TW201319447A - 具有共同端點之照明模組 - Google Patents

具有共同端點之照明模組 Download PDF

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TW201319447A
TW201319447A TW101130218A TW101130218A TW201319447A TW 201319447 A TW201319447 A TW 201319447A TW 101130218 A TW101130218 A TW 101130218A TW 101130218 A TW101130218 A TW 101130218A TW 201319447 A TW201319447 A TW 201319447A
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lighting module
heat sink
array
conductive
light emitting
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TW101130218A
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Alejandro V Basauri
Jeff Smith
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Phoseon Technology Inc
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

一種照明模組，其具有電性地傳導散熱片、固定在該傳導散熱片上並且電性地連接至該傳導散熱片的一發光元件陣列、固定在該傳導片上之屈曲電路以及在該屈曲電路上之傳導佈線，該傳導佈線連接至該發光元件。一種照明模組，其具有散熱片、發光元件陣列，每個元件具有陰極端點和陽極端點，其中該散熱片為該些元件的共同端點。

Description

具有共同端點之照明模組
本發明關於一種具有共同端點之照明模組。
如發光二極體的固態發光器具有多個優於傳統弧光燈的優點。而這些優點包含低操作溫度以及低功率消耗、性能增加，以及更進一步地，可以藉由甚至更低的操作溫度以及功率消耗來節省成本。
例如，熱會裂化LED在每平方公分之光輸出功率的量的性能。任何允許LED操作之技術並且減少操作環境中之熱以在光輸出方面增加LED的性能。當減少熱對於LED之磨損時，對於個別的LED此亦可產生較長的壽命。減少熱通常涉及使用散熱片及/或冷卻系統，不是空氣就是液體。
減少功率銷耗可能造成較低的花費以及減少熱這兩者好處。產生熱的其中一個因子涉及該等裝置之功率提取的量。如果該等裝置提取少的功率，則他們在發射和功率供給的路線中產生少的熱，同時保持該電源冷卻。
大部分現有的技術藉由增加元件至該燈光設施以減少溫度和功率銷耗，例如如上所提及之冷卻系統，或者是功率控制器、屏蔽或是電鍍等等。極少數的技術提出該裝置本身如何配置。
本發明之一態樣關於一種照明模組，其包含散熱片；以及發光元件之陣列，每一個元件具有陰極端點以及陽極 端點，其中該散熱片為該些元件的共同端點。
本發明之另一態樣關於一種照明模組，其包含電性地傳導散熱片；固定在該傳導散熱片上並且電性地連接至該傳導散熱片的一發光元件陣列；固定在該傳導散熱片上之一屈曲電路；以及在該屈曲電路上之傳導佈線，該傳導佈線連接至該等發光元件。
圖1顯示目前使用於照明模組中的LED陣列之執行的範例。LED具有很多優點優於傳統燈光，特別是使用於固化應用中之LED。他們通常在低溫操作並且損耗少的功率。然而固態裝置當被加熱時可能會遭遇到性能的劣化。當LED在低溫操作時，所產生的熱可能會影響LED的輸出功率。許多冷卻技術可管理熱，包含使用散熱片，其典型地為一片熱傳導材料以傳導多餘的熱遠離LED。
圖1顯示目前所執行之固定至散熱片12的LED陣列10。LED通常具有陰極和陽極。一般來說，每個LED 20的陽極在傳導佈線18上，而該陰極藉由如22之打線接合而接線至相鄰的傳導佈線18。該傳導佈線18位在中間基板上。此範例具有中間基板，該中間基板由氮化鋁基板16所構成。中間基板16透過導熱膏14而固定至散熱片12。
此配置上出現問題，例如衝擊必須透過傳導佈線、中間基板以及導熱膏而傳輸至該散熱片，在該點時，此衝擊最後就消散。此造成高程度的熱阻，其與電阻有些相似之處，特別在於當熱量增加時，它需要更多的功率以產生相 同的照射輸出。
在圖1的範例中，對於每個發光元件的每個陽極和陰極分開的連接。然而，一者可形成該LED陣列以具有該發光元件共享一共同陽極。其允許該等LED和該散熱片之配置而藉由從該熱傳導路徑移除元件來減少熱阻。
圖2顯示用於發光元件而具有一共同陽極的LED陣列之實施例。在該發光元件之陣列30中，例如20之該發光元件直接地固定至散熱片12。該散熱片通常由熱及電傳導散熱片所構成，例如鋁或銅。該散熱片之電導率允許其提供一共同電性連接至發光元件的陽極。該等發光元件可由任何固態元件，例如發光二極體或是雷射二極體所構成。
該些散熱片可為組合式的，其中它們係被電或是熱絕緣，該些散熱片可被綁在一起或是不被綁在一起，端看該等散熱片的尺寸。要具有減少線規(wire gage)的優點需要傳遞電流至該共同陽極散熱片連接。這就使得產品提供組合式和可變的尺寸作為一個選項，以佔領不同的市場和用途。
例如18之該傳導佈線不能置於該散熱片上，由於該散熱片之傳導性將與該等傳導佈線短路。一個解決方法為在該散熱片和該等傳導佈線之間使用絕緣體32，而該等傳導佈線連接有發光元件之陰極。在此實施例中，該絕緣體由屈曲電路所構成，其可具有至少一層，通常是某種類型的電絕緣材料，例如電介質。該絕緣體將具有傳導佈線置於其之上，例如銅佈線。例如一層疊結構之一個範例將為屈曲電路。
圖3顯示一屈曲電路之實施例的上視圖，其可作為絕緣體32。絕緣體32具有開口36，其可容置發光二極體陣列。在此特殊的實施例中，每個開口容置三個發光二極體，但是開口可具有有任何所需的配置。此外，該屈曲電路可包含例如為40之發光二極體或是電晶體。該屈曲電路可亦容置如42之熱敏電阻。該些元件可以監測LED的照射輸出以及靠近LED附近所產生的熱。
圖4顯示照明模組30之前視圖。LED陣列20置於具有屈曲電路32的散熱片12上。該傳導夾具44協助支撐屈曲電路32至該散熱片。該等夾具可藉由螺栓或是其他連接物46而附接至該散熱片，並且該等夾具提供一迴路至接地極48。該等螺栓或是其他連接物必須與該散熱片電性地絕緣，以避免陽極和陰極連接的短路。
圖5顯示該照明模組的平面圖。該照明模組包含散熱片12、LED陣列20、屈曲電路32、夾具44和連接物48。該散熱片可藉由接地電纜50而被附接至接地路徑以產生該接地路徑。
除了藉由消除熱電阻的幾個來源以更有效的熱管理之外，使用共同陽極允許該發光元件陣列之不同的電性配置。圖6顯示先前範例的LED陣列60之配線圖。在該配線圖中，該等元件位於列與行的x-y格子中。列和行的指定可為任意的，但是在此特定的的範例中，發光元件62之群組組成該陣列的列。該等元件之此列係經接線以使得每個在該列中之元件係與在一特定行中之其他元件串聯接線在一 起。
相反的，圖7之配線圖顯示藉由共同陽極配置而可行的一個可能性。陣列70具有列72，其中每個在該列中的元件係並聯的接線至在該陣列中之其他元件。此種配置方式可能具有數個優點。在者，此允許LED之隨機放置於該散熱片上，使得其較易於製造，建構光學元件以增加光萃取，可形成具有LED的同案，例如圓形或奇形多邊形(odd shaped polygon)以幫助光投影。
當上述討論針對共同陽極時，所屬技術領域中具有通常知識者將瞭解到，可以反轉該陰極和陽極、改變電路的極性以及以使用共同陰極取代。因此，此概念可與共同端點有關。
雖然在此所描述的特點為具有共同端點之發光元件陣列的特定實施例，然而這些具體引用之目的不是被視為這些實施例的範圍的限制。
10‧‧‧LED陣列
12‧‧‧散熱片
14‧‧‧導熱膏
16‧‧‧中間基板
18‧‧‧傳導佈線
20‧‧‧LED
22‧‧‧打線接合
30‧‧‧陣列
32‧‧‧絕緣體
36‧‧‧開口
40‧‧‧發光二極體或電晶體
42‧‧‧熱敏電阻
44‧‧‧夾具
46‧‧‧螺栓或其他連接物
48‧‧‧接地極
50‧‧‧接地電纜
60‧‧‧LED陣列
62‧‧‧發光元件群組
70‧‧‧陣列
72‧‧‧列
圖1顯示固定於散熱片上之目前LED的側視圖。
圖2顯示具有共同陽極之LED陣列的實施例之側視圖。
圖3顯示屈曲電路之實施例的上視圖。
圖4顯示利用共同陽極之LED陣列的實施例。
圖5顯示具有共同陽極固定於散熱片組件上之LED陣列的實施例。
圖6顯示先前技術之LED陣列的配線圖。
圖7顯示具有共同陽極之LED陣列的配線圖之實施例。
12‧‧‧散熱片
18‧‧‧傳導佈線
20‧‧‧LED
22‧‧‧打線接合
30‧‧‧陣列
32‧‧‧絕緣體

Claims (14)

  1. 一種照明模組，其包含：散熱片；以及發光元件之陣列，每一個元件具有陰極端點以及陽極端點，其中該散熱片為該些元件的共同端點。
  2. 如申請專利範圍第1項之照明模組，其進一步包含固定銅佈線於該散熱片上，使得該銅佈線係與該散熱片電性地絕緣。
  3. 如申請專利範圍第2項之照明模組，其進一步包含在該等銅佈線和發光元件之陰極之間的電性連接。
  4. 如申請專利範圍第2項之照明模組，其中該等銅佈線係藉由一屈曲電路以與該散射片電性地絕緣。
  5. 如申請專利範圍第4項之照明模組，該照明模組進一步包含傳導夾具，其被配置以夾住該屈曲電路至該散熱片。
  6. 如申請專利範圍第5項之照明模組，其中該夾具係被配置以提供電路至接地極。
  7. 如申請專利範圍第1項之照明模組，其中發光元件之陣列具有列和行，並且在一個列中之每個元件係並聯地電性連接至在該相同列中之其他元件。
  8. 一種照明模組，其包含：電性地傳導散熱片；固定在該傳導散熱片上並且電性地連接至該傳導散熱片的一發光元件陣列； 固定在該傳導散熱片上之一屈曲電路；以及在該屈曲電路上之傳導佈線，該傳導佈線連接至該等發光元件。
  9. 如申請專利範圍第8項之照明模組，其中該傳導散熱片為銅或鋁中之一者。
  10. 如申請專利範圍第8項之照明模組，其中該發光元件陣列包含發光二極體(LED)陣列，其發射紫外光。
  11. 如申請專利範圍第8項之照明模組，其中該屈曲電路具有多層，該多層中之至少一者為電介質。
  12. 如申請專利範圍第8項之照明模組，其中該屈曲電路具有開口以容納該發光元件陣列。
  13. 如申請專利範圍第8項之照明模組，其中該發光元件陣列係電性地連接至作為一共同端點的該散熱片。
  14. 如申請專利範圍第8項之照明模組，其中該照明模組進一步包含多個散熱片，每一個為電性且熱絕緣，除非彼此連接在一起。
TW101130218A 2011-08-31 2012-08-21 具有共同端點之照明模組 TW201319447A (zh)

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