TW201316588A - Materials supply device and deposition device - Google Patents

Abstract

A materials supply device which supplies a vaporized solid material, the device comprising: a vaporizing member which has a supply surface to which the solid material is supplied, and vaporizes the solid material, a powder material supply member which supplies the solid material in powder form onto the supply surface of the vaporizing member, a material dispersion member, which is attached to the powder material supply member such that a gap is formed with respect to the supply surface of the vaporizing member, and disperses the powdered solid material across the supply surface of the vaporizing member, and a transport mechanism which moves the vaporizing member relative to the material dispersing member.

Description

Material supply device and film forming device

Each aspect and embodiment of the present invention relates to a film forming apparatus for performing film formation of a light-emitting layer of an organic EL element, and a material supply device for supplying a material to a film forming apparatus.

In recent years, an organic electroluminescence device using electroluminescence (EL: Electro Luminescence) has been developed. The basic structure of the organic electroluminescence device is a sandwich structure formed by laminating an anode layer, a light-emitting layer, and a cathode layer on a glass substrate. In order to take out the light of the light-emitting layer to the outside, the anode layer on the glass substrate is a transparent electrode made of ITO (Indium Tin Oxide) or the like. The organic electroluminescence device is generally produced by forming a light-emitting layer and a cathode layer on a glass substrate having an ITO layer (anode layer) formed in advance on the surface thereof, and then forming a sealing film layer.

The light-emitting layer of the organic electroluminescence device is generally formed by vapor deposition. The organic material is a solid, which is vaporized into a material gas by heating by a material supply device, and is supplied to the vapor deposition head. Patent Document 1 discloses a film forming apparatus including: an open-close type valve which is a gate valve for supplying a granular organic material; and a gap portion which is a cover body which is freely rotatable and liftable, and which faces the cover body Produced between the concave bodies; the quantitative portion adjusts the width of the gap portion; and the material supply device has a vaporization member that vaporizes the powder material. In this apparatus, the supplied granular organic material is pulverized into a powder form in the gap portion by opening and closing of the open/close valve, and the powdery organic material is vaporized. The amount of supply of the organic material supplied to the vaporization member is controlled by controlling the width of the gap portion, the rotational speed of the lid body, and the pressure difference in the device.

[Practical Technical Literature] [Patent Literature]

[Patent Document 1] International Publication WO2010/123027

However, it is now necessary to be able to adjust the vaporization rate (rate) with higher precision. In the technical field, it has been desired to develop a material supply device and a film forming apparatus capable of adjusting the sublimation and melting speed of a solid organic material with better precision.

That is, the material supply device of one aspect of the present invention vaporizes and supplies the solid material, comprising: a vaporization member having a supply surface to receive the supply of the solid material, and vaporizing the solid material; the powder material supply member, The powdery solid material is supplied to the supply surface of the vaporization member; the material dispersion member is attached to the powder material supply member, and is disposed to form a gap with the supply surface of the vaporization member, and the powdery solid material is formed Dispersing onto the supply surface of the vaporization member; and moving the mechanism to move the vaporization member relative to the material dispersion member.

In the material supply device of one aspect of the invention, the powder material supply member supplies the powdery solid material to the supply surface of the vaporization member, and the vaporization member moves relative to the material dispersion member by the moving mechanism. By moving the supply side, the powder material can be further diffused. Further, a gap is provided between the material dispersion member of the powder material supply member and the vaporization member, so that the solid material is diffused by a thickness corresponding to the gap width. In this way, the sublimation and melting speed of the organic material can be adjusted with good precision by the gap.

In an embodiment of the invention, the material dispersion member may have a hollow structure. By forming such a structure, the powder material accommodated in the material dispersion member can be evenly distributed over the entire gap between the vaporization member and the like, so that it can be properly dispersed.

According to an embodiment of the invention, the material dispersion member may have an elevating mechanism that moves up and down with respect to the supply surface. By forming such a structure, the width of the gap can be changed, so that the thickness of the powder material can be changed.

In an embodiment of the invention, the vaporization member may be arranged such that the supply surface is a top surface. By forming such a structure, the solid material can be supplied to the supply surface by gravity.

In an embodiment of the present invention, the vaporization member may be a circular plate member made of a porous material, and one of the main faces is formed as a vaporization surface. By forming such a structure, the gas generated by vaporization on the top surface side can pass through the disk member, so that the generated gas can be transported out from the bottom side of the vaporization member. Further, since the melted material can pass through the porous vaporization member, the bottom surface side can also be used as the vaporization surface.

In an embodiment of the invention, the vaporization member may form a groove on the supply surface. By forming such a structure, a gap can be provided between the supply surface and the material dispersion member, so that the amount filled in the groove can be regarded as a powder material by narrowing the supply surface and the material dispersion member. The amount of supply is set. Therefore, the supply amount of the powder material can be fixed.

In an embodiment of the invention, the moving mechanism can also rotate the vaporization member. The moving mechanism may also rotate the vaporization member by using a rod connected to the vaporization member as a rotating shaft. By forming such a structure, the powder member can be dispersed over the entire surface of the vaporization member.

In an embodiment of the present invention, the powder material supply member may have an axis that is displaced from a rotational axis of the vaporization member. Further, the material dispersing member may be a surface that is connected to one end of the powder material supply member and joined to an end portion where the gap is formed, and is curved along a direction in which the vaporization member rotates.

In an embodiment of the present invention, a heater may be disposed under the vaporization member for heating the vaporization member. By forming such a structure, the powder material can be properly vaporized.

In an embodiment of the present invention, the moving mechanism may rotate the vaporization member, and the heater is disposed at a position from the material dispersing member, and is rotated approximately halfway along a rotation direction of the rotating member of the vaporizing member. The position of the circle. By forming such a structure, a temperature difference can be set between the heating region and the material input region, so that vaporization at the time of input can be reduced. Therefore, the amount of material input can be quantified.

According to an embodiment of the present invention, the solid material may be further supplied to the supply unit of the powder material supply member, and the supply portion may be a casing and may be narrowed toward the lower end by the inner wall. a lower space of the conical shape, at the bottom of the lower space, a drop hole is formed to drop the powdery solid material, and has a downward direction extending from the drop hole along the inner wall while being bent inward Linear member. By forming such a structure, the solid material adhering to the wall surface or the like can be removed by the linear member.

In an embodiment of the invention, the supply portion may be a vacuum-removable structure. In the case of vacuuming, since the solid material is more likely to adhere to the wall surface or the like, it is possible to further exert the effect of the action of the linear member.

In an embodiment of the present invention, the supply unit may include a quantitative portion having a conical cover body that protrudes upward, a conical shape that is conical with the top of the cover, and the concave portion a rotating mechanism for rotating the lid body relative to the concave body; a material input mechanism for inserting material into the quantitative portion; and a lifting mechanism for freely changing a gap between the lid body and the concave surface; and downstream of the material input mechanism And the upstream side of the quantitative portion, the upper space is partitioned by the inner wall, and the lowermost hole of the upper space is formed with a falling hole for dropping the solid material, and has a line A member that extends upward from the drop hole along the inner wall while being bent toward the inner side. By forming such a structure, the particulate solid material supplied to the quantitative portion can be stirred or the powdery solid material produced by the quantitative portion can be stirred.

In one embodiment of the present invention, the material introduction mechanism may be configured by a material introduction portion and a material input portion, and the material introduction portion may introduce a material and evacuate the vacuum, and the material input portion may introduce the introduced material into the material. The material supply device can be evacuated; the material introduction portion and the material input portion are connected to each other through a gate valve. By forming such a structure, the material can be properly placed even under vacuum.

Further, a film forming apparatus according to another aspect of the present invention includes the material supply device described above, and vaporizes and forms a solid material, the structure comprising: a material supply device that vaporizes the solid material; and a film forming portion that is introduced into the film The material supplied from the material supply device is formed into a film; the material supply device includes: a vaporization member having a supply surface to receive the supply of the solid material to vaporize the solid material; and a powder material supply member to which the solid is powdery a material is supplied to the supply surface of the vaporization member; a material dispersion member is attached to the powder material supply member, and a gap is formed between the supply surface and the supply surface of the vaporization member, and the powdery solid material is dispersed to the vaporization member. And a moving mechanism that moves the vaporization member relative to the material dispersion member.

The film forming apparatus of another aspect of the present invention has the same effects as the material supply apparatus described above.

According to each aspect and embodiment of the present invention, the sublimation and melting speed of the solid organic material can be adjusted with higher precision.

Hereinafter, embodiments will be described with reference to the drawings. In the present specification and the drawings, the components that have substantially the same functional configuration are denoted by the same reference numerals, and the description thereof will not be repeated.

FIG. 1 is an explanatory view of a manufacturing process of the organic electroluminescence device A, which is an element (organic electroluminescence device, solar cell, etc.) manufactured by the film formation apparatus 1 of the present embodiment or the like. An example. As shown in Fig. 1(a), a substrate G on which the anode layer 10 has been formed on the top surface is prepared. The substrate G is made of, for example, a transparent material made of glass or the like. Further, the anode layer 10 is made of a transparent conductive material such as ITO (Indium Tin Oxide). Further, the anode layer 10 is formed on the top surface of the substrate G by sputtering or the like, for example.

First, as shown in FIG. 1(a), the organic layer 11 including the light-emitting layer is formed on the anode layer 10 by a vapor deposition method or the like. Further, the organic layer 11 is formed by, for example, a hole injection layer, a hole transport layer, a non-light-emitting layer (electron blocking layer), a blue light-emitting layer, a red light-emitting layer, a green light-emitting layer, and an electron transport layer. And the multilayer structure of the electron injection layer is formed.

Next, as shown in FIG. 1(b), a cathode layer 12 made of, for example, Ag, Al, or the like is formed on the organic layer 11 by, for example, sputtering using a photomask.

Next, as shown in FIG. 1(c), the cathode layer 12 is used as a mask, and the organic layer 11 is patterned by, for example, dry etching on the organic layer 11.

Next, as shown in FIG. 1(d), an insulating sealing film made of yttrium nitride (SiN) is formed so as to cover the periphery of the organic layer 11 and the cathode layer 12 and the exposed portion of the anode layer 10. Layer 13. The formation of the sealing film layer 13 is carried out, for example, by a microwave plasma chemical vapor deposition method (CVD method).

The organic electroluminescent element A thus produced by the anode layer 10 and the cathode A voltage is applied between the layers 12 to emit light. The organic electroluminescent element A can be used for a display device or a planar light-emitting element (illumination, light source, etc.), and can also be used in various electronic devices.

Next, the configuration of the film forming apparatus 1 of the present embodiment will be described. The film forming apparatus described above has a vapor deposition head that ejects an organic material gas to the substrate G, as will be easily understood. FIG. 2 is a schematic view showing the structure of the film forming apparatus 1.

As shown in FIG. 2, the film forming apparatus 1 includes a vapor deposition device (film formation portion) 15 that forms a film on the substrate G, and a material supply device 30 that supplies a material gas for film formation to the vapor deposition device 15. The vapor deposition device 15 includes a first cavity 20, a second cavity 21, and a vapor deposition head 22 for performing a film formation process. The second cavity 21 is provided below the first cavity 20. The second cavity 21 and the first cavity 20 define a space in the internal area. The vapor deposition head 22 is disposed between the first cavity 20 and the second cavity 21 and disposed inside the cavity. Inside the second cavity 21, a support base 23 is provided which supports the substrate G in a state in which the film formation surface of the substrate G faces upward (face-up state). Here, the vapor deposition head 22 is disposed such that the material gas ejection surface of the vapor deposition head 22 faces the top surface (film formation surface) of the substrate G. Further, the first cavity 20 communicates with the vacuum pump 26a through the exhaust pipe 25a, and the second cavity 21 communicates with the vacuum pump 26b through the exhaust pipe 25b, and is evacuated at the time of film formation.

Further, the material supply device 30 includes a control unit 30a, a supply unit 30b, and a material gas generation unit 30c. The control unit 30a has a structure for controlling each member of the supply unit 30b. The supply unit 30b has a structure in which an organic material (solid material) is supplied to the material gas generating unit 30c. The material gas generating portion 30c has a structure in which an organic material is vaporized and introduced into the vapor deposition device 15. The material gas generating portion 30c communicates with the material introduction path 31, and the material introduction path 31 introduces the material gas into the vapor deposition head 22. That is, the solid material is supplied from the supply unit 30b to the material gas generating unit 30c, and the material gas is generated in the material gas generating unit 30c, and is generated in the material gas generating unit 30c. The material gas is introduced into the vapor deposition head 22, and the material gas is ejected from the vapor deposition head 22 to the substrate G. Further, the material introduction path 31 is provided with a valve 33 for switching between the presence or absence of the introduction of the material gas into the vapor deposition head 22. A material retracting path 34 is provided between the material gas generating portion 30c and the valve 33 in the material introduction path 31, and communicates with the vacuum pump 26a, and has a valve 35 that is openable and closable. Further, the vapor deposition head 22 is provided with a tube flow path 36 that communicates with the vacuum pump 26a and has a valve 37 that is openable and closable.

Further, a light-transmissive window 39 is provided on both sides of the vapor deposition head 22 and on both sides of the second cavity 21. A vapor amount measuring device 38 is disposed outside the second cavity 21, and the light is transmitted through the windows 39, and the material in the vapor deposition head 22 is investigated by, for example, Fourier transform infrared spectroscopy (FTIR). The amount of gas vapor.

Fig. 3 is an enlarged view of the material supply device 30 of Fig. 2, and the structure of the material supply device 30 of the present embodiment will be described below with reference to Fig. 3 .

The supply portion 30b is a housing having a space inside, and is configured such that the solid organic material can be processed from the inside of the device external introduction device and supplied to the material gas generating portion 30c; it is provided with: a material load of a load lock The mechanism 40 is configured to perform the injection of the particulate organic material; the first agitating portion 42 agitates the granular organic material introduced by the material input mechanism 40; and the quantitative portion 70 pulverizes each of the quantitative particulate organic materials. The second agitating portion 71 agitates the powdery organic material treated by the quantitative portion 70, and drops the passage 72 to supply the powder material to the material gas generating portion 30c by the second agitating portion 71.

The material input mechanism 40 is provided with a mechanism that can introduce an organic material into the interior of the apparatus from the outside of the apparatus. The material input mechanism 40 is in communication with the first agitating portion 42. The material input mechanism 40 includes, for example, a material introduction portion that introduces a material, and a material input portion that feeds the introduced material to the first agitating portion 42. The material introduction portion and the material input portion are configured to be evacuated and connected through a gate valve. Therefore, even if the material introduction portion is open to the atmosphere, the vacuum of the material input portion can be maintained by closing the gate valve. degree. Therefore, it is possible to introduce materials from the outside of the device without stopping the device.

The first agitating portion 42 that communicates with the material input mechanism 40 is a space (upper space) defined by the inner wall region of the supply portion 30b, and is formed in a conical shape that gradually narrows toward the lower end. This space is zoned on the downstream side of the material input mechanism 40 and is on the upstream side of the quantitative section 70. At the lowermost portion of the first agitating portion 42, a dropping hole 43 for dropping the organic material is provided. Moreover, the agitator 41 is a linear member, and extends upward from the falling hole 43 along the inner wall of the first agitating portion 42, and is bent inward. The agitator 41 is bent twice inwardly in a roughly triangular shape. Here, the agitator 41 is coupled to a rotating cylinder 44 located outside the biaxial shaft provided inside the material supply device 30, and a pulley 45a is provided above the rotating cylinder 44. Further, the rotation mechanism 50 provided above the control unit 30a is provided with a pulley 45b under the rotation shaft 46, and a belt body 47 is stretched between the pulley 45a and the pulley 45b. Thereby, the rotational power of the rotating mechanism 50 is transmitted to the rotating cylinder 44, and the agitator 41 is rotated inside the first agitating portion 42. Further, a plurality of agitators 41 are provided on the outer circumference of the rotary cylinder 44. In this manner, the organic material introduced into the first agitating portion 42 is stirred by the rotation of the agitator 41.

Further, the heater 52 is attached to both sides of the first agitating portion 42, and the temperature of the first agitating portion 42 can be controlled. Further, the first agitating portion 42 is sealed to the upper portion (control portion 30a) of the material supply device 30 by the magnetic fluid seal 49. The magnetic fluid seal 49 is rotatably sealed in a state in which the two rotating shafts of the rotating cylinder 44 and the shaft 61 disposed on the inside thereof (described later in detail) are rotatably provided. The inside of the first agitating portion 42 is evacuated by the vacuum pump 55, and a carrier gas such as argon gas is introduced by the gas introducer 57.

Below the first agitating portion 42, a conical cover 60 that protrudes below the falling hole 43 and protrudes upward is provided. The cover 60 is supported by a rotating cylinder 44 provided above the cover 60. That is, the cover 60 is rotatable by the support of the rotary cylinder 44. Further, an elevating mechanism 65 is provided above the control unit 30a. The elevating mechanism 65 raises the control unit 30a including the rotating mechanism 62, the shaft 61, the rotating cylinder 44, and the cover 60. drop. Here, since the elevation of the elevating mechanism 65 causes the control unit 30a to move up and down, the elevating distance that the elevating mechanism 65 drives is measured by a measuring device 66 such as a micrometer attached to the control unit 30a. .

A conical concave body 63 is provided in the vicinity of the upper portion of the cover 60, and is disposed to face the top surface of the cover 60. The width of the gap portion 64 generated between the lid body 60 and the concave body 63 changes by the elevation of the lid body 60. That is, the change in the width of the gap portion 64 is measured by the measuring device 66. Further, the quantitative portion 70 includes a lid body 60 and a concave surface 63, and the lid body 60 is rotated and raised by the rotation mechanism and the elevating mechanism, and the width of the gap portion 64 is changed. The rotating mechanism rotates the lid 60 and the concave body 63 relative to each other.

Below the quantitative portion 70, a second agitating portion 71 having an inverted tapered shape is formed. The second agitating portion 71 is a conical space (lower space) that gradually narrows toward the lower end, and a drop passage 72 that allows the organic material to fall is provided at the lowermost portion of the second agitating portion 71. The second stirring unit 71 is provided with a stirrer 48. The agitator 48, which is a linear member, extends upward from the upper end of the drop passage 72 along the inner wall of the second agitating portion 71, and is bent toward the inner side. The agitator 48 is bent twice inwardly in a roughly triangular shape. Here, the agitator 48 is coupled to the shaft 61 located inside the biaxial shaft provided inside the material supply device 30. The shaft 61 is configured by the upper and lower shafts 61a and 61b through the coupling member 61'. Above the shaft 61a, a rotation mechanism 62 such as a rotation motor is attached to rotate the shaft 61. That is, the agitator 48 is rotatable by being coupled to the shaft 61. Further, a plurality of agitators 48 are provided on the outer circumference of the shaft 61b. Therefore, the organic material introduced into the second agitating portion 71 is stirred by the rotation of the agitator 48. Further, the second agitating portion 71 is connected to the gas introducer 57, and a carrier gas such as argon gas is introduced, and the pressure is measured by a pressure gauge 73. Further, heaters 52 are attached to both sides of the drop passage 72 for temperature control. Here, the temperature difference may be given to the drop passage 72 so that the temperature on the side of the quantitative portion 70 is low, and the temperature on the side of the material gas generating portion 30c is high.

As described above, argon gas is introduced into the first agitating portion 42 from the gas introduction device 57 as a carrier gas, and the carrier gas is introduced in the same manner for the quantitative portion 70 and the second agitating portion 71. The pressure difference between the carrier gas of the first agitating portion 42 and the second agitating portion 71 is a factor, and the powdery organic material is dropped from the quantitative portion 70.

When a sufficient organic material is supplied from the material input mechanism 40, the width of the gap portion 64, the rotational speed of the lid 60, and the pressure difference between the agitating portion 42 and the second agitating portion 71 are determined by the first agitating portion 42. The amount of drop of the organic material dropped to the second stirring portion 71. The above three factors can be controlled by the elevating mechanism 65, the rotating mechanism 50, and the gas introducer 57. Therefore, the amount of the powdery organic material dropped from the quantitative portion 70 can be quantified to a desired amount. Further, by making the pressure of the carrier gas introduced into the agitating portion 42 and the second agitating portion 71 equal to each other, and eliminating the pressure difference between the agitating portion 42 and the second agitating portion 71, the elevating mechanism 65 can be used only by the control portion 30a. The control of the rotating mechanism 50 allows the organic material to be dropped, and the introduction of the organic material to the material gas generating portion 32c can be performed more easily.

The drop passage 72 is connected to the material gas generating portion 30c. The material gas generating unit 30c performs vaporization of the organic material. Here, a sublimation type material such as Alq ₃ or a molten material such as α-NPD is used as the organic material. Sublimation materials differ from evaporation mechanisms in molten materials. In order to efficiently evaporate in the material gas generating portion 30c, a different structure is employed in the case of using the sublimation type material and the case of using the molten material.

Here, referring to Fig. 4, a carburetor 80 employed when a molten material is used as the organic material will be described.

4 is a schematic cross-sectional view of a material gas generating portion 30c including a vaporizer 80 that melts a molten organic material to generate a material gas. As shown in FIG. 4, a box-shaped vaporizer 80 having a hollow structure is disposed inside the material gas generating portion 30c. The vaporizer 80 is formed to be internally airtight. Vaporizer 80 series The member 154, the side member 153, and the lower member 155 are closed. Further, the lower member 155 is provided with a leg portion 152. The bottom wall 151b of the vaporizer 80 is supported by the foot 152.

On the member 154 above the carburetor 80, a powder material supply member 94 that communicates with the inside of the carburetor 80 is inserted. The upper end portion of the powder material supply member 94 is connected to the drop passage 72 that communicates with the material supply device 30. Therefore, the powdery organic material is supplied to the inside of the vaporizer 80 via the drop passage 72 and the powder material supply member 94. Further, the carrier gas for transporting the vaporized gas is also supplied simultaneously with the organic material via the drop passage 72 and the powder material supply member 94. On the other hand, the lower member 155 of the vaporizer 80 is provided with a material introduction path 31 that communicates with the vapor deposition head 22 in the first chamber 20. The vaporized gas is introduced into the vapor deposition head 22 via the material introduction path 31.

Inside the vaporizer 80, a material evaporation plate (vaporization member) 82 that vaporizes the organic material is disposed. The material evaporation plate 82 is a plate-like member (a disk member) having a substantially disk shape and is formed of a porous material. As the porous material, a porous ceramic (for example, SiC) is used. The material evaporation plate 82 has a top surface (first main surface, supply surface) 82a and a bottom surface (second main surface) 82b, and has a vaporization surface for vaporizing an organic material on one of the main surface sides. In the material evaporation plate 82 of Fig. 4, since the organic material is a molten material, the bottom surface 82b is used as a vaporization surface, and the surface area is increased to form a groove. 5 and 6, an example of a material evaporation plate 82 is shown. In the figure, (a) is a top view of the material evaporation plate 82, (b) is a bottom view, and (c) is a cross-sectional view of the material evaporation plate 82. As shown in Fig. 5 (a) and Fig. 6 (a), a rib 82c is provided on the outer edge of the top surface 82a. Further, as shown in FIG. 5(b), the groove 82d which is the bottom surface 82b of the vaporization surface may be formed in a lattice shape, and as shown in FIG. 6(b), the groove 82d may be formed in a concentric shape. In any case, as shown in FIGS. 5(c) and 6(c), the shape of the groove 82d may be any as long as the surface area of the bottom surface 82b of the vaporization surface is large. Further, the material evaporation plate 82 is made to have a diameter of about 200 nm.

As shown in FIG. 4, the structure of the material evaporation plate 82 can be controlled by a rotating mechanism. The rotary axis rotates. The rotating mechanism has a vacuum motor 98 as a power source, and a rod 95 whose one end is connected to the vacuum motor 98 and has a central axis as a rotating shaft. The other end of the rod body 95 is connected to the center position of the bottom surface 82b of the material evaporation plate 82. Thereby, the material evaporation plate 82 can be freely rotated in the in-plane direction by the rotation mechanism (moving mechanism). Further, the vacuum motor 98 is configured to control the rotational speed of the material evaporation plate 82.

An end portion of the powder material supply member 94 is disposed on the top surface 82a side of the material evaporation plate 82. The axis of the powder material supply member 94 is displaced from the rotational axis of the material evaporation plate 82. At the end of the powder material supply member 94, a material dispersion member 96 is bonded which disperses the powdery organic material onto the top surface 82a of the material evaporation plate 82. 7 and 8 are schematic views showing the shape of the material dispersion member 96 and the positional relationship with the material evaporation plate 82, Fig. 7 is a schematic view of the top surface, and Fig. 8 is a schematic view of the cross section. As shown in FIGS. 7 and 8, the material dispersion member 96 exhibits a slightly dome shape having a hollow structure and has an end portion inclined with respect to the top surface 82a of the material evaporation plate 82. The material dispersion member 96 is disposed to be apart from the vicinity of the top surface 82a of the material evaporation plate 82 in the vertical direction to form a gap K with the top surface 82a of the material evaporation plate 82. In the material dispersion member 96, a surface which is connected to one end of the powder material supply member 94 and which is connected to the end portion where the gap K is formed is formed to be curved along the rotation direction of the material evaporation plate 82. The material dispersion member 96 disperses the powdery organic material D onto the top surface 82a of the material evaporation plate 82 while adjusting the thickness with the gap K. The powdery organic material D flows through the powder material supply member 94 and is supplied onto the top surface 82a of the material evaporation plate 82. Since the powder material supply member 94 and the material dispersion member 96 are fixed at the designated position, the powdery organic material D is thinly spread by the height of the gap K by the rotation of the material evaporation plate 82, and is dispersed in the material evaporation plate. On top surface 82a of 82. In this manner, the gap K is a member that defines the thickness of the powder material when it is stretched. Further, after the fallen organic material D is adjusted in thickness, the excess portion of the organic material D is accommodated inside the material dispersion member 96. In this manner, the material dispersion member 96 adjusts the thickness through the gap K while arranging the organic material D to be dropped while accommodating a certain amount of the organic material D.

Moreover, as shown in FIG. 4, the side member 153 of the vaporizer 80 is comprised by the member which expands and expands in the up-down direction. As such a member, for example, stainless steel having a bellows shape can be employed. Thereby, the vaporizer 80 is configured such that the upper member 154 is movable up and down with respect to the lower member 155. Further, the upper portion 151a of the material gas generating portion 30c is provided with an adjuster 99 for adjusting the height and inclination of the member 154 on the vaporizer 80. The adjustment tool 99 is connected to the upper member 154 through the shaft 99a, and is configured to adjust the amount of pushing of the shaft 99a. Further, the upper member 154 is further provided with two identical adjustment members 99 and a shaft 99a, and is fixed by three-point contact (not shown). Then, by adjusting the pushing amount of the other two points with reference to one fulcrum, the height or inclination of the upper member 154 is adjusted, thereby adjusting the gap K between the material dispersing member 96 and the material evaporating plate 82. That is, the side member 153, the adjuster 99, and the shaft 99a function as a lifting mechanism (a three-point kinematic mechanism) of the material dispersing member 96. Using this mechanism, the amount of material supplied to the material evaporation plate 82 is adjusted.

Further, a heater 97 is disposed below the bottom surface 82b of the material evaporation plate 82. The heater 97 heats the material evaporation plate 82 so that the temperature of the organic material (melted type material) is higher than the melting point. For example, the heater 97 heats the material evaporation plate 82 to 300 ° C to 450 ° C. The heater 97 is disposed on the bottom surface 82b side of the material evaporation plate 82, and is disposed approximately a half turn from the arrangement position of the material dispersion member 96 around the rotation direction of the material evaporation plate 82. The approximate half circle is, for example, in the range of 135 to 225, and the center of gravity of the heater 97 is placed within this range. Further, here, the heater 97 is disposed on the lower side of the member 155 below the vaporizer 80, which constitutes a structure in which the vaporization surface of the material evaporation plate 82 is heated by the radiant heat of the heater 97.

Further, the drop passage 72 and the material introduction path 31 are provided with heaters 52 on both sides as described above, and the heater 52 is also provided on the top surface portion and both side portions of the vaporizer 80 to control the temperature.

With the above structure, the powdery organic material is mixed with the carrier gas from the powder material. The material supply member 94 is supplied to the material evaporation plate 82, and the material evaporation plate 82 is rotated by the vacuum motor 98, and the powdery organic material is thinly stretched on the material evaporation plate 82 while being adjusted in thickness by the material dispersion member 96. . Then, by the radiant heating of the heater 97, it evaporates on the bottom surface 98b which is the vaporization surface. The carrier gas flowing into the vaporizer 80 from the powder material supply member 94 pushes out the generated material gas, and the material gas flows out from the material introduction path 31. Moreover, the material supply amount supplied to the material evaporation plate 82 is adjusted by the elevating mechanism, the rotation speed of the material evaporation plate 82 is adjusted by the vacuum motor 98, and the heating amount is adjusted by the heater 97. Since the above adjustment can be performed, the evaporation amount of the material can be controlled, and the vaporization efficiency of the organic material can be improved.

Further, since the organic material is deposited on the material evaporation plate 82 in the state of the powder, the sublimation is sublimated, and the sublimation can be efficiently sublimated in a very short time as compared with, for example, the organic material is directly sublimated by the particles. A large amount of material gas is produced.

As described above, the material gas vaporized by the organic material flows out from the material gas generating portion 30c of the vaporizer 80 to the material introduction path 31. Then, as shown in FIG. 2, since the material introduction path 31 communicates with the vapor deposition head 22 in the first chamber 20, the material gas is introduced into the vapor deposition head 22 when the valve 33 is opened. The vapor deposition head 22 is provided with a heater 52. The material gas is not deposited inside the vapor deposition head 22, and the material gas is ejected from the vapor deposition head 22 to the substrate G.

Further, when the material gas is not ejected from the vapor deposition head 22 to the substrate G, the material gas can be stopped from being introduced into the vapor deposition head 22 from the material introduction path 31 by closing the valve 33. At this time, since the material gas may remain in the material introduction path 31, the material introduction path 31 is provided with the valve 35, and the material evacuation path 34 that communicates with the vacuum pump 26a is provided. Therefore, the material gas is sucked and collected by the vacuum pump 26a. Further, the vapor deposition head 22 is provided with an outflow flow path 36 for sucking and recovering the material gas remaining in the vapor deposition head 22 when the film formation is completed, and evacuating and connecting the inside of the vapor deposition head 22 To vacuum pump 26a. The material retreating path 34 and the outflow flow path 36 are left in the material introduction path 31 and the vapor deposition head 22 The material gas in the film is completely recovered. When the substrate G on which the film is formed has a plurality of sheets, the film formation environment of each of the substrates G can be made uniform, so that a plurality of substrates G are uniformly formed.

Further, the amount of vapor inside the vapor deposition head 22 measured by the vapor amount measuring device 38 such as an FTIR detector provided on the side portion (the side portion of the second chamber 21) of the vapor deposition head 22 is used. The desired amount of vapor is compared, and the result is signal-transmitted to the gas introduction device 57 of the material supply device 30 or the heater 52 provided in each unit, and the carrier introduced from the gas introduction device 57 is controlled based on the signal. The amount of gas in the vapor deposition head 22 can be optimized by the amount of gas or the temperature of each part.

According to the film forming apparatus 1 of the present embodiment, the granular material organic material can be quantified in the material supply device 30 while being powdered, and the thickness (supply amount) can be adjusted by the material evaporation plate 82. The material gas is generated while vaporizing the organic material. Further, by adopting a structure in which a particulate organic material is introduced and then pulverized, for example, a material of a granular load is applied to the quantitative portion 70 by using a material loading mechanism 40 of a load lock, compared with a material. In the case of powder, the material can be accurately quantified at the time of input of the material, and continuous input can be smoothly performed. In addition, when a material gas is ejected to the substrate G to form a film by vapor deposition, after one sheet of the substrate G is formed, when the next substrate G is to be formed, the vapor deposition head 22 and the material are introduced first. When the inside of the road 31 is evacuated, even if the film formation is performed under almost the same conditions as the first substrate G, the film formation of the substrate G can be performed properly.

Further, according to the film forming apparatus 1 of the present embodiment, the powdery solid material is supplied from the powder material supply member 94 to the supply surface of the material evaporation plate 82, and the material evaporation plate 82 is opposed to the material dispersion member 94 by the vacuum motor 98. mobile. The powder material can be further diffused by moving the side of the top surface 82a as the supply surface. Further, by the gap K between the material dispersing member 96 attached to the powder material supply member 94 and the material evaporating plate 82, the solid material is expanded by the thickness corresponding to the gap width. Scattered. In this way, the speed of sublimation and melting of the organic material can be adjusted with good precision by the gap.

Further, according to the film forming apparatus 1 of the present embodiment, since the material dispersion member 96 has a hollow structure in which the powdery organic material is accommodated, the powder material accommodated inside the material dispersion member 96 can be evenly distributed over the material. The entire gap between the evaporation plates 82 can be properly dispersed.

Moreover, according to the film forming apparatus 1 of the present embodiment, the width of the gap K can be changed by moving the material dispersion member 96 up and down with respect to the top surface 82a, so that the thickness of the powder material can be changed. Further, according to the film forming apparatus 1 of the present embodiment, the material evaporation plate 82 is a disk member made of a porous material, and one of the main faces is formed as a vaporization surface, so that the gas generated by vaporization on the top surface 82a side is generated. The material evaporating plate 82 can be passed through, and the generated gas can be transported out from the bottom side of the material evaporating plate 82. Further, according to the film forming apparatus 1 of the present embodiment, since the melted material can pass through the porous material evaporation plate 82, the bottom surface side can be used as the vaporization surface.

Further, according to the film forming apparatus 1 of the present embodiment, since the material evaporation plate 82 is rotated by the rod body connected to the material evaporation plate 82 as a rotating shaft, the powder member can be dispersed over the entire surface of the material evaporation plate 82. Since the heater 97 is disposed at a position slightly rotated by a half turn from the arrangement position of the material dispersion member 96 in the rotation direction of the material evaporation plate 82, a temperature difference can be provided between the heating region and the material input region. Therefore, the vaporization at the time of input can be reduced. Therefore, the amount of material input can be quantified.

Further, the film forming apparatus 1 of the present embodiment includes the supply unit 30b that supplies the organic material to the powder material supply member 94. The supply unit 30b has the second stirring unit 71 that agitates the organic material, so that the second stirring unit can be used. The portion 71 removes an organic material that adheres to a wall surface or the like due to charging or the like. In particular, when the second agitating portion 71 is evacuated, the organic material is more likely to adhere to the wall surface or the like, so that the structure can be further enhanced. The effect of the stirring portion 71. Further, by changing the shape of the agitator, it is possible to vary depending on the particle diameter of each material.

Further, the above-described embodiment is merely an example of the film forming apparatus and the material supply apparatus of the present invention, and the present invention is not limited to the apparatus of the embodiment, and may be modified or applied to other articles. .

For example, in the above embodiment, as shown in Fig. 5(a), only the rib 82c is provided on the top surface 82a of the material evaporation plate 82. However, as shown in Fig. 9(a), concentric circles may be provided at the center. The convex portion 82e forms a groove 82f. As shown in Fig. 9(b), by disposing the material dispersing member 96 in contact with the rib portion 82c and the convex portion 82e, the material evaporating plate 82 can be supplied with the organic material D which is exactly the amount of the groove 82f. That is, the amount of material supplied to the material evaporation plate 82 can be controlled in accordance with the capacity of the groove 82f. In this manner, when the amount of material supply is controlled by using the groove 82f, the organic material can be sublimated and melted at an average rate even in the case where the quantitative portion 70 does not accurately quantify the organic material. That is, even if the quantitative portion 70 is not provided, the organic material can be sublimated and melted at an average rate. Further, the groove 82f may be formed by cutting the material evaporation plate 82. Furthermore, the shape of the groove 82f is not limited to that shown in FIG. 9(a), and may be, for example, the shape shown in FIGS. 5(b) and 6(b). Thus, by forming a groove on the main surface side facing the material dispersing member 96 in the material evaporating plate 82, and in the case where the material dispersing member 96 is disposed in a flat scraping groove, the amount filled in the groove can be regarded as The amount of organic material supplied is set. Therefore, the supply amount of the organic material can be fixed.

Further, in the above embodiment, the organic material described above is a molten material, but the organic material may be a sublimated material. In this case, the sublimator 90 can be used instead of the vaporizer 80. Fig. 10 is a schematic view showing a material gas generating portion 30c of the sublimator 90. As shown in FIG. 10, unlike the vaporizer 80, only the underside of the vapor of the material evaporation plate 100 is replaced with the top surface 100a. The groove provided on the top surface 100a has a function of expanding the surface area under the steam to promote evaporation, and as described above, due to the groove capacity of the material supply material dispersing member 96 The amount of material, so there is a function of controlling the amount of material supplied by the grooves.

Further, in the above embodiment, the case where the organic electroluminescence device is manufactured is described, and the case where the organic layer is deposited on the substrate using an organic material will be described. However, the present invention is not limited thereto, and may be applied to steaming. Various electronic components, optical components, and the like which are produced by film formation, surface treatment, and the like are subjected to plating treatment.

Further, in the above embodiment, an apparatus having a single vapor deposition head is described. However, in the film formation apparatus, a vapor deposition head for ejecting an organic material gas to the substrate G is usually used, for example, for a hole transport layer or a non-light-emitting layer ( In the electron blocking layer, the blue light-emitting layer, the red light-emitting layer, the green light-emitting layer, the electron transport layer, and the like, when a plurality of organic layers are to be vapor-deposited, a plurality of layers are prepared. It is a matter of course that the apparatus for providing a plurality of vapor deposition heads is a film formation apparatus in which a plurality of material supply units of the above-described embodiments are provided in accordance with the number of vapor deposition heads.

Further, in the above embodiment, the material input mechanism 40 described above is a vacuum preparation type, and the specific configuration thereof can be explained with reference to Fig. 11 as follows.

Fig. 11 is an explanatory view showing an example of the structure of the material input mechanism 40. As shown in FIG. 11, the material input mechanism 40 is composed of a material introduction unit 120 and a material introduction path 125. The material introduction unit 120 introduces a material, and the material introduction path 125 puts the material introduced by the material introduction unit 120 into the material. Inside the material supply device 30. The material introduction portion 120 is disposed above the material introduction path 125, and the material introduction portion 120 and the material introduction path 125 are connected to each other through the gate valve 130. The material introduction portion 120 is a structure that can be sealed. Since the material introduction portion 120 is provided with the exhaust port 121, the material introduction portion 120 can be evacuated by the operation of a vacuum pump (not shown) that communicates with the exhaust port 121. Further, the material supply path 125 communicates with the first agitating portion 42 not shown in the material supply device 30 of Fig. 11, and is evacuated in conjunction with the first agitating portion 42.

Further, the material introduction unit 120 is provided with a refining mechanism 140 having an enclosing The shape of the space 132 (the shape of the mortar), the space 132 is a conical shape that is gradually narrowed toward the lower end, and the agitating mechanism 145 that agitates the inside of the conical space 132 in the refining mechanism 140. The material introduction portion 120 is provided with an introduction port 133 for introducing the material into the space 132 in the refining mechanism 140, and opening and closing. Here, the agitation mechanism 145 is composed of two members: a rotating shaft 147 that rotates in a central portion of the space 132 by operation of a driving mechanism (not shown), and a stirring bar 149 that is horizontally mounted on the rotating shaft 147. There are multiple. Further, the bottom of the refining mechanism 140 (the lower portion of the space 132) and the structure of the gate valve 130 are connected by a pipe 150. After the refining mechanism 140 is refined, the material passes through the pipe 150, and when the gate valve 130 is opened, The material dropped by the refining mechanism 140 is sent to the material input path 125 through the line 150.

Further, a heater 142 is attached to the outer surface of the refining mechanism 140, and the material introduced into the refining mechanism 140 can be heated. Further, in the arrangement and arrangement of the heaters, the material loading mechanism 40 is preferably provided with heaters in various portions to maintain the temperature of the material at a predetermined temperature. Further, in the refining mechanism 140, the heater is not shown in the portion other than the refining mechanism 140, but the heater may be provided in other portions from the viewpoint of efficiently heating and soaking the material.

According to the material supply mechanism 40 of the configuration shown in Fig. 11, in the material supply device, first, in the state where the gate valve 130 is closed, the material introduction portion 120 is opened to the atmosphere, and the (organic) material is introduced from the introduction port 133 to the material introduction portion. 120 refining mechanism 140. Then, in the refining mechanism 140, the material is heated and refined while being stirred by the stirring bar 149.

Next, the material introduction portion 120 is evacuated by exhausting from the exhaust port 121. Here, the state in which the material supply device 30 is in operation is, for example, as shown in FIG. 3, and the inside of the material supply device 30, that is, the state in which the first agitating portion 42 is evacuated. Therefore, when the gate valve 130 is opened to insert the material, the degree of vacuum (internal pressure) in the material introduction portion 120 and the material introduction path 125 must be almost equal. Therefore, the exhaust of the material introduction portion 120 is required to be The vacuum in the material supply device 30 is the same The degree of vacuum.

After the gas in the material introduction portion 120 is discharged, the gate valve 130 is opened, and the material refined in the refining mechanism 140 passes through the pipe 150 and is introduced into the first agitating portion 42 of the material supply device 30 from the material supply path 125. Then, after the material is supplied to the material supply device 30, the gate valve 130 is closed, and the material introduction portion 120 is again opened to the atmosphere to refine the next batch of new materials to be input.

By introducing the material into the material supply device 30 by the material input mechanism 40 shown in FIG. 11 and performing the above-described process operation, the vacuum of the material supply device 30 during operation can be prevented in the vacuumed state ( When the internal pressure is affected, new materials are introduced into the material supply device 30, so that productivity can be improved.

Further, in the above-described embodiment, an example in which the material evaporating plate 82 is rotated by the vacuum motor 98 and the rod body 95 has been described. However, as long as it can move relative to the material dispersing plate 96, it may be moved other than rotation.

Further, in the above-described embodiment, an example in which the support table 23 of the support substrate G is supported in a state in which the substrate to be coated of the substrate G faces upward (in the state of face up) is described. However, the support substrate G may be provided. The support table is a device that forms a film in a state in which the film formation target of the substrate G faces downward (in the state of face down).

G‧‧‧Substrate

1‧‧‧ film forming device

10‧‧‧ anode layer

11‧‧‧Organic layer

12‧‧‧ cathode layer

13‧‧‧ Sealing film

15‧‧‧Vapor deposition unit (film formation)

20‧‧‧1st cavity

21‧‧‧2nd cavity

22‧‧‧Steam head

23‧‧‧Support desk

25a‧‧‧Exhaust pipe

25b‧‧‧Exhaust pipe

26a‧‧‧Vacuum pump

26b‧‧‧Vacuum pump

30‧‧‧Material supply device

30a‧‧‧Control Department

30b‧‧‧Supply Department

30c‧‧‧Material Gas Generation Department

31‧‧‧Material introduction

33‧‧‧Valves

34‧‧‧Material retreat

35‧‧‧ valve

36‧‧‧Tubing

37‧‧‧Valves

38‧‧‧Vapor measuring device

39‧‧‧Form

40‧‧‧Material input agencies

41‧‧‧Agitator

42‧‧‧1st mixing section

43‧‧‧Down hole

44‧‧‧Rotating cylinder

45a‧‧‧ Pulley

45b‧‧‧ Pulley

46‧‧‧Rotary axis

47‧‧‧带体

48‧‧‧Agitator

49‧‧‧Magnetic fluid seals

50‧‧‧Rotating mechanism

52‧‧‧heater

55‧‧‧Vacuum pump

57‧‧‧ gas introducer

60‧‧‧ cover

61‧‧‧Axis

61’‧‧‧Combined components

61a‧‧‧Axis

61b‧‧‧Axis

62‧‧‧ Lifting mechanism

63‧‧‧ concave body

64‧‧‧Gap section

65‧‧‧ Lifting mechanism

66‧‧‧Measurer

70‧‧‧Quantity Department

71‧‧‧2nd mixing section

72‧‧‧Lower access

73‧‧‧ pressure gauge

80‧‧‧Vaporizer

82‧‧‧Material evaporation board (vaporization unit)

82a‧‧‧ top surface (first main surface, supply surface)

82b‧‧‧ bottom surface (2nd main surface)

82c‧‧‧ ribs

82d‧‧‧ trench

82e‧‧‧ convex

82f‧‧‧ trench

90‧‧‧Sublimation

94‧‧‧Powder material supply member

95‧‧‧ rod body

96‧‧‧Material dispersing components

97‧‧‧heater

98‧‧‧vacuum motor

99‧‧‧Adjustment

99a‧‧‧Axis

100‧‧‧ material evaporation board

100a‧‧‧ top

120‧‧‧Material Import Department

121‧‧‧Exhaust port

125‧‧‧Material input

130‧‧‧ gate valve

132‧‧‧ Space

133‧‧‧Import

140‧‧‧Refining agency

142‧‧‧heater

145‧‧‧Stirring mechanism

147‧‧‧Rotary axis

149‧‧‧ stir bar

150‧‧‧pipe

151a‧‧‧ upper

151b‧‧‧ bottom wall

152‧‧‧ feet

153‧‧‧Side components

154‧‧‧Upper components

155‧‧‧lower components

A‧‧‧Organic electroluminescent elements

D‧‧‧Organic materials

K‧‧‧ gap

Fig. 1 (a) to (d) are explanatory views of a manufacturing process of an organic electroluminescence device.

Fig. 2 is a schematic view showing the structure of a film forming apparatus.

Figure 3 is an enlarged view of the material supply device of Figure 2.

Fig. 4 is a partial cross-sectional view showing the material gas generating portion of Fig. 3.

Fig. 5 is a schematic view showing an example of the material evaporation plate of Fig. 4, Fig. 5(a) is a plan view, Fig. 5(b) is a bottom view, and Fig. 5(c) is a cross-sectional view.

Fig. 6 is a schematic view showing another example of the material evaporation plate of Fig. 4, Fig. 6(a) is a plan view, Fig. 6(b) is a bottom view, and Fig. 6(c) is a cross-sectional view.

Fig. 7 is a schematic view showing the material evaporation plate and the material dispersion member of Fig. 4.

Fig. 8 is a schematic view showing the material evaporation plate and the material dispersion member of Fig. 4.

Fig. 9 is a schematic view showing another example of the material evaporation plate and the material dispersion member of Fig. 4, wherein Fig. 9(a) is a plan view and Fig. 9(b) is a cross-sectional view.

Figure 10 is a partial cross-sectional view showing another embodiment of the material gas generating portion of Figure 3.

Fig. 11 is a view showing a specific example of a material input mechanism.

22‧‧‧Steam head

30b‧‧‧Supply Department

30c‧‧‧Material Gas Generation Department

31‧‧‧Material introduction

80‧‧‧Vaporizer

82‧‧‧Material evaporation board (vaporization unit)

82a‧‧‧ top surface (first main surface, supply surface)

82b‧‧‧ bottom surface (2nd main surface)

94‧‧‧Powder material supply member

95‧‧‧ rod body

96‧‧‧Material dispersing components

97‧‧‧heater

98‧‧‧vacuum motor

99‧‧‧Adjustment

99a‧‧‧Axis

151a‧‧‧ upper

151b‧‧‧ bottom wall

152‧‧‧ feet

153‧‧‧Side components

154‧‧‧Upper components

155‧‧‧lower components

Claims (17)

A material supply device for vaporizing and supplying a solid material, comprising: a vaporization member having a supply surface for receiving a supply of the solid material to vaporize the solid material; and a powder material supply member supplying the powdered solid material to a supply surface of the vaporization member; a material dispersion member attached to the powder material supply member, disposed to form a gap with the supply surface of the vaporization member, and dispersing the powdery solid material to the supply surface of the vaporization member And a moving mechanism that moves the vaporization member relative to the material dispersion member. The material supply device of claim 1, wherein the material dispersion member has a hollow structure. A material supply device according to claim 1 or 2, further comprising: an elevating mechanism for elevating and lowering the material dispersing member with respect to the supply surface. The material supply device according to any one of claims 1 to 3, wherein the vaporization member is disposed such that the supply surface becomes a top surface. The material supply device according to any one of claims 1 to 4, wherein the vaporization member is a disk member made of a porous material, and one of the main faces is formed as a vaporization surface. The material supply device according to any one of claims 1 to 5, wherein the vaporization member forms a groove on the supply surface. The material supply device of any one of claims 1 to 6, wherein the moving mechanism rotates the vaporization member. The material supply device of claim 7, wherein the moving mechanism rotates the vaporization member by a shaft that connects the vaporization member as a rotating shaft. The material supply device of claim 7 or 8, wherein the powder material supply member has an axis displaced from a rotational axis of the vaporization member. A material supply device according to any one of claims 7 to 9, wherein In the material dispersion member, a surface that is connected to one end of the powder material supply member and joined to an end portion where the gap is formed is a surface that is curved along a rotation direction of the vaporization member. The material supply device according to any one of claims 1 to 10, further comprising: a heater disposed below the vaporization member for heating the vaporization member. The material supply device of claim 11, wherein the moving mechanism rotates the vaporization member; the heater is disposed at a position from the disposition member of the material, along a rotation direction of the rotation axis of the vaporization member Approximately half a turn. The material supply device according to any one of claims 1 to 12, further comprising: a supply unit that supplies the solid material to the powder material supply member; the supply portion is a casing, and the casing is borrowed a conical-shaped lower space which is gradually narrowed toward the lower end by the inner wall, and a falling hole for dropping the powdery solid material is formed at the lowermost portion of the lower space, and has a falling hole from the falling hole A wire-shaped member that extends upward and is bent inside. The material supply device of claim 13, wherein the supply portion is an evacuatable structure. The material supply device of claim 13 or 14, wherein the supply portion comprises: a quantitative portion having a conical cover body protruding upward, and a conical shape facing the top of the cover body a concave body and a rotating mechanism for rotating the lid body and the concave body; a material input mechanism for inserting a material into the quantitative portion; and a lifting mechanism for freely changing a gap between the lid body and the concave surface; a downstream side of the material input mechanism and an upstream side of the quantitative portion, an upper space is partitioned by the inner wall, and a lower hole for dropping the solid material is formed at the lowermost portion of the upper space, and has a line shape a member from the falling hole along the inner wall Extends upwards while bending toward the inside. The material supply device according to claim 15, wherein the material input mechanism is composed of a material introduction portion and a material input portion, and the material introduction portion introduces a material and can be evacuated, and the material input portion is The introduced material is supplied to the material supply device and can be evacuated; the material introduction portion and the material input portion are connected to each other through a gate valve. A film forming apparatus that vaporizes and forms a solid material, comprising: a material supply device that vaporizes the solid material; and a film forming portion that introduces a material supplied from the material supply device and forms a film; the material supply device includes: a vaporization member having a supply surface for receiving a supply of the solid material to vaporize the solid material; a powder material supply member supplying the powdered solid material to a supply surface of the vaporization member; and a material dispersion member mounted to the a powder material supply member configured to generate a gap with a supply surface of the vaporization member to disperse the powdery solid material onto a supply surface of the vaporization member; and a moving mechanism to move the vaporization relative to the material dispersion member member.