TW201249657A - Imprinting apparatus - Google Patents

Imprinting apparatus Download PDF

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Publication number
TW201249657A
TW201249657A TW101104616A TW101104616A TW201249657A TW 201249657 A TW201249657 A TW 201249657A TW 101104616 A TW101104616 A TW 101104616A TW 101104616 A TW101104616 A TW 101104616A TW 201249657 A TW201249657 A TW 201249657A
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TW
Taiwan
Prior art keywords
stamper
holding member
substrate
pressure
ultraviolet
Prior art date
Application number
TW101104616A
Other languages
Chinese (zh)
Inventor
Takahiro Suzuki
Shuuyou Akama
Original Assignee
Bridgestone Corp
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Publication date
Application filed by Bridgestone Corp filed Critical Bridgestone Corp
Publication of TW201249657A publication Critical patent/TW201249657A/en

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    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/855Coating only part of a support with a magnetic layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023Microembossing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0888Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

Provided is an imprinting apparatus such that fluctuation in the dimensions of a stamper due to heat is prevented, and manufacturing cost is reduced. The imprinting apparatus (10) positions a stamper (56) having a recess/protrusion pattern at the surface thereof over an ultraviolet-curable resin material (54) supplied on a substrate (52), presses the stamper (56) by using fluid to apply pressure to the back face of the stamper (56), cures the ultraviolet-curable resin material (54) by irradiating ultraviolet rays thereupon, and forms a recess/protrusion pattern on the surface of the substrate (52). The imprinting apparatus is characterized by comprising a holding member (14) that holds the substrate (52), and a pressure- resistant body (12) facing the holding member (14), said pressure-resistant body (12) being provided with, on the bottom section thereof, LEDs (16) for irradiating ultraviolet rays upon the ultraviolet-curable resin material (54), and the bottom section of the pressure-resistant body (12) and the holding member (14) being arranged in opposition to each other.

Description

201249657 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種壓 防止壓模因受熱而尺寸缴/ ’尤其係關於一種可 裝置。 、氟造成本可縮減之壓印 【先前技術】 近年來’做為半導辦_ 錄媒體、生化晶片、光-^ :顯不器、電子紙、記 案之技術,已知有奈Ί中用以形成微細圖 於以往之壓製技術,、=印Ϊ術。奈米壓印技術相較 X技術。此技術本身在解構造之微細加 由懕媒f亦即金!始目、析度並無極限,解析度係 由,(亦即金屬Μ具)之製作精度所決 能製作高精度之壓模,目、, 疋而/、要 '則相較於以往之光微影能更容 易以甚為廉價之裝置來形成極微細構造。 壓印技術隨受轉印材料而大致區分為2種類。其 中-者係將受轉印之材料料加熱,利用壓模(金屬模 -)使其塑性變形後’再冷卻形成圖案之熱壓印技術。 另一者係於基板上塗佈於室溫下為液狀之光硬化性樹 脂之後’將透光性壓模壓抵於樹脂並照光來使得基板 上之樹脂硬化而形成圖案之UV壓印技術。尤其UV 壓印技術由於可在室溫形成圖案,不易因為熱導致基 &'壓模間之線膨脹係數差而發生變形,可得到高精 度之圖案形成,做為半導體等微影技術的替代技術受 201249657 到矚目。 用以進行UV壓印之裝置已知有例如圖2所記載 之壓印裝置。此壓印裝置1〇〇主要具有:保持構件 U4 ’用以將被供給有紫外線硬化樹脂材料154的基板 U2加以保持;石英玻璃118,係被支撐體116所支撐 著;以及UV燈120。於紫外線硬化樹脂材料154上載 置壓模(金屬模具)156,對由石英玻螭118、支撐體 116、設置於支撐體116下部之密封材122以及裝設在 密封材122的可撓性膜124所構成之空腔(cavity)i26, 從流體供給排放管128來供給空氣等流體來抵壓壓模 156上面,從水銀燈等UV燈120照射會外線,使得紫 外線硬化樹脂材料154硬化以於基板152上形成微細 的凹凸圖案。由於使用流體來抵壓,故能以均勻壓力 來將壓模156抵壓於紫外線硬化樹脂材料154<>是以, 主要被使用在難以利用均勻壓力來抵壓之大面積的壓 印上。 做為均勻抵壓壓模之手段,尚有為熱壓印所使用 之裝置’但不使用可撓性膜而是以氣體來直接對壓模 進行抵壓之壓印裝置(專利文獻】)。 先前技術文獻 專利文獻1日本特開2〇〇9- 154393號公報 【發明内容】 但是,圖2 所記栽之裴置受到UV燈(光源)120之 201249657 影響’於UV壓印時,壓模156之溫度會上升造成尺 寸變化,有時無法於基板152上形成精確的凹凸圖 案。此對於長距離間距的情況、或是使用容易受到熱 影響之樹脂製壓模的情況尤其成為問題。此外,必須 使用厚度能承受流體加壓的石英玻璃(通常為5cm以 上),而有製造成本高的問題。 本發明有鑑於上述情事,其目的在於提供一種壓 印裝置,可防止壓印時壓模之尺寸變化、縮減製造成 本。 上述目的可藉由下述壓印裝置來達成,此壓印裝 置係將表面具有凹凸圖案之壓模以該凹凸圖案表面密 接於被供給至基板上之紫外線硬化樹脂材料上的方式 來配置’並使用流體來加壓該壓模之背面以抵壓該壓 模,於該抵壓狀態下對該紫外線硬化樹脂材料照制 外線來使得該紫外線硬化樹脂材料產生硬化,而於 基板表面形成該凹凸圖案之倒轉凹凸圖案;其特德 於’該壓印裝置係具有:保持該基板之保持構件、 及對向於該保持構件之耐壓體;該耐壓體於其底^ 備有對該紫外線硬化樹脂材料照射紫外線之Led°, 該耐壓體之底部與該㈣構件係 配置著。 乃灸 舣优用二水銀燈等υν燈,來自燈本』 發熱多,此外,會伴隨產生&外線,故成為壓模 上升的原因。LED㈣嫌其他紫外線紐,來自^ 6 201249657 之發熱少,且不會伴隨產生紅外線,故光源若使用LED 可防止壓模之溫度上升。此外,LED相較於水銀燈等 UV燈在耐壓方面也優異,當於耐壓體之底部收納LED 之際,無須設置石英玻璃等透明板,可縮減壓印裝置 之製造成本。 此外,亦可設置透明板,於此情況下,施加於透 明板之壓力可連同LED由耐壓體所承受,故透明板以 薄厚度者及足夠,不僅可縮減裝置之製造成本’且由 保持構件與耐壓體所形成之空間内的流體流動會成為 更為穩定,歷模能以更固定壓力來加壓。 本發明之較佳樣態如下。 (1) 於該耐壓體與該保持構件之至少一者設有冷 卻機構。 即便溫度上升,仍可藉由冷卻機構來防止壓模之 溫度上升。 (2) 於該耐壓體與該保持構件之至少一者設有溫 度計;並設有藉由該溫度計與該冷卻機構來進行溫度 控制之控制部。 可經常性監視壓印裝置之溫度變化而維持於一定 溫度。 (3) 於該耐壓體設有隔熱機構。 可防止熱擴散至裝置全體。 (4) 該壓模為樹脂製壓模。 · 本發明尤其適用於使用熱尺寸變化相對大之樹脂 201249657 製壓模的壓印。 依據本發明之壓印裝置’ 上升、可抑制尺寸變化,故可:二壓模因熱而溫度 地形成微細的凹凸圖案’此外,:二 可縮減製造成本。從而,可提供-種壓印裝置^ 於需要高尺寸精度之用途上、並可提高生產性。 【實施方式】 以下’針對本發明參見圖來詳細地說明。圖 1 員示本發明之麗㈣置之實施形態—例的概略截面 ®。本發明之壓印聚置10主要構成包括:耐 :系將咖6收容於底部;以及保持構件14, 二52。對於以片狀方式供給於基板52上之紫外線^ 化樹脂材料54來配购56後,將壓模% 而)以流體供給管3〇所供給之越做減,維持此狀 態下由LED16照射紫外線產生硬化而於基板52上形 戍凹凸圖案。以下,針對各構成分別詳細朗。^ 耐壓體12係具有耐得住後述流體加壓的剛性之 擤件,由例如SUS等所構成,其形狀係形成為大致長 f體狀。於耐壓體丨2之底部12a形成有凹部l2c,底 哗12a係設定成加壓時不會接觸於膜34之高度。此 外’於其凹# 12c亦可設置穿透紫外線之透明板2〇。 此透明板20之下面施係經由後述膜34來和保持構 件14之上面(基板保持面)14a呈對向設置,透明板2〇 201249657 係設定成加壓時不會接觸於臈34之古声 且備=二之底部12&所形成::部以係設有 具㈣外=射用LED(發光二 18,刪6係朝向下方來配置。於LED基板18 ^ 側面18a’凹部19係以一定間隔來形成,於此凹部η ^有L^H6。藉此,LEm6以截面來㈣致從哪 基板18 X出而構成。此外,#如圖讀設置透明板 20之情況’面l8a之凹部19以外的區域係和透明板 2〇之上面呈接觸對向,藉此,施加於透明板20之壓 力可同对壓體12來承受。是以,所使用之透明板20 的厚度只要為例如薄至3〜5_即可,並無須如以往般 設置厚的透明板(石英玻璃卜在透明板Μ方面只要可 穿透紫外線且具有某難度難即可,可❹例如石 英玻璃。一旦紫外線自LED16射出,會穿透透明板2〇 而照射於紫外線硬化樹脂材料54。 LED16之數量只要是可照射紫外線來使得紫外 線硬化樹脂材料54產生硬化之數量即可,例如每 10cm2具備至少9〜81個’紫外線照射量只要為例如 300mJ/cm2以上即可。此外,LED16係以可對紫外線 硬化樹脂材料54均勻地照射紫外線之方式以一定間 隔來配置著。LED16為可照射紫外線之LED ,係使用 可照射例如200〜400nm、較佳為300〜4〇0nm之波長的 LED。 保持構件14係由具有剛性之材質例如sus等所 201249657 構成,其形狀係形成為大致長方體狀。㈣以其上 面Ha來將棊板52加以水平保持著。 於耐愿體12以及保持構件14之内部設有冷媒管 24做為流通冷媒之冷卻機構。冷媒管24於耐壓體12 係设置於LED基板18之附近,於保持構件14係設置 於基板保持面14a之附近。冷媒可使用水、油等液體 或空氣或惰性氣體等氣體。藉此,即便led基板18 生熱,也可確實防止壓模56之尺寸變化。 於耐壓體12以及保持構件14分別設有用以測定 其内。卩/jnt度的溫度計28。溫度計28於耐壓體12以測 定LED基板18附近溫度的方式來設置為佳,於保持 構件14以測定保持基板52之面14a附近的溫度的方 式來設置為佳。此外,於本發明之壓印裝置1〇係設有 藉由冷卻機構24以及溫度計28來進行耐壓體12以及 保持構件14之溫度控制的控制部(未圖示)。藉此,於 壓印裝置10之運轉時,可經常維持一定溫度。 此外,於耐壓體12内部且為LED基板18之外侧 位置設有隔熱材26做為隔熱機構。藉由設置隔熱材 26 ’可防止熱擴散至裝置1〇全體。隔熱材26可彳吏用 例如聚胺基曱酸酯、酚醛樹脂等發泡體或玻璃棉、擴 石棉等纖維系隔熱材。隔熱材亦可設置於保持構件14 之内部。 於耐壓體12之下面12a外周上設有〇型環密封 材等密封材22。於密封材22裝設有具可撓性之膜, 201249657 藉此形成供給流體之空腔36。 膜34必須為由可穿透紫外線之材料所構成,例如 由聚乙烯、聚丙烯、聚對苯二曱酸乙二醇酯、聚碳酸 酯、PMMA、聚環烯烴、氟系樹脂等薄膜所構成,厚 度係設定為例如50μιη〜5mm、較佳為i〇〇pm〜3mm之 厚度。 空腔36係從設置在耐壓體12之流體供給排放管 30被供給流體,成為空腔36内受到加壓之構成。此 流體可使用例如空氣、氮氣、二氧化碳、氬等。藉由 流體來加壓空腔36 β可對於壓模56之背面以均句壓 力來抵壓’在抵壓狀態下將紫外線照射於紫外線硬化 樹脂材料54。 雖未圖示,於耐壓體12與保持構件14當中至少 -者設置可上下移動之上下移動機構,於抵壓時來調 整耐壓體12與保持構件14之間隔。 於本實施n對壓模56賦^抵壓力之機構雖舉 出經由膜34來以流體做間接性抵壓的例子,惟不限定 於此’亦可如專利文獻1所記載般不㈣膜而是以流 體來,接抵壓之構成。於此情況,㈣係使用空氣、 惰性氣體等氣體。 於本發月中,用以於基板52形成所希望圖案的壓 模56可使料有紫外線穿透性之以往周知的壓模。具 體而°可使用例如石英玻璃、樹脂等。樹脂製壓模係 使用由聚乙烯、聚丙缚、聚環烯煙、1系樹脂、聚氣 201249657 型性佳的樹脂所製作之壓模。如上述般,, :可將壓印裝置全體之溫度維持 發明之壓印裝置褕m 疋,故本201249657 VI. Description of the Invention: [Technical Field] The present invention relates to a pressure-preventing stamper which is dimensionally charged by heat, and is particularly concerned with an apparatus. Fluorine caused by the reduction of the imprinting [prior art] In recent years, as a semi-guided _ recording media, biochemical wafers, light-^: display, electronic paper, documentary technology, known as Naizhongzhong Used to form micrographs in the past, pressing technology, = printing. Nano imprint technology is better than X technology. The technology itself is in the deconstruction of the structure plus the media f, that is, gold! There is no limit to the starting point and the degree of resolution. The resolution is determined by the precision of the production of metal cookware. It is possible to produce high-precision stampers, which can be compared with the light of the past. Micro-shadows make it easier to form very fine structures with very inexpensive devices. The imprint technique is roughly classified into two types depending on the material to be transferred. Among them is a hot stamping technique in which a material to be transferred is heated, and plasticized by a stamper (metal mold) to re-cool and form a pattern. The other is a UV imprint technique in which a light-transmissive resin which is liquid at room temperature is applied to a substrate, and a resin is pressed against the resin to illuminate the resin on the substrate to form a pattern. In particular, UV imprinting technology can form a pattern at room temperature, and it is not easy to be deformed due to the difference in linear expansion coefficient between the base and the stamper due to heat, so that high-precision pattern formation can be obtained as an alternative to lithography such as semiconductor. Technology received attention from 201249657. An apparatus for performing UV imprinting is known, for example, as the imprint apparatus described in Fig. 2. This imprint apparatus 1b mainly has a holding member U4' for holding the substrate U2 to which the ultraviolet curable resin material 154 is supplied, quartz glass 118 supported by the support 116, and a UV lamp 120. A stamper (metal mold) 156 is placed on the ultraviolet curable resin material 154, and the quartz glass bottle 118, the support body 116, the sealing material 122 provided on the lower portion of the support body 116, and the flexible film 124 attached to the sealing material 122 are placed. The cavity i26 is configured to supply a fluid such as air from the fluid supply discharge pipe 128 to press the upper surface of the stamper 156, and irradiate the outer line from the UV lamp 120 such as a mercury lamp, so that the ultraviolet curable resin material 154 is hardened to the substrate 152. A fine concavo-convex pattern is formed on the upper surface. Since the fluid is used for pressing, the stamper 156 can be pressed against the ultraviolet curable resin material 154 with a uniform pressure. > is mainly used for printing on a large area which is difficult to be pressed by uniform pressure. As a means for uniformly pressing the stamper, there is a device for hot stamping, but an imprint apparatus that directly presses a stamper with a gas without using a flexible film (Patent Document). [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei 2- No. 9-154393. SUMMARY OF THE INVENTION However, the device of FIG. 2 is affected by the influence of 201249657 of a UV lamp (light source) 120. The temperature of 156 rises to cause dimensional changes, and sometimes it is impossible to form a precise concave-convex pattern on the substrate 152. This is particularly problematic in the case of a long distance pitch or in the case of using a resin stamper which is susceptible to heat. In addition, it is necessary to use quartz glass (usually 5 cm or more) which is capable of withstanding the pressure of the fluid, and has a problem of high manufacturing cost. SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to provide a printing apparatus which can prevent a dimensional change of a stamper during imprinting and reduce a manufacturing cost. The above object can be attained by a stamping apparatus in which a stamper having a concave-convex pattern on the surface is disposed in such a manner that the surface of the uneven pattern is adhered to the ultraviolet curable resin material supplied onto the substrate. The fluid is used to pressurize the back surface of the stamper to press the stamper, and the ultraviolet curable resin material is irradiated to the outer line in the pressed state to harden the ultraviolet curable resin material, and the concave and convex pattern is formed on the surface of the substrate. The inverted concave-convex pattern; the embossing device has: a holding member for holding the substrate, and a pressure-resistant body facing the holding member; the pressure-resistant body is provided with the ultraviolet curing at the bottom thereof The resin material is irradiated with Led° of ultraviolet rays, and the bottom of the pressure-resistant body and the (four) member are disposed. Moxibustion 舣 Excellent use of 水 灯 灯 , , , , , , , , 』 』 』 』 』 』 』 』 』 』 』 』 』 』 』 』 』 』 』 』 』 』 』 』 』 』 』 』 LED (4) is suspected of other UV rays, and the heat generated from ^ 6 201249657 is not accompanied by the generation of infrared rays. Therefore, if the light source uses LEDs, the temperature of the stamper can be prevented from rising. Further, the LED is excellent in pressure resistance compared to a UV lamp such as a mercury lamp, and when the LED is housed at the bottom of the pressure-resistant body, it is not necessary to provide a transparent plate such as quartz glass, and the manufacturing cost of the reduced-pressure printing device can be reduced. In addition, a transparent plate may be provided. In this case, the pressure applied to the transparent plate may be withstand by the pressure-resistant body, so that the transparent plate is sufficient to reduce the manufacturing cost of the device. The fluid flow in the space formed by the member and the pressure-resistant body becomes more stable, and the calendar can be pressurized with a more fixed pressure. Preferred aspects of the invention are as follows. (1) A cooling mechanism is provided to at least one of the pressure-resistant body and the holding member. Even if the temperature rises, the temperature of the stamper can be prevented from rising by the cooling mechanism. (2) A temperature meter is provided to at least one of the pressure-resistant body and the holding member, and a control unit that performs temperature control by the thermometer and the cooling mechanism is provided. The temperature change of the imprint apparatus can be constantly monitored to maintain a certain temperature. (3) A heat insulating mechanism is provided in the pressure resistant body. It prevents heat from spreading to the entire device. (4) The stamper is a resin stamper. The present invention is particularly suitable for use in the imprinting of a resin having a relatively large thermal dimensional change 201249657. According to the imprint apparatus of the present invention, the dimensional change can be suppressed, so that the two stampers can form a fine concavo-convex pattern by temperature due to heat. In addition, the manufacturing cost can be reduced. Therefore, it is possible to provide an imprint apparatus which can be used for applications requiring high dimensional accuracy and can improve productivity. [Embodiment] Hereinafter, the present invention will be described in detail with reference to the drawings. Fig. 1 shows a schematic cross section of an embodiment of the present invention. The main structure of the embossing and stacking 10 of the present invention includes: resistance to: holding the coffee 6 to the bottom; and holding members 14, two 52. When 56 is dispensed from the ultraviolet ray resin material 54 supplied to the substrate 52 in a sheet form, the pressure of the mold is reduced by the supply of the fluid supply tube 3, and the ultraviolet light is irradiated by the LED 16 while maintaining the state. Hardening is generated to form a concave-convex pattern on the substrate 52. Hereinafter, each configuration is described in detail. The pressure-resistant body 12 is a member which is resistant to the rigidity of the fluid to be described later, and is made of, for example, SUS or the like, and its shape is formed into a substantially long f-shape. A recess 12c is formed in the bottom portion 12a of the pressure-resistant body 2, and the bottom 12a is set so as not to contact the height of the film 34 when pressurized. In addition, the transparent plate 2 穿透 which penetrates the ultraviolet ray can also be disposed in the concave portion # 12c. The lower surface of the transparent plate 20 is disposed opposite to the upper surface (substrate holding surface) 14a of the holding member 14 via the film 34 to be described later, and the transparent plate 2〇201249657 is set so as not to be in contact with the old sound of the crucible 34 when pressurized. And the bottom portion of the second and the second is formed by: the fourth part is provided with (4) outer = shooting LED (lighting two 18, the deletion 6 is oriented downward). The concave portion 19 is fixed on the LED substrate 18 ^ side 18a' The recesses η ^ have L^H6. Thereby, the LEm 6 is formed by the substrate 18 X from the cross section (4). Further, # is as shown in the case where the transparent plate 20 is read, the recess 19 of the surface l8a. The other regions are in contact with the upper surface of the transparent plate 2, whereby the pressure applied to the transparent plate 20 can be received by the pressing body 12. Therefore, the thickness of the transparent plate 20 used is, for example, thin. To 3~5_, it is not necessary to set a thick transparent plate as in the past (quartz glass is only required to penetrate the ultraviolet rays in the transparent plate and has difficulty in some difficulty, such as quartz glass. Once the ultraviolet light is from LED16 When it is ejected, it will penetrate the transparent plate 2〇 and be irradiated to the ultraviolet curable resin material 54. The number of the LEDs 16 may be such that the ultraviolet curable resin material 54 can be cured by irradiation with ultraviolet rays, for example, at least 9 to 81 per 10 cm 2 . The ultraviolet irradiation amount may be, for example, 300 mJ/cm 2 or more. The LEDs 16 are arranged to be capable of illuminating the ultraviolet curable resin material 54 at a predetermined interval. The LEDs 16 are LEDs that can emit ultraviolet rays, and are used to emit LEDs having a wavelength of, for example, 200 to 400 nm, preferably 300 to 4 〇 0 nm. The holding member 14 is made of a material having rigidity such as SUS et al. 201249657, and its shape is formed into a substantially rectangular parallelepiped shape. (4) The seesaw 52 is horizontally held by the upper surface Ha. The resistant body 12 and the holding member 14 are held horizontally. The refrigerant pipe 24 is provided as a cooling mechanism for circulating a refrigerant. The refrigerant pipe 24 is provided in the vicinity of the LED substrate 18 in the pressure-resistant body 12, and is provided in the vicinity of the substrate holding surface 14a in the holding member 14. The refrigerant can use water. A liquid such as oil or a gas such as air or an inert gas, whereby even if the led substrate 18 generates heat, the dimensional change of the stamper 56 can be surely prevented. 12 and the holding member 14 are respectively provided with a thermometer 28 for measuring the inside 卩/jnt degree. The thermometer 28 is preferably provided in the pressure-resistant body 12 so as to measure the temperature in the vicinity of the LED substrate 18, and the holding member 14 is used for measuring and holding the substrate. The temperature in the vicinity of the surface 14a of the surface 52 is preferably set. Further, in the imprint apparatus 1 of the present invention, the temperature control of the pressure body 12 and the holding member 14 is performed by the cooling mechanism 24 and the thermometer 28. A control unit (not shown), whereby a constant temperature can be maintained during the operation of the imprint apparatus 10. Further, a heat insulating material 26 is provided inside the pressure-resistant body 12 at a position outside the LED substrate 18 as a heat insulating mechanism. By providing the heat insulating material 26', heat can be prevented from diffusing to the entire apparatus 1. The heat insulating material 26 can be used, for example, a foam such as polyamine phthalate or phenol resin, or a fiber heat insulating material such as glass wool or expanded cotton. The heat insulating material may be disposed inside the holding member 14. A sealing member 22 such as a ring-shaped ring seal member is provided on the outer periphery of the lower surface 12a of the pressure-resistant body 12. A flexible film is attached to the sealing material 22, and 201249657 thereby forms a cavity 36 for supplying fluid. The film 34 must be composed of a material that can penetrate ultraviolet rays, for example, a film composed of polyethylene, polypropylene, polyethylene terephthalate, polycarbonate, PMMA, polycycloolefin, fluorine resin, or the like. The thickness is set to, for example, a thickness of 50 μm to 5 mm, preferably i 〇〇 pm to 3 mm. The cavity 36 is supplied with a fluid from the fluid supply and discharge pipe 30 provided in the pressure-resistant body 12, and is pressurized in the cavity 36. For this fluid, for example, air, nitrogen, carbon dioxide, argon or the like can be used. The cavity 36 is pressurized by the fluid to be pressed against the back surface of the stamper 56 with a uniform pressure. The ultraviolet ray is irradiated to the ultraviolet curable resin material 54 in a pressed state. Although not shown, at least one of the pressure-resistant body 12 and the holding member 14 is provided with a vertically movable upper and lower moving mechanism, and the interval between the pressure-resistant body 12 and the holding member 14 is adjusted at the time of pressing. In the embodiment, the mechanism for applying pressure to the stamper 56 is an example in which the fluid is indirectly pressed through the film 34. However, the present invention is not limited to the above-described method. It is a fluid that is connected to the pressure. In this case, (4) a gas such as air or an inert gas is used. In the present month, the stamper 56 for forming a desired pattern on the substrate 52 allows a conventionally known stamper having ultraviolet penetrability. Specifically, for example, quartz glass, resin, or the like can be used. The resin molding die is a stamper made of a resin excellent in polyethylene, polypropylene, polycyclomethene, a first-line resin, and a gas-rich 201249657 type. As described above, the temperature of the entire imprint apparatus can be maintained by the imprint apparatus of the invention 疋m 疋,

製__2適用於使用熱尺寸變化相對大之樹月I 月中务'外線硬化樹脂材料54 Υ系合右普& & 二,始劑。做為紫外線硬化性樹腊 氧丙細酸醋丙稀酸酿、聚醋丙雜、環 备宜取札楚长氣樹脂、醢亞胺系寡聚物、聚烯-硫醇 乐养取物寺。 胺基甲酸酉旨丙缚酸醋係例如六甲樓二異氛酸醋、 異佛酮二異氰_旨、曱樓雙(4—環己基異氰酸醋)、三 甲基六曱樓二異氰軸、m異氰酸S旨、4,4-二 苯基曱炫二異氰酸酿、二甲笨撐二酸 異氰 酸醋類來和聚(氧化丙烯)二醇、聚(氧化丙稀)三醇、聚 (四曱撐氧化物)二醇、乙氧基化雙酚A等多醇類與丙 烯酸2—輕基乙醋、曱基丙烯酸2〜羥基乙酯、丙烯酸 2-經基丙醋、二甲基_酸去水甘油醋、季戊四醇三 丙烯酸酯等丙烯酸羥酯類進行反應所得,分子中具有 做為官能基之丙烯醯基與胺基曱酸酯鍵。 在聚醋丙摩㈣方面可舉出例如由馬來酸酐與氧 化丙烯與丙烯酸所構成之聚酯丙烯酸酯、由己二酸與 1,6-己二醇與丙雜所構成之聚|旨__旨、由偏苯 三甲酸與二乙二醇與丙烯酸所構成之聚酯丙烯酸酯 等。 12 201249657 環氧丙烯酸酯係藉由表氣醇等環氧化合物與丙師 酸或是曱基丙烯酸之反應所合成,例如可舉出由雙紛 A與表氣醇與丙烯酸之反應所合成之雙酚A型環氣内 烯酸酯、由雙酚S與表氯醇與丙烯酸之反應所合成之 雙酚S型環氧丙烯酸酯、由雙酚F與表氣醇與丙歸峻 之反應所合成之雙紛F型環氧丙稀酸酯、由盼駿清漆 與表氣醇與丙烯酸之反應所合成之酚醛清漆型環氣 烯酸酯等。 你机例加1平jtj例划雙附A型環氣樹脂、雙粉p 型環氧樹脂、雙酚AD型環氧樹脂、雙酚S型環氧 月曰等雙酚型環氧樹脂;酚醛清漆型環氧樹脂、甲决 f型,氧樹脂等清漆型環氧樹脂;三盼曱貌三縮水二 〉喊等芳香族環氧樹脂、以及此等氫化物或漠化物 陽離聚合料劑以光自由絲合起始劑以W 起始劑為佳,在光自域 2 酿笨紛、2rrirr基㈣祕、甲氣基乙 盼衍生物氧基 本基⑽苯料乙酿笨 合物H =乙醚、笨偶因⑽等笨偶因醚系化 膦氣化I _等祕衍生物;、酿其 酸醋、2-曱基+〔二二 始劑方面可舉中彳 在先陽離子聚合起 鹽、芳香心錯合物、芳香族重氣 对-方香私鎏鹽、鏽鹽、吡啶鑷鹽、 13 201249657 鋁錯合物/發醇鹽、三氣 ' PFC 氣尹烷磺酸鹽、 磺酸鹽、曱苯磺 鑌鹽、吡啶鑕鹽之相:二嗪衍生物等。做為上述 -、AH:广陰離子可舉出例如 SbFc ’ 田θ 五氣)塌醆鹽、- 乙酸鹽 甲烷磺酸鹽 '三氟乙醆鹽 -二 酸鹽、硝酸鹽等。 光聚合起始劑之添加 樹脂100重量份為〇」〜15 份0 置:般相對於紫外線硬化性 重置份、較佳為0.5〜10重量 10來進行壓印 以下’針對利用本發明之堡印裝置 之過程來說明。 Μ,52以片狀來塗佈料線硬化樹脂 此拉、^、紫卜柄化樹脂Μ上配置壓模(樣板)%。 此時’备必須做精確對位之情況係適宜地進行對準。 ^其次,將此積層體配置於保持構件14之既定位置 後,以上下移動機構來調節耐壓體12與保持構件Μ 的間隔,成為密封材22經由可撓性膜34來和保持構 件14之上面(基板保持面)i4a相密合之狀態。之後, 從流體供給排放管30供給流體,對空腔36内進行加 壓(例如1〜50bar),來將壓模56抵壓於紫外線硬化樹 脂材料54。於此抵壓狀態下,從LED 16照射紫外線使 得紫外線硬化樹脂材料54硬化後,移除耐壓體12與 保持構件14。藉此,可於基板52上形成微細的凹凸 圖案,而於此動作中,藉由上述溫度計28、冷媒管24 以及控制部(未圖示)來進行耐壓體12以及保持構件14 201249657 之溫度控制為佳。由溫度控制所設定之溫度係以壓模 56之尺寸不致變化的溫度、尤其以壓模之設定溫度的 ±5°C、較佳為、尤佳為±〇.5°C的範圍來設定為佳。 藉此,可確實防止尺寸變化,能以高精度來形成所希 望之凹凸圖案。此處,所說的壓模之設定溫度係於壓 模之製作中所設定之顯示所希望之尺寸的溫度,例如 當使用設定溫度為23°C之壓模的情況係以成為 22〜24°C、較佳為22.5〜23.5\:之溫度的方式來進行溫 度控制。壓模之設定溫度通常係設定在、尤其 設定在20〜25°C之範圍内的溫度。 本發明不限定於上述各實施形態之構成,可在發 明之要旨的範圍内進行各種變形。 若使用本發明之壓印裝置,可便於獲得高品質之 電子顯示器、電子紙等資訊顯示用面板之隔壁或電子 元件(製版物(lithography)、電晶體)、光學零件(微透鏡 陣列、波導管、光學濾色器、光子結晶)、生物相關材 料(DNA晶片、微反應器)、記録媒體(圖案化媒體、DVD) 等。 【圖式簡單說明】 圖1係顯示本發明之壓印裝置之實施形態一例的 概略截面圖。 圖2係以往之壓印裝置之概略截面圖。 15 201249657 主要元件符號說明 10 12 14 16 18 20 22 24 26 28 30 34 36 52 54 56The system __2 is suitable for use in the use of thermal size changes relatively large tree month I month in the 'external hardening resin material 54 Υ 合 右 right && As a UV-curable tree, aromatized vinegar, acrylic acid, acrylic acid, polyacetate, and arsenic, it is recommended to use the Zhachu long-air resin, the yttrium-based oligomer, and the polyene-thiol-learning temple. . Amino guanidine carboxy acyl citrate is for example, Liujialou diiso-acid vinegar, isophorone diisocyanate _, 曱 双 double (4-cyclohexyl isocyanic acid vinegar), trimethyl hexanthene bismuth Cyanide shaft, m isocyanate S, 4,4-diphenyl fluorene diisocyanate, dimethyl benzoic acid isocyanate and poly(oxypropylene) diol, poly(oxygen propylene) Dilute triol, poly(tetramethylene oxide) diol, ethoxylated bisphenol A and other polyols with 2-acrylic acid acrylate, 2-hydroxyethyl methacrylate, 2-hydroxy acrylate A hydroxy acrylate such as propyl vinegar, dimethyl-acid dehydroglycerin vinegar or pentaerythritol triacrylate is obtained by reacting a propylene sulfonate group with an amino phthalate linkage as a functional group in the molecule. Examples of the polyacetonitrile (IV) include a polyester acrylate composed of maleic anhydride, propylene oxide and acrylic acid, and a mixture of adipic acid, 1,6-hexanediol and propylene. A polyester acrylate composed of trimellitic acid, diethylene glycol and acrylic acid. 12 201249657 Epoxy acrylate is synthesized by the reaction of an epoxy compound such as a surface alcohol with propyl or methacrylic acid. For example, a double synthesized from the reaction of bisphenol A with surface alcohol and acrylic acid Phenol A-type cyclic olefinic acid ester, bisphenol S-type epoxy acrylate synthesized by the reaction of bisphenol S with epichlorohydrin and acrylic acid, synthesized by the reaction of bisphenol F with epigas alcohol and propylene The F-type epoxy acrylate, the novolac type cycloolefin acrylate synthesized by the reaction of junqing varnish and surface alcohol and acrylic acid. You can add 1 flat jtj case with double type A ring gas resin, double powder p type epoxy resin, bisphenol AD type epoxy resin, bisphenol S type epoxy epoxide and other bisphenol type epoxy resin; phenolic Varnish-type epoxy resin, A-type f-type, varnish-type epoxy resin such as oxy-resin; three-in-one three-shrinking two-enhanced aromatic epoxy resin, and such hydride or desert cation polymerization agent The light free silking initiator is preferably a W initiator, which is light in the self-domain 2, 2rrirr-based (four) secret, and the gas-based acetylene derivative oxy-based (10) benzene-based compound H = ether Stupid due to (10) and other stupid couples due to the etherification of phosphine gasification I _ and other secret derivatives;, brewing its acid vinegar, 2-mercapto + [secondary agent can be used in the first cationic polymerization of salt, Aromatic heart complex, aromatic heavy gas pair - Fangxiang private salt, rust salt, pyridinium salt, 13 201249657 aluminum complex / hair alkoxide, three gas 'PFC gas alkane sulfonate, sulfonate , benzene sulfonium sulfonium salt, pyridinium salt phase: diazine derivative and the like. The above-mentioned -, AH: broad anion may, for example, be a SbFc' field θ five gas) saponin, - acetate methane sulfonate 'trifluoroacetate salt - diacid salt, nitrate or the like. 100 parts by weight of the added resin of the photopolymerization initiator is 〇"~15 parts. 0: It is generally embossed with respect to the ultraviolet curable resettable portion, preferably 0.5 to 10 by weight 10, and the following is used for the use of the fort of the present invention. The process of printing the device to illustrate. Μ, 52, the strand curing resin is applied in a sheet form. The stamper (sample) % is placed on the pull, the handle, and the handle. At this time, the situation in which the preparation must be accurately aligned is properly aligned. Then, after the laminated body is placed at a predetermined position of the holding member 14, the upper and lower moving mechanisms adjust the interval between the pressure-resistant body 12 and the holding member ,, and the sealing member 22 passes through the flexible film 34 and the holding member 14 The upper surface (substrate holding surface) i4a is in close contact with each other. Thereafter, the fluid is supplied from the fluid supply discharge pipe 30, and the inside of the cavity 36 is pressurized (e.g., 1 to 50 bar) to press the stamper 56 against the ultraviolet curable resin material 54. In this pressed state, the ultraviolet curable resin material 54 is cured by irradiating ultraviolet rays from the LED 16, and then the pressure-resistant body 12 and the holding member 14 are removed. Thereby, a fine uneven pattern can be formed on the substrate 52. In this operation, the temperature of the pressure-resistant body 12 and the holding member 14 201249657 is performed by the thermometer 28, the refrigerant tube 24, and the control unit (not shown). Control is better. The temperature set by the temperature control is set to a temperature at which the size of the stamper 56 does not change, particularly a range of ±5 ° C, preferably, particularly preferably ± 〇 5 ° C of the set temperature of the stamper. good. Thereby, the dimensional change can be surely prevented, and the desired concave-convex pattern can be formed with high precision. Here, the set temperature of the stamper is a temperature set to a desired size set in the production of the stamper, for example, when a stamper having a set temperature of 23 ° C is used, it is 22 to 24°. C, preferably a temperature of 22.5 to 23.5\: for temperature control. The set temperature of the stamper is usually set to a temperature which is set in particular in the range of 20 to 25 °C. The present invention is not limited to the configurations of the above embodiments, and various modifications can be made without departing from the spirit and scope of the invention. When the imprint apparatus of the present invention is used, it is possible to easily obtain a partition wall or an electronic component (lithography, transistor), optical component (microlens array, waveguide) of a high-quality electronic display panel such as an electronic display or an electronic paper. , optical filters, photonic crystals, bio-related materials (DNA wafers, microreactors), recording media (patterned media, DVD), etc. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing an example of an embodiment of an imprint apparatus of the present invention. Fig. 2 is a schematic cross-sectional view showing a conventional imprint apparatus. 15 201249657 Main component symbol description 10 12 14 16 18 20 22 24 26 28 30 34 36 52 54 56

壓印裝置 耐壓體 保持構件 LED LED基板 透明板 密封材 冷媒管 隔熱材 溫度計 流體供給排放管 膜 空腔 基板 紫外線硬化樹脂材料 壓模Imprinting device Pressure-resistant body Holding member LED LED substrate Transparent plate Sealing material Refrigerant tube Heat-insulating material Thermometer Fluid supply discharge tube Membrane Substrate UV-curable resin material Stamper

Claims (1)

201249657 七 、申請專利範圍: _丨.一種壓印裝置,係將表面具有凹凸圖案之壓模 以,凹凸圖案表面密接於被供給至基板上之紫外線硬 化树脂材料上的方式來配置,並使用流體來加壓該壓 模之f面以抵壓該壓模,於該抵壓狀態下對該紫外線 硬化樹·脂材料照射紫外線來使得該紫外線硬化樹脂材 料產生硬化’而於該基板表面形成該凹凸圖案之倒轉 凹凸圖案;其特徵在於, 3玄壓印裝置係具有:保持該基板之保持構件、以 及對向於該保持構件之财壓體; 邊=壓體於其底部具備有對該紫外線硬化樹脂材 ;斗照射紫外線之LED,且㈣顔之底部與該保持構 件係以成為對向的方式來配置著。 2.如申請專利範圍第1項之壓印裝置,係於該耐 聖體與該保持構件之至少一者設有冷卻機構。 β 3.如申請專利範圍第2項之壓印裝置,係於該耐 壓體與該保持構件之至少一者設有溫度計; 並設有藉由該溫度計與該冷卻機構來進行溫度控 制之控制部。 咖·又二 4. 如申睛專利範圍第1至3項中任一項之壓印裝 置’係於該耐壓體設有隔熱機構。 5. 如申請專利範圍第1至4項中任一項之壓印裝 置,其中該壓模為樹脂製壓模。201249657 VII. Patent application scope: _丨. An imprinting device is configured by arranging a stamper having a concave-convex pattern on the surface so that the surface of the concave-convex pattern is closely attached to the ultraviolet-curable resin material supplied onto the substrate, and using the fluid Pressing the surface of the stamper to pressurize the stamper, and irradiating the ultraviolet curable tree/fat material with ultraviolet rays in the pressed state to cause the ultraviolet curable resin material to be hardened to form the bump on the surface of the substrate a reversed concave-convex pattern of the pattern; wherein the 3 embossing device has: a holding member for holding the substrate; and a financial body opposite to the holding member; the side = the pressing body is provided with the ultraviolet curing at the bottom thereof The resin material is a LED that emits ultraviolet rays, and (4) the bottom of the face and the holding member are disposed to face each other. 2. The imprint apparatus of claim 1, wherein the anti-san body and the holding member are provided with a cooling mechanism. [01] The imprint apparatus of claim 2, wherein at least one of the pressure body and the holding member is provided with a thermometer; and the temperature control is controlled by the thermometer and the cooling mechanism. unit. The embossing device according to any one of claims 1 to 3 is provided with a heat insulating mechanism. 5. The embossing apparatus according to any one of claims 1 to 4, wherein the stamper is a resin stamper.
TW101104616A 2011-02-15 2012-02-14 Imprinting apparatus TW201249657A (en)

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