TW201310711A - LED package structure and manufacturing method thereof - Google Patents

Abstract

An LED package structure manufacturing method includes the following steps. An isolated sleeve is formed around a terminal of a lead frame by an injection step. A water-block groove on a metal base is filled with a b-stage epoxy. After positioning the lead frame, the metal base and a reflection ring, an isolated material is injected to secure them to form an LED package structure. The LED package structure is roasted to fully cure the b-stage epoxy.

Description

Light-emitting diode package structure and manufacturing method thereof

The present invention relates to a light emitting diode package structure and a method of fabricating the same.

At present, the mainstream products of the LED package structure are mostly formed by injection molding on a metal lead frame or a metal substrate. Because the adhesion between the metal lead frame and the plastic cannot be expected, many innovations and improvements have been made to solve the problem of adhesion between the lead frame and the plastic or metal substrate.

In addition, because the reliability of the bond between the plastic and the lead frame or the metal substrate can not meet the higher specification test, after the LED package structure is used for a long time, the moisture may be from the plastic to the lead frame or the metal substrate. Infiltration, resulting in a shortened service life of the light-emitting diode.

In order to prevent the infiltration of water, a waterproof groove is designed on the metal substrate to enhance the effect of blocking moisture. However, when plastics are used differently, the design of the gutter may not be reliable enough to meet the higher specification tests.

In view of the demand for high-reliance light-emitting diode package structures, manufacturers providing LED packages must provide technical solutions to the above problems to meet market demands.

Accordingly, it is an object of the present invention to provide an improved light emitting diode package structure and method of fabricating the same.

According to the above object of the present invention, a light emitting diode package structure comprising a metal substrate, two terminals, a reflection ring, two insulating sleeves and an insulator is provided. The metal substrate has a solid crystal region, two accommodating grooves and at least one waterproof groove. The two accommodating grooves are located at two sides of the solid crystal region, and the waterproof groove is disposed around the solid crystal region. The two terminals are respectively located in the two receiving slots. The reflective ring is located above the metal substrate, and the reflective ring has a central hole to expose the solid crystal region. Two insulating sleeves are respectively formed on the two terminals to insulate the metal substrate. The insulator is formed to fix the metal substrate, the two terminals, the reflection ring and the two insulation sleeves, wherein the waterproof groove is filled with B-stage glue.

According to an embodiment of the invention, the melting point of the insulator is higher than the melting point of the two insulating sleeves.

In accordance with another embodiment of the present invention, each of the insulating sleeve portions encloses each of the terminals to expose both ends thereof.

According to another embodiment of the invention, the central aperture of the reflective ring exposes the end of each of the terminals that are not covered by the insulating sleeve.

According to the above object of the present invention, a method of manufacturing a light emitting diode package structure is provided, which comprises the following steps. An insulating sleeve is formed on the terminal of a lead frame by injection molding. A B-stage glue is filled in the waterproof groove of the metal substrate. After the lead frame, the metal substrate and the reflection ring are positioned, an insulator is injection molded to fix each other to form a light emitting diode package structure. The LED package structure is baked to completely cure the B-stage glue.

According to an embodiment of the invention, the melting point of the insulator is higher than the melting point of the two insulating sleeves.

According to another embodiment of the invention, the insulating sleeve partially covers each of the terminals to expose both ends thereof.

According to another embodiment of the present invention, the positioning holes of the lead frame are aligned with the positioning holes of the metal substrate, so that the terminals of the lead frame can be located in the receiving grooves of the metal substrate.

According to another embodiment of the invention, the B-stage glue surrounds the die bond region to form a closed loop.

According to another embodiment of the invention, the reflective ring and the metal substrate are aligned such that the central aperture of the reflective ring exposes the die attach region of the metal substrate.

It can be seen from the above that the LED package structure and the manufacturing method thereof are applied, and the B-stage glue is filled in the waterproof groove of the metal substrate and baked in the LED package structure to be baked again to make the B-stage. The glue is completely cured, thereby enhancing the effect of the waterproof groove to block moisture. In addition, the choice of the insulator and the insulating sleeve material will make the melting point of the insulator higher than the melting point of the insulating sleeve, help to improve the adhesion between the insulator and the insulating sleeve, and also improve the effect of blocking moisture.

Please refer to the first, second, and third figures. FIG. 1 is a top view of a light emitting diode package structure according to an embodiment of the present invention, and FIG. 2 is a view along line 2-2 of FIG. A cross-sectional view of the section line, and a third section is a cross-sectional view taken along line 3-3' of Fig. 1.

The LED package structure 100 is basically composed of a metal substrate 101, two terminals (103a, 103b), a reflection ring 108 and an insulator 107. The insulator 107 is formed by injection molding to fix components such as the metal substrate 101, the two terminals (103a, 103b), and a reflection ring 108. The top mask of the metal substrate 101 has a die bonding region 101c to which a light emitting diode (not shown) is fixed. The metal substrate 101 is for transmitting heat generated by the light emitting diode to the bottom surface 101d of the metal substrate 101 to dissipate heat.

The metal substrate 101 has at least one waterproof groove (101a, 101b, 101e or 101f) on its top surface, thereby preventing moisture from blocking the outside from penetrating through the gap between the insulator 107 and the metal substrate 101. In the waterproof groove (101a, 101b, 101e or 101f), a B-stage glue 105 is filled. The so-called "B-stage glue" is a kind of glue material that needs to be completely cured by double baking, or "secondary baking glue". Since the B-stage adhesive 105 is formed on the metal substrate 101 after the insulator 107 is formed on the metal substrate 101, it needs to be baked for a longer time (bake time varies depending on the type of the glue), so that the B-stage adhesive 105 is completely cured, thereby making the waterproof The effect of the ditch (101a, 101b, 101e or 101f) against moisture is further enhanced. B-stage glue can be filled only into the inner groove of the inner ring (for example, 101a, 101e), the outer ring of the waterproof groove (for example, 101b, 101f) or the waterproof groove of the inner and outer rings.

The ends of the two terminals (103a, 103b) are wire bonding regions (103c, 103d). When the reflective ring 108 is positioned on the metal substrate 101, the center hole 108b of the reflective ring 108 exposes the wire-bonding regions (103c, 103d), whereby the light-emitting diodes are connected thereto by wires (for example, gold wires).

Please refer to FIG. 4, which is a schematic diagram showing a manufacturing process of a light emitting diode package structure according to an embodiment of the invention.

In step 202 (please refer to FIGS. 8 and 9 simultaneously), insulating sleeves (112a, 112b) are formed on the two terminals (103a, 103b) of the lead frame 103 by injection molding. The insulating sleeves (112a, 112b) only partially cover the corresponding terminals (103a, 103b), thereby exposing both ends of each of the terminals (103a, 103b). The bare wire-bonding regions (103c, 103d) of each of the terminals (103a, 103b) are used to connect the light-emitting diodes to the wires (for example, gold wires). Each of the terminals (103a, 103b) has a cutting line (110a, 110b). When the terminals (103a, 103b) are fixed to the metal substrate 101, they are cut along the cutting lines (110a, 110b), and only the terminals (103a, 103b) are fixed in the LED package structure 100 (refer to Fig. 1). . In the present embodiment, the insulating sleeve (112a, 112b) selects a material having a lower melting point (compared to the insulator 107), thereby increasing the adhesion between the insulating sleeve and the insulator, and also improving the effect of blocking moisture.

In step 204 (please refer to FIG. 5 at the same time), the waterproof groove (101a, 101b, 101e or 101f) on the top surface of the metal substrate 101 is filled with B-stage glue. Basically, the B-stage glue preferably forms a closed loop around the die-bonding region 101c, thereby effectively preventing water vapor from invading the die-bonding region 101c. In the present embodiment, the linear waterproof grooves (101a, 101b) are located in the accommodating areas (104a, 104b), and the curved waterproof grooves (101e, 101f) are located on both sides of the accommodating area, and the waterproof grooves ( Both ends of 101e, 101f) are respectively connected to the accommodating areas (104a, 104b). B-stage glue can be filled only into the waterproof groove of the inner ring, the waterproof groove of the outer ring or the waterproof groove of the inner and outer rings at the same time.

Please also refer to Figures 6 and 7. Figure 6 is a cross-sectional view taken along line 6-6' of Figure 5, and Figure 7 is a cross-sectional view taken along line 7-7' of Figure 5 . Figures 6 and 7 clearly show the relationship between the waterproof groove (101a, 101b, 101e or 101f) and the solid crystal region 101c in cross section.

In step 206, the lead frame 103 (see FIG. 9), the metal base 101 (see FIG. 5), and the reflection ring 108 (see FIG. 10) are positioned, and then an insulator 107 is formed to fix each other to form a light. Diode package structure 100 (see Figures 1, 2, and 3). In the present embodiment, the insulator 107 selects a material having a higher melting point (compared to the insulating sleeve (112a, 112b)), thereby increasing the adhesion between the insulating sleeve and the insulator, and also improving the effect of blocking moisture.

Regarding the positioning manner of the lead frame 103 and the metal substrate 101 (refer to FIGS. 5 and 9), the positioning holes (106a, 106b) of the lead frame 103 are respectively aligned by the positioning holes (104c, 104d) of the metal substrate 101, so that The two terminals (103a, 103b) of the lead frame 103 are respectively located in the two accommodating grooves (104a, 104b) of the metal substrate 101.

In addition, the reflective ring 108 should be aligned above the metal substrate 101 such that the central hole 108b of the reflective ring 108 is exposed to the bonding region 101c of the metal substrate 101 and the bonding regions (103c, 103d) of the two terminals (103a, 103b).

In step 208, the LED package structure 100 is baked, so that the B-stage glue is completely cured, thereby enhancing the effect of the waterproof groove to block moisture.

Please refer to FIG. 10 and FIG. 11 simultaneously. FIG. 10 is a top view of a reflection ring according to an embodiment of the present invention, and FIG. 11 is a cross-sectional view of the reflection ring of FIG. The function of the reflective ring 108 in the light emitting diode package structure is that the light emitted by the reflective light emitting diode is oriented in a particular direction. The reflective ring 108 has a reflective surface 108a for performing the function of reflecting light. The center hole 108b of the reflection ring 108 is used to expose the bonding region 101c of the metal substrate 101 and the wiring regions (103c, 103d) of the two terminals (103a, 103b). When the reflection ring 108 is positioned above the metal base 101 and the molded insulator 107 is injected to fix each other, the fixing hook 108c of the reflection ring 108 contributes to reinforcing the firmness of the insulator 107 fixing the reflection ring 108 (please refer to FIG. 2 at the same time).

According to the embodiment of the present invention, the LED package structure and the manufacturing method thereof are applied, and the B-stage glue is filled in the waterproof groove of the metal substrate and baked again after the injection molding of the LED package structure. The B-stage glue is completely cured, thereby enhancing the effect of the waterproof groove to block moisture. In addition, the choice of the insulator and the insulating sleeve material will make the melting point of the insulator higher than the melting point of the insulating sleeve, help to improve the adhesion between the insulator and the insulating sleeve, and also improve the effect of blocking moisture.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

100. . . Light emitting diode package structure

101. . . Metal substrate

101a. . . Waterproof groove

101b. . . Waterproof groove

101c. . . Solid crystal zone

101d. . . Bottom

101e. . . Waterproof groove

101f. . . Waterproof groove

103. . . Lead frame

103a. . . Terminal

103b. . . Terminal

103c. . . Line area

103d. . . Line area

104a. . . Locating slot

104b. . . Locating slot

104c. . . Positioning hole

104d. . . Positioning hole

105. . . B-stage glue

106a. . . Positioning hole

106b. . . Positioning hole

107. . . Insulator

108. . . Reflection ring

108a. . . Reflective surface

108b. . . Center hole

108c. . . Fixed hook

110a. . . Cutting line

110b. . . Cutting line

112a. . . Insulating sleeve

112b. . . Insulating sleeve

The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood.

1 is a top view of a light emitting diode package structure in accordance with an embodiment of the invention.

Fig. 2 is a cross-sectional view taken along line 2-2' of Fig. 1.

Fig. 3 is a cross-sectional view taken along line 3-3' of Fig. 1.

FIG. 4 is a schematic diagram showing a manufacturing process of a light emitting diode package structure according to an embodiment of the invention.

FIG. 5 is a top view of a metal substrate of a light emitting diode package structure according to an embodiment of the invention.

Fig. 6 is a cross-sectional view taken along line 6-6' of Fig. 5.

Fig. 7 is a cross-sectional view taken along line 7-7' of Fig. 5.

Figure 8 is a top plan view of a lead frame in accordance with an embodiment of the present invention.

Figure 9 is a top plan view showing the terminal of the lead frame of Figure 8 after forming an insulating sleeve.

Figure 10 is a top plan view of a reflective ring in accordance with an embodiment of the present invention.

Figure 11 is a cross-sectional view showing the reflection ring of Figure 10.

100. . . Light emitting diode package structure

101. . . Metal substrate

101a. . . Waterproof groove

101b. . . Waterproof groove

101c. . . Solid crystal zone

101d. . . Bottom

103a. . . Terminal

103b. . . Terminal

103c. . . Line area

103d. . . Line area

105. . . B-stage glue

107. . . Insulator

108. . . Reflection ring

108b. . . Center hole

Claims (10)

A light emitting diode package structure comprising: a metal substrate having a solid crystal region, two accommodating grooves and at least one waterproof groove, wherein the two accommodating grooves are located at two sides of the solid crystal region, and the waterproof groove surrounds the The two terminals are respectively located in the two accommodating grooves; a reflection ring is located above the metal substrate, the reflection ring has a central hole, thereby exposing the solid crystal region; and two insulating sleeves are respectively formed The two terminals are insulated from the metal substrate; and an insulator is formed to fix the metal substrate, the two terminals, the reflective ring and the two insulating sleeves, wherein the waterproof groove is filled with a B-stage glue. The light emitting diode package structure of claim 1, wherein the insulator has a melting point higher than a melting point of the two insulating sleeves. The light emitting diode package structure of claim 1, wherein each of the insulating sleeve portions covers each of the terminals to expose both ends thereof. The light emitting diode package structure of claim 3, wherein the center hole exposes an end of each of the terminals not covered by the insulating sleeve. A method for manufacturing a light emitting diode package structure comprises: forming an insulating sleeve by injection molding on a terminal of a lead frame; filling a B-stage glue in a waterproof groove of the metal substrate; After the metal substrate and the reflective ring are positioned, an insulator is injection molded to fix each other to form a light emitting diode package structure; and the light emitting diode package structure is baked to completely cure the B-stage glue. The method of fabricating a light emitting diode package structure according to claim 5, wherein the insulator has a melting point higher than a melting point of the insulating sleeve. The method of fabricating a light emitting diode package according to claim 5, wherein the insulating sleeve partially covers each of the terminals to expose both ends thereof. The manufacturing method of the LED package structure of claim 5, further comprising: aligning the positioning hole of the lead frame with the positioning hole of the metal substrate, so that the terminal of the lead frame can be located in the metal substrate. Inside the slot. The method of fabricating a light emitting diode package according to claim 5, wherein the B-stage glue surrounds the die bonding region to form a closed loop. The method for fabricating a light emitting diode package according to claim 5, further comprising: aligning the reflective ring with the metal substrate such that a center hole of the reflective ring exposes a die bonding region of the metal substrate.