TW201305727A - Positive photosensitive resin composition for LTPS-LCD manufacturing process - Google Patents

Abstract

Provided is a positive photosensitive resin composition, comprising an alkali-soluble novolak resin, two kinds of photosensitive compounds, a surfactant, and solvent whereby decrease the remaining photoresist after developing step during LTPS-LCD manufacturing process.

Description

Positive type photosensitive resin composition for low temperature polycrystalline liquid crystal display process

The present invention relates to a positive photosensitive resin composition, particularly a positive photosensitive resin composition suitable for a low temperature polycrystalline liquid crystal display process.

The photosensitive resin composition is used in a patterning process of an integrated circuit or a liquid crystal display (LCD) to form a photoresist pattern after exposure and development. Thin Film Transistor Liquid Crystal Display (TFT-LCD) produced by Low Temperature Ploy Silicon (LTPS) process compared to conventional Amorphous Silicon (aS) process TFT-LCD has the advantages of low power consumption, high response speed, high resolution and high brightness, so it is widely used in flat-panel displays such as smart phones and car panels. In addition, touch panels have been widely used in daily life, and the demand for products continues to heat up, causing manufacturers to increase production capacity and yield to meet consumer demand.

In order to increase the productivity, the positive photoresist (Positive Photoresist) required for the transistor yellow lithography process needs to further increase the sensitivity of the photoresist exposure (Exposure Dose). Generally speaking, the sensitivity of the photoresist is improved by changing the molecular weight of the alkali-soluble resin or adjusting the Alkaline Dissolution Rate (ADR), but the difference between the line-dense region or the patterned layer is often large. In the process of the process, it is easy to cause photoresist residue. In addition, although conventionally used, such as 125 (msec, development 15 sec) high exposure energy operation, the photoresist residue is less serious, but when the exposure energy is to be lowered to less than 100 or 95 (msec, development 15 sec), the photoresist remains. The problem is no longer in compliance with the process standards.

In the related art, the Taiwan Patent No. I285789 discloses a positive-type photoresist composition for the purpose of solving the problem of insufficient storage stability of a photoresist composition containing a non-diphenylketone-based photosensitive compound. This patent improves the preservative stability of the photoresist composition by adding a phenolic hydroxy compound and an anti-reducing agent, but does not discuss the problem of photoresist residue.

Taiwan Patent No. I326801 discloses another positive-type photoresist composition for the purpose of increasing Depth of Focus (DOF) by adding a phenolic hydroxy compound having a molecular weight of less than 1000 to enhance DOF, and has not revealed how to improve light. Residual residue.

Therefore, there is still a need to develop a positive photosensitive resin composition which can reduce photoresist residue to meet the needs of the industry.

In view of the above disadvantages of the prior art, the present invention provides a positive photosensitive resin composition for a liquid crystal display process, comprising:

(A) an alkali-soluble phenolic resin having a weight average molecular weight of from 3,000 to 8,000;

(B) a first photosensitive compound which is an esterified product of a compound of the formula (I) and a first phenol compound, wherein the R is H or Cl,

(C) a second photosensitive compound which is an esterified product of a compound of the formula (II) and a second phenol compound, wherein the R is H or Cl,

(D) a surfactant;

(E) Solvent.

According to a specific embodiment of the present invention, the first phenol compound and the second phenol compound are independently selected from the group consisting of compounds of the following formula (a), (b), (c), (d) or (e)

The positive photosensitive resin composition of the present invention is particularly suitable for use in a liquid crystal display process by a combination of an alkali-soluble phenolic resin and a photosensitive compound formed of at least two different naphthoquinonediazide sulfonates and a phenol compound. Residual photoresist problems on each patterned layer.

The embodiments of the present invention are described by way of specific examples, and those skilled in the art can understand the advantages and advantages of the present invention as disclosed in the present disclosure. The present invention may be embodied or applied in various other specific embodiments. The details of the present invention can be variously modified and changed without departing from the spirit and scope of the invention.

The positive photosensitive resin composition of the liquid crystal display process of the present invention suitable for low temperature polysilicon includes:

(A) an alkali-soluble phenolic resin;

(B) a first photosensitive compound;

(C) a second photosensitive compound;

(D) a surfactant;

(E) Solvent.

Unlike the resin having a molecular weight of up to 8000 or more in the photoresist composition generally used in the semiconductor integrated circuit process, the positive-type photosensitive resin composition used in the present invention (A) the alkali-soluble phenol resin has a weight average molecular weight of 3,000 to 8,000. Preferably, in combination with (B) the first photosensitive compound and (C) the second photosensitive compound of the present invention, the photoresist residue can be reduced.

As used herein, "weight average molecular weight" is a measure of the measurement of a sample in a tetrahydrofuran (THF) solvent relative to a polystyrene standard by gel permeation chromatography (GPC).

In the positive photosensitive resin composition, the content of the (A) alkali-soluble phenol resin is from 10 to 30% by weight, preferably from 15 to 25% by weight based on the total mass of the positive photosensitive resin composition.

The alkali-soluble phenol resin can be obtained by, for example, an addition condensation reaction using an aromatic compound having a phenolic hydroxyl group (hereinafter, abbreviated as "phenol") and an aldehyde. The preparation method of the above alkali-soluble phenol resin is well known to those skilled in the art and will not be described again.

Examples of phenols include, but are not limited to, phenol, o-cresol, m-cresol, p-cresol, o-ethylphenol, m-ethylphenol, p-ethylphenol, o-butylphenol, m-butylphenol, pair Butyl phenol, 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 2,6-xylenol, 3,4-xylenol, 3,5-dimethyl Phenol, 2,3,5-trimethylphenol, 3,4,5-trimethylphenol, p-phenylphenol, resorcinol, hydroquinone, hydroquinone-methyl ether, pyrogallol , phloroglucinol, hydroxybiphenyl, bisphenol A, gallic acid, gallic acid ester, α-naphthol and β-naphthol. Examples of aldehydes include, but are not limited to, formaldehyde, paraformaldehyde, furfural, benzaldehyde, nitrobenzaldehyde, acetaldehyde, and the like.

In a specific embodiment, the methyl group on the phenyl repeating unit in the (A) alkali-soluble phenol resin used in the positive-type photosensitive resin composition of the present invention may form a meta relationship or a relationship with the hydroxyl group. In the positional relationship (para), the alkali-soluble phenol resin (A) may be obtained by mixing two or more kinds of phenol resins. For example, the alkali-soluble phenol resin (A) of the present invention may be composed of a first phenol resin and a second phenol resin.

The photosensitive compound used in the positive photosensitive resin composition of the present invention is a naphthoquinonediazide sulfonate reacted with one or more phenolic hydroxyl compounds, for example, 1,2-naphthoquinonediazide a complete ester compound of 4-sulfonic acid or 1,2-naphthoquinonediazide-5-sulfonic acid and a phenolic hydroxyl compound, partially esterified compound.

In the composition of the present invention, at least two photosensitive compounds are included. In a preferred embodiment, the first photosensitive compound is an esterified product of a compound of the formula (I) and a first phenol compound, wherein the R is H or Cl,

a second photosensitive compound, which is an esterified product of a compound of the formula (II) and a second phenol compound, wherein the R is H or Cl,

In proportion, the weight ratio of the first photosensitive compound to the second photosensitive compound is from 98:2 to 10:90, preferably from 98:2 to 60:40, more preferably from 90:10 to 80:20.

In one embodiment, the first phenolic compound and the second phenolic compound are independently selected from the group consisting of compounds of the following formula (a), (b), (c), (d) or (e).

In a preferred embodiment, the first phenolic compound and the second phenolic compound are all compounds of formula (e-1)

In a preferred embodiment, the first photosensitive compound of the present invention is composed of 3 moles of 2-Diazo-1-naphthone-5-sulfonyl chloride. 1 molar 2,3,4,4'-tetrahydroxybenzophenone (2,3,4,4'-tetrahydroxybenzophenone, formula (e-1)) esterification reaction product (5-DNQ); The first photosensitive compound of the present invention is composed of 3 moles of 2-Diazo-1-naphthone-4-sulfonyl chloride and 1 mole of 2,3. Esterification reaction product (4-DNQ) of 4,4'-tetrahydroxybenzophenone (2,3,4,4'-tetrahydroxybenzophenone, formula (e-1)).

According to a specific embodiment of the present invention, the positive photosensitive resin composition of the present invention comprises a surfactant to enhance leveling, a wide variety of surfactants, and is not limited to a specific kind, and examples of the surfactant include MEGAFAC R- 08 (trade name, Dainippon Ink Chemical Industry Co., Ltd.), FLUORAD FC-430, FC-431 (trade name, Sumitomo 3M (share) system), EFTOP EF 122A, EF122B, EF122C, EF126 (trade name, TOCHEM) PRODUCT (share) system and other fluorine-based surfactants, XR-104 and so on. The surfactant is contained in an amount of from 0.001 to 0.1% by weight based on the total weight of the positive photosensitive resin composition.

According to an embodiment of the present invention, the positive photosensitive resin composition is usually used in the form of a solvent to prepare a liquid composition. The solvent to be used for the positive photosensitive resin composition is not particularly limited as long as the components of the positive photosensitive resin composition can be dispersed or dissolved without reacting with these components.

According to a specific embodiment of the present invention, the positive photosensitive resin composition has a solvent content of 50 to 90% by weight, preferably 65 to 85% by weight, more preferably 70% based on the total mass of the positive photosensitive resin composition. Up to 80% by weight.

Examples of the solvent include, but are not limited to, ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n-propyl ether, ethylene glycol mono-n-butyl ether, diethylene glycol monomethyl ether, Diethylene glycol monoethyl ether, diethylene glycol mono-n-propyl ether, diethylene glycol mono-n-butyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-propyl ether, Propylene glycol mono-n-butyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol mono-n-propyl ether, dipropylene glycol mono-n-butyl ether, dipropylene glycol monomethyl ether, tripropylene glycol monoethyl ether, diethylene glycol dimethyl ether, two Glycol methyl ether, diethylene glycol diethyl ether and tetrahydrofuran; ketones, for example, methyl ethyl ketone, cyclohexanone, 2-heptanone and 3-heptanone; esters, for example, ethylene glycol Methyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate (PGMEA), 2-hydroxyl Propionic acid formic acid, ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, methyl 3-methoxypropionate, 3-methoxypropionic acid Ester, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl ethoxyacetate, ethyl hydroxyacetate, methyl 2-hydroxy-3-methylbutanoate, 3-methyl 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl propionate, ethyl acetate, n-propionic acid acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate Ester, formic acid, n-amyl acetate, n-butyl propionate, ethyl butyrate, n-propyl butyrate, isopropyl butyrate, n-butyl butyrate, methyl pyruvate, ethyl pyruvate , n-propyl pyruvate, methyl acetate methyl acetate, ethyl acetate ethyl acetate and ethyl 2-hydroxybutyrate; aromatics, for example, toluene and xylene; guanamine groups, for example, N-A Pyrrolidone, N,N-dimethylformamide, and N,N-dimethylacetamide. According to a particular embodiment of the invention, at least one of the above solvents can be used.

In addition, the above solvent may also be combined with benzyl ether, di-n-hexyl ether, acetonitrile, isophorone, caproic acid, heptanoic acid, 1-octanol, 1-naphthol, benzyl alcohol, benzyl acetate, benzoic acid. A high boiling point solvent such as ethyl ester, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate or ethylene glycol monophenyl ether acetate is used in combination.

According to an embodiment of the present invention, the positive photosensitive resin composition may be added with an additive as needed. Examples of additives include, but are not limited to, pigments, dyes, dissolution inhibitors, thermal polymer inhibitors, thickeners, antifoaming agents, sensitizers, antioxidants, and couplings. Agent. In the positive photosensitive resin composition, the content of the additive is usually not more than 5% by weight based on the total weight of the positive photosensitive resin composition.

Example Preparation of photosensitive resin composition Example 1

Taking (A) an alkali-soluble phenol resin, (B) a first photosensitive compound, (C) a second photosensitive compound, (D) a surfactant, and (E) a solvent to form a photosensitive resin composition, and uniformly mixing the above components Then, the solution was filtered with a 0.2 μm filter, and the photoresist composition formulation was completed. Hereinafter, the components used in the respective examples and comparative examples will be described, and the ratios are shown in Table 1.

Alkali-soluble phenolic resin of Examples 1 and 2: weight average molecular weight was 4866; TR40B30G was mixed with TR40B80G, Asahi Organic Materials Co., Ltd.

Alkali-soluble phenolic resin of Comparative Example 1: weight average molecular weight was 4980; TR40B30G was mixed with TR40B80G, Asahi Organic Materials Co., Ltd.

Alkali-soluble phenolic resin of Comparative Example 2: weight average molecular weight was 4707; TR40B30G was mixed with TR40B80G, Asahi Organic Materials Co., Ltd.

Alkali-soluble phenolic resin of Comparative Example 3: weight average molecular weight was 4,616; TR40B30G was mixed with TR40B80G, Asahi Organic Materials Co., Ltd.

First Photosensitive Compound: 5-DNQ, MIPHOTO PAC430, Miwom

Second Photosensitive Compound: 4-DNQ, MIPHOTO 4PAC430, Miwom

Surfactant: MEGAFAC R-08 (trade name, manufactured by Dainippon Ink Chemical Industry Co., Ltd.)

Solvent: Propylene glycol 1-methyl ether 2-acetate (PGMEA)

Evaluation of characteristics:

The residual of the photosensitive resin composition obtained in the above Examples and Comparative Examples after exposure and development was tested.

The photosensitive resin composition is uniformly coated on a substrate (bottom layer) by a spin coater (TEL MK-Vz), and examples of the substrate include a glass substrate (such as ITO glass) or a tantalum wafer or the like. For different patterned (to be patterned) layers, the substrate may also be, for example, boron (B), aluminum (Al), aluminum germanium (Al-Nd), molybdenum aluminum molybdenum (Mo-Al-Mo) or a metal layer of titanium aluminum titanium (Ti-Al-Ti); an ion implantation layer such as arsenic (As), boron (B) or phosphorus (P).

The coated photosensitive resin composition film is subjected to heat treatment (soft baking, temperature: 90 to 110 ° C, time: 90 to 120 seconds) to obtain a photoresist film having a thickness of about 1.0 to 2.0 μm. The light source using the exposure machine (Nikon 1755i7a) is irradiated onto the photoresist film through the mask, and the exposure machine source is mainly i-line (365 nm). The exposed photoresist film is subjected to post-exposure baking ((PEB), temperature: 90-110 ° C, time: 90-120 seconds), followed by development with 2.38 wt% tetramethylammonium hydroxide developer operation. The residual photoresist residue was observed by a scanning electron microscope (Hitachi S-4200 FE-SEM).

The test results are shown in Table 2 below.

It can be seen from Table 2 that the combination of an alkali-soluble phenolic resin and a photosensitive compound formed of at least two different naphthoquinonediazide sulfonates and a phenol compound is particularly suitable for use in a liquid crystal display process, and the various patterns are reduced. Residual photoresist problem on the layer.

The above examples are merely illustrative of the compositions and preparation methods of the present invention and are not intended to limit the invention. Modifications and variations of the above-described embodiments can be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of the claims of the present invention should be as set forth in the appended claims.

Claims (10)

A positive photosensitive resin composition for a low temperature polycrystalline liquid crystal display process, comprising: (A) an alkali-soluble phenolic resin having a weight average molecular weight of 3,000 to 8,000; (B) a first photosensitive compound, a compound of the formula (I) An esterified product of a first phenolic compound, wherein the R is H or Cl, (C) a second photosensitive compound which is an esterified product of a compound of the formula (II) and a second phenol compound, wherein the R is H or Cl, (D) a surfactant; and (E) a solvent. The positive photosensitive resin composition for a liquid crystal display process of the low temperature polycrystalline silicon according to the first aspect of the invention, wherein the alkali-soluble phenolic resin is 10 based on the total weight of the positive photosensitive resin composition. Up to 30% by weight. The positive photosensitive resin composition according to claim 1, wherein the total content of the first photosensitive compound and the second photosensitive compound is 2 based on the total weight of the positive photosensitive resin composition. Up to 8wt%. The positive photosensitive resin composition for a low-temperature polycrystalline silicon liquid crystal display process according to claim 1, wherein the first photosensitive compound and the second photosensitive compound have a weight ratio of 98:2 to 10:90. The positive photosensitive resin composition for a low-temperature polycrystalline silicon liquid crystal display process according to claim 1, wherein the first photosensitive compound and the second photosensitive compound have a weight ratio of 98:2 to 60:40. The positive photosensitive resin composition for a low-temperature polycrystalline silicon liquid crystal display process according to claim 1, wherein the first photosensitive compound and the second photosensitive compound have a weight ratio of 90:10 to 80:20. The positive photosensitive resin composition for a low-temperature polycrystalline liquid crystal display process according to claim 1, wherein the first phenol compound and the second phenol compound are independently selected from the following formulas (a) and (b); , (c), (d) or (e) compounds The positive photosensitive resin composition for a low-temperature polycrystalline silicon liquid crystal display process according to claim 7, wherein the first phenol compound and the second phenol compound are compounds of the formula (e-1) The positive photosensitive resin composition for a liquid crystal display process of the low temperature polycrystalline silicon according to claim 1, wherein the surfactant is contained in an amount of 0.001 to the total weight of the positive photosensitive resin composition. 0.1 wt%. The positive photosensitive resin composition for a liquid crystal display process of the low temperature polycrystalline silicon according to the first aspect of the invention, wherein the solvent is contained in an amount of 65 to 85 wt% based on the total weight of the positive photosensitive resin composition. .