JP2008241798A - Method for forming resist pattern using new positive photosensitive resin composition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for forming a resist pattern by which a resist pattern showing no reverse tapered profile can be obtained even when the ultimate decompression degree or decompression speed is increased. <P>SOLUTION: The method for forming a resist pattern includes steps of: forming a positive photosensitive resin composition film on a substrate by applying a positive photosensitive resin composition comprising (A) an alkali-soluble resin, (B) a quinone diazide compound, (C) a triazole compound expressed by general formula (C-1) or the like, and (D) a solvent; drying the obtained positive photosensitive resin composition film at a reduced pressure under the condition of the ultimate pressure of 5 to 4,000 Pa and then heating and drying to form a photosensitive resist film; and exposing the formed photosensitive resist film along a pattern and developing the film to form a resist pattern. In the above formula, each of R<SP>11</SP>and R<SP>12</SP>represents an α,α-dimethylbenzyl group or the like, at least one of them is α,α-dimethylbenzyl group or an alkoxycarbonylethyl group, and R<SP>13</SP>is a hydrogen atom or the like. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a resist pattern forming method using a novel positive photosensitive resin composition. More specifically, the present invention relates to a method for forming a resist pattern using a positive photosensitive resin composition that does not reverse taper even under reduced pressure drying conditions where the ultimate pressure reduction degree and pressure reduction speed are extremely high.

  In recent years, flat display devices such as liquid crystal display devices and organic EL elements have attracted attention as electronic display devices. Since the liquid crystal display device is smaller and more compact than a cathode ray tube (CRT) display device, various devices including the liquid crystal display device have been developed. The market needs for miniaturization of various devices including consumer devices such as personal computers and video cameras are high, and miniaturized portable devices such as laptop computers and cameras with a liquid crystal monitor have become widespread. In these devices, it is indispensable to have a liquid crystal display device, and there is a strong demand for high performance and high performance such as color display and high luminance. There is also a strong demand for increasing the size of the liquid crystal display.

  Under such circumstances, in order to produce a large amount of liquid crystal display devices, the production substrate of the liquid crystal display device is also increased in size. Along with this, the production method has also changed, but there is a demand for improved productivity in the reduced-pressure drying step in the resist pattern forming step. For this reason, in the reduced pressure drying step, the degree of reduced pressure is increased or the reduced pressure rate is increased in order to reduce the tact time and reduce the unevenness of the resist coating surface.

However, when the degree of decompression is increased or the decompression speed is increased, the resist becomes inversely tapered (the width (X1) at the top of the resist pattern is larger than the width (X2) at the bottom (side in contact with the substrate)). )). In order to prevent reverse taper, it is necessary to limit the ultimate pressure reduction degree and the pressure reduction speed in the vacuum drying process to a certain limit, and there is no choice but to compromise with application with a long tact time and unevenness.
Thus, the productivity improvement in the reduced-pressure drying process and the prevention of reverse taper of the resist pattern are in a contradictory relationship, and a solution for this is required.

In Patent Document 1, a positive resist composition containing a novolak resin and a quinonediazide photosensitizer is added to 2- (2′-hydroxy-5′-methylphenyl) -benzotriazole, 2- (2′-hydroxy-). 3 ′, 5′-di-t-butylphenyl) benzotriazole, 2- (2′-hydroxy-3′-t-butyl-5′-methylphenyl) -5-chloro-benzotriazole, 2- (2 ′ -Hydroxy-3 ', 5'-di-t-amylphenyl) benzotriazole, 2- (2'-hydroxy-3', 5'-di-t-butylphenyl) benzotriazole, 2- (2'-hydroxy) A photosensitive resin composition containing a triazole compound such as -5'-t-butylphenyl) -benzotriazole and 2- (2'-hydroxy-5'-t-octylphenyl) benzotriazole. Shown is, the photosensitive resin composition, ultraviolet absorbent is high.
However, the positive resist compositions reported so far cannot satisfy both the productivity improvement in the reduced-pressure drying step and the prevention of reverse taper of the resist pattern.

JP-A-1-241546

  Accordingly, an object of the present invention is to provide a resist pattern forming method capable of obtaining a resist pattern that does not reverse taper even when the ultimate pressure reduction degree or pressure reduction speed is increased.

  As a result of intensive studies to solve the above-mentioned problems, the present inventor has significantly reduced the reverse taper phenomenon in a resist pattern obtained by using a positive photosensitive resin composition containing a specific compound. Based on this finding, the present invention has been completed.

（式中、Ｒ^１１及びＲ^１２は、それぞれ、水素原子、ヒドロキシ基、炭素数１〜１２のアルキル基、炭素数１〜１２のアルコキシ基、炭素数１〜１２のアルコキシカルボニルエチル基又はα，α−ジメチルベンジル基である。また、Ｒ^１１及びＲ^１２の少なくとも一方はα，α−ジメチルベンジル基又は炭素数１〜１２のアルコキシカルボニルエチル基である。Ｒ^１３は水素原子又はハロゲン原子である。）

（式中、Ｒ^２１は、水素原子、ヒドロキシ基、炭素数１〜１２のアルキル基、炭素数１〜１２のアルコキシ基又はアシル基であり、Ｒ^２２及びＲ^２３は、それぞれ、水素原子、ハロゲン原子、ヒドロキシ基、炭素数１〜１２のアルキル基、炭素数１〜１２のアルコキシル基、アシル基、アミノ基、炭素数１〜１２のアルキル基で置換されたアミノ基、炭素数１〜１２のアルコキシ基で置換されたアミノ基又はニトロ基であり、少なくとも一方は、ハロゲン原子、メチル基、アミノ基又はニトロ基である。）
本発明のレジストパターン形成方法において、一般式（Ｃ−１）又は（Ｃ−２）で表わされるトリアゾール化合物の配合量が、アルカリ可溶性樹脂（Ａ）１００重量部に対して、０．１〜３０重量部であることが好ましい。 Thus, according to the present invention,
Step (I): containing (A) an alkali-soluble resin, (B) a quinonediazide compound, (C) a triazole compound represented by the following general formula (C-1) or (C-2), and (D) a solvent. Applying a positive photosensitive resin composition to the substrate to form a positive photosensitive resin composition film on the substrate;
Step (II): A step of drying the positive photosensitive resin composition film obtained in Step (I) under reduced pressure under a condition of an ultimate pressure of 5 to 4,000 Pa, followed by heat drying to form a photosensitive resist film. And Step (III): There is provided a resist pattern forming method comprising a step of pattern-exposing the photosensitive resist film formed in Step (II) and then developing to form a resist pattern.

Wherein R ¹¹ and R ¹² are each a hydrogen atom, a hydroxy group, an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, an alkoxycarbonylethyl group having 1 to 12 carbon atoms, or α, an α-dimethylbenzyl group, and at least one of R ¹¹ and R ¹² is an α, α-dimethylbenzyl group or an alkoxycarbonylethyl group having 1 to 12 carbon atoms, and R ¹³ is a hydrogen atom or a halogen atom. .)

(Wherein R ²¹ represents a hydrogen atom, a hydroxy group, an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, or an acyl group, and R ²² and R ²³ represent a hydrogen atom, a halogen atom, respectively. Atom, hydroxy group, alkyl group having 1 to 12 carbon atoms, alkoxyl group having 1 to 12 carbon atoms, acyl group, amino group, amino group substituted with an alkyl group having 1 to 12 carbon atoms, 1 to 12 carbon atoms An amino group or a nitro group substituted with an alkoxy group, at least one of which is a halogen atom, a methyl group, an amino group, or a nitro group.
In the resist pattern formation method of this invention, the compounding quantity of the triazole compound represented by general formula (C-1) or (C-2) is 0.1-30 with respect to 100 weight part of alkali-soluble resin (A). It is preferable that it is a weight part.

In the resist pattern forming method of the present invention, it is preferable to perform the heat drying in the step (II) for 40 to 300 seconds.
Furthermore, according to the present invention, there is provided a resist pattern obtained by the resist pattern forming method of the present invention.

According to the resist pattern forming method using the novel positive photosensitive resin composition of the present invention, the resist pattern in which the degree of reverse taper is remarkably reduced even if the degree of pressure reduction is increased and the pressure reduction speed is increased in the reduced-pressure drying step. Can be formed efficiently.
Therefore, according to the resist pattern forming method of the present invention, a resist pattern having a uniform coated surface can be efficiently obtained while reducing the tact time, which can greatly contribute to the improvement of productivity of a liquid crystal display substrate and the like.

  In the resist pattern forming method of the present invention, step (I): a positive photosensitive resin composition containing a specific triazole compound is applied to a substrate to form a positive photosensitive resin composition film on the substrate. Step (sometimes simply referred to as “photosensitive resin composition film forming step”), step (II): The positive photosensitive resin composition film obtained in step (I) is subjected to an ultimate pressure of 5 to 4,000 Pa. A step of forming a photosensitive resist film by drying under reduced pressure under the above conditions, and a step (III): pattern exposure of the photosensitive resist film formed in step (II), followed by development to form a resist pattern Forming a step.

  In the resist pattern forming method of the present invention, first, in step (I), a positive photosensitive resin composition film is formed on a substrate by applying a positive photosensitive resin composition on the substrate.

  The positive photosensitive resin composition used in the resist pattern forming method of the present invention is represented by (A) an alkali-soluble resin, (B) a quinonediazide compound, (C) a general formula (C-1) or (C-2). It contains a triazole compound and (D) a solvent.

The alkali-soluble resin (A) constituting the positive photosensitive resin composition used in the present invention is not particularly limited as long as it is a resin soluble in a developer composed of an alkaline aqueous solution. Specific examples thereof include novolak resin, resol resin, acrylic resin, polyvinyl alcohol, styrene-acrylic acid copolymer, hydroxystyrene polymer, polyvinyl hydroxybenzoate and the like. These alkali-soluble resins may be used alone or in combination of two or more.
In the present invention, among the alkali-soluble resins, novolak resins are preferable.

  A novolac resin is a resin obtained by dehydrating and condensing a phenol compound and an aldehyde compound using an acidic catalyst. The phenol compound used for producing the novolak resin may be a monovalent phenol compound or a dihydric or higher polyhydric phenol such as resorcinol. A phenol compound may be used individually by 1 type, and may be used in combination of 2 or more type.

  Specific examples of monovalent phenol compounds include phenol; o-cresol, m-cresol, p-cresol; 2,3-xylenol, 2,5-xylenol, 3,4-xylenol, 3,5-xylenol, and the like. Xylenol, 2-ethylphenol, 3-ethylphenol, 4-ethylphenol, 2-propylphenol, 3-propylphenol, 4-propylphenol, 2-t-butylphenol, 3-t-butylphenol, 4-t-butylphenol, 2,5-diethylphenol, 3,5-diethylphenol, 2-t-butyl-4-methylphenol, 2-t-butyl-5-methylphenol, 2-t-butyl-3-methylphenol, 2,3 , 5-trimethylphenol, 2,3,5-triethylphenol and other alkyls Phenol; alkoxyphenol such as 2-methoxyphenol, 3-methoxyphenol, 4-methoxyphenol, 2-ethoxyphenol, 3-ethoxyphenol, 4-ethoxyphenol, 2,3-dimethoxyphenol, 2,5-dimethoxyphenol; Arylphenols such as 2-phenylphenol, 3-phenylphenol, 4-phenylphenol; 2-isopropenylphenol, 4-isopropenylphenol, 2-methyl-4-isopropenylphenol, 2-ethyl-4-isopropenylphenol And the like.

  Specific examples of polyhydric phenol compounds include resorcinols such as resorcinol, 2-methylresorcinol, 4-methylresorcinol, 5-methylresorcinol, 2-methoxyresorcinol, 4-methoxyresorcinol; hydroquinones such as hydroquinone; catechol, 4 -Catechols such as t-butylcatechol and 3-methoxycatechol; those having a plurality of phenyl skeletons such as 4,4'-dihydroxybiphenyl and 2,2-bis (4-hydroxyphenyl) propane; pyrogallols such as pyrogallol Phloroglicinols such as phloroglucinol; and the like.

  In the present invention, among these phenol compounds, o-cresol, m-cresol, p-cresol, 2,5-xylenol, 3,5-xylenol and 2,3,5-trimethylphenol are preferably used. Can do.

As the aldehyde compound to be dehydrated and condensed with the phenol compound, any of an aliphatic aldehyde, an alicyclic aldehyde, and an aromatic aldehyde can be used.
An aldehyde compound may be used individually by 1 type, and may be used in combination of 2 or more type.
The aliphatic aldehyde may be a saturated aldehyde or an unsaturated aldehyde. Specific examples thereof include saturated formaldehyde, trioxane, paraformaldehyde, acetaldehyde, propionaldehyde, n-butyraldehyde, isobutyraldehyde, trimethylacetaldehyde, n-hexylaldehyde and the like. Aldehydes; and unsaturated aldehydes such as acrolein, crotonaldehyde, and furylacrolein.

  The alicyclic aldehyde may be a saturated alicyclic aldehyde or an unsaturated alicyclic aldehyde, and specific examples thereof include cyclopentane aldehyde, cyclohexane aldehyde, furfural and the like.

  Specific examples of the aromatic aldehyde include benzaldehyde, o-tolualdehyde, m-tolualdehyde, p-tolualdehyde, p-ethylbenzaldehyde, 2,4-dimethylbenzaldehyde, 2,5-dimethylbenzaldehyde, 3,4-dimethyl. Benzaldehyde, 3,5-dimethylbenzaldehyde, o-chlorobenzaldehyde, m-chlorobenzaldehyde, p-chlorobenzaldehyde, o-hydroxybenzaldehyde, m-hydroxybenzaldehyde, p-hydroxybenzaldehyde, o-anisaldehyde, m-anisaldehyde, p -Anisaldehyde, terephthalaldehyde, phenylacetaldehyde, α-phenylpropionaldehyde, β-phenylpropionaldehyde, cinnamic aldehyde, etc. it can.

The acidic catalyst used for dehydrating and condensing a phenol compound and an aldehyde compound is not particularly limited as long as it is usually used in this reaction. Specific examples thereof include hydrochloric acid, sulfuric acid, formic acid, acetic acid, and oxalic acid. And p-toluenesulfonic acid.
The condensation reaction product obtained by the dehydration condensation reaction can be used as a novolak resin as it is.

In the present invention, the (A) alkali-soluble resin can be used after separating and removing low molecular weight components. Examples of the method for removing the low molecular weight component include a liquid-liquid fractionation method in which the resin is fractionated in two solvents having different solubility, a method for removing the low molecular weight component by centrifugation, and a thin film distillation method. be able to.
In the case of a novolak resin, the resulting condensation reaction product is dissolved in a good solvent, and then poured into water to cause precipitation, whereby a novolak resin from which low molecular weight components have been removed can be obtained.
Specific examples of the good solvent include alcohol solvents such as methanol and ethanol; ketone solvents such as acetone and methyl ethyl ketone; alkylene glycol solvents such as ethylene glycol monoethyl ether acetate; ether solvents such as tetrahydrofuran;

  The alkali-soluble novolak resin used in the present invention preferably has a mass average molecular weight of 2,000 to 20,000, more preferably 2,500 to 12,000, and 3,000 to 8,000. More preferably, it is 000. The mass average molecular weight can be measured by a gel permeation chromatography (GPC) method using monodispersed polystyrene as a standard sample and tetrahydrofuran (THF) as an eluent.

In the positive photosensitive resin composition used in the present invention, a second resin component can be blended in addition to the alkali-soluble resin, if necessary.
The second resin component includes (meth) acrylic acid ester homopolymers and copolymers, and (meth) acrylic acid esters and styrenes, N-vinylimidazole, N-vinylcarbazole, 2-vinylquinoline, vinylcyclohexane, vinylnaphthalene. And copolymers with vinyl compounds such as vinylpyridine, N-vinylpyrrolidone, N-vinylphthalimide and the like. These polymers may be used individually by 1 type, and may be used in combination of 2 or more type.

Here, specific examples of the (meth) acrylic acid ester include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, and (meth) acrylic acid. n-butyl, isobutyl (meth) acrylate, t-butyl (meth) acrylate, n-hexyl (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, phenyl (meth) acrylate, Naphthyl (meth) acrylate, 2-chloroethyl (meth) acrylate, 1-phenylethyl (meth) acrylate, 2-phenylethyl (meth) acrylate, furfuryl (meth) acrylate, diphenylmethyl (meth) acrylate , Pentachlorophenyl (meth) acrylate, phenyl α-bromo (meth) acrylate, α- Mention may be made of methyl chloro (meth) acrylate.
In the present invention, “(meth) acrylic acid” means “acrylic acid and / or methacrylic acid”.

  The quinonediazide compound (B) constituting the positive photosensitive resin composition used in the present invention is a compound having a quinonediazide group. Although it does not specifically limit as a quinonediazide compound (B), As a suitable specific example, hydroxy group, an amino group, etc. which can carry out a condensation reaction with acid halides, such as a naphthoquinone diazide sulfonic acid chloride and a benzoquinone diazide sulfonic acid chloride, etc. And quinonediazide sulfonic acid ester obtained by reacting with a compound having a functional group, preferably a hydroxy group.

  Here, specific examples of the acid halide include 1,2-naphthoquinonediazide-5-sulfonyl chloride, 1,2-naphthoquinonediazide-4-sulfonyl chloride, 1,2-naphthoquinonediazide-6-sulfonyl chloride, and the like. Can do.

Specific examples of the compound having a hydroxy group include 2,3,4-trihydroxybenzophenone, 2,4,4′-trihydroxybenzophenone, 2,3,4,4′-tetrahydroxybenzophenone, 2,2 Polyhydroxybenzophenones such as ', 4,4'-tetrahydroxybenzophenone, 2,2', 3,4,4'-pentahydroxybenzophenone; gallic esters such as methyl gallate, ethyl gallate, propyl gallate; , 2-bis (4-hydroxyphenyl) propane, polyhydroxybisphenylalkane such as 2,2-bis (2,4-dihydroxyphenyl) propane; tris (4-hydroxyphenyl) methane, 1,1,1-tris (4-hydroxy-3-methylphenyl) ethane, 1,1,1-tris (4-hydroxy Enyl) ethane, 1,1-bis (4-hydroxy-3-methylphenyl) -1- (4-hydroxyphenyl) ethane, bis (4-hydroxy-3-methylphenyl) -2-hydroxy-4-methoxyphenyl Methane, polyhydroxytrisphenylalkanes such as 4,4 ′-[1- [4- [1- (4-hydroxyphenyl) -1-methylethyl] phenyl] ethylidene] bisphenol; 1,1,2,2-tetrakis Polyhydroxytetrakis such as (4-hydroxyphenyl) ethane, 1,1,2,2-tetrakis (3-methyl-4-hydroxyphenyl) ethane, 1,1,3,3-tetrakis (4-hydroxyphenyl) propane Phenylalkane; α, α, α ′, α′-tetrakis (4-hydroxyphenyl) -m-xylene, α, α, α ′, α′- Polyhydroxytetrakisphenylxylene such as trakis (4-hydroxyphenyl) -p-xylene, α, α, α ′, α′-tetrakis (3-methyl-4-hydroxyphenyl) -m-xylene; 2,6-bis (2,4-dihydroxybenzyl) -p-cresol, 2,6-bis (2,4-dihydroxy-3-methylbenzyl) -p-cresol, 4,6-bis (4-hydroxybenzyl) resorcin, 4, 6-bis (4-hydroxy-3-methylbenzyl) resorcin, 4,6-bis (4-hydroxybenzyl) -2-methylresorcin, 4,6-bis (4-hydroxy-3-methylbenzyl) -2- Trimer of phenolic compound such as methylresorcin and formaldehyde; Tetramer of phenolic compound and formaldehyde; Novo Click resin; and the like.
One of the acid halide and the compound having a hydroxy group may be used alone, or two or more of them may be used in combination.

The reaction between an acid halide and a compound having a hydroxy group should be carried out in an organic solvent such as dioxane, N-methylpyrrolidone or dimethylacetamide in the presence of a basic condensing agent such as triethanolamine, alkali carbonate or alkali hydrogen carbonate. Can do.
The esterification rate of the obtained quinonediazide sulfonic acid ester is preferably 50 mol% or more, and more preferably 60 mol% or more. The esterification rate is determined by the blending ratio of the acid halide and the compound having a hydroxy group.

  In the positive photosensitive resin composition used in the present invention, the amount of the quinonediazide compound (B) is preferably 5 to 40 parts by mass with respect to 100 parts by mass of the alkali-soluble resin (A). More preferably, it is 30 parts by mass. If the compounding amount of the quinonediazide compound (B) is within the above range, the formability of the halftone pattern portion of the resist pattern is good and the balance between the effective sensitivity and the resist characteristics such as the remaining film ratio and resolution is achieved. An excellent positive photosensitive resin composition can be obtained.

（式中、Ｒ^１１及びＲ^１２は、それぞれ、水素原子、ヒドロキシ基、炭素数１〜１２のアルキル基、炭素数１〜１２のアルコキシ基、炭素数１〜１２のアルコキシカルボニルエチル基又はα，α−ジメチルベンジル基である。また、Ｒ^１１及びＲ^１２の少なくとも一方はα，α−ジメチルベンジル基又は炭素数１〜１２のアルコキシカルボニルエチル基である。Ｒ^１３は水素原子又はハロゲン原子である。） The triazole compound (C) constituting the positive photosensitive resin composition used in the present invention is represented by the following general formula (C-1) or (C-2).

Wherein R ¹¹ and R ¹² are each a hydrogen atom, a hydroxy group, an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, an alkoxycarbonylethyl group having 1 to 12 carbon atoms, or α, an α-dimethylbenzyl group, and at least one of R ¹¹ and R ¹² is an α, α-dimethylbenzyl group or an alkoxycarbonylethyl group having 1 to 12 carbon atoms, and R ¹³ is a hydrogen atom or a halogen atom. .)

As a suitable specific example of the triazole compound (C-1), 2- (3 ′, 5′-di (α, α-dimethylbenzyl) -2′-hydroxyphenyl) -benzotriazole (general formula (C-11)) ) And 2- (3 ′-(α, α-dimethylbenzyl) -2′-hydroxy-5′-tert-octylphenyl) -benzotriazole (general formula (C-12)).

  Other specific examples of the triazole compound (C-1) include 2- (2′-hydroxy-4′-octyloxy-phenyl) benzotriazole and 2- (3 ′, 5′-bis (α, α-dimethylbenzyl). ) -2′-hydroxyphenyl) benzotriazole (C-11), 2- (3′-t-butyl-2′-hydroxy-5 ′-(2-octylcarbonylethyl) phenyl) -5-chloro-benzotriazole 2- (3′-t-butyl-5 ′-[2- (2-ethylhexyloxy) -carbonylethyl] -2′-hydroxyphenyl) -5-chloro-benzotriazole, 2- (3′- t-butyl-2′-hydroxy-5 ′-(2-methoxycarbonylethyl) phenyl) -5-chloro-benzotriazole, 2- (3′-t-butyl-2′-hy Droxy-5 ′-(2-methoxycarbonylethyl) phenyl) benzotriazole, 2- (3′-t-butyl-2′-hydroxy-5 ′-(2-octyloxycarbonylethyl) phenyl) benzotriazole, 2- (3'-t-butyl-5 '-[2- (2-ethylhexyloxy) -carbonylethyl] -2'-hydroxyphenyl) benzotriazole, and 2- (3'-t-butyl-2'-hydroxy- 5 ′-(2-isooctyloxycarbonylethyl) phenyl) benzotriazole, 2- [3′-tert-butyl-5 ′-(2-methoxycarbonylethyl) -2′-hydroxy-phenyl] -2H-benztriazole Can be mentioned.

（式中、Ｒ^２１は、水素原子、ヒドロキシ基、炭素数１〜１２のアルキル基、炭素数１〜１２のアルコキシ基又はアシル基であり、Ｒ^２２及びＲ^２３は、それぞれ、水素原子、ハロゲン原子、ヒドロキシ基、炭素数１〜１２のアルキル基、炭素数１〜１２のアルコキシル基、アシル基、アミノ基、炭素数１〜１２のアルキル基で置換されたアミノ基、炭素数１〜１２のアルコキシ基で置換されたアミノ基又はニトロ基であり、少なくとも一方は、ハロゲン原子、メチル基、アミノ基又はニトロ基である。）

(Wherein R ²¹ represents a hydrogen atom, a hydroxy group, an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, or an acyl group, and R ²² and R ²³ represent a hydrogen atom, a halogen atom, respectively. Atom, hydroxy group, alkyl group having 1 to 12 carbon atoms, alkoxyl group having 1 to 12 carbon atoms, acyl group, amino group, amino group substituted with an alkyl group having 1 to 12 carbon atoms, 1 to 12 carbon atoms An amino group or a nitro group substituted with an alkoxy group, at least one of which is a halogen atom, a methyl group, an amino group, or a nitro group.

Specific examples of the triazole compound (C-2) include tolyltriazole (general formula (C-21)) and 5-chloro-benzotriazole (general formula (C-22)). Its structure is shown below.

Other specific examples of the triazole compound (C-1) include 5-aminobenzotriazole (general formula (C-23)), 5-nitrobenzotriazole (general formula (C-24)), (general formula (C- 25)) and 5,6-dibromobenzotriazole.

In the positive photosensitive resin composition used in the present invention, the amount of the triazole compound (C) is preferably 0.1 to 30 parts by mass with respect to 100 parts by mass of the alkali-soluble resin (A). It is more preferable that it is 0.1-15 mass parts, and it is still more preferable that it is 0.3-10 mass parts.
If the blending amount of the triazole compound (C) is excessively less than the above lower limit, the effect of controlling the reverse taper of the resist pattern may not be obtained. On the contrary, if the amount is excessively larger than the above upper limit, the effective sensitivity of the resist may be deteriorated or the resolution of the pattern may be lowered.

  The solvent (D) constituting the positive photosensitive resin composition used in the present invention is particularly a solvent that dissolves the alkali-soluble resin (A), the compound (B) having a quinonediazide group, and the triazole compound (C). Specific examples thereof include alkylene glycol solvents, ether solvents, ester solvents, hydrocarbon solvents, ketone solvents, amide solvents, lactone solvents, and the like.

  Specific examples of the alkylene glycol solvent include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, and other ethylene glycol alkyl ethers; propylene glycol monomethyl ether, propylene glycol Propylene glycol alkyl ethers such as monoethyl ether; Ethylene glycol monoalkyl ether acetates such as ethylene glycol monomethyl ether acetate and ethylene glycol monoethyl ether acetate; Propylene glycol monomethyl ether acetate and propylene glycol monoethyl ether Propylene glycol monoalkyl ether acetates such as Le acetate; and the like.

Specific examples of the ether solvent include tetrahydrofuran.
Specific examples of the ester solvent include ethyl acetate, n-butyl acetate, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, methyl lactate, ethyl lactate, and γ-butyrolactone.
Specific examples of the hydrocarbon solvent include aromatic hydrocarbons such as toluene and xylene.
Specific examples of the ketone solvent include methyl ethyl ketone, 2-heptanone, cyclohexanone and the like.
Specific examples of the amide solvent include N, N-dimethylacetamide, N-methylpyrrolidone and the like.
Specific examples of the lactone solvent include γ-butyrolactone.
These solvent may be used individually by 1 type, and may be used in combination of 2 or more type.

The positive photosensitive resin composition used in the present invention may contain an adhesion promoter.
Specific examples of the adhesion promoter include melamine adhesion promoter, silane adhesion promoter and the like.
The melamine adhesion promoter is not particularly limited. For example, Cymel (registered trademark) 300 and 303 manufactured by Nippon Cytec Industries, Inc., MW-30MH, MW-30, MS-11, MS-001, MX manufactured by Sanwa Chemical Co., Ltd. -750, MX-706 and the like.
The blending amount of the melamine adhesion promoter is preferably 0.1 to 20 parts by mass, more preferably 0.5 to 18 parts by mass with respect to 100 parts by mass of the alkali-soluble resin (A). More preferably, it is 1-15 mass parts.

The silane adhesion promoter is not particularly limited. For example, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (2-methoxyethoxy) silane, N- (2-aminoethyl) -3-aminopropylmethyldimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3 4-epoxycyclohexyl) ethyltrimethoxysilane, 3-chloropropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane and the like.
The blending amount of the silane adhesion promoter is preferably 0.0001 to 2 parts by mass, more preferably 0.001 to 1 part by mass with respect to 100 parts by mass of the alkali-soluble resin (A). More preferably, it is 0.005-0.8 mass part.

The positive photosensitive resin composition used in the present invention may contain a surfactant. Generation | occurrence | production of the coating nonuniformity in a coating film can be prevented by mix | blending surfactant.
As the surfactant, a nonionic surfactant is suitable. Specific examples thereof include silicone surfactants, fluorine surfactants, polyoxyalkylene surfactants, and the like.
Examples of the silicone surfactant include polyether-modified silicone oil. This polyether-modified silicone oil includes SF8410, SF8427 (product of Toray Dow Corning), KP321, KP323 (product of Shin-Etsu Silicone), TSF400, TSF401, TSF410, TSF4440, TSF4445, TSF4446 (product of GE Toshiba Silicone) ) And the like.
Fluorosurfactants include Fluorinert FC-430, FC-431, FC-472 (Sumitomo 3M product), Surflon S-141, S-145, S-381, S-393 etc. (Asahi Glass product), Ftop (registered trademark) EF301, EF303, EF351, EF352, etc. (Gemco products), MegaFac (registered trademark) F171, F172, F173, R-30, etc. (Dainippon Ink Chemical Co., Ltd. products) etc. Yes.
Examples of silicone surfactants having a fluorocarbon chain include Megafac (registered trademark) R08, F470, F471, F472SF, F475 (Dainippon Ink & Chemicals, Inc.).
Specific examples of the polyoxyalkylene surfactant include, for example, polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octyl phenyl ether, polyoxyethylene nonyl phenyl ether, polyethylene glycol dilaurate And polyethylene glycol distearate.

  The positive photosensitive resin composition used in the present invention contains additives such as a sensitizer, an antifoaming agent and an anti-aging agent in addition to the adhesion promoter and surfactant as long as the effect is not impaired. May be.

  The solid content concentration of the positive photosensitive resin composition used in the present invention is preferably 6 to 35% by mass, more preferably 7 to 30% by mass, and 8 to 25% by mass. Further preferred. By setting the solid content concentration within the above range, a uniform coating film can be formed without causing coating unevenness.

  The method for preparing the positive photosensitive resin composition used in the present invention is not particularly limited, and the components (A) to (C) and each compound to be added as necessary are dissolved in the solvent (D). That's fine.

There are no particular restrictions on the material of the substrate that can be used in the present invention, and any of a glass substrate; a plastic substrate such as polyethylene terephthalate or polyimide; a silicon substrate such as a silicon wafer;
In the photosensitive resin composition film forming step (I), the method for applying the positive photosensitive resin composition onto the substrate is not particularly limited. For example, spraying, roll coating, spin coating, slit and spin Method, spinless slit method, and the like. Among these, the spinless slit method can be preferably used.
According to the spinless slit method, the positive photosensitive resin composition can be applied without moving the slit that contacts the substrate by moving the slit that supplies the positive photosensitive resin composition.
For application by spinless slit method, spinless coater manufactured by Tokyo Ohka Kogyo Co., Ltd., table coater manufactured by Chugai Furnace Industry Co., Ltd., linear coater manufactured by Dainippon Screen Mfg. Co., Ltd., head coater manufactured by Hirata Kiko Co., Ltd., manufactured by Toray Engineering Co., Ltd. Slit die coater, Toray slit coater manufactured by Toray Industries, Inc. can be used.

  As for the thickness of the positive photosensitive resin composition film formed on the substrate, the thickness of the photosensitive resist film formed in the next step is usually 0.5 to 5 μm, preferably 0.8 to 4 μm. Such a thickness is sufficient.

In the resist pattern forming method of the present invention, the positive photosensitive resin on the substrate formed in the photosensitive resin composition film forming step (step (I)) in step (II) following step (I). The composition film is dried by heating after drying under reduced pressure. By this step (II), the fluidity of the positive photosensitive resin composition film on the substrate is substantially lost.
The drying under reduced pressure is performed so that the final ultimate pressure is preferably 5 to 4,000 Pa, more preferably 10 to 2,000 Pa, and still more preferably 15 to 1,000 Pa. Moreover, it is preferable that it is 3 to 300 seconds, it is more preferable that it is 5 to 180 seconds, and it is further more preferable that it is 10 to 120 seconds until it reaches the final ultimate pressure from pressure reduction start.

After drying under reduced pressure, the positive photosensitive resin composition film on the substrate is further heated and dried (prebaked).
Heat drying can be normally performed at 60-120 degreeC using a hotplate, oven, etc. under a normal pressure. The heating time in this heat drying is preferably 40 to 300 seconds, more preferably 45 to 230 seconds, and still more preferably 50 to 200 seconds.
A photosensitive resist film is formed on the substrate after heat drying, and the thickness of the resist film is usually 0.5 to 5 μm, preferably 0.8 to 4 μm.

Next, in step (III), the photosensitive resist film on the substrate obtained in step (II) is exposed with actinic rays through a pattern mask to form a latent image pattern in the photosensitive resist film, and then The latent image pattern is developed to form a resist pattern.
There are no particular limitations on the active light that can be used in the pattern forming method of the present invention, and any of visible light, ultraviolet light, far ultraviolet light, X-rays, and the like may be used. Among them, visible light and ultraviolet light can be preferably used. .
There is no restriction | limiting in particular in the light quantity irradiated to a photosensitive resist film, According to the intended purpose, thickness, etc. of a photosensitive resist film, it can select suitably.

Next, a resist pattern is formed by developing the latent image pattern formed by exposure.
There is no particular limitation on the developer (alkaline developer) used for developing the latent image pattern. Specific examples thereof include aqueous solutions of tetramethylammonium hydroxide, sodium carbonate, sodium hydrogen carbonate, sodium hydroxide, potassium hydroxide and the like. The concentration of these developers is preferably from 0.1 to 5% by mass.
After developing the latent image pattern, the resist pattern on the formed substrate is preferably washed with, for example, pure water to remove a developer residue and then air-dried with compressed air or compressed nitrogen.
If desired, the obtained resist pattern may be heated (post-baked). Post baking can be performed using a heating device such as a hot plate or an oven. The heating temperature is preferably 100 to 250 ° C., and the heating time is about 2 to 60 minutes on the hot plate and about 2 to 90 minutes in the oven.

Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples. In this example, parts and% are based on mass unless otherwise specified.
The taper angle of the resist pattern was measured as follows.
(Measurement method of taper angle of resist pattern)
The film thickness (Z) of each pattern part is measured using an optical film thickness meter (Dainippon Screen Mfg. Co., Ltd., trade name “VM-1200”) having a spot diameter of 5 μm. Further, the cross-sectional shape of the pattern is observed with an SEM (scanning electron microscope), and the width of the resist pattern uppermost portion (X1) and the width of the bottom portion (portion in contact with the substrate) (X2) are measured.
From the difference (X1−X2) between the width (X1) of the top part of the resist pattern and the width (X2) of the bottom part and the film thickness (Z) obtained by the optical film thickness meter, the taper angle is calculated using the following formula: (Θ) is obtained.
When the taper angle is less than 90 °, the resist pattern has a forward taper (the width (X1) at the top of the resist pattern is smaller than the width (X2) at the bottom), and when the taper angle exceeds 90 °, a reverse taper ( The width (X1) at the top of the resist pattern is larger than the width (X2) at the bottom. When the taper angle is 90 °, the width (X1) at the top of the resist pattern is equal to the width (X2) at the bottom.
θ = 90 + arctan ((X1−X2) / (2 × Z))

[Example 1]
A reaction vessel is charged with m-cresol and p-cresol in a 50/50 ratio, dehydrated and condensed with formaldehyde using oxalic acid as a catalyst to synthesize a novolak resin having a mass average molecular weight of 5,000 and used as an alkali-soluble resin. It was.
97 parts of an alkali-soluble resin, 20 parts of an ester of 1,2-naphthoquinonediazide-5-sulfonic acid chloride and 2,3,4,4′-tetrahydroxybenzophenone (esterification rate 75 mol%) as a quinonediazide compound, triazole Compound (C-11) 5 parts, melamine adhesion promoter (manufactured by Nippon Cytec Industries, trade name “Cymel 303”) and surfactant (Dainippon Ink & Chemicals, trade name “Megafuck R-”) 08 ") 300 ppm was dissolved in 680 parts of propylene glycol monomethyl ether acetate to prepare a positive photosensitive resin composition (1).
Using a spinner, the positive photosensitive resin composition (1) was applied onto a glass substrate to form a coating film of the positive photosensitive resin composition (1). This was dried under reduced pressure under conditions of an ultimate pressure of 26 Pa and a treatment time of 25 seconds, and then prebaked at 110 ° C. for 150 seconds using a hot plate. The thickness of the photosensitive resist film after pre-baking was 2.3 μm.
This photosensitive resist film was exposed using a mirror projection aligner. As a mask, a mask in which 10 μm lines and 10 μm spaces were alternately included was used. Subsequently, paddle development was performed at 23 ° C. for 60 seconds using a 2.38% tetramethylammonium hydroxide aqueous solution to form a resist pattern.
The taper angle of this resist pattern was measured. The results are shown in Table 1.

[Example 2]
A positive photosensitive resin composition was prepared in the same manner as in Example 1 except that the amount of the triazole compound (C-11) was 0.3 part, and a resist pattern was formed therefrom, and the taper angle was evaluated. Was done. The results are shown in Table 1.

Example 3
A positive photosensitive resin composition was prepared in the same manner as in Example 1 except that the triazole compound (C-21) was used instead of the triazole compound (C-11), and a resist pattern was formed therefrom. The taper angle was evaluated. The results are shown in Table 1.

[Comparative Example 1]
A positive photosensitive resin composition was prepared in the same manner as in Example 1 except that the triazole compound (C) was not blended. A resist pattern was formed therefrom, and the taper angle was evaluated. The results are shown in Table 1.

  As shown in Table 1, when a positive photosensitive resin composition not containing the specific triazole compound (C) defined in the present invention was used, the taper angle of the resist pattern was 96 ° (Comparative Example 1). Inverted taper. On the other hand, when the positive photosensitive resin composition containing the specific triazole compound (C) defined in the present invention is used, the taper angle of the resist pattern is less than 90 ° (Examples 1 to 3) It is a forward taper shape.

  According to the resist pattern forming method using the novel positive photosensitive resin composition of the present invention, it is possible to efficiently form a resist pattern that is not reverse-tapered even under reduced pressure drying conditions where the ultimate vacuum or reduced pressure rate is higher than usual. Can do. A substrate having a resist pattern formed in this manner is useful for manufacturing a thin film transistor substrate, for example.

It is explanatory drawing of a forward taper shape (a) and a reverse taper shape (b).

Explanation of symbols

X1: width of resist pattern top part X2: width of resist pattern bottom side part (part in contact with substrate) Z: thickness of resist pattern

Claims (4)

Step (I): containing (A) an alkali-soluble resin, (B) a quinonediazide compound, (C) a triazole compound represented by the following general formula (C-1) or (C-2), and (D) a solvent. Applying a positive photosensitive resin composition to the substrate to form a positive photosensitive resin composition film on the substrate;
Step (II): A step of drying the positive photosensitive resin composition film obtained in Step (I) under reduced pressure under a condition of an ultimate pressure of 5 to 4,000 Pa, followed by heat drying to form a photosensitive resist film. And Step (III): A resist pattern forming method comprising a step of pattern-exposing the photosensitive resist film formed in Step (II) and then developing to form a resist pattern.

Wherein R ¹¹ and R ¹² are each a hydrogen atom, a hydroxy group, an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, an alkoxycarbonylethyl group having 1 to 12 carbon atoms, or α, an α-dimethylbenzyl group, and at least one of R ¹¹ and R ¹² is an α, α-dimethylbenzyl group or an alkoxycarbonylethyl group having 1 to 12 carbon atoms, and R ¹³ is a hydrogen atom or a halogen atom. .)

(Wherein R ²¹ represents a hydrogen atom, a hydroxy group, an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, or an acyl group, and R ²² and R ²³ represent a hydrogen atom, a halogen atom, respectively. Atom, hydroxy group, alkyl group having 1 to 12 carbon atoms, alkoxyl group having 1 to 12 carbon atoms, acyl group, amino group, amino group substituted with an alkyl group having 1 to 12 carbon atoms, 1 to 12 carbon atoms An amino group or a nitro group substituted with an alkoxy group, at least one of which is a halogen atom, a methyl group, an amino group, or a nitro group.   The compounding quantity of the triazole compound represented by general formula (C-1) or (C-2) is 0.1-30 mass parts with respect to 100 mass parts of alkali-soluble resin (A). Resist pattern forming method.   The resist pattern forming method according to claim 1 or 2, wherein the heat drying in the step (II) is performed for 40 to 300 seconds.   The resist pattern obtained by the resist pattern formation method of any one of Claims 1-3.

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