TW201325711A - 殼體及殼體的製作方法 - Google Patents

殼體及殼體的製作方法 Download PDF

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TW201325711A
TW201325711A TW101101030A TW101101030A TW201325711A TW 201325711 A TW201325711 A TW 201325711A TW 101101030 A TW101101030 A TW 101101030A TW 101101030 A TW101101030 A TW 101101030A TW 201325711 A TW201325711 A TW 201325711A
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casing
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ren-bo Wang
Xin-Wu Guan
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Fih Hong Kong Ltd
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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Abstract

本發明提供一種殼體，包括一基材及形成於基材上形的裝飾層，該基材由質量百分比為1-6%活性膠黏劑，94-98%活性碳，剩餘為有機雜質混合組成。另，本發明還提供所述殼體的製作方法。

Description

殼體及殼體的製作方法
本發明涉及一種殼體及該殼體的製作方法，尤其涉及一種籍由自清潔從而可以減少細菌且具有較好外觀的殼體及該殼體的製作方法。
習知的手持通訊設備，人們會隨時隨地的使用，例如手機，平板電腦，然而，該類可攜式電子產品的機殼上卻存在著大量污染物及傳染病菌，影響著人們的健康。受污染的主要來源可分三大類：一是化學因素，如各種油漆、塗料、黏合劑等，其主要污染物是甲醛、苯、二甲苯等揮發性的有機物和氨、一氧化碳、二氧化碳等無機物。二是物理因素:主要來源於材料本身，其主要污染物是放射性物質、電器設備的電磁輻射、光污染等。三是生物因素:主要污染物為蟎蟲等細菌和病菌。這些污染源籍由各種手持通訊產品傳播迅速，嚴重影響使用者的健康。
有鑒於此，有必要提供一種能減少細菌的殼體。
另外，還有必要提供一種上述殼體的製作方法。
一種殼體，包括一基材及形成於基材上的裝飾層，該基材由質量百分比為1-6%活性膠黏劑；94-98%活性碳剩餘為有機雜質。
本發明還提供一種殼體製作方法：
一種殼體，包括一基材及形成於基材上形的裝飾層，該基材由質量百分比為1-6%活性膠黏劑，94-98%活性碳，剩餘為有機雜質混合組成。
相較於習知技術，本發明的主要包含有活性炭和活性膠黏劑的複合殼體能吸附甲醛、苯、甲苯、二甲苯、氨氣、氡氣等有害氣體，且無二次污染，並且籍由活性碳能防黴，吸附催化功能去可除異味及除臭，籍由使用活性碳替代習知金屬材料及塗層材料，以達到抗菌、吸附污染物之功效，減小手持通訊產品對人體的危害。
本發明較佳實施例殼體：包括一基材，於基材形成裝飾層，該基材由質量百分含量為1-6%活性膠黏劑、94-98%活性碳、餘量的有機雜質組成。在本優選的實施例中，活性碳的主成分為質量百分比為94%碳及5%活性膠黏劑，並含有1%氫、氧、氮、硫等雜質。活性碳本體為黑色及表面複雜的多孔性物質，活性碳的原材料多樣化，木材、煤、泥炭或椰子殼等皆是活性碳的原材料。
該裝飾層可籍由機械加工等方法並籍由有機或無機顏料染色在基材上形成。
本發明的殼體的製作方法為：
（1）用質量百分比為1-6%活性膠黏劑；94-98%活性碳、剩餘為有機物雜質混合。在本優選的實施例中，活性碳的主成分為碳94%及活性膠黏劑5%，並摻有約1%氫、氧、氮、硫等自然混入的雜質物質混合而成，活性碳本體為黑色及表面複雜的多孔性物質，活性碳材質多樣化，木材、煤、泥炭或椰子殼等皆是碳的前軀體原材料。
（2）選用幹壓成型方式形成殼體，幹壓的條件為200~240Mpa，保壓30~60分鐘。
（3）活化：活性碳於碳化過程中，經常會有碳氫化合物焦油形成而附著在焦炭結構上，堵塞活性碳本體中的孔隙度，造成表面積減少而影響活性碳的吸附能力，所以必須藉由活化程式來去除碳氫化合物，以增加孔隙度。本發明優選的實施例中選用蒸汽活化，在蒸氣的高溫900~1150℃下去除基材表面層的原子，以增加孔隙度，基材表面最終孔隙率達到35%以上。
（4）形成裝飾層：首先，採用車磨工藝，根據所需尺寸進行初步加工，尺寸略高於最終尺寸。再利用CNC精雕至最終精準尺寸，公差在± 0.05mm。最後，進行彩繪裝飾，採用的顏料為鈦白粉系列、氧化鐵系列或鉻系。該類顏料氣孔率較一般染料透氣性好，外觀與一般顏料類似，顏色也比較豐富，可耐80℃溫度。裝飾層的透氣率達到80%以上，這樣顏料對活性碳吸附性的影響較小。
（5）二次活化：在彩繪之後再經過一次物理活化過程，在氧氣活化反應爐中進行活化過程，純氧氣氣氛下，加入一定量活化劑，該活化劑成分為有機矽、 氧化鈣、 二氧化矽及有機物質，750~850℃下進行活化。
（6）清潔清理：簡單清潔，吸油紙擦拭經過上述處理後的基材表面油污後，蒸餾水超聲波清洗5~10分鐘，60~70℃下烘乾即可，表面殘留加工工藝過程中殘留的表面粉塵、油污等。
相較於習知技術，本發明的包含有活性炭的殼體能吸附甲醛、苯、甲苯、二甲苯、氨氣、氡氣等有害氣體，且無二次污染，並且籍由活性碳能防黴，吸附催化功能去可除異味及除臭，籍由使用活性碳替代習知金屬材料及塗層材料，以達到抗菌、吸附污染物之功效，減小手持通訊產品對人體的危害。
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Claims (12)

  1. 一種殼體，包括一基材及形成於基材上形的裝飾層，其改良在於：該基材由質量百分比為1-6%活性膠黏劑，94-98%活性碳，剩餘為有機雜質混合組成。
  2. 如申請專利範圍第1項所述之殼體，其中所述基材中摻雜的有機雜質為氫、氧、氮、硫元素。
  3. 如申請專利範圍第1項所述之殼體，其中所述活性膠黏劑為高活性聚醚多元醇。
  4. 如申請專利範圍第1項所述之殼體，其中所述裝飾層籍由機械加工並籍由有機或無機顏料染色形成在基材上。
  5. 如申請專利範圍第1項所述之殼體，其中所述有機或無機顏料為鈦白粉系列、氧化鐵系列、鉻系。
  6. 一種殼體的製作方法，其包括如下步驟：
    用含有由質量百分比為1-6%活性膠黏劑；94-98%活性碳，剩餘為有機雜質化合而成基材；
    選用幹壓成型方式對基材進行擠壓成形；
    選用蒸汽對擠壓成形後的基材進行活化；
    在活化後的材料表面進行彩繪裝飾加工；
    對基材進行二次純氧活化。
  7. 如申請專利範圍第6項所述之殼體的製作方法，其中所述幹壓成型方式的設定成型壓力為200~240Mpa，保壓30~60分鐘。
  8. 如申請專利範圍第6項所述之殼體的製作方法，其中所述蒸汽活化，氣體在高溫900~1150℃，使表面層原子增加孔隙度，孔隙率達到35%以上。
  9. 如申請專利範圍第6項所述之殼體的製作方法，其中所述彩繪裝飾加工步驟為：首先，採用車磨，根據尺寸進行初步加工，利用CNC精雕至最終精準尺寸，彩繪過程中使用的顏料為有機或無機顏料。
  10. 如申請專利範圍第9項所述之殼體的製作方法，其中所述有機或無機顏料為鈦白粉系列、氧化鐵系列、鉻系。
  11. 如申請專利範圍第6項所述之殼體的製作方法，其中所述二次純氧活化，純氧氣氣氛下，加入活化劑，750~850℃下進行活化，該活化劑成分為有機矽、 氧化鈣、 二氧化矽及有機物質。
  12. 如申請專利範圍第6項所述之殼體的製作方法，其中對製作好的殼體進行清潔，吸油紙擦拭表面油污後，蒸餾水超聲波清洗5~10分鐘，60~70℃下烘乾。
TW101101030A 2011-12-30 2012-01-11 殼體及殼體的製作方法 TW201325711A (zh)

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