TW201337273A - Wiring of probe structure unit and manufacturing method thereof - Google Patents

Abstract

The present invention is to provide a probe card with a probe structure for reducing wiring layers of a multilayer wiring board in a cantilever type probe structure constituted by laminating metal materials by means of MEMS technique, and to provide a manufacturing method thereof. The technical solution has the following features: a probe structure unit including probe wiring parts at the probe structures (12) for reducing wiring layers of a multilayer wiring board (50) is manufactured integrally. The probe structure (12) comprises arms (34, 40) having one end on which a needle tip portion (46) is mounted and the other end fixed, and a probe support (32) provided at the fixed end side of the arms (34, 40). Either one of or both of the arms and the probe support (32) has a multilayer laminate structure formed by laminating a plurality of flat sheets and a probe wire for connecting the plural probe structures (12) at the same laminate as that of either one.

Description

Wiring of probe structure unit and manufacturing method

The present invention relates to a probe structure for a probe structure in a probe card used in an energization test of a semiconductor integrated circuit, and a probe structure unit for directly wiring the probe structure and Its manufacturing method.

Since the semiconductor integrated circuit is highly integrated, the components constituting the circuit are also miniaturized. Accordingly, the test device used for the characteristic evaluation performed in the manufacturing process also requires a fine structure. Probe.

The probe card used as a test device for a semiconductor integrated circuit corresponds to a fine structure, and the probe structure used is also manufactured with high precision by MEMS (Micro Electro Mechanical System) technology. Construction.

The probe structure of the one-side support beam structure supported by the flexible insulating synthetic resin film provided in the substrate of the probe card is fixed to the wiring substrate of the synthetic resin film via the pedestal at the front end At the portion, a tip portion for contacting the electrode of the semiconductor circuit is mounted. This probe structure is a micro-structure of micro-order. As a MEMS technology, it adopts photolithography.

The probe structure is manufactured by stacking a metal material to form a needle tip portion in a plurality of concave portions arranged on a base, and then sequentially constructing the probe structure The arm portion of the body and the pedestal which is a fixed portion of the synthetic resin film are formed by photolithography, whereby a fine probe structure is produced at a high density (refer to Patent Documents 1 and 2). Wait).

The probe structure unit is composed of a plurality of probe structures, and each probe structure is connected to the multilayer wiring substrate which is laminated to the probe structure unit, and passes through each probe structure. The pedestal to seek electrical connection. The tip of the probe structure is brought into contact with the electrode of the semiconductor integrated circuit to be inspected, and the electrical inspection of the semiconductor integrated circuit is performed. The electrode of the semiconductor integrated circuit is a main power source electrode for driving a semiconductor element, and a grounding electrode, a signal electrode, and a sub power source electrode (such as an analog input power supply or a signal input/output power source) And constitute it.

The multilayer wiring board is generally formed by laminating an insulating layer in a plurality of layers, and a wiring conductor layer is formed between the layers of the insulating layer, and the base substrate is made of a ceramic such as alumina ceramic or aluminum nitride ceramic. On the main surface, a resin insulating layer formed by coating a resin and heat-hardening made of an epoxy resin or a polyimide resin is laminated in a plurality of layers, and between the layers of the resin insulating layer, by copper In the metal material such as aluminum, a thin film wiring layer is formed by a thin film forming technique such as an electroplating method or a vapor deposition method, and a photolithography technique, whereby electrical wiring is performed.

The multilayer wiring board is formed with a probe electrode pad for connecting to the probe at the surface thereof. Further, in order to connect to the interposer substrate, an external connection electrode pad is formed on the lower surface of the base substrate, and the probe electrode pad and the external connection electrode pad are formed. The sheet is joined by a connection pad existing at the interface between the base substrate and the film wiring layer (refer to Patent Documents 3 and 4, etc.).

The connection between the probe structures is not limited to a multilayer wiring substrate. For example, in the form of the thin film probe, the conductive probe electrodes are arranged in a lattice shape on the circuit substrate surface (thin film probe) on which the linear pattern is formed, and the specific electrodes of the probe electrodes are placed on each other. A short circuit is formed, and a line pattern is formed in a radial shape. In the LSI wafer to be contacted, it is possible to select two or more types that can prevent short-circuiting of the terminal electrodes due to the linear pattern on the surface of the circuit board (refer to Patent Document 5 and the like).

Further, it is also proposed to provide an electronic component such as a capacitor, a resistor, a transistor, or the like which is electrically connected to each other from the substrate at a fixed end side of the probe structure of the probe side support beam structure. As a base structure for installation. This base structure is provided between the probe structure and the substrate (refer to Patent Document 6, etc.).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-285802

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2010-286360

[Patent Document 3] Japanese Patent Laid-Open Publication No. 2004-214586

[Patent Document 4] Japanese Patent Laid-Open Publication No. 2010-177555

[Patent Document 5] Japanese Patent Laid-Open No. Hei 7-63788

[Patent Document 6] Japanese Patent Publication No. 2009-534660

However, although a structure in which wiring is provided on a substrate or a structure in which a base structure for mounting an electronic component is provided has been proposed from the prior art, the wiring layer of the multilayer wiring substrate is reduced, and the design is designed. In the above problem, wiring is performed in a multilayer wiring board.

Therefore, in particular, a secondary power source (hereinafter referred to as a second power source) for driving a main power source for a semiconductor element (hereinafter referred to as a first power source), a ground, and an analog circuit is commonly used between the electrodes. Since it is connected, it cannot be placed on the same layer as other signal lines. Therefore, there is a problem that the wiring layer is increased.

For example, as shown in FIG. 27, in the integrated circuit electrode 110 of the integrated circuit board, a plurality of signal electrode pads 112 and a first power source electrode pad 114 are used as the first power source electrode. Four of the pads 114-1 to 4, the second power source electrode pad 116 is four of the second power source electrode pads 116-1 to 4, and the ground electrode pad 118 is a ground electrode pad. 12 of the pieces 118-1~12. In order to wire the common electrode pads, it is necessary to connect the respective electrode pads.

However, since the wirings of the first power source and the second power source are crossed, it is not possible to provide the same wiring layer, and it is necessary to provide separate wirings in the different wiring layers.

FIG. 28 shows the multilayer wiring substrate 120 and the probe structure 130. At the multilayer wiring substrate 120, a layer for wiring the input and output signal lines 122, a layer for wiring the ground line 124, and The first power supply line 126 is provided with a layer for wiring and a layer for wiring the second power supply line 128, and the wiring layer is laminated in a plurality of layers via an insulating layer. This wiring is connected to the probe structure 130. In Fig. 26, the first power supply line 126 is connected to the probe structure 130-1, and the second power supply line 128 is connected to the probe structure 130-2.

In this way, since the intersecting wires are required to be different wiring layers, the wiring layers of the multilayer wiring substrate 120 are inevitably increased, and the manufacturing process of the multilayer wiring substrate 120 is also increased. Further, there is a problem that the cost increases with this.

The present invention provides a metal wiring layer of a cantilever type probe structure formed by laminating a metal material by MEMS technology, and simultaneously forming a probe structure and a probe wiring It is an object of manufacturing a probe structure which reduces the wiring layer of a multilayer wiring board, and the manufacturing method of this.

The present invention is a probe structure unit which is a probe structure unit in which a cantilever type probe structure body and a position of an electrode of a test object are arranged in plural, and the cantilever type probe structure body And a probe tip that is in contact with an electrode of the test object, a probe post that is connected to the multilayer wiring substrate, and an arm that extends from the tip end portion and is coupled to the probe post. The structure unit is characterized in that it is provided with a probe wiring which is connected to the probe structure at the same laminated layer as the laminated plate of one of the arm portion and the probe post.

At the probe wiring, a wiring post that is bonded to the multilayer wiring substrate is provided.

The probe wiring of the probe structure unit is arranged in parallel with the probe structure in which a plurality of probe structures are arranged in a space in the middle portion of the probe structure arrangement, and is provided with a probe. The structural body is arranged in a linear intermediate wiring portion in which the probe structures are connected in a parallel manner, and a wiring portion extending from the intermediate wiring portion in a direction perpendicular to the direction is provided, and is connected to each probe structure. The wiring post is provided at the intermediate wiring portion.

In addition, the probe structure unit may be configured such that the probe wiring includes a wiring portion extending radially from the wiring post toward the probe structure. .

In the probe structure unit, when a plurality of probe wires are electrically connected to a plurality of wires in the multilayer wiring substrate, the plurality of probe wires connected to the mutually different wires are respectively It is connected to the different laminated ply layers of the laminated ply. The plurality of probe wires are arranged in a space so as not to be in contact with other probe wires, and are arranged in a three-dimensional manner, and a step portion in which the height of the laminated plate layer is changed by the wiring posts is provided.

The arm portion may be a two-armed structure formed by two arms sandwiching a spacer at both end portions.

The probe wiring that is spatially provided is used as an insulating film to prevent electrical short-circuiting.

A probe structure having a spatial probe wiring for the probe structure The erecting unit is applied to a probe card having a multilayer wiring board and a probe card substrate for performing electrical testing of the semiconductor integrated circuit on the electrical wiring of the probe structure.

A method of manufacturing a probe structure unit having a spatial probe wiring for a probe structure, wherein the probe structure unit is formed of a plurality of probe structures, and the probe structures are The arm is attached to the end portion of one of the ends and the other end is fixed, and the probe post is provided at the fixed end side of the arm to form a cantilever type. The method for manufacturing the probe structure unit is characterized in that: a sacrificial layer is provided on a base, and a front end portion is provided as a thin opening portion by a press, and then a step of filling the opening portion by electroplating and forming a needle tip portion; forming a pattern by a photomask, and filling the pattern by electroplating to form a laminated plate, and by using a sacrificial layer after removing the pattern a step of filling the pattern portion into a plurality of layers to form an arm and a probe post by laminating the layer of the needle tip; and in the step of forming the arm and the probe post, forming the arm At least one of one or more layers of laminated sheets Providing a probe for connecting a plurality of the aforementioned probe structures at a fixed end side of the laminated plate or at a pattern of a reticle forming at least one of the laminated plates constituting one of the probe struts or the multilayer structure A step of forming a probe wiring simultaneously with a wiring pattern constituting the probe structure.

The step of forming the arm and the probe post includes: fixing the end side of the laminated board constituting at least one of the laminated layer of one or more layers of the arm, or forming a layer or a multilayer structure constituting one of the probe pillars Laminated At least one of the mask patterns is provided with a pattern of probe wirings for connecting a plurality of probe structures, and a probe wiring is formed, which corresponds to the probe wiring of the laminated layer which is subsequently laminated. At the portion where the pattern of the wiring post is formed, the step of fabricating the probe wiring is performed simultaneously with the laminated board constituting the probe structure.

According to the present invention, since it is provided in the probe structure, a wiring portion which is a part of the wiring by the multilayer wiring substrate is provided, and is integrally manufactured by the manufacturing process of the probe card. Therefore, it is possible to obtain an effect of reducing the wiring layer of the multilayer wiring board, and it is not necessary to perform a special manufacturing process, so that the cost does not increase.

Further, by applying a plurality of different electrical connection wirings to the same laminated board layer and avoiding the contact portion by the step difference, it is possible to expect further multilayer wiring boards. The wiring layer reduces the effect.

Since the wiring in the multilayer wiring board is covered with the electrical insulating material, the generated heat is radiated through the insulating material, but the probe wiring directly connected to the probe structure is directly The heat is released into the space, so that the system can also obtain an exothermic effect.

The present invention relates to a probe card used in an energization test of a semiconductor integrated circuit, and relates to a probe card substrate and a multilayer wiring substrate. And a probe card formed of a probe structure unit in which a plurality of probe structures are disposed, and a probe structure space existing in the probe structure unit in order to reduce a wiring layer of the multilayer wiring substrate A probe card having a probe wiring and a method of manufacturing the same are provided. Hereinafter, the probe structure unit will be mainly described.

Fig. 1 is a view showing a probe structure unit having a cantilever type probe structure. The probe structure unit is a unit in which a probe card substrate and a multilayer wiring board (not shown) are connected to the upper portion, and the needle tip portion is brought into contact with the object to be inspected. The probe wiring is a wiring that connects the probe structure 12 from the wiring of the multilayer wiring substrate, and may be a wiring such as a power source, a ground, or a signal. Here, for the first embodiment shown in FIG. The power supply wiring and the second power supply wiring will be described as an example of the probe wiring.

The probe structure unit 10 is, for example, generally arranged as shown in Fig. 1, and the plurality of probe structures 12 are arranged in two columns. The probe structure 12 has a structure in which a thin flat plate-shaped laminated plate is superposed. The plurality of probe structures 12 are directly connected by the laminated plate layer composed of the plurality of laminated plates. The portions of the first power supply wiring 14 and the second power supply wiring 16 that are connected to the probe structures 12-15 and 12-24 are shown in an enlarged view in front of the arrows.

Further, the laminated plate refers to a thin conductive metal flat plate constituting the probe structure, and the laminated plate layer refers to the entire layer of one plane of the laminated plate.

The first power supply wiring 14 is wired to the fixed ends of the probe structures 12-11, 12-12, 12-13, 12-14, and 12-15 to which the first power source is connected. In the probe structure of one of the probe structures, for example, the probe structures 12-15, a first power source is connected from the multilayer wiring board.

The second power supply wiring 16 is wired at a fixed end of the probe structures 12-21, 12-22, 12-23, and 12-24 to which the second power source is connected, among the probe structures. In the probe structure of one, for example, the probe structure 12-24, a second power source is connected from the multilayer wiring board.

The first power source is a power source for driving the semiconductor element, and the second power source is an analog circuit or an input/output power source provided in the integrated circuit. Many of these power sources are connected to a large number of electrodes of a semiconductor integrated circuit. Accordingly, it is necessary to connect by a large number of wirings, and the wirings cross each other, so wiring cannot be performed. In the same wiring layer, the wiring layer of the multilayer wiring board can be reduced by the wiring by the probe structure. Further, since the grounding is such that a large number of electrodes are disposed at the electrodes of the semiconductor integrated circuit, the ground can be connected to the fixed end of the probe structure.

Fig. 2 is an external view showing an embodiment of a probe card 100 using a probe structure unit according to the present invention. The probe structure unit 10 is connected to a multilayer wiring substrate 50 on which electrical wirings of a plurality of layers are provided. Further, in the multilayer wiring board 50, a plurality of test pads electrically connected from the outside are mounted on the probe card substrate 102, and electrical signals are supplied to the probe structure 10 from the test pads. .

The multilayer wiring substrate 50 is such that it is input to the test pad The signal is a multi-layer structure in which the wiring is disposed across a plurality of layers in a manner corresponding to a desired electrode pad existing at the semiconductor integrated circuit, and is electrically connected as an epoxy resin mixed with glass. The insulating material is formed, and the conduction between the probe structure unit 10 and the probe structure unit 10 is connected via a conductive adhesive resin.

3 is a view showing a state in which the probe structure unit according to the present invention is brought into contact with the integrated circuit board portion as the object to be inspected and connected to the electrode pad. In FIG. 3, an electrode pad 26 corresponding to an electrical signal, a power source, or the like is disposed in the integrated circuit board portion 20, and the first power supply electrode for the integrated circuit, for example, in the electrode pad 26 The spacers 22-1, 22-2, 22-3, 22-4, 22-5 and the second power supply electrode pads 24-1, 24-2, 24-3, and 24-4 are disposed in the integrated body. At the circuit board portion 20.

The front end portions of the probe structures 12-11, 12-12, 12-13, 12-14, and 12-15 that are connected by the first power source wiring 14 are connected to the common electrodes. The first power supply electrode pads 24-1, 24-2, 24-3, 24-4, and 24-5 for the integrated circuit are crimped and electrically connected.

Further, the tip end portion of the probe structures 12-21, 12-22, 12-23, and 12-24 which are connected by the second power source wiring 16 is used for the integrated circuit. The second power supply electrode pads 24-1, 24-2, 24-3, and 24-4 are crimped and electrically connected.

Fig. 4 is a cross-sectional view showing a cantilever type probe structure. Figure 4 (A) is the probe construct 12-13 and probe of Figure 1 A cross-sectional view of the structure 12-15 and the first power supply wiring 14, and FIG. 4(B) is a cross section of the probe structure 12-22, the probe structure 12-24, and the second power supply wiring 16 in FIG. Figure.

In FIG. 4(A), the probe structure 12-13 is provided at a pedestal 30-1 connected to a multilayer wiring board, and is provided with a probe post 32-supporting the probe structure 12-13. 1. The upper arm 34-1 and the lower arm 40-1, and the spacer A36-1 and the spacer B38-1 for setting the upper arm 34-1 and the lower arm 40-1 to the double arm structure, And a tip portion 46-1 that is crimped to the electrode pad of the semiconductor integrated circuit at the first step difference 42-1 and the second step difference 44-1.

Similarly, the probe structure 12-15 is provided at a pedestal 30-2 connected to the multilayer wiring board, and is provided with a probe post 32-1 supporting the probe structure 12-15, and an upper side. The arm 34-2 and the lower arm 40-2, and the spacer A36-2 and the spacer B38-2 for setting the upper arm 34-2 and the lower arm 40-2 to the double arm structure, and the first The step 42-2 and the second step 44-2 are crimped to the tip end portion 46-2 at the electrode pad of the semiconductor integrated circuit.

The first power supply wiring 14 is provided at the laminated plate layer of the probe post 32-1 of the probe structure 12-13 and the probe post 32-2 of the probe structure 12-15, and is connected to The probe structures 12-13 and the probe end bodies 12-15 are fixed end sides.

FIG. 4(B) shows the second power supply wiring 16 wired to the probe structure 12-22 and the probe structure 12-24.

Probe structure 12-22 and probe structure 12-24 are also constructed The upper system is the same, and at the pedestals 30-3 and 30-4 connected to the multilayer wiring substrate, probe posts 32-3 and 32 supporting the probe structures 12-22 and 12-24 are provided. -4, and upper side arms 34-3, 34-4 and lower side arms 40-3, 40-4, and for upper side arms 34-3, 34-4 and lower side arms 40-3, 40-4 Spacers A36-3, 36-4 and spacers B38-3, 38-4, which are constructed for both arms, and 42-3, 42-4 and 2nd steps 44-3, 44-4 at the first step The needle tips 46-3, 46-4 are crimped to the electrode pads of the semiconductor integrated circuit.

The second power supply wiring 16 is provided at the laminated plate layer of the spacer B38-3 of the probe structure 12-22 and the spacer B38-4 of the probe structure 12-24, and is connected to the probe. Structures 12-22 and probe constructs 12-24.

Since the first power supply line 14 and the second power supply line 16 are in contact with each other due to the intersecting wiring portions, the step of changing the height in the wiring space is prevented from coming into contact with each other. Of course, when there is no wiring portion that intersects, it is possible to realize wiring in the same plane.

In addition, the first power supply wiring 14 and the second power supply wiring 16 have a one-layer structure for one laminated plate layer constituting the probe structure 12, but may be used as a probe structure. The plurality of laminated plies are overlapped and thickened to increase the strength. For example, in the first power supply wiring 14 shown in FIG. 4(A), it is also possible to use a laminated plate layer in which the upper arms 34-1 and 34-2 are present, and two laminated layers are used. The first power supply wiring 14 is formed, and the thickness thereof is increased by this. at this time, The second power supply wiring 16 is provided at the same laminated plate layer as the lower arms 40-1 and 40-2, and connects the lower arms 40-1 and 40-2.

Similarly, in the second power supply wiring, the second power supply wiring 16 can be formed by using two laminated layers in the laminated plate layer in which the lower arms 40-1 and 40-2 are present. By this, the thickness is increased.

Fig. 5 is a cross-sectional view showing a state in which a multilayer wiring board is connected to a cantilever type probe portion. Fig. 5(A) is a cross-sectional view corresponding to the probe structure 12-13, the probe structure 12-15, and the first power supply wiring 14 of Fig. 1, and Fig. 5(B) is a diagram A cross-sectional view corresponding to the probe structure 12-22 of the first embodiment, the probe structure 12-24, and the second power supply wiring 16.

In Fig. 5, a multilayer wiring board 50 having a structure in which a conductor foil is formed in a plurality of layers on a film-shaped insulator is a signal line 52-1, 52-2 in which an input/output signal is wired. The grounding wires 54-1 and 54-2 to be grounded, the first power source line 56, and the second power source line 58 are wired in a multilayer structure.

Further, as shown in FIG. 5(A), generally, a probe electrode 60-1 for connecting to the pedestal 30-1 of the probe structure 12-13 is provided, at the probe electrode 60-1, The first power supply line 56 is connected. Further, as shown in Fig. 5(B), generally, a probe electrode 60-4 for connecting to the pedestal 30-4 of the probe structure 12-24 is provided, at the probe electrode 60-4, A second power line 58 is connected. In this manner, since the second power source line 58 can be disposed in the same wiring layer as the first power source line 56, the number of layers of the wiring on the multilayer wiring board 50 is reduced.

Fig. 6 is a cross-sectional view showing a probe structure of a single arm type. Even in the case of the one-arm type probe structure 60, similarly, as shown in Fig. 6, the probe posts 32-5, 32-6 are constituted by a plurality of laminated plates, and the upper arm is set. The 34-6 and the lower arm 40-6 have an integrated structure, and the first power supply wiring 14 and the second power supply wiring 16 that connect the respective laminated boards can be configured. Even when a plurality of laminated board structures are not used, it is also possible to form only one power supply wiring by using a laminated board layer at a pillar or an arm.

FIG. 7 is a first power supply line 14 and a second power supply line that are arranged in a radial shape with one point as a center in a space between the probe structure arrangement and the probe structure arrangement intermediate portion. A diagram of the wiring struts 64-11, 64-21 is provided at the center of the 16th. Since the first power supply wiring 14 and the second power supply wiring 16 are thin plates, a space (space portion) is formed between the multilayer wiring substrates, and thus the deflection is likely to occur. Therefore, the wiring stays 64-11 and 64 which are connected to the multilayer wiring substrate 50 and prevent the first power supply wiring 14 and the second power supply wiring 16 from being bent are provided at the center point of the wiring portion that is wired to be radiated. twenty one. Further, in order to prevent the purpose of the deflection, the wiring stay may be disposed not only at the center of the radiation but also during the probe wiring.

In addition, the first power supply wiring 14 and the second power supply wiring 16 are electrically connected to the different wirings in the multilayer wiring substrate 50, and are connected to the probe structures corresponding to each other via the probe wiring. Therefore, as shown in FIG. 7, the first power supply wiring 14 and the second power supply wiring 16 are connected to each other by a laminated board layer of a probe structure different from each other. In Figure 7 In the example, although two different power supply wirings are used, the layers may be appropriately replaced or added. In addition, it can be used as a ground or signal wiring in addition to the power supply.

Fig. 8 is a view showing a cross-sectional view of Fig. 7 at the same position as Fig. 5, and wiring posts 64-11 and 64-21 are added to Fig. 5 . In FIG. 8(A), the wiring stay 64-11 is provided in the first power supply wiring 14, and in FIG. 8(B), the wiring support 64-21 is provided in the second power supply wiring 16. The wiring stay 64-21 is provided in a portion that does not affect other wirings in order to be connected to the multilayer wiring board 50. Even in the case where the wiring struts are provided at the probe wiring, it is also possible to manufacture integrally by the manufacturing process of the probe structure, and there is almost no influence on the cost surface.

FIG. 9 shows another embodiment in the case where the wiring support is provided in the first power supply wiring 14 and the second power supply wiring 16. By the wiring support pillars, the first power supply wiring 14 and the second power supply wiring 16 that are wired in the space of the intermediate portion can be improved in strength, and therefore, it is possible to perform the degree of freedom with a certain degree of freedom. The design of the location.

For example, in FIG. 9, the first power supply line 14 is provided with a linear first intermediate wiring portion extending in parallel with the probe structure in the space of the intermediate portion, and the first intermediate wiring is provided from the first intermediate wiring. The wiring portion extending in a direction perpendicular to the right direction is connected to each probe structure. In the case of the first power supply wiring 14 in FIG. 9, both ends of the linear wiring portion are used as the probe structure 12-11 connected by the probe wiring. The position of the probe construct 12-11 and the probe construct 12-13 located at the farthest from ~15.

The first power supply wiring 14 that has been wired as described above is preferably provided with the wiring support 64 so as to prevent deflection in a space (space portion) between the multilayer wiring board and the multilayer wiring board. The wiring stay 64 is provided at both ends of the first intermediate wiring portion which is linearly arranged in parallel with the arrangement of the probe structure, and the wiring support 64-12 and the wiring support 64-15 are provided, and further, the wiring support is provided. Between 64-12 and wiring stays 64-15, wiring stays 64-13 and wiring stays 64-14 are provided.

The second power supply wiring 16 is also wired in the same manner as the first power supply wiring 14, and the probe structure is arranged in a space slightly parallel to the probe structure in the space in the middle portion of the probe structure arrangement. A second intermediate wiring portion having a linearity is provided at an intermediate portion of the probe wiring for connection between the bodies. The second power supply wiring 16 is formed in a laminated board layer different from the first power supply wiring 14, and is disposed in a space so as to avoid contact with each other. In addition, the intermediate wiring portion which is linearly arranged in parallel with the probe structure in the intermediate portion space between the arrays of the probe structures arranged in two rows is for the multilayer of the wiring support 64 and the upper portion. As shown in FIG. 9, the wiring board is joined, and the planarity of the linear first intermediate wiring portion and the second intermediate wiring portion is generally shifted from each other. Thereby, the wiring support 64 provided in the second power supply wiring 16 can be disposed without being in contact with the first power supply wiring 14.

Further, similarly to FIG. 7, the first power supply wiring 14 and the second power supply wiring 16 are electrically connected to the different wirings in the multilayer wiring substrate 50. Then, the probe structures corresponding to the respective probe structures are connected via probe wirings, and the laminated layer layers of the probe structures different from each other are connected. The number of power wirings is not limited to two, and it is suitable to replace or increase the layer. In addition to the power supply, it can also be used as a grounding or signal wiring.

Further, when the number of probe wires is increased for the purpose of design and the gap between the electrodes is not sufficiently ensured, it is also immersed in the silicone liquid and subjected to heavy coating in addition to the above configuration. Or, the insulating film is formed by baking or the like to avoid mutual conduction with other probe wirings.

In the second power supply line 16, in FIG. 9, the probe structures 12-21 to 24 are connected, and both ends of the linear wiring portion parallel to the probe structure wiring are used as probes. The position of the probe structure 12-23 and the probe structure 12-24 located at the farthest among the probe structures 12-21 to 24 connected by the wiring. In addition to the wiring stay 64-22 and the wiring support 64-24 provided at both ends of the linear wiring portion parallel to the probe structure wiring of the second power supply wiring 16, the wiring support 64 is also in two A wiring stay 64-23 is provided at an intermediate portion of the wiring post.

The first power supply wiring 14 and the second power supply wiring 16 are provided in different spaces, and the wiring pattern is not limited to the pattern shape shown in FIG. 9, but may be any pattern shape. Further, the wiring stay 64 is not intended to cause deflection of the probe wiring, and the number of configurations at which position is to be made is only a design problem, and is not limited to FIG. The example shown in .

In the meantime, the first power supply wiring 14 and the second power supply wiring 16 are configured such that a gap due to the height difference is provided so as not to cross each other and come into contact with each other. The probe wirings may be disposed at the same plane, and in this case, it may be configured to set a step at the intersecting portions and avoid mutual contact.

Figure 10 is a cross-sectional view showing the case where the step is set to avoid mutual contact. In FIG. 10(A), the probe power supply is provided on the same plane, and the first power supply wiring 14 and the second power supply wiring 16 are provided. The first power supply line 14 and the second power supply line 16 are wired to the spacers 38-1 and 38-2 of the probe structure 12-13, and the second power supply line 16 is also wired to other probes. The spacer of the structure.

In this manner, when the first power supply wiring 14 and the second power supply wiring 16 are wired on the same plane, portions that intersect each other are generated. Therefore, for example, as shown in FIG. The power supply wiring 14 is provided with a stepped portion structure, and is changed in height at the layer where the laminated layer existing at the probe stays 32-3 and 32-4 is temporarily wired and then returned to the same height. The probe structures 12-15 and the probe structures 12-13 are connected to avoid contact between the first power source wiring 14 and the second power source wiring 16. At the step portion, the wiring stays 64-11, 64-12 are provided to prevent the deflection. In other words, the step portion is used for the wiring post on the probe wiring, and the probe wiring is formed at a layer having a height different from that of the laminated layer connected to the probe structure. And become between the wiring pillars to avoid matching with other probes The structure in which the lines are in contact with each other.

In the first power supply wiring 14 from the probe structure 12-15, the first power supply wiring 14 is provided with a stepped portion at a portion intersecting the second power supply wiring 16, and is used as a structure. Once wired to the laminated layer existing in the probe posts 32-3, 32-4, the structure is then directly connected to the probe structures 12-13. Different from FIG. 10(A), this is not to change the height of the layer between the wiring posts, but to maintain the original layer and connect to the probe structure.

10(A) and (B) show an example of a configuration in which a step is provided at the probe wiring in order to avoid contact at the intersecting portion, but a step is set to avoid contact. The structure is not limited to this example.

Fig. 11 is a view showing a configuration in which a part of the probe wiring is followed by a multilayer wiring substrate when a step is set in order to avoid contact between the intersecting probe wirings. The probe wiring is the same as that of FIG. 10, and the first power supply wiring 14 and the second power supply wiring 16 are disposed on the same plane, and the portions intersecting each other are set by the wiring pillars 64-11 and 64-12. To avoid contact. In this case, the first power supply wiring 14 which is one of the contacts avoided is adhered to the multilayer wiring substrate 50 to prevent the deflection.

In addition, in FIGS. 8, 10, and 11, the wiring pillars 64-11 and 64-12 are embedded in the interior of the multilayer wiring substrate 50, but the multilayer wiring board is used. 50 can be supported, and can also be set only on the surface of the multilayer wiring substrate 50. At the office.

FIG. 12 is a cross-sectional view showing a state in which the wiring posts are electrically connected from the multilayer wiring board. The wiring stay 64-11 is provided in the drawing of the first power supply wiring 14, and the second power supply 58 wired to the multilayer wiring substrate 50 is connected to the wiring support 64-11. As shown in this example, the electrical connection from the multilayer wiring substrate 50 is not directly required for the probe structure 12, and may be connected to the wiring post. Depending on the wiring structure in the multilayer wiring board, the wiring layer can be reduced by wiring the wiring posts.

Although the space wiring based on the connection to the probe structure is described, a part of the signal wiring existing in the multilayer wiring board may be wired by the probe structure. Out of the space.

FIG. 13 is a cross-sectional view showing a state in which a part of the signal wiring existing in the multilayer wiring substrate 50 is taken out in the space created by the probe structure. Although it is necessary to connect the signal line A74-1 and the signal line A74-2, since there is a signal line B76, it is not possible to make a direct connection. Therefore, the signal line A74-1 is connected to the first signal wiring stay 68-1 and the second signal wiring stay 70-1 via the signal electrode 66-1, and is prevented from being in contact with the signal line B76. External signal wiring 72.

The external signal wiring 72 is connected to the signal electrode 66-2 via the second signal wiring support 70-2 and the second signal wiring support 68-2, and further to the signal electrode 66-2 and the signal line A74-. 2 as a company Then, the signal line A74-1 and the signal line A74-2 are connected, and can be electrically connected.

The external signal wiring 72 is not limited to the case where the signal wiring intersects with other signal wiring, and a part of the signal wiring can be simply used as an external wiring. This is because the external wiring is more likely to be expected to have a heat dissipation effect when it is directly covered by the outside air than when it is covered by the insulating material in the multilayer wiring board, and the function of the heat dissipation plate can also be exhibited. Therefore.

The external signal wiring 72 can also be formed by a plurality of laminated boards, or can be connected to the multilayer wiring substrate 50 at the middle of the external signal electrode 72 to prevent the external signal wiring 72 from being scratched. Folded pillars.

In addition, the external signal wiring 72 from the multilayer wiring board 50 is an external signal line 72 that is a wiring other than the first power supply wiring 14 and the second power supply wiring 16 on which the probe wiring is formed, and may be, for example, In the grounding, a part of the electrical wiring other than the wiring in which the probe wiring is formed is provided in the space from the multilayer wiring substrate 50, thereby causing a heat radiation effect. Further, it is possible to avoid the intersection of the signal wiring or the like at the multilayer wiring substrate 50, and to reduce the wiring layer of the multilayer wiring substrate 50. Of course, the wiring of the probe wiring may be in the multilayer wiring substrate 50. A part is used as a space wiring, and is not limited to the embodiment.

Fig. 14 is a view for explaining a case where an external signal wiring portion is provided at the cantilever type probe structure unit of Fig. 1. The probe structure unit 80 shown in FIG. 14 is attached to the probe structure 12 and the first The external signal wiring portion 82 is provided at the power supply wiring 14 and the second power supply wiring 16. The external signal wiring portion 82 is a portion composed of the first signal line stays 68-1 and 68-2 and the second signal line stays 70-1 and 70-2 and the external signal wiring 72 in Fig. 13 .

The external signal wiring portion 82 can be disposed in any space without contacting the probe structure 12 with another power supply wiring, and does not need to have a wide width due to the relationship with the heat dissipation efficiency. It is set to be the same as the signal lines A74-1 and 74-2, and can be set to a wider width to improve the heat dissipation effect. Further, of course, the external signal wiring portion 82 may be provided in plural.

An insulating film may be formed in the first power source wiring 14 and the second power source wiring 16 and the external signal wiring portion 82. For example, it may be immersed in a silicone liquid to perform a heavy coating film, or an insulating film may be formed by firing, and various methods may be used.

Next, a method of manufacturing the probe structure in which the probe wiring is incorporated will be described. In the description of the configuration of the entire structure, the probe structure and the external signal wiring portion 82, which are also arranged in parallel, are used, and the probe structure 12 is disposed on the right and left sides. A diagram of the -13 and the probe structure 12-15, the probe structure 12-23, and the probe structure 12-24, and is a cross-sectional view in which one or both of them are used as necessary. Moreover, the cross section between the probe structures is not necessarily a cross section for connecting the left and right probe structures, but a cross section of a necessary portion is preferably used.

Figure 15 is a step 1 for forming a needle tip Fig. 15(A) is a cross-sectional view, and Fig. 15(B) is a plan view. In Fig. 15(A), at the base 90, a sacrificial layer 92 made of copper as a material for forming the tip portion 46 is laminated and formed in the shape of the tip portions 46-1, 46-2. The mask is covered. As shown generally in Fig. 15(B), a plurality of marks are placed at corresponding positions including all of the needle tips 46. The mark is as shown in the enlarged view, and the front end is made into a thin quadrangular pyramid shape. At the mark of the needle tip portion 46, a hard material such as barium or palladium cobalt alloy is deposited by electroplating, and a needle tip portion 46 is formed.

Fig. 16 is a manufacturing process for forming the second step difference 44 as the step 2. Fig. 16(A) is a cross-sectional view, and Fig. 16(B) is a plan view. In FIG. 16(A), the second step differences 44-1 and 44-2 are formed corresponding to the needle tip portions 46-1 and 46-2, and are planarized by the sacrificial layer 92.

The second step difference 44 is formed by applying a photoresist pattern having the second step difference 44 on the sacrificial layer on which the needle tip portion 46 is formed, and depositing nickel or the like by plating. Thereafter, the photoresist pattern is removed, and copper plating is applied to the entire surface, and the copper plating is polished so as to be parallel to the surface on which the upper portion of the second step 44 is formed, so that The second level difference 44 and the planar layer formed by the sacrificial layer 92.

Fig. 17 is a manufacturing process for forming the first step difference 42 as step 3. Fig. 17(A) is a cross-sectional view, and Fig. 17(B) is a plan view. In FIG. 17(A), the first step differences 42-1 and 42-2 are arranged corresponding to the second step differences 44-1 and 44-2, and are formed in the same manner as the sacrificial layer 92, and are as shown in FIG. The general planar layer shown in (B). This second-order manufacturing system The process is the same as the manufacturing process of the first step.

Fig. 18 is a manufacturing process for forming the lower arm 40 as step 4. Fig. 18(A) is a cross-sectional view, and Fig. 18(B) is a plan view. In FIG. 18(A), the lower arm 40-1, 40-2 is formed corresponding to the first step difference 42-1, 42-2, and is planarized by the sacrificial layer 92.

The lower arm 40 is formed by coating a photoresist pattern on which the lower arm 40 is disposed on the sacrificial layer 92 on which the first step 42 is formed, and depositing nickel or the like by plating. Thereafter, the photoresist pattern is removed, and copper plating is applied to the entire surface, and the copper plating is polished so as to be parallel to the surface on which the upper portion of the lower arm 40 is formed, so that it is A planar layer of side arm 40 and sacrificial layer 92.

19 is a manufacturing process for forming the second power supply wiring 16 together with the spacer A36 and the spacer B38 as the step 5, and FIG. 19(A) shows that the second power supply wiring 16 is not wired. FIG. 19(B) is a cross-sectional view showing a portion in which the second power source wiring 16 is wired, and FIG. 19(C) is a plan view.

As shown in Fig. 19(A), generally, the portion of the second power supply wiring 16 is not wired, and spacers A36-1 and 36-2 are laminated corresponding to the lower arms 40-1 and 40-2. And spacers B38-1, 38-2. On the other hand, the portion in which the second power source wiring 16 is wired is a structure in which the second power source line 16 is connected to the spacers B38-3 and 38-4 as shown in FIG. 19(B). .

As shown in FIG. 19(C), the second power supply wiring 16 is an interval of the probe structure in which the second power source is radially connected from one point. At the points B38-1 and 38-2, the wiring is connected in a pattern shape. As a result, the probe structure connected by the second power supply line 16 is electrically short-circuited, and if the second power source is connected to any of the probe structures, it is borrowed. The second power source is supplied from all of the probe structures connected by the second power source wiring 16.

In this case, the second power supply wiring 16 is coated on the sacrificial layer on which the lower arm 40 is formed, and the photoresist of the second power supply wiring 16 is applied together with the spacer A36 and the spacer B38. The pattern is formed by depositing nickel or the like by electroplating. After that, the photoresist pattern is removed, and copper plating is applied to the whole, and the copper plating is performed in parallel with the spacer A36 and the spacer B38 so as to be parallel to the surface on which the upper portion of the second power supply wiring 16 is formed. The polishing is performed as a planar layer by the sacrificial layer 92 of copper plating.

20 is a manufacturing process for forming the external signal wiring 72 together with the upper arm 34 as a step 6, and FIG. 20(A) is a cross-sectional view of a portion to which the external signal wiring 72 is wired, FIG. 20 (FIG. 20 (FIG. 20) B) is a cross-sectional view of a portion where the external signal wiring 72 is not wired, and FIG. 20(C) is a plan view.

As shown in Fig. 20(A), generally, the portion to which the external signal wiring 72 is wired corresponds to the spacers A36-1 and 36-2 and the spacers B38-1 and 38-2, and is laminated on the upper side. In addition to the arms 34-1, 34-2, the external signal wiring 72 is formed at the same layer. On the other hand, the portion of the external signal wiring 72 that is not wired is generally as shown in FIG. 20(B), corresponding to the spacers A36-3, 36-4 and the spacers B38-3, 38- 4, and upper side arms 34-3, 34-4 are stacked.

The external signal wiring 72, as shown in FIG. 20(C), is a portion pulled out from the signal line wired in the multilayer wiring substrate, and is not connected to the probe structure and is not The first power supply wiring 14 and the second power supply wiring 16 are arranged to intersect each other.

Further, similarly to the manufacturing process up to this point, the upper arm 34 and the external signal wiring 72 are coated on the plane on which the sacrificial layer 92 is formed, together with the spacer A36, the spacer B38, and the second power supply wiring 16. The photoresist pattern of the upper arm 34 and the external signal wiring 72 is disposed, and nickel or the like is deposited by plating. Thereafter, the photoresist pattern is removed, and copper plating is applied to the entire surface, and the copper plating is polished in parallel with the surface on which the upper arm 34 and the upper portion of the external signal wiring 72 are formed, so that The sacrificial layer 92 is plated by copper to form a planar layer.

21 is a manufacturing process for forming the probe post 32, the first power supply wiring 14, and the second signal wiring stay 70 as the step 7, and FIG. 21(A) is a portion in which the first power supply wiring 14 is wired. FIG. 21(B) is a cross-sectional view showing a portion where the first power source wiring 14 is not wired, and FIG. 21(C) is a plan view.

As shown in Fig. 21(A), generally, the portion to which the first power supply wiring 14 is wired corresponds to the upper arms 34-1 and 34-2, and is also provided together with the probe stays 32-1 and 32-2. The first power supply wiring 14 is connected to the wiring. On the other hand, the portion of the first power supply wiring 14 is not wired, and as shown in FIG. 21(B), it is laminated at the upper arms 34-3 and 34-4. There are configurations of probe posts 32-3, 32-4.

As shown in FIG. 21(C), the first power supply wiring 14 is a probe pillar 32 that is connected to the probe structure of the first power source in a radial manner from one point, and the wiring is connected. . In the pattern shape, the probe structure connected by the first power supply line 14 is electrically short-circuited, and if the first power source is connected to any of the probe structures, the system becomes The first power source is supplied to all of the probe structures connected by the first power source wiring 14. Further, the second signal wiring stay 70 of the external signal wiring 72 is disposed at a position corresponding to both end portions of the external signal wiring 72.

The planarization by the sacrificial layer 92 is formed by applying a photoresist pattern in which the probe post 32, the first power supply wiring 14 and the second signal wiring support 70 are disposed, and depositing nickel or the like by plating. Thereafter, the photoresist pattern is removed and carried out by applying copper plating to the entire surface and grinding.

Fig. 22 is a manufacturing process for forming the pedestal 30 and the first signal wiring stay 68 as the step 8. Fig. 22(A) is a cross-sectional view, and Fig. 22(B) is a plan view. In Fig. 22(A), the pedestals 30-1, 30-2 are formed corresponding to the probe struts 32-1, 32-2, and are planarized by the sacrificial layer 92.

In the stage of this step 8, the probe portion including the sacrificial layer which is removed after lamination of the multilayer wiring substrate is completed, but in Fig. 23, the cross-sectional view of the other constituent portions is made. Show.

The pedestal 30 and the first signal wiring support 68 are also manufactured by the same system. The manufacturing process is formed, and a photoresist pattern in which the pedestal 30 and the first signal wiring struts 68 are disposed is applied to the sacrificial layer on which the probe struts 32 are formed, and nickel or the like is deposited by plating. Thereafter, the photoresist pattern was removed, and copper plating was applied to the entire portion, and then copper plating was further polished to form a planar layer.

Fig. 23(A) is a cross-sectional view showing a portion in which only the probe structures disposed on the right and left sides are present. FIG. 23(B) is a cross-sectional view showing a portion in which the probe structure and the second power source wiring 16 are disposed on the right and left sides. FIG. 23(C) is a cross-sectional view showing a portion where the probe structure and the first power source wiring 14 are disposed on the right and left sides. Fig. 23(D) is a cross-sectional view showing a portion where the probe structure and the external signal wiring 72 are disposed on the right and left sides. In this manner, the first power supply line 14, the second power supply line 16, and the external signal wiring, which are the features of the present invention, are used for the same laminated layer as the laminated structure of the probe structure. It suffices to add a pattern of wiring to the design, and there is almost no increase in cost.

Further, in step 9 (not shown), the multilayer wiring substrate 50 shown in FIG. 5(A) and FIG. 5(B) is formed, and then the sacrificial layer 92 is removed and completed. The probe portion of the wiring substrate 50.

Next, a manufacturing process in the case where the wiring support is provided in the first power supply wiring 14 and the second power supply wiring 16 will be described as another embodiment.

Figure 24 is for the case where there is no wiring struts The manufacturing process of step 5 (Fig. 19) starts and moves to the next stage of the manufacturing process at the time of the presence of the wiring struts for display. Fig. 24(A) is a cross-sectional view, and Fig. 24(B) is a plan view. The wiring support 64-21 is a support for supporting the second power supply wiring 16, and is formed by being laminated on the second power supply wiring 16 as shown in FIG. 24(A). The position is arranged at the center point of the second power supply wiring 16 which is wired in a radial manner as shown in FIG. 24(B).

FIG. 25 is a manufacturing process in the case where the wiring stay 64-21 is formed together with the probe post 32 and the first power supply wiring 14. Fig. 25(A) is a cross-sectional view, and Fig. 25(B) is a plan view. As shown in Fig. 25(A), the wiring stays 64-21 are further stacked in a state further with respect to Fig. 24. As shown in FIG. 25(B), generally, it is disposed at a position that does not intersect the first power supply wiring 14.

FIG. 26 is a manufacturing process in the case where the wiring stays 64-11 and 64-21 are formed together with the pedestal 30 and the first power supply wiring 14. 26(A) is a cross-sectional view showing a portion where the first power supply wiring 14 and the wiring support 64-11 are present, and FIG. 26(B) is a wiring support 64-21 where the second power supply wiring 14 is present. A partial cross-sectional view, Fig. 26(C), is a plan view. As shown in Fig. 22 (A) and Fig. 26 (B), the wiring stay 64-11 corresponds to the first power supply wiring 14 and the wiring support 64-21, and is further laminated.

As shown in Fig. 26(C), in general, the respective wiring struts 64-11, 64- 21, are arranged at positions that do not intersect. The wiring stay 64-21 is in a state of being further laminated with respect to FIG. As shown in FIG. 25(B), generally, it is disposed at a position that does not intersect the first electrode wiring 14.

Further, the multilayer wiring board 50 shown in FIGS. 5(A) and 5(B) is formed, and then the sacrificial layer 92 is removed from the probe structure unit 80. Thereafter, the probe card 100 is completed by being mounted on the probe card substrate 102.

The embodiments of the present invention have been described above, but the present invention also includes appropriate modifications without departing from the purpose and advantages thereof. Further, the present invention is not implemented as described above. The form is limited.

10, 80‧‧‧ probe structure unit

12, 12-11~15, 12-21~24‧‧‧ probe structure

14‧‧‧1st power wiring

16‧‧‧2nd power wiring

20‧‧‧Integrated Circuit Board Part

22-1~5‧‧‧1st power electrode gasket

24-1~4‧‧‧2nd power electrode gasket

26‧‧‧electrode gasket

30, 30-1~5‧‧‧ pedestal

32, 32-1~6‧‧‧ probe pillar

34, 34-1~6‧‧‧ upper arm

36, 36-1~4‧‧‧ spacer A

38, 38-1~4‧‧‧ spacer B

40, 40-1~6‧‧‧ lower arm

42, 42-1~5‧‧‧1st step difference

44, 44-1~5‧‧‧ second order difference

46, 46-1~5‧‧‧ needle tip

50‧‧‧Multilayer wiring board

52-1‧‧‧ Signal Line

54-1‧‧‧ Grounding wire

56‧‧‧1st power cord

58‧‧‧2nd power cord

60‧‧‧Probe electrode

62‧‧‧One-arm probe structure

64, 64-11~15, 64-21~24‧‧‧ wiring pillar

66, 66-1, 66-2‧‧‧ signal electrodes

68, 68-1, 68-2‧‧‧1st signal wiring pillar

70, 70-1, 70-2‧‧‧2nd signal wiring pillar

72‧‧‧External signal wiring

74-1, 74-2‧‧‧ Signal Line A

76‧‧‧Signal Line B

82‧‧‧External signal wiring department

90‧‧‧Abutment

92‧‧‧ Sacrifice layer

100‧‧‧ probe card

102‧‧‧Probe card substrate

Fig. 1 is a view showing a cantilever type probe structure unit by the present invention.

[Fig. 2] An external view of the probe card.

Fig. 3 is a view showing a state in which the cantilever type probe structure unit unit according to the present invention is in contact with the electrode pad of the integrated circuit portion.

Fig. 4 is a view showing a cross section of a probe structure according to the present invention.

Fig. 5 is a cross-sectional view showing a state in which a multilayer wiring board is connected to a probe structure body according to the present invention.

Fig. 6 is a one-arm type probe structure resulting from a multilayer laminated structure.

Fig. 7 is a view showing a wiring post provided in a probe wiring of a probe structure according to the present invention.

[Fig. 8] A cross-sectional view showing a state in which a wiring post is provided at a probe wiring of a structural unit according to the present invention, and a probe structure and a multilayer wiring substrate are connected.

Fig. 9 is a view showing another embodiment of a wiring stay in which a probe wiring is provided at a space wiring portion.

Fig. 10 is a cross-sectional view showing a case where a step and a wiring post are provided at the intersecting probe wirings.

[Fig. 11] A cross-sectional view showing a case where a step difference and a joint portion of a multilayer wiring board are provided at a cross probe wiring.

FIG. 12 is a cross-sectional view showing a state in which the wiring posts of the probe wiring are electrically connected from the multilayer wiring board.

FIG. 13 is a cross-sectional view for explaining a multilayer wiring board and a space wiring in a case where a space wiring portion is provided when signal lines are crossed in a multilayer wiring board.

FIG. 14 is a view showing a probe structure unit in which a space wiring portion is provided when signal lines are crossed in a multilayer wiring substrate.

Fig. 15 is a view for explaining a manufacturing step for forming a needle tip portion.

Fig. 16 is a view for explaining a manufacturing procedure for forming a step of the first stage for holding the needle tip portion.

Fig. 17 is a view for explaining a manufacturing procedure for forming a step of the second stage for holding the needle tip portion.

[Fig. 18] The system for forming the lower arm for forming the dual-arm type probe structure The steps for making the steps are explained.

19 is a view for explaining a manufacturing process of a spacer for forming a dual-arm type probe structure and a probe wiring for a probe structure.

20 is a view for explaining a manufacturing procedure of a space wiring portion for forming a lower arm and a signal line of the dual-arm type probe structure.

Fig. 21 is a view for explaining a manufacturing procedure of a wiring post for forming a probe structure and a probe wiring for a probe structure.

Fig. 22 is a view for explaining a manufacturing procedure of a signal wiring stay for a space wiring portion for forming a pedestal and a signal of the probe structure.

Fig. 23 is a cross-sectional view showing the probe structure.

FIG. 24 is a view for explaining a manufacturing procedure of the upper arm and the wiring post when the wiring post is provided at the space wiring portion. FIG.

FIG. 25 is a view for explaining a manufacturing procedure of the probe structure pillar and the wiring pillar when the wiring pillar of the probe wiring is provided in the space wiring portion.

FIG. 26 is a view for explaining a manufacturing procedure of the pedestal and the wiring post when the wiring struts of the probe wiring are provided at the space wiring portion.

[Fig. 27] A diagram showing an integrated circuit electrode.

Fig. 28 is a cross-sectional view showing a multilayer wiring board and a probe structure in which a signal line or the like is wired in a plurality of layers in the prior art.

10‧‧‧Probe structure unit

12, 12-11~15, 12-21~24‧‧‧ probe structure

14‧‧‧1st power wiring

16‧‧‧2nd power wiring

Claims (12)

A probe structure unit is a probe structure unit in which a cantilever probe structure and a position of an electrode of a test object are arranged in plural, and the cantilever probe structure is a a probe tip for contacting the electrode of the test body, a probe post connected to the multilayer wiring substrate, and an arm portion extending from the tip end portion and coupled to the probe post, the probe structure unit, It is characterized in that it is provided with a probe wiring which is connected to the probe structure at the same laminated layer as the laminated plate of one of the arm portion and the probe post. The probe structure unit according to the first aspect of the invention, wherein the probe wiring is provided with a wiring post joined to the multilayer wiring substrate. The probe structure unit according to the second aspect of the invention, wherein the probe wiring is in a space in an intermediate portion of the probe structure arrangement and a probe structure in which a plurality of probe structures are disposed The needle structure is arranged in parallel, and a linear intermediate wiring portion that connects the probe structures in parallel with the probe structure is provided in parallel, and is provided in a direction perpendicular to the intermediate wiring portion. The extended wiring portion is connected to each probe structure, and the wiring post is provided at the intermediate wiring portion. The probe structure unit according to the second aspect of the invention, wherein the probe wiring includes a wiring portion extending radially from the wiring post toward the probe structure. The probe structure unit according to any one of claims 1 to 4, wherein the probe wiring is electrically connected to a plurality of wires in the multilayer wiring substrate. The plurality of probe wirings that are connected to the different wirings are connected to the different laminated layers of the laminated board layer. The probe structure unit according to any one of claims 2 to 5, wherein the plurality of probe wires are provided so as not to be in contact with other probe wires. For stereo configuration. The probe structure unit according to any one of claims 2 to 6, wherein the height of the laminated layer is set by the wiring post in order to avoid contact between the probe wires. The step part of the change. The probe structure unit according to any one of claims 1 to 7, wherein the arm portion is formed by sandwiching a spacer at both end portions and having two arms. The construction of the arms. The probe structure unit according to any one of claims 1 to 8, wherein the probe wiring is used as an insulating film. A probe card for performing an electrical test of a semiconductor integrated circuit, comprising: the probe structure unit according to any one of claims 1 to 9; a multilayer wiring board for electrical wiring of the probe structure; and a probe card substrate. A method for manufacturing a probe structure unit, wherein the probe structure unit is formed by a plurality of probe structures, wherein the probe structures are provided with a needle tip at one end portion thereof And a method of manufacturing the probe structure unit, wherein the arm of the other side is fixed and the probe post provided at the fixed end side of the arm constitutes a cantilever type The steps are as follows: a sacrificial layer is provided on the base, and a tip end portion is provided as a thin opening portion by a press, and the opening portion is filled by plating to form a needle tip portion. And forming a pattern by using a photomask, filling a pattern by electroplating to form a laminated board, and by laminating the pattern portion with a sacrificial layer after removing the pattern, by a step of forming an arm and a probe post following the laminated layer of the tip portion; and, in the step of forming the arm and the probe post, at least one of the laminated plates constituting one or more of the arms The fixed end side of the laminated board, or A pattern of a probe wiring that connects at least one of the probe layers constituting one of the probe struts or the multilayer structure is provided, and a probe wiring pattern for connecting the plurality of probe structures is provided, and the probe structure is configured The step of fabricating the probe wiring is performed simultaneously with the laminated sheets of the body. The method for producing a probe structure unit according to claim 11, wherein the step of forming the arm and the probe post includes a laminated plate constituting one or more layers of the arm. The fixed end side of at least one of the laminated sheets, or the aforementioned one of forming at least one of the laminated sheets constituting one or a plurality of layers of the probe struts At the pattern of the mask, a pattern for a probe wiring in which a plurality of probe structures are connected is provided, and a probe wiring is formed, and a portion corresponding to the probe wiring of the laminated layer which is subsequently laminated is formed. At the same time, a step of forming the wiring struts and forming the probe wiring simultaneously with the laminated plates constituting the probe structure are provided.