201248252 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種顯示裝置的製造方法，特別是一種運用於 單片玻璃方案的顯示裝置的製造方法。 【先前技術】 單片玻璃方案(One glass solution，OGS)是把觸控玻璃(Touch Sensor)與保護玻璃(Cover Glass)整合在一起的技術。更詳細地說， 單片玻璃方案是在一般的保護玻璃内側鍍上銦錫氧化物(Indium Tin Oxide，IT0)導電層，使單片玻璃不僅具備保護玻璃的強度、 安全性，同時也兼具觸控功能。 由於目前以玻璃基材為主的投射式電容觸控面板，多採用兩 片玻璃結構，亦即一片觸控玻璃加上一片保護玻璃。為簡化材料、 製程’提升生產效率以及降低成本，同時減少賴的使用，以使 終端產品設計更輕、更薄並且使面板透光度更高，因此單片玻璃 方案被視為是下階段觸控面板的重要發展方向。 當運用單片玻璃方案製造液晶面板時，遮光元件(又可稱為累 色矩陣，BlackMatrix)會設置於玻璃基材的上側，而金屬塾則是設 置於遮光树之上。也就是說，絲元件位於金屬塾與玻璃基: 之間。接著’要將晶片設置於金屬墊上的時候，會運用影像辨識 模組從玻璃基材的下側找尋預先設置於金屬墊上的對位栈钛鈇 因為金與玻璃基材之間還隔著遮光树，因此二二 單片玻璃方針’位於玻璃基材下側的影像辨識模組無法取得對 201248252 位標誌，也就無法順利的將晶片設置於金屬墊上。 f發明内容】 於以上關題，本發明储出示裝置的製造方法。 此製造方法包括：提供—透明基板、形成—遮光層於刺基板上、 幵>成s穿孔於遮光層以露出透明基板、形成金屬層於遮光層上 -、貝穿孔中藉由對位模組自透明基板榻取位於貫穿孔的金屬層 的對位標誌；根據對位標誌，設置一待對位物件於金屬層。 此外’本發明係另提出一種顯示裝置，包括透明基板、遮光 層與金屬層。 遮光層位於翻基板上，且遮光層具有—貫穿孔。金屬層設 置遮光層之上，金屬層填滿貫穿孔且金屬層透過貫穿孔連接至透 明基板。 在本發明之一實施例中，其中遮光層與金屬層之間反射率的 差異大於等於40%。 _在本發明之一實施例中，其中金屬層之材質係選自金、銀、 銅紹、鉬或其組合，金屬層的反射率大於47%。 在本發明之一實施例中，其中貫穿孔包括一長方形、一三 形或是一圓形。 — 在本發明之一實施例中，其中貫穿孔的孔徑小於 藉由上述之方式，當待對位物件在對位時，可利用貫穿孔中 的金屬層進行對位，因此不會受到遮光層的遮蔽而可順利將 位物件設置於金屬層。 、、 201248252 【實施方式】 以下在實施方式中係進-步詳細說明本發明之詳細特徵以及 優點’其内容足以使任何熟f相關技藝者了解本發明之技術内容 並據以實施，且根據本說明書所揭露之内容、㈣專利範圍及^ 式’任何im目關技藝者可_地理解本發明侧之目的及優點。 睛參照『第1A圖』至『第1E圖』，『第1A圖』至『第圖』 係為本發明之顯示裝置的製造方法之流程圖。 』 在第1A圖』中，係挺供透明基板1〇。透明基板具有第 -側11與第二側12。其中第―側u為實際產品會露出於外界之 -側’也就纽用者實際會觀看的—側。第二側12則是用以堆積 遮光層20等獏層並進行製程的一側。透明基板1〇係可為玻璃基 板或是塑膠材質的基板。 在第1B圖』中，係利用鍍膜/黃光/餘刻技術形成遮光層 於透明基板10的第一側12上。遮光層20可為遮光油墨，遮光油 墨係用喷嘴以喷灑的方式覆蓋於透明基板1〇。 在『第1C圖』中，係利用鍍膜/黃光/勉刻技術形成貫穿孔3〇 於遮光層20。貫穿孔30係由遮光層20的一側貫穿至遮光層20 的相對另一側。遮光層20在被貫穿後，透明基板1〇的第二侧12 藉由貝穿孔30露出。貫穿孔3〇在透明基板1〇的第二側12的形 狀可為長方形、三角形、圓形或是其他多邊形或是不規則型。為 了使貫穿孔30不影響顯示裝置在視覺上的美觀，在本發明之一實 施例中，貫穿孔30的孔徑較佳係小於1〇〇μηι，因此，使用者較不 201248252 容易察覺此貫穿孔30。以多邊形為例，貫穿孔3〇的孔徑可定義為 多邊形中相距最遠的兩個頂點之間的距離。 在『第1D圖』中’係利用鍍膜/黃光刻技術形成金屬層40 於遮光層20上與貫穿孔3〇中。在此實施例甲，鍍膜形成金屬層 40的方法可為但不限於電子束蒸發法、物理氣相沉積法或錢射沉 積法。因為金屬層40形成於貫穿孔30,金屬層4〇會連接至透明 基板10的第二側12。也就是說，形成於貫穿孔3〇中的金屬層4〇, 不會被遮光層20所遮蔽。因此，自透明基板1〇的第一側^，亦 可看到此金屬層40。在本實施例中，金屬層4〇之材質可以選自 金、銀、銅、鋁、鉬或其組合，以使得金屬層4〇在可見光照射時 之反射率大於等於47%。由於金屬層40與遮光層20反射率差異 大於等於40%。是以在第一側u可辨識出遮光層2〇與金屬層4〇 之不同。藉由貫穿孔30在透明基板1〇的第二側12的形狀以及金 屬層4〇與遮光層20的反射率差異，可以將形成於貫穿孔3〇之金 屬層40視為對位標誌以協助後續製程之對位。 在此處特別要說明的是，金屬層4〇可以與原本金屬佈線層同 一道製程’此時，金屬層4〇與原本金屬佈線層同時進行鍍膜/黃光 /姓刻等步_形成於遮光層2〇上與貫穿孔％中或形成於貫穿孔 30 中。 、、 在『第1E1]』中，藉由對位模組6〇自透明基板1〇祿取位於 貫穿孔30的金屬層4〇的一對位標誌。對位標誌即為貫穿孔邓在 透明基板10的第二側12上所形成的形狀。對位模組6〇包括光源 201248252 產生模_輯娜裝置。雜额6G餘於透縣板ι〇第一 側11之-側。對位模組60的光源產生模組可朝向透明基板1〇發 射光源。光源反射後，可被影像擷取裝置所接收。因為反射率不 同，影像擷取裝置可根據反射的光源，取得一影像資訊。 在『第1F圖』中’根據對位標誌、，設置待對位物件7〇於金 屬層上。在此實施例中’待對位物件？〇係可為晶片(chip)或是軟 性電路板(flexiWe pri福circuit board)。晶片或軟性電路板㈣ 裝配裝置所夾持。裝配裝置比如說可為但不限於纽，此夹具可 配置於-機器手臂。對位模組6G可根據影像擷取裝置所取得的影 像資訊，離機H手㈣岐與錄，轉晶$或軟性電路板放 置於金屬層40上。舉例而言，當對位標總位於影像資訊中的左侧 時，可調整機n手臂向左軸，或是職翻基板ig向右移動。 當對位標魏位於影像資訊中的右側時，可調整機器手臂向右移 動或疋》周正透明基板10向左移動。然而，本發明的裝配裝置並 不限於-纽與機时臂，其錄何可經由自動㈣而移動角度 或位置的H具，皆可為本案的㈣裝置。 1又而r晶;^軟性電路板在外觀上的顏色與遮光層如近 似。因此’當制者從第—側n觀看此顯稀置時，使 容易發現貫穿孔30的存在，不會影響顺覺上的美觀。 以在之方式’在進行晶片或軟性電路的對位時，光源可 ^板10的第—㈣之一測，透過貫穿孔 中之金屬層40的反兰〜办戍於其 认射革差進行對位，因此不會受到遮光層2〇的 201248252 遮蔽而可順利完成對位。 請參照『第2圖』’『第2圖』係為本發明之顯示裝置之剖面 示意圖。 顯示裝置100包括透明基板10、遮光層20、金屬層40與發 光模組50。 遮光層20位於透明基板1〇上，且金屬層4〇位於遮光層2〇 上。也就是說，遮光層20係位於透明基板10與金屬層4〇之間。 遮光層20具有貫穿孔30。金屬層40填滿貫穿孔30，金屬層40 透過貫穿孔30連接至透明基板1〇的第二側12。貫穿孔3〇在透明 基板10的第二側12的形狀可為長方形、三角形、圓形或是其他 多邊形或是不規則型。為了使貫穿孔3〇不影響顯示裝置在視覺上 的美觀’貫穿孔30的孔徑較佳可小於1〇〇μιη，以讓使用者不容易 察覺此貫穿孔30。 透明基板10具有透光區域13與遮光區域14，遮光層2〇係設 置於遮光區域14。顯示H模組5G藉由透明师54齡設置於透 光區域13上。在此實施射，顯示器模組％可包括彩色濾光基 板片5：1、薄膜電晶體基板52與背光源53。以上係以液晶顯示器 拉、、且為例’然本發明並不以此為限。上述驗晶顯示器模組％可 替換為其他的顯示器模組，比如說有機發光二極體㈣_ _ emitting diode、OLED)顯示器模組。 综合以上所述’杨明·出_示裝置婦造顯示裝 置的方法’可有效的克服料玻财針無法糊取得對位標諸 201248252 的問題。 1本發明一述之實施例揭露如上，然其並非用以限 發明。在不麟本發私精神和範_，所為之找 屬本發明之專利保護範圍。關於本發騎界定之保魏 所附之申請專利範圍。 ’、濩軏圍叫參考 【圖式簡單說明】 『第1A圖』至『第1F圖』係為本發明之 法之流程圖；以及 Μ的k方 『第2圖』係為本發明之顯示裝置之剖面示音。 【主要元件符號說明】 10 透明基板 11 第一側 12 第二側 13 透光區域 14 遮光區域 20 遮光層 30 貫穿孔 40 金屬層 50 顯示器模組 51 彩色濾光片基板 52 薄膜電晶體基板 53 背光源 201248252 54 透明黏膠 60 對位模組 70 待對位物件 100 顯示裝置201248252 VI. Description of the Invention: [Technical Field] The present invention relates to a method of manufacturing a display device, and more particularly to a method of manufacturing a display device applied to a monolithic glass scheme. [Prior Art] One glass solution (OGS) is a technology that integrates a touch sensor and a cover glass. In more detail, the monolithic glass solution is coated with a conductive layer of Indium Tin Oxide (IT0) on the inside of a general protective glass, so that the single-piece glass not only has the strength and safety of the protective glass, but also has both Touch function. Due to the current projection capacitive touch panel based on glass substrates, two glass structures are used, that is, one touch glass and one protective glass. In order to simplify materials and processes, 'improve production efficiency and reduce costs, while reducing the use of the products, so that the end product design is lighter, thinner and the panel transmittance is higher, the single-chip glass solution is regarded as the next stage of touch. The important development direction of the control panel. When a single-piece glass scheme is used to fabricate a liquid crystal panel, a light-shielding element (also referred to as a color matrix, BlackMatrix) is placed on the upper side of the glass substrate, and a metal crucible is placed on the shade tree. That is to say, the wire element is located between the metal crucible and the glass base:. Then, when the wafer is to be placed on the metal pad, the image recognition module is used to find the alignment stack pre-positioned on the metal pad from the underside of the glass substrate because the light-shielding tree is interposed between the gold and the glass substrate. Therefore, the image recognition module located on the lower side of the glass substrate cannot obtain the 201248252 mark, and the wafer cannot be smoothly placed on the metal pad. f SUMMARY OF THE INVENTION In the above, the manufacturing method of the storage device of the present invention. The manufacturing method includes: providing a transparent substrate, forming a light shielding layer on the thorn substrate, 幵 puncturing the opaque layer to expose the transparent substrate, forming a metal layer on the light shielding layer, and forming a metal layer on the puncturing pattern The alignment mark of the metal layer located in the through hole is taken from the transparent substrate; and the object to be aligned is disposed on the metal layer according to the alignment mark. Further, the present invention further provides a display device comprising a transparent substrate, a light shielding layer and a metal layer. The light shielding layer is located on the flip substrate, and the light shielding layer has a through hole. The metal layer is disposed on the light shielding layer, the metal layer fills the through holes, and the metal layer is connected to the transparent substrate through the through holes. In an embodiment of the invention, the difference in reflectance between the light shielding layer and the metal layer is greater than or equal to 40%. In one embodiment of the invention, the material of the metal layer is selected from the group consisting of gold, silver, copper, molybdenum or combinations thereof, and the reflectivity of the metal layer is greater than 47%. In an embodiment of the invention, the through hole comprises a rectangle, a triangle or a circle. - In an embodiment of the invention, wherein the diameter of the through hole is smaller than that of the above-mentioned manner, when the object to be aligned is in the opposite position, the metal layer in the through hole can be used for alignment, and thus the light shielding layer is not received. The shielding can smoothly place the object on the metal layer. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following, the detailed features and advantages of the present invention are described in detail in the embodiments, which are sufficient to enable any skilled person to understand the technical contents of the present invention and to implement the present invention. The contents disclosed in the specification, (4) the scope of the patent, and the skilled artisan can understand the objects and advantages of the present invention. Referring to "1A" to "1E", "1A" to "FIG." are flowcharts of a method of manufacturing a display device of the present invention. In the 1st AA, the transparent substrate 1 is provided. The transparent substrate has a first side 11 and a second side 12. The first side u is the side where the actual product will be exposed to the outside - the side will be viewed by the new user. The second side 12 is a side for stacking the enamel layer such as the light shielding layer 20 and performing the process. The transparent substrate 1 can be a glass substrate or a plastic substrate. In Fig. 1B, a light-shielding layer is formed on the first side 12 of the transparent substrate 10 by a coating/yellow/recessive technique. The light shielding layer 20 may be a light-shielding ink, and the light-shielding ink nozzle is sprayed on the transparent substrate 1〇. In the "1Cth drawing", the through hole 3 is formed in the light shielding layer 20 by a coating/yellow/engraving technique. The through hole 30 is penetrated from one side of the light shielding layer 20 to the opposite side of the light shielding layer 20. After the light shielding layer 20 is penetrated, the second side 12 of the transparent substrate 1 is exposed by the bead perforations 30. The shape of the through hole 3 〇 on the second side 12 of the transparent substrate 1 可 may be a rectangle, a triangle, a circle or other polygon or an irregular shape. In order to prevent the through hole 30 from affecting the visual appearance of the display device, in one embodiment of the present invention, the diameter of the through hole 30 is preferably less than 1〇〇μηι, so that the user can easily perceive the through hole in 201248252. 30. Taking a polygon as an example, the aperture of the through hole 3〇 can be defined as the distance between the two vertices farthest apart in the polygon. In the "1D drawing", the metal layer 40 is formed on the light shielding layer 20 and the through hole 3 by a plating/yellow lithography technique. In this embodiment A, the method of forming the metal layer 40 by plating may be, but not limited to, electron beam evaporation, physical vapor deposition, or coin-jet deposition. Since the metal layer 40 is formed in the through hole 30, the metal layer 4 is connected to the second side 12 of the transparent substrate 10. That is, the metal layer 4〇 formed in the through hole 3〇 is not shielded by the light shielding layer 20. Therefore, the metal layer 40 can also be seen from the first side of the transparent substrate 1〇. In this embodiment, the material of the metal layer 4 may be selected from gold, silver, copper, aluminum, molybdenum or a combination thereof such that the reflectance of the metal layer 4 when irradiated with visible light is 47% or more. Since the difference in reflectance between the metal layer 40 and the light shielding layer 20 is 40% or more. Therefore, the difference between the light shielding layer 2 and the metal layer 4 is recognized on the first side u. By the shape of the through hole 30 on the second side 12 of the transparent substrate 1 and the difference in reflectance between the metal layer 4 and the light shielding layer 20, the metal layer 40 formed in the through hole 3 can be regarded as a registration mark to assist The alignment of subsequent processes. In particular, the metal layer 4〇 can be formed in the same process as the original metal wiring layer. At this time, the metal layer 4〇 and the original metal wiring layer are simultaneously coated/yellow/surnamed. The layer 2 is formed in the through hole and in the through hole 30. In "1E1], a pair of bit marks located in the metal layer 4A of the through hole 30 are taken from the transparent substrate 1 by the alignment module 6. The alignment mark is a shape formed by the through hole Deng on the second side 12 of the transparent substrate 10. The aligning module 6 〇 includes the light source 201248252 to generate the modulo_na device. The amount of miscellaneous 6G is on the side of the first side of the county board. The light source generating module of the registration module 60 can emit light toward the transparent substrate 1 . After the light source is reflected, it can be received by the image capturing device. Because the reflectivity is different, the image capturing device can obtain an image information according to the reflected light source. In "Phase 1F", the object to be aligned 7 is placed on the metal layer according to the alignment mark. In this embodiment, the 'object to be aligned'? The lanthanide can be a chip or a flexible circuit board (flexiWe pri circuit board). The wafer or flexible circuit board (4) is clamped by the assembly device. The assembly device can be, for example but not limited to, a button, which can be placed in a robotic arm. The alignment module 6G can be placed on the metal layer 40 according to the image information obtained by the image capturing device, the off-hook (four), and the recording, or the flexible circuit board. For example, when the target mark is always located on the left side of the image information, the machine n arm can be adjusted to the left axis, or the flip substrate ig can be moved to the right. When the position mark Wei is located on the right side of the image information, the robot arm can be moved to the right or 疋"the positive transparent substrate 10 is moved to the left. However, the assembling device of the present invention is not limited to the - button and the hour arm, and the H device with the angle or position that can be moved via the automatic (4) can be the device of the present invention. 1 and r crystal; ^ soft circuit board in the appearance of the color and the light-shielding layer is similar. Therefore, when the maker sees this display from the first side n, it is easy to find the existence of the through hole 30 without affecting the aesthetic appearance. In the manner of 'in the alignment of the wafer or the flexible circuit, the light source can be measured by one of the first (four) of the board 10, and the anti-blue through the metal layer 40 in the through-hole is performed. It is aligned, so it will not be obscured by the blackout layer 2〇 201248252 and the alignment can be completed smoothly. Please refer to "Fig. 2" and "Fig. 2" for a schematic cross-sectional view of the display device of the present invention. The display device 100 includes a transparent substrate 10, a light shielding layer 20, a metal layer 40, and a light emitting module 50. The light shielding layer 20 is on the transparent substrate 1〇, and the metal layer 4 is located on the light shielding layer 2〇. That is, the light shielding layer 20 is located between the transparent substrate 10 and the metal layer 4A. The light shielding layer 20 has a through hole 30. The metal layer 40 fills the through hole 30, and the metal layer 40 is connected to the second side 12 of the transparent substrate 1 through the through hole 30. The shape of the through hole 3〇 on the second side 12 of the transparent substrate 10 may be a rectangle, a triangle, a circle or other polygon or an irregular shape. In order to prevent the through hole 3 from affecting the visual appearance of the display device, the diameter of the through hole 30 may preferably be less than 1 μm, so that the through hole 30 is not easily perceived by the user. The transparent substrate 10 has a light-transmitting region 13 and a light-shielding region 14, and the light-shielding layer 2 is disposed in the light-shielding region 14. The display H module 5G is disposed on the light transmitting region 13 by the transparency of the 54th. In this embodiment, the display module % may include a color filter substrate 5: 1, a thin film transistor substrate 52 and a backlight 53. The above is a liquid crystal display, and is taken as an example. However, the invention is not limited thereto. The above-mentioned crystal display module can be replaced with other display modules, such as an organic light-emitting diode (4) _ _ s s s s The above-mentioned method of 'Yang Ming·Output Device for Displaying Devices' can effectively overcome the problem that the material can not be obtained by the matching mark 201248252. The embodiment of the present invention is disclosed above, but it is not intended to limit the invention. In the spirit of the private spirit and the scope of the invention, it is sought for the scope of patent protection of the present invention. The scope of the patent application attached to Bao Wei, the definition of this ride. ', 濩軏 叫 参考 【 图 图 图 图 图 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第The profile of the device is shown. [Main component symbol description] 10 Transparent substrate 11 First side 12 Second side 13 Light-transmissive area 14 Light-shielding area 20 Light-shielding layer 30 Through-hole 40 Metal layer 50 Display module 51 Color filter substrate 52 Thin-film transistor substrate 53 Backlight Source 201248252 54 transparent adhesive 60 registration module 70 to be aligned object 100 display device