TW201247828A - Multilayered adhesive film - Google Patents

Multilayered adhesive film Download PDF

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Publication number
TW201247828A
TW201247828A TW101104591A TW101104591A TW201247828A TW 201247828 A TW201247828 A TW 201247828A TW 101104591 A TW101104591 A TW 101104591A TW 101104591 A TW101104591 A TW 101104591A TW 201247828 A TW201247828 A TW 201247828A
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TW
Taiwan
Prior art keywords
adhesive
layer
adhesive layer
contour
film
Prior art date
Application number
TW101104591A
Other languages
Chinese (zh)
Inventor
Tadashi Takano
Original Assignee
Henkel Corp
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Filing date
Publication date
Application filed by Henkel Corp filed Critical Henkel Corp
Publication of TW201247828A publication Critical patent/TW201247828A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/006—Presence of polyolefin in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68377—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/2901—Shape
    • H01L2224/29016—Shape in side view
    • H01L2224/29018—Shape in side view comprising protrusions or indentations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content

Abstract

Multilayered adhesive films that include a support layer, a first adhesive layer on or over the support layer and a second adhesive layer abutting the first adhesive layer, are provided. Of the abutting surfaces of the first and second adhesive layers, the first adhesive layer has a first profile and/or the second adhesive layer has a second profile. The first and/or second profiles are each independently selected such that the peel strength between the first and second adhesive layers is reduced relative to the comparative peel strength of a comparative multilayered adhesive film that is free of the first and second profiles. The multilayered adhesive films of the present invention may be used as dicing die attach films. Also provided is an assembly that includes a separate article (e.g., a silicon wafer) adhered to the multilayered adhesive film of the present invention.

Description

201247828 六、發明說明： 【發明所屬之技術領域】 本發明係關於多層黏著膜，其包含一支撲層、在該支樓 層上或覆蓋該支樓看之一第一黏著層及鄰接該第一黏著層 之一第二黏著層。該第一及第二黏著層之鄰接表面中之至 少一者各具有一第一輪廓及一第二輪廓。第一及/或第二 輪廓各自單獨選擇以使該第一與第二黏著層間之制離強度 小於不含δ亥第一及第一輪廊之對照多層黏著膜β本發明之 多層黏著膜可用作切割晶粒附接膜。 【先前技術】 於特定應用中，宜 ^僭鄱者膜，具 ίκ m X —奶Ί卞势 商品於初始加工步驟期間維持於原位；及隨後可分離以4 一或多個後續加工步驟中容許該商品之經加工部分黏附』 一獨立基板》就半導體裝置製造而言，例如，一般將一^ 導體晶圓（例如’-石夕晶圓）附接至一切割晶粒附接膜之^ 粒附接膜或層。該切割晶粒附接膜一般包含一基板層q 該基板層上之-壓感㈣層及在該壓感層上之—晶粒㈣ 膜。該半導體晶圓當黏附至該切割晶粒附接膜時，可視客 要抛光及/或薄化（例如，藉由研磨），接著將該晶圓切^ 切割成較小晶片’ 1¾等較小晶片分別地附接至該切割晶 附接膜之基板。該_步驟1形成通暢延伸至晶圓㈣ 之基板層、切割晶粒附接黏著材料及壓感黏著材料之切, 道。隨後以使各晶片底部保留晶粒附接黏著材料的方式片 藉由交叉切割道彼此分離之切割晶片自該切割晶粒附接s 160999.doc 201247828 移除（例如，拾離）。該壓感黏著材料維持黏附至該切割晶 粒附接膜之基板。隨後藉由保留在底部之晶粒附接黏著材 料將該等晶片黏附至—獨立基板，如—半導體裝置。 爲了促進或保證在拾起步驟期間晶粒附接黏著材料自下 層壓感黏著材料分離，—般藉由硬化或@化該壓感黏著材 料來減小該壓感黏著材料與晶粒附接黏著材料間之黏附。 一般先實施初始加工步驟，如，研磨及/或拋光晶圓，然 後實施該壓感黏著材料之固化（例如，交聯），及接著實施 該拾起步驟（例如，在切割步驟之後）。可視該壓感黏著材 料為熱及/或光可聚合/可固化，藉由使該壓感黏著材料曝 露於高溫及/或光化輻射實現固化。壓感黏著材料之固化 可呈不均勻，導致該壓感黏著材料與晶粒附接黏著材料間 之黏附發生可變減小。黏附發生可變減小可導致在拾起步 驟期間晶粒附接黏著材料自下層壓感黏著材料之不充分分 離。例如，於拾起步驟期間，晶片可自晶粒附接黏著材料 分離及/或一部份壓感黏著材料可與該晶粒附接膜一起升 起，於每一情況中，導致該等晶片與半導體裝置之黏附降 低或消失。 需發明使鄰接之黏著層間展現改良（例如，受控制及均 勻）分離之新穎多層膜。進一步需此等發明之新穎多層膜 可用作切割晶粒附接膜。 【發明内容】 根據本發明，提供一種多層黏著膜，其包含： (a)具有一第一表面之一支揮層； 160999.doc 201247828 (b) 具有彼此相對之一第一表面及一第二表面之一第一 黏著層’該第一黏著層之該第二表面與該支撐層之該第一 表面彼此黏著接觸；及 (c) 具有彼此相對之一第一表面及一第二表面之一第二黏 著層’該第-黏著層之該第一表面與該第二黏著層之該第 二表面彼此黏著接觸且彼此之間具有一剝離強度， 其中，存在以下情況中之至少一者： ⑴。玄第-黏著層之該第一表面具有一第一輪廓，及 ⑴)該第二黏著層之該第二表面具有一第二輪廓， 進一步，其中該第一輪廓與該第二輪廓係各自單獨選 擇，以使 相較於包3該支撐層、該第一黏著層及該第二黏著層之 -對照多層黏著膜’其中該對照多層黏著膜不含該第一輪 廓及不a。亥第一輪廓且該第一黏著層之該第一表面與該第 一黏著層之該第二表面間具有一對照剝離強度， s玄剝離強度小於該對照剝離強度。 進一步根據本發明，提供一種組件，其包含： (I) 上述多層黏著臈，及 (II) 一獨立物件（例如’—薄片或晶圓，如，一石夕晶圓）， ”具有與β亥夕層黏著骐之第二黏著層之第一表面黏著接觸 之一第二表面。 如本文及專利申請範圍中所使用，除非另外說明，否則 分子量’如，「數量平均分子量」係利用適當標準，如， 聚苯乙稀標準’藉由凝膠滲透層析法確定。 160999.doc 201247828 如本文及專利申請範圍中所使用，術語「（甲基）丙稀酸 酯」及類似術語，如「（甲基）丙烯酸之酯」意指丙烯酸酯 及/或甲基丙烤酸酯。 如本文中所使用，術語「聚合物」意指均聚物’即，由 單種單體製成之聚合物，及共聚物，即，由兩或更多種單 體製成之聚合物。 如本文及專利申請範圍中所使用，術語「光化輻射」意 指可引發包含可自&amp;基聚合乙烯系不飽和性之、组合物進行 自由基聚合之電磁輻射，且包括，但不限制於，紅外光、 可見光、紫外光、電子束㈣、x射線及其等並行及/或接 續組合。 使本發明特徵化之特徵係於附接並形成公開内容之一部 刀之專利中4範圍中以精確方式指出。本發明之此等及其 他特徵「操作優點及由其用途獲得之具體目的將藉由以 實&amp;方式及顯不並描述本發明較佳實施例之附圖得以更 完整理解。 如 本文及專利申請範圍中所使 」下」、「内」、「外」、「右」、「左」、「垂直」. 「水平」、「頂 、「&amp; 」 _」及類似術語係用於如圖中所定向身 描述本發明。除北 ,^ 、另外說明，否則此等術語之使用無意戈 句。 制，係因本發明可採取其他位置及只 之所有範圍應視為涵 。例如，範圍「1至 ，十、入v 蓋其中所包含之# 3之任何及所# 160999.doc 201247828 i〇」應視為包括最小值i與最大值1〇之間(且含 及所有子範圍，即，以最小值丨或更大值起始並以最大值了 10或更小值終止的所有子範圍，例如，1至61、 7.8、5.5至 1〇等。 ·至 除非另外說明，否則將如說明書及專利申請範圍中所使 用之所有數字或表述’如表述結構之尺寸、成分之量等之 彼等表述’視為在所有情況中以術語「約」修飾。 【實施方式】 於圖1至8⑷中，除非另外說明，否則相同參考數字表干 相同部件及結構特徵件。 參照圖1至;3 ,其等顯示根據本發 夕 m诼伞f明之一多層黏著膜】。 該多層黏著膜1包含一支撐層H，在該支樓層上罝有一第 -黏著層14,及在該第一黏著層上之一第二黏著層&quot; 撐層11具有彼此相對(例如，實質上彼此背向)之一第一表 面20及一第二表面第一 舶有增丨4具有彼此相對 如，實質上彼此背向)之一第一表面26及一第二表面23β 第-黏著層具有彼此相對(例如，實質上彼此 一 第一表面32及一第二表面29。 特定言之’該第一黏著層14之第二表面23係與支撐層η 之第一表面20黏著接觸。^+ 觸如本文及專利申請範圍中所使 用’第-黏著層之第二表面與支撐層之第一表面間之黏著 接觸意指：⑴彼此間直接點著接觸；或(Π)因彼此之間插 置一獨立層或膜(例如，-獨立黏著層或膜)而彼此之間間 接黏著接觸。於一實施例中’第一點著層之第二表面與支 I60999.doc 201247828 撐層之第一表面彼此直接黏著接觸。 第一黏著層14之第一表面26與第二黏著層17之第二表面 29彼此黏著接觸，及彼此間具有一剝離強度。一般而言， 第一黏著層之第一表面與第二黏著層之第二表面彼此直接 黏著接觸* 第二黏著層17之第一表面32界定多層黏著膜一外部 黏著表面44(例如，外部上黏著表面44) ^支撐層丨丨之第二 表面21界定多層黏著膜1之外部支撐表面41(例如，一外部 下支樓表面41)。 就根據本發明之多層膜而言：第一黏著層14之第一表面 26具有一第一輪廓35 ;及/或第二黏著層17之第二表面29 具有一第二輪廓38。參見，例如，圖2及3。因此，第一Μ 及第1 7黏著層間之黏著介面47具有一輪扉化介面。參 見，例如，圖1。 第（例如’ 35)及第二（例如，38)輪廓係各自獨立選擇 以使本發明多層膜之第一(例如，14)與第二(例如，⑺黏 著層間之剝離強度小於不具有第—㈣及不具有第二輪廊 之對照多層黏著膜之第一與第二黏著層間之對照剝離強 度。忒對照多層膜具有一支撐層、第一黏著層及第二黏著 層’各層具有與本發❹層心同之組心此外，該對照 :層膜係於與本發明多層膜實質上相同之條件(例如，廢 力及：度)下製造。然&quot;，就該對照多層黏著膜而言，第 者層之第一表面不具有第一輪廓；及第二黏著層之第 一面不具有第二輪廓。該對照多層膜在其第一與第二黏 I60999.doc 201247828 著層間具有一對照剝離強度。 在十對日曰+ C3 死乃之目的，並參照圖4(a)及4(b)，對照多層黏著 膜1包含.具有彼此相對之一第一表面20及一第二表面21 之第—層丨1;具有彼此相對之一第一表面26,及一第二表 面23之—第一黏著層14,；及具有彼此相對之一第一表面32 及第—表面29’之一第二黏著層17、第一黏著層14，之第 一表面23與支撐層u之第一表面2〇彼此黏著接觸。第二黏 者f 17’之第二表面29.與第一黏著層14，之第—表面％，彼此 黏著接觸。第一黏著層14，之第一表面26·實質上不具有第 一輪廓（例如，不具有第—輪廟35)，及第二黏著層17•之第 一表面29實質上不具有第二輪廓(例如，不具有第二輪廓 38)因此，該對照多層黏著膜1，之第一 14，與第二17，黏著 層間之黏著介面47,實質上不具有輪廓化介面(例如，不具 有輪廓化介面50) » ' 對照多層點著膜r之支榜層心第-黏著層U,及第二黏 者層17’各具有與本發明多層黏著膜1之支樓層U、第一黏 著層及第二黏著層17實質上相同之組成及尺寸(例如， 厚度）。 該對照多層黏著膜之第一與第二黏著層間之對照剝離強 度可視’例如，黏著層之組成及該第一黏著層是否至少部 份固化而大範圍變化。一般而言，當在室溫、鮮制離 值、3〇5 “分鐘02英寸/分鐘）之制離速度下確定時，一 對照多層黏著膜（其第一與第-黏装a 畀第一黏者層之間）具有U.6牛頓/ 米（N/M)至38.6 N/M(30克力/英寸 J UF/央寸）至100 gF/英 160999.doc •10· 201247828 寸）’或 11.6N/M 至 30.9N/M(30gF/英寸至 8〇gF/英寸），或 U謂河至23.2 N/M(3〇 gF/英寸至6〇奶英寸）之對照剝離 強度（或黏著力）。 根據本發明之多層黏著膜(第一與第二黏著層之間)一般 具有較對照多層黏著膜(第一與第二黏著層之間)之對昭： 離強度小至少50百分比之剝離強度。根據本發明之多層黏 著膜（第一與第二黏著層之間）可具有比對照多層黏著膜（第 一與第二黏著層之間)之對照剝離強度小至少60百分比， 或至少7 0百分比之剝離強度。 根據本發明之多層黏著臈之第一與第二黏著層間之剝離 強度相對對照多層黏著膜之第一與第二黏著層間之剝離強 度之下降一般小於100%(即，該剝離強度一般不會下降 100%)。根據本發明之多層黏著膜之第一與第二黏著層間 之制離強度相對對照多層黏著膜之第—與第二黏著層間之 剝離強度之下降一般具有99%、或95%、或90%或85%之上 限。例如，根據本發明之多層黏著膜之第一與第二黏著層 間之剝離強度可相對對照多層黏著膜之第一與第二黏著層 間之剝離強度下降鄕至99%，或60%至95%，或60%至 90%，或 70%至 85%。 根據本發月之多層黏著膜之第—與第二黏著層間之剝離 強度係可視例如黏著層之組成及第一黏著層是否至少部份 固化而大範圍變化。一般而言，當在室溫、18〇。剝離值、 m/刀釦（12英寸/分鐘）之剝離速度下測定時，根據本 發明之多層黏著⑽―與第：黏著膜之間）具有㈣眶 160999.doc 201247828 至 9.65 N/M(l gF/英寸至 25 gF/英寸）或 〇.58 N/M至 7 72 Ν/Μ(1·5 gF/英寸至 2〇 gF/英寸）或 〇 77 N/M至 5.79 gF/英寸至15gF/英寸）之剝離強度。 根據本發明之多層黏著膜之第-黏著層與支#層間之剝 離強度較第一與第二黏著層間之剝離強度大，以使當第一 與第二黏著層彼此分離時’該第一黏著層與該支撐層實質 上維持彼此黏附…般而言，當在室溫、列。剝離值、 _/分鐘（12英寸/分鐘）之剝離速度下測料，根據本發明 二黏著膜之第一黏著層與支撐層間之剝離強度(或黏 :·、78 N/M至 390 N/M(200 gF/英寸至 1000 gF/英寸）， 或 195 N/M 至 312 N/M(500 gF/英寸至 _ gF/英寸）。若一 ^立物件（例如’―秒晶圓）與根據本發明之多層黏著膜之 著層之第-表面黏著接觸，則該獨立物件與該第二 =二之：離強度大於第一與第二黏著層間之剝離強 ”-與第二黏著層彼此分離時，該獨立物件與 第一黏者層實質上維持彼此黏附。 第 月之多層黏著膜而言：第一黏著層(例如，14)之 例如，26)具有一第一輪廓（例如，35).及/1 q 第二黏荃思/v , , ，及/或该 者層（例如，17)之第二表面（例如，2%1 輪心例如，38)。於一實施例中：該第^層有；；第二 14)之笛一 * 黏著層（例如， 表面（例如，26)具有一第一輪靡, 該第二黏荽麻， ^ #輪廓（例如，35);及 黏者層（例如，17)之第二表面（例 二輪廟（例如，38)。 29)不具有第 月之多層點著膜之第一輪靡及第二輪廓各自獨立及 160999.doc -12- 201247828 叙包含可具有實質上相同形狀及不同形狀之複數個微結 構。於一實施例中，該第一輪廓及該第二輪廓各自獨立地 包含複數個微結構，該等微結構獨立地具有選自以下形狀 之一形狀：圓錐形、角錐形、隆脊形、通道形、矩形、球 形、卵形、圓錐形、不規則形狀及其等兩或更多者之組 合。 針對非限制性說明之目的並參照圖5(勾至5(h)，該等圖 顯不在第一黏著層14之第一表面26上具有各形狀之第一輪 廓35微結構。針對說明方便之目的，在圖5(a)至5(h)中將 各種微結構形狀顯示為實質上駐存在第一黏著層14之第一 表面26上。期望不受任何理論約束，據信該等微結構實際 上駐存在第一黏著層14之第一表面26内及上，且相應地亦 界疋第表面26。第二黏著層17之第二表面29之輪廓38可 同時或替代地包含在圖5(a)至（5h)中及參照該等圖顯示之 各種微結構形狀。 第一輪廓35可包含具有圓錐形之微結構53，如圖5(a)中 所顯示。第一輪廓35可包含具有角錐形56之微結構，如圖 5(b)中所顯示。如圖5((；)中所顯示，第一輪廓35可包含具 有隆脊59及/或凹槽62之微結構。第一輪廓35可包含具有 球形（包括半球形）65之微結構，如圖5(d)中所顯示。如圖 50)中所顯示，第一輪廓35可包含具有卵形（例如，搞圓 形）68之微結構。參照圖5(f)，第一輪廓35可包含具有矩形 (例如，矩管狀，包括正方形管狀）71之微結構。第一輪廓 35可包含具有圓柱形74之微結構，如圖5(g)中所顯示。如 160999.doc •13· 201247828 圖5(h)中所顯示，第一 向磨35可包含具有不規則 微結構H第 料現料狀77之 罘一輪廓可各自獨立地包 代表性描述之形狀中$ +^ 八有所引述且 狀中兩或多者之微結構。 第-及第二輪廓之微結構各自—般 複數個凸升點。各一有次界疋 因此m 有至少一鄰近凸升點，及 因此，界疋複數個鄰近凸升 开點對。鄰近凸升點對間之平妁 距離可藉由，例如，輪廒卟矣&amp; Ί又十枸 微放大）分析量化。於一管祐如士 九·4 、實Μ巾，第一輪廓及第二輪廓 各自獨立地具有複數個凸升 开點且第一輪廓及第二輪廓各 地具有—般大於或等於1〇叩且小於或等於300 叫，例如，大於或等於25 _且小於或等於25〇 _之鄰近 凸升點對間之平均距離。 針對非限制說明之目的並參照圖6 ’將第一點著層“之 第-表面26之第-輪廊35繪製成包含具有圓錐形”之微結 構，各微結構具有或界定—凸升⑽。對比複數個鄰近凸 升έ對83間之複數個距離86以提供鄰近凸升點對間之平均 距離》 除具有或界定複數個凸升點外，第一及第二輪廓之微結 構各自一般及獨立地具有或界定複數個凹陷點（在垂直方 向上相對複數個凸升點較低）。各凹陷點一般具有至少一 鄰近凹陷點，及因此，界定複數個鄰近凹陷點對。鄰近凹 陷點對間之平均距離可藉由，例如，輪廓化表面之顯微放 大（例如，光顯微放大）分析量化。於一實施例中，第一輪 廓及第二輪廓各自獨立地具有複數個凹陷點對，且第一輪 I60999.doc •14- 201247828 廓及第二輪廓各自獨立地具有一般大於或等於10 μηι且小 於或等於300 μπι，例如，大於或等於25 μηι且小於或等於 25 0 μηι之鄰近凹陷點對間之平均距離。 針對非限制性說明之目的並進一步參照圖6，將第一黏 著層14之第一表面26之第一輪廓35繪製成包含具有圓錐形 53之微結構，各微結構具有或界定一凹陷點89。鄰近凹陷 點對92之間具有一距離95。對比複數個鄰近凹陷點對92間 之複數個距離95以提供鄰近凹陷點對間之平均距離。 第一及第二輪廓可各自獨立地藉由以下方法形成：包 括，例如，化學蝕刻、表面切削（或刻模），及/或壓縮壓印 (例如，衝壓）。 對於光化輻射可固化黏著層（如，第一黏著層），可使戶 化干蝕刻來使表面輪廓化。例如，一般將一遮罩放置於羊 輪廊化之表面上或覆蓋該表面，及將光化輻射（例如，^ 外光）施用於整個遮罩，但僅使表面聚合有限深度（該有砰 深度小於黏著層之整個厚度）。移除該遮罩，及藉由曝灣 於將未交聯聚合物自特定(例如，未曝露)表面區域移除, 適宜溶劑以使表面顯影’藉此，獲得輪廓化點著表面。可 藉由使高廢液體喷射(例如，水喷射，視需要包含研磨介 質）或高能量電磁輻射束（例如，高能量雷射） 面來實現表面切削，以移除 “表 藉由局部研磨及/或局部高溫分解^聚例如’ 於-實施例中，第一及第二輪廟各自獨立地藉 面之壓縮壓印（例如’衝壓或塵紋）形成。利用Μ縮壓印， 160999.doc -15 - 201247828 在高壓及視需要高溫條件下將表面上具有負型圖形或所需 輪廓形式之一模板壓向及/或壓入黏著表面。模板之負型 圖形或形式意指模板表面上之凹陷在輪廓化黏著表面上形 成凸升點，及模板表面上之凸升點在輪廓化黏著表面内形 成凹陷。該模板可由任何適宜材料製成，條件係其較所壓 向/壓入之黏著表面硬。例如，該模板可係由一或多種金 屬、陶瓷（例如，玻璃）及/或交聯聚合物製成。該模板可實 質上係固體’或其可呈網狀物或網篩之形式。 於一實施例中，用於形成第一輪廓及/或第二輪廓之模 板係由金屬製成之一網篩或網狀物。於另一實施例中，該 模板係具有大於或等於10 μιη且小於或等於3〇〇从爪，例 如，大於或等於25 μιη且小於或等於25〇 μιη之網筛筛目（或 設計）之來自顆粒篩之金屬網篩或網狀物（例如，選自Μ μηι網目、55 μηι網目及/或250㈣網目網篩）。 本發明之多層黏著膜之支樓層可由任何適宜材料製成， 如，紙張、金屬（例如，金屬箱片）' 聚合材料、陶曼（例 如，玻璃，如玻璃片或編織纖維玻璃墊）及其等組合（包括 摻合物及/或多層體該支禮層可包含—單層或多層（例 如，2或更多層）。多層支撐層可藉由本技藝已知方法製 成，如，共擠壓及/或層壓。多層支撐層之鄰接層可彼此 直接緊靠或其間插入一黏著（或黏結）層。包含一或多種聚 合材料之支撐層令之各層可獨立地進行單軸拉伸（或牽 引）、雙軸拉伸或非單軸及雙軸拉伸。於一實施例中，該 支撐層係由一單層構成。 160999.doc •16· 201247828 該支樓層之第-表面（例如，第一表面2〇)可因以下目的 進行本技藝已知之表面處理：包括’但不限制於改良對 第-黏著層(例如’ H)之黏附。該支撐層之第一表面‘進 行之表面處理之實例包括，但不限制於，酸（如，絡酸）曝 露、曝露於臭氧、火焰處理、曝露於一或多種離子化氣體 及其等組合。此外或替代地，該支撐層之第一表面(例 如，20)可藉由一塗層（如，矽烷功能塗層）界定。可藉由本 技藝已知之方法，如，喷塗、浸潰及幕塗將塗層施用至該 支撐層。該支撐層之第二表面（例如，21)可進行如第一表 面相同之處理（例如，黏附增進處理，包括，塗層）。一般 而5，該支樓層之第二表面不進行黏附增進處理。 於一貫施例中，該支撐層包含含有聚合物之至少一層， 該聚合物可選自熱塑性聚合物、熱固性聚合物及其等組 合。製造該支撐層之聚合物之實例包括，但不限制於，聚 稀烴，包括低密度聚乙稀、線型聚乙浠、線型低密度聚乙 烯、中等密度聚乙烯、高密度聚乙烯、超低密度聚乙烯； 無規及嵌段共聚聚烯烴’如’具有選自乙烯、丙烯、丁 稀、戊烯及己烯中之兩或多者之單體殘基之共聚物；乙烯/ 乙酸乙烯酯共聚物、離子聚合物樹脂、乙烯/(甲基）丙烯酸 共聚物、乙烯/(曱基）丙烯酸酯（無規或交替）共聚物、聚胺 基曱酸酯；聚酯，如，聚對苯二甲酸乙二酯及聚萘二甲酸 乙二酯；聚碳酸酯、聚醯亞胺、聚醯胺、聚醚醚酮、聚苯 硫越；含氟聚合物、聚氯乙烯、聚偏二氣乙烯、纖維素樹 脂、聚矽氧樹脂及其等組合。 160999.doc •17- 201247828 於一實施例中’該支撐層係由一單層構成，包含諸如聚 乙烯之聚烯烴，且具有60°C至120°C(例如，約7〇t)之炫 該支撐層中之各層可獨立地包含一或多種添加劑。可獨 立地包含於支撐層中各層（例如，各聚合層）中之添加劑之 實例包括，但不限制於，熱穩定劑、紫外光穩定劑 '顏 料、染料、抗靜電劑 '增塑劑及其等組合。 於一實施例中，及如本文中所更詳細地論述，該第一黏 著層（例如，14)可藉由曝露於光化輻射（例如，紫外光、χ_ 射線及/或電子束）而至少部份固化。當該第一黏著層可藉 由曝露於光化_而至少部份固化日夺，於一實施例中，該 支樓層（例如，n)可實質上使光化輻射穿透（即，其具有對 ;所通過之光化賴射之高透射率）ogUb，衝㈣支樓層 (例如，11)之第二表面（例如，21)之光化賴射t穿過該支 撐層之主體或核心，經由該支撐層之第-表面(例如，20) 射出’並進入第—#著層（例如’ 14)，以導致該第一黏著 層之至少部份固化（例如，光聚合）。 該支撐層可具有任何適宜厚度，條件係其可支撑並财受 上層所進行之搡作(例如，如本文進-步論述之晶片切 割操作）。該支撐層—般 奴 Z、有 3 μιη至 200 μιη，或 1〇 ^^至 15〇叫’或2〇_至1〇0叫之厚度。 -亥第毒占者層可包含—單層或多個層⑼如。Μ &gt; )_。當該第-黏著層包含兩或更多個層時，各層可具有 相同或不同組成。一般而言，第一黏著層係由一單層構 I60999.doc • 18· 201247828201247828 VI. Description of the Invention: [Technical Field] The present invention relates to a multi-layer adhesive film comprising a ply layer, a first adhesive layer on the branch floor or covering the branch and abutting the first One of the adhesive layers is the second adhesive layer. At least one of the abutting surfaces of the first and second adhesive layers each have a first contour and a second contour. The first and/or second contours are each individually selected such that the separation strength between the first and second adhesive layers is less than the control multilayer adhesive film of the first and first rims without the δ hai first and the first porch. Used as a cutting die attach film. [Prior Art] In a particular application, a film of ίκ m X - milk potential is maintained in situ during the initial processing step; and subsequently separable in 4 or more subsequent processing steps Allowing the processed portion of the article to adhere to a separate substrate. For semiconductor device fabrication, for example, a conductive wafer (eg, '-Shi Xi wafer) is typically attached to a die attach film. A particle attachment film or layer. The dicing die attach film generally comprises a substrate layer q a pressure sensitive (four) layer on the substrate layer and a die (tetra) film on the pressure sensitive layer. The semiconductor wafer, when adhered to the dicing die attach film, may be polished and/or thinned (eg, by grinding), and then the wafer is diced into smaller wafers, such as smaller Wafers are attached to the substrate of the dicing die attach film, respectively. The step 1 forms a cut-off path for the substrate layer that smoothly extends to the wafer (4), the die-attached adhesive material, and the pressure-sensitive adhesive material. The dicing wafers separated from each other by the intersecting scribe lines are then removed (e.g., picked up) from the dicing die attach s 160999.doc 201247828 in such a manner that the die attach adhesive material remains at the bottom of each wafer. The pressure sensitive adhesive material remains adhered to the substrate of the dicing crystal attachment film. The wafers are then adhered to a separate substrate, such as a semiconductor device, by leaving the die attach adhesive material at the bottom. In order to promote or ensure that the die attach adhesive material is separated from the underlying adhesive adhesive material during the picking up step, the pressure sensitive adhesive material and the die attach adhesive are reduced by hardening or @activating the pressure sensitive adhesive material. Adhesion between materials. Initial processing steps are typically performed, such as grinding and/or polishing the wafer, followed by curing (e.g., crosslinking) of the pressure sensitive adhesive material, and then performing the picking up step (e.g., after the cutting step). The pressure sensitive adhesive material may be thermally and/or photopolymerizable/curable, and cured by exposing the pressure sensitive adhesive material to high temperature and/or actinic radiation. The curing of the pressure sensitive adhesive material may be uneven, resulting in a variable decrease in adhesion between the pressure sensitive adhesive material and the die attach adhesive material. A variable reduction in adhesion can result in insufficient separation of the die attach adhesive material from the underlying viscous adhesive material during the picking up step. For example, during the picking up step, the wafer may be separated from the die attach adhesive material and/or a portion of the pressure sensitive adhesive material may be raised with the die attach film, in each case, causing the wafers Adhesion to the semiconductor device is reduced or eliminated. Novel multilayer films exhibiting improved (e.g., controlled and uniform) separation between adjacent adhesive layers are desired. Further novel multilayer films of these inventions are useful as dicing die attach films. SUMMARY OF THE INVENTION According to the present invention, there is provided a multilayer adhesive film comprising: (a) a wrap layer having a first surface; 160999.doc 201247828 (b) having a first surface opposite to each other and a second a first adhesive layer of the surface, the second surface of the first adhesive layer and the first surface of the support layer are in adhesive contact with each other; and (c) having one of the first surface and the second surface opposite to each other The second adhesive layer 'the first surface of the first adhesive layer and the second surface of the second adhesive layer are in adhesive contact with each other and have a peeling strength between each other, wherein at least one of the following cases exists: (1) . The first surface of the mysterious-adhesive layer has a first contour, and (1) the second surface of the second adhesive layer has a second contour, and further wherein the first contour and the second contour system are each separate Optionally, the control multilayer, the first adhesive layer and the second adhesive layer-control multilayer adhesive film are compared to the package 3, wherein the control multilayer adhesive film does not contain the first contour and is not a. The first contour of the first contour and the first surface of the first adhesive layer and the second surface of the first adhesive layer have a comparative peel strength, and the smective peel strength is less than the control peel strength. Further in accordance with the present invention, there is provided an assembly comprising: (I) said multilayer adhesive tape, and (II) a separate article (eg, '-sheet or wafer, such as a stone wafer), having a The first surface of the second adhesive layer of the layer is adhered to contact with one of the second surfaces. As used herein and in the scope of the patent application, unless otherwise stated, the molecular weight ', such as the number average molecular weight', utilizes appropriate standards, such as , Phenylene standard 'determined by gel permeation chromatography. 160999.doc 201247828 As used herein and in the scope of the patent application, the term "(meth) acrylate" and similar terms, such as "ester of (meth) acrylate" means acrylate and / or methyl propylene roast Acid ester. As used herein, the term "polymer" means a homopolymer, i.e., a polymer made of a single monomer, and a copolymer, i.e., a polymer made of two or more monomers. As used herein and in the scope of the patent application, the term "actinic radiation" means electromagnetic radiation that can initiate free radical polymerization of a composition comprising a self-polymerizable ethylenic unsaturation, and includes, but is not limited to, Infrared, visible, ultraviolet, electron beam (4), x-ray and the like are combined in parallel and/or in succession. Features that characterize the present invention are pointed out in a precise manner in the scope of Patent 4, which is incorporated herein by reference. These and other features of the present invention, "the advantages of the invention, and the <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> <RTIgt; "Bottom", "Inside", "Outside", "Right", "Left" and "Vertical" in the scope of application. "Horizontal", "Top", "&amp;" _" and similar terms are used in the figure. The invention is described in the context of the invention. Except for the North, ^, and otherwise stated, otherwise the use of these terms is unintentional. The system is intended to take other positions and all ranges are considered to be within the scope of the invention. For example, the range "1 to, ten, and v. Any of the #3 contained in the cover and #160999.doc 201247828 i〇" shall be considered to include between the minimum value i and the maximum value 1〇 (and all and Range, that is, all sub-ranges starting with a minimum value 丨 or greater and ending with a maximum value of 10 or less, for example, 1 to 61, 7.8, 5.5 to 1 〇, etc. · Unless otherwise stated, Otherwise, all numbers or expressions such as the size of the stated structure, the amount of ingredients, etc., as used in the specification and the scope of the patent application, are to be construed as being modified by the term "about" in all cases. 1 to 8 (4), the same reference numerals are used to dry the same components and structural features unless otherwise stated. Referring to Figures 1 to 3, etc., a multilayer adhesive film according to the present invention is shown. The multi-layered adhesive film 1 comprises a support layer H having a first adhesive layer 14 on the support layer, and a second adhesive layer &lt; 11 on the first adhesive layer having opposite sides (for example, substantially One facing away from each other) one of the first surface 20 and the second surface first The first reinforcing surface 4 and the second surface 23β are opposite to each other (for example, substantially one first surface 32 and one second opposite to each other) Surface 29. In particular, the second surface 23 of the first adhesive layer 14 is in adhesive contact with the first surface 20 of the support layer η. ^+ touches the 'adhesive layer' as used herein and in the scope of the patent application Adhesive contact between the two surfaces and the first surface of the support layer means: (1) direct contact with each other; or (Π) due to the insertion of a separate layer or film (for example, - separate adhesive layer or film) between each other Indirect contact with each other. In one embodiment, the first surface of the first layer and the first surface of the layer I60999.doc 201247828 are in direct adhesion to each other. The first surface 26 of the first adhesive layer 14 is The second surface 29 of the second adhesive layer 17 is in adhesive contact with each other and has a peeling strength with each other. Generally, the first surface of the first adhesive layer and the second surface of the second adhesive layer are in direct adhesion to each other* The first surface 32 of the adhesive layer 17 defines a plurality of layers The film-external adhesive surface 44 (e.g., the outer upper adhesive surface 44). The second surface 21 of the support layer defines an outer support surface 41 of the multilayer adhesive film 1 (e.g., an outer lower abutment surface 41). In the multilayer film of the present invention, the first surface 26 of the first adhesive layer 14 has a first contour 35; and/or the second surface 29 of the second adhesive layer 17 has a second contour 38. See, for example, 2 and 3. Therefore, the adhesive interface 47 between the first and seventh adhesive layers has a rounded interface. See, for example, Figure 1. The first (e.g., '35) and second (e.g., 38) contours are independent. Selecting such that the first (eg, 14) and second (eg, (7) adhesive layers of the multilayer film of the present invention have a peel strength less than that of the control multilayer adhesive film without the first (four) and without the second porch) The control peel strength between the two adhesive layers. The 忒 control multilayer film has a support layer, the first adhesive layer and the second adhesive layer 'each layer has the same core as the core layer of the present hairpin. In addition, the control film layer is substantially the same as the multilayer film of the present invention. Manufactured under (for example, waste force and: degree). However, in the case of the multi-layered adhesive film, the first surface of the first layer does not have the first contour; and the first side of the second adhesive layer does not have the second contour. The control multilayer film had a control peel strength between the first and second adhesive layers of the I60999.doc 201247828 layer. For the purpose of ten pairs of 曰 + C3 死, and with reference to Figures 4(a) and 4(b), the control multilayer adhesive film 1 comprises a first surface 20 and a second surface 21 opposite to each other. a layer 1 having a first surface 26 opposite to each other, and a second surface 23, and a second adhesive layer having a first surface 32 and a first surface 29' opposite to each other The first surface 23 of the layer 17, the first adhesive layer 14, and the first surface 2 of the support layer u are in adhesive contact with each other. The second surface 29 of the second adhesive member f' is in contact with the first surface of the first adhesive layer 14, which is in adhesive contact with each other. The first adhesive layer 14, the first surface 26· has substantially no first contour (for example, does not have the first wheel temple 35), and the first surface 29 of the second adhesive layer 17 has substantially no second contour (For example, without the second contour 38) Therefore, the control multilayer adhesive film 1, the first 14 and the second 17, the adhesive interface 47 between the adhesive layers, has substantially no contouring interface (for example, no contouring) Interface 50) » 'In contrast to the multi-layered film r-layer, the core-adhesive layer U, and the second adhesive layer 17' each have a support layer U, a first adhesive layer and a layer of the multilayer adhesive film 1 of the present invention. The second adhesive layer 17 has substantially the same composition and size (e.g., thickness). The control peel strength between the first and second adhesive layers of the control multilayer adhesive film can be varied, for example, depending on the composition of the adhesive layer and whether the first adhesive layer is at least partially cured. In general, a control multilayer adhesive film (the first and the first-adhesive a 畀 first) when determined at room temperature, fresh separation, 3制5 "minute 02 inches / minute" separation speed Between the layers of the adhesive layer) U.6 Newtons/meter (N/M) to 38.6 N/M (30 gram force/inch J UF/central inch) to 100 gF/inch 160999.doc •10·201247828 inch) Or 11.6 N/M to 30.9 N/M (30 gF/inch to 8 〇gF/inch), or U to river to 23.2 N/M (3 〇gF/inch to 6 〇 milk inch) control peel strength (or adhesion) The multilayer adhesive film (between the first and second adhesive layers) according to the present invention generally has a comparison with the comparative multilayer adhesive film (between the first and second adhesive layers): at least 50% less than the strength Peel strength. The multilayer adhesive film (between the first and second adhesive layers) according to the present invention may have a control peel strength at least 60% less than the control multilayer adhesive film (between the first and second adhesive layers), or at least 70% peel strength. The peel strength between the first and second adhesive layers of the multilayer adhesive tape according to the present invention is the first compared to the control multilayer adhesive film The decrease in the peel strength between the second adhesive layers is generally less than 100% (ie, the peel strength generally does not decrease by 100%). The separation strength between the first and second adhesive layers of the multilayer adhesive film according to the present invention is relatively thick compared to the control. The decrease in the peel strength between the first and second adhesive layers of the film generally has an upper limit of 99%, or 95%, or 90% or 85%. For example, between the first and second adhesive layers of the multilayer adhesive film according to the present invention The peel strength may be reduced to 99%, or 60% to 95%, or 60% to 90%, or 70% to 85%, relative to the peel strength between the first and second adhesive layers of the control multilayer adhesive film. The peel strength between the first and second adhesive layers of the plurality of adhesive films may vary widely depending, for example, on the composition of the adhesive layer and whether the first adhesive layer is at least partially cured. Generally, at room temperature, 18 Å. When measured at a peeling speed of m/knife (12 inches/minute), the multilayer adhesive (10)-to-adhesive film according to the present invention has (iv) 眶160999.doc 201247828 to 9.65 N/M (l gF) /inch to 25 gF/inch) or 〇.58 N/M to 7 Peel strength of 72 Ν/Μ (1·5 gF/inch to 2〇gF/inch) or 〇77 N/M to 5.79 gF/inch to 15gF/inch. The first-adhesive layer of the multilayer adhesive film according to the present invention The peel strength between the layers and the support layer is greater than the peel strength between the first and second adhesive layers such that when the first and second adhesive layers are separated from each other, the first adhesive layer and the support layer substantially remain adhered to each other. For example, when measured at room temperature, column peeling value, peeling speed of _/min (12 inches/min), the peel strength between the first adhesive layer and the support layer of the two adhesive films according to the present invention (or viscosity: · 78 N/M to 390 N/M (200 gF/inch to 1000 gF/inch), or 195 N/M to 312 N/M (500 gF/inch to _ gF/inch). If an object (for example, a 'second wafer) is in contact with the first surface of the layer of the multilayer adhesive film according to the present invention, the independent object and the second=two: the intensity is greater than the first and the first The peeling between the two adhesive layers is strong" - when the second adhesive layer is separated from each other, the independent object and the first adhesive layer substantially remain adhere to each other. The multilayer adhesive film of the month: the first adhesive layer (for example, 14) For example, 26) has a first profile (eg, 35). and /1 q a second bond /v, , , and/or a second surface of the layer (eg, 17) (eg, 2%) 1 a wheel center, for example, 38). In one embodiment: the second layer has; a second 14) flute-adhesive layer (eg, the surface (eg, 26) has a first rim, the second Sticky ramie, ^ #profile (for example, 35); and the second surface of the viscous layer (for example, 17) (such as the second round temple (for example, 38). 29) does not have the first layer of the first month of the film The rim and the second contour are independent and 160999.doc -12- 201247828 includes a plurality of microstructures having substantially the same shape and different shapes. In an embodiment, the first contour and the second contour each independently comprise a plurality of microstructures, the microstructures independently having one shape selected from the group consisting of a conical shape, a pyramid shape, a ridge shape, and a channel shape. a combination of two or more of a rectangle, a sphere, an oval, a cone, an irregular shape, and the like. For the purposes of non-limiting illustration and with reference to Figure 5 (hook to 5(h), the figures are not in the first The first surface 26 of the adhesive layer 14 has a first contour 35 microstructure of each shape. For the convenience of description, various microstructure shapes are shown as substantially resident in FIGS. 5(a) to 5(h). The first surface 26 of the adhesive layer 14 is desirably unconstrained by any theory, and it is believed that the microstructures actually reside in and on the first surface 26 of the first adhesive layer 14, and correspondingly the first surface 26. The contour 38 of the second surface 29 of the second adhesive layer 17 may be simultaneously or alternatively included in the various microstructure shapes shown in Figures 5(a) through (5h) and referenced to the figures. The first contour 35 may comprise a conical microstructure 53 as shown in Figure 5(a). The first contour 35 can A microstructure having a pyramidal shape 56 is shown as shown in Figure 5(b). As shown in Figure 5 ((;), the first profile 35 can comprise a microstructure having ridges 59 and/or grooves 62. The first contour 35 can comprise a microstructure having a spherical shape (including a hemispherical shape) 65, as shown in Figure 5(d). As shown in Figure 50, the first contour 35 can comprise an oval shape (e.g., rounded) The microstructure of the shape 68. Referring to Figure 5(f), the first profile 35 can comprise a microstructure having a rectangular shape (e.g., a rectangular tube comprising a square tube) 71. The first profile 35 can comprise a microstructure having a cylindrical shape 74. , as shown in Figure 5 (g). As shown in Fig. 5(h), the first direction grind 35 may comprise a profile having an irregular microstructure H, a first material profile 77, which may each independently represent a representative shape. In the middle of $ + ^ eight has a description and the microstructure of two or more in the shape. The microstructures of the first and second contours each have a plurality of convex lift points. Each has a secondary boundary, so m has at least one adjacent convex point, and therefore, the boundary has a plurality of adjacent convex rising points. The distance between the adjacent points of the raised point can be quantified by, for example, rim &amp; Ί and ten 枸 micro-amplification. In the first tube and the second contour, each of the first contour and the second contour independently has a plurality of convex opening points and the first contour and the second contour are generally greater than or equal to 1 〇叩 and Less than or equal to 300, for example, greater than or equal to 25 _ and less than or equal to 25 〇 _ the average distance between adjacent pairs of raised points. For the purposes of non-limiting description and with reference to Figure 6 'the first-to-span 26 of the first-point layer', the first-wheel rim 35 is drawn to include a microstructure having a conical shape, each microstructure having or defining a bulge (10) . Comparing a plurality of distances 86 between a plurality of adjacent convex lift pairs 83 to provide an average distance between adjacent pairs of raised points. In addition to having or defining a plurality of convex points, the microstructures of the first and second contours are generally Independently having or defining a plurality of recessed points (lower relative to a plurality of raised points in the vertical direction). Each recessed point generally has at least one adjacent recessed point and, thus, a plurality of adjacent recessed point pairs. The average distance between adjacent pairs of recessed points can be quantified by, for example, microscopic magnification (e.g., light microscopy) of the contoured surface. In one embodiment, the first contour and the second contour each independently have a plurality of pairs of concave points, and the first wheel I60999.doc •14-201247828 and the second contour each independently have a value greater than or equal to 10 μηι An average distance between adjacent pairs of recessed points that is less than or equal to 300 μπι, for example, greater than or equal to 25 μηι and less than or equal to 25 0 μηι. For purposes of non-limiting illustration and with further reference to FIG. 6, the first contour 35 of the first surface 26 of the first adhesive layer 14 is depicted as comprising a microstructure having a conical shape 53 having or defining a recessed point 89. . There is a distance 95 between adjacent pairs of recesses 92. A plurality of distances 95 between a plurality of adjacent recessed pairs 92 are compared to provide an average distance between adjacent pairs of recesses. The first and second profiles can each be formed independently by, for example, chemical etching, surface cutting (or dicing), and/or compression embossing (e.g., stamping). For an actinic radiation curable adhesive layer (e.g., a first adhesive layer), a dry etching can be performed to contour the surface. For example, a mask is typically placed on or over the surface of the sheep wheel and the actinic radiation (eg, external light) is applied to the entire mask, but only the surface is polymerized to a limited depth (there is a flaw) The depth is less than the entire thickness of the adhesive layer). The mask is removed and the uncrosslinked polymer is removed from a particular (e.g., unexposed) surface area by exposure to a solvent, suitable solvent to develop the surface&apos; thereby obtaining a contoured spotted surface. Surface cutting can be achieved by spraying high waste liquid (eg, water jet, optionally including grinding media) or high energy electromagnetic radiation beam (eg, high energy laser) to remove "table by local grinding And/or local pyrolysis, for example, in the embodiment, the first and second rounds of the temple are each independently formed by a compression embossing (for example, 'stamping or dusting). Using embossing, 160999. Doc -15 - 201247828 Pressing and/or pressing a template with a negative pattern or a desired contour on the surface under high pressure and optionally high temperature. The negative pattern or form of the template means the surface of the template The depression forms a raised point on the contoured adhesive surface, and the raised point on the surface of the template forms a depression in the contoured adhesive surface. The template can be made of any suitable material, provided that it is pressed/pressed. The adhesive surface is hard. For example, the template may be made of one or more metals, ceramics (eg, glass) and/or crosslinked polymers. The template may be substantially solid 'or it may be in the form of a mesh or mesh Form. In one embodiment, the template for forming the first contour and/or the second contour is a mesh or mesh made of metal. In another embodiment, the template has a greater than or equal to 10 μm. And a metal mesh screen or mesh from the particle sieve (for example, selected from the group consisting of, for example, greater than or equal to 25 μm and less than or equal to 25 μm η mesh mesh (or design). Μ μηι mesh, 55 μηι mesh and/or 250 (iv) mesh mesh screen. The support layer of the multilayer adhesive film of the present invention may be made of any suitable material, such as paper, metal (for example, metal box) 'polymeric material, Tauman (eg, glass, such as a glass sheet or woven fiberglass mat) and combinations thereof (including blends and/or multilayers of the layer may comprise - a single layer or multiple layers (eg, 2 or more layers). The support layer can be formed by methods known in the art, such as co-extrusion and/or lamination. Adjacent layers of the multilayer support layer can be placed directly adjacent to each other or with an adhesive (or bonded) layer interposed therebetween. Material support layer The layers can be independently uniaxially stretched (or drawn), biaxially stretched, or non-uniaxially and biaxially stretched. In one embodiment, the support layer is comprised of a single layer. 160999.doc •16· 201247828 The first surface of the floor (eg, the first surface 2〇) may be subjected to surface treatments known in the art for the following purposes: including, but not limited to, improved adhesion to the first adhesive layer (eg, 'H). Examples of surface treatments performed by the first surface of the support layer include, but are not limited to, exposure to acid (eg, complex acid), exposure to ozone, flame treatment, exposure to one or more ionized gases, and the like. Or alternatively, the first surface (e.g., 20) of the support layer can be defined by a coating (e.g., a decane functional coating), which can be applied by methods known in the art, such as spraying, dipping, and curtain coating. A coating is applied to the support layer. The second surface (e.g., 21) of the support layer can be treated the same as the first surface (e.g., adhesion enhancing treatment, including coating). In general, 5, the second surface of the floor is not subjected to adhesion enhancement treatment. In a consistent embodiment, the support layer comprises at least one layer comprising a polymer selected from the group consisting of thermoplastic polymers, thermoset polymers, and the like. Examples of polymers from which the support layer is made include, but are not limited to, polythene hydrocarbons, including low density polyethylene, linear polyethylene, linear low density polyethylene, medium density polyethylene, high density polyethylene, ultra low Density polyethylene; random and block copolymerized polyolefins such as 'copolymers having monomer residues selected from two or more of ethylene, propylene, butylene, pentene and hexene; ethylene/vinyl acetate Copolymer, ionic polymer resin, ethylene/(meth)acrylic acid copolymer, ethylene/(mercapto) acrylate (random or alternating) copolymer, polyamino phthalate; polyester, such as polyparaphenyl Ethylene dicarboxylate and polyethylene naphthalate; polycarbonate, polyimine, polyamine, polyether ether ketone, polyphenylene sulfide; fluoropolymer, polyvinyl chloride, polyvinylidene Ethylene, cellulose resin, polyoxymethylene resin and the like. 160999.doc • 17- 201247828 In one embodiment, the support layer is composed of a single layer comprising a polyolefin such as polyethylene and having a brightness of 60 ° C to 120 ° C (eg, about 7 〇 t). The layers in the support layer may independently comprise one or more additives. Examples of additives that may be independently included in each of the layers of the support layer (eg, each polymeric layer) include, but are not limited to, heat stabilizers, UV stabilizers, pigments, dyes, antistatic agents, plasticizers, and And so on. In an embodiment, and as discussed in more detail herein, the first adhesive layer (eg, 14) can be at least exposed to actinic radiation (eg, ultraviolet light, x-rays, and/or electron beams) Partially cured. When the first adhesive layer can be at least partially cured by exposure to actin, in an embodiment, the support floor (eg, n) can substantially penetrate actinic radiation (ie, it has For the high transmittance of the photochemical ray that passes through, ogUb, the photochemical ray of the second surface (eg, 21) of the (four) branch floor (eg, 11) passes through the body or core of the support layer, The first surface (e.g., 20) is ejected through the first surface (e.g., 20) and enters the first layer (e.g., '14) to cause at least partial curing (e.g., photopolymerization) of the first adhesive layer. The support layer can have any suitable thickness, provided that it can support and sustain the work performed by the upper layer (e.g., wafer cutting operations as discussed further herein). The support layer is generally slave Z, having a thickness of 3 μm to 200 μm, or 1 〇 ^^ to 15 ’ or 2 〇 to 1 〇 0. - The HiDic occupant layer may comprise - a single layer or multiple layers (9). Μ &gt; )_. When the first-adhesive layer contains two or more layers, the layers may have the same or different compositions. In general, the first adhesive layer consists of a single layer I60999.doc • 18· 201247828

表面， 卜為帶子）保存一段時間，然後將第二黏著層施用至 黏著層。可將一釋放膜施用至該第一黏著層之第一 及捲起該支撐層、該第一黏著層及該釋放膜之組 曰。^該組合成卷時，該釋放膜防止該第一黏著層之第一 表面與該支撐層之第二表面融合。移除該釋放膜，然後使 該第二黏著層於該第一黏著層上形成。 該第一黏著層一般包含自黏式材料，如壓感黏著材料， 且可係一熱塑性第一黏著層或可固化第一黏著層（例如， 可藉由曝露於高溫及/或光化輻射固化）。該第一黏著層可 包含聚合物，該等聚合物選自，但不限制於，橡膠（包括 合成及/或天然橡膠）、丙烯酸系聚合物、聚矽氧聚合物、 聚乙烯醚、及其等兩或更多者之組合。 可包含於該第一黏著層中之丙烯酸系聚合物一般包括 (曱基）丙烯酸酯之殘基，如(：1至(：2〇_(甲基）丙烯酸酯單體， 包括直鍵或支鍵〇3至C2〇-(甲基）丙稀酸g旨單體、環狀匸3至 C2〇-(甲基）丙烯酸酯單體及芳族C5至Cm-(曱基）丙烯酸酯單 體。一般而言’（曱基）丙烯酸酯係選自（曱基）丙烯酸（^至 C2〇烷基酯。（甲基）丙烯酸q至C2〇烷基酯之實例包括，但 不限制於’（甲基）丙烯酸曱酯、（曱基）丙烯酸乙酯、（曱基） 丙稀酸2-經乙酯、（甲基）丙稀酸丙酯、（曱基）丙烯酸2_羥丙 160999.doc -19· 201247828 酿、（曱基）丙烯酸異丙酯、（甲基）丙烯酸丁酯、（曱基）丙稀 酸異丁酯、（甲基）丙烯酸第三丁酯、（曱基）丙烯酸2乙基 己醋、（甲基）丙烯酸月桂酯、（甲基）丙烯酸異冰片醋、（甲 基）丙烯酸環己酯及（甲基）丙烯酸3,3,5-三曱基環己酿。（曱 基）丙稀酸環烷酯之實例包括，但不限制於，（曱基）丙稀酸 環丙醋 '(甲基）丙烯酸環丁酯、（甲基）丙烯酸環戊醋、（甲 基）丙烯酸環己酯、（甲基）丙烯酸環庚酯及（甲基）丙烯酸異 冰片酯。 為改質（例如’增大）第一黏著層之黏著性，可視需要將 (曱基）丙烯酸酯與具有活性氫基（如，羧酸基、磷酸基、續 酸基、硫醇基及/或羥基）之一或多個單體共聚合。具有活 性氫基之可共聚單體一般係以單體總重量之小於或等於4〇 重量百分比之量存在。含有羧酸基（或可經轉化以含有敌 酸基）之可共聚單體之實例包括，但不限制於，丙稀酸、 曱基丙烯酸、衣康酸、馬來酸、富馬酸、巴豆酸及酸酐單 體’如’馬來酸肝及衣康酸酐。含有礙酸基之可共聚單體 之非限制性實例係磷酸2-羥乙基丙烯醯酯。包含磺酸基之 可共聚單體之實例包括，但不限制於，苯乙烯磺酸 '烯丙 基磺酸' 2-(甲基）丙烯醯胺-2-甲基丙烷磺酸、（曱基）丙稀 醯胺丙烷磺酸、（曱基）丙烯酸磺丙酯及（甲基）丙烯醯氧基 萘續酸。含有經基之可共聚單體之實例包括，但不限制 於’（甲基）丙烯酸2-羥乙酯、（曱基）丙烯酸2-羥丙酯、（甲 基）丙烯酸4-羥丁酯、（甲基）丙烯酸6-羥己酯、（曱基）丙稀 酸8-羥辛酯、（曱基）丙烯酸10-羥癸酯、（曱基）丙烯酸12_趣 160999.doc • 20· 201247828 月桂酯及（甲基）丙烯酸（4-羥曱基環己基）曱酯。 爲增大所獲得之丙稀酸系聚合物之交聯密度，可進一步 視需要將（曱基）丙烯酸酯與多官能單體共聚。多官能單體 之實例包括，但不限制於’二（曱基）丙烯酸己二醇酯、二 (甲基）丙烯酸（聚）乙二醇酯、二（曱基）丙烯酸（聚）丙二醇 酯、二（曱基）丙烯酸新戊二醇酯、二（曱基）丙烯酸異戊四 醇酯、三（甲基）丙烯酸三羥曱基丙烷酯、三（甲基）丙烯酸 異戊四醇酯及六（曱基）丙烯酸二異戊四醇酯。若存在，則 此等多官能單體係以總單體重量之小於或等於i 0重量百分 比，例如，小於或等於5重量百分比之量存在。 該第一黏著層之丙稀酸系聚合物之分子量可大範圍變 化’且基本上係經選擇以使該第一黏著層具有適宜黏著品 質。一般而言，丙烯酸系聚合物之數量平均分子量為至少 200,000且小於或等於4,0〇〇,〇〇〇(例如，3〇〇 〇〇〇至 3,500,000，或 400,000至 3,000,000)。 該第一黏著層可係可藉由曝露於高溫及/或光化輻射而 固化（即，可交聯）之可固化第一黏著層。因以下理由，需 使S亥可固化第一黏著層固化：包括，但不限制於，降低該 第一黏著層之黏著性質。可藉由合併可因該聚合物之活性 氫官能性（例如，羥基、硫醇、一級胺、二級胺及/或羧酸 基）變為反應性之一或多種交聯劑來實現第一黏著層之熱 固化。本技藝已知之交聯劑之實例包括，但不限制於，聚 異氰酸酯、聚環氧乙烷（即，聚環氧化物）及三聚氰胺。交 聯劑使用量一般係聚合物與交聯劑之總重量之小於10重量 160999.doc 201247828 百分比’如〇·1至5重量百分比。 該第一黏著層另可藉由曝露於光化輻射（例如，紫外 光 '電子束及/或X-射線）而固化。該光化輻射可固化第一 黏著層可包含：不含乙烯系不飽和性之高分子量聚合物 (例如，如上文所描述之丙烯酸系聚合物）；乙烯系不飽和 寡聚物；及/或乙烯系不飽和單體；及光化輻射活化引發 劑（例如’光引發劑）。或者’該光化輻射可固化第一黏著 層可包含：具有側接及/或末端乙婦系不飽和性之聚合物 (例如’丙烯酸系聚合物）；視需要，乙烯系不飽和寡聚物 及/或乙烯系不飽和單體；及光化輻射活化引發劑（例如， 光引發劑）。 可藉由本技藝已知之方法將側接及/或末端乙烯系不飽 和陡導入丙稀酸系聚合物中。例如，可隨後使具有側接及/ 或末端活性氫基（例如，羥基、硫醇、一級胺、二級胺或 羧酸基）之丙烯酸系聚合物與可與此等活性氫基反應之（甲 基)丙烯酸系單體(如’環氧乙烷官能性(曱基)丙烯酸酯(例 如，（曱基）丙烯酸縮水甘油酯）及異氰酸酯官能性（甲基）丙 烯酸酯（例如，異氰酸甲基丙烯醯酯））反應。 乙稀系不飽和寡聚物及乙稀系不飽和單體組分可各自獨 立地具有至少-（例如，兩或更多）乙稀系不飽和基團。乙 稀系不飽和單體組分之實例包括，但不限制於，三（甲基） 丙稀酸三經甲基丙院醋 '四(甲基)丙婦酸四經甲基甲1 酿、三（甲基）㈣酸異戊四醇醋、四（甲基）丙稀酸異戍四 ㈣、五（甲基）丙稀酸二異戊四醇單經基酉旨 '六（甲基）丙 160999.doc -22· 201247828 烯酸二異戊四醇酯及二（曱基）丙烯酸1，4-丁二醇酯。乙豨 系不飽和寡聚物之實例包括，但不限制於，以（甲基）丙烯 酸酯基封端，及具有選自胺基甲酸酯、聚醚 '聚酯、聚碳 酸酯及/或聚丁二烯之主鏈之彼等物。乙烯系不飽和寡聚 物可具有100至30,000之分子量。 可用於該光化輻射可固化第一黏著層中之光引發劑包括 熟練技術者已知之彼等物。光引發劑之實例包括，但不限 制於：α-酮醇化合物，如4-(2-羥基乙氧基）笨基（2-羥基_2-丙基）酮、a-羥基-α，α，·二甲基苯乙酮、2_曱基_2_羥基苯丙 酮及1-羥基環己基苯基酮；苯乙酮化合物，如甲氧基苯乙 酮、2,2-二曱氧基_2·苯基苯乙酮、2,2_二乙氧基苯乙酮及 2-甲基-1-[4-(甲硫基苯基]_2_嗎啉丙烷_丨；苯偶姻鰱化合 物，如苯偶姻乙醚、笨偶姻異丙醚及茴香偶姻甲醚；縮輞 化合物，如苄基二甲基縮酮；芳族磺醯氣化合物，如2-萘 磺醯氣；光活性肟化合物，如苯嗣丙二嗣·2_(鄰乙 氧基羰基)肟’二笨甲明化合物，如二笨曱酮、苯曱醯笨 曱馱及3,3 -一曱基甲氧基二苯甲酮；噻噸酮化合物，如 噻頓酮、2-氣噻噸鲷' 2_甲基噻噸酮、2,4_二曱基噻噸 酮、異丙基噻噸酮、24_备 2一氣噻噸酮、2,4-二乙基噻噸酮 及 2，4 ·,—&quot;異丙基。塞 tuu . 吞％綱，樟腦醌；函化酮；醯基膦氧化 物；醯基膦酸酯及苴笙a l 八丹寺兩或更多者之組合。 所存在之光引發鈿夕县 和之置一般係經選擇以獲得如下組合： 所需之固化程度（例知 、B|曰 I】如’測1增大之表面硬度）；在有限時 間内；及曝露於特定強许+， 強度之光化輻射一段指定時間。一船 160999.doc -23- 201247828 向s，該光引發劑 …八从寸，王里曰分比之量（例 。，樹脂組分總重量之〇.〇5至2〇重量百分比）存在。 第一黏著層之各層可獨立地包含—或多種添加劑。可獨 立地包含於第-黏著層之各層（例如，各聚合層）中之添加 劑之實例包括，但不限制於，熱穩定劑、f外光穩定劑 例如，不可光聚合之第一黏著層）、顏料、 劑、增塑劑及其等組合。 柷靜電 =勒著層可具有任何適宜厚度(例如，以使其可保 持於其第-表面上提供之輪廊）。—般而言，該第一黏著 層具有小於或等於1 〇〇 如 5至一厚度。 帥，或2至3〜’或The surface, the tape is stored for a while, and then the second adhesive layer is applied to the adhesive layer. A release film can be applied to the first of the first adhesive layer and the set of the support layer, the first adhesive layer, and the release film. When the film is assembled into a roll, the release film prevents the first surface of the first adhesive layer from being fused with the second surface of the support layer. The release film is removed, and then the second adhesive layer is formed on the first adhesive layer. The first adhesive layer generally comprises a self-adhesive material, such as a pressure sensitive adhesive material, and may be a thermoplastic first adhesive layer or a curable first adhesive layer (for example, may be cured by exposure to high temperatures and/or actinic radiation). ). The first adhesive layer may comprise a polymer selected from, but not limited to, rubber (including synthetic and/or natural rubber), acrylic polymer, polyoxyl polymer, polyvinyl ether, and Wait for a combination of two or more. The acrylic polymer which may be included in the first adhesive layer generally includes a residue of a (fluorenyl) acrylate such as a (:1 to (:2〇_(meth)acrylate monomer, including a straight bond or a branch). 〇3 to C2〇-(meth)acrylic acid g monomer, cyclic 匸3 to C2 〇-(meth) acrylate monomer and aromatic C5 to Cm-(indenyl) acrylate monomer In general, the '(fluorenyl) acrylate is selected from (mercapto)acrylic acid (^ to C2 alkyl acrylate. Examples of (meth)acrylic acid q to C2 decyl ester include, but are not limited to, ' Ethyl methacrylate, ethyl (mercapto) acrylate, (mercapto) acrylate 2-ethyl ester, propyl (meth) acrylate, (mercapto) acrylic acid 2-hydroxypropyl 160999.doc -19· 201247828 Brewing, isopropyl (meth) acrylate, butyl (meth) acrylate, (butyl) isobutyl acrylate, (butyl) (meth) acrylate, (mercapto) acrylic 2 Ethyl hexanoic acid, lauryl (meth)acrylate, isobornyl (meth)acrylate, cyclohexyl (meth)acrylate, and 3,3,5-trimethylcyclo(meth)acrylate. Examples of (mercapto)alkyl cycloalkyl esters include, but are not limited to, (fluorenyl) acrylic acid propylene vinegar 'cyclobutyl (meth) acrylate, (meth) acrylate valerate, (A) Base) hexyl hexyl acrylate, cycloheptyl (meth) acrylate and isobornyl (meth) acrylate. To modify (eg, 'increase" the adhesion of the first adhesive layer, (meth) acrylate may be used as needed The ester is copolymerized with one or more monomers having an active hydrogen group (eg, a carboxylic acid group, a phosphate group, a carboxylic acid group, a thiol group, and/or a hydroxyl group). The copolymerizable monomer having an active hydrogen group is generally The total monomer weight is present in an amount less than or equal to 4% by weight. Examples of copolymerizable monomers containing a carboxylic acid group (or may be converted to contain a diacid group) include, but are not limited to, acrylic acid, hydrazine Acrylic acid, itaconic acid, maleic acid, fumaric acid, crotonic acid and anhydride monomers such as 'maleic acid liver and itaconic anhydride. Non-limiting examples of copolymerizable monomers containing acid groups are phosphoric acid 2 - hydroxyethyl propylene phthalate. Examples of comonomers containing sulfonic acid groups include, but are not limited to Made from, styrenesulfonic acid 'allylsulfonic acid' 2-(meth)acrylamide amine-2-methylpropanesulfonic acid, (mercapto) acrylamide propane sulfonic acid, (mercapto) acrylate sulfonate Propyl esters and (meth) propylene oxime naphthalene acid. Examples of copolymerizable monomers containing a thiol group include, but are not limited to, 2-hydroxyethyl (meth) acrylate, 2-(fluorenyl) acrylate Hydroxypropyl ester, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, (曱基)Acrylic 12_趣160999.doc • 20· 201247828 Lauryl ester and (4-hydroxydecylcyclohexyl) decyl (meth) acrylate. To increase the cross-linking of the obtained acrylic polymer Density, (mercapto) acrylate can be further copolymerized with a polyfunctional monomer as needed. Examples of polyfunctional monomers include, but are not limited to, 'di(mercapto)acrylic acid hexanediol, di(meth)acrylic acid (poly)ethylene glycol ester, bis(decyl)acrylic acid (poly)propylene glycol ester, Di(indenyl) neopentyl glycol acrylate, pentaerythritol di(mercapto)acrylate, trishydroxypropyl propane tris(meth)acrylate, isoamyl tris(meth)acrylate and six (Mercapto) diisopentyl acrylate. If present, such multifunctional single systems are present in an amount less than or equal to i0 weight percent of the total monomer weight, for example, less than or equal to 5 weight percent. The molecular weight of the acrylic polymer of the first adhesive layer can vary widely and is selected substantially to provide the first adhesive layer with a suitable adhesive quality. In general, the acrylic polymer has a number average molecular weight of at least 200,000 and less than or equal to 4,0 Torr, 〇〇〇 (e.g., 3 〇〇 to 3,500,000, or 400,000 to 3,000,000). The first adhesive layer can be a curable first adhesive layer that can be cured (i.e., crosslinkable) by exposure to high temperatures and/or actinic radiation. For the following reasons, the S-curable first adhesive layer needs to be cured: including, but not limited to, reducing the adhesive properties of the first adhesive layer. The first can be achieved by combining one or more crosslinkers that become reactive due to the active hydrogen functionality of the polymer (eg, hydroxyl, thiol, primary amine, secondary amine, and/or carboxylic acid group) Thermal curing of the adhesive layer. Examples of crosslinking agents known in the art include, but are not limited to, polyisocyanates, polyethylene oxides (i.e., polyepoxides), and melamine. The crosslinking agent is generally used in an amount of less than 10% by weight based on the total weight of the polymer and the crosslinking agent. 160999.doc 201247828 Percentage, such as 〇·1 to 5 weight percent. The first adhesive layer can also be cured by exposure to actinic radiation (e.g., ultraviolet light 'electron beam and/or X-rays). The actinic radiation curable first adhesive layer may comprise: a high molecular weight polymer free of ethylenic unsaturation (eg, an acrylic polymer as described above); an ethylenically unsaturated oligomer; and/or Ethylene-based unsaturated monomers; and actinic radiation-activated initiators (eg, 'photoinitiators'). Or 'the actinic radiation curable first adhesive layer may comprise: a polymer having side and/or terminal ethylenic unsaturation (eg 'acrylic polymer'); if desired, an ethylenically unsaturated oligomer And/or an ethylenically unsaturated monomer; and an actinic radiation activating initiator (eg, a photoinitiator). The side and/or terminal ethylene unsaturation can be introduced into the acrylic polymer by methods known in the art. For example, an acrylic polymer having pendant and/or terminal active hydrogen groups (eg, hydroxyl, thiol, primary amine, secondary amine or carboxylic acid group) can be subsequently reacted with such active hydrogen groups ( Methyl) acrylic monomers (eg, 'oxirane functional (fluorenyl) acrylate (eg, glycidyl (meth) acrylate) and isocyanate functional (meth) acrylate (eg, isocyanic acid) Methyl methacrylate oxime)) reaction. The ethylenically unsaturated oligomer and the ethylenically unsaturated monomer component may each independently have at least - (e.g., two or more) ethylenically unsaturated groups. Examples of the ethylenically unsaturated monomer component include, but are not limited to, tris(methyl)propionic acid trimethyl propyl acetate vinegar tetrakis(methyl)propanate tetramethyl methacrylate 1 Tris(methyl)(tetra)ic acid isovalerol vinegar, tetrakis(methyl)acrylic acid isoindole tetrakis(4), penta(methyl)propionic acid diisopentyl alcohol monoester based on 'six (methyl) C 160969.doc -22· 201247828 Diisopentyl enoate and 1,4-butanediol di(mercapto)acrylate. Examples of acetamidine unsaturated oligomers include, but are not limited to, capped with (meth) acrylate groups, and having a choice selected from the group consisting of urethanes, polyethers' polyesters, polycarbonates, and/or The other of the main chains of polybutadiene. The ethylenically unsaturated oligomer may have a molecular weight of from 100 to 30,000. Photoinitiators useful in the actinic radiation curable first adhesive layer include those known to those skilled in the art. Examples of photoinitiators include, but are not limited to, alpha-keto alcohol compounds such as 4-(2-hydroxyethoxy)phenyl (2-hydroxy-2-propyl) ketone, a-hydroxy-α, alpha , dimethyl acetophenone, 2 fluorenyl 2- hydroxy phenyl ketone and 1-hydroxycyclohexyl phenyl ketone; acetophenone compounds such as methoxyacetophenone, 2,2-didecyloxy _2·Phenylacetophenone, 2,2-diethoxyacetophenone and 2-methyl-1-[4-(methylthiophenyl]_2_morpholinpropane 丨; benzoin 鲢a compound such as benzoin ethyl ether, benzoin isopropyl ether and fennel ketone methyl ether; a condensed compound such as benzyl dimethyl ketal; an aromatic sulfonium compound such as 2-naphthalene sulfonium; An active hydrazine compound, such as benzopyrene 2 - (o-ethoxycarbonyl) hydrazine, a bismuth-methyl compound, such as dioxin, benzoquinone, and 3,3-methoxymethyl methoxy Benzophenone; thioxanthone compounds such as thiotonone, 2-oxothioxanthene-2-methylthioxanthone, 2,4-dithioxanthone, isopropylthioxanthone, 24_ Prepare 2 gas thioxanthone, 2,4-diethyl thioxanthone and 2,4 ·,-&quot;isopropyl. 塞tuu. 吞%纲, camphor 醌; ; a combination of two or more of mercaptophosphonate; decylphosphonate and 苴笙al Badan Temple. The presence of light triggers Yuxi County and it is generally selected to obtain the following combinations: The degree of curing (for example, B|曰I) such as 'measuring 1 increased surface hardness'; for a limited time; and exposure to a specific strong +, intensity of actinic radiation for a specified period of time. One ship 160999.doc - 23- 201247828 To s, the photoinitiator ... eight from the inch, the amount of Wang Liqi (for example, the total weight of the resin component 〇 〇 5 to 2 〇 weight percent) exists. The first layer of the adhesive layer The additive may be independently included or added. Examples of the additive which may be independently included in each layer of the first adhesive layer (for example, each polymeric layer) include, but are not limited to, a heat stabilizer, an external light stabilizer, for example, A non-photopolymerizable first adhesive layer), a pigment, a agent, a plasticizer, and the like.柷 Statics = The lacing layer can have any suitable thickness (e.g., such that it can remain on the rim provided on its first surface). Generally, the first adhesive layer has a thickness of less than or equal to 1 〇〇, such as 5 to 1. Handsome, or 2 to 3~’ or

s玄第_黏著層可句合__ s e ., A 』匕3單層或多個層（例如，2或更多 層）。當該第二黏著層句人夕 . 層包含兩或更多層時，各層可具有相 同或不同組成。一般而言 '、 成。 /弟—黏者層係由一單層構 3玄第一黏者層可藉由士 4士激 之至少…之方法於該第-黏著層 壓至，第°: 例如，可將該第二黏著層層壓或擠 壓至㈣一點著層之第-表面之至少_部八上一擠 言，將該第二黏著層層壓 °77 。一般而 少-部分上。m亥第-點者層之第一表面之至 在使該第一黏著廢夕笙 表面與該第二黏著層之笛-主 面彼此黏著接觸之前:將第-輪廓提供至該二 =表 第一表面上（或中）.β/々心 茨弟黏者層之 之第-表面上Β， 5第二輪廓提供至該第二黏著層 之第一表面上（或令） 一 層 及第二輪廓各自獨立地提供 160999.doc -24· 201247828 至各黏著表面上之方法包括 彼等方法。 ，但不限制於 上文所論述之 可將第二輪廟提供至該第二黏著膜之第二表面上/中， =時使《二黏著層保持在—傳遞膜（或載體膜）上。例 如’當該第二黏著層之第一矣 表面與一傳遞臈可分離（或可 占著接觸時’將第二㈣提供/形成於由傳遞膜支撑之 黏著層之第二表面上/中。該輪廓化第二黏著層可自 該傳遞膜分離及隨後與該第一點著層之第一表面黏著接 觸。或者，該輪廓化第二黏著層可與該第一黏著層之第一 表面黏著接觸，同時使該傳遞獏與該第二黏著層之第一表 面可分離(或可逆)黏著接觸。在將該第一與第二黏著層黏 者接觸於一起之後’可維持該傳遞膜與該第二黏著層之第 -表面接觸，直至需使該第二黏著層之第一表面與一獨立 物件（如，矽晶圓）黏著接觸。 類似地’若在該第二黏著層之第二表面上不提供第二輪 廓，則可使該第二黏著層與該第—著層之第—表面（具 有第-輪廓)黏著接觸’同時使_傳遞膜與該第二黏著層 之第一表面可分離（或可逆）黏著接觸。該傳遞膜可視需要 與該第二黏著層之第一表面維持接觸，直至，例如，使一 獨立物件（如，矽晶圓）與該第二黏著層之第一表面黏著接 觸0 該第二黏著層之組成一般係經選擇，以使當—獨立物件 (例如，矽晶圓）與5亥第二黏著層之第一表面維持黏著接 觸時，該帛二黏著層之第二表面可在自該第一點著層分離 160999.doc •25- 201247828 之後接著黏附至一獨立基板（例如，一半導體裝置）。該第 二黏著層一般包含熱塑性聚合物及/或熱固性聚合物。於 一實施例中，該第二黏著層之組成係經選擇以使其第—表 面可於低於或等於70°C(例如’室溫或約25。〇之溫度下與 一獨立物件（例如，一石夕晶圓）黏著接觸。 可包含於該第二黏著層中之熱塑性聚合物之類型包括， 但不限制於：飽和聚酯；聚胺基甲酸酯；聚醯胺（例如， 耐綸聚合物）；聚醯亞胺；聚矽氧聚合物；彈性聚合物， 如橡膠聚合物，包括天然及/或合成橡膠聚合物，如經官 能化封端之丁二烯丙烯腈橡膠，包括，例如，以環氧基封 端之丁二烯丙稀腈橡膠（ETBN類）、以胺基封端之丁二稀丙 烯腈橡膠（ATBN類）、以羧基封端之丁二烯丙烯腈橡膠 (CTBN類）及以羥基封端之丁二烯丙烯腈橡膠（111^1^類）； 聚（曱基）丙烯酸酯；及其等之兩或更多者之組合。可包含 於該第二黏著層中之熱固性聚合物之類型包括，但不限制 於，熱固性環氧聚合物、熱固性不飽和聚酯、熱固性丙烯 酸系聚合物及熱固性紛樹脂。 於一實施例中’該第二黏著層包含非彈性聚合物及彈性 聚合物°非彈性聚合物可選自本技藝已知之非彈性聚合 物’包括如上引述之熱塑性聚合物之彼等類型及實例’ 如飽和聚醋；聚胺基甲酸酯；聚醯胺（例如，耐綸聚合 物）’聚酿亞胺；聚矽氧聚合物；聚（甲基）丙烯酸酯；聚 鱗’包括聚環氧化物；及其等兩或更多者之組合。彈性聚 合物可選自太1 1 +技藝*已知之彈性聚合物，包括，橡膠聚合 160999.doc • 26 - 201247828 物，包括天錢/或合成橡膠聚合物，如，經官能化封端 之丁二烯丙烯腈橡膠’包括’例如，以環氧基封端之丁二 稀丙烯腈橡膠(ETBN類)、以胺基封端之丁二稀丙稀腈橡膠 (ATBN類）、以缓基封端之丁二稀丙稀腈橡膠（c侧類）及 以經基封端之丁二稀丙稀腈橡膠（HTBN類）；&amp;其等兩或 更多者之組合。. 於貫施例中1¾非彈性聚合物係選自聚（甲基）丙稀酸 酯及/或聚醚，如聚環氧化物；及該彈性聚合物係選自一 或多種經官能化封端之丁二烯丙烯腈橡膠，如，以環氧基 封端之丁二稀丙烯腈橡勝（ETBN)、以胺基封端之丁二稀丙 稀腈橡膠（ATBN)、以缓基封端之丁二稀丙稀腈橡膠 (CTBN)及/或以經基封端之丁二稀丙稀腈橡膠（htbn)。 該非彈性聚合物可以（在各情況中）該非彈性聚合物與該 彈性聚合物之總重量之5至95重量百分比，或1〇至75重量 百分比，或25至55重量百分比之量存在於該第二黏著層 中。该彈性聚合物可以（於各情況中）該非彈性聚合物與該 彈性聚合物之總重量之5至95重量百分比，或25至9〇重量 百分比，或45至75重量百分比之量存在於該第二黏著層 中0 該第二黏著層之各層可獨立地包含一或多種添加劑。可 獨立地包含於該第二黏著層之各層（例如’各聚合層）中之 添加劑之實例包括，但不限制於，熱穩定劑、紫外光穩定 劑、顏料、染料、抗靜電劑、增塑劑及其等組合。 该第二黏著層可具有任何適宜厚度。例如，該第二黏著 160999.doc •27· 201247828 層可具有5μιη至1〇〇μηι，或ΙΟμηι至50 μιη之厚度。 本發明亦係關於一種組合件，其包含如上所述之本發明 多層黏著膜及具有與該第二黏著層之第一表面黏著接觸之 第二表面之一獨立物件（例如，一薄片或晶圓，如一半導 體晶圓）。如本文及專利申請範圍中所使用，該獨立物件 之第二表面與該第二黏著層之第一表面間之黏著接觸意 才曰·（1)彼此直接黏著接觸；或（Η)因其間插入一分離層或 膜（例如，一分離黏著層或膜）而彼此間接黏著接觸。於一 實施例中，該獨立物件之第二表面與該第二黏著層之第一 表面彼此直接黏著接觸。 為非限制說明並參照圖7，組合件3包含根據本發明之一 多層黏著膜1及與該多層黏著膜1之第二黏著層i7黏著接觸 蜀物件98。獨立物件98具有彼此f胃_ p =實質背向)之-第一表面1〇1及一第二表面1〇“獨立 98之第-表面104與該第二黏著層17之第-表面32彼 此黏著接觸。 衣仮 该獨立物件可具有任 平面形狀，如呈薄片咬膜之形：狀，如’二維形狀或實質 係呈薄片或臈 &quot;式。-般而言，該獨立物件 % έκι Mj： al, 4·' ·貫質連續或不連續（例如， 呈網狀物或網筛之形式） ； 貝’ 質連續薄片或膜之形心 5 《立物件係呈實 該獨立物件可係由任何 物、熱固性聚人物、A 材料製成，如熱塑性聚合 σ切、金屬、喻 含矽之半導體晶圓)或 、半導體材料(例如’包 ’、 可組合。於一實施例中，該 160999.doc -28- 201247828 曰立物件係一矽晶圓(例如，包含矽之半導體晶圓）。該矽 S曰圓可包3其他材料’如，鍺、_化鎵及/或碳化石夕。 該獨立物件可具有大範圍的厚度。於-實施例中，當該 獨立物件係一矽晶圓時，其可具有5至1000微米(㈣或25 至300 μηι之厚度。 士本發明之、组合件可藉由本技藝已知之方法形成。一般而 °該夕層黏著膜係單獨形成（或預形成），且該獨立物件 ” /夕層黏著膜之第二黏著層係、在加壓及視需要之高溫條 件下彼此黏著接觸。例如，當該獨立物件係一矽晶圓時， 該石夕晶圓與該多層黏著膜之第二黏著層係於G.G125至1.45 磅/平方英寸（psi)(86至9997帕斯卡）之施加壓力及2〇至 120 C之溫度下彼此黏著接觸。 十如此形成之本發明組合件而言，可對該獨立物件（例 如，-矽晶圓)之第一表面實施加工步驟，包括，例如， 平坦化、拋光（例如’化學機械拋光）及/或斫刻。在完成對 獨立物件之第-表面之任何加工步驟（例如，拋光）之後， 視需要對該多層黏著膜之第一黏著層實施一固化步驟。例 如，當該第一黏著層係光可固化時，可使該支樓層之第二 表面曝露於-光化轄射源（例如，一 uv光源）。光化輻射穿 過該支撐層及進入該第一黏著層巾，藉此實現第一黏著層 之固化。就如此固化之該第-黏著層而言，該第一黏著層 與該第二黏著層間之黏著力基本上會減弱。 當戎獨立物件係-晶圓(如’矽晶圓)時，-般在加工該 晶圓之第-表面之後，對該組合件實施一切割步驟。切割 160999.doc -29· 201247828 一般涉及將矽晶圓切削成仍黏附於該多層膜（或切割晶圓 附接膜）之支撐層之複數個獨立晶片預製坯。對該矽晶圓 實施-適當切割方法，&gt;，藉由雷射器或視需要包含研磨 介質之流體喷射切割機（例如，水噴射器）。切割該矽晶圓 將形成複數個相交切割道，該等切割道一般延伸貫穿該第 二黏著層、該第一黏著層並視需要部份地穿入該支撐層 (但非貫穿該支撐層）。切割亦形成複數個獨立晶片預製 坦〇 參照圖8(a&gt;，對圖7之組合件3進行一切割步驟，及包含 其間具有一切割道110之獨立晶片預製坯1〇7。切割道11〇 延伸至多層黏著膜1之支撐層U之第一表面20,於圖8(a)及 8(b)中，該多層黏著膜係一切割晶粒附接膜。雖然切割道 110可視需要部份延伸至該支撐層丨丨中，然而其不會延伸 貫穿該支撐層11。 在完成切割步驟之後，對晶片預製坯實施一拾起步驟。 一拾起工具將包含下方附接有第二黏著層之切割部分之一 切割晶圓之一晶片自該第一黏著層移除。隨後使該晶片移 向一獨立基板（例如’一半導體元件）並藉由使該第二黏著 層駐留在s亥切割晶圓下而黏著接觸。隨後，例如，可藉由 曝露於高溫使該第二黏著層交聯及固化，藉此將該晶片牢 固附接至該半導體元件。 為非限制性說明及參照圖8(b)及8(c)，藉由一拾起工具 (未顯示）將包含切割晶圓98及其下黏附之第二黏著層之切 割部分之晶片113提起及自該第一黏著層14分離》該第一 160999.doc •30- 201247828 黏著層14維持黏附於支樓層i卜該拾起工具基本上包含一 長形臂，該長形臂具有藉由其間之減壓（例#，吸力）接觸 該晶圓98之第一表面101之一末端頭。該拾起工具之長形 臂可附接至使拾起工具之頭相對切割組合件3⑷垂直再定 位之-直線致動器（未顯示）。於拾起步驟期間，一般將該 切割組合件3(a)保持在，例如，一框架（未顯示）内。 然後，該拾起工具將晶片113移至—獨立基板ιΐ6(例 如，一半導體元件），及使該第二黏著層17之第二表面Μ 與該獨立基板116之第一表面119黏著接觸。就如此黏附至 獨立基板116之晶片113而言，該第二黏著層u可視需要進 行-固化步驟。例如’可使黏附至獨立基板ιΐ6之晶片&quot;3 之組合曝露於高溫，令第二黏著層17交聯及固化，藉此， 將晶片U3牢固附接至獨立基板116。該獨立基板可係，例 如，—半導體元件，如，-引線框，及可包含黏附其上之 複數個晶片113。此外，4替代地，可將晶片ιΐ3黏附至共 同點附至獨立基板116之-或多個下層晶片丨丨3 (未顯示）。 如上文令所描述，獨立物件與第二黏著層間之剝離強度 (或黏著力）大於第一與第二黏著層間之剝離強度，以使當 第一與第二黏著層彼此分離時，該獨立物件與該第二黏著 層維持實質上彼此黏附。於-實施例中，當該獨立物件係 一晶圓（如，矽晶圓）時，在室溫、18〇。剝離值、3〇5爪^分 鐘（12英寸/分鐘）之剝離速度下確定時，該獨立物件與本發 明多層黏著膜之第二黏著層間之剝離強度（或黏著力）為Μ Ν/Μ 至 390 N/M(200 gF/英寸至 1000 gF/英寸），或丨95 ν/μ I60999.doc •31 · 201247828 至 312 N/M(500 gF/英寸至 800 gF/英寸）。 於本發明之組合件之一實施例中，該第一及第二輪廓各 自獨立及另外地經選擇，以增大獨立物件與支撐層間之距 離時，導致s玄第一黏著層之第一表面與該第二黏著層之第 二表面彼此分離。在分離之同時，該第一黏著層之第二表 面與支撐層之第一表面之間維持黏著接觸，及獨立物件與 该第二黏著層之第一表面之間維持黏著接觸。 為非限制性說明及參照圖8(b)，切割晶圓部分98與晶片 預製坯107之支撐體丨丨之間具有一第一距離122。當切割晶 圓部分98與支撐體丨丨間之距離增大時，如，增至第二距離 1 25(例如，藉由一拾起工具，未顯示），該第一黏著層14之 第-表面26與（晶片113之）該第二黏著層17之第二表面29彼 此分離。如圖8(b)中所顯示，第二距離125大於第一距離 122。當該第一與第二黏著層彼此分離時：該第一黏著層 14之第二表面23與該支撐層n之第一表面2〇之間維持黏著 接觸；及該獨立物件（例如，晶圓）98之第二表面1〇4與該第 二黏著層17之第—表面32之間維持黏著接觸。 可將本發明之多層膜用於許多應用中。一般而言，才 明之多層臈係與需使一物件或商品在初始加工步驟期沒 持在原位’及隨後選擇性將該商品自該多層膜分離以灰 或多個後續加卫步驟中容許該商品之加卫部分黏附（|| 該多層膜之保留部分）至一獨立基板之方法連用。於-施例中，本發明之多層膜係一切割晶粒附接膜，其可月 諸如矽圓’曰曰片之晶圓之加工。相應地，於本發明3 160999.doc •32· 201247828 合件之—實施例中，該組合 膜，及其猶……一多層膜係一切割晶粒附接 晶圓，如 半導體晶圓（例如 膜，及其獨立物件係 一矽晶圓） 本發明將在以-p jgi办丨+ β 作說明夕田.，更具體地進行描述，該等實例僅 货者捧紐’係因其中之許多修改及變化將為熟習本項技 ^ /、。除非另外說明，否則所有份數及百分比係指重 實例 根據本發明之多層黏著膜係、依照以下描述製備。切割帶 係以商標名ERX_8005切割帶講自Denki Kagaku ahshiki Kaisha。該切割帶包含溶點約听之一聚稀煙 支撐層，及其上覆蓋之由紫外光可固化丙烯酸系聚合物構 成之一壓感黏著層。自具有25 μπι、55 μηι及25G μηι之網目 寸‘號之篩子切製具有2〇 cmx2〇 cm尺寸之聚酯絲篩 網 ° 該等篩子係購自 Filter Specia丨ists Inc 〇f Indi_， USA 〇 5 在溫度65t及壓力2 psi下，使切割帶樣品之壓感黏著層 進灯各絲篩網壓紋》壓紋後，使絲篩網自壓感黏著層分 離。切割帶的對比（或對照）樣品並未進行絲篩網壓紋。s Xuo _ _ adhesion layer can be __ s e., A 』 匕 3 single layer or multiple layers (for example, 2 or more layers). When the second adhesive layer layer comprises two or more layers, the layers may have the same or different compositions. Generally speaking, ', Cheng. /different----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- The adhesive layer is laminated or extruded to (4) at least a portion of the first surface of the layer, and the second adhesive layer is laminated to 77. Generally less and less - part. The first surface of the mhai-first layer is before the first adhesive surface and the front surface of the second adhesive layer are adhered to each other: the first contour is provided to the second a surface (or in the middle) of the β-々 々 茨 黏 黏 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 The methods of providing 160999.doc -24·201247828 to each of the adhesive surfaces independently include their methods. However, without limitation to the above discussion, the second round of temples may be provided on/in the second surface of the second adhesive film, where the "two adhesive layers are held on the transfer film (or carrier film). For example, 'When the first crucible surface of the second adhesive layer is separable (or can occupy contact), the second (four) is provided/formed on/in the second surface of the adhesive layer supported by the transfer film. The contoured second adhesive layer can be separated from the transfer film and subsequently adhered to the first surface of the first spot layer. Alternatively, the contoured second adhesive layer can be adhered to the first surface of the first adhesive layer Contacting, while the transfer enthalpy is in detachable (or reversible) adhesive contact with the first surface of the second adhesive layer. After the first and second adhesive layers are brought into contact with each other, the transfer film can be maintained The first surface of the second adhesive layer contacts until the first surface of the second adhesive layer is in adhesive contact with a separate object (eg, a germanium wafer). Similarly, if the second surface of the second adhesive layer The second contour is not provided, and the second adhesive layer can be adhered to the first surface of the first layer (having a first contour) while the first surface of the _transfer film and the second adhesive layer can be Separate (or reversible) adhesive contact. The transfer film can Remaining contact with the first surface of the second adhesive layer until, for example, a separate object (eg, a germanium wafer) is adhered to the first surface of the second adhesive layer. The second adhesive layer is generally composed. Is selected such that when a separate object (eg, a silicon wafer) is in adhesive contact with the first surface of the second adhesive layer, the second surface of the second adhesive layer can be from the first point Layer separation 160999.doc •25-201247828 is then adhered to a separate substrate (eg, a semiconductor device). The second adhesive layer typically comprises a thermoplastic polymer and/or a thermoset polymer. In one embodiment, the second The composition of the adhesive layer is selected such that its first surface can be in adhesive contact with a separate article (e.g., a stone wafer) at a temperature less than or equal to 70 ° C (e.g., 'room temperature or about 25 Torr. Types of thermoplastic polymers that may be included in the second adhesive layer include, but are not limited to: saturated polyesters; polyurethanes; polyamines (eg, nylon polymers); polyimines; Polyoxyl polymer Compounds, such as rubber polymers, including natural and/or synthetic rubber polymers, such as functionalized blocked butadiene acrylonitrile rubbers, including, for example, epoxy-terminated butadiene acrylonitrile rubber (ETBN type), butyl dilute acrylonitrile rubber (ATBN type) terminated with an amine group, butadiene acrylonitrile rubber (CTBN type) terminated with a carboxyl group, and butadiene acrylonitrile rubber terminated with a hydroxyl group ( a combination of two or more of a poly(indenyl) acrylate; and the like, and a type of thermosetting polymer that may be included in the second adhesive layer includes, but is not limited to, thermosetting An epoxy polymer, a thermosetting unsaturated polyester, a thermosetting acrylic polymer, and a thermosetting resin. In one embodiment, the second adhesive layer comprises a non-elastic polymer and an elastic polymer. The non-elastic polymer may be selected from the group consisting of Non-elastic polymers known in the art include the types and examples of thermoplastic polymers as cited above, such as saturated polyesters; polyurethanes; polyamines (for example, nylon polymers) Polyoxyl polymer; poly (a ) Acrylate; poly scales' includes a polyepoxide; and the like, and combinations of two or more thereof. The elastomeric polymer may be selected from the group consisting of elastomeric polymers known to the skilled artisan*, including rubber polymerizations 160999.doc • 26 - 201247828, including Tianqian/or synthetic rubber polymers, such as functionalized capping The diene acrylonitrile rubber 'comprises', for example, an epoxy-terminated butyl dilute acrylonitrile rubber (ETBN type), an amine-terminated butyl dilute acrylonitrile rubber (ATBN type), and a slow base seal a combination of two or more of a di-n-acrylonitrile rubber (c-side) and a trans-blocked di-n-acrylonitrile (HTBN); &amp; In the embodiment, the 13⁄4 inelastic polymer is selected from the group consisting of poly(meth) acrylates and/or polyethers, such as polyepoxides; and the elastomeric polymer is selected from one or more functionalized seals. A butadiene acrylonitrile rubber, such as an epoxy-terminated dibutyl acrylonitrile rubber (ETBN), an amine-terminated butyl dilute acrylonitrile (ATBN), with a slow base seal A butyl dilute acrylonitrile rubber (CTBN) and/or a butyl dilute acrylonitrile (htbn) terminated with a base. The non-elastic polymer may be present (in each case) from 5 to 95 weight percent, or from 1 to 75 weight percent, or from 25 to 55 weight percent of the total weight of the elastomeric polymer, Two adhesive layers. The elastomeric polymer may, in each case, be present in an amount of from 5 to 95 weight percent, or from 25 to 9 weight percent, or from 45 to 75 weight percent of the total weight of the elastomeric polymer to the elastomeric polymer. Each of the second adhesive layers may independently comprise one or more additives. Examples of additives that may be independently included in each layer of the second adhesive layer (eg, 'each polymeric layer') include, but are not limited to, heat stabilizers, ultraviolet light stabilizers, pigments, dyes, antistatic agents, plasticizing Agents and combinations thereof. The second adhesive layer can have any suitable thickness. For example, the second adhesive 160999.doc • 27· 201247828 layer may have a thickness of 5 μm to 1 μm, or ΙΟμηι to 50 μηη. The present invention is also directed to an assembly comprising the multilayer adhesive film of the present invention as described above and a separate object having a second surface in adhesive contact with the first surface of the second adhesive layer (eg, a sheet or wafer) , such as a semiconductor wafer). As used herein and in the scope of the patent application, the adhesive contact between the second surface of the separate article and the first surface of the second adhesive layer is (1) directly adhered to each other; or (Η) is inserted therebetween A separate layer or film (e.g., a separate adhesive layer or film) is in indirect adhesive contact with each other. In one embodiment, the second surface of the separate article and the first surface of the second adhesive layer are in direct adhesive contact with each other. By way of non-limiting illustration and with reference to Figure 7, the assembly 3 comprises a multilayer adhesive film 1 according to the invention and an adhesive member 98 adhered to the second adhesive layer i7 of the multilayer adhesive film 1. The individual objects 98 have a first surface 1〇1 and a second surface 1〇 of the first surface 1〇1 and a second surface 1〇“the first surface 104 of the independent 98 and the first surface 32 of the second adhesive layer 17 are mutually Adhesive contact. The separate article may have any planar shape, such as a sheet-shaped film shape, such as a 'two-dimensional shape or a solid sheet or a 臈&quot;. In general, the separate object% έκι Mj: al, 4·' · continuous or discontinuous (for example, in the form of a mesh or mesh); shell-shaped continuous sheet or film centroid 5 "the object is solid, the independent object can be Made of any material, thermoset poly, A material, such as thermoplastic polymerized sigma, metal, semiconductor wafer, or semiconductor material (eg 'package', combinable. In one embodiment, the 160999 .doc -28- 201247828 The standing object is a wafer (for example, a semiconductor wafer containing germanium). The 矽S曰 circle can contain 3 other materials 'eg, 锗, _ gallium and/or carbon carbide. The separate article can have a wide range of thicknesses. In the embodiment, when the separate object is attached In the case of a wafer, it may have a thickness of 5 to 1000 micrometers ((iv) or 25 to 300 μm. The assembly of the invention may be formed by methods known in the art. Generally, the interlayer adhesive film is formed separately (or Pre-formed, and the second adhesive layer of the separate article/adhesive film is adhered to each other under pressure and optionally high temperature conditions. For example, when the independent object is a wafer, the stone The wafer and the second adhesive layer of the multilayer adhesive film are adhered to each other at an applied pressure of G.G125 to 1.45 psi (86 to 9997 Pascal) and a temperature of 2 to 120 C. In the thus formed assembly of the present invention, the first surface of the separate article (eg, - germanium wafer) may be subjected to processing steps including, for example, planarization, polishing (eg, 'chemical mechanical polishing) and/or germanium After completing any processing step (for example, polishing) on the first surface of the individual object, a curing step is performed on the first adhesive layer of the multilayer adhesive film as needed. For example, when the first adhesive layer is light-receivable When curing, it can The second surface of the support floor is exposed to a photochemical source (for example, a uv light source) through which the actinic radiation passes and enters the first adhesive layer to thereby cure the first adhesive layer. In the thus-cured layer of the first adhesive layer, the adhesion between the first adhesive layer and the second adhesive layer is substantially weakened. When the individual object-wafer (such as '矽 wafer), the After processing the first surface of the wafer, a cutting step is performed on the assembly. Cutting 160999.doc -29 - 201247828 generally involves cutting the germanium wafer to still adhere to the multilayer film (or cutting the wafer attachment film) A plurality of individual wafer preforms of the support layer. A suitable cutting method is applied to the wafer, &gt; a fluid jet cutting machine (e.g., a water jet) by means of a laser or, if desired, a grinding medium. Cutting the wafer will form a plurality of intersecting dicing lines that extend generally through the second adhesive layer, the first adhesive layer and, if desired, partially penetrate the support layer (but not through the support layer) . The dicing also forms a plurality of individual wafer preforms. Referring to Figure 8 (a), a dicing step is performed on the assembly 3 of Figure 7, and a separate wafer preform 1 〇 7 having a scribe line 110 therebetween. Extending to the first surface 20 of the support layer U of the multi-layered adhesive film 1, in the layers 8(a) and 8(b), the multi-layer adhesive film is used to cut the die attach film. Extending into the support layer, however, it does not extend through the support layer 11. After the cutting step is completed, a pick-up step is performed on the wafer preform. A pick-up tool will include a second adhesive layer attached thereto. One of the dicing portions of the dicing wafer is removed from the first adhesive layer. The wafer is then moved to a separate substrate (eg, a semiconductor component) and the second adhesive layer is left in the sig Adhesive contact under the wafer. Subsequently, the second adhesive layer can be crosslinked and cured, for example, by exposure to high temperatures, thereby firmly attaching the wafer to the semiconductor component. For non-limiting illustration and reference to FIG. (b) and 8(c), by picking up a tool (not shown) lifts and separates the wafer 113 including the cut portion of the dicing wafer 98 and the second adhesive layer adhered thereto, and is detached from the first adhesive layer 14. The first 160999.doc • 30-201247828 adhesive layer 14 is maintained Adhesive to the support floor i The pick-up tool basically includes an elongate arm having a tip end that contacts one of the first surfaces 101 of the wafer 98 by decompression therebetween (example #, suction). The elongate arm of the pick-up tool can be attached to a linear actuator (not shown) that repositions the head of the pick-up tool vertically relative to the cutting assembly 3 (4). During the picking up step, the cutting assembly 3 is typically (a) is held, for example, in a frame (not shown). Then, the pick-up tool moves the wafer 113 to a separate substrate ΐ6 (e.g., a semiconductor component), and the second adhesive layer 17 is second. The surface Μ is in adhesive contact with the first surface 119 of the individual substrate 116. For the wafer 113 thus adhered to the individual substrate 116, the second adhesive layer u can be subjected to a curing step as needed. For example, 'adhesion can be adhered to the independent substrate ΐ6 Combination of wafer &quot;3 exposure The high temperature causes the second adhesive layer 17 to crosslink and cure, thereby firmly attaching the wafer U3 to the individual substrate 116. The individual substrate can be, for example, a semiconductor component, such as a lead frame, and can include an adhesive And a plurality of wafers 113. Further, 4 alternatively, the wafers ι 3 may be adhered to a common point to the independent substrate 116 - or a plurality of lower wafer rafts 3 (not shown). As described above, the independent objects and The peel strength (or adhesion) between the second adhesive layers is greater than the peel strength between the first and second adhesive layers, so that when the first and second adhesive layers are separated from each other, the independent object and the second adhesive layer maintain substantially Adhering to each other. In the embodiment, when the individual object is a wafer (e.g., a germanium wafer), at room temperature, 18 Torr. When the peeling value is determined at a peeling speed of 3 〇 5 claws per minute (12 inches/minute), the peeling strength (or adhesive force) between the separate article and the second adhesive layer of the multilayer adhesive film of the present invention is Μ Ν / Μ to 390 N/M (200 gF/inch to 1000 gF/inch), or 丨95 ν/μ I60999.doc •31 · 201247828 to 312 N/M (500 gF/inch to 800 gF/inch). In an embodiment of the assembly of the present invention, the first and second contours are independently and additionally selected to increase the distance between the independent object and the support layer, resulting in the first surface of the first adhesive layer The second surface of the second adhesive layer is separated from each other. While being separated, the second surface of the first adhesive layer maintains an adhesive contact with the first surface of the support layer, and the adhesive member maintains an adhesive contact with the first surface of the second adhesive layer. For purposes of non-limiting illustration and reference to Figure 8(b), the dicing wafer portion 98 has a first distance 122 from the support body of the wafer preform 107. When the distance between the dicing wafer portion 98 and the support body is increased, for example, to a second distance 1.25 (eg, by a pick-up tool, not shown), the first adhesive layer 14 is - The surface 26 and the second surface 29 of the second adhesive layer 17 (of the wafer 113) are separated from each other. As shown in Figure 8(b), the second distance 125 is greater than the first distance 122. When the first and second adhesive layers are separated from each other: the second surface 23 of the first adhesive layer 14 maintains an adhesive contact with the first surface 2 of the support layer n; and the separate object (for example, a wafer) The second surface 1〇4 of the 98 maintains an adhesive contact with the first surface 32 of the second adhesive layer 17. The multilayer film of the present invention can be used in many applications. In general, the multi-layered tether is required to have an item or article not held in situ during the initial processing step and subsequently selectively separate the article from the multilayer film in ash or multiple subsequent curing steps. The method of attaching the reinforced portion of the article (|| the remaining portion of the multilayer film) to a separate substrate is used. In the embodiment, the multilayer film of the present invention is a wafer-attached film which can be processed by a wafer such as a wafer. Accordingly, in the embodiment of the present invention, the composite film, and a multilayer film thereof, a die-attached wafer, such as a semiconductor wafer ( For example, the film, and its independent objects are a wafer.) The present invention will be described in more detail with the method of -p jgi 丨 + β, which is described in more detail. Modifications and changes will be familiar to this skill ^ /,. Unless otherwise stated, all parts and percentages refer to heavy examples. The multilayer adhesive film system according to the present invention was prepared as described below. The cutting tape is sold under the trade name ERX_8005 from Denki Kagaku ahshiki Kaisha. The dicing tape comprises a viscous point support layer and a pressure sensitive adhesive layer comprising an ultraviolet curable acrylic polymer coated thereon. A polyester wire screen having a size of 2〇cmx2〇cm was cut from a sieve having a mesh size of 25 μm, 55 μηι and 25G μηι°. The sieves were purchased from Filter Specia丨ists Inc 〇f Indi_, USA 〇 5 At a temperature of 65t and a pressure of 2 psi, the pressure-sensitive adhesive layer of the dicing tape sample is embossed into the embossing of each wire screen, and the wire mesh is separated from the pressure-sensitive adhesive layer. The contrast (or control) sample of the dicing tape was not embossed with a silk screen.

根據本發明之多層黏著膜形成係藉由在約25t之溫度及 〇·29 pSi(2〇〇〇帕斯卡）之壓力下將EASY STACK ATB-130U 黏著膜（含有橡膠化環氧樹脂之膜，購自Henkel Corporation)層壓至壓紋切割帶之壓感黏著層上。藉由在 約25C之溫度及0.29 psi(2000帕斯卡）之壓力下，將EASY 160999.doc -33· 201247828 STACK ATB-130U黏著膜層壓至未經壓紋之切割帶之壓感 黏著層上來製備對比（或對照）多層黏著膜。 使本發明之多層黏著膜及對比多層黏著膜曝露於UV 光，以使其等壓感黏著層固化。利用配置有一 385 nm UV 燈之一 Model 18672紫外光曝露系統（購自UVEXS Incorporated)使本發明及對比多層黏著膜曝露於400 mJ/cm2之 UV 光。 依照以下描述，對各具有2.5 cm&gt;&lt;20 cm之尺寸之本發明 多層黏著膜及對比多層黏著膜評價EASY STACK ATB-1 3 0U層與UV固化壓感黏著層間之剝離強度。利用購自 Stable Micro Systems，Ltd之一TA.XTPlus分析儀，在室溫 及獲得180°剝離強度值之305 mm/分鐘（12英寸/分鐘）下分 別評價三個測試樣品。剝離強度結果示於下表-1中。 表1 樣品 於壓感黏著層上 壓紋之篩網之尺寸 剝離強度(1) (gf/英寸） 剝離強度減小之 平均百分比(2) 對比 無 44.22±11.50 na(3) 實例-A 25 μηι 14.12±8.30 68% 實例-B 55 μηι 13.25±0.18 70% 實例-C 250 μηι 2.83±0.30 94% ⑴剝離強度值係以如下方式提供：平均值土標準偏差。剝 離強度值表示樣品之穩態剝離強度。 (2) 平均剝離強度相對對比多層黏著膜之減小之平均百分 比。 (3) na意指不適用。 160999.doc • 34- 201247828 表-it出示之結果顯示，本發 “ 實例A、B及C)之第一與笛 點著膜（例如， K弟與第二黏著層間之 比多層黏著臈(即，在第— “離強度小於對 廟，例如，第-輪廓)之第…者層之間不具有輪The multi-layered adhesive film formation according to the present invention is obtained by coating an EASY STACK ATB-130U adhesive film (a film containing a rubberized epoxy resin) at a temperature of about 25 t and a pressure of 29·29 pSi (2 〇〇〇 Pascal). Laminated from Henkel Corporation to the pressure sensitive adhesive layer of the embossed dicing tape. The EASY 160999.doc -33·201247828 STACK ATB-130U adhesive film is laminated to the pressure-sensitive adhesive layer of the unembossed dicing tape by a temperature of about 25 C and a pressure of 0.29 psi (2000 Pascal). Compare (or control) multiple layers of adhesive film. The multilayer adhesive film of the present invention and the comparative multilayer adhesive film are exposed to UV light to cure the isobaric adhesive layer. The present invention and the comparative multilayer adhesive film were exposed to UV light at 400 mJ/cm2 using a Model 18672 UV exposure system (available from UVEXS Incorporated) configured with a 385 nm UV lamp. The peel strength between the EASY STACK ATB-1 30U layer and the UV-curable pressure-sensitive adhesive layer was evaluated for the multilayer adhesive film of the present invention having a size of 2.5 cm &gt;&lt; 20 cm and the comparative multilayer adhesive film in accordance with the following description. Three test samples were evaluated at room temperature and at 305 mm/min (12 in/min) with a 180° peel strength value, using a TA.XTPlus analyzer available from Stable Micro Systems, Ltd. The peel strength results are shown in Table-1 below. Table 1 Dimensional Peel Strength of the Screen Embossed on the Pressure Sensitive Adhesive Layer (1) (gf/inch) Average Percentage of Peel Strength Reduction (2) Contrast No. 44.22±11.50 na(3) Example-A 25 μηι 14.12±8.30 68% Example-B 55 μηι 13.25±0.18 70% Example-C 250 μηι 2.83±0.30 94% (1) Peel strength values are provided as follows: mean soil standard deviation. The peel strength value indicates the steady state peel strength of the sample. (2) The average percentage of the average peel strength relative to the reduction of the multilayer adhesive film. (3) na means not applicable. 160999.doc • 34-201247828 The results presented by Table-it show that the first of the “Examples A, B and C” of this issue is filmed with a flute (for example, the ratio between K and the second adhesive layer is multi-layered (ie , in the first - "off strength is less than the temple, for example, the first - contour"

^ 與第二點宴風B 強度。此外，表1中出示之 s之對比剝離 盥第-黏菩居A ^ 、、°果顯不，可藉由選擇在第一 :、第—黏者層間之介面處所提供之輪 本發明之多層黏著膜之第—點著層 之，如 廓來控制剝離強度減小。 表面所展示之輪 本發明已參照其特定實施例 桩直釗由咬於㈤ 之/、體、，、田即進行描述。在附 接專利中料圍對此等細節所限 等細節視為對本發明範圍之限制。 【圖式簡單說明】 圖1係根據本發明之一多層黏耸 ^ 層黏者膜之典型截面圖； 圖2係根據本發明之多層考 .占著膜之典型分解截面圖，其 中该夕層黏著膜之第一黏著 * ^ a ^咕 廓； I層之第一表面具有一第一輪 多層黏著膜之典型分解截面圖， 黏著層之第二表面具有一第二輪 圖3係根據本發明之一 其中該多層黏著膜之第二 廓； —圖4(a)係在第一與第二黏著層間之黏著介面處不具有第 第輪摩之一對照多層黏著膜之典型截面圖； 圖4(b)係圖4(a)之對照多層黏著膜之典型分解截面圖； 圖5(a)至5(h)係第-及第二輪靡可選擇之具有各種形狀 之微結構之典型部分立體圖； 160999.doc •35- 201247828 圖6係包含鄰近凸升點及鄰近凹陷點之輪廓之典型部分 立體圖； 、° 27係根據本發明之一組合件之典型截面圖，該組合件 包=本發明之多層黏著膜及與該多層黏著膜之第二黏著層 黏著接觸之一獨立物件； 圖8(a)係圖6之組合件之典型截面圖，於該圖之組合件中 形成一切割道； 圖8(b)係圖8(&amp;)之組合件之典型截面圖，於該圖中，具 有該組合件所黏附之第二黏著層中之一部分之晶片之一部 分係自該第一黏著層拾起及分離；及 圖8(c)係與一獨立基板黏著接觸之圖8(b)晶片之典型截 面圖。 【主要元件符號說明】 1 多層黏著膜 Γ 對照多層黏著膜 3(a) 切割組合件 11 支撐層 14 第 一黏著層 14' 第 一黏著層 17 第 二黏著層 17' 第 二黏著層 20 第 一表面 21 第 二表面 23 第 —·表面 I60999.doc -36- 201247828 26 第一表面 26' 第一表面 29 第二表面 29' 第二表面 32 第一表面 35 第一輪廟 38 第二輪廊 41 外部支撐表面 44 外部黏著表面 47 黏著介面 47， 黏著介面 50 輪廓化介面 53 圓錐形微結構 56 角錐形微結構 59 隆脊 62 凹槽 65 球形微結構 68 卵形微結構 71 矩形微結構 74 圓柱形微結構 77 不規則形微結構 80 凸升點 83 凸升點對 86 距離 160999.doc -37- 201247828 89 凹陷點 92 鄰近凹陷點對 95 距離 98 獨立物件 101 第一表面 104 第二表面 107 晶片預製坯 110 切割道 113 晶片 116 獨立基板 119 第一表面 122 第一距離 125 第二距離 160999.doc -38^ With the second point feast wind B intensity. In addition, the contrast of s shown in Table 1 is detached, and the thickness of the present invention can be obtained by selecting the interface provided at the interface between the first: and the first layer of the adhesive layer. The first layer of the adhesive film - the layer is layered, such as the profile to control the peel strength to decrease. The wheel shown on the surface has been described with reference to its specific embodiment. The pile is straightened by the bite of (5), body, and field. The details of the details in the attached patents are to be considered as limiting the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a typical cross-sectional view of a multi-layered adhesive film according to the present invention; FIG. 2 is a typical exploded cross-sectional view of a film according to the present invention. The first adhesion of the layer of adhesive film is * ^ a ^ profile; the first surface of the I layer has a typical exploded cross-sectional view of the first round of the multilayer adhesive film, and the second surface of the adhesive layer has a second wheel. One of the inventions, wherein the second layer of the multi-layer adhesive film; FIG. 4(a) is a typical cross-sectional view of the first control film of the first and second adhesive layers; 4(b) is a typical exploded cross-sectional view of the comparative multilayer adhesive film of Fig. 4(a); Fig. 5(a) to 5(h) are typical of the microstructures of the first and second rims which can be selected to have various shapes. Partial perspective view; 160999.doc • 35- 201247828 Figure 6 is a partial partial perspective view of a contour including adjacent raised and adjacent recessed points; 27 is a typical cross-sectional view of an assembly according to the present invention, the assembly package = The multi-layer adhesive film of the invention and the second adhesive layer of the multi-layer adhesive film Contacting a separate article; Figure 8 (a) is a typical cross-sectional view of the assembly of Figure 6, forming a cutting lane in the assembly of Figure 8; Figure 8 (b) is a combination of Figure 8 (&amp; a typical cross-sectional view in which a portion of a wafer having a portion of a second adhesive layer to which the assembly is adhered is picked up and separated from the first adhesive layer; and Figure 8(c) is a separate substrate A typical cross-sectional view of the wafer of Figure 8(b) for adhesive contact. [Main component symbol description] 1 Multi-layer adhesive film 对照 Comparative multilayer adhesive film 3 (a) Cutting assembly 11 Support layer 14 First adhesive layer 14' First adhesive layer 17 Second adhesive layer 17' Second adhesive layer 20 First Surface 21 Second surface 23 First surface I60999.doc -36- 201247828 26 First surface 26' First surface 29 Second surface 29' Second surface 32 First surface 35 First round temple 38 Second round gallery 41 External support surface 44 External adhesive surface 47 Adhesive interface 47, Adhesive interface 50 Contoured interface 53 Conical microstructure 56 Pyramidal microstructure 59 Ridge ridge 62 Groove 65 Spherical microstructure 68 Oval microstructure 71 Rectangular microstructure 74 Cylindrical Microstructure 77 Irregular Shape Microstructure 80 Projection Point 83 Projection Point Pair 86 Distance 160999.doc -37- 201247828 89 Depression Point 92 Adjacent Depression Point Pair 95 Distance 98 Independent Object 101 First Surface 104 Second Surface 107 Wafer Prefabrication Blank 110 cutting track 113 wafer 116 independent substrate 119 first surface 122 first distance 125 second distance 160999.doc -38

Claims (1)

201247828 七、申請專利範圍： 1. 一種多層黏著臈，其包含： (a)具有一第一表面之一支撐層； 2)具有彼此相對之—第—表面與—第二表面之一第— 黏者層、亥第一黏著層之該第二表面與該支撐層之該 一表面彼此黏著接觸；及 X ⑷具有彼此相對之_第—表面及—第二表面之 黏著層、亥第-黏著層之該第一表面與該第二黏著層 該第二表面彼此黏著接觸且彼此之間具有一剝離強度， 其中，具有以下情況中之至少一者， (〇該第一黏著層之該第-表面具有-第一輪廓，及 ⑻該第二黏著層之該第二表面具有一第二輪廓， 進-步’其中該第-輪廓及該第二輪廓係 擇，以使 史 2較於包含該支撐層、該第一黏著層及該第二黏著層 :-對比多層黏著臈’其中該對比多層黏 ::輪:且不具有該第二輪廊且具有其該第-黏著層I 剝離強度面與”二黏著層之該第二表面之間之-對比 該剝離強度小於該對比剝離強度。 2.如凊求項1之多層黏著膜’其中該第—輪廓及該第二輪 +目土也包3複數個微結構’該複數個微結構獨立 有選自圓錐形、角錐形、隆脊形、通道形、矩形、 /㈣、圓錐形、不規則形狀及其等兩或更多者之 I60999.doc 201247828 組合之形狀❶ 3·如β月求項1之多層黏著臈，其中該第一輪廓及該第二輪 廓各自獨立包含複數個凸升點，該第一輪廓及該第二輪 廓各自獨立地具有大於或等於10 μιη且小於或等於300 ㈣之鄰近該等凸升點對間之平均距離。 4·如凊求項1之多層黏著膜，其中該第一黏著層之該第一 表面具有該第一輪廓，及該第二黏著層之該第二表面實 質上不具有該第二輪廓。 其中該剝離強度比該對比剝 其中該剝離強度比該對比剝 其中該剝離強度比該對比剝 其中該剝離強度為1 gf/英寸 其中該支撑層包含聚稀烴樹 5·如請求項丨之多層黏著膜 離強度小至少50百分比。 6·如請求項〗之多層黏著膜 離強度小至少60百分比。 7·如請求項丨之多層黏著骐 離強度小至少70百分比。 8.如請求項丨之多層黏著犋 至25 gf/英寸。 9·如請求項丨之多層黏著犋 脂。 10 ·如請求項1之多居 ^ 層黏者膜’其中該第一黏著膜係可固 化0 11. 如請求項i 〇之多眉逢 露於光…“ 其中該第一黏著層係藉由曝 露於先化輻射而至少邹份固化。 12. 如請求項i i之多居 # 輻射穿逯 者膜，其中該支撐層實質上使光化 160999.doc 201247828 13·如請求項1之多層黏著膜， 性樹脂及彈性樹脂。 14.如請求項1之多層黏著膜， 晶粒附接膜。 其中該第二黏著層包含非彈 其中該多層黏著膜係—切割 15. —種組合件，其包含： (1) 一多層黏著膜，其包含： (a) 具有一第一表面之一支撐層， (b) 具有彼此相對之一第一表面與一第二表面之一第 -黏著層’該第一黏著層之該第二表面與該支撐層之 該第一表面彼此黏著接觸；及 (c) 具有彼此相對之一第一表面及一第二表面之一第 二黏著層，該第一黏著層之該第一表面與該第二黏著 層之δ亥第一表面彼此黏著接觸且彼此之間具有一剝離 強度， 其中’具有以下情況中之至少一者， (1)該第一黏著層之該第一表面具有一第一輪廓，及 (Π)該第二黏著層之該第二表面具有一第二輪廓， 進一步，其中該第一輪廓及該第二輪廓各自獨立選 擇，以使 相較於包含該支撐層、該第一黏著層及該第二黏著 層之一對比多層黏著膜，其中該對比多層黏著膜不具 有該第一輪廓且不具有該第二輪廓且具有其該第一黏 著層之該第一表面與該第二黏著層之該第二表面間之 一對比剝離強度， 160999.doc 201247828 該剝離強度小於該對比剝離強度；及 (II)具有與該第二黏著層之該第一表面黏著接觸之一 第二表面之一獨立物件。 16. 17. 18. 19. 20. 如請求項15之組合件，其中該第一輪廓及該第二輪廓各 自獨立地包含複數個微結構，該複數個微結構獨立地具 有選自圓錐形、角錐形、隆脊形' 通道形、矩形、球 形、卵形、不規則形狀及其等兩或更多者之組合之形 狀。 如明求項1 5之組合件，其中該第一輪廓及該第二輪廓各 自獨立包含複數個凸升點，該第一輪廓及該第二輪廓各 自獨立地具有大於或等於10 μηι且小於或等於3〇〇 鄰近忒等凸升點對間之平均距離。 如明求項15之組合件，其中該第一輪廓及該第二輪廓各 自獨立及另外地選擇，以使 增大5玄獨立物件與該支撐層以距離導致該第-黏著 層之該第-表面與該第二黏著層之該第二表面彼此分 離同時使該第一點著層之該第二表面與該支樓層之該 第，面間維持勒著接觸’且同時使該獨立物件與該第 -黏者層之該第一表面間維持黏著接觸。 士。青长項15之組合件，其中該剝離強度比該對比剝離強 度小至少50百分比。 如請求項1 夕&amp;人，L &amp;件’其中該多層黏著膜係一切割晶粒 附接膜’及該獨立物件係一石夕晶圓。 160999.doc201247828 VII. Patent application scope: 1. A multi-layer adhesive crucible comprising: (a) a support layer having a first surface; 2) having a first surface opposite to each other - a first surface - a second surface The second surface of the first adhesive layer and the surface of the support layer are in adhesive contact with each other; and X (4) has an adhesive layer and a second adhesive layer of the first surface and the second surface The first surface and the second surface of the second adhesive layer are in adhesive contact with each other and have a peeling strength therebetween, wherein at least one of the following conditions is met (the first surface of the first adhesive layer) Having a first contour, and (8) the second surface of the second adhesive layer has a second contour, wherein the first contour and the second contour are selected such that history 2 is greater than the support a layer, the first adhesive layer and the second adhesive layer: a contrasting multilayer adhesive tape, wherein the comparative multilayer adhesive:: wheel: and does not have the second circular corridor and has the first adhesive layer I peel strength surface and - between the second surface of the second adhesive layer The peel strength is less than the comparative peel strength. 2. The multilayer adhesive film of claim 1 wherein the first contour and the second round + mesh also include a plurality of microstructures. From the conical shape, pyramidal shape, ridge shape, channel shape, rectangle shape, / (four), conical shape, irregular shape and the like two or more I60999.doc 201247828 The shape of the combination ❶ 3 · as β month item 1 a plurality of adhesive ridges, wherein the first contour and the second contour each independently comprise a plurality of convex lifting points, the first contour and the second contour each independently having a greater than or equal to 10 μηη and less than or equal to 300 (four) adjacent The average distance between the pairs of raised points. 4. The multilayer adhesive film of claim 1, wherein the first surface of the first adhesive layer has the first contour, and the second of the second adhesive layer The surface substantially does not have the second contour. wherein the peel strength is greater than the peel strength, wherein the peel strength is greater than the peel strength, and the peel strength is 1 gf/inch. wherein the support layer comprises polythene Hydrocarbon tree 5. If the thickness of the multi-layer adhesive film of the request item is at least 50%. 6. The multi-layer adhesive film of the claim item is at least 60% smaller than the strength. 7·If the thickness of the multi-layer adhesion of the request item is at least 70% 8. If the request item is multi-layered to 25 gf/inch. 9. If the request item is multi-layered adhesive rouge. 10 · If the request item 1 is more than the layer of the adhesive film 'the first adhesive film Can be cured 0 11. If the request item i 〇 多 露 露 ... “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ A radiation transmissive film, wherein the support layer substantially opticalizes 160999.doc 201247828 13 · The multilayer adhesive film of claim 1, the resin and the elastic resin. 14. The multilayer adhesive film of claim 1, the die attach film. Wherein the second adhesive layer comprises a non-elastic one of the multi-layer adhesive film-cutting-type assembly, comprising: (1) a multi-layer adhesive film comprising: (a) having a support of a first surface a layer, (b) having one of the first surface opposite to the first surface and a second surface, the first adhesive layer, the second surface of the first adhesive layer and the first surface of the support layer are in adhesive contact with each other; c) having a first adhesive surface opposite to one of the first surface and a second surface, the first surface of the first adhesive layer and the first surface of the second adhesive layer adhere to each other and to each other Having a peel strength, wherein 'having at least one of the following, (1) the first surface of the first adhesive layer has a first contour, and (Π) the second surface of the second adhesive layer Having a second contour, further wherein the first contour and the second contour are each independently selected such that the multilayer adhesive film is compared to one of the support layer, the first adhesive layer, and the second adhesive layer. Where the comparative multilayer adhesive film does not have a first profile and having no such second profile and having a peel strength between the first surface of the first adhesive layer and the second surface of the second adhesive layer, 160999.doc 201247828 the peel strength is less than the Comparing the peel strength; and (II) having a separate object of the second surface in contact with the first surface of the second adhesive layer. 16. The combination of claim 15, wherein the first contour and the second contour each independently comprise a plurality of microstructures, the plurality of microstructures independently having a shape selected from a conical shape, A shape of a combination of two or more of a pyramid shape, a ridge shape, a channel shape, a rectangle shape, a spherical shape, an oval shape, an irregular shape, and the like. The assembly of claim 15, wherein the first contour and the second contour each independently comprise a plurality of convex lifting points, the first contour and the second contour each independently having greater than or equal to 10 μηι and less than or It is equal to the average distance between the pair of convex points and the like. The assembly of claim 15, wherein the first contour and the second contour are each independently and additionally selected such that increasing the distance between the five independent objects and the support layer results in the first of the first adhesive layer - The surface and the second surface of the second adhesive layer are separated from each other while maintaining the second surface of the first landing layer and the first surface of the support floor in contact with each other while the independent object is The first surface of the first-adhesive layer maintains an adhesive contact. Shi. The combination of the green length 15 wherein the peel strength is at least 50 percent less than the comparative peel strength. For example, the claim 1 &amp; person, L &amp; ', wherein the multilayer adhesive film is a cut die attach film&apos; and the separate article is a stone wafer. 160999.doc
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