TW201318831A - Automatic altimeter apparatus of splitting machine and altimetry method thereof - Google Patents

Automatic altimeter apparatus of splitting machine and altimetry method thereof Download PDF

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Publication number
TW201318831A
TW201318831A TW100139738A TW100139738A TW201318831A TW 201318831 A TW201318831 A TW 201318831A TW 100139738 A TW100139738 A TW 100139738A TW 100139738 A TW100139738 A TW 100139738A TW 201318831 A TW201318831 A TW 201318831A
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Taiwan
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splitting machine
splitting
height measuring
linear
platform
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TW100139738A
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Chinese (zh)
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Sheng-Xiong Yang
Yuan-Qin Liu
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Horng Terng Automation Co Ltd
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Priority to TW100139738A priority Critical patent/TW201318831A/en
Priority to CN201210182853.2A priority patent/CN103090797B/en
Publication of TW201318831A publication Critical patent/TW201318831A/en

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Abstract

The present invention relates to an automatic altimeter apparatus of splitting machine and its altimetry method. The splitting machine is provided with a linear coder and a position feedback device so that a linear displacement device and a moving platform of the splitting machine can be directly used to measure the thickness of a target object, and the position feedback device and the linear coder then are used to record the current location. Accordingly, the thickness of the target object can be easily, quickly and accurately measured to improve the working efficiency. The present invention overcomes the shortcomings of existing measurement methods that are unable to quickly and accurately measure the thickness of a target object.

Description

劈裂機的自動測高裝置及其測高方法Automatic height measuring device of splitting machine and height measuring method thereof

本發明係涉及一種劈裂機的自動測高裝置及其測高方法。The invention relates to an automatic height measuring device for a splitting machine and a method for measuring the height thereof.

劈裂機泛指以劈裂刀對物品施加以壓力,並使其分裂的機具。其包含有一刀具及多數傳動機構,其中刀具包含有一底台及一劈裂刀,使用時,將欲劈裂之物品置於底台上,接著使劈裂刀之作用端向下對該物品施加壓力,並藉此劈裂。A splitting machine generally refers to a machine that applies pressure to a piece of a splitting knife and splits it. The utility model comprises a cutter and a plurality of transmission mechanisms, wherein the cutter comprises a bottom platform and a splitting knife, and in use, the object to be split is placed on the base, and then the action end of the splitting knife is applied downward to the article. Pressure, and thereby chapped.

而現有之劈裂機多使用於相當精密之物品,例如晶圓等物,因此其動作要求相當精準,就連劈裂刀的上下進刀距離也同樣如此;然而在高精準度的檢視之下,每個目標物的厚度不一定相同,或甚至是同一個目標物由於其表面不平整,因此不同處的厚度也會有些微差異,而這些因素皆會影響到劈裂刀的進刀行程,若劈裂刀進刀過深,可能會劈裂至其他不該劈裂之處,或著是進刀過淺,則會無法完全劈斷目標物。The existing splitting machines are often used in quite sophisticated items, such as wafers, so the motion requirements are quite accurate, even the upper and lower feed distances of the splitting knife are the same; however, under high precision inspection The thickness of each target is not necessarily the same, or even the same target is uneven due to its uneven surface, so the thickness of the different parts will be slightly different, and these factors will affect the infeed stroke of the splitting knife. If the splitting knife is too deep, it may split to other places where it should not be split, or if the cutting is too shallow, it will not completely break the target.

因此為解決劈裂刀之進刀問題,在每次進刀前,皆會有人員人工測量目標物之厚度,然而劈裂刀之進刀誤差距離可能難以用肉眼輕易判斷,不然則是須以複雜之測量器具來檢視,而不論是哪種方式,皆會造成操作人員的困擾,並且大幅影響工作效率;尤其當使用於晶圓時,可能需要劈裂十數次甚至數十次,並且每次劈裂前皆需要再次測量該處之厚度,更是會大幅拉長工作時間。Therefore, in order to solve the problem of the splitting knife, some people will manually measure the thickness of the target before each feeding. However, the error of the cutting edge of the splitting knife may be difficult to judge with the naked eye. Otherwise, it must be Complex measuring instruments can be viewed, and in either case, it can cause operator troubles and greatly affect work efficiency; especially when used on wafers, it may need to be cracked dozens or even dozens of times, and each Before the splitting, it is necessary to measure the thickness of the place again, and it will greatly lengthen the working time.

因此,無法快速且準確測量出目標物厚度的測量方法,實有待加以改良。Therefore, the measurement method for measuring the thickness of the target object quickly and accurately does not need to be improved.

有鑑於前述現有測量方法無法快速且準確測量出目標物厚度的缺點及不足,本發明提供一種劈裂機的自動測高裝置及其測高方法,其可快速且精準地測量出目標物的厚度。In view of the shortcomings and disadvantages of the foregoing existing measurement methods that cannot quickly and accurately measure the thickness of the target object, the present invention provides an automatic height measuring device for a splitting machine and a method for measuring the height thereof, which can quickly and accurately measure the thickness of the target object. .

為達到上述的發明目的,本發明所採用的技術手段為設計一種劈裂機的自動測高裝置,其中包含:一劈裂機,其係具有一基座、一移動平台、一線性位移裝置、一劈裂刀及一底台,移動平台可上下移動地裝設於基座上,線性位移裝置用以控制移動平台的移動,劈裂刀裝設於移動平台上,底台位於劈裂刀下方;一線性編碼器,其裝設在劈裂機的基座上,且沿著移動平台的移動路線設置;一位置回饋裝置,其裝設於劈裂機的移動平台上,且可感應線性編碼器,進而產生一數值;一控制系統,其可感應劈裂機之線性位移裝置的電流(電壓)變化,並可紀錄位置回饋裝置所產生的數值。In order to achieve the above object, the technical means adopted by the present invention is to design an automatic height measuring device for a splitting machine, which comprises: a splitting machine having a base, a moving platform, a linear displacement device, a splitting knife and a bottom platform, the mobile platform can be mounted on the base up and down, the linear displacement device is used to control the movement of the mobile platform, the splitting knife is mounted on the mobile platform, and the bottom platform is located under the splitting knife a linear encoder mounted on the base of the splitter and disposed along the moving path of the moving platform; a position feedback device mounted on the moving platform of the splitting machine and capable of sensing linear coding And, in turn, a value; a control system that senses the change in current (voltage) of the linear displacement device of the splitter and records the value produced by the position feedback device.

所述之劈裂機的自動測高裝置,其中劈裂機之線性位移裝置為線性馬達。The automatic height measuring device of the splitting machine, wherein the linear displacement device of the splitting machine is a linear motor.

所述之劈裂機的自動測高裝置,其中線性編碼器為光學尺;位置回饋裝置為光學尺讀頭。The automatic height measuring device of the splitting machine, wherein the linear encoder is an optical scale; the position feedback device is an optical scale reading head.

為達到上述的發明目的,本發明另設計一種劈裂機的自動測高方法,其中包含:準備步驟:準備一前述之劈裂機的自動測高裝置;第一步驟:劈裂機的自動測高裝置進入測高模式;第二步驟:移動平台向下移動;第三步驟:當劈裂刀的刀鋒接觸目標物時受到阻力,線性位移裝置的負載電流(電壓)上升;第四步驟:當線性位移裝置的負載電流(電壓)上升至設定值時,控制系統便會紀錄當下位置回饋裝置在線性編碼器上感應到的數值;第五步驟:當數值紀錄後,移動平台立刻上升,以避免壓傷或壓斷目標物,並完成測高動作。In order to achieve the above object, the present invention further provides an automatic height measuring method for a splitting machine, which comprises: preparing steps: preparing an automatic height measuring device of the aforementioned splitting machine; first step: automatic measuring of the splitting machine The high device enters the altimetry mode; the second step: the mobile platform moves downward; the third step: when the blade of the cleavage knife contacts the target, the resistance is applied, and the load current (voltage) of the linear displacement device rises; the fourth step: when When the load current (voltage) of the linear displacement device rises to the set value, the control system records the value sensed by the current position feedback device on the linear encoder; the fifth step: when the value is recorded, the mobile platform immediately rises to avoid Press or break the target and complete the height measurement.

本發明之優點在於,藉由在劈裂機上設置線性編碼器及位置回饋裝置,以可直接利用劈裂機的線性位移裝置及移動平台來測量目標物的厚度,再使位置回饋裝置及線性編碼器配合紀錄當下之位置,以可輕易、快速且精準地測量出目標物厚度,進而提高工作效率。The invention has the advantages that the linear encoder and the position feedback device are arranged on the splitting machine, so that the thickness of the target can be directly measured by the linear displacement device and the moving platform of the splitting machine, and then the position feedback device and the linearity are used. The encoder cooperates with the current position of the record to make it easy, fast and accurate to measure the thickness of the target, thus improving work efficiency.

以下配合圖示及本發明之較佳實施例,進一步闡述本發明為達成預定發明目的所採取的技術手段。The technical means adopted by the present invention for achieving the intended purpose of the invention are further described below in conjunction with the preferred embodiments of the invention.

請參閱圖1至圖3所示,本發明之劈裂機的自動測高裝置包含有一劈裂機10、一線性編碼器、一位置回饋裝置及一控制系統。Referring to FIG. 1 to FIG. 3, the automatic height measuring device of the splitting machine of the present invention comprises a splitting machine 10, a linear encoder, a position feedback device and a control system.

前述之劈裂機10具有一基座11、一移動平台12、一線性位移裝置、一劈裂刀14及一底台15,在本實施例中,線性位移裝置為線性馬達13;移動平台12可上下移動地裝設於基座11上;線性馬達13用以控制移動平台12的上下移動;劈裂刀14裝設於移動平台12上;底台15位於劈裂刀14的下方。The splitting machine 10 has a base 11, a moving platform 12, a linear displacement device, a splitting blade 14 and a bottom plate 15. In the embodiment, the linear displacement device is a linear motor 13; the moving platform 12 The linear motor 13 is configured to be mounted on the base 11; the linear motor 13 is used to control the up and down movement of the moving platform 12; the splitting blade 14 is mounted on the moving platform 12; and the bottom 15 is located below the splitting blade 14.

前述之線性編碼器在本實施例中為光學尺21,其裝設在劈裂機10的基座11上,且沿著移動平台12的移動路線設置。The aforementioned linear encoder is an optical scale 21 in the present embodiment, which is mounted on the base 11 of the splitter 10 and disposed along the movement path of the moving platform 12.

前述之位置回饋裝置在本實施例中為光學尺讀頭22,其裝設於劈裂機10的移動平台12上,且感應光學尺21的刻度(數值)。The position feedback device described above is the optical scale read head 22 in the present embodiment, which is mounted on the moving platform 12 of the splitter 10 and senses the scale (value) of the optical scale 21.

前述之控制系統可感應劈裂機10之線性馬達13的電流(電壓)變化,並可紀錄光學尺讀頭22所讀取到的數值。The aforementioned control system can sense the change in current (voltage) of the linear motor 13 of the splitter 10 and can record the value read by the optical scale read head 22.

請參閱圖1至圖3及圖5所示,本發明之劈裂機的自動測高方法,包含:準備步驟:準備一前述之劈裂機的自動測高裝置。Referring to FIG. 1 to FIG. 3 and FIG. 5, the automatic height measuring method of the splitting machine of the present invention comprises: preparing step: preparing an automatic height measuring device of the foregoing splitting machine.

第一步驟:劈裂機的自動測高裝置進入測高模式。The first step: the automatic height measuring device of the splitting machine enters the height measuring mode.

第二步驟:移動平台12定速向下移動。The second step: the mobile platform 12 moves at a constant speed.

第三步驟:當劈裂刀14的刀鋒接觸目標物50時受到阻力,線性馬達13的負載電流(電壓)上升(如圖4所示)。The third step: when the blade of the splitting blade 14 contacts the target 50, the load is applied, and the load current (voltage) of the linear motor 13 rises (as shown in FIG. 4).

第四步驟:當線性馬達13的負載電流(電壓)上升至設定值時,控制系統便會紀錄當下光學尺讀頭22在光學尺21上讀取到的數值。Fourth step: When the load current (voltage) of the linear motor 13 rises to a set value, the control system records the value read by the optical scale read head 22 on the optical scale 21.

第五步驟:當該高度,也就是第四步驟之數值紀錄後,移動平台12立刻上升,以避免壓傷或壓斷目標物50,並完成測高動作(如圖3所示)。The fifth step: when the height, that is, the value of the fourth step, is recorded, the mobile platform 12 immediately rises to avoid crushing or crushing the target 50, and completes the height measuring action (as shown in FIG. 3).

本發明藉由在劈裂機10上設置光學尺21及光學尺讀頭22,以可直接利用劈裂機10的線性馬達13及移動平台12來測量目標物50的厚度,再使光學尺讀頭22及光學尺21配合紀錄當下之位置,以可輕易、快速且精準地測量出目標物50厚度,進而提高工作效率。According to the present invention, the optical scale 21 and the optical scale read head 22 are disposed on the splitting machine 10, so that the thickness of the target 50 can be directly measured by the linear motor 13 of the splitting machine 10 and the moving platform 12, and then the optical scale is read. The head 22 and the optical scale 21 cooperate to record the current position, so that the thickness of the target 50 can be measured easily, quickly and accurately, thereby improving work efficiency.

以上所述僅是本發明的較佳實施例而已,並非對本發明做任何形式上的限制,雖然本發明已以較佳實施例揭露如上,然而並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明技術方案的範圍內,當可利用上述揭示的技術內容作出些許更動或修飾為等同變化的等效實施例,但凡是未脫離本發明技術方案的內容,依據本發明的技術實質對以上實施例所作的任何簡單修改、等同變化與修飾,均仍屬於本發明技術方案的範圍內。The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and A person skilled in the art can make some modifications or modifications to equivalent embodiments by using the above-disclosed technical contents without departing from the technical scope of the present invention. The present invention is not limited to any simple modifications, equivalent changes and modifications of the above embodiments.

10...劈裂機10. . . Splitting machine

11...基座11. . . Pedestal

12...移動平台12. . . mobile platform

13...線性馬達13. . . Linear motor

14...劈裂刀14. . . Splitting knife

15...底台15. . . Base

21...光學尺twenty one. . . Optical ruler

22...光學尺讀頭twenty two. . . Optical ruler

50...目標物50. . . Target

圖1係本發明之裝置之示意圖。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic illustration of the apparatus of the present invention.

圖2係本發明之裝置之部份放大示意圖。Figure 2 is a partial enlarged view of the apparatus of the present invention.

圖3係本發明之移動平台下降前之示意圖。3 is a schematic view of the mobile platform of the present invention before it descends.

圖4係本發明之移動平台下降後之示意圖。4 is a schematic diagram of the mobile platform of the present invention after it has been lowered.

圖5係本發明之方法流程圖。Figure 5 is a flow chart of the method of the present invention.

Claims (4)

一種劈裂機的自動測高裝置,包含:一劈裂機,其係具有一基座、一移動平台、一線性位移裝置、一劈裂刀及一底台,移動平台可上下移動地裝設於基座上,線性位移裝置用以控制移動平台的移動,劈裂刀裝設於移動平台上,底台位於劈裂刀下方;一線性編碼器,其裝設在劈裂機的基座上,且沿著移動平台的移動路線設置;一位置回饋裝置,其裝設於劈裂機的移動平台上,且可感應線性編碼器,進而產生一數值;一控制系統,其可感應劈裂機之線性位移裝置的電流(電壓)變化,並可紀錄位置回饋裝置所產生的數值。An automatic height measuring device for a splitting machine, comprising: a splitting machine, comprising: a base, a moving platform, a linear displacement device, a splitting knife and a bottom platform; the mobile platform can be installed up and down On the pedestal, a linear displacement device is used to control the movement of the mobile platform, the splitting knife is mounted on the mobile platform, the bottom platform is located under the splitting knife, and a linear encoder is mounted on the base of the splitting machine. And a moving route along the moving platform; a position feedback device installed on the moving platform of the splitting machine and capable of sensing a linear encoder to generate a value; a control system capable of sensing the splitting machine The current (voltage) of the linear displacement device changes, and the value generated by the position feedback device can be recorded. 如申請專利範圍第1項所述之劈裂機的自動測高裝置,其中劈裂機之線性位移裝置為線性馬達。The automatic height measuring device of the splitting machine according to claim 1, wherein the linear displacement device of the splitting machine is a linear motor. 如申請專利範圍第1或2項所述之劈裂機的自動測高裝置,其中線性編碼器為光學尺;位置回饋裝置為光學尺讀頭。An automatic height measuring device for a splitting machine according to claim 1 or 2, wherein the linear encoder is an optical scale; and the position feedback device is an optical scale reading head. 一種劈裂機的自動測高方法,包含:準備步驟:準備一如同申請專利範圍第1至3項中任一項所述之劈裂機的自動測高裝置;第一步驟:劈裂機的自動測高裝置進入測高模式;第二步驟:移動平台向下移動;第三步驟:當劈裂刀的刀鋒接觸目標物時受到阻力,線性位移裝置的負載電流(電壓)上升;第四步驟:當線性位移裝置的負載電流(電壓)上升至設定值時,控制系統便會紀錄當下位置回饋裝置在線性編碼器上感應到的數值;第五步驟:當數值紀錄後,移動平台立刻上升,以避免壓傷或壓斷目標物,並完成測高動作。An automatic height measuring method for a splitting machine, comprising: preparing step: preparing an automatic height measuring device of a splitting machine as described in any one of claims 1 to 3; first step: splitting machine The automatic height measuring device enters the height measuring mode; the second step: the moving platform moves downward; the third step: when the blade of the splitting knife contacts the target, the resistance is received, and the load current (voltage) of the linear displacement device rises; the fourth step : When the load current (voltage) of the linear displacement device rises to the set value, the control system records the value sensed by the current position feedback device on the linear encoder; the fifth step: when the value is recorded, the mobile platform immediately rises. To avoid crushing or breaking the target and complete the height measurement.
TW100139738A 2011-11-01 2011-11-01 Automatic altimeter apparatus of splitting machine and altimetry method thereof TW201318831A (en)

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CN107655435A (en) * 2017-09-15 2018-02-02 广东利迅达机器人系统股份有限公司 A kind of high method of survey of robot to supplied materials workpiece
CN107806846A (en) * 2017-10-17 2018-03-16 广东利迅达机器人系统股份有限公司 A kind of high method of survey of robot to supplied materials workpiece
CN109909807B (en) * 2019-04-03 2021-11-12 上海维宏电子科技股份有限公司 Method for realizing automatic scanning height measurement in numerical control system

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US8293043B2 (en) * 2006-07-24 2012-10-23 Asm Assembly Automation Ltd Automatic level adjustment for die bonder
KR100801316B1 (en) * 2006-11-20 2008-02-05 한밭대학교 산학협력단 Automatically measuring height device for using airpressure
CN201856456U (en) * 2010-09-27 2011-06-08 深圳市润天智图像技术有限公司 Height adjusting device of spray-painting printer trolley
TWM406802U (en) * 2010-12-30 2011-07-01 Horng Terng Automation Co Ltd High speed wafer cleavage device
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