and the second functional portion Each of the at least one notch is recessed in its end surface in the direction parallel to the second axis, and the cup-shaped insulator has a concave on the side parallel to the first axis to the pre-insertion structure groove. The method of manufacturing the LED package of claim 11, wherein the at least one first and second connecting portions of the lead frame are respectively connected to the peripheral axis along the second axis. In the first and second functional portions, the end of the pre-insertion structure extends along the first axis to be adjacent to the first and second functional portions, such that the first functional portion and the second functional portion Each of the at least one notch is recessed in a side surface thereof in a direction parallel to the first axis, and the cup-shaped insulator has a concave surface on the side parallel to the second axis to be left by the pre-insertion structures groove. The method for manufacturing a light emitting diode package according to claim 11, wherein the grooves have a surface roughness higher than other portions of the cup insulator. The method for manufacturing a light-emitting diode package according to claim 1, wherein the at least one first and second connecting portions are respectively connected to the first and second portions from the peripheral base along the first axis. In the case of the two functional portions, the cup-shaped insulator that is emitted fills the gap between the first functional portion and the second functional portion along the second axis and the peripheral base. The method for manufacturing a light-emitting diode package according to claim 15, further comprising: emitting the cup insulator and cutting the at least first connecting portion and the at least one second connecting portion, and the light emitting two After the polar body chip is packaged, an external force is applied to separate the cup-shaped insulator from the peripheral base, leaving a stencil on the side surface of the cup-shaped insulator parallel to the first axis. The method for manufacturing a light-emitting diode package according to claim 16, wherein a surface of the cup-shaped insulator parallel to the side surface of the first axis is located below the mold surface. The other parts of the insulator are high. A light-emitting diode package includes: a first electrode sheet and a second electrode sheet, the surface of which is plated with a plating layer; a cup-shaped insulator provided with a recessed functional area, located at a first electrode sheet and a first electrode And exposing a portion of the first electrode sheet and the second electrode sheet to the second electrode sheet; at least one light emitting diode wafer is disposed on the first electrode sheet in the cup insulator; and an encapsulant Encapsulating the LED chip; wherein the first and second electrode sheets each have an extension protruding from one end surface of the cup insulator on a first axis or an extension protrusion on a second axis And at the side surface of the cup-shaped insulator, the end surfaces or the side surfaces have at least one notch recessed therein, wherein the second axis is substantially perpendicular to the first axis. The light-emitting diode package of claim 18, wherein the cup-shaped insulator comprises a thermosetting resin. The light emitting diode package of claim 18, wherein the first electrode sheet and the second electrode sheet comprise copper. The light emitting diode package of claim 18, wherein the plating layer comprises silver. The illuminating diode package of claim 18, wherein the cup insulators are parallel to each other when the end surfaces of the first and second electrode sheets have the at least one notch recessed therein The first shaft has at least one groove on its side. The light emitting diode package of claim 22, wherein the at least one groove has a surface roughness higher than other portions of the cup insulator. The illuminating diode package of claim 18, wherein when the side surfaces of the first and second electrode sheets have the at least one notch recessed therein, and the cup insulator is parallel to Each of the two sides of the second shaft has at least one groove. The light emitting diode package of claim 24, wherein the at least one groove has a surface roughness higher than other portions of the cup insulator. The light-emitting diode package of claim 24, wherein the side surfaces of the first and second electrode sheets are located on the same side of the cup-shaped insulator. The light emitting diode package of claim 18, wherein the end surfaces or the side surfaces of the first and second electrode sheets are covered by the plating layer, and the recesses are The end surfaces or the notches of the side surfaces expose the original material of the second electrode sheet of the first electrode sheet. The light-emitting diode package of claim 18, wherein the end surfaces each comprise a protruding flat surface sandwiched between the two notches. The illuminating diode package of claim 18, wherein the cup-shaped insulator further comprises a plurality of end surfaces of the first and second electrode sheets having the at least one notch recessed therein a mold mark is located on a side surface of the cup-shaped insulator parallel to the first axis, wherein a surface of the cup-shaped insulator parallel to a side surface of the first shaft and located under the mold mark has a surface roughness compared to the cup-shaped insulator The other parts are high.