TW201331971A - Fuse structure - Google Patents
Fuse structure Download PDFInfo
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- TW201331971A TW201331971A TW101103071A TW101103071A TW201331971A TW 201331971 A TW201331971 A TW 201331971A TW 101103071 A TW101103071 A TW 101103071A TW 101103071 A TW101103071 A TW 101103071A TW 201331971 A TW201331971 A TW 201331971A
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Abstract
Description
本發明係為一種保險絲結構，尤指一種可承受高功率之保險絲結構。The present invention is a fuse structure, especially a fuse structure that can withstand high power.
按，傳統之保險絲結構，由於結構上之設計並不具高導熱材料層或低導熱材料層，因而不適合作為承受高功率之保險絲，如第一圖所示，傳統保險絲結構30之熔絲部32，其係夾設於依基材31之上層部311及下層部312之間，而上層部311及下層部312係為同一種材料之基材，例如一種陶瓷材料，其中並無任何高導熱材料層或低導熱材料層之結構設計，因而無法耐高功率或應用於大電流之電路中，此外，傳統之保險絲結構亦無法依客戶需求而有各種導熱上之運用，而此導熱上之運用可作為保護保險絲元件或保護電路上之其他電子元件的選擇，上述均造成使用者之不便及困擾。According to the conventional fuse structure, since the structural design does not have a layer of high thermal conductive material or a layer of low thermal conductive material, it is not suitable as a fuse for withstanding high power. As shown in the first figure, the fuse portion 32 of the conventional fuse structure 30, The upper layer portion 311 and the lower layer portion 312 are a substrate of the same material, for example, a ceramic material, and there is no high thermal conductive material layer interposed between the layer portion 311 and the lower layer portion 312 of the substrate 31. Or the structural design of the low thermal conductive material layer, so it can not withstand high power or in the circuit of high current. In addition, the traditional fuse structure can not be used in various heat conduction according to customer requirements, and the application of the heat conduction can be used as The choice of protecting the fuse element or other electronic components on the protection circuit causes inconvenience and trouble to the user.
故實有必要就此一缺失重新設計，有鑑於此，如何將上述缺失加以摒除，即為本案發明人所欲解決之技術困難點之所在；是而，本案發明人基於多年從事相關產品設計的經驗，有感於上述傳統用品之不便，經多年苦心孤詣潛心研究，試作改良，終於可以摒除傳統保險絲結構之諸多缺點，成功研發完成本案，並使本發明得以誕生，以增進功效者。Therefore, it is necessary to redesign this lack. In view of this, how to eliminate the above-mentioned defects is the technical difficulty point that the inventor of the case wants to solve; however, the inventor of this case is based on years of experience in designing related products. I feel that the inconvenience of the above-mentioned traditional products, after many years of painstaking research, trial and improvement, can finally eliminate many of the shortcomings of the traditional fuse structure, successfully developed the case, and the invention was born to enhance the efficacy.
有鑑於上述之缺點，本發明係提供一種保險絲結構，包括：一基材，其係具有上層部及下層部，用以形成保險絲結構之基礎；一熔絲部，其係設於該上層部與下層部之間，且於該熔絲部與該下層部之間設有一高導熱材料層；至少一空穴，其係設於該熔絲部之表面處，用以形成該熔絲部之熔斷空間。In view of the above disadvantages, the present invention provides a fuse structure comprising: a substrate having an upper layer portion and a lower layer portion for forming a foundation of a fuse structure; and a fuse portion disposed in the upper layer portion and Between the lower layer portions, and a layer of high thermal conductive material between the fuse portion and the lower layer portion; at least one cavity is disposed at a surface of the fuse portion for forming a fuse space of the fuse portion .
如上述之保險絲結構，較佳的是該上層部與下層部係為陶瓷材料。In the above fuse structure, it is preferable that the upper layer portion and the lower layer portion are ceramic materials.
如上述之保險絲結構，較佳的是該上層部之外側更設有一低導熱材料層。For the fuse structure as described above, it is preferable that a layer of a low thermal conductive material is further disposed on the outer side of the upper layer portion.
如上述之保險絲結構，較佳的是該上層部之外側更設有一高導熱材料層。For the fuse structure as described above, it is preferable that a layer of a highly thermally conductive material is further disposed on the outer side of the upper layer portion.
本發明另提供一種保險絲結構，包括：一基材，其係具有上層部及下層部，用以形成保險絲結構之基礎；一熔絲部，其係設於該上層部與下層部之間，且於該下層部之外側設有一高導熱材料層；至少一空穴，其係設於該熔絲部之表面處，用以形成該熔絲部之熔斷空間。The present invention further provides a fuse structure comprising: a substrate having an upper layer portion and a lower layer portion for forming a foundation of a fuse structure; and a fuse portion disposed between the upper layer portion and the lower layer portion, and A layer of high thermal conductive material is disposed on an outer side of the lower layer portion; at least one cavity is disposed at a surface of the fuse portion to form a fuse space of the fuse portion.
如上述之保險絲結構，較佳的是該上層部與下層部係為陶瓷材料。In the above fuse structure, it is preferable that the upper layer portion and the lower layer portion are ceramic materials.
如上述之保險絲結構，較佳的是該上層部之外側更設有一低導熱材料層。For the fuse structure as described above, it is preferable that a layer of a low thermal conductive material is further disposed on the outer side of the upper layer portion.
如上述之保險絲結構，較佳的是該上層部之外側更設有一高導熱材料層。For the fuse structure as described above, it is preferable that a layer of a highly thermally conductive material is further disposed on the outer side of the upper layer portion.
本發明之主要目的在於提供一種可承受高功率之保險絲結構。The main object of the present invention is to provide a fuse structure that can withstand high power.
本發明之次要目的在於提供一種可保護保險絲元件之保險絲結構。A secondary object of the present invention is to provide a fuse structure that protects a fuse element.
本發明之另一目的在於提供一種可保護其他電子元件之保險絲結構。Another object of the present invention is to provide a fuse structure that can protect other electronic components.
以下係藉由特定的具體實施例說明本發明之實施方式，所屬技術領域中具有通常知識者可由本說明書所揭示之內容輕易地瞭解本發明之其他優點與功效。The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can readily understand other advantages and functions of the present invention from the disclosure of the present disclosure.
請參閱第二圖，第二圖係為本發明之第一實施例示意圖，如圖所示，本發明之保險絲結構10，包括：一基材11，其係具有上層部111及下層部112，用以形成保險絲結構之基礎；一熔絲部12，其係設於上層部111與下層部112之間，且於熔絲部12與下層部112之間設有一高導熱材料層14；至少一空穴13，其係設於熔絲部12之表面處，用以形成熔絲部12之熔斷空間，其中上層部111與下層部112可為陶瓷材料。藉由本發明而達到一種可承受高功率的保險絲結構之目的。Referring to the second drawing, the second drawing is a schematic view of a first embodiment of the present invention. As shown, the fuse structure 10 of the present invention comprises: a substrate 11 having an upper layer portion 111 and a lower layer portion 112. Forming a fuse structure; a fuse portion 12 is disposed between the upper layer portion 111 and the lower layer portion 112, and a layer of high thermal conductive material 14 is disposed between the fuse portion 12 and the lower layer portion 112; at least one empty The hole 13 is provided at the surface of the fuse portion 12 to form a fuse space of the fuse portion 12, wherein the upper portion 111 and the lower portion 112 may be ceramic materials. By the present invention, a fuse structure that can withstand high power is achieved.
請參閱第三圖及第四圖，係為本發明之第二及第三實施例示意圖，如圖所示，第三圖係保險絲結構10(如第二圖所示)之上層部111之外側更設有一低導熱材料層15，第四圖係保險絲結構10(如第二圖所示)之上層部111之外側更設有一高導熱材料層14。Please refer to the third and fourth figures, which are schematic diagrams of the second and third embodiments of the present invention. As shown in the figure, the third figure is the outer side of the upper layer portion 111 of the fuse structure 10 (as shown in the second figure). Further, a layer 15 of low thermal conductive material is provided, and a fourth layer of the fuse structure 10 (shown in FIG. 2) is further provided with a layer 14 of high thermal conductive material on the outer side of the upper layer portion 111.
請參閱第五圖，第五圖係為本發明之第四實施例示意圖，如圖所示，本發明之另一種保險絲結構20，包括：一基材21，其係具有上層部211及下層部212，用以形成保險絲結構之基礎；一熔絲部22，其係設於上層部211與下層部212之間，且於下層部212之外側設有一高導熱材料層24；至少一空穴23，其係設於熔絲部22之表面處，用以形成熔絲部22之熔斷空間，其中上層部211與下層部212可為陶瓷材料。藉由本發明而達到一種可承受高功率的保險絲結構之目的。Please refer to the fifth embodiment, which is a schematic view of a fourth embodiment of the present invention. As shown, another fuse structure 20 of the present invention includes: a substrate 21 having an upper portion 211 and a lower portion. 212, a base for forming a fuse structure; a fuse portion 22 disposed between the upper layer portion 211 and the lower layer portion 212, and a layer of high thermal conductive material 24 on the outer side of the lower layer portion 212; at least one cavity 23, It is provided at the surface of the fuse portion 22 to form a fuse space of the fuse portion 22, wherein the upper layer portion 211 and the lower layer portion 212 may be ceramic materials. By the present invention, a fuse structure that can withstand high power is achieved.
請參閱第六及第七圖，其係為本發明之第五及第六實施例示意圖，如圖所示，第六圖係保險絲結構20(如第五圖所示)之上層部211之外側更設有一低導熱材料層25，第七圖係保險絲結構20(如第五圖所示)之上層部211之外側更設有一高導熱材料層25。Please refer to the sixth and seventh figures, which are schematic diagrams of the fifth and sixth embodiments of the present invention. As shown in the figure, the sixth figure is the outer side of the upper layer portion 211 of the fuse structure 20 (as shown in the fifth figure). Further, a layer 25 of low thermal conductive material is provided, and the seventh layer is a fuse structure 20 (as shown in FIG. 5). A layer of high thermal conductive material 25 is further disposed on the outer side of the upper layer portion 211.
惟以上所述之具體實施例，僅係用於例釋本發明之特點及功效，而非用以限定本發明之可實施範疇，在未脫離本發明上揭之精神與技術範疇下，任何運用本發明所揭示內容而完成之等效改變及修飾，均仍應為下述之申請專利範圍所涵蓋。However, the specific embodiments described above are merely used to exemplify the features and functions of the present invention, and are not intended to limit the scope of the present invention, and may be applied without departing from the spirit and scope of the present invention. Equivalent changes and modifications made to the disclosure of the present invention are still covered by the scope of the following claims.
綜上所述，本發明在突破先前之技術結構下，確實已達到所欲增進之功效，且也非熟悉該項領域中之通常知識者所能輕易完成；再者，本發明申請前未曾公開，其所具之進步性、實用性，顯已符合發明專利之申請要件，爰依法提出發明申請。In summary, the present invention has achieved the desired effect under the prior art structure, and is not easily understood by those who are not familiar with the ordinary knowledge in the field; further, the invention has not been disclosed before the application. The progressive and practical nature of the invention has been consistent with the application requirements of the invention patent, and the invention application has been filed according to law.
10．．．保險絲結構10. . . Fuse structure
11．．．基材11. . . Substrate
111．．．上層部111. . . Upper department
112．．．下層部112. . . Lower part
12．．．熔絲部12. . . Fuse part
13．．．空穴13. . . Hole
14．．．高導熱材料層14. . . High thermal conductivity material layer
15．．．低導熱材料層15. . . Low thermal conductivity layer
20．．．保險絲結構20. . . Fuse structure
21．．．基材twenty one. . . Substrate
211．．．上層部211. . . Upper department
212．．．下層部212. . . Lower part
22．．．熔絲部twenty two. . . Fuse part
23．．．空穴twenty three. . . Hole
24．．．高導熱材料層twenty four. . . High thermal conductivity material layer
25．．．低導熱材料層25. . . Low thermal conductivity layer
30．．．傳統保險絲結構30. . . Traditional fuse structure
31．．．基材31. . . Substrate
311．．．上層部311. . . Upper department
312．．．下層部312. . . Lower part
32．．．熔絲部32. . . Fuse part
第一圖係為傳統保險絲結構之示意圖。The first figure is a schematic diagram of a conventional fuse structure.
第二圖係為本發明之第一實施例示意圖。The second figure is a schematic view of a first embodiment of the present invention.
第三圖係為本發明之第二實施例示意圖。The third figure is a schematic view of a second embodiment of the present invention.
第四圖係為本發明之第三實施例示意圖。The fourth figure is a schematic view of a third embodiment of the present invention.
第五圖係為本發明之第四實施例示意圖。The fifth figure is a schematic view of a fourth embodiment of the present invention.
第六圖係為本發明之第五實施例示意圖。The sixth drawing is a schematic view of a fifth embodiment of the present invention.
第七圖係為本發明之第六實施例示意圖。The seventh drawing is a schematic view of a sixth embodiment of the present invention.
10．．．保險絲結構10. . . Fuse structure
11．．．基材11. . . Substrate
111．．．上層部111. . . Upper department
112．．．下層部112. . . Lower part
12．．．熔絲部12. . . Fuse part
13．．．空穴13. . . Hole
14．．．高導熱材料層14. . . High thermal conductivity material layer
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101103071A TW201331971A (en) | 2012-01-31 | 2012-01-31 | Fuse structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101103071A TW201331971A (en) | 2012-01-31 | 2012-01-31 | Fuse structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201331971A true TW201331971A (en) | 2013-08-01 |
| TWI485738B TWI485738B (en) | 2015-05-21 |
Family
ID=49479085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101103071A TW201331971A (en) | 2012-01-31 | 2012-01-31 | Fuse structure |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201331971A (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996000973A1 (en) * | 1994-06-29 | 1996-01-11 | Wickmann-Werke Gmbh | Fuse |
| US5929741A (en) * | 1994-11-30 | 1999-07-27 | Hitachi Chemical Company, Ltd. | Current protector |
| US20030048620A1 (en) * | 2000-03-14 | 2003-03-13 | Kohshi Nishimura | Printed-circuit board with fuse |
| CN101313382A (en) * | 2005-10-03 | 2008-11-26 | 保险丝公司 | Fuse with cavity forming enclosure |
| CN201584389U (en) * | 2009-06-26 | 2010-09-15 | 颜琼章 | Improved resistance fuse device |
-
2012
- 2012-01-31 TW TW101103071A patent/TW201331971A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TWI485738B (en) | 2015-05-21 |
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